Substrate heating support device and semiconductor machine

Abstract

The present invention provides a substrate heating support device and a semiconductor machine. The substrate heating support device includes a carrying unit, a heating unit, a heat insulating unit and a chassis unit; the carrying unit includes a carrying plate; the first surface of the heating unit contacts the second surface of the carrying plate to heat the carrying plate and the substrate; the first surface of the heat insulating unit contacts the second surface of the heating unit, and the second surface of the heat insulating unit contacts the first surface of the chassis unit; wherein the heat insulating unit and the heating unit are interference fit between the carrying plate and the chassis unit. In the present invention, the heat insulating unit and the heating unit are interference fit between the carrying plate and the chassis unit, so that the contact between the chassis heating unit and the carrying plate is closer, so as to improve the heat conduction efficiency and heat conduction uniformity. In addition, the heat insulating unit is arranged on the second surface of the heating unit, which can reduce heat loss and prevent heat from being conducted downward to the chassis unit, so as to protect the peripheral devices of the substrate heating support device.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a substrate heating support device and a semiconductor machine. Background Art

[0002] As integrated circuit technology continues to advance, semiconductor manufacturing processes are also evolving. For example, annealing processes are gradually evolving from bulk heating of batch substrates to rapid thermal processing (RTP), impulse annealing, and laser scanning annealing.

[0003] Among them, laser scanning annealing has the best effect. According to the process requirements, the substrate needs to be preheated to a certain temperature (for example, 300°C to 500°C) before laser scanning annealing. The industry generally sets the heater on the back of the carrier plate to heat the substrate (such as a silicon wafer) placed on the front of the carrier plate. Usually the heater is bonded to the lower surface of the carrier plate with glue, but this connection method will result in a decrease in the uniform heat transfer performance (heat conduction uniformity) between the carrier plate and the heater. In addition, it is difficult for the heater to fit tightly against the lower surface of the carrier plate, which leads to a decrease in heating performance (heat conduction efficiency). Summary of the Invention

[0004] An object of the present invention is to provide a substrate heating support device and a semiconductor machine, so as to improve the heat conduction efficiency and heat conduction uniformity of the substrate heating support device.

[0005] In order to solve the above technical problems, the present invention provides a substrate heating support device for heating a substrate, comprising a carrying unit, a heating unit, a thermal insulation unit and a chassis unit, wherein the carrying unit, the heating unit, the thermal insulation unit and the chassis unit respectively have a first surface and a second surface arranged opposite to each other; the carrying unit comprises a carrying plate, the first surface of the carrying plate is used to carry the substrate; the first surface of the heating unit contacts the second surface of the carrying plate to heat the carrying plate and the substrate; the first surface of the thermal insulation unit contacts the second surface of the heating unit, the second surface of the thermal insulation unit contacts the first surface of the chassis unit, and the thermal insulation unit and the heating unit are interference fitted between the carrying plate and the chassis unit.

[0006] Optionally, the heat insulation unit includes a first heat insulation unit in contact with the second surface of the heating unit and a second heat insulation unit in contact with the first heat insulation unit, and the second surface of the second heat insulation unit is in contact with the chassis unit.

[0007] Optionally, the material of the first thermal insulation unit is a rigid material, and the material of the second thermal insulation unit is an elastic material.

[0008] Optionally, the first thermal insulation unit has a first surface in contact with the heating unit and a second surface in contact with the second thermal insulation unit, and an area of ​​the first surface is larger than an area of ​​the second surface.

[0009] Optionally, the first surface and / or the second surface of the first thermal insulation unit has a plurality of convex microstructures.

[0010] Optionally, the heating unit includes a heater and a heat spreader, the first surface of the heat spreader contacts the second surface of the supporting plate, the second surface of the heat spreader contacts the first surface of the heater, and the second surface of the heater contacts the first surface of the insulation unit.

[0011] Optionally, the carrying unit further includes at least three fixing units, and the at least three fixing units are arranged on the chassis unit and evenly distributed on the edge of the carrying plate, for fixing the carrying plate.

[0012] Optionally, the fixing unit includes a supporting component and a pressing component, the first surface of the supporting component contacts the edge of the second surface of the supporting plate, the pressing component includes an elastic pressing plate contacting the edge of the first surface of the supporting plate and an elastic pressing plate support column fixedly connected to the elastic pressing plate, and the second surfaces of the supporting component and the elastic pressing plate support column are both connected to the first surface of the chassis unit.

[0013] Optionally, the chassis unit is a cooling unit.

[0014] Based on another aspect of the present invention, the present invention further provides a semiconductor machine, comprising the substrate heating and supporting device as described above, wherein the semiconductor machine is a laser annealing device or a bonding device.

[0015] In summary, the substrate heating support device and semiconductor machine provided by the present invention have the following beneficial effects:

[0016] 1) The heat insulation unit and the heating unit are interference-fitted between the carrier plate and the chassis unit, making the contact between the chassis heating unit and the carrier plate closer, thereby improving the heat conduction efficiency and heat conduction uniformity;

[0017] 2) The heat insulation unit is arranged on the second surface of the heating unit to reduce heat loss and prevent heat from being conducted downward to the chassis unit, so as to protect peripheral components of the substrate heating support device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Those skilled in the art will appreciate that the accompanying drawings are provided to better understand the present invention and do not constitute any limitation to the present invention.

[0019] Figure 1is a schematic diagram of a substrate heating support device provided in an embodiment of the present application;

[0020] Figure 2 is a top view schematic diagram of the fixing unit and the carrying unit provided in an embodiment of the present application;

[0021] Figure 3 This is a schematic diagram of the thickness of the heating unit and the heat insulation unit before assembly provided in an embodiment of the present application;

[0022] Figure 4 This is a schematic diagram of another substrate heating support device provided in an embodiment of the present application.

[0023] In the attached figure:

[0024] 100-substrate; 10-carrying plate; 20-heating unit; 21-heat spreader; 22-heater;

[0025] 30 - thermal insulation unit; 31 - first thermal insulation unit; 31a - first surface; 31b - second surface; 311 - microstructure; 32 - second thermal insulation unit;

[0026] 40-fixing unit; 41-pressing component; 41a-elastic pressing piece; 41b-elastic pressing piece supporting column; 42-supporting component;

[0027] 50-Chassis unit. DETAILED DESCRIPTION

[0028] To make the objects, advantages, and features of the present invention more clearly apparent, the present invention is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale. They are only used to conveniently and clearly assist in illustrating the purposes of the embodiments of the present invention. In addition, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may need to illustrate different focuses and sometimes use different scales.

[0029] It should be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers. Although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, or portion discussed below may be represented as a second element, component, region, layer, or portion. Spatially relative terms such as "under," "below," "below," "above," "above," etc. may be used herein for convenience of description to describe the relationship between an element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatial relationship terms are intended to also include different orientations of devices in use and operation. For example, if the device in the drawings is flipped, then, the elements or features described as "under...", "below," or "below" will be oriented as "on" other elements or features. The device can be oriented differently (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly. The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. When used herein, the singular forms "one," "an," and "said / the" are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "including" is used to determine the presence of features, steps, operations, elements, and / or parts, but does not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0030] Figure 1 This is a schematic diagram of a substrate heating support device provided in an embodiment of the present application.

[0031] like Figure 1As shown, the substrate heating support device provided in this embodiment is used to heat a substrate 100. The substrate heating support device includes a carrying unit, a heating unit 20, a thermal insulation unit 30, and a chassis unit 50. The carrying unit, the heating unit 20, the thermal insulation unit 30, and the chassis unit 50 each have a first surface and a second surface arranged opposite to each other. The carrying unit includes a carrying plate 10, and the first surface of the carrying plate 10 is used to carry the substrate 100. The first surface of the heating unit 20 contacts the second surface of the carrying unit 10 to heat the carrying unit 10 and the substrate 100. The first surface of the thermal insulation unit 30 contacts the second surface of the heating unit 20, and the second surface of the thermal insulation unit 30 contacts the first surface of the chassis unit 50. The thermal insulation unit 30 and the heating unit 20 are interference fitted between the carrying plate 10 and the chassis unit 50.

[0032] In this embodiment, the first surface may be the respective upper surface, and the second surface may be the corresponding lower surface. For example, the substrate 100 is placed on the first surface of the carrier 10, that is, the substrate 100 is placed on the upper surface of the carrier 10. The substrate 100 may be made of any suitable material, such as silicon, glass, sapphire, or ceramic, and may further have a corresponding film layer or microstructure on the surface of the substrate 100. In this embodiment, the substrate 100 is a silicon wafer (also called a wafer).

[0033] Please continue to refer to Figure 1 The carrier plate 10 is used to support and heat the substrate 100 and has excellent thermal conductivity to transfer heat from the heating unit 20 to the substrate 100. The carrier plate 10 also includes a corresponding fixing mechanism for fixing the substrate 100 to the first surface of the carrier plate 10 and simultaneously ensuring close contact (adhesion) between the first surface of the carrier plate 10 and the second surface of the substrate 100 to improve heat transfer efficiency. In this embodiment, the substrate 100 is a silicon wafer, and the second surface of the substrate 100 has excellent flatness. Therefore, the fixing structure on the surface of the carrier unit 10 can be a plurality of vacuum adsorption mechanisms to fix the substrate 100. In practice, the carrier plate 10 can also include other corresponding mechanisms to achieve different functions, such as a substrate lifting mechanism for cooperating with a robot to perform loading and unloading (loading and unloading) of the substrate 100. The substrate lifting structure can include a plurality of evenly spaced lifting pins for receiving the substrate 100 at the top of the lifting pins' lifting stroke, or for placing the substrate 100 on the first surface of the carrier plate 10 at the bottom of their lifting stroke.

[0034] Please continue to refer to Figure 1The carrying unit also includes a fixing unit 40, which is fixedly connected to the chassis unit 50 and located at the edge of the carrying plate 10, and is used to fix the carrying plate 10. The fixing unit 40, for example, includes a supporting component 42 and a pressing component 41. The first surface of the supporting component 42 contacts the edge of the second surface of the carrying plate 10 to support the carrying plate 10. The pressing component 41 includes an elastic pressing piece 41a in contact with the edge of the first surface of the carrying plate 10 and an elastic pressing piece support column 41b fixedly connected to the elastic pressing piece 41a. The second surfaces of the supporting component 42 and the elastic pressing piece support column 41b are both connected to the first surface of the chassis unit 50. Preferably, the supporting component 42 and the pressing component 41 are arranged adjacent to each other, so that the two act on the upper and lower surfaces of the same area of ​​the carrying plate 10, so as to form a better support and fixing effect.

[0035] Please refer to Figure 2 The number of fixing units 40 is, for example, three, and the three fixing units 40 are evenly distributed on the edge of the carrier plate 10 to better support and fix the carrier plate 10. Of course, in a specific implementation, the number and shape of the fixing units 40 can be adjusted accordingly, for example, to one, two, or more than three, as long as the purpose of supporting and fixing the carrier plate 10 can be achieved. Furthermore, in order to better fix the heating plate, when there is only one fixing unit 40, the fixing unit 40 can be in a circular ring shape surrounding the edge of the carrier plate 10, or when there are only two fixing units 40, the fixing units 40 can be in an arc shape, and the two fixing units 40 are arranged opposite to each other on the edge of the carrier plate 10.

[0036] Please continue to refer to Figure 1 In this embodiment, the support component 42 of the fixing unit 40 is a support column, such as a square column. The material of the support component 42 is a rigid heat-insulating material, such as ceramic, so as to reduce the heat loss when the support component 42 contacts the carrier plate 10 and ensure the supporting effect of the support component 42 on the carrier plate 10. The elastic pressing plate 41a of the pressing component 41 is, for example, an L-shaped sheet structure, including a vertical portion and a horizontal portion fixedly connected to the vertical portion, wherein the vertical portion is fixedly connected to the first surface of the elastic pressing plate support column 41b, and the horizontal portion extends to contact the edge of the first surface of the carrier plate 10 to fix the carrier plate 10. The material of the elastic pressing plate is preferably an elastic and high-temperature resistant material. Of course, the high-temperature resistance here is relative to the highest preset heating temperature of the heating unit 20, for example, greater than 600°C. Preferably, the material of the elastic pressing plate is spring steel. It should be understood that when the carrier plate 10 transfers the heat of the heating unit 20 to the substrate 100, both the heating unit 20 and the carrier plate 10 will undergo thermal expansion and deformation, and thereby squeeze each other. In this embodiment, the first surface of the fixing unit 40 is an elastic pressing piece 41a. The elastic pressing piece 41a can adapt to partial thermal expansion and deformation and mutual squeezing, prevent excessive deformation or squeezing, and thus protect the carrier plate 10.

[0037] Please continue to refer to Figure 1 The heating unit 20 is used to provide heat to heat the substrate 100. The heating unit 20 includes a heat spreader 21 and a heater 22. The first surface of the heat spreader 21 contacts the second surface of the carrier plate 10, and the second surface of the heat spreader 21 contacts the first surface of the heater 22, so as to evenly distribute the heat of the heater 22 and conduct it to the carrier plate 10. The material of the heat spreader 21 can be graphite. Experiments have shown that the higher the purity, the better the effect of uniform heat. In this embodiment, the heater 22 is a thin film heating plate, which has a certain degree of flexibility so that it can form good contact with the heat spreader 21 under the support of the insulation unit 30 to improve the heat conduction efficiency.

[0038] Please continue to refer to Figure 1 The heat insulation unit 30 is disposed between the heating unit 20 and the bottom plate unit 50 and forms close contact with both. The heat insulation unit 30 includes a first heat insulation unit 31 in contact with the second surface of the heating unit 20 and a second heat insulation unit 32 in contact with the first heat insulation unit 31. The second surface of the second heat insulation unit 32 is in contact with the bottom plate unit 50.

[0039] In this embodiment, if Figure 3 As shown, the thicknesses of the heating unit 20, the first heat insulating unit 31 and the second heat insulating unit 32 of the substrate heating support device before assembly are H1, H2 and H3 respectively, and the thicknesses of the three after assembly (bonding) are as shown in FIG. Figure 1 H is shown, and H1+H2+H3>H. By utilizing the above-mentioned assembly method similar to interference fit (interference fitting), the heating unit 20 and the carrier plate 10 can be brought into closer contact (fitting) to improve the efficiency and uniformity of heat conduction. Preferably, the material of the first thermal insulation unit 31 is a rigid material, and the material of the second thermal insulation unit 32 is an elastic material. The elasticity of the second thermal insulation unit 32 can be utilized to achieve the above-mentioned interference fit, and to adapt to the thermal expansion and deformation of the first thermal insulation unit 31 and the heating unit 20 during heating to protect the carrier plate 10 and the heating unit 20. In addition, the thermal insulation effect of the first thermal insulation unit 31 and the second thermal insulation unit 32 can also be utilized to reduce the heat loss of the heating unit 20 and prevent heat from being conducted to the chassis unit 50, so as to protect the chassis unit 50 and the surrounding components under the chassis unit 50, such as the motion mechanism or sensors.

[0040] Specifically, in this embodiment, the first insulation unit 31 is an insulation disc. The first surface 31a and / or the second surface 31b of the first insulation unit 31 have multiple raised microstructures 311, which reduce the contact area and enhance the insulation effect. Preferably, the first surface 31a and the second surface 31b of the first insulation unit 31 are each uniformly provided with multiple microstructures 311. The spacing between adjacent microstructures 311 can be 2 mm to 7 mm to achieve both optimal support and thermal insulation. Furthermore, the size of the microstructures 311 can be the same as the spacing between adjacent microstructures 311. The microstructures 311 can be shaped, for example, as square or cylindrical columns. It should be understood that larger spacing between microstructures 311 reduces the contact area, resulting in better insulation, but also compromises support. This is particularly true when the heater 22 of the heating unit 20 is a thin-film heater (which is relatively flexible). This can hinder good contact between the entire surface of the heating unit 20 and the carrier plate 10, thereby hindering heat conduction.

[0041] Furthermore, the first thermal insulation unit 31 can be made of stainless steel wire by 3D printing. The first surface 31a and the second surface 31b of the first thermal insulation unit 31 each have a convex microstructure 311 formed by stainless steel wire, and the diameter of the stainless steel wire is, for example, 1mm to 3mm. In addition, thanks to the advantages of 3D printing, the above-mentioned microstructure 311 can also be formed into a hollow structure during 3D printing to further improve the thermal insulation effect. In practice, if the size of the first thermal insulation unit 31 is large, multiple 3D printings can be used to form multiple partial structures, and then the above-mentioned multiple partial structures can be spliced ​​to form a whole.

[0042] Preferably, Figure 1 As shown, the first thermal insulation unit 31 includes a first surface 31a, which contacts the heating unit 20, and a second surface 31b, which contacts the second thermal insulation unit 32. The area of ​​the first surface 31a is larger than that of the second surface 31b. The larger area of ​​the first surface 31a allows for better contact between the heating unit 20 and the entire surface of the carrier plate 10, improving heat transfer efficiency and uniformity. The smaller area of ​​the second surface 31b reduces the contact area between the first and second thermal insulation units 31 and 32, thereby reducing heat loss. In practice, because both the first and second surfaces 31a, 31b of the first thermal insulation unit 31 have raised microstructures 311, the first and second surfaces 31a, 31b serve as the contact surfaces of the microstructures 311.

[0043] In this embodiment, the second thermal insulation unit 32 can be made of a material having both elasticity and thermal insulation properties to improve the thermal insulation effect. The second thermal insulation unit 32 is, for example, a thermal insulation pad made of aerogel.

[0044] In a specific implementation, the chassis unit 50 can be a cooling unit to further isolate the heat of the substrate heating support device and prevent the heat from being conducted downward, so as to protect the surrounding components under the chassis unit 50. In use, a fluid for cooling flows through the cooling unit, and the fluid can be a coolant or a cooling gas.

[0045] like Figure 4 As shown, the present invention also provides another substrate heating support device in which the heating unit only includes a heater 22 and does not use a heat spreader. This simplifies the structure and reduces costs. All other parts are similar to the aforementioned substrate heating support device. The first surface of the heater 22 contacts the second surface of the carrier plate 10, and the second surface of the heater 22 contacts the insulation unit 20. The heater 22 and the insulation unit 20 are interference-fitted between the carrier plate 10 and the chassis unit 50.

[0046] This embodiment further provides a semiconductor machine, which includes the substrate heating support device as described above, and is used to heat the substrate 100 .

[0047] In some embodiments, the semiconductor machine is a laser annealing device, which is used to heat the substrate 100 during the laser annealing process. In other embodiments, the semiconductor machine is a bonding device, which is used to heat the substrate 100 during the bonding process.

[0048] In summary, the substrate heating support device and semiconductor machine provided by the present invention have the following beneficial effects:

[0049] 1) The heat insulation unit and the heating unit are interference-fitted between the carrier plate and the chassis unit, making the contact between the chassis heating unit and the carrier plate closer, thereby improving the heat conduction efficiency and heat conduction uniformity;

[0050] 2) The heat insulation unit is arranged on the second surface of the heating unit to reduce heat loss and prevent heat from being conducted downward to the chassis unit, thereby protecting peripheral components of the substrate heating support device.

[0051] The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A substrate heating support device for heating a substrate, characterized in that: The device comprises a carrying unit, a heating unit, a heat insulating unit and a chassis unit, wherein the carrying unit, the heating unit, the heat insulating unit and the chassis unit each have a first surface and a second surface arranged opposite to each other; The carrying unit includes a carrying plate, and a first surface of the carrying plate is used to carry the substrate; The first surface of the heating unit contacts the second surface of the carrier plate to heat the carrier plate and the substrate; The first surface of the thermal insulation unit is in contact with the second surface of the heating unit, the second surface of the thermal insulation unit is in contact with the first surface of the chassis unit, and the thermal insulation unit and the heating unit are interference fitted between the supporting plate and the chassis unit. The thermal insulation unit includes a first thermal insulation unit in contact with the second surface of the heating unit and a second thermal insulation unit in contact with the first thermal insulation unit, the second surface of the second thermal insulation unit is in contact with the chassis unit, the material of the first thermal insulation unit is a rigid material, and the material of the second thermal insulation unit is an elastic material.

2. The substrate heating support device according to claim 1, characterized in that: The first heat insulating unit has a first surface in contact with the heating unit and a second surface in contact with the second heat insulating unit, and an area of ​​the first surface is larger than an area of ​​the second surface.

3. The substrate heating support device according to claim 1, characterized in that: The first surface and / or the second surface of the first thermal insulation unit has a plurality of convex microstructures.

4. The substrate heating support device according to claim 1, wherein: The heating unit includes a heater and a heat spreader, wherein the first surface of the heat spreader contacts the second surface of the supporting plate, the second surface of the heat spreader contacts the first surface of the heater, and the second surface of the heater contacts the first surface of the insulation unit.

5. The substrate heating support device according to claim 1, characterized in that: The carrying unit further includes at least three fixing units, which are arranged on the chassis unit and evenly distributed on the edge of the carrying plate for fixing the carrying plate.

6. The substrate heating support device according to claim 5, characterized in that: The fixing unit includes a supporting component and a pressing component, the first surface of the supporting component contacts the edge of the second surface of the supporting plate, the pressing component includes an elastic pressing sheet contacting the edge of the first surface of the supporting plate and an elastic pressing sheet support column fixedly connected to the elastic pressing sheet, and the second surfaces of the supporting component and the elastic pressing sheet support column are both connected to the first surface of the chassis unit.

7. The substrate heating support device according to claim 1, characterized in that: The chassis unit is a cooling unit.

8. A semiconductor machine, characterized in that: The substrate heating and supporting device comprises the substrate heating and supporting device according to any one of claims 1 to 7, wherein the semiconductor machine is a laser annealing device or a bonding device.

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