Laser processing head servo control device, system and method thereof

By combining the EtherCAT bus and the FPGA main control module, independent control of the laser processing head is achieved, solving the problems of slow communication speed and low security in traditional height adjustment control systems, and improving control accuracy and production efficiency.

CN115555728BActive Publication Date: 2026-04-21HANS LASER TECH IND GRP CO LTD +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HANS LASER TECH IND GRP CO LTD
Filing Date
2021-07-01
Publication Date
2026-04-21

AI Technical Summary

Technical Problem

Traditional height adjustment control systems rely on CNC systems, resulting in slow communication speeds, delayed servo motor response, limited follow-up speeds, and safety hazards.

Method used

The servo control device, consisting of an EtherCAT slave module, an FPGA master module, and an EtherCAT master module, transmits signals via the EtherCAT bus to achieve independent control of the laser processing head. The FPGA master module performs calculations on the height signal and command information, generates control quantities, and outputs them to the servo drive module.

Benefits of technology

It achieves efficient and accurate independent control of the laser processing head, shortens communication time, improves dynamic response speed, avoids safety risks caused by CNC system failures, and improves production efficiency and control precision.

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Abstract

This invention relates to the field of laser processing technology, and discloses a laser processing head follow-up control device, system, and method. The follow-up control device includes an EtherCAT slave module for receiving instruction information from an external CNC device and outputting the instruction information to an FPGA master module; an FPGA master module for receiving the height signal input from the laser processing head, performing calculations based on the instruction information input from the EtherCAT slave module to obtain a control quantity, and outputting it to an EtherCAT master module; and an EtherCAT master module for receiving the control quantity output from the FPGA master module and outputting it to an external servo control module; the servo drive module adjusts the height of the laser processing head according to the control quantity. The follow-up control device of this invention can effectively obtain the control quantity of the laser processing head and ensure the accuracy and precision of the control quantity, enabling the system and method using the follow-up control device to achieve independent control of the laser processing head, ensuring system safety and effectiveness, and improving work efficiency and accuracy.
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Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and more specifically, to a laser processing head follow-up control device, system and method. Background Technology

[0002] With the rapid development of the laser industry and the advent of ultra-high power laser cutting machine tools, processing efficiency has been greatly improved, and the market's performance requirements for height adjustment systems are also increasing. In most traditional height adjustment servo control systems, the height adjustment module only plays a role in height acquisition; the actual control of the motor movement of the axis where the laser processing head is located still requires the support of a CNC system.

[0003] Traditional height control relies on CNC systems, resulting in slow communication speeds, delayed servo motor responses, and significant limitations on follow-up speed. Traditional height control system frameworks, such as... Figure 1 As shown in the diagram, the sensor signal from the laser processing head enters the height adjustment module. After processing, the height adjustment module obtains the height value and feeds it back to the CNC system. The CNC system then performs certain PID calculations based on the feedback height and the set cutting height, and outputs appropriate control quantities to the servo motor (including the servo driver). The servo motor drives the shaft to move, ultimately moving the laser processing head to near the set height to complete the cutting.

[0004] However, due to the fluctuating surface of the processed material, the feedback height changes constantly. The CNC system needs to adjust the control of the servo motor in a timely manner according to the changes in the feedback height to ensure a constant cutting height. However, this process requires at least two communication cycles before the servo motor can respond. Furthermore, if the CNC system suddenly malfunctions, the servo motor will not receive the correct instructions, which could easily lead to danger. Summary of the Invention

[0005] The purpose of this invention is to address the technical problems existing in the prior art by providing a laser processing head follow-up control device, system and method, which can realize follow-up control of the laser processing head, improve work efficiency and ensure safety.

[0006] To address the problems mentioned above, the technical solution adopted by this invention is as follows:

[0007] This invention discloses a laser processing head follow-up control device, which includes an EtherCAT slave module, an FPGA master control module, and an EtherCAT master module.

[0008] The EtherCAT slave module is connected to an external CNC device to receive instruction information from the CNC device and output the instruction information to the FPGA master control module.

[0009] The FPGA master control module is connected to the EtherCAT slave module and is used to receive the height signal input from the external laser processing head, and perform calculations in combination with the instruction information input from the EtherCAT slave module to obtain the control quantity and output it to the EtherCAT master module.

[0010] The EtherCAT master module is connected to the FPGA master control module and is used to receive the control quantities output by the FPGA master control module and output them to the external servo control module.

[0011] Furthermore, the EtherCAT master module and the servo drive module, as well as the EtherCAT slave module and the CNC device, use the EtherCAT bus for signal transmission.

[0012] Furthermore, the FPGA main control module includes:

[0013] The frequency measurement unit is used to measure the height signal input to the laser processing head and obtain the frequency value.

[0014] The height control unit is connected to the frequency measurement unit and the EtherCAT slave module. It is used to convert the frequency value obtained by the frequency measurement unit into a feedback height value, and to perform calculations to obtain the control quantity in combination with the control commands received by the EtherCAT slave module.

[0015] Furthermore, the FPGA master control module also includes a DPRAM storage unit connected to the EtherCAT master module and the EtherCAT slave module. The EtherCAT slave module receives the control quantity output by the control unit and writes it into the DPRAM storage unit. The EtherCAT master module reads the control quantity from the DPRAM storage unit and outputs it to the servo drive module.

[0016] Furthermore, the follow-up control device also includes an AXI interface module, which is connected to the height adjustment control unit and the EtherCAT slave module via an AXI bus.

[0017] Furthermore, the follow-up control device also includes a frequency receiving circuit module connected to the laser processing head and the frequency measurement unit respectively, which is used to filter, shape and divide the height signal input from the laser processing head to obtain a square wave signal and output it to the frequency measurement unit.

[0018] Furthermore, the follow-up control device also includes an EEPROM storage chip connected to the height adjustment control unit for storing parameters and information in the height adjustment control unit.

[0019] Furthermore, the servo control device also includes an Ethernet MAC layer, a PHY chip, and an RJ45 network port. The EtherCAT master module is connected to the Ethernet MAC layer, the Ethernet MAC layer is connected to the PHY chip, and the PHY chip is connected to the RJ45 network port. The EtherCAT slave module is connected to the EtherCAT slave protocol chip via an SPI bus, and the EtherCAT slave protocol chip is also connected to the RJ45 network port. The RJ45 network port is connected to the servo drive module and the CNC device via the EtherCAT bus.

[0020] The present invention also provides a laser processing head follow-up control system, the follow-up control system comprising: the follow-up control device, a CNC device and a servo drive module connected to the follow-up control device via an EtherCAT bus, a laser processing head connected to the servo drive module, and a sensor connecting the laser processing head and the follow-up control device;

[0021] The sensor is used to collect the height signal generated by the laser processing head and output it to the follow-up control device;

[0022] The follow-up control device receives the height signal collected by the sensor and the control command input by the CNC device, performs calculations to obtain the control quantity and outputs it to the servo control module;

[0023] The servo control module adjusts the height of the laser processing head according to the control quantity, thereby controlling the follow-up height of the laser processing head.

[0024] The present invention also provides a laser processing head follow-up control method, the control method comprising the following:

[0025] The sensor collects the height signal generated by the laser processing head and outputs it to the follow-up control device;

[0026] The CNC device generates control commands and outputs the control commands to the follow-up control device;

[0027] The servo control device processes the received height signal and control command to obtain the control quantity and outputs it to the servo control module.

[0028] The servo control module adjusts the height of the laser processing head based on the received control input, thereby controlling the follow-up height of the laser processing head.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] The present invention provides a laser processing head follow-up control device, system, and method. The follow-up control device receives instruction information from an external CNC device via an EtherCAT slave module, receives the height signal input from the external laser processing head via an FPGA master module, and calculates the control quantity based on the received instruction information. The control quantity is then output to an external servo drive module via an EtherCAT master module to adjust the height of the laser processing head. This follow-up control device can effectively obtain the control quantity of the laser processing head and ensure the accuracy and precision of the control quantity. This enables the system and method using the follow-up control device to achieve independent control of the laser processing head, ensuring system safety and effectiveness, and improving work efficiency and accuracy. Attached Figure Description

[0031] To more clearly illustrate the solutions in this invention, a brief introduction to the accompanying drawings used in the description of the embodiments will be provided below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without any creative effort. Wherein:

[0032] Figure 1 This is a schematic diagram of a height adjustment system that requires the participation of a CNC system in existing technologies.

[0033] Figure 2 This is a schematic diagram of the laser processing head follow-up control device and a partial schematic diagram of the system in this invention.

[0034] Figure 3 This is a connection diagram of the AXI interface module in this invention.

[0035] Figure 4 This is a schematic diagram of the connection of the frequency receiving circuit module in this invention.

[0036] Figure 5 This is a schematic diagram showing the connection between the EtherCAT master module, the EtherCAT slave module, and the network port in this invention.

[0037] Figure 6 This is a schematic diagram of the overall principle of the laser processing head follow-up control system in this invention. Detailed Implementation

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. For example, terms such as “length,” “width,” “upper,” “lower,” “left,” “right,” “front,” “rear,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer” indicate orientations or positions based on the orientations or positions shown in the accompanying drawings and are for ease of description only, and should not be construed as limiting the technical solution.

[0039] The terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion; the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a particular order. In the specification, claims, and accompanying drawings of this invention, when an element is referred to as "fixed to," "mounted to," "disposed of," or "connected to" another element, it may be directly or indirectly located on that other element. For example, when an element is referred to as "connected to" another element, it may be directly or indirectly connected to that other element.

[0040] Furthermore, the reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments.

[0041] It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] See Figure 2 As shown, this embodiment of the invention provides a laser processing head follow-up control device and system. The follow-up control device 200 is used to collect the height signal transmitted from the external laser processing head 40 and process the height signal. It combines the instruction information of the external CNC device 100 to generate a control quantity. The external servo drive module 50 drives the laser processing head 40 to move to the set height to complete the cutting according to the control quantity. The follow-up control device 200 can efficiently and accurately obtain the control quantity of the laser processing head 40, and enable the system using the follow-up control device 200 to achieve independent control of the follow-up height of the laser processing head 40.

[0043] The follow-up control device 200 includes an EtherCAT slave module 20, an FPGA master control module 30, and an EtherCAT master module 10.

[0044] The EtherCAT slave module 20 is connected to the external CNC device 100 and is used to receive instruction information from the CNC device 100 and output the instruction information to the FPGA master control module 30.

[0045] The FPGA master control module 30 is connected to the external laser processing head 40 and the EtherCAT slave module 20 respectively. It is used to receive the height signal input by the laser processing head 40, and perform calculations in combination with the instruction information input by the EtherCAT slave module 20 to obtain the control quantity and output it to the EtherCAT master module 10.

[0046] The EtherCAT master module 10 is connected to the FPGA master control module 30 and to the external servo drive module 50. It receives control signals from the FPGA master control module 30 and outputs them to the external servo control module 50. The servo drive module 50 adjusts the height of the laser processing head 40 according to the control signals.

[0047] In this embodiment, by setting up an EtherCAT master module 10, an EtherCAT slave module 20, and an FPGA master control module 30, the EtherCAT slave module 20 receives instruction information from the external CNC device 100, and the FPGA master control module 30 receives the instruction information and the height signal input from the laser processing head 40, and performs calculations to obtain the control quantity. The servo drive module 50 adjusts the height of the laser processing head 40 according to the control quantity, that is, it can independently control the follow-up height of the laser processing head 40 without relying on the external CNC device 100 to control it, thereby improving control accuracy and efficiency.

[0048] Furthermore, the EtherCAT master module 10 and the servo drive module 50, as well as the EtherCAT slave module 20 and the CNC device 100, use EtherCAT bus for signal transmission. The wiring of the EtherCAT bus connection is simple, the communication speed is fast, the anti-interference ability is strong, and the communication cycle of the device can be as fast as less than 200us, which greatly reduces the communication time and can achieve a faster follow-up speed and higher dynamic response, thereby improving production efficiency.

[0049] In this embodiment, since the functions of ordinary STM32 microcontrollers are too limited to meet the requirements of multiple functions, in order to simultaneously meet the communication between the EtherCAT slave module 20 and the external CNC device 100, as well as the communication between the EtherCAT master module 10 and the servo drive module 50, the main processor of the servo control device adopts a high-performance SOC processor of model Z-7030 from the Xilinx Zynq-7000 series. It integrates dual-core ARM Cortex-A9 on the PS side and Kintex-7 architecture 28nm programmable logic resources on the PL side. That is, the main chip of the servo control device adopts the Z-7030 dual-core A9 fully programmable SOC chip and integrates a Kintex-7 FPGA module.

[0050] Specifically, the EtherCAT master module 10 uses an ARM Cortex-A9 processor and runs a real-time Linux operating system to control the external servo drive module 50. The EtherCAT slave module 20 also uses an ARM Cortex-A9 processor and is responsible for receiving relevant instructions and information from the external CNC device 40 and sending them to the FPGA master control module 30 to calculate the control quantities. The FPGA master control module 30 uses a Kintex-7 FPGA module for calculation to obtain the control quantities. In this embodiment, by integrating the EtherCAT master module 10, EtherCAT slave module 20, and FPGA master control module 30 onto a single main chip, all the functions of the servo control device can be realized, significantly reducing costs.

[0051] For further information, please refer to [link / reference]. Figure 2 As shown, the FPGA main control module 30 includes a frequency measurement unit 310, a height adjustment control unit 320, and a DPRAM storage unit 330.

[0052] The frequency measurement unit 310 is connected to the external laser processing head 40 and is used to measure the height signal input to the laser processing head 40 and obtain the frequency value. Specifically, the height signal is a square wave signal. The frequency measurement unit 310 uses an equal-precision frequency measurement method to measure the input square wave signal and can directly obtain the frequency value. The method is simple and can achieve accurate measurement. The height signal of the laser processing head 40 can be acquired by a sensor or other measuring device and then transmitted to the frequency measurement unit 310.

[0053] The height control unit 320 is connected to the frequency measurement unit 310 and the EtherCAT slave module 20. It is used to convert the frequency value obtained by the frequency measurement unit 310 into a feedback height value, and combine it with the control commands (including the set height and feedback height) received by the EtherCAT slave module 20 to perform a closed-loop follow-up control algorithm to obtain the control quantity of the laser processing head, and then output the control quantity to the EtherCAT slave module 20.

[0054] The DPRAM storage unit 330 is connected to the EtherCAT master module 10 and the EtherCAT slave module 20, and is used to store the control values ​​written by the EtherCAT slave module 20. The EtherCAT master module 10 reads the control values ​​from the DPRAM storage unit 330 and outputs them to the servo drive module 50. In this embodiment, the DPRAM storage unit 330 stores the data that the EtherCAT master module 10 and the EtherCAT slave module 20 need to interact with, enabling them to share data and thus improving communication efficiency.

[0055] In this embodiment, the FPGA main control module 30 uses a frequency measurement unit 310 to measure the frequency of the height signal input from the laser processing head 40 to obtain a frequency value, and uses a height control unit 320 to convert the frequency value into a height value. Then, it combines the control command to calculate the control quantity, which is stored in the DPRAM storage unit 330 to facilitate communication between the EtherCAT slave module 20 and the EtherCAT master module 10. The FPGA main control module 30 has high measurement accuracy and fast algorithm processing speed, which can ensure the accuracy of the obtained control quantity, thereby ensuring the accuracy and reliability of the system control.

[0056] For further details, please refer to [link / reference]. Figure 3 As shown, the follow-up control device also includes an AXI interface module 60, which is connected to the height adjustment control unit 320 and the EtherCAT slave module 20 respectively, reliably realizing communication between the two. The AXI interface module 60 is connected to the height adjustment control algorithm unit 320 and the EtherCAT slave module 20 via an AXI bus. In this embodiment, since the height adjustment control unit 320 is located within the FPGA main control module 30, and the EtherCAT slave module 20 is located on the A9 processor in the PS section of the main chip, the AXI interface module 60 and the AXI bus facilitate reliable communication between the height adjustment control unit 320 and the EtherCAT slave module 20, ensuring effective data transmission.

[0057] For further details, please refer to [link / reference]. Figure 4As shown, the follow-up control device also includes a frequency receiving circuit module 70, which is connected to the laser processing head 40 and the frequency measurement unit 310 respectively. It is used to perform certain filtering, shaping and frequency division processing on the height signal input by the laser processing head 40, and generate a square wave signal after processing and output it to the frequency measurement unit 310.

[0058] Furthermore, the follow-up control device also includes an EEPROM storage chip 80 connected to the height adjustment control unit 320. Figure 2 As shown in the diagram, the EEPROM storage chip 80 is used to store parameters and information in the height control unit 320, ensuring that data is not lost when the device is powered off. Specifically, the EEPROM storage chip 80 and the height control unit 320 transmit data via the IIC protocol, facilitating efficient and reliable data transmission.

[0059] For further details, please refer to [link / reference]. Figure 5 As shown, the servo control device further includes an Ethernet MAC layer 101, an EtherCAT slave protocol chip 401, a PHY chip 201, and an RJ45 network port 301. The EtherCAT master module 10 is connected to the Ethernet MAC layer 101, the Ethernet MAC layer 101 is connected to the PHY chip 201, and the PHY chip 201 is connected to the RJ45 network port 301. The EtherCAT slave module 20 is connected to the EtherCAT slave protocol chip 401 via an SPI bus, and the EtherCAT slave protocol chip 401 is also connected to the RJ45 network port 301. The RJ45 network port 301 is connected to the servo drive module 50 and the CNC device 100 via an EtherCAT bus.

[0060] In this implementation, since the PS section of the main chip Z-7030 includes a Gigabit Ethernet MAC layer 101, and the Ethernet MAC layer 101 cannot be directly connected to the network port, an Ethernet physical layer transmission chip is required externally to the main chip. Specifically, a PHY chip 201 is connected to the RJ45 network port 301 to achieve a Gigabit Ethernet interface. In this embodiment, the PHY chip 201 is the Marvell PHY chip 88E1518. If the EtherCAT slave module 20 wants to connect to the CNC device 100 via the EtherCAT bus, an EtherCAT slave protocol chip 401 must be added in the middle. In this embodiment, the EtherCAT slave protocol chip 401 is the Microchip Technology LAN9252, which integrates a PHY and can be directly connected to the RJ45 network port 301. The EtherCAT slave module 20 and the EtherCAT slave protocol chip 401 communicate via the SPI bus, ensuring reliable communication.

[0061] In this embodiment, by setting the PHY chip 201 to connect the Ethernet MAC layer 101 and the RJ45 network port 301 of the EtherCAT master module 10 in the main chip, communication between the main chip and the external servo drive module 50 can be realized. By setting the EtherCAT slave protocol chip 401 to connect the EtherCAT slave module 20 and the RJ45 network port 301 of the main chip, communication between the main chip and the CNC device 100 can be realized, ensuring the reliability of the follow-up control device 200.

[0062] As attached Figure 6 As shown, this embodiment of the invention also provides a laser processing head follow-up control system, including the follow-up control device 200, a CNC device 100 and a servo drive module 50 connected to the follow-up control device 200 via an EtherCAT bus, a laser processing head 40 connected to the servo drive module 50, and a sensor 410 connected to the laser processing head 40 and the follow-up control device 200.

[0063] The sensor 410 collects the height signal generated by the laser processing head and outputs it to the follow-up control device 200. Specifically, the sensor 410 collects the capacitance signal between the laser processing head 40 and the processing material and outputs a high-frequency sine wave to the frequency receiving circuit module 70 in the follow-up control device 200. This capacitance signal changes with the actual height of the laser processing head 40, and the frequency signal output by the frequency receiving circuit module 70 also changes with the capacitance signal. Therefore, the actual height value of the current laser processing head 40 can be calculated by the frequency measurement unit 310 and the height control unit 320.

[0064] The follow-up control device 200 receives the height signal and the control commands input by the CNC device 100, performs calculations to obtain a control quantity, and outputs it to the servo control module 50. Specifically, the control commands generally include cutting height, perforation height, follow-up switch, follow-up algorithm parameters, etc. The control quantity is the distance and direction that the laser processing head 40 should travel, obtained after comprehensive calculation based on the specified cutting height or perforation height transmitted from the CNC device 100 and the actual height value calculated by the height adjustment control unit 320 in the follow-up control device 200.

[0065] The servo control module 50 adjusts the height of the laser processing head 40 according to the control quantity, thereby achieving independent control of the follow-up height of the laser processing head.

[0066] In this embodiment, the servo control module 50 includes a servo motor connected to the laser processing head 40 and a servo driver connected to the servo motor and the follow-up control device 200. The servo driver is used to receive control quantities and perform signal conversion to output to the servo motor. The servo motor controls the laser processing head 40 according to the converted signal, which facilitates control and ensures control accuracy.

[0067] This invention also provides a laser processing head follow-up control method, which includes the following:

[0068] Sensor 410 collects the height signal generated by laser processing head 40 and outputs it to follow-up control device 200;

[0069] The CNC device 100 generates control commands and outputs the control commands to the follow-up control device 200;

[0070] The follow-up control device 200 calculates the height signal and control command received, obtains the control quantity, and outputs it to the servo control module 50.

[0071] The servo control module 50 adjusts the height of the laser processing head 40 according to the obtained control quantity, thereby controlling the follow-up height of the laser processing head 40.

[0072] The servo drive module 50 directly adjusts the height of the laser processing head 40 based on the control quantity obtained from the servo drive device 200, bypassing the control of the CNC device 100 on the laser processing head 40. This not only makes the control more convenient and efficient, but also ensures that the laser processing head 40 can still operate stably under the control of the servo drive module 50 even when the CNC device 100 suddenly stops working due to a malfunction, avoiding dangerous situations such as collisions with the plate, ensuring the safety of the system operation, and improving the system's working efficiency.

[0073] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A laser processing head follow-up control device, characterized in that: The control device includes an EtherCAT slave module, an FPGA master module, and an EtherCAT master module, all of which are integrated into a single main chip. The EtherCAT slave module is connected to an external CNC device to receive instruction information from the CNC device and output the instruction information to the FPGA master control module. The FPGA master control module is connected to the EtherCAT slave module and is used to receive the height signal input by the laser processing head, and perform calculations in combination with the instruction information input by the EtherCAT slave module to obtain the control quantity and output it to the EtherCAT master module. The EtherCAT master station module is connected to the FPGA master control module and is used to receive the control quantity output by the FPGA master control module and output it to the servo drive module. The servo drive module adjusts the follow-up height of the laser processing head according to the control quantity output by the EtherCAT master station module. The FPGA master control module also includes a DPRAM storage unit connected to the EtherCAT master module and the EtherCAT slave module. The DPRAM storage unit is used to store the control quantities written by the EtherCAT slave module. The EtherCAT master module reads the control quantities from the DPRAM storage unit and outputs them to the servo drive module.

2. The laser processing head follow-up control device according to claim 1, characterized in that: The EtherCAT master module and servo drive module, as well as the EtherCAT slave module and CNC device, use EtherCAT bus for signal transmission.

3. The laser processing head follow-up control device according to claim 1, characterized in that: The FPGA main control module includes: The frequency measurement unit is used to measure the height signal input to the laser processing head and obtain the frequency value. The height control unit is connected to the frequency measurement unit and the EtherCAT slave module. It is used to convert the frequency value obtained by the frequency measurement unit into a feedback height value, and to perform calculations to obtain the control quantity in combination with the control commands received by the EtherCAT slave module.

4. The laser processing head follow-up control device according to claim 3, characterized in that: The EtherCAT slave module receives the control quantity output by the control unit and writes it into the DPRAM storage unit.

5. The laser processing head follow-up control device according to claim 3, characterized in that: The follow-up control device also includes an AXI interface module, which is connected to the height adjustment control unit and the EtherCAT slave module via an AXI bus.

6. The laser processing head follow-up control device according to claim 3, characterized in that: The follow-up control device also includes a frequency receiving circuit module connected to the laser processing head and the frequency measurement unit respectively, which is used to filter, shape and divide the height signal input from the laser processing head to obtain a square wave signal and output it to the frequency measurement unit.

7. The laser processing head follow-up control device according to claim 3, characterized in that: The follow-up control device also includes an EEPROM storage chip connected to the height adjustment control unit, used to store parameters and information in the height adjustment control unit.

8. The laser processing head follow-up control device according to claim 1, characterized in that: The servo control device further includes an Ethernet MAC layer, an EtherCAT slave protocol chip, a PHY chip, and an RJ45 network port. The EtherCAT master module is connected to the Ethernet MAC layer, the Ethernet MAC layer is connected to the PHY chip, and the PHY chip is connected to the RJ45 network port. The EtherCAT slave module is connected to the EtherCAT slave protocol chip via an SPI bus, and the EtherCAT slave protocol chip is also connected to the RJ45 network port. The RJ45 network port is connected to the servo drive module and the CNC device via the EtherCAT bus.

9. A laser processing head follow-up control system, characterized in that: The servo control system includes: a servo control device as described in any one of claims 1-8, a CNC device and a servo drive module connected to the servo control device via an EtherCAT bus, a laser processing head connected to the servo drive module, and a sensor connected to the laser processing head and the servo control device. The sensor is used to collect the height signal generated by the laser processing head and output it to the follow-up control device; The follow-up control device receives the height signal collected by the sensor and the control command input by the CNC device, performs calculations to obtain the control quantity and outputs it to the servo drive module; The servo drive module adjusts the height of the laser processing head according to the control quantity, thereby controlling the follow-up height of the laser processing head.

10. A control method based on the laser processing head follow-up control system of claim 9, characterized in that: The control method includes the following: The sensor collects the height signal generated by the laser processing head and outputs it to the follow-up control device; The CNC device generates control commands and outputs the control commands to the follow-up control device; The servo control device processes the height signal and control command received, obtains the control quantity, and outputs it to the servo drive module. The servo drive module adjusts the height of the laser processing head based on the received control input, thereby controlling the follow-up height of the laser processing head.

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