Cooling systems and electronic equipment

Abstract

The present application provides a heat dissipation system and an electronic device. The heat dissipation system may include a power module and a condenser. The power module may include a base and a power device, the base having a first cavity, and the first cavity is filled with a refrigerant. The power device is arranged on the first surface of the base, and the power device is in thermal contact with the first surface, so the heat generated by the power device can be transferred from the first surface to the first cavity, and then conducted to the refrigerant, and the refrigerant can be vaporized into steam by the heat. In addition, the condenser is connected to the first cavity, so the vaporized refrigerant can enter the condenser; and the refrigerant condensed into a liquid by the condenser can flow back to the first cavity. The phase change heat of the refrigerant can take away a large amount of heat generated by the power device, and can reduce the thermal resistance from the power module to the air, which can improve the heat dissipation capacity of the power module, thereby facilitating the improvement of the product performance of the electronic device using the heat dissipation system.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and electronic equipment. Background Art

[0002] With the development of electronic technology, high-power semiconductor devices are increasingly widely used in the power electronics industry. As the computing power of high-power semiconductor devices continues to increase, their power consumption also increases significantly. Therefore, high-power semiconductor devices generate more and more heat, and the heat flux density is also increasing, which poses a higher challenge to the heat dissipation of high-power semiconductor devices.

[0003] At present, electronic devices are developing in the direction of miniaturization and integration, and the space left for heat dissipation components is not large. However, if there are no good heat dissipation measures for high-power semiconductor devices, the use environment of high-power semiconductor devices will be restricted, and the performance of the product will also be restricted. Therefore, the heat dissipation capacity of high-power semiconductor devices at high power density needs to be improved urgently. Summary of the invention

[0004] The present application provides a heat dissipation system and an electronic device to improve the heat dissipation capability of a power module, thereby improving the product performance of the electronic device to which the heat dissipation system is applied.

[0005] In a first aspect, the present application provides a heat dissipation system, which may include a power module and a condenser. The power module includes a base and a power device, the base has a first cavity, and the first cavity is filled with a refrigerant, the refrigerant can be vaporized into steam when heated, and the steam can be condensed into a liquid refrigerant when cooled. The power device can be arranged on the first surface of the base, and the power device is in thermal contact with the first surface. In addition, the condenser is connected to the first cavity, which can be used to condense the gaseous refrigerant into a liquid refrigerant.

[0006] By using the heat dissipation system provided in the present application, when the power module is working, heat can be conducted from the power device to the first surface of the base, and then to the liquid refrigerant in the first cavity of the base. The liquid refrigerant is vaporized by heat to form steam, which enters the condenser and condenses into liquid before flowing back to the first cavity. It can be understood that in the process of the above-mentioned refrigerant phase change, a large amount of heat generated by the power device can be taken away, thereby achieving heat dissipation of the power device. In addition, the use of the phase change heat of the refrigerant can effectively reduce the thermal resistance from the power module to the air, thereby effectively improving the heat dissipation capacity of the power module.

[0007] In a possible implementation of the present application, the refrigerant in the first cavity is condensed into liquid in the condenser and then flows back to the first cavity by gravity. In this way, without the need for a pump or other power device to drive, the refrigerant in the first cavity can be vaporized and enter the condenser, and the refrigerant condensed into liquid by the condenser can flow back to the first cavity under the action of gravity, thereby achieving efficient circulation of the refrigerant between the base and the condenser.

[0008] In the present application, the placement of the heat dissipation system is not limited, and it can be placed according to the specific application scenario. For example, the heat dissipation system can be placed along the direction of gravity. Among them, the direction of gravity can be defined by the top to bottom direction when the device to which the heat dissipation system is applied is placed in a normal use state in accordance with the customary manner in this field. For example, when the heat dissipation system is used in a photovoltaic inverter, the direction of gravity of the photovoltaic inverter can be understood as the top to bottom direction of the photovoltaic inverter when the photovoltaic inverter is in normal use. At this time, the heat dissipation system is placed along the top to bottom direction of the photovoltaic inverter.

[0009] In addition, when the heat dissipation system is placed along the direction of gravity, the condenser can be located above the base. Based on this, when the base is placed, in a possible implementation, the thickness direction of the base can be perpendicular to the direction of gravity.

[0010] Since the first surface of the base can be used to set the power device, in a possible implementation of the present application, the thickness direction of the thermal conductive substrate can also be perpendicular to the first surface, and then the first surface is parallel to the gravity direction.

[0011] In the present application, the base may be provided with a flow nozzle, which is connected to the first cavity. In addition, the flow nozzle may be provided on the second surface of the base, and the second surface is arranged opposite to the first surface, which is conducive to simplifying the structure of the base. In a possible implementation, the condenser may be connected to the first cavity through the flow nozzle, so that the connection between the condenser and the base is relatively simple.

[0012] Since the refrigerant circulates between the power module and the condenser and undergoes a transformation from liquid to gas and from gas to liquid, in order to distinguish the gas flow path from the liquid flow path, the base may be provided with at least two flow nozzles. In this way, at least one flow nozzle may be connected to the condenser through a first liquid flow pipe, and at least one flow nozzle may be connected to the condenser through a first gas flow pipe.

[0013] In a possible implementation of the present application, the heat dissipation system may further include an evaporator having a second cavity filled with a refrigerant. In addition, the condenser and the first cavity may be connected through the second cavity. Specifically, the second cavity and the first cavity may be connected through a flow nozzle, and the second cavity is connected to the condenser. In this way, the refrigerant in the second cavity can be replenished to the first cavity in a timely manner, so that the area of ​​the base for arranging the power device can always be in contact with the refrigerant, which is conducive to improving the heat exchange efficiency between the power device and the refrigerant, thereby improving the heat dissipation capacity of the power module.

[0014] When connecting the flow nozzle to the evaporator, the evaporator may be provided with a through hole, and the flow nozzle may be connected to the through hole in a one-to-one correspondence. In a possible implementation, the flow nozzle may be directly inserted into the through hole, and the flow nozzle may be fixed to the evaporator, and the fixing method may be but not limited to welding or bonding. This simplifies the connection method between the flow nozzle and the evaporator, and makes the structure of the heat dissipation system more compact.

[0015] In order to ensure the sealing between the flow nozzle and the through hole, a sealing ring can be further provided between the flow nozzle and the through hole. The sealing ring is sleeved on the flow nozzle, and the side wall of the through hole can squeeze the sealing ring so that the sealing ring fills the gap between the flow nozzle and the through hole.

[0016] In another possible implementation, the flow nozzle and the through hole can be connected through a pipe. In specific implementation, the base can be provided with at least two flow nozzles, at least one flow nozzle is connected to the corresponding through hole through a second liquid flow pipe, and at least one flow nozzle is connected to the corresponding through hole through a second gas flow pipe.

[0017] In the present application, the evaporator and the condenser can also be connected by a pipeline. For example, the evaporator and the condenser can be connected by at least one first liquid flow pipeline and at least one first gas flow pipeline to distinguish the gas flow path and the liquid flow path of the refrigerant circulating between the evaporator and the condenser.

[0018] In a possible implementation of the present application, the refrigerant in the second cavity is condensed into liquid in the condenser and then flows back to the second cavity by gravity. In this way, without the need for a pump or other power device to drive, the refrigerant in the second cavity can be vaporized and enter the condenser, and the refrigerant condensed into liquid by the condenser can flow back to the second cavity under the action of gravity, thereby achieving efficient circulation of the refrigerant between the evaporator and the condenser.

[0019] In the present application, the placement of the heat dissipation system is not limited, and it can be placed according to the specific application scenario. For example, the heat dissipation system can be placed along the direction of gravity. Among them, the direction of gravity can be defined by the top to bottom direction when the device to which the heat dissipation system is applied is placed in a normal use state in accordance with the customary manner in this field. For example, when the heat dissipation system is used in a photovoltaic inverter, the direction of gravity of the photovoltaic inverter can be understood as the top to bottom direction of the photovoltaic inverter when the photovoltaic inverter is in normal use. At this time, the heat dissipation system is placed along the top to bottom direction of the photovoltaic inverter.

[0020] In addition, when the heat dissipation system is placed along the direction of gravity, the condenser can be located above the evaporator. Based on this, when the base is placed, in a possible implementation, the thickness direction of the base can be perpendicular to the direction of gravity.

[0021] Since the first surface of the base can be used to set the power device, in a possible implementation of the present application, the thickness direction of the thermal conductive substrate can also be perpendicular to the first surface, and then the first surface is parallel to the gravity direction.

[0022] In a possible implementation of the present application, the first cavity of each power module can be connected to the respective second cavities of at least two evaporators, and at least one evaporator is connected to the condenser through a first liquid circulation pipeline, and at least one evaporator is connected to the condenser through a first gas circulation pipeline. In this way, the refrigerant can circulate between the power module, at least one evaporator connected to the condenser through the first liquid circulation pipeline, at least one evaporator connected to the condenser through the first gas circulation pipeline, and the condenser. Specifically, after the liquid refrigerant in the first cavity evaporates into a gaseous state, it can enter the condenser after passing through the second cavity of at least one evaporator connected to the condenser through the first gas circulation pipeline; and the refrigerant condensed into a liquid state by the condenser can flow back to the second cavity of at least one evaporator connected to the condenser through the first liquid circulation pipeline, and the refrigerant in each second cavity can realize the replenishment of the refrigerant in the first cavity. Therefore, by connecting each power module to at least two evaporators, the refrigerant in the first cavity can be replenished in time, which can be beneficial to improve the heat dissipation efficiency of the power module.

[0023] In addition, among the at least two evaporators connected to the first cavity of each power module, at least one evaporator can be connected to the condenser through at least one liquid circulation pipeline and at least one gas circulation pipeline. In this way, the refrigerant can circulate between the power module, at least one evaporator connected to the condenser through at least one liquid circulation pipeline and at least one gas circulation pipeline, and the condenser. It can also be understood that at least one of the circulation paths of the refrigerant is composed of a power module, an evaporator and a condenser. With respect to this circulation path, after the liquid refrigerant in the first cavity evaporates into a gaseous state, it can enter the condenser after passing through the second cavity of the evaporator; and the refrigerant condensed into a liquid state by the condenser can flow back to the second cavity of the evaporator, and the refrigerant in the second cavity can supplement the refrigerant in the first cavity.

[0024] When each power module is specifically connected to at least two evaporators, each power module may be provided with at least two flow nozzles, so that each flow nozzle may be connected to at least one evaporator. Exemplarily, one flow nozzle may be connected to two evaporators; or, when the number of evaporators and flow nozzles is the same, the flow nozzles may be connected to the evaporators one by one. In addition, when each flow nozzle is connected to at least one evaporator, two flow nozzles may be connected to one evaporator. For example, when the evaporator is connected to the condenser through at least one first liquid flow pipe and at least one first gas flow pipe, two flow nozzles may be connected to the evaporator to form a refrigerant circulation path between the power module, an evaporator and a condenser. They should all be understood to fall within the scope of protection of the present application.

[0025] In the present application, each evaporator can also be connected to at least two power modules, which is conducive to the integrated design of the heat dissipation system.

[0026] In order to improve the heat dissipation efficiency of the power module, in a possible implementation of the present application, the base may also be provided with a heat dissipation enhancement structure. In a specific implementation, the base also has a first inner side surface, which is arranged opposite to the first surface, and at least a portion of the first inner side surface is immersed in the refrigerant. When the heat generated by the power device is conducted from the first surface of the heat-conducting substrate to the first inner side surface, it can be directly transferred to the refrigerant to achieve efficient heat exchange between the heat-conducting substrate and the refrigerant.

[0027] In addition, the first inner side surface may be provided with a heat dissipation enhancement structure, which is provided in the heat dissipation enhancement region of the first inner side surface, and the heat dissipation enhancement structure may be used to increase the area of ​​the first inner side surface immersed in the refrigerant. In this way, in the direction from the first surface to the first inner side surface, at least a portion of the projection of the power device on the first inner side surface may be located in the heat dissipation enhancement region, so that the heat generated by the power device can be efficiently exchanged with the refrigerant, which is beneficial to improving the heat dissipation performance of the power module.

[0028] In the present application, the specific setting form of the heat dissipation enhancement structure is not limited. It can be exemplarily a groove or protrusion located on the second surface, or a fin or capillary structure, so as to achieve the purpose of increasing the area of ​​the heat-conducting substrate immersed in the refrigerant.

[0029] In the second aspect, the present application further provides a power device, which may include a chassis and the heat dissipation system of the first aspect, wherein the evaporator may be located inside or outside the chassis, and the condenser may be located outside the chassis. In the present application, the specific type of the power device is not limited, and it may be, but is not limited to, photovoltaic power generation equipment such as photovoltaic inverters. The electronic device has a strong heat dissipation capacity, thereby improving the product performance of the electronic device and enhancing the product competitiveness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of a power module provided in an embodiment of the present application;

[0031] Figure 2a to Figure 2g Structural schematic diagrams of several first inner side surfaces provided in embodiments of the present application;

[0032] Figure 3 for Figure 1 A three-dimensional diagram of the power module shown in FIG.

[0033] Figure 4 for Figure 3 A cross-sectional view of a power module shown in FIG.

[0034] Figure 5 A schematic diagram of the structure of a heat dissipation system provided in an embodiment of the present application;

[0035] Figure 6 A schematic diagram of the structure of another heat dissipation system provided in an embodiment of the present application;

[0036] Figure 7 for Figure 6 A cross-sectional view of the connection position of the power module and the evaporator shown in FIG.

[0037] Figures 8a to 8c for Figure 6 Schematic diagram of heat dissipation principle of the heat dissipation system shown in;

[0038] Fig. 9 A schematic diagram of the structure of another heat dissipation system provided in an embodiment of the present application;

[0039] Fig.10 A schematic diagram of the structure of another heat dissipation system provided in an embodiment of the present application;

[0040] Fig.11 A schematic diagram of the structure of another heat dissipation system provided in an embodiment of the present application;

[0041] Fig.12 A schematic diagram of the structure of a power device provided in an embodiment of the present application.

[0042] Reference numerals:

[0043] 1-power module; 101-power device; 102-base; 1021-first surface; 1022-first cavity;

[0044] 1023-first inner side surface; 10231-heat dissipation enhancement area; 1024-fins; 1025-capillary structure; 1026-flow nozzle;

[0045] 1027-second surface; 2-condenser; 3-first liquid flow pipe; 4-first gas flow pipe; 5-evaporator;

[0046] 501 - second cavity; 502 - through hole; 6 - second liquid circulation pipeline; 7 - second gas circulation pipeline; 8 - chassis. DETAILED DESCRIPTION

[0047] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be used as limitations on the present application. As used in the specification and the appended claims of the present application, the singular expressions "one", "a kind of", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear indication to the contrary in the context. References to "one embodiment" or "specific embodiment" etc. described in this specification mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0048] In order to facilitate understanding of the heat dissipation system and electronic device provided in the embodiments of the present application, the following first introduces its application scenarios. The heat dissipation system provided in the present application can be, but is not limited to, applied to electronic devices such as photovoltaic inverters. With the development of electronic technology, the heat dissipation demand for high-power semiconductor devices in electronic devices is becoming more and more obvious. For example, in a photovoltaic inverter, the heat flux density of the insulated gate bipolar transistor (IGBT) is getting higher and higher, and good heat dissipation measures will be beneficial to improving its maximum current output capacity, thereby improving the performance of the photovoltaic inverter and improving the competitiveness of the product.

[0049] In order to improve the power density of high-power semiconductor devices, there is currently extensive research on the enhancement of heat dissipation of high-power semiconductor devices. From the perspective of heat dissipation methods, there are mainly air cooling, natural cooling and liquid cooling, which are selected according to the actual application scenario. For example, photovoltaic inverters are mainly used in outdoor scenarios, and air cooling is its main form of heat dissipation. For air-cooled heat dissipation, high-power semiconductor devices are generally attached to the surface of the air-cooled radiator through thermal grease for heat dissipation. At present, the research on heat dissipation enhancement of air-cooled heat dissipation is mainly to add heat pipe radiators or vacuum chamber heat sink technology (vapor chamber, VC) radiators on the basis of ordinary aluminum air-cooled radiators, but further evolution has also encountered bottlenecks. In addition, from the distribution of thermal resistance of the heat dissipation link, the thermal resistance of the thermal grease layer accounts for 20%, and there is currently no good alternative solution to reduce thermal resistance.

[0050] Based on this, the present application provides a heat dissipation system and electronic equipment, which can remove the silicone grease layer of the thermal resistance chain by directly contacting the heat dissipation surface of the power module with the refrigerant, and at the same time use efficient phase change heat to reduce the thermal resistance from the module to the air, thereby improving the heat dissipation capacity of the power module, which is conducive to improving the product performance of the electronic equipment using the heat dissipation system and improving the product competitiveness. In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0051] In this application, the heat dissipation system may include a power module, referring to Figure 1 , Figure 1A schematic diagram of the structure of a power module 1 provided in an embodiment of the present application. The power module 1 includes a power device 101 and a base 102. The power device 101 may be, but is not limited to, a chip or a database controller (DBC), etc. The power device 101 may be disposed on a first surface 1021 of the base 102, and the power device 101 is in thermal contact with the first surface 1021 of the base 102. In addition, the number of power devices 101 disposed on each base 102 may be one or more, which may be disposed according to the specific application scenario of the power module 1.

[0052] In the present application, the material of the base 102 is not limited, and it can be exemplarily a metal with good thermal conductivity such as copper or aluminum. In some possible embodiments, the material of the base 102 may also be a non-metal with good thermal conductivity. When the base 102 is specifically set, the base 102 has a first cavity ( Figure 1 (not shown), the first cavity is filled with a refrigerant, which is a vapor-liquid two-phase refrigerant, that is, when the temperature is less than or equal to the first temperature threshold, the refrigerant is in a liquid state; and when the temperature is higher than the first temperature threshold, the refrigerant boils and changes into vapor. The specific type of refrigerant is not limited in the present application, and an exemplary one may be tetrafluoroethane (1,1,1,2-tetrafluoroethane) and the like. It is understandable that the first temperature threshold is affected by the type of refrigerant, and it may be, for example, 20°C or 25°C.

[0053] It can be understood that in the present application, the projection of the power device 101 on the base 102 can be made to fall completely within the contour range of the first surface 1021, thereby effectively increasing the contact area between the power device 101 and the first surface 1021, which is beneficial to improving the heat exchange efficiency between the power device 101 and the refrigerant in the base 102, thereby improving the heat dissipation performance of the power module 1.

[0054] In addition, in order to improve the efficiency of heat transfer from the power device 101 to the refrigerant, a heat dissipation enhancement structure may be provided on the base 102. The heat dissipation enhancement structure may be provided on the first inner side surface 1023 of the base 102. The first inner side surface 1023 is provided opposite to the first surface 1021, and at least a portion of the first inner side surface 1023 is immersed in the refrigerant. Figure 2a , Figure 2aThe schematic diagram of the structure of the first inner side surface 1023 of the base 102 provided in an embodiment of the present application. The heat dissipation enhancement structure may be a fin 1024 formed on the first inner side surface 1023, and the fin 1024 may play a role in increasing the area of ​​the first inner side surface 1023 immersed in the refrigerant. In the present application, the fin 1024 may be a protruding structure formed on the first inner side surface 1023, which may be an integrally formed structure with the first inner side surface 1023; or, the fin 1024 may be an independently formed structure, and may be fixed to the first inner side surface 1023 by welding or other possible means. Among them, the fin 1024 may be arranged in the heat dissipation enhancement area 10231 of the first inner side surface 1023. In addition, in the direction from the first surface to the first inner side surface 1023, at least a portion of the projection of the power device 101 on the first inner side surface 1023 is located in the heat dissipation enhancement area 10231. Since the first inner side surface 1023 is in direct contact with the refrigerant in the first cavity 1022, by setting the fin 1024 on the first inner side surface 1023, the area of ​​the first inner side surface 1023 immersed in the refrigerant can be effectively increased, so that the heat generated by the power device 101 can be efficiently exchanged with the refrigerant, which is beneficial to improving the heat dissipation performance of the power module 1.

[0055] In the present application, the fins 1024 may be multiple and arranged in parallel. Figure 2a In the embodiment shown, the plurality of fins 1024 are arranged obliquely. Figure 2a In addition to the configuration shown in the example, other possible configurations can be used. For example, Figure 2b to Figure 2d , Figure 2b to Figure 2d Several possible configurations of the fins 1024 are shown, for example, Figure 2b and Figure 2c In the embodiment, the fins 1024 may be multiple and arranged in parallel, and the multiple fins 1024 are arranged parallel to one side of the first inner side surface; Figure 2d In the illustrated embodiment, the fins 1024 are arranged in a plurality of rows in parallel, each row includes a plurality of fins 1024, and the plurality of rows of fins 1024 are arranged obliquely.

[0056] In addition, in this application, the heat dissipation enhancement structure can be set as Figure 2a to Figure 2d In addition to the fins 1024 shown, other possible structures can also be provided. Figure 2e to Figure 2g , Figure 2e to Figure 2g The schematic diagrams of the structures of several other first inner side surfaces 1023 provided in the embodiments of the present application are as follows: Figure 2g A three-dimensional structural diagram of the first inner side surface 1023 is shown. Figure 2e to Figure 2gIn the embodiment, the heat dissipation enhancement structure may be a capillary structure 1025, wherein the capillary structure 1025 may be, but is not limited to, a metal mesh structure or a metal powder sintered structure, etc., which has an adsorption effect on the liquid. The capillary structure 1025 may also be disposed in the heat dissipation enhancement area 10231 of the first inner side surface 1023, thereby effectively increasing the area of ​​the first inner side surface 1023 immersed in the refrigerant.

[0057] It is worth mentioning that the shape of the first inner side surface 1023 is not specifically limited in the present application, and can be Figure 2a to Figure 2f The class rectangle shown in Figure 2g In some other possible embodiments of the present application, the heat dissipation enhancement structure may also be a groove or a protrusion located on the first inner side surface 1023, as long as it can increase the area of ​​the first inner side surface 1023 immersed in the refrigerant.

[0058] Reference Figure 3 , Figure 3 for Figure 1 The base 102 may also be provided with a flow nozzle 1026, and the flow nozzle 1026 is provided on the second surface 1027 of the base 102. In addition, the flow nozzle 1026 may protrude from the second surface 1027. In a possible embodiment of the present application, the base 102 may be an integrally formed structure, thereby simplifying the structure of the base 102 and making the base 102 have better sealing performance. In some other possible embodiments of the present application, the flow nozzle 1026 of the base 102 may also be an independently formed structure, and may be connected to the second surface 1027 of the base 102 by welding or bonding, so that the setting of the flow nozzle 1026 is more flexible.

[0059] In the present application, the positional relationship between the first surface 1021 and the second surface 1027 is not limited. Figure 3 In the illustrated embodiment, the first surface 1021 and the second surface 1027 may be disposed opposite to each other. In some other possible embodiments of the present application, the first surface 1021 and the second surface 1027 may also be two adjacent surfaces.

[0060] Reference Figure 4 , Figure 4 for Figure 3 The cross-sectional view of the power module 1 is shown in FIG. Figure 4 It can be seen that the flow nozzle 1026 is connected to the first cavity 1022, and the flow nozzle 1026 can be used as a channel for the refrigerant to enter and exit the first cavity 1022. In the present application, the number of the flow nozzles 1026 is not specifically limited. Figure 3 and Figure 4In the illustrated embodiment, the base 102 may be provided with two flow nozzles 1026, one of which may be used for the refrigerant to enter the first cavity 1022, and the other may be used for the refrigerant to flow out of the first cavity 1022. In another possible embodiment of the present application, the base 102 may also be provided with only one flow nozzle 1026, which may be used for the refrigerant to enter the first cavity 1022 and may also be used for the refrigerant to flow out of the first cavity 1022. In some other possible embodiments of the present application, the base 102 may also be provided with more than two flow nozzles 1026, for example, three, four or five, etc., at least one of the more than two flow nozzles 1026 may be used for the refrigerant to enter the first cavity 1022, and the other flow nozzles 1026 may be used for the refrigerant to flow out of the first cavity 1022.

[0061] Reference Figure 5 , Figure 5 A schematic diagram of the structure of a heat dissipation system provided for an embodiment of the present application. In addition to the above-mentioned power module 1, the heat dissipation system may also include a condenser 2, and the first cavity 1022 of the base 102 is connected to the condenser 2. In a specific implementation, the flow nozzle 1026 of the base 102 may be connected to the condenser 2. Since the flow nozzle 1026 may protrude from the second surface 1027, the connection between the flow nozzle 1026 and the condenser 2 may be facilitated. In addition, the flow nozzle 1026 and the condenser 2 may be connected by a pipe, but not limited to, and the pipe may be a hose, so that the connection between the flow nozzle 1026 and the condenser 2 is more convenient. In some possible application scenarios, for example, when the space for setting up the heat dissipation system is large, the flow nozzle 1026 and the condenser 2 may also be connected by a rigid pipe.

[0062] By adopting the heat dissipation system provided in the present application, when the power module 1 is working, heat can be conducted from the power device 101 to the first surface 1021 of the base 102, and then to the liquid refrigerant in the first cavity 1022 of the base 102. The liquid refrigerant is vaporized by heat to form steam, which enters the condenser 2 through the flow nozzle 1026 and condenses into liquid and then flows back to the first cavity 1022. It can be understood that in the process of the above-mentioned refrigerant phase change, a large amount of heat generated by the power device 101 can be taken away, thereby achieving heat dissipation of the power device 101. In addition, the use of the phase change heat of the refrigerant can effectively reduce the thermal resistance from the power module 1 to the air, thereby effectively improving the heat dissipation capacity of the power module 1.

[0063] Since the refrigerant circulates between the power module 1 and the condenser 2 and undergoes a transformation from liquid to gas and from gas to liquid, in order to distinguish the gas flow path from the liquid flow path, the base 102 may be provided with at least two flow nozzles 1026, so that at least one flow nozzle 1026 may be connected to the condenser 2 through a liquid flow pipe, and at least one flow nozzle 1026 may be connected to the condenser 2 through a gas flow pipe. Figure 5 In the figure, the first liquid circulation pipeline 3 for connecting the flow nozzle 1026 and the condenser 2 is indicated by a dotted line, and the first gas circulation pipeline 4 for connecting the flow nozzle 1026 and the condenser 2 is indicated by a solid line. In this way, the refrigerant in the form of steam can enter the condenser 2 through at least one flow nozzle 1026, and the liquid refrigerant condensed by the condenser 2 can flow back to the first cavity 1022 through at least one flow nozzle 1026, thereby realizing efficient circulation of the refrigerant between the power module 1 and the condenser 2. In some possible embodiments of the present application, only one flow nozzle 1026 can be provided on the base 102, so that the base 102 and the condenser 2 are connected through the one flow nozzle 1026, thereby simplifying the structure of the power module 1.

[0064] In the present application, the refrigerant condensed into liquid by the condenser 2 can be allowed to flow back to the first cavity 1022. Based on this, when arranging the condenser 2 and the base 102, the condenser 2 and the base 102 of the power module 1 can be arranged along the direction of gravity. For example, in the direction of gravity, the condenser 2 can be arranged above the base 102. Among them, the arrangement of the condenser 2 and the base 102 along the direction of gravity can be arranged along a straight line, or the two can be staggered along the direction of gravity. In this way, without the need for a pump or other power equipment to drive, the refrigerant in the first cavity 1022 can be vaporized and enter the condenser 2, and the refrigerant condensed into liquid by the condenser 2 can flow back to the first cavity 1022 under the action of gravity, thereby realizing efficient circulation of the refrigerant between the base 102 and the condenser 2.

[0065] In each embodiment of the present application, when the heat dissipation system is placed along the direction of gravity, the direction of gravity can be defined by the direction from top to bottom when the device to which the heat dissipation system is applied is placed in a normal use state in accordance with the customary manner in the field. For example, when the heat dissipation system is used in a photovoltaic inverter, the direction of gravity can be understood as the direction from top to bottom of the photovoltaic inverter when the photovoltaic inverter is in normal use. In this case, the heat dissipation system is placed along the direction from top to bottom of the photovoltaic inverter.

[0066] In the present application, when the heat dissipation system is placed along the gravity direction, the thickness direction of the base 102 can be perpendicular to the gravity direction. In addition, the thickness direction of the base 102 can also be perpendicular to the first surface 1021, and the first surface 1021 is parallel to the gravity direction.

[0067] In addition, the base 102 and the condenser 2 can be arranged in any direction respectively, and can be adjusted according to the specific application scenario. There is no specific limitation in the present application, as long as the liquid refrigerant condensed by the condenser 2 can flow back to the first cavity 1022.

[0068] Reference Figure 6 , Figure 6 This is a schematic diagram of another heat dissipation system provided in an embodiment of the present application. In addition to the power module 1 and the condenser 2 described above, the heat dissipation system may also include an evaporator 5, wherein the evaporator 5 has a second cavity 501 filled with a refrigerant.

[0069] exist Figure 6 In the embodiment shown, the base 102 can be connected to the condenser 2 through the evaporator 5. Figure 7 , Figure 7 for Figure 6 , a cross-sectional view of the connection position of the power module 1 and the evaporator 5 is shown in FIG. . The evaporator 5 may be provided with a through hole 502, and the flow nozzle 1026 may be connected to the through hole 502 in a one-to-one correspondence, so that the first cavity 1022 of the base 102 is connected to the second cavity 501 of the evaporator 5. It is understandable that the refrigerant in the first cavity 1022 and the refrigerant in the second cavity 501 may be the same, so that the refrigerant in the second cavity 501 can be replenished to the first cavity 1022 in time, so that the area of ​​the base 102 for arranging the power device 101 can always be in contact with the refrigerant. In some possible embodiments, the refrigerants in the first cavity 1022 and the second cavity 501 may also be different, as long as the heat dissipation of the power module 1 can be achieved through the circulation of the refrigerant between the first cavity 1022, the second cavity 501 and the condenser 2.

[0070] In a possible embodiment of the present application, the volume of the second cavity 501 can be made larger than the volume of the first cavity 1022, so that the capacity of the refrigerant in the second cavity 501 can be made larger than the capacity of the refrigerant in the first cavity 1022, so that the refrigerant in the first cavity 1022 is always in a fully filled state, which is beneficial to improving the heat exchange efficiency between the power device 101 and the refrigerant, so as to achieve the purpose of improving the heat dissipation capacity of the power module 1.

[0071] In the present application, the connection method between the flow nozzle 1026 and the evaporator 5 is not specifically limited. For example, Figure 7In the illustrated embodiment, the flow nozzle 1026 can be directly inserted into the through hole 502. In addition, the flow nozzle 1026 can be fixed to the evaporator 5 by, but not limited to, welding or bonding. In order to ensure the seal between the flow nozzle 1026 and the through hole 502, a sealing ring can be provided between the two, and the material of the sealing ring can be, but not limited to, rubber. When the sealing ring is specifically provided, the sealing ring can be sleeved on the flow nozzle 1026, so that when the flow nozzle 1026 is inserted into the through hole 502, the sealing ring is squeezed by the side wall of the through hole 502, so that the sealing ring fills the gap between the two to achieve a sealing effect.

[0072] Reference Figure 8a , Figure 8a for Figure 6 Schematic diagram of heat dissipation principle of the heat dissipation system shown in . In the present application, the second cavity 501 of the evaporator 5 can be connected to the condenser 2. In specific implementation, the evaporator 5 and the condenser 2 can be connected through a pipeline, for example, through at least one first gas flow pipeline 4 and at least one first liquid flow pipeline 3, so that the gas flow path can be distinguished from the liquid flow path.

[0073] exist Figure 8a The solid line with an arrow indicates the flow direction of the gaseous refrigerant, and the dotted line with an arrow indicates the flow direction of the liquid refrigerant. Figure 8a In the heat dissipation system shown, when the power module 1 is working, heat can be conducted from the power device 101 to the first surface 1021 of the base 102, and then to the liquid refrigerant in the first cavity 1022 of the base 102. The liquid refrigerant is heated and boils to form steam, which enters the second cavity 501 of the evaporator 5 through the flow nozzle 1026 and enters the condenser 2 through the first gas circulation pipe 4. After the steam is condensed into liquid in the condenser 2, it can flow back to the second cavity 501 through the first liquid circulation pipe 3. It can be understood that after the refrigerant in the first cavity 1022 forms steam, the refrigerant in the second cavity 501 can be replenished to the first cavity 1022 in time, so as to realize the efficient circulation of the refrigerant between the power module 1, the evaporator 5 and the condenser 2, so as to realize the heat dissipation of the power module 1 by utilizing the phase change heat of the refrigerant, which is conducive to improving the heat dissipation capacity of the power module 1.

[0074] In the present application, in order to allow the refrigerant in the second cavity 501 to be replenished to the first cavity 1022 in a timely manner, the liquid level of the refrigerant in the second cavity 501 can be above the liquid level of the refrigerant in the first cavity 1022 in the direction of gravity. In addition, in order to allow the refrigerant condensed into liquid by the condenser 2 to flow back to the second cavity 501, the condenser 2 and the evaporator 5 can be arranged along the direction of gravity. For example, the condenser 2 can be located above the evaporator 5 in the direction of gravity. The arrangement of the condenser 2 and the evaporator 5 along the direction of gravity can be arranged in a straight line, or the two can be staggered in the direction of gravity. In addition, the evaporator 5 and the condenser 2 can be arranged in any direction, which can be adjusted according to the specific application scenario. There is no specific limitation in the present application, as long as the liquid refrigerant condensed by the condenser 2 can flow back to the second cavity 501. For example, in Figure 8a In the embodiment shown, the condenser 2 and the evaporator 5 are arranged along a straight line in the direction of gravity, and the power module 1 is located on the surface of the evaporator 5 parallel to the direction of gravity; Figure 8b In the embodiment shown, the condenser 2 and the evaporator 5 are arranged along a straight line in the gravity direction, and the power module 1 is arranged on a side surface of the evaporator 5 away from the condenser 2; Figure 8c In the illustrated embodiment, the condenser 2 and the evaporator 5 are arranged alternately in the gravity direction, and both the condenser 2 and the evaporator 5 are arranged at an angle, and the power module 1 is arranged on an inclined surface of the evaporator 5 .

[0075] In addition, in the present application, each evaporator 5 may be provided with a plurality of power modules 1, for example Figure 6 In the heat dissipation system shown, six power modules 1 are arranged on one evaporator 5, and the one evaporator 5 is connected to one condenser 2, which is beneficial to the integrated design of the heat dissipation system.

[0076] Reference Fig. 9 , Fig. 9 A schematic diagram of another heat dissipation system provided in an embodiment of the present application. Figure 8a The difference between the cooling system shown in Fig. 9 In the embodiment, the flow nozzle 1026 of the power module 1 can be connected to the through hole 502 of the evaporator 5 through a pipeline, wherein the pipeline can be a hose, so that the setting of the power module 1 and the evaporator 5 is more flexible. In some possible embodiments, the flow nozzle 1026 and the evaporator 5 can also be connected through a rigid pipeline to improve the reliability of the connection between the power module 1 and the evaporator 5.

[0077] exist Fig. 9In the heat dissipation system shown, the base 102 may be provided with at least two flow nozzles 1026, so that at least one flow nozzle 1026 may be connected to the evaporator 5 through a liquid flow pipe, and at least one flow nozzle 1026 may be connected to the evaporator 5 through a gas flow pipe. Fig. 9 In the figure, the second liquid circulation pipeline 6 for connecting the flow nozzle 1026 and the evaporator 5 can be represented by a dotted line, and the second gas circulation pipeline 7 for connecting the flow nozzle 1026 and the evaporator 5 can be represented by a solid line. In this way, the refrigerant forming vapor can enter the second cavity 501 of the evaporator 5 through the second gas circulation pipeline 7 through at least one flow nozzle 1026, and enter the condenser 2 from the second cavity 501 through the first gas circulation pipeline 4; and the liquid refrigerant condensed by the condenser 2 can flow back to the second cavity 501 through the first liquid circulation pipeline 3, and the refrigerant in the second cavity 501 can be replenished to the first cavity 1022 through at least one flow nozzle 1026 through the second liquid circulation pipeline 6, thereby realizing efficient circulation of the refrigerant between the power module 1 and the condenser 2. In addition, Fig. 9 Other structures of the heat dissipation system shown in can refer to Figure 8a For example, each evaporator 5 may be connected to at least two power modules 1, which will not be described in detail here.

[0078] Reference Fig.10 , Fig.10 A schematic diagram of another heat dissipation system provided in an embodiment of the present application. Fig. 9 The difference between the cooling system shown in Fig.10 In the embodiment, the first cavity 1022 of each power module 1 can be communicated with the respective second cavities 501 of at least two evaporators 5, and each second cavity 501 is filled with refrigerant. In addition, among the at least two evaporators 5 connected to the first cavity 1022, at least one evaporator 5 is connected to the condenser 2 through the first liquid circulation pipe 3, and at least one evaporator 5 is connected to the condenser 2 through the first gas circulation pipe 4. In this way, the refrigerant can circulate among the power module 1, at least one evaporator 5 connected to the condenser 2 through the first liquid circulation pipe 3, at least one evaporator 5 connected to the condenser 2 through the first gas circulation pipe 4, and the condenser 2. Specifically, after the liquid refrigerant in the first cavity 1022 evaporates into a gaseous state, it can enter the condenser 2 after passing through the second cavity 501 of at least one evaporator 5 connected to the condenser 2 through the first gas circulation pipe 4; and the refrigerant condensed into a liquid state by the condenser 2 can flow back to the second cavity 501 of at least one evaporator 5 connected to the condenser 2 through the first liquid circulation pipe 3, and the refrigerant in each second cavity 501 can supplement the refrigerant in the first cavity 1022.

[0079] Each power module 1 may be provided with at least two flow nozzles 1026, so that each flow nozzle 1026 may be connected to at least one evaporator 5. Fig.10 In the heat dissipation system shown, when the number of the flow nozzles 1026 is the same as that of the evaporators 5, the flow nozzles 1026 can be connected to the evaporators 5 in a one-to-one correspondence. In this embodiment, by connecting each power module 1 to at least two evaporators 5, the refrigerant in the first cavity 1022 of the base 102 of the power module 1 can be replenished in time, which is beneficial to improving the heat dissipation efficiency of the power module 1.

[0080] You can continue to refer to Fig.10 In the present application, the arrangement of at least two evaporators 5 connected to each power module 1 is not limited. For example, they can be arranged in sequence along the direction of gravity, or can be specifically arranged according to the application scenario of the heat dissipation system. In addition, Fig.10 Other structures of the heat dissipation system shown in can refer to Fig. 9 For example, each evaporator 5 may be connected to at least two power modules 1, which will not be described in detail here.

[0081] In addition, when the first cavity 1022 of each power module 1 is connected to the respective second cavities 501 of at least two evaporators 5, and each power module 1 is provided with at least two flow nozzles 1026, one flow nozzle 1026 can also be connected to two or more evaporators 5. For example, refer to Fig.11 , Fig.11 A schematic diagram of another heat dissipation system provided in an embodiment of the present application. Fig.11 In the figure, the connection mode of connecting one through-flow nozzle 1026 with two evaporators 5 is shown. At this time, the one through-flow nozzle 1026 can be connected with the two evaporators 5 through the second gas pipeline 7, and the two evaporators 5 are respectively connected with the condenser 2 through a first gas pipeline 4. Alternatively, the one through-flow nozzle 1026 can be connected with the two evaporators 5 through the second liquid pipeline 6, and the two evaporators 5 are respectively connected with the condenser 2 through a first liquid pipeline 3. Alternatively, the one through-flow nozzle 1026 is connected with one of the two evaporators 5 through the second liquid pipeline 6, and the one evaporator 5 can be connected with the condenser 2 through a first liquid pipeline 3; in addition, the one through-flow nozzle 1026 is connected with the other of the two evaporators 5 through the second gas pipeline 7, and the other evaporator 5 is connected with the condenser 2 through a first gas pipeline 4.

[0082] In addition, you can continue to refer to Fig.11 ,exist Fig.11In the heat dissipation system shown, two flow nozzles 1026 can also be connected to one evaporator 5. One of the two flow nozzles 1026 is connected to the condenser 2 through the second liquid flow pipe 6, and the other is connected to the condenser 2 through the second gas flow pipe 7. In addition, the one evaporator 5 can be connected to the condenser 2 through at least one first liquid flow pipe 3 and at least one first gas flow pipe 4.

[0083] From the above, it can be seen that Fig.11 The heat dissipation system shown at least includes a refrigerant circulation path formed by a power module 1, at least one evaporator 5 connected to the condenser 2 through a first liquid circulation pipe 3, at least one evaporator 5 connected to the condenser 2 through a first gas circulation pipe 4, and the condenser 2; and a refrigerant circulation path formed by a power module 1, at least one evaporator 5 connected to the condenser 2 through at least one liquid circulation pipe 3 and at least one gas circulation pipe 4, and the condenser 2. Based on this, by adjusting the connection method between the power module 1, the evaporator 5 and the condenser 2, the heat dissipation system can also include other possible refrigerant circulation paths, which will not be repeated here, but they should all be understood to fall within the scope of protection of this application.

[0084] The heat dissipation system provided in this application can be applied to various possible power devices. This application does not limit the specific type of power devices. For example, it can be photovoltaic power generation equipment such as photovoltaic inverters. Fig.12 , Fig.12 A schematic diagram of a possible power device provided in an embodiment of the present application. In addition to the heat dissipation system, the power device may also include a chassis 8. The evaporator 5 may be located inside or outside the chassis 8, and the condenser 2 is located outside the chassis 8. The electronic device has a strong heat dissipation capacity, thereby improving the product performance of the electronic device and enhancing the product competitiveness of the electronic device.

[0085] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation system, characterized in that: It includes power module and condenser, including: The power module comprises a base and a power device, wherein the base has a first cavity filled with a refrigerant; the power device is arranged on a first surface of the base; The condenser is connected to the first cavity, and the heat generated by the power device is transferred to the first cavity through the first surface. The refrigerant in the first cavity is heated and vaporized and then enters the condenser, and is condensed into liquid by the condenser and then flows back to the first cavity.

2. The heat dissipation system according to claim 1, characterized in that: The refrigerant in the first cavity is condensed into liquid in the condenser and then flows back to the first cavity by gravity.

3. The heat dissipation system according to claim 1 or 2, characterized in that: When the heat dissipation system is placed along the direction of gravity, the condenser is located above the base.

4. The heat dissipation system according to claim 1 or 2, characterized in that: The base is provided with a flow nozzle, and the flow nozzle is communicated with the first cavity; the condenser is communicated with the first cavity through the flow nozzle.

5. The heat dissipation system according to claim 4, characterized in that: The base is provided with at least two flow nozzles, at least one of which is connected to the condenser via a first liquid flow pipe, and at least one of which is connected to the condenser via a first gas flow pipe.

6. The heat dissipation system according to claim 4, characterized in that: The heat dissipation system further comprises an evaporator, wherein the evaporator has a second cavity filled with a refrigerant; the second cavity is communicated with the first cavity through the flow nozzle, and the second cavity is communicated with the condenser.

7. The heat dissipation system according to claim 6, characterized in that: The refrigerant in the second cavity is condensed into liquid in the condenser and then flows back to the second cavity by gravity.

8. The heat dissipation system according to claim 6 or 7, characterized in that: When the heat dissipation system is placed along the direction of gravity, the condenser is located above the evaporator.

9. The heat dissipation system according to claim 6 or 7, characterized in that: The evaporator is provided with through holes, and the through-flow nozzles are connected to the through holes in a one-to-one correspondence.

10. The heat dissipation system according to claim 9, characterized in that: The flow nozzle is inserted into the corresponding through hole, and the flow nozzle is fixed to the evaporator.

11. The heat dissipation system according to claim 10, characterized in that: A sealing ring is arranged between the flow nozzle and the through hole. The sealing ring is sleeved on the flow nozzle, and the side wall of the through hole squeezes the sealing ring.

12. The heat dissipation system according to claim 9, characterized in that: The base is provided with at least two flow nozzles, at least one of which is connected to the corresponding through hole via a second liquid flow pipe, and at least one of which is connected to the corresponding through hole via a second gas flow pipe.

13. The heat dissipation system according to claim 6 or 7, characterized in that: The evaporator is connected to the condenser via at least one first liquid flow pipeline and at least one first gas flow pipeline.

14. The heat dissipation system according to claim 6 or 7, characterized in that: Each of the first cavities is in communication with respective second cavities of at least two of the evaporators; At least one of the evaporators is connected to the condenser via a first liquid flow pipe, and at least one of the evaporators is connected to the condenser via a first gas flow pipe.

15. The heat dissipation system according to claim 14, characterized in that: At least one of the evaporators is connected to the condenser via at least one first liquid flow pipeline and at least one first gas flow pipeline.

16. The heat dissipation system according to claim 14, characterized in that: The base of each power module is provided with at least two flow nozzles, and each flow nozzle is connected to at least one evaporator.

17. The heat dissipation system according to claim 4, characterized in that: The flow nozzle is arranged on the second surface of the base, and the first surface and the second surface are arranged opposite to each other.

18. The heat dissipation system according to claim 1 or 2, characterized in that: The base has a first inner side surface, the first inner side surface and the first surface are arranged opposite to each other, and at least a portion of the first inner side surface is immersed in the refrigerant.

19. The heat dissipation system according to claim 18, characterized in that: The first inner side surface is provided with a heat dissipation enhancement structure, and the heat dissipation enhancement structure is arranged in the heat dissipation enhancement area of ​​the first inner side surface, and is used to increase the area of ​​the first inner side surface immersed in the refrigerant; along the direction from the first surface to the first inner side surface, at least part of the projection of the power device on the first inner side surface is located in the heat dissipation enhancement area.

20. The heat dissipation system according to claim 19, characterized in that: The heat dissipation enhancement structure is a groove or a protrusion located on the first inner side surface, or the heat dissipation enhancement structure is a fin or a capillary structure arranged on the first inner side surface.

21. A power device, characterized in that: The invention comprises a chassis and a heat dissipation system as claimed in any one of claims 1 to 20, wherein the condenser is located outside the chassis.

Images