A wafer transfer device and transfer method applied to a semiconductor measurement device

Abstract

The present invention provides a wafer transfer device and a transfer method applied to a semiconductor measuring device. The method includes: a wafer loading step: a manipulator places a wafer on a wafer loading device; a transfer step: a wafer adsorption surface picks up the wafer from the wafer loading device; a measurement step: a workpiece stage drives the wafer to move to a measurement area to measure the wafer. During the process of detecting the wafer, the wafer loading action of another wafer can be completed, saving the wafer loading action time in the whole process, improving the wafer transfer efficiency, and preliminarily positioning the wafer during the wafer loading process to improve the subsequent detection efficiency. In addition, after the measurement step, there is also a wafer unloading step. During the wafer unloading process, the downward movement of the wafer adsorption surface in the Z direction and the movement of the workpiece stage in the X direction are carried out synchronously, which can save the wafer unloading action time and further improve the wafer transfer efficiency.

Description

Technical Field

[0001] The present invention belongs to the field of integrated circuit manufacturing, and relates to a wafer transfer device and a transfer method applied to a semiconductor measuring device. Background Art

[0002] In the field of semiconductor wafer inspection, it is required that the workpiece stage can complete the transfer of wafers with the wafer transfer system. With the continuous improvement of the requirements for productivity, the speed requirement for wafer transfer is getting higher and higher, and the transfer efficiency is improved accordingly. This requires the wafer transfer device to have high transfer efficiency.

[0003] In patent US6485253B1, a wafer transfer solution is proposed. Four pick-up hands are driven up and down by a cylinder, and two sets of linear bearings provide guidance to complete the wafer transfer process with the workpiece stage. This structure is relatively simple, but only one wafer can be transferred in one transfer process, and wafer centering cannot be completed.

[0004] In patent US6390767B1, a wafer transfer solution is proposed. It mainly consists of three sets of pick-up arms fixed on a frame. Each pick-up arm is driven by a stepper motor to rotate the pick-up hand at three positions, so as to complete the wafer transfer process with the workpiece stage. This solution can complete the transfer and centering of wafers, but the structure is relatively complex, and three sets of motors need to be synchronously controlled.

[0005] In patent US6860790B2, a wafer transfer solution is proposed. It mainly drives the annular hands on both sides to open and close left and right through a relative driving device to complete the transfer of wafers with the robot arm, but wafer centering cannot be completed, and the structure is relatively complex.

[0006] Therefore, how to provide a wafer transfer device and a transfer method applied to a semiconductor measuring device to reduce the structural complexity and improve the transfer efficiency has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0007] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide a wafer transfer device and a transfer method applied to a semiconductor measuring device, which are used to solve the problems of complex structure and low transfer efficiency of the wafer transfer device in the prior art.

[0008] To achieve the above object and other related objects, the present invention provides a wafer transfer method applied to a semiconductor measuring device, including the following steps:

[0009] Provided is a wafer transfer device for a semiconductor measuring device, the semiconductor measuring device including a frame and a workpiece table, a measuring area and a transfer area being provided on the frame, the workpiece table having a liftable wafer adsorption surface, the workpiece table being capable of moving within the measuring area and the transfer area, the wafer transfer device including a wafer loading device, the wafer loading device being installed on the frame at the transfer area;

[0010] Wafer loading step: Driving a manipulator to adsorb a first wafer and move it to the wafer loading position, and placing the first wafer on the wafer loading device;

[0011] Transfer step: Driving the workpiece table to move to the transfer position, and controlling the wafer adsorption surface to rise so that the wafer adsorption surface contacts and adsorbs the first wafer, and transferring the first wafer from the wafer loading device to the workpiece table;

[0012] Measuring step: Driving the workpiece table to drive the first wafer to move horizontally to the measuring position of the semiconductor measuring device, and controlling the semiconductor measuring device to measure the first wafer;

[0013] Wherein, when performing the measuring step on the first wafer, driving the manipulator to adsorb a second wafer and move it to the wafer loading position, and completing the wafer loading step of the second wafer.

[0014] Optionally, the wafer loading device includes a plurality of wafer loading positioning components and at least one wafer loading clamping component, both the wafer loading positioning component and the wafer loading clamping component having a wafer bearing surface, and a pre-tightening component being provided on the wafer bearing surface of the wafer loading clamping component, both the wafer loading positioning component and the wafer loading clamping component being capable of moving in a direction towards or away from the center of the wafer. After the manipulator adsorbs the first wafer and moves it to the wafer loading position, the wafer loading step further includes:

[0015] S101: Driving the wafer loading positioning component to move in a direction towards the center of the first wafer to form a wafer loading bearing surface;

[0016] S102: Driving the manipulator to descend and placing the first wafer on the wafer loading bearing surface;

[0017] S103: Driving the wafer loading clamping component to move in a direction towards the center of the first wafer to provide a pre-tightening force to the first wafer placed on the wafer loading bearing surface.

[0018] Optionally, the wafer transfer device further includes a vacuum adsorption device, a first vacuum adsorption hole connected to the vacuum adsorption device being provided on the wafer loading positioning component, and step S102 further includes:

[0019] Controlling the vacuum adsorption device to establish a vacuum through the first vacuum adsorption hole and adsorb the first wafer; and / or

[0020] The upper wafer clamping assembly is provided with a second vacuum adsorption hole connected to the vacuum adsorption device, and the step S103 further includes:

[0021] Controlling the vacuum adsorption device to establish a vacuum through the second vacuum adsorption hole and adsorb the first wafer.

[0022] Optionally, the upper wafer positioning assembly includes a first driving component and an upper wafer fixing and positioning component. The upper wafer fixing and positioning component is located above the first driving component and connected to the output end of the first driving component. The step S101 includes: controlling the first driving component to drive the upper wafer fixing and positioning component to move along the direction towards the center of the first wafer to form the upper wafer carrying surface; and / or

[0023] The upper wafer clamping assembly includes a second driving component, an upper wafer sliding component, and an upper wafer sliding and positioning component. The upper wafer sliding component is located above the second driving component and connected to the output end of the second driving component. The upper wafer sliding and positioning component is located above the upper wafer sliding component and connected to the upper wafer sliding component through an upper wafer clamping spring. The step S103 includes: controlling the second driving component to drive the upper wafer sliding component to move along the direction towards the center of the first wafer, so that the upper wafer sliding and positioning component fixes the first wafer, and applies a pre-tightening force to the first wafer through the upper wafer clamping spring.

[0024] Optionally, the wafer transfer device further includes a lower wafer device. The lower wafer device is installed on the workpiece table and distributed around the wafer adsorption surface, and can move with the workpiece table. After the measurement step is completed, the following lower wafer step is further included:

[0025] Controlling the wafer adsorption surface to descend so that the first wafer contacts the lower wafer device and transfers the first wafer to the lower wafer device, driving the workpiece table to move to the transfer position, and driving the manipulator to move to the lower wafer position and adsorb the first wafer, and taking the first wafer away from the lower wafer device;

[0026] After the lower wafer step is completed, repeat the transfer step and the measurement step to perform the transfer and measurement of the second wafer.

[0027] Optionally, the wafer unloading device includes a plurality of wafer unloading positioning components and at least one wafer unloading clamping component. Both the wafer unloading positioning components and the wafer unloading clamping component have a wafer carrying surface. The wafer carrying surfaces of the plurality of wafer unloading positioning components are located on the same plane to form a wafer unloading wafer carrying surface, and the wafer unloading wafer carrying surface is parallel to the wafer adsorption surface of the worktable. The wafer unloading clamping component can move in a direction towards or away from the center of the wafer. The specific steps of transferring the first wafer to the wafer unloading device in the wafer unloading step include:

[0028] S401: Control the wafer adsorption surface to descend and place the first wafer on the wafer unloading wafer carrying surface;

[0029] S402: Drive the wafer unloading clamping component to move in a direction towards the center of the first wafer to provide a pre-tightening force to the first wafer placed on the wafer unloading wafer carrying surface.

[0030] Optionally, the wafer unloading clamping component includes a third driving component, a wafer unloading sliding component, and a wafer unloading sliding positioning component. The wafer unloading sliding component is located above the third driving component and is connected to the output end of the third driving component. The wafer unloading sliding positioning component is located above the wafer unloading sliding component and is connected to the wafer unloading sliding component through a wafer unloading clamping spring. The step S402 includes:

[0031] Control the third driving component to drive the wafer unloading sliding component to move in a direction towards the center of the first wafer, so that the wafer unloading sliding positioning component fixes the first wafer and applies a pre-tightening force to the first wafer through the wafer unloading clamping spring.

[0032] Optionally, the wafer transfer device further includes a vacuum adsorption device. A third vacuum adsorption hole connected to the vacuum adsorption device is provided on the wafer unloading positioning component. The step S401 further includes:

[0033] Control the vacuum adsorption device to establish a vacuum through the third vacuum adsorption hole and adsorb the first wafer; and / or

[0034] A fourth vacuum adsorption hole connected to the vacuum adsorption device is provided on the wafer unloading clamping component. The step S402 further includes:

[0035] Control the vacuum adsorption device to establish a vacuum through the fourth vacuum adsorption hole and adsorb the first wafer.

[0036] The present invention also provides a wafer transfer device applied to a semiconductor measuring device. The semiconductor measuring device includes a frame and a workpiece table. A measuring area and a transfer area are provided on the frame. The workpiece table has a liftable wafer adsorption surface, and the workpiece table can move within the measuring area and the transfer area. It is characterized in that the wafer transfer device includes:

[0037] A wafer loading device installed on the frame at the transfer area. The wafer loading device includes a plurality of wafer loading positioning components and at least one wafer loading clamping component. Both the wafer loading positioning component and the wafer loading clamping component have a wafer bearing surface. The wafer bearing surface of the wafer loading positioning component and the wafer bearing surface of the wafer loading clamping component are in the same plane and parallel to the wafer adsorption surface of the workpiece table. And a pre-tightening component is provided on the wafer bearing surface of the wafer loading clamping component;

[0038] Wherein, the wafer bearing surface of the wafer loading positioning component can move along the direction towards the center of the wafer to receive the wafer from the manipulator, and the wafer loading clamping component can move along the direction towards the center of the wafer so that the pre-tightening component provides a pre-tightening force to the wafer placed on the wafer loading positioning component;

[0039] The workpiece table can move to the transfer area to adsorb the wafer located on the wafer loading device. After the workpiece table completes the adsorption of the wafer, the wafer loading device can move along the direction away from the center of the wafer to release the wafer. After the workpiece table adsorbs the wafer, it can move to the measuring area to measure the wafer.

[0040] Optionally, the wafer loading positioning component includes a first driving component and a wafer loading fixed positioning component. The wafer loading fixed positioning component is located above the first driving component and connected to the first driving component. Wherein, the first driving component is used to drive the wafer loading fixed positioning component to move along the direction towards or away from the center of the wafer; and / or

[0041] The wafer loading clamping component includes a second driving component, a wafer loading sliding component and a wafer loading sliding positioning component. The wafer loading sliding component is located above the second driving component and connected to the second driving component. The wafer loading sliding positioning component is located above the wafer loading sliding component and connected to the wafer loading sliding component through a wafer loading clamping spring. Wherein, the second driving component is used to drive the wafer loading sliding component to move along the direction towards or away from the center of the wafer, so that the wafer loading sliding positioning component moves to apply or remove a pre-tightening force to the wafer.

[0042] Optionally, the upper wafer fixing and positioning component includes a first bearing surface, a first guiding and positioning surface, and a first vacuum adsorption hole. The first guiding and positioning surface is located above the first bearing surface, the first vacuum adsorption hole is located within the first bearing surface, and the first guiding and positioning surface includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface; and / or

[0043] The upper wafer sliding and positioning component includes a second bearing surface, a second guiding and positioning surface, and a second vacuum adsorption hole. The second guiding and positioning surface is located above the second bearing surface, the second vacuum adsorption hole is located within the second bearing surface, and the second guiding and positioning surface includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface.

[0044] Optionally, the wafer transfer device further includes a lower wafer device. The lower wafer device is installed on the workpiece table and distributed around the wafer adsorption surface, and can move horizontally with the workpiece table. The lower wafer device includes a plurality of lower wafer positioning components and at least one lower wafer clamping component. Both the lower wafer positioning component and the lower wafer clamping component have a wafer bearing surface. The wafer bearing surface of the lower wafer positioning component and the wafer bearing surface of the lower wafer clamping component are on the same plane and parallel to the wafer adsorption surface of the workpiece table. Among them, the wafer bearing surface of the lower wafer positioning component is used to receive the wafer from the wafer adsorption surface of the workpiece table, and the lower wafer clamping component can move in the direction towards the center of the wafer after the lower wafer positioning component has received the wafer to provide a pre-tightening force to the wafer.

[0045] Optionally, the lower wafer positioning component includes a lower wafer fixing and positioning component. The lower wafer fixing and positioning component includes a third bearing surface, a third guiding and positioning surface, and a third vacuum adsorption hole. The third guiding and positioning surface is located above the third bearing surface, the third vacuum adsorption hole is located within the third bearing surface, and the third guiding and positioning surface includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface; and / or

[0046] The lower wafer clamping component includes a third driving component, a lower wafer sliding component, and a lower wafer sliding and positioning component. The lower wafer sliding component is located above the third driving component and connected to the third driving component. The lower wafer sliding and positioning component is located above the lower wafer sliding component and connected to the lower wafer sliding component through a lower wafer clamping spring. Among them, the third driving component is used to drive the lower wafer sliding component to move in the direction towards or away from the center of the wafer, so that the lower wafer sliding and positioning component moves to apply a pre-tightening force to the wafer or remove the pre-tightening force.

[0047] Optionally, the lower wafer sliding and positioning component includes a fourth bearing surface, a fourth guiding and positioning surface, and fourth vacuum suction holes. The fourth guiding and positioning surface is located above the fourth bearing surface, and the fourth vacuum suction holes are located within the fourth bearing surface. The fourth guiding and positioning surface includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface.

[0048] Optionally, the semiconductor measuring device includes a film thickness measuring system.

[0049] As described above, in the wafer transfer device and transfer method applied to a semiconductor measuring device according to the present invention, the loading operation of the second wafer can be completed during the detection process of the first wafer, saving the loading operation time in the entire process, improving the wafer transfer efficiency, and preliminarily positioning the wafer during the loading process, improving the subsequent detection efficiency. In addition, during the unloading process, the downward movement of the wafer adsorption surface in the Z direction and the movement of the workpiece table in the X direction are synchronized, which can save the unloading time and further improve the wafer transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It shows a schematic flow chart of the wafer transfer method provided in Embodiment 1 of the present invention.

[0051] Figure 2 It shows a schematic diagram of a wafer placed on the loading device in Embodiment 1 of the present invention.

[0052] Figure 3 It shows a schematic structural diagram of the loading positioning component in Embodiment 1 of the present invention.

[0053] Figure 4 It shows a schematic structural diagram of the loading clamping component in Embodiment 1 of the present invention.

[0054] Figure 5 It shows a schematic diagram of the loading clamping component providing a pre-tightening force to the wafer in Embodiment 1 of the present invention.

[0055] Figure 6 It shows a schematic diagram of a wafer placed on the unloading device in Embodiment 1 of the present invention.

[0056] Figure 7 It shows an exploded view of a wafer placed on the unloading device in Embodiment 1 of the present invention.

[0057] Figure 8 It shows a top view of a wafer placed on the unloading device in Embodiment 1 of the present invention.

[0058] Figure 9 It shows a schematic structural diagram of the unloading positioning component in Embodiment 1 of the present invention.

[0059] Figure 10 It shows a schematic structural diagram of the lower piece clamping assembly in the first embodiment of the present invention.

[0060] Element number description

[0061] 1 Frame

[0062] 10 Measuring area

[0063] 11 Handover area

[0064] 2 Workpiece table

[0065] 3 Upper piece device

[0066] 30 Upper piece positioning assembly

[0067] 301 First driving component

[0068] 302 Upper piece fixed positioning component

[0069] 3020 First vacuum adsorption hole

[0070] 3021 First bearing surface

[0071] 3022 First guiding and positioning surface

[0072] 303 First connecting piece

[0073] 31 Upper piece clamping assembly

[0074] 311 Second driving component

[0075] 312 Upper piece sliding component

[0076] 313 Upper piece sliding positioning component

[0077] 3130 Second vacuum adsorption hole

[0078] 3131 Second bearing surface

[0079] 3132 Second guiding and positioning surface

[0080] 314 Upper piece clamping spring

[0081] 315 Second connecting piece

[0082] 3151 Second upper connecting piece

[0083] 3152 Second lower connecting piece

[0084] 4 Manipulator

[0085] 5 Lower piece device

[0086] 50 Lower piece positioning assembly

[0087] Lower wafer fixing and positioning component 501

[0088] Third vacuum adsorption hole 5010

[0089] Third bearing surface 5011

[0090] Third guiding and positioning surface 5012

[0091] Lower wafer clamping assembly 51

[0092] Third driving component 511

[0093] Lower wafer sliding component 512

[0094] Lower wafer sliding and positioning component 513

[0095] Fourth vacuum adsorption hole 5130

[0096] Fourth bearing surface 5131

[0097] Fourth guiding and positioning surface 5132

[0098] Lower wafer clamping spring 514

[0099] Third connecting piece 515

[0100] Mounting base 516 Specific implementation mode

[0101] The following uses specific specific examples to illustrate the implementation mode of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes. Each detail in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0102] Please refer to Figures 1 to 10 . It should be noted that the drawings provided in this embodiment only illustrate the basic concept of the present invention in a schematic manner. Therefore, only the components related to the present invention are shown in the drawings, rather than being drawn according to the number, shape, and size of the components during actual implementation. The type, quantity, and ratio of each component during actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0103] Embodiment 1

[0104] This embodiment provides a wafer transfer method applied to semiconductor measurement equipment, including the following steps:

[0105] Provided is a wafer transfer device for a semiconductor measuring device. The semiconductor measuring device includes a frame 1 and a workpiece stage 2. A measuring area 10 and a transfer area 11 are provided on the frame. The workpiece stage 2 has a wafer adsorption surface that can be lifted and lowered, and the workpiece stage 2 can move within the measuring area 10 and the transfer area 11. The wafer transfer device includes a wafer loading device 3, and the wafer loading device 3 is installed on the frame at the transfer area 11;

[0106] Wafer loading step: Drive the manipulator 4 to adsorb the first wafer and move it to the wafer loading position, and place the first wafer on the wafer loading device 3;

[0107] Transfer step: Drive the workpiece stage 2 to move to the transfer position, and control the wafer adsorption surface to rise so that the wafer adsorption surface contacts and adsorbs the first wafer, and transfer the first wafer from the wafer loading device 3 to the workpiece stage 2;

[0108] Measuring step: Drive the workpiece stage 2 to drive the first wafer to move horizontally to the measuring position of the semiconductor measuring device, and control the semiconductor measuring device to measure the first wafer;

[0109] Wherein, when performing the measuring step on the first wafer, drive the manipulator 4 to adsorb the second wafer and move it to the wafer loading position, and complete the wafer loading step of the second wafer.

[0110] As an example, please refer to Figure 1 , which shows a specific process when the wafer transfer method is applied to a semiconductor measuring device. First, the wafer adsorption surface moves in the Z direction to the measuring position, then the workpiece stage moves away from the transfer position in the X direction and moves to the measuring position, and then judgments are made and corresponding processes are executed according to the judgment results.

[0111] As an example, in the first judgment process, judge whether there is a wafer on the workpiece stage:

[0112] If yes (Y), then the following steps are sequentially executed: The wafer starts to be measured → The wafer is measured completely → The wafer adsorption surface descends in the Z direction to transfer the wafer to the wafer unloading device, and at the same time the workpiece stage moves in the X direction to the transfer area → The manipulator picks up the wafer, and the wafer unloading device completes the wafer unloading action → The wafer adsorption surface rises in the Z direction to the pre-transfer position → The vacuum of the wafer loading device is broken, and the cylinder of the wafer loading clamping assembly retracts → The wafer adsorption surface further rises in the Z direction to adsorb the wafer → The cylinder of the wafer loading positioning assembly retracts to complete the wafer transfer. Thereafter, the step of "the wafer adsorption surface moves in the Z direction to the measuring position" can be returned as needed to start the next cycle;

[0113] If not (N), then the following steps are executed in sequence: Wait for the wafer loading device to complete wafer loading → The worktable moves in the X direction to the handover area → The wafer adsorption surface rises in the Z direction to the pre-connection position → The wafer loading device breaks the vacuum, and the cylinder of the wafer loading clamping component retracts → The wafer adsorption surface further rises in the Z direction to adsorb the wafer -> The cylinder of the wafer loading positioning component retracts to complete the wafer handover. Thereafter, the step of "the wafer adsorption surface moves in the Z direction to the measurement position" can be returned as needed to start the next cycle.

[0114] As an example, in the second judgment process, it is judged whether there is a wafer on the wafer loading device:

[0115] If so (Y), then the following steps are executed in sequence: Complete wafer loading (the second wafer loading is completed, waiting for the first wafer to complete measurement and be unloaded) → The wafer adsorption surface rises in the Z direction to the pre-connection position → The wafer loading device breaks the vacuum, and the cylinder of the wafer loading clamping component retracts → The wafer adsorption surface further rises in the Z direction to adsorb the wafer → The cylinder of the wafer loading positioning component retracts to complete the wafer handover (the second wafer handover is completed). Thereafter, the step of "the wafer adsorption surface moves in the Z direction to the measurement position" can be returned as needed to start the next cycle;

[0116] If not (N), then the following steps are executed in sequence: The manipulator picks up the wafer → The manipulator moves to the wafer loading position, and the wafer handover device completes the handover action → The manipulator withdraws → Complete wafer loading (the second wafer loading is completed, waiting for the first wafer to complete measurement and be unloaded) → The wafer adsorption surface rises in the Z direction to the pre-connection position → The wafer loading device breaks the vacuum, and the cylinder of the wafer loading clamping component retracts → The wafer adsorption surface further rises in the Z direction to adsorb the wafer → The cylinder of the wafer loading positioning component retracts to complete the wafer handover (the second wafer handover is completed). Thereafter, the step of "the wafer adsorption surface moves in the Z direction to the measurement position" can be returned as needed to start the next cycle.

[0117] As an example, as Figure 2 shown, it is an example diagram showing the wafer placed on the wafer loading device 3. The worktable 2 can move horizontally to drive the wafer adsorption surface to move horizontally, and the wafer adsorption surface can rotate; in the measurement step, when the worktable 2 drives the wafer to move horizontally to the measurement position of the semiconductor measurement device to measure the wafer, the wafer adsorption surface rotates to drive the wafer to rotate to achieve multi-angle detection of the wafer.

[0118] As an example, during the measurement of the first wafer, the manipulator 4 adsorbs the second wafer and moves it to the wafer loading position to complete wafer loading, saving the action time of wafer loading in the whole process and improving the wafer handover efficiency.

[0119] As an example, the wafer loading device 3 includes a plurality of wafer loading positioning components 30 and at least one wafer loading clamping component 31. Both the wafer loading positioning component 30 and the wafer loading clamping component 31 have a wafer bearing surface, and a pre-tightening component is provided on the wafer bearing surface of the wafer loading clamping component 31. Both the wafer loading positioning component 30 and the wafer loading clamping component 31 can move in a direction towards or away from the center of the wafer. After the manipulator 4 adsorbs the first wafer and moves to the wafer loading position, the wafer loading step further includes:

[0120] S101: Driving the wafer loading positioning component 30 to move in a direction towards the center of the first wafer to form a wafer loading bearing surface;

[0121] S102: Driving the manipulator 4 to descend to place the first wafer on the wafer loading bearing surface;

[0122] S103: Driving the wafer loading clamping component 31 to move in a direction towards the center of the first wafer to provide a pre-tightening force to the first wafer placed on the wafer loading bearing surface.

[0123] As an example, as Figure 3 shown, it is a schematic structural diagram of the wafer loading positioning component 30. The wafer loading positioning component 30 includes a first driving component 301 and a wafer loading fixed positioning component 302. The wafer loading fixed positioning component 302 is located above the first driving component 301 and is connected to the output end of the first driving component 301. A first bearing surface 3021 is provided at one end of the wafer loading fixed positioning component 302 facing the wafer. In step S101, the first driving component 301 drives the wafer loading fixed positioning component 302 to move in a direction towards the center of the first wafer, and a plurality of first bearing surfaces 3021 form a wafer loading bearing surface.

[0124] As an example, the wafer loading bearing surface is parallel to the wafer adsorption surface, and the height of the wafer loading bearing surface in the Z direction is lower than the plane determined by the wafer loading position, and the height difference is 1-2 mm. In step S102, the manipulator 4 descends 1-2 mm in the Z direction to place the first wafer on the wafer loading bearing surface.

[0125] As an example, a first guiding and positioning surface 3022 is provided on the first bearing surface 3021. The first guiding and positioning surface 3022 includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface (as shown in the figure, that is, a guiding structure in the shape of a semi-circular platform is provided on the first bearing surface 3021); further, when the position of the wafer is offset during wafer loading and does not fall on the wafer loading bearing surface, the inclined guiding surface can make the wafer slide onto the wafer loading bearing surface, and the circular positioning surface can play a role in limiting the wafer placed on the wafer loading bearing surface.

[0126] As an example, the height of the upper wafer carrying surface in the Z direction is higher than the plane determined by the workpiece table 2 at the Z-direction measurement position, and the height difference is greater than the sum of the thickness of a robot 4 and the thickness of a wafer.

[0127] As an example, as Figure 4 shown, it is a schematic structural diagram of the wafer loading clamping assembly 31. The wafer loading clamping assembly 31 includes a second driving component 311, a wafer loading sliding component 312, and a wafer loading sliding positioning component 313. The wafer loading sliding component 312 is located above the second driving component 311 and is connected to the output end of the first driving component 301. An opening groove facing the wafer is provided at one end of the wafer loading sliding component 312 close to the wafer. The wafer loading sliding positioning component 313 is located in the opening groove and can move horizontally relative to the wafer loading sliding component 312. One end of the wafer loading sliding positioning component 313 away from the wafer is connected to the side wall of the opening groove through a wafer loading clamping spring 314. A second carrying surface 3131 is provided at one end of the wafer loading sliding positioning component 313 close to the wafer. Among them, the second carrying surface 3131 and the first carrying surface 3021 are on the same horizontal plane, and a second guiding and positioning surface 3132 is provided on the second carrying surface 3131; in step S103, the second driving component 311 drives the wafer loading sliding component 312 to move in the direction towards the center of the first wafer. The side wall of the second guiding and positioning surface 3132 touches the first wafer placed on the upper wafer carrying surface, and the wafer loading clamping spring 314 provides a pre-tightening force to the first wafer through the wafer loading sliding positioning component 313.

[0128] As an example, as Figure 5 shown, the circular positioning surfaces of the plurality of first guiding and positioning surfaces 3022 play a limiting role, and the circular positioning surface of the second guiding and positioning surface 3132 provides a pre-tightening force to the wafer through the wafer loading clamping spring 314.

[0129] As an example, the cooperation between the first guiding and positioning surface 3022 and the second guiding and positioning surface 3132 can, on the one hand, provide a pre-tightening force to the wafer placed on the wafer loading device 3 to improve the safety of wafer loading, and on the other hand, preliminarily position the wafer placed on the wafer loading device 3 to improve the subsequent detection efficiency.

[0130] As an example, the wafer transfer device further includes a vacuum adsorption device. A first vacuum adsorption hole 3020 connected to the vacuum adsorption device is provided in the first carrying surface 3021. In step S102, after the robot 4 descends and places the first wafer on the upper wafer carrying surface, the first vacuum adsorption hole 3020 establishes a vacuum to adsorb the first wafer; a second vacuum adsorption hole 3130 connected to the vacuum adsorption device is provided in the second carrying surface 3131. In step S103, after the wafer loading clamping assembly 31 provides a pre-tightening force to the first wafer placed on the upper wafer carrying surface, the second vacuum adsorption hole 3130 establishes a vacuum to adsorb the first wafer.

[0131] As an example, on the one hand, the first vacuum adsorption hole 3020 and the second vacuum adsorption hole 3130 can adsorb the first wafer, adsorb the first wafer on the wafer loading device 3, and improve the safety of wafer loading. On the other hand, the vacuum sensor can be used to judge whether the vacuum is established normally, and then judge whether the wafer loading step of the wafer is completed normally.

[0132] As an example, after it is determined that the wafer is properly placed on the wafer loading device 3, the robot 4 withdraws from the loading position.

[0133] As an example, in the Z direction, the transfer position is below the loading position. In the transfer step, the workpiece table 2 drives the wafer adsorption surface to move to the transfer position, and controls the wafer adsorption surface to rise to the pre-contact position. The height difference between the pre-contact position and the wafer loading surface of the loaded wafer is 0.5 - 1 mm. When the wafer adsorption surface reaches the pre-contact position, the first vacuum adsorption hole 3020 and the second vacuum adsorption hole 3130 cut off the vacuum and no longer adsorb the first wafer, and the second driving component 311 drives the wafer loading clamping component 31 to move in a direction away from the center of the wafer to remove the pre-tightening force on the first wafer. The wafer adsorption surface rises in the Z direction from the pre-contact position to contact and adsorb the first wafer, and the wafer adsorption surface continues to rise 0.1 - 0.5 mm in the Z direction to make the first wafer leave the wafer loading surface of the loaded wafer (which can avoid friction between the wafer loading surface and the first wafer). The first driving component 301 drives the wafer loading positioning component 30 to move in a direction away from the center of the wafer, and sends a signal for transferring the first wafer to the workpiece table 2.

[0134] As an example, after the second driving component 311 drives the wafer loading clamping component 31 to move in a direction away from the center of the wafer and the first driving component 301 drives the wafer loading positioning component 30 to move in a direction away from the center of the wafer, the wafer loading device 3 does not contact the first wafer and does not interfere with the workpiece table 2.

[0135] As an example, after the wafer adsorption surface adsorbs the first wafer, it descends to the transfer position. The workpiece table 2 moves in the X direction to drive the wafer adsorption surface to move, and then drives the first wafer to the measurement position for the measurement step.

[0136] As an example, the semiconductor measurement device includes a film thickness measurement system that can measure the film thickness of the wafer.

[0137] As an example, before the measurement step, the workpiece table 2 judges whether there is a wafer on the workpiece table 2 through a vacuum sensor or an optical fiber sensor arranged on the wafer adsorption surface. After it is determined that there is a wafer on the workpiece table 2, a wafer presence signal is sent, and the semiconductor measurement device measures the first wafer. If there is no wafer on the workpiece table 2, wait for the wafer loading device 3 to complete the loading, and the workpiece table 2 moves in the X direction to the transfer area for the above transfer step.

[0138] As an example, as Figure 6 shown, the wafer transfer device further includes a wafer unloading device 5, which is installed on the workpiece table 2 and distributed around the wafer adsorption surface, and can move in the X direction with the workpiece table 2. After the measurement step is completed, the following wafer unloading step is also included:

[0139] Control the wafer adsorption surface to descend so that the first wafer contacts the wafer unloading device 5 and transfer the first wafer to the wafer unloading device 5, drive the workpiece table 2 to move to the transfer position, and drive the manipulator to move to the wafer unloading position and adsorb the first wafer, and take the first wafer away from the wafer unloading device 5;

[0140] After the wafer unloading step is completed, repeat the transfer step and the measurement step to perform the transfer and measurement of the second wafer.

[0141] As an example, the wafer unloading device 5 includes a plurality of wafer unloading positioning components 50 and at least one wafer unloading clamping component 51. Both the wafer unloading positioning components 50 and the wafer unloading clamping component 51 have a wafer bearing surface. The wafer bearing surfaces of the plurality of wafer unloading positioning components 50 are located on the same plane to form a wafer unloading wafer bearing surface, and the wafer unloading wafer bearing surface is parallel to the wafer adsorption surface of the workpiece table 2. The wafer unloading clamping component 51 can move along the direction towards or away from the center of the wafer. Specifically, transferring the first wafer to the wafer unloading device 5 in the wafer unloading step includes:

[0142] S401: Control the wafer adsorption surface to descend and place the first wafer on the wafer unloading wafer bearing surface;

[0143] S402: Drive the wafer unloading clamping component 51 to move along the direction towards the center of the first wafer to provide a pre-tightening force to the first wafer placed on the wafer unloading wafer bearing surface.

[0144] As an example, the wafer unloading device 5 includes three wafer unloading positioning components 50 and one wafer unloading clamping component 51, Figure 7 and Figure 8 are respectively shown as an exploded view and a top view of the wafer placed on the wafer unloading device 5.

[0145] As an example, the height of the wafer unloading wafer bearing surface in the Z direction is lower than the plane determined by the Z-direction measurement position of the workpiece table 2, and the height difference is greater than the sum of the thickness of one manipulator 4 and the thickness of one wafer.

[0146] As an example, as Figure 9As shown in the figure, it is a schematic structural diagram of the wafer unloading positioning component 50. The wafer unloading positioning component 50 includes a wafer unloading fixed positioning component 501. One end of the wafer unloading fixed positioning component 501 close to the wafer is provided with a third bearing surface 5011. A plurality of third bearing surfaces 5011 form a wafer unloading wafer bearing surface. A third guiding and positioning surface 5012 is arranged on the third bearing surface 5011. The third guiding and positioning surface 5012 includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface. The center position determined by a plurality of third guiding and positioning surfaces 5012 coincides with the rotation central axis of the wafer adsorption surface. Third vacuum adsorption holes 5010 connected to a vacuum adsorption device are arranged in the third bearing surface 5011.

[0147] As an example, in step S401, the steps of controlling the wafer adsorption surface to descend and placing the first wafer on the wafer unloading wafer bearing surface include:

[0148] (1) The wafer adsorption surface descends in the Z direction to the wafer unloading handover position, and the workpiece table 2 breaks the vacuum so that the wafer adsorption surface no longer adsorbs the first wafer. Among them, the wafer unloading handover position is equal to or slightly higher than the wafer unloading wafer bearing surface;

[0149] (2) After the wafer adsorption surface breaks the vacuum, it continues to descend, hands over the first wafer to the wafer unloading wafer bearing surface, and the third vacuum adsorption holes 5010 establish a vacuum to adsorb the first wafer.

[0150] Furthermore, when the position of the first wafer deviates during the process of being handed over from the workpiece table 2 to the wafer unloading wafer bearing surface and does not fall on the wafer unloading wafer bearing surface, the inclined guiding surface can make the wafer slide onto the wafer unloading wafer bearing surface, and the circular positioning surface can play a limiting role on the wafer placed on the wafer unloading wafer bearing surface.

[0151] As an example, as Figure 10 shown in the figure, it is a schematic structural diagram of the wafer unloading clamping component 51. The wafer unloading clamping component 51 includes a third driving component 511, a wafer unloading sliding component 512 and a wafer unloading sliding positioning component 513. The wafer unloading sliding component 512 is located above the third driving component 511 and is connected to the output end of the third driving component 511. One end of the wafer unloading sliding component 512 close to the wafer is provided with an opening groove facing the wafer. The wafer unloading sliding positioning component 513 is located in the opening groove and can move horizontally relative to the wafer unloading sliding component 512. One end of the wafer unloading sliding positioning component 513 far from the wafer is connected to the side wall of the opening groove through a wafer unloading clamping spring 514. One end of the wafer unloading sliding positioning component 513 close to the wafer is provided with a fourth bearing surface 5131. A fourth guiding and positioning surface 5132 is arranged on the fourth bearing surface 5131. Fourth vacuum adsorption holes 5130 connected to the vacuum adsorption device are arranged in the fourth bearing surface 5131.

[0152] As an example, in step S402, after it is determined that the first wafer is correctly transferred to the lower wafer carrying surface, the third driving component 511 drives the lower sliding component 512 to move in the direction towards the center of the first wafer. The side wall of the fourth guiding and positioning surface 5132 touches the first wafer placed on the lower wafer carrying surface. The lower clamping spring 514 provides a pre-tightening force to the first wafer through the lower sliding and positioning component 513, and the fourth vacuum adsorption hole 5130 establishes vacuum adsorption for the first wafer to further confirm that the first wafer has been correctly transferred to the lower wafer carrying surface.

[0153] As an example, after the wafer adsorption surface transfers the first wafer to the lower wafer device 5, the wafer adsorption surface further descends to the lowest position in the Z direction. Among them, the height difference between the lowest position and the lower wafer carrying surface is greater than the thickness of a manipulator 4, providing a movement space for the subsequent manipulator 4 to pick up the first wafer placed on the lower wafer device 5.

[0154] As an example, during the process of the wafer adsorption surface descending in the Z direction to transfer the first wafer to the lower wafer device 5, the workpiece stage 2 moves in the X direction to the transfer position, that is, the descending of the wafer adsorption surface in the Z direction and the movement of the workpiece stage 2 in the X direction are carried out simultaneously; after the workpiece stage 2 moves to the transfer position in the X direction, the manipulator 4 moves to the lower wafer position. Among them, the lower wafer position is below the lower wafer carrying surface in the Z direction and higher than the lowest position. After the manipulator 4 moves to the lower wafer position, the third vacuum adsorption hole 5010 and the fourth vacuum adsorption hole 5130 break the vacuum and no longer adsorb the first wafer, and the third driving component 511 drives the lower clamping assembly 51 to move in the direction away from the center of the first wafer to remove the pre-tightening force from the first wafer.

[0155] As an example, after the lower clamping assembly 51 removes the pre-tightening force from the first wafer, the manipulator 4 rises in the Z direction to pick up and adsorb the first wafer, and exits the transfer position to complete the lower wafer process.

[0156] As an example, during the lower wafer process, the descending movement of the wafer adsorption surface in the Z direction and the movement of the workpiece stage 2 in the X direction are carried out synchronously, saving the time of the lower wafer action and improving the wafer transfer efficiency.

[0157] The wafer transfer method applied to the semiconductor measurement equipment in this embodiment can complete the upper wafer action of the second wafer during the detection process of the first wafer, saving the action time of the upper wafer in the whole process, improving the wafer transfer efficiency, and can initially complete the positioning function of the wafer during the upper wafer process, improving the subsequent detection efficiency. In addition, during the lower wafer process, the descending movement of the wafer adsorption surface in the Z direction and the movement of the workpiece stage in the X direction are carried out synchronously, which can save the lower wafer time and further improve the wafer transfer efficiency.

[0158] Embodiment 2

[0159] Please refer to Figures 2 to 10, this embodiment provides a wafer transfer device applied to a semiconductor measurement device. The semiconductor measurement device includes a frame 1 and a workpiece stage 2. A measurement area 10 and a transfer area 11 are provided on the frame 1. The workpiece stage 2 has a liftable wafer adsorption surface, and the workpiece stage 2 can move within the measurement area 10 and the transfer area 11. The wafer transfer device includes a wafer loading device 3. The wafer loading device 3 is installed on the frame 1 at the transfer area 11. The wafer loading device 3 includes a plurality of wafer positioning components 30 and at least one wafer clamping component 31. Both the wafer positioning component 30 and the wafer clamping component 31 have a wafer bearing surface. The wafer bearing surface of the wafer positioning component 30 and the wafer bearing surface of the wafer clamping component 31 are on the same plane and parallel to the wafer adsorption surface of the workpiece stage 2. A pre-tightening component is provided on the wafer bearing surface of the wafer clamping component 31. Among them, the wafer bearing surface of the wafer positioning component 30 can move along the direction towards the center of the wafer to receive the wafer from the manipulator 4, and the wafer clamping component 31 can move along the direction towards the center of the wafer so that the pre-tightening component provides a pre-tightening force to the wafer placed on the wafer positioning component 31.

[0160] As an example, as Figure 2 shown, in this embodiment, the wafer loading device 3 includes three wafer positioning components 30 and one wafer clamping component 31.

[0161] As an example, as Figure 3 shown, the wafer positioning component 30 includes a first driving component 301 and a wafer fixed positioning component 302. The wafer fixed positioning component 302 is located above the first driving component 301 and is connected to the first driving component 301 through a first connecting piece 303. The first driving component 301 includes a driving cylinder. The driving cylinder includes a cylinder base and a horizontal telescopic rod. The cylinder base is fixedly connected to the frame 1, and the horizontal telescopic rod is located in the cylinder base and can perform horizontal telescopic movement relative to the cylinder base. The first connecting piece 303 is in the shape of a "7", including an integrated horizontal support plate and a vertical support plate. The vertical support plate is connected to the horizontal telescopic rod (i.e., the output end of the first driving component 301). The wafer fixed positioning component 302 is arranged on the horizontal support plate. One end of the wafer fixed positioning component 302 facing the wafer is provided with a first bearing surface 3021. A first guiding and positioning surface 3022 is provided on the first bearing surface 3021, and a first vacuum adsorption hole 3020 is provided in the first bearing surface 3022.

[0162] As an example, a plurality of first wafer bearing surfaces 3021 form an upper wafer bearing surface, and the height of the upper wafer bearing surface in the Z direction is higher than the plane determined by the workpiece table 2 at the Z-direction measurement position, and the height difference is greater than the sum of the thickness of a robot 4 and the thickness of a wafer; when the lateral telescopic rod of the driving cylinder (the first driving member 301) extends, the plurality of first bearing surfaces 3021 receive the wafer from the robot 4; the first guiding and positioning surface 3022 includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface. Further, when the position of the wafer deviates during the process of the robot 4 placing the wafer on the first bearing surface 3021 and does not fall on the first bearing surface 3021, the inclined guiding surface can make the wafer slide onto the first bearing surface 3021, and the circular positioning surface can limit the wafer placed on the first bearing surface 3021; the first vacuum suction hole 3020 can establish a vacuum suction force on the wafer placed on the first bearing surface 3021.

[0163] As an example, Figure 4 As shown, the upper wafer clamping assembly 31 includes a second driving member 311, an upper wafer sliding member 312 and an upper wafer sliding and positioning member 313. The upper wafer sliding member 312 is located above the second driving member 311 and is connected to the second driving member 311 through a second connecting member 315; the second driving member 311 includes a driving cylinder, and the driving cylinder includes a cylinder base and a lateral telescopic rod. The cylinder base is fixedly connected to the frame 1, and the lateral telescopic rod is located in the cylinder base and can perform a lateral telescopic movement relative to the cylinder base; the second connecting member 315 includes a second upper connecting member 3151 and a second lower connecting member 3152. The second lower connecting member 3152 is in a "7" shape and includes an integrated lateral support plate and a longitudinal support plate. The longitudinal support plate is connected to the lateral telescopic rod of the driving cylinder (i.e., the output end of the second driving member 311). The second upper connecting member 3151 is in a "Z" shape. The bottom end of the second upper connecting member 3151 is connected to the lateral support plate, and the top end of the second upper connecting member 3151 is connected to the upper wafer sliding member 312; an opening groove facing the wafer is provided at one end of the upper wafer sliding member 312 close to the wafer. The upper wafer sliding and positioning member 313 is located in the opening groove and can perform a horizontal movement relative to the upper wafer sliding member 312. One end of the upper wafer sliding and positioning member 313 far from the wafer is connected to the side wall of the opening groove through an upper wafer clamping spring 314. A second bearing surface 3131 is provided at one end of the upper wafer sliding and positioning member 313 close to the wafer. A second guiding and positioning surface 3132 is provided on the second bearing surface 3131, and a third vacuum suction hole 3130 is provided in the second bearing surface 3131. It should be noted that in some embodiments, the second upper connecting member 3151 and the second lower connecting member 3152 may be an integral structure.

[0164] As an example, the second bearing surface 3131 and the first bearing surface 3021 are located on the same horizontal plane; as Figure 5As shown, when the lateral telescopic rod of the cylinder (the second driving component 311) extends, the second bearing surface 3131 provides a part of the bearing capacity for the wafer placed on the first bearing surface 3021, and the side surface of the second guiding and positioning surface 3022 contacts the wafer. The second guiding and positioning surface 3022 provides a pre-tightening force for the wafer through the wafer loading clamping spring 314. After the second guiding and positioning surface 3022 provides a pre-tightening force for the wafer, the second vacuum adsorption hole 3130 can establish a vacuum adsorption force for the wafer placed on the wafer loading device 3.

[0165] As an example, on the one hand, the first vacuum adsorption hole 3020 and the second vacuum adsorption hole 3130 can adsorb the wafer and adsorb the wafer on the wafer loading device 3, which can improve the safety of wafer loading. On the other hand, the vacuum sensor can be used to judge whether the vacuum is established normally and whether the wafer loading step of the wafer is completed normally.

[0166] As an example, the worktable 2 can move horizontally, and a rotation and lifting mechanism is arranged in the worktable 2 to realize the lifting and rotation of the wafer adsorption surface. After the wafer is normally placed on the wafer loading device 3, the worktable 2 can move horizontally to the transfer area 11, and the wafer adsorption surface rises to adsorb the wafer located on the wafer loading device 3. After the wafer adsorption surface completes the adsorption of the wafer, the first driving component 301 and the second driving component 311 can move in the direction away from the center of the wafer (the cylinder retracts) to release the wafer. After the worktable 2 adsorbs the wafer, it can move to the measurement area 10 to measure the wafer.

[0167] As an example, as Figure 6 shown, the wafer transfer device further includes a wafer unloading device 5. The wafer unloading device 5 is installed on the worktable 2 and is distributed around the wafer adsorption surface, and can move horizontally with the worktable 2. The wafer unloading device 5 includes a plurality of wafer unloading positioning components 50 and at least one wafer unloading clamping component 51. Both the wafer unloading positioning components 50 and the wafer unloading clamping components 51 have a wafer bearing surface. The wafer bearing surface of the wafer unloading positioning component 50 is used to receive the wafer from the wafer adsorption surface of the worktable 2. After the wafer unloading positioning component 50 completes the reception of the wafer, the wafer unloading clamping component 51 can move in the direction towards the center of the wafer to provide a pre-tightening force for the wafer.

[0168] As an example, the wafer unloading device 5 includes three wafer unloading positioning components 50 and one wafer unloading clamping component 51. Figure 7 and Figure 8 respectively show an exploded view and a top view of the wafer placed on the wafer unloading device 5.

[0169] As an example, as Figure 9As shown in the figure, the lower wafer positioning component 50 includes a lower wafer fixing and positioning member 501. An installation hole is provided at the bottom end of the lower wafer fixing and positioning member 501 for fixed installation with the workpiece table 2. On the side of the top end of the lower wafer fixing and positioning member 501 facing the wafer, there is a third bearing surface 5011. A third guiding and positioning surface 5012 is provided on the third bearing surface 5011, and third vacuum suction holes 5010 are provided in the third bearing surface 5011.

[0170] As an example, a plurality of third bearing surfaces 5011 are located on the same horizontal plane to form a lower wafer bearing surface. The lower wafer bearing surface is parallel to the wafer suction surface of the workpiece table 2, and the height of the lower wafer bearing surface in the Z direction is lower than the plane determined by the Z-direction measurement position of the workpiece table 2. The height difference is greater than the sum of the thicknesses of a manipulator 4 and a wafer. When the wafer is inspected, the wafer suction surface can descend to transfer the wafer to the lower wafer positioning component 50; the third guiding and positioning surface 5012 includes a circular positioning surface and an inclined guiding surface above the circular positioning surface. Further, when the wafer suction surface places the wafer on the third bearing surface 5011 and its position is offset and does not fall on the third bearing surface 5011, the inclined guiding surface can make the wafer slide onto the third bearing surface 5011, and the circular positioning surface can limit the position of the wafer placed on the third bearing surface 5011; the third vacuum suction holes 5010 can establish a vacuum suction force on the wafer placed on the third bearing surface 5011.

[0171] As an example, as Figure 10 shown in the figure, the lower wafer clamping component 51 includes a third driving member 511, a lower wafer sliding member 512, and a lower wafer sliding and positioning member 513. The lower wafer sliding member 512 is located above the third driving member 511 and is connected to the third driving member 511 through a third connecting member 515; the third driving member 511 includes a driving cylinder. The driving cylinder includes a cylinder base and a horizontal telescopic rod. The cylinder base is fixedly connected to the workpiece table 2 through an installation base 516. The horizontal telescopic rod is located in the cylinder base and can perform horizontal telescopic movement relative to the cylinder base; the third connecting member 515 is in a "7" shape and includes an integrated horizontal support plate and a vertical support plate. The horizontal telescopic rod of the driving cylinder is connected to the vertical support plate, and the lower wafer sliding member 512 is arranged on the horizontal support plate; an opening groove facing the wafer is provided at one end of the lower wafer sliding member 512 close to the wafer. The lower wafer sliding and positioning member 513 is located in the opening groove and can perform horizontal movement relative to the lower wafer sliding member 512. One end of the lower wafer sliding and positioning member 513 away from the wafer is connected to the side wall of the opening groove through a lower wafer clamping spring 514. One end of the lower wafer sliding and positioning member 513 close to the wafer is provided with a fourth bearing surface 5131. A fourth guiding and positioning surface 5132 is provided on the fourth bearing surface 5131, and fourth vacuum suction holes 5130 are provided in the fourth bearing surface 5131.

[0172] As an example, the mounting base 516 is in a "C" shape. The bottom end of the mounting base 516 is provided with mounting holes for fixedly mounting with the workpiece table 2, and the top end of the mounting base 516 is fixedly connected to the third driving component 511 (cylinder base); on the one hand, the mounting base 516 is used to mount the fourth driving component 511 on the workpiece table 2, and on the other hand, the mounting base 516 is used to compensate for the height difference between the wafer unloading positioning component 50 and the wafer unloading clamping component 51, so that the third bearing surface 5011 and the fourth bearing surface 5131 are located in the same plane.

[0173] As an example, after the wafer is placed on the third bearing surface 5011 by the wafer adsorption surface, the telescopic rod of the driving cylinder (the fourth driving component 511) extends to make the fourth bearing surface 5131 provide a part of the bearing capacity for the wafer placed on the third bearing surface 5011, and the side surface of the fourth guiding and positioning surface 5132 contacts the wafer. The fourth guiding and positioning surface 5132 provides a pre-tightening force for the wafer through the wafer unloading clamping spring 514. After the fourth guiding and positioning surface 5132 provides a pre-tightening force for the wafer, the fourth vacuum adsorption hole 5130 can establish a vacuum adsorption force for the wafer placed on the wafer unloading device 5.

[0174] As an example, the cooperation between the third guiding and positioning surface 5012 and the fourth guiding and positioning surface 5132 can, on the one hand, provide a pre-tightening force for the wafer placed on the wafer unloading device 5 to improve the safety of wafer unloading, and on the other hand, preliminarily position the wafer placed on the wafer unloading device 5.

[0175] As an example, the third vacuum adsorption hole 5010 and the fourth vacuum adsorption hole 5130 can, on the one hand, adsorb the wafer and adsorb the wafer on the wafer unloading device 5 to improve the safety of wafer unloading, and on the other hand, the vacuum sensor can be used to judge whether the vacuum is established normally and whether the wafer unloading step of the wafer is completed normally.

[0176] As an example, after the wafer is placed on the wafer unloading device 5, the wafer adsorption surface can further descend to the lowest position, and the height difference between the lowest position and the wafer unloading and wafer bearing surface is greater than the thickness of a manipulator 4, providing a movement space for the subsequent manipulator 4 to pick up the wafer placed on the wafer unloading device 5.

[0177] As an example, during the process of the wafer adsorption surface descending in the Z direction to hand over the wafer to the wafer unloading device 5, the workpiece table 2 moves along the X direction to the handover area 11 at the same time, so that the manipulator 4 moves to the handover area 11 to pick up the wafer placed on the wafer unloading device 5.

[0178] The wafer transfer device applied to the semiconductor measuring equipment in this embodiment has the advantages of simple structure and high transfer efficiency compared with the traditional wafer transfer device.

[0179] In summary, in the wafer transfer device and transfer method applied to semiconductor measurement equipment according to the present invention, the wafer loading operation of the second wafer can be completed during the detection process of the first wafer, saving the operation time of wafer loading in the whole process, improving the wafer transfer efficiency, and preliminarily positioning the wafer during the wafer loading process, improving the subsequent detection efficiency. In addition, during the wafer unloading process, the downward movement of the wafer adsorption surface in the Z direction and the movement of the workpiece stage in the X direction are synchronized, which can save the wafer unloading time and further improve the wafer transfer efficiency. Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0180] The above embodiments are only illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A wafer transfer method applied to a semiconductor measurement device, characterized in that: The semiconductor measurement device includes a frame (1) and a workpiece table (2). A measurement area (10) and a transfer area (11) are provided on the frame (1). The workpiece table (2) has a wafer adsorption surface that can be lifted and lowered. The workpiece table (2) can move within the measurement area (10) and the transfer area (11). The wafer transfer device for the semiconductor measurement device includes a wafer loading device (3). The wafer loading device (3) is installed on the frame (1) at the transfer area (11). The wafer loading device (3) includes a plurality of wafer loading positioning components (30) and at least one wafer loading clamping component (31). The wafer loading positioning components (30) and the wafer loading clamping components (31) both have a wafer carrying surface, and a pre-tightening component is provided on the wafer carrying surface of the wafer loading clamping component (31). The wafer loading positioning components (30) and the wafer loading clamping components (31) can both move in a direction towards or away from the center of the wafer. The wafer loading positioning component (30) includes a first driving component (301) and a wafer loading fixed positioning component (302). The wafer loading fixed positioning component (302) is located above the first driving component (301) and is connected to the output end of the first driving component (301). The wafer loading clamping component (31) includes a second driving component (311), a wafer loading sliding component (312), and a wafer loading sliding positioning component (313). The wafer loading sliding component (312) is located above the second driving component (311) and is connected to the output end of the second driving component (311). The wafer loading sliding positioning component (313) is located above the wafer loading sliding component (312) and is connected to the wafer loading sliding component (312) through a wafer loading clamping spring (314). It includes the following steps: Wafer loading step: Drive the manipulator (4) to adsorb the first wafer and move it to the wafer loading position. Control the first driving component (301) to drive the wafer loading fixed positioning component (302) to move in a direction towards the center of the first wafer to form a wafer loading surface. Drive the manipulator (4) to descend and place the first wafer on the wafer loading surface. Control the second driving component (311) to drive the wafer loading sliding component (312) to move in a direction towards the center of the first wafer, so that the wafer loading sliding positioning component (313) fixes the first wafer, and apply a pre-tightening force to the first wafer through the wafer loading clamping spring (314) to place the first wafer on the wafer loading device (3). Transfer step: Drive the workpiece table (2) to move to the transfer position, and control the wafer adsorption surface to rise so that the wafer adsorption surface contacts and adsorbs the first wafer, and transfer the first wafer from the wafer loading device (3) to the workpiece table (2). Measurement step: Drive the workpiece table (2) to drive the first wafer to move horizontally to the measurement position of the semiconductor measurement device, and control the semiconductor measurement device to measure the first wafer. When performing the measurement step on the first wafer, the manipulator (4) is driven to adsorb the second wafer and move it to the wafer loading position, and the wafer loading step of the second wafer is completed.

2. The wafer transfer method applied to a semiconductor measuring device according to claim 1, wherein The wafer transfer device further includes a vacuum adsorption device. A first vacuum adsorption hole (3020) connected to the vacuum adsorption device is provided on the wafer loading positioning assembly (30). After driving the manipulator (4) to descend and place the first wafer on the wafer loading surface, the following steps are further included: Controlling the vacuum adsorption device to establish a vacuum through the first vacuum adsorption hole (3020) and adsorb the first wafer; and / or A second vacuum adsorption hole (3130) connected to the vacuum adsorption device is provided on the wafer loading clamping assembly (31). After controlling the second driving member (311) to drive the wafer loading sliding member (312) to move in the direction towards the center of the first wafer so that the wafer loading sliding positioning member (313) fixes the first wafer and applying a pre-tightening force to the first wafer through the wafer loading clamping spring (314), the following steps are further included: Controlling the vacuum adsorption device to establish a vacuum through the second vacuum adsorption hole (3130) and adsorb the first wafer.

3. The wafer transfer method applied to a semiconductor measuring device according to claim 1, characterized in that: The wafer transfer device further includes an unloading device (5). The unloading device (5) is installed on the workpiece table (2) and is distributed around the wafer adsorption surface and can move with the workpiece table (2). After the measurement step is completed, the following unloading step is further included: Controlling the wafer adsorption surface to descend so that the first wafer contacts the unloading device (5) and transferring the first wafer to the unloading device (5), driving the workpiece table (2) to move to the transfer position, and driving the manipulator (4) to move to the unloading position and adsorb the first wafer to take the first wafer away from the unloading device (5); After the unloading step is completed, the transfer step and the measurement step are repeated to perform the transfer and measurement of the second wafer.

4. The wafer transfer method applied to a semiconductor measurement device according to claim 3, wherein: The unloading device (5) includes a plurality of unloading positioning components (50) and at least one unloading clamping component (51). Both the unloading positioning components (50) and the unloading clamping component (51) have a wafer bearing surface. The wafer bearing surfaces of the plurality of unloading positioning components (50) are located on the same plane to form an unloading wafer bearing surface, and the unloading wafer bearing surface is parallel to the wafer adsorption surface of the workpiece table (2). The unloading clamping component (51) can move in the direction towards or away from the center of the wafer. The specific steps of transferring the first wafer to the unloading device (5) in the unloading step include: S401: Controlling the wafer adsorption surface to descend and place the first wafer on the unloading wafer bearing surface; S402: Driving the unloading clamping component (51) to move in the direction towards the center of the first wafer to provide a pre-tightening force to the first wafer placed on the unloading wafer bearing surface.

5. The wafer transfer method applied to a semiconductor measuring device according to claim 4, wherein: The lower wafer clamping assembly (51) includes a third driving component (511), a lower wafer sliding component (512), and a lower wafer sliding positioning component (513). The lower wafer sliding component (512) is located above the third driving component (511) and is connected to the output end of the third driving component (511). The lower wafer sliding positioning component (513) is located above the lower wafer sliding component (512) and is connected to the lower wafer sliding component (512) through a lower wafer clamping spring (514). The step S402 includes: Controlling the third driving component (511) to drive the lower wafer sliding component (512) to move in the direction towards the center of the first wafer, so that the lower wafer sliding positioning component (513) fixes the first wafer, and applying a pre-tightening force to the first wafer through the lower wafer clamping spring (514).

6. The wafer transfer method applied to a semiconductor measurement device according to claim 4, wherein The wafer transfer device further includes a vacuum adsorption device. A third vacuum adsorption hole (5010) connected to the vacuum adsorption device is provided on the lower wafer positioning assembly (50). The step S401 further includes: Controlling the vacuum adsorption device to establish a vacuum through the third vacuum adsorption hole (5010) and adsorb the first wafer; and / or A fourth vacuum adsorption hole (5130) connected to the vacuum adsorption device is provided on the lower wafer clamping assembly (51). The step S402 further includes: Controlling the vacuum adsorption device to establish a vacuum through the fourth vacuum adsorption hole (5130) and adsorb the first wafer.

7. A wafer transfer device applied to a semiconductor measuring device, which is used to implement the wafer transfer method applied to a semiconductor measuring device according to any one of claims 1-6. The semiconductor measuring device includes a frame (1) and a workpiece table (2). A measuring area (10) and a transfer area (11) are provided on the frame (1). The workpiece table (2) has a wafer adsorption surface that can be lifted and lowered. The workpiece table (2) can move within the measuring area (10) and the transfer area (11). It is characterized in that, The wafer transfer device includes: An upper wafer device (3), installed on the frame (1) at the transfer area (11). The upper wafer device (3) includes a plurality of upper wafer positioning components (30) and at least one upper wafer clamping component (31). Both the upper wafer positioning component (30) and the upper wafer clamping component (31) have a wafer bearing surface. The wafer bearing surface of the upper wafer positioning component (30) and the wafer bearing surface of the upper wafer clamping component (31) are in the same plane and parallel to the wafer adsorption surface of the worktable (2). And a pre-tightening component is provided on the wafer bearing surface of the upper wafer clamping component (31). Wherein, the wafer bearing surface of the upper wafer positioning component (30) can move in the direction towards the center of the wafer to receive the wafer from the robot (4), and the upper wafer clamping component (31) can move in the direction towards the center of the wafer so that the pre-tightening component provides a pre-tightening force to the wafer placed on the upper wafer positioning component (30). The worktable (2) can move to the transfer area (11) to adsorb the wafer located on the upper wafer device (3). After the worktable (2) completes the adsorption of the wafer, the upper wafer device (3) can move in the direction away from the center of the wafer to release the wafer. After the worktable (2) adsorbs the wafer, it can move to the measurement area (10) to measure the wafer. The upper wafer positioning component (30) includes a first driving component (301) and an upper wafer fixing and positioning component (302). The upper wafer fixing and positioning component (302) is located above the first driving component (301) and connected to the first driving component (301). Among them, the first driving component (301) is used to drive the upper wafer fixing and positioning component (302) to move in a direction towards or away from the center of the wafer. The upper wafer clamping component (31) includes a second driving component (311), an upper wafer sliding component (312) and an upper wafer sliding and positioning component (313). The upper wafer sliding component (312) is located above the second driving component (311) and connected to the second driving component (311). The upper wafer sliding and positioning component (313) is located above the upper wafer sliding component (312) and connected to the upper wafer sliding component (312) through an upper wafer clamping spring (314). Among them, the second driving component (311) is used to drive the upper wafer sliding component (312) to move in a direction towards or away from the center of the wafer, so that the upper wafer sliding and positioning component (313) moves to apply or remove a pre-tightening force to the wafer.

8. The wafer transfer device applied to a semiconductor measuring device according to claim 7, wherein: The upper wafer fixing and positioning component (302) includes a first bearing surface (3021), a first guiding and positioning surface (3022) and a first vacuum adsorption hole (3020). The first guiding and positioning surface (3022) is located above the first bearing surface (3021). The first vacuum adsorption hole (3020) is located in the first bearing surface (3021). The first guiding and positioning surface (3022) includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface; and / or The upper wafer sliding and positioning component (313) includes a second bearing surface (3131), a second guiding and positioning surface (3132) and a second vacuum adsorption hole (3130). The second guiding and positioning surface (3132) is located above the second bearing surface (3131). The second vacuum adsorption hole (3130) is located in the second bearing surface (3131). The second guiding and positioning surface (3132) includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface.

9. The wafer transfer device applied to a semiconductor measuring device according to claim 7, characterized in that: The wafer transfer device further includes a wafer unloading device (5). The wafer unloading device (5) is mounted on the worktable (2) and distributed around the wafer adsorption surface, and can move horizontally with the worktable (2). The wafer unloading device (5) includes a plurality of wafer unloading positioning components (50) and at least one wafer unloading clamping component (51). Both the wafer unloading positioning component (50) and the wafer unloading clamping component (51) have a wafer bearing surface. The wafer bearing surface of the wafer unloading positioning component (50) and the wafer bearing surface of the wafer unloading clamping component (51) are in the same plane and parallel to the wafer adsorption surface of the worktable (2). Wherein, the wafer bearing surface of the wafer unloading positioning component (50) is used to receive the wafer from the wafer adsorption surface of the worktable (2), and the wafer unloading clamping component (51) can move in the direction towards the center of the wafer after the wafer unloading positioning component (50) completes the reception of the wafer to provide a pre-tightening force to the wafer.

10. The wafer transfer device applied to a semiconductor measuring device according to claim 9, characterized in that: The wafer unloading positioning component (50) includes a wafer unloading fixed positioning part (501). The wafer unloading fixed positioning part (501) includes a third bearing surface (5011), a third guiding and positioning surface (5012) and a third vacuum adsorption hole (5010). The third guiding and positioning surface (5012) is located above the third bearing surface (5011), and the third vacuum adsorption hole (5010) is located in the third bearing surface (5011). The third guiding and positioning surface (5012) includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface; and / or The wafer unloading clamping component (51) includes a third driving part (511), a wafer unloading sliding part (512) and a wafer unloading sliding positioning part (513). The wafer unloading sliding part (512) is located above the third driving part (511) and is connected to the third driving part (511). The wafer unloading sliding positioning part (513) is located above the wafer unloading sliding part (512) and is connected to the wafer unloading sliding part (512) through a wafer unloading clamping spring (514). Wherein, the third driving part (511) is used to drive the wafer unloading sliding part (512) to move in the direction towards or away from the center of the wafer, so that the wafer unloading sliding positioning part (513) moves to apply a pre-tightening force to the wafer or remove the pre-tightening force.

11. The wafer transfer device applied to a semiconductor measuring device according to claim 10, characterized in that: The wafer unloading sliding positioning part (513) includes a fourth bearing surface (5131), a fourth guiding and positioning surface (5132) and a fourth vacuum adsorption hole (5130). The fourth guiding and positioning surface (5132) is located above the fourth bearing surface (5131), and the fourth vacuum adsorption hole (5130) is located in the fourth bearing surface (5131). The fourth guiding and positioning surface (5132) includes a circular positioning surface and an inclined guiding surface located above the circular positioning surface.

12. The wafer transfer device applied to a semiconductor measuring device according to any one of claims 7-11, characterized in that: The semiconductor measuring device includes a film thickness measuring system.

Images