Chip transfer assembly and chip transfer method

Abstract

The application discloses a chip transfer assembly and a chip transfer method. The chip transfer assembly comprises a transfer substrate and a control mechanism. The transfer substrate comprises a plurality of chip accommodating holes for accommodating chips. The control mechanism is used for controlling the chips to be fixed to or separated from the hole walls of the chip accommodating holes. The chip transfer assembly provided by the application can realize the transfer of a large number of chips, and improves the chip transfer efficiency.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display devices, and particularly relates to a chip transfer assembly and a chip transfer method. BACKGROUND

[0002] Mini light emitting diode chips have self-luminescence characteristics, and have the characteristics of high light emitting efficiency, high brightness, low power consumption, fast response speed, long service life, etc., and become a new choice in the self-luminescence display era, and have broad development prospects, but in the actual production process, the transfer efficiency of the mini light emitting diode is low. SUMMARY

[0003] The chip transfer assembly provided by the present application can realize the transfer of a large number of chips, and improves the transfer efficiency of the chips.

[0004] In one aspect, the present application provides a chip transfer assembly, comprising:

[0005] A transfer substrate, wherein the transfer substrate comprises a plurality of chip accommodating holes for accommodating chips;

[0006] A control mechanism for controlling the chip to be fixed to or separated from the hole wall of the chip accommodating hole.

[0007] According to one aspect of the present application, the control mechanism comprises a colloid.

[0008] Preferably, the colloid is a heat-cured glue or a light-sensitive glue.

[0009] According to one aspect of the present application, the minimum distance between the hole wall of the chip accommodating hole and the side wall of the chip located in the chip accommodating hole is 0-10 microns.

[0010] According to one aspect of the present application, the thickness of the transfer substrate is greater than the size of the chip along the thickness direction of the transfer substrate, and the difference between the thickness of the transfer substrate and the size of the chip along the thickness direction of the transfer substrate is at least 1 micron.

[0011] According to one aspect of the present application, the cross-sectional shape of the chip accommodating hole along the thickness direction thereof is trapezoidal.

[0012] According to one aspect of the present application, the transfer substrate is made of a material that expands when heated and contracts when cooled, the transfer substrate has a first position and a second position, when the transfer substrate is in the first position, the chip accommodating holes accommodate the chips, when the transfer substrate is in the second position, the chip accommodating holes clamp the chips, and the control mechanism includes a temperature control mechanism for adjusting the temperature of the transfer substrate to switch the transfer substrate between the first position and the second position.

[0013] In another aspect, the present application provides a chip transfer method, comprising:

[0014] aligning the chip accommodating holes of the transfer substrate with the chips on the substrate, and accommodating the chips in the chip accommodating holes;

[0015] adjusting the control mechanism to fix the chips to the hole walls of the chip accommodating holes;

[0016] peeling the chips from the substrate;

[0017] positioning a target substrate on the first side of the transfer substrate and aligning, adjusting the control mechanism to detach the chips from the chip accommodating holes, thereby transferring the chips to the target substrate.

[0018] According to another aspect of the present application, the cross-sectional shape of the chip accommodating holes along the thickness direction of the chip accommodating holes is trapezoidal, the smaller side of the base of the trapezoid is the first side of the transfer substrate, and the larger side of the base of the trapezoid is the second side for positioning the control mechanism.

[0019] According to another aspect of the present application, the target substrate includes a substrate, a buffer layer on the substrate, and a polydimethylsiloxane layer on the side of the buffer layer away from the substrate.

[0020] According to another aspect of the present application, the adjusting the control mechanism to fix the chips to the hole walls of the chip accommodating holes includes:

[0021] fixing the chips corresponding to the chip accommodating holes at the preset positions to the hole walls of the chip accommodating holes at the respective preset positions.

[0022] Compared with the prior art, the chip transfer assembly provided in this application includes a transfer substrate and a control mechanism. The transfer substrate includes multiple chip receiving holes that penetrate the thickness direction of the transfer substrate. During the chip transfer process, each chip receiving hole is used to receive a chip. The control mechanism controls each chip to connect with the hole wall of the chip receiving hole, thereby picking up the chip. The control mechanism also controls the chip to detach from the hole wall of the chip receiving hole to place the chip in a designated position, thereby realizing the chip transfer. The chip transfer assembly provided in this application can realize the transfer of a large number of chips and improve the chip transfer efficiency. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a transfer substrate provided in an embodiment of this application;

[0025] Figure 2 This is a schematic diagram of a transfer substrate and chip alignment process provided in an embodiment of this application;

[0026] Figure 3 This is a schematic diagram of a transfer substrate and chip fixing process provided in an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of a chip transfer process to a transfer substrate provided in an embodiment of this application;

[0028] Figure 5 This is a schematic diagram of a chip transfer process to a target substrate provided in an embodiment of this application;

[0029] Figure 6 This is a schematic diagram of a chip transfer process to a driver backplane provided in an embodiment of this application;

[0030] Figure 7 This is a schematic flowchart of a chip transfer method provided in an embodiment of this application.

[0031] In the attached image:

[0032] 1-Transfer substrate; 10-Chip receiving hole; 2-Colloid; 3-Substrate; 4-Chip; 41-Electrode; 5-Temporary bonding substrate; 51-Base; 52-Buffer layer; 53-Polydimethylsiloxane layer; 6-Drive backplane; 61-Drive backplane substrate; 62-Connection end. Detailed Implementation

[0033] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0035] Micro-LED technology, also known as LED miniaturization and matrixing technology, refers to a high-density array of micro-LED chips integrated on a backplane. These micro-LED chips are thin-film LEDs with lateral dimensions on the order of hundreds of micrometers. Due to their self-emissive nature and characteristics such as high luminous efficiency, high brightness, low power consumption, fast response speed, and long lifespan, micro-LED chips have become a new choice for the self-emissive display era and have broad development prospects. However, in actual production, the development of micro-LED technology faces the problem of low transfer efficiency. The inventors discovered that the low transfer efficiency is due to the use of transfer heads in related technologies. These transfer heads are generally small, and when transferring large quantities of micro-LED chips, multiple transfers are required to transfer them to a temporary bonding substrate. Therefore, there is a problem of low efficiency when transferring large areas. Based on the analysis of the above problems, the inventors proposed a chip transfer component and a chip transfer method.

[0036] The chip transfer assembly provided in this application embodiment is used to transfer chip 4 from the substrate 3 of chip 4 to a temporary bonding substrate 5, then transfer chip 4 from the temporary bonding substrate 5 to a driving backplate 6, and fix chip 4 to the driving backplate 6.

[0037] The chip 4 transferred in the chip transfer assembly provided in this application may include a micro light-emitting diode chip 4, or other chips 4, and this application does not make any special limitation.

[0038] To better understand this application, the following will be combined with... Figures 1 to 7 The chip transfer components and chip transfer methods according to embodiments of this application will be described in detail.

[0039] like Figure 1 and Figure 2 As shown, this application embodiment provides a chip transfer assembly, including a transfer substrate 1 and a control mechanism. The transfer substrate 1 includes a plurality of chip receiving holes 10 for accommodating a chip 4, and the control mechanism is used to control the chip 4 to be fixed to the hole wall of the chip receiving hole 10 or to detach from the hole wall of the chip receiving hole.

[0040] The chip transfer assembly provided in this application includes a transfer substrate 1 and a control mechanism. The transfer substrate 1 includes a plurality of chip receiving holes 10, which penetrate through the thickness direction of the transfer substrate 1. During the transfer of chip 4, each chip receiving hole 10 is used to receive chip 4. The control mechanism controls each chip 4 to connect with the hole wall of the chip receiving hole 10, thereby picking up chip 4. The control mechanism also controls the chip 4 to disengage from the hole wall of the chip receiving hole 10 to place chip 4 in a designated position, thereby realizing the transfer of chip 4. The chip transfer assembly provided in this application can realize the transfer of a large number of chips 4, improving the transfer efficiency of chip 4.

[0041] In one feasible implementation, such as Figure 3 As shown, the control mechanism includes a colloid 2, which enables the chip 4 to be fixed and detached from the transfer substrate 1, making it convenient, controllable, and less likely to damage the chip 4.

[0042] In one feasible embodiment, the colloid 2 is a thermosetting adhesive or a photosensitive adhesive. When a thermosetting adhesive is used, heating can be used to evaporate some of the solvent within the thermosetting adhesive, thereby fixing the chip 4 to the transfer substrate 1. Thermal reflow can then be used to detach the chip 4 from the transfer substrate 1. When a photosensitive adhesive is used, laser irradiation can be used to cure the photosensitive adhesive, thereby fixing the chip 4 to the transfer substrate 1. An organic solvent can then be used to dissolve the chip 4 from the transfer substrate 1.

[0043] In one feasible implementation, the distance between the wall of the chip receiving hole 10 and the sidewall of the chip located in the chip receiving hole 10 is 0 micrometers to 10 micrometers, so as to facilitate the smooth reception of each chip 4 in the chip receiving hole 10 without affecting the cooperation of other surrounding chips 4 with the chip receiving hole 10.

[0044] In one feasible implementation, the thickness of the transfer substrate 1 is larger than the dimension of the chip 4 along the thickness direction of the transfer substrate 1, and the difference between the thickness of the transfer substrate 1 and the dimension of the chip along the thickness direction of the transfer substrate 1 is at least 1 micrometer, thereby providing a space for the colloid 2 to be accommodated. This allows the colloid 2 to be partially accommodated between the chip 4 and the wall of the chip receiving hole 10, and partially located on the side of the chip 4 away from the substrate 3 used to support the chip 4. This helps to prevent the colloid 2 from overflowing and increases the contact area between the colloid 2 and the chip 4, especially the contact area between the side of the chip 4 away from the substrate 3 and the colloid 2. It also increases the contact area between the colloid 2 and the wall of the chip receiving hole 10, resulting in a better connection between the chip 4 and the wall of the chip receiving hole 10.

[0045] In one feasible implementation, such as Figure 3 As shown, the cross-sectional shape of the chip receiving hole 10 along its thickness direction is trapezoidal, wherein the side of the substrate 3 closer to the chip 4 is the smaller base side of the trapezoid, and the side of the substrate 3 farther away from the chip 4 is the larger base side of the trapezoid, so as to facilitate the injection of colloid 2.

[0046] In one feasible implementation, the transfer substrate 1 is made of an iron-nickel alloy, which can ensure load-bearing capacity and prevent deformation, and facilitates the processing to form the chip receiving hole 10. In addition, the material is readily available and low in cost.

[0047] In the chip transfer component provided in this application, such as Figures 1 to 3 As shown, in one feasible embodiment, the chip receiving hole 10 in the transfer substrate 1 corresponds one-to-one with the chip 4, that is, each chip receiving hole 10 accommodates one chip 4. In another feasible embodiment, the chip receiving hole 10 in the transfer substrate 1 can accommodate multiple chips 4.

[0048] In the chip transfer assembly provided in the above embodiments, when the transfer substrate 1 includes chip receiving holes 10 corresponding to each chip 4, a portion of the chips 4 can be fixed to the hole wall of the chip receiving hole 10 by a control mechanism. Specifically, a portion of the chips 4 can be fixed to the transfer substrate 1 by dispensing adhesive into the chip receiving hole 10, thereby realizing the batch transfer of a portion of the chips 4. At the same time, the batch transfer of the chips 4 can be carried out according to the final arrangement of the chips 4 on the driving substrate, thereby saving the time of arrangement on the driving substrate and improving production efficiency.

[0049] In another feasible embodiment, the transfer substrate 1 is made of a material that expands and contracts with temperature. The transfer substrate 1 has a first station and a second station. When the transfer substrate 1 is in the first station, the chip receiving hole 10 receives the chip 4. When the transfer substrate 1 is in the second station, the chip receiving hole 10 clamps the chip 4. The control mechanism includes a temperature control mechanism for adjusting the temperature of the transfer substrate 1 so that the transfer substrate 1 switches between the first station and the second station.

[0050] In the above embodiments, the transfer substrate 1 can be made of a thermally expandable material. When the temperature control mechanism adjusts the transfer substrate 1 to the second working position, the transfer substrate 1 expands due to heat, thereby reducing the diameter of the chip receiving hole 10 in the transfer substrate 1 to clamp the chip 4, so that the chip 4 is fixed to the transfer substrate 1. When the temperature control mechanism adjusts the transfer substrate 1 to the first working position, the transfer substrate 1 contracts due to cold, thereby increasing the diameter of the chip receiving hole 10 in the transfer substrate 1 to release the chip 4, so that the chip 4 is separated from the hole wall of the chip receiving hole 10 and does not contact the hole wall of the chip receiving hole 10, so that the chip 4 is accommodated in the chip receiving hole 10 and one end is fixed to the target substrate, thereby realizing the transfer of the chip 4.

[0051] In the above embodiment, the chip receiving hole 10 in the transfer substrate 1 can be designed to correspond one-to-one with the chip 4, so that the chips 4 can be clamped and transferred one by one without changing the position of the chips 4.

[0052] This application also provides a chip 4 transfer method, such as Figure 7 As shown, it includes:

[0053] S101: Align the first side of the transfer substrate 1 with the side of the chip 4 facing away from the substrate 3, align the chip receiving hole 10 of the transfer substrate 1 with the chip 4 located on the substrate 3, and house the chip 4 within the chip receiving hole 10. Figure 2 As shown;

[0054] S102: Adjust the control mechanism to fix the chip 4 to the wall of the chip receiving hole 10, such as... Figure 3 As shown;

[0055] S103: Separate chip 4 from substrate 3, as follows Figure 4 As shown;

[0056] S104: The target substrate is placed on the first side of the transfer substrate 1 and aligned. The control mechanism is adjusted to disengage the chip 4 from the chip receiving hole 10, thereby transferring the chip 4 to the target substrate. Figure 5 As shown.

[0057] In the above chip 4 transfer method, the substrate 3 is a carrier for supporting the chip 4. For example, when the chip 4 is a micro light-emitting diode chip 4, the substrate 3 can be a sapphire substrate 3, etc. A buffer layer 52 is also grown between the sapphire substrate 3 and the micro light-emitting diode chip 4 to protect the micro light-emitting diode chip 4. When peeling the micro light-emitting diode chip 4 from the substrate 3, laser peeling technology can be used, that is, laser irradiation is used to peel the micro light-emitting diode chip 4 to be peeled, so that the buffer layer 52 changes from solid to gaseous or other states, so as to separate the micro light-emitting diode chip 4 from the substrate 3 and the buffer layer 52.

[0058] In the above-described chip 4 transfer method, when chip 4 is a micro LED chip 4, the purpose of the transfer is to transfer micro LED chips 4 of different colors to the driving backplate 6, and to weld the electrodes 41 of each micro LED chip 4 to the solder points on the driving backplate 6, thereby achieving electrical connection between the micro LED chip 4 and the driving backplate 6, so that the micro LED chip 4 can be controlled to emit light through the driving backplate 6, such as... Figure 6 As shown. During the transfer process, chip 4 is first transferred to temporary bonding substrate 5 via transfer substrate 1. At this time, temporary bonding substrate 5 serves as the target substrate for temporarily supporting micro LED chip 4. Then, micro LED chip 4 is transferred from temporary bonding substrate 5 to driving back plate 6. Temporary bonding substrate 5 is fixed to the side of micro LED chip 4 away from electrode 41. This allows the driving back plate 6 to be placed on the side of micro LED chip 4 away from temporary bonding substrate 5 and aligned when transferring micro LED chip 4 from temporary bonding substrate 5 to driving back plate 6. After this alignment, micro LED chip 4 can be fixed in the designated position on driving back plate 6. The solder joint between micro LED chip 4 and driving back plate 6 is fixed by soldering to achieve electrical connection.

[0059] In one feasible implementation, the target substrate includes a substrate 51, a buffer layer 52 located on the substrate 51, and a polydimethylsiloxane 53 layer located on the side of the buffer layer 52 opposite to the substrate 51. The polydimethylsiloxane 53 layer can adsorb each chip 4 to fix the chip 4 to the temporary bonding substrate 5.

[0060] During the chip 4 transfer process described above, the control mechanism is adjusted to fix the chip 4 to the wall of the chip receiving hole 10, or to detach the chip 4 from the chip receiving hole 10. When the control mechanism is a colloid 2, the state of the colloid 2 can be controlled to fix or separate the chip 4 from the wall of the chip receiving hole 10 in the transfer substrate 1. When the control structure is a temperature control mechanism, it needs to be used in conjunction with a transfer substrate 1 made of a thermal expansion material. By controlling the temperature, the transfer substrate 1 expands, and the chip receiving hole 10 shrinks to clamp the chip 4, that is, to place the transfer substrate 1 in the second working position, or to shrink the transfer substrate 1, and the chip receiving hole 10 recovers to release the chip 4, that is, to place the transfer substrate 1 in the first working position.

[0061] In the above chip 4 transfer method, the cross-sectional shape of the chip receiving hole 10 along its own thickness direction is trapezoidal. The side with the smaller base of the trapezoid is the first side of the transfer substrate 1, and the side with the larger base of the trapezoid is the second side for setting the control mechanism. The first side of the transfer substrate 1 is opposite to the side of the chip 4 away from the substrate 3, and the second side with the larger base of the trapezoid is located on the side away from the substrate 3. When the control structure is a colloid, it is convenient to apply the colloid to the side of the chip 4 away from the substrate 3, so that the chip receiving hole 10 can better accommodate the colloid 2 and prevent the colloid 2 from overflowing. At the same time, it increases the contact area between the colloid 2 and the hole wall of the chip receiving hole 10 and between the colloid 2 and the chip 4, so that the chip 4 and the transfer substrate 1 are better fixed.

[0062] In the above chip 4 transfer method, adjusting the control mechanism to fix the chip 4 to the wall of the chip receiving hole 10 includes:

[0063] The chip 4 corresponding to the chip receiving hole 10 at the preset position is fixed to the hole wall of the chip receiving hole 10 at each preset position.

[0064] When chip 4 is a miniature light-emitting diode chip 4, in one feasible embodiment, a red miniature light-emitting diode chip 4 for emitting red light, a green miniature light-emitting diode chip 4 for emitting green light, and a blue miniature light-emitting diode chip 4 for emitting blue light are disposed on the driving backplate 6. The red miniature light-emitting diode chip 4, the green miniature light-emitting diode chip 4, and the blue miniature light-emitting diode chip 4 are respectively grown on different sapphire substrates 3, so it is necessary to transfer the red miniature light-emitting diode chip 4, the green miniature light-emitting diode chip 4, and the blue miniature light-emitting diode chip 4 to the driving backplate 6 respectively.

[0065] In one feasible implementation, when using the transfer substrate 1 provided in this application for transfer, the arrangement of the chip receiving holes 10 in the transfer substrate 1 can be set to be the same as the arrangement of the micro LED chips 4 on the driving backplate 6. When processing the red LED chip 4, the corresponding red micro LED chip 4 can be transferred to the temporary bonding substrate 5 using the portion of the chip receiving holes 10 in the transfer substrate 1 that has the same arrangement as the red LED chips 4 on the driving backplate 6 (i.e., the chip receiving holes 10 at preset positions). This transfer is then used for subsequent connection with the driving backplate 6. When processing the green LED chip 4, the chip receiving holes 10 in the transfer substrate 1 that have the same arrangement as the green LED chips 4 on the driving backplate 6 are used for the transfer. The nano-hole 10 (i.e., the chip receiving hole 10 at the preset position) transfers the corresponding green micro light-emitting diode chip 4 to the temporary bonding substrate 5 for subsequent connection with the driving backplane 6. When transferring the blue light-emitting diode chip 4, the corresponding blue micro light-emitting diode chip 4 is transferred to the temporary bonding substrate 5 using the chip receiving hole 10 (i.e., the chip receiving hole 10 at the preset position) in the transfer substrate 1 with the same arrangement as the blue light-emitting diode chip 4 on the driving backplane 6. This makes the arrangement of the temporary bonding substrate 5 and the driving backplane 6 the same after the transfer, and each micro light-emitting diode chip 4 can be transferred to the driving backplane 6 by direct alignment and welding, which is more convenient and saves time.

[0066] In the above embodiment, the chip 4 corresponding to the chip receiving hole 10 at the preset position is fixed to the hole wall of the chip receiving hole 10. This can be achieved by applying adhesive to the chip receiving hole 10 at the preset position to fix the hole wall of the chip receiving hole 10 at the preset position to the corresponding chip 4.

[0067] In another feasible implementation, the transferred micro LED chips 4 are all white light-emitting micro LED chips 4. It is only necessary to set the transfer substrate 1 to be arranged in the same way as the driving back plate 6, which is convenient and quick and can realize the transfer of a large number of micro LED chips 4.

[0068] The driving backplate 6 includes a driving backplate 6 substrate 61 and a connection terminal 62 formed on one side of the driving backplate 6 substrate 61 for connecting the chip 4. The connection terminal 62 can be directly welded and fixed to the electrode 41 of the chip 4.

[0069] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0070] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A chip transfer assembly, comprising: The application relates to a transfer substrate, a control mechanism and a method for transferring a chip. The transfer substrate comprises a plurality of chip accommodating holes for accommodating the chip, the cross-sectional shape of the chip accommodating hole along the thickness direction of the chip accommodating hole is trapezoidal, the smaller side of the base of the trapezoid is the first side of the transfer substrate, the larger side of the base of the trapezoid is the second side of the transfer substrate, the transfer substrate is made of a material that expands when heated and shrinks when cooled, and the transfer substrate has a first station and a second station. The control mechanism is used for controlling the chip to be fixed to the hole wall of the chip accommodating hole or to be separated from the hole wall of the chip accommodating hole, and the control mechanism comprises a glue and a temperature control mechanism for adjusting the temperature of the transfer substrate, so that the transfer substrate is switched between the first station and the second station. The second side is used for arranging the control mechanism, the glue is heat-cured glue, when the transfer substrate is in the first station, the chip accommodating hole accommodates the chip, and the glue is partially accommodated between the chip and the hole wall of the chip accommodating hole. When the temperature control mechanism adjusts the transfer substrate to be heated to be in the second station, the transfer substrate is expanded by heat, the glue is cured by heat, and the chip accommodating hole clamps the chip.

2. The chip transfer assembly of claim 1, wherein, The minimum distance between the hole wall of the chip accommodating hole and the side wall of the chip located in the chip accommodating hole is 0-10 microns.

3. The chip transfer assembly of claim 1, wherein, The thickness of the transfer substrate is larger than the size of the chip along the thickness direction of the transfer substrate, and the difference between the thickness of the transfer substrate and the size of the chip along the thickness direction of the transfer substrate is at least 1 micron.

4. A chip transfer method characterized by, The application relates to a transfer substrate, a control mechanism and a method for transferring a chip. The first side of the transfer substrate is opposite to the side of the chip away from the substrate, the chip accommodating hole of the transfer substrate is aligned with the chip located on the substrate, and the chip and the glue of the adjusting control mechanism are accommodated in the chip accommodating hole. The temperature control mechanism of the adjusting control mechanism makes the transfer substrate made of a material that expands when heated and shrinks when cooled to be expanded by heat, the glue to be cured by heat, and the chip accommodating hole to clamp the chip, so that the chip is fixed to the hole wall of the chip accommodating hole. The chip is separated from the substrate. The target substrate is arranged on the first side of the transfer substrate and is aligned, the temperature control mechanism of the control mechanism makes the transfer substrate shrink by cooling, so that the chip is separated from the chip accommodating hole, and the chip is transferred to the target substrate.

5. The chip transfer method according to claim 4, wherein The target substrate comprises a substrate, a buffer layer located on the substrate, and a polydimethylsiloxane layer located on the side of the buffer layer away from the substrate.

6. The chip transfer method according to claim 4, wherein The adjusting control mechanism for fixing the chip to the hole wall of the chip accommodating hole comprises: The chip corresponding to the chip accommodating hole of the preset position is fixed to the hole wall of the chip accommodating hole of each preset position respectively.

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