Satellite Multi-Physical Field Digital Twin Hardware-in-the-Loop Simulation Platform

Abstract

The present invention discloses a satellite multi-physical field digital twin semi-physical simulation platform, comprising: a thermal simulation cabin, the temperature of whose cabin wall can be adjusted within a preset range; a thermal layout board, arranged in the thermal simulation cabin and used for simulating the satellite PCB board; a plurality of thermal components and electronic components, the heating power of the thermal components being adjustable, and the thermal components and electronic components being capable of being inserted on the thermal layout board and used for simulating the electronic components on the satellite; a distributed measurement module, connected to the thermal layout board and used for measuring the force borne by the thermal layout board and the temperatures at multiple points; an infrared thermal imaging module, used for imaging the temperature field of the thermal layout board; and a control module, used for controlling the working modes and parameters of the thermal simulation cabin, the thermal layout board, the thermal components, the distributed measurement module and the infrared thermal imaging module, as well as collecting, storing and processing the cabin wall temperature data, the pressure and temperature data, and the infrared image data. The present invention can meet the satellite simulation requirements in complex environments, at multi-scale levels and under multiple working conditions.

Description

Technical Field

[0001] The present invention relates to the technical field of satellite engineering, and particularly to a satellite multi-physical-field digital twin semi-physical simulation platform. Background Art

[0002] The successful completion of the established tasks of a satellite depends on a variety of on-board devices. However, some on-board devices are very sensitive to environmental factors. Taking temperature as an example, the operating temperature requirement for aerospace-grade electronic components is -55°C to 150°C. Thermal stress and thermal strain will affect the reliability of chip packaging and also cause phenomena such as corrosion, oxidation, and device explosion. Generally speaking, for every 10-degree increase in temperature, the device life is reduced by half. In addition, some on-board payloads also have high temperature requirements. For example, the infrared optical sensor of a remote sensor requires a low-temperature working environment, while the on-board refrigeration system and thermoelectric power generation system need to work under high-temperature conditions. Therefore, ambient temperature, as an important factor, has an important impact on the working performance and life of satellite system components. Real-time monitoring of the on-board temperature field is an important prerequisite for effective on-board thermal control. However, since spacecraft such as satellites need to face frequent thermal cycles during on-orbit operation, coupled with the self-coupled heat generation of components, the satellite thermal environment is very complex, posing a huge challenge to satellite temperature monitoring. In addition, the on-orbit environment of the satellite is extremely complex and changeable, and the influence of multi-physical-field coupling makes it very difficult to accurately characterize the working state of on-board devices, further increasing the difficulty of satellite monitoring.

[0003] As a high-value spacecraft, a satellite has strict requirements for launch mass. Only a limited number of sensors can be arranged on the satellite, making it impossible to accurately characterize the on-board physical field. By establishing a satellite multi-physical-field digital twin model, this problem can be effectively solved to achieve real-time monitoring of the on-board physical field.

[0004] At present, the most important factor restricting the modeling of the satellite multi-physical field digital twin model is the lack of real in-orbit operation data. In existing research, numerical calculation methods or hardware-in-the-loop simulation experiments are usually used to obtain data. Common numerical calculation methods include the finite element method, the finite volume method, the finite difference method, etc. However, traditional numerical calculation methods have their own drawbacks. For example, the finite element method is difficult to handle complex equations and large-scale solution problems, the high-order calculation method of the finite volume method is very complex, and the finite difference method is not flexible enough when dealing with complex grids. Moreover, the coupling of multi-physical fields further exacerbates the difficulty of numerical simulation. Therefore, the physical field simulation accuracy obtained based on numerical calculation methods cannot meet the requirements for accurate modeling of the satellite multi-physical field digital twin model. In addition, satellite design, manufacturing, and operation and maintenance are a process of continuous iterative optimization. Changing any model parameter will invalidate the previous numerical calculation results, and the huge calculation cost brought about by this is also unacceptable. The hardware-in-the-loop simulation technology can effectively improve the development accuracy and efficiency of digital satellites by introducing a highly reliable software / hardware ground experimental environment. However, the simulation environments of existing hardware-in-the-loop simulation platforms mostly use simple steady-state settings, ignoring the impact of environmental changes under real operating conditions and are not applicable to the hardware-in-the-loop simulation of satellites in complex and changing in-orbit environments. The designs of existing hardware-in-the-loop simulation platforms are mostly designed for one or a few specific working conditions and cannot be flexibly extended for multi-working conditions and multi-sizes, and cannot meet the requirements of the satellite digital twin hardware-in-the-loop simulation for complex environments, multi-scale levels, and multi-working conditions. Summary of the Invention

[0005] To solve some or all of the above-mentioned technical problems existing in the prior art, the present invention provides a satellite multi-physical field digital twin hardware-in-the-loop simulation platform.

[0006] The technical solution of the present invention is as follows:

[0007] A satellite multi-physical field digital twin hardware-in-the-loop simulation platform is provided, including:

[0008] A thermal simulation chamber, the temperature of the chamber wall of the thermal simulation chamber can be adjusted within a preset range, and is used to simulate the satellite cabin under different operating states;

[0009] A thermal layout board, the thermal layout board is arranged in the thermal simulation chamber, and a plurality of pluggable pins are arranged on the thermal layout board, and are used to simulate the satellite PCB board;

[0010] A plurality of thermal components and a plurality of electronic components, the heating power of the thermal components is adjustable, and the thermal components and the electronic components can be inserted on the thermal layout board through the pluggable pins, and the thermal components and the electronic components are used to simulate the electronic components on the satellite and various circuits composed thereof;

[0011] A distributed measurement module, which is connected to the thermal layout board and is used to measure the force on the thermal layout board and the temperatures of multiple points on the thermal layout board;

[0012] An infrared thermal imaging module, which is used to sense the infrared radiation energy emitted by the thermal layout board and the thermal components and electronic components thereon, so as to image the temperature field of the thermal layout board;

[0013] A control module, which is respectively connected to the thermal simulation chamber, the thermal layout board, the thermal components, the distributed measurement module and the infrared thermal imaging module, and can be connected to external devices. It is used to control the working modes and working parameters of the thermal simulation chamber, the thermal layout board, the thermal components, the distributed measurement module and the infrared thermal imaging module, and is used to collect, store and process the temperature data of the chamber wall of the thermal simulation chamber, the pressure data and temperature data measured by the distributed measurement module, and the infrared image data obtained by the infrared thermal imaging module.

[0014] In some possible implementation manners, the thermal simulation chamber includes a plurality of wall panels, and the plurality of wall panels are connected to each other to form a chamber structure with a closed space. Heaters and heat exchangers are arranged on the inner side of each wall panel, and at least one of the wall panels is provided with a wiring hole.

[0015] In some possible implementation manners, the heating logic of the heater and the refrigeration logic of the heat exchanger are controlled by six numbers of the track.

[0016] In some possible implementation manners, the thermal layout board includes: a first printed circuit board and a second printed circuit board;

[0017] A plurality of pluggable pins are provided on the upper surface of the first printed circuit board for installing the thermal components and the electronic components, and the lower surface of the first printed circuit board is used to connect the distributed measurement module;

[0018] The upper surface of the second printed circuit board is connected to the lower surface of the first printed circuit board, and is also connected to the distributed measurement module through a high-speed connector. The second printed circuit board is used as a logic control layer to control the operation and output of the thermal components, the electronic components and the distributed measurement module.

[0019] In some possible implementation manners, the thermal components include:

[0020] A power consumption unit, which can generate heat, and the heating power can be adjusted within a preset power range;

[0021] A wireless communication unit, which is respectively connected to the coordination control unit and the control module;

[0022] The coordination control unit is respectively connected to the power consumption unit and the wireless communication unit, and is configured to adjust the heating power of the power consumption unit according to the control instruction received from the control module by the wireless communication unit, and send the status information of the heat component to the control module through the wireless communication unit.

[0023] In some possible implementation manners, the wireless communication unit adopts ZigBee, Bluetooth, wireless broadband, ultra-wideband or near-field communication wireless communication technology. The wireless communication unit is configured to send the status information of the heat component sent by the coordination control unit to the control module, receive the control instruction sent by the control module, and send the control instruction to the coordination control unit.

[0024] In some possible implementation manners, the distributed measurement module includes: a pressure sensor and a temperature sensor;

[0025] There are multiple pressure sensors, and one pressure sensor is arranged at each vertex of the heat layout board. The pressure sensor is configured to measure the force and the center of gravity of the heat layout board;

[0026] There are multiple temperature sensors, and the multiple temperature sensors are mounted on the heat layout board in an equally spaced array distribution manner, and are configured to measure the temperatures of multiple points on the heat layout board.

[0027] In some possible implementation manners, the infrared thermal imaging module includes: a bracket and an infrared camera;

[0028] The bracket is mounted outside the thermal simulation cabin, the infrared camera is mounted on the bracket, an infrared-transmitting observation window is opened on the cabin wall of the thermal simulation cabin, and the lens of the infrared camera faces the heat layout board arranged in the thermal simulation cabin through the infrared-transmitting observation window.

[0029] In some possible implementation manners, the control module includes: a host computer and a server;

[0030] The host computer is communicatively connected to the server. The host computer is respectively connected to the thermal simulation cabin, the heat layout board, the heat component, the distributed measurement module and the infrared thermal imaging module through a control bus, and is configured to control the working modes and working parameters of the thermal simulation cabin, the heat layout board, the heat component, the distributed measurement module and the infrared thermal imaging module according to the control information sent by the server;

[0031] The server is communicatively connected to the thermal simulation chamber, the distributed measurement module, and the infrared thermal imaging module, and the server can be communicatively connected to external devices, and is used for collecting, storing, and processing the bulkhead temperature data of the thermal simulation chamber, the pressure data and temperature data measured by the distributed measurement module, the infrared image data obtained by the infrared thermal imaging module, and for sending control information to the host computer.

[0032] In some possible implementation manners, system software is provided on the server, the system software is provided with an HMI interface, and the HMI interface can display the stored data according to user requirements.

[0033] The main advantages of the technical solution of the present invention are as follows:

[0034] The satellite multi-physical field digital twin semi-physical simulation platform of the present invention can simulate the real satellite on-orbit environment and the on-orbit operating state of on-board equipment, and can make adaptive adjustments according to the satellite's operating environment and operating state, can meet the satellite simulation requirements of complex environments, multi-scale levels, and multi-working conditions, has a high simulation accuracy, the obtained simulation data can approximate real data, and can provide reliable data support for satellite multi-physical field digital twin model modeling research such as multi-source heterogeneous data fusion, multi-physical field surrogate model modeling, uncertainty quantification, and model accuracy confirmation. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0036] Figure 1 It is a schematic structural diagram of a satellite multi-physical field digital twin semi-physical simulation platform according to an embodiment of the present invention, where some structures are not shown;

[0037] Figure 2 It is a schematic structural diagram of a thermal simulation chamber according to an embodiment of the present invention;

[0038] Figure 3 It is a schematic structural diagram of a thermal layout board according to an embodiment of the present invention;

[0039] Figure 4 It is a schematic diagram of the arrangement manner of the pressure sensors of the distributed measurement module according to an embodiment of the present invention;

[0040] Figure 5 It is a schematic diagram of the arrangement manner of the temperature sensors of the distributed measurement module according to an embodiment of the present invention;

[0041] Figure 6Schematic diagram of the structure and installation position of an infrared thermal imaging module according to an embodiment of the present invention.

[0042] Explanation of reference numerals:

[0043] 1 - Thermal simulation chamber, 11 - Wiring hole, 12 - Infrared - transmissive observation window, 2 - Thermal layout board, 21 - First printed circuit board, 22 - Second printed circuit board, 3 - Mechanical room, 4 - Power distribution cabinet, 51 - Pressure sensor, 52 - Temperature sensor, 61 - Bracket, 62 - Infrared camera. Detailed implementation manners

[0044] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] The following will detail the technical solutions provided by the embodiments of the present invention with reference to the drawings.

[0046] Refer to Figure 1 , an embodiment of the present invention provides a satellite multi - physical - field digital twin semi - physical simulation platform. The semi - physical simulation platform includes:

[0047] A thermal simulation chamber 1, the temperature of the chamber wall of the thermal simulation chamber 1 can be adjusted within a preset range, and is used to simulate the satellite cabin under different operating states;

[0048] A thermal layout board 2, the thermal layout board 2 is arranged in the thermal simulation chamber 1, and a plurality of plug - in pins are provided on the thermal layout board 2, which is used to simulate the satellite PCB board;

[0049] A plurality of thermal components and a plurality of electronic components, the heating power of the thermal components is adjustable, and the thermal components and electronic components can be inserted on the thermal layout board 2 through the plug - in pins. The thermal components and electronic components are used to simulate the electronic components on the satellite and various circuits composed of them;

[0050] A distributed measurement module, the distributed measurement module is connected to the thermal layout board 2, and is used to measure the force on the thermal layout board 2 and the temperatures of multiple points on the thermal layout board 2;

[0051] An infrared thermal imaging module, which is used to sense the infrared radiation energy emitted by the thermal layout board 2 and the thermal components and electronic components thereon, so as to image the temperature field of the thermal layout board 2;

[0052] The control module is connected to the thermal simulation chamber 1, the thermal layout board 2, the thermal components, the distributed measurement module, and the infrared thermal imaging module respectively, and can be connected to external devices. It is used to control the working modes and working parameters of the thermal simulation chamber 1, the thermal layout board 2, the thermal components, the distributed measurement module, and the infrared thermal imaging module, and is used to collect, store, and process the temperature data of the cabin wall of the thermal simulation chamber 1, the pressure data and temperature data measured by the distributed measurement module, and the infrared image data obtained by the infrared thermal imaging module.

[0053] Specifically, when the satellite multi-physical field digital twin semi-physical simulation platform provided by an embodiment of the present invention is in use, first determine the electronic components and the layout of the electronic components on the printed circuit boards (PCBs) of the satellite to be simulated. According to the types, quantities, and layout of the determined electronic components, insert the corresponding thermal components and electronic components into the thermal layout board 2 to simulate the satellite PCB board and the components thereon, and place the thermal layout board 2 with the thermal components and electronic components arranged into the thermal simulation chamber 1; then, determine the actual temperature or temperature range corresponding to each cabin wall of the satellite cabin according to the operating state of the satellite to be simulated, and use the control module to adjust the temperature of each cabin wall of the thermal simulation chamber 1 so that the temperature of each cabin wall of the thermal simulation chamber 1 is the same as or within the determined temperature range of each cabin wall of the satellite cabin; at the same time, determine the operating temperature of the electronic components on the satellite PCB board according to the operating state and working state of the satellite to be simulated, and adjust the heating power of the corresponding thermal components on the thermal layout board 2 according to the determined operating temperature parameters of the electronic components so that the temperature of the thermal components is basically consistent with the temperature of the electronic components they simulate; then, use the control module to adjust the working modes and working parameters of the distributed measurement module and the infrared thermal imaging module, use the distributed measurement module and the infrared thermal imaging module to collect data such as pressure, temperature, and infrared images of the thermal layout board 2 in real time, and use the control module to record, store, and analyze the obtained data, as well as the working modes and working parameters of each component of the semi-physical simulation platform.

[0054] It can be seen that the satellite multi-physical field digital twin semi-physical simulation platform provided by an embodiment of the present invention can simulate the real satellite on-orbit environment and the on-orbit operating state of on-board equipment, and can make adaptive adjustments according to the satellite's operating environment and operating state. It can meet the satellite simulation requirements in complex environments, multi-scale levels, and multi-working conditions, has high simulation accuracy, and the obtained simulation data can approximate real data. It can provide reliable data support for satellite multi-physical field digital twin model modeling research such as multi-source heterogeneous data fusion, multi-physical field surrogate model modeling, uncertainty quantification, and model accuracy confirmation.

[0055] Further, refer to Figure 2, in an embodiment of the present invention, the thermal simulation chamber 1 includes a plurality of wall panels, and the plurality of wall panels are connected to each other to form a chamber structure with a sealed space. A heater and a heat exchanger are arranged on the inner side of each wall panel, and a wire routing hole 11 is provided on at least one wall panel.

[0056] Specifically, in an embodiment of the present invention, the thermal simulation chamber 1 includes 6 wall panels, and the 6 wall panels are connected to each other to form a square chamber structure with a sealed space.

[0057] Optionally, in order to facilitate the precise control of the temperature of the chamber wall of the thermal simulation chamber 1, the wall panel can be prepared from multiple layers of metal plates, and the inner and outer sides of the wall panel can be covered with a heat insulation layer.

[0058] Furthermore, in an embodiment of the present invention, the heating and cooling logic of the heater and the heat exchanger is controlled by six numbers of tracks. In this way, the temperature change situation of the satellite chamber under different operating orbits and different sun exposure conditions can be accurately simulated.

[0059] In an embodiment of the present invention, the heater can adopt a nickel-chromium alloy electric heating tube heater, and the heat exchanger can adopt a finned heat exchanger. Among them, the heater can adopt contactless equal-period pulse width modulation for heating control, and the heat exchanger adopts air-cooled mechanical compression compound single-stage cooling for refrigeration control, so as to realize the independent control of different wall surfaces of the thermal simulation chamber 1 within a preset temperature range.

[0060] Among them, the preset temperature range can be -20°C to 80°C to correspond to the temperature change range of the satellite chamber under different operating orbits and different sun exposure conditions.

[0061] Furthermore, referring to Figure 2 , in an embodiment of the present invention, the satellite multi-physical field digital twin semi-physical simulation platform further includes: a mechanical room 3 and a power distribution cabinet 4. The mechanical room 3 is respectively connected to the power distribution cabinet 4 and the chamber structure composed of a plurality of wall panels. The heating control equipment of the heater and the refrigeration control equipment of the heat exchanger are placed in the mechanical room 3. The power cord of the power distribution cabinet 4 can enter the interior of the chamber structure through the wire routing hole 11, and the power distribution cabinet 4 is used to provide the required electric energy for each component of the semi-physical simulation platform.

[0062] Furthermore, referring to Figure 3 , in an embodiment of the present invention, the thermal layout board 2 includes: a first printed circuit board 21 and a second printed circuit board 22;

[0063] A plurality of pluggable pins are provided on the upper surface of the first printed circuit board 21 for installing thermal components and electronic components, and the lower surface of the first printed circuit board 21 is used to connect the distributed measurement module;

[0064] The upper surface of the second printed circuit board 22 is connected to the lower surface of the first printed circuit board 21 and is also connected to the distributed measurement module through a high-speed connector. Detection chips, sensing chips, and / or control chips are arranged on the lower surface of the second printed circuit board 22. The second printed circuit board 22 is used as a logic control layer to perform the work and output control of the thermal components, electronic components, and distributed measurement module.

[0065] In an embodiment of the present invention, a plurality of pluggable pins are provided on the upper surface of the first printed circuit board 21. The thermal components and electronic components can be inserted on the upper surface of the first printed circuit board 21 to form an electronic component layer. The distributed measurement module is installed on the lower surface of the first printed circuit board 21 to measure the temperatures of multiple different points on the thermal layout board 2 by using the distributed measurement module.

[0066] The second printed circuit board 22 serves as the logic control layer of the thermal layout board 2. This logic control layer is connected to the distributed measurement module through a high-speed connector, and four types of pinholes including address lines, positive power supplies, negative power supplies, and custom lines are arranged thereon. These four types of pinholes constitute the minimum-size functional unit of the thermal layout board 2. The minimum-size functional units are arranged to form the entire logic control layer. Various detection chips, MCUs (micro control units), high-speed ADCs (analog-to-digital converters), etc. for detection, sensing, and control can be arranged on the lower surface of the second printed circuit board 22. Through the logic control layer, power can be supplied to the thermal components and electronic components, the positions of different thermal components in the thermal layout board 2 can be identified, and communication control and data acquisition of the thermal components can be performed.

[0067] By adopting the thermal layout board 2 with the above structure, the working state of the satellite PCB board and its components in the real in-orbit thermal cycling environment can be accurately simulated.

[0068] In an embodiment of the present invention, a snap-fastening layer is fixedly welded on the upper surface of the second printed circuit board 22. The first printed circuit board 21 and the second printed circuit board 22 are connected through the snap-fastening layer, thereby connecting the thermal components and electronic components on the first printed circuit board 21 to the logic control layer.

[0069] Further, in an embodiment of the present invention, the thermal components include:

[0070] A power consumption unit that can generate heat and whose heating power can be adjusted within a preset power range;

[0071] A wireless communication unit that is respectively connected to the coordination control unit and the control module;

[0072] A coordination control unit, which is respectively connected to a power consumption unit and a wireless communication unit, is used to adjust the heating power of the power consumption unit according to the control instruction received from the control module by the wireless communication unit, and send the status information of the heat component to the control module through the wireless communication unit.

[0073] Since some components on the satellite PCB board will generate heat during operation, while some components will not generate heat during operation, but may also affect the overall temperature field of the satellite PCB board. In an embodiment of the present invention, for the heat-generating components on the satellite PCB board, heat components are used for simulation, and for the components that do not generate heat but may affect the temperature field, the same electronic components are used for simulation, which can accurately simulate the component layout and component working status on the satellite PCB board. Moreover, by adjusting the heat components and electronic components inserted on the heat layout board 2, the simulation of satellite PCB boards with various different layout methods can also be realized.

[0074] Among them, in order to be able to simulate various different types of heat-generating components, there are multiple types of heat components, each type of heat component includes at least one, and the corresponding size and heating power adjustment range of each type of heat component are different.

[0075] In an embodiment of the present invention, the status information of the heat component at least includes: the relative position information of the heat component on the heat layout board 2, the heat component ID information, the actual energy consumption situation of the power consumption unit, and the heating power.

[0076] Furthermore, in an embodiment of the present invention, the power consumption unit can be composed of multiple switch groups and multiple energy-consuming components through series-parallel connection. Specifically, a switch group is connected in parallel with an energy-consuming component to obtain a parallel circuit, and multiple parallel circuits are connected in series in sequence. When the power consumption unit is in use, the on-off of the switch group can be controlled to control the number of energy-consuming components connected to the circuit, thereby realizing the adjustment and control of the heating power of the power consumption unit.

[0077] Among them, the energy-consuming component can adopt a resistor, and the on-off of the switch group is controlled to control the resistance value of the resistor connected to the circuit, thereby realizing the adjustment and control of the heating power.

[0078] Furthermore, in an embodiment of the present invention, the wireless communication unit adopts Zigbee, Bluetooth, Wi-Fi, UWB or NFC wireless communication technology. The wireless communication unit is used to send the status information of the heat component sent by the coordination control unit to the control module, receive the control instruction sent by the control module, and send the control instruction to the coordination control unit.

[0079] Specifically, when the thermal component is working, the coordination control unit sends the status information of the thermal component to the wireless communication unit, and the wireless communication unit transmits the received status information to the control module according to the requirements of the communication protocol; the wireless communication unit receives the control instructions sent by the control module in real time and transmits the control instructions to the coordination control unit, and the coordination control unit adjusts the power output of the power consumption unit according to the control instructions.

[0080] Further, referring to Figure 4 and Figure 5 , in an embodiment of the present invention, the distributed measurement module includes: a pressure sensor 51 and a temperature sensor 52;

[0081] There are multiple pressure sensors 51, and one pressure sensor 51 is arranged at each vertex of the thermal layout board 2. The pressure sensor 51 is used to measure the force and the center of gravity of the thermal layout board 2.

[0082] There are multiple temperature sensors 52, and the multiple temperature sensors 52 are mounted on the thermal layout board 2 in a way of equidistant array distribution, and are used to measure the temperatures of multiple points on the thermal layout board 2.

[0083] Specifically, on the basis of the structure of the thermal layout board 2 set above, the temperature sensor 52 is mounted on the lower surface of the first printed circuit board 21.

[0084] Optionally, the temperature sensor 52 can adopt a thermistor or a thermocouple.

[0085] Further, referring to Figure 6 , in an embodiment of the present invention, the infrared thermal imaging module includes: a bracket 61 and an infrared camera 62;

[0086] The bracket 61 is installed outside the thermal simulation chamber 1, the infrared camera 62 is installed on the bracket 61, an infrared-transmitting observation window 12 is opened on the cabin wall of the thermal simulation chamber 1, and the lens of the infrared camera 62 faces the thermal layout board 2 arranged in the thermal simulation chamber 1 through the infrared-transmitting observation window 12.

[0087] On the basis of the structure of the thermal layout board 2 set above, the infrared camera 62 faces the upper surface of the first printed circuit board 21.

[0088] The working principle of the infrared camera 62 in an embodiment of the present invention is to detect and measure radiation, so that the infrared radiation energy distribution pattern of the measured target is reflected on the photosensitive element of the infrared camera 62, thereby obtaining an infrared thermal image, and establishing the mutual connection between radiation and surface temperature.

[0089] Since common circuit board faults are generally short circuits, open circuits, or poor contacts, in the case of a short circuit, the current in the circuit board is larger than normal, and the corresponding components have a temperature rise. Its infrared thermal image is significantly abnormal compared to normal; in the case of an open circuit or poor contact, the current value passing through the components is almost zero. At this time, the temperature of the corresponding components is lower than when they are working normally, and its infrared thermal image is also significantly abnormal compared to normal. Therefore, in an embodiment of the present invention, by using an infrared camera 62 to perform infrared thermal imaging on the thermal layout board 2, the infrared thermal images corresponding to the thermal layout board 2 and its components are obtained in real time, and the working state of the thermal layout board 2 can be monitored in real time, and the corresponding fault points can be quickly determined when the thermal layout board 2 fails.

[0090] Further, in an embodiment of the present invention, the control module includes: a host computer and a server;

[0091] The host computer is communicatively connected to the server. The host computer is respectively connected to the thermal simulation chamber 1, the thermal layout board 2, the thermal components, the distributed measurement module, and the infrared thermal imaging module through a control bus, and is used to control the working modes and working parameters of the thermal simulation chamber 1, the thermal layout board 2, the thermal components, the distributed measurement module, and the infrared thermal imaging module according to the control information sent by the server;

[0092] The server is communicatively connected to the thermal simulation chamber 1, the distributed measurement module, and the infrared thermal imaging module, and the server can be communicatively connected to external devices, and is used to collect, store, and process the bulkhead temperature data of the thermal simulation chamber 1, the pressure data and temperature data measured by the distributed measurement module, the infrared image data obtained by the infrared thermal imaging module, and to send control information to the host computer.

[0093] Among them, the external device is, for example, a computer. The user can perform information interaction with the server through the computer, so as to realize the use and control of the hardware-in-the-loop simulation platform.

[0094] Optionally, a distributed CEPH distributed file system can be set on the server, and the CEPH distributed file system is used to store the relevant parameters and data of the hardware-in-the-loop simulation platform.

[0095] Further, in an embodiment of the present invention, system software is set on the server, and the system software is provided with an HMI interface, and the HMI interface can display and analyze the stored data according to user requirements.

[0096] Specifically, HTML and CSS3 technologies can be used to develop the HMI interface of the system software. A user login window can be set on the HMI interface. After the user logs in, the HMI interface can display the relevant data in the form of charts and other forms according to user requirements, and perform analysis and processing of the relevant data, such as performing steady-state analysis of the temperature field.

[0097] Among them, the system software can set different usage permissions for different user levels and supports the modification of user permissions.

[0098] Furthermore, in order to facilitate the control of the hardware-in-the-loop simulation platform, the HMI interface of the system software is also provided with display windows and modification windows for the working modes and working parameters of each component of the hardware-in-the-loop simulation platform. Users can learn about the working modes and working parameters of each component of the hardware-in-the-loop simulation platform through the HMI interface, and modify and adjust the working modes and working parameters of each component of the hardware-in-the-loop simulation platform.

[0099] It should be noted that in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. In addition, "front", "rear", "left", "right", "upper" and "lower" in this article are referenced with the placement state shown in the drawings.

[0100] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A satellite multi-physical field digital twin semi-physical simulation platform, characterized in that, Comprising: A thermal simulation chamber, the wall temperature of which can be adjusted within a preset range, for simulating satellite cabins under different operating states; A thermal layout board, which is arranged in the thermal simulation chamber, and a plurality of pluggable pins are arranged on the thermal layout board for simulating a satellite PCB board; A plurality of thermal components and a plurality of electronic components, the heating power of the thermal components is adjustable, and the thermal components and the electronic components can be inserted on the thermal layout board through the pluggable pins, and the thermal components and the electronic components are used for simulating the electronic components on the satellite and various circuits composed thereof; A distributed measurement module, which is connected to the thermal layout board for measuring the force on the thermal layout board and the temperatures of multiple points on the thermal layout board; An infrared thermal imaging module for sensing the infrared radiation energy emitted by the thermal layout board and the thermal components and electronic components thereon to image the temperature field of the thermal layout board; A control module, which is respectively connected to the thermal simulation chamber, the thermal layout board, the thermal components, the distributed measurement module and the infrared thermal imaging module, and can be connected to external devices, for controlling the working modes and working parameters of the thermal simulation chamber, the thermal layout board, the thermal components, the distributed measurement module and the infrared thermal imaging module, and for collecting, storing and processing the wall temperature data of the thermal simulation chamber, the pressure data and temperature data measured by the distributed measurement module, and the infrared image data obtained by the infrared thermal imaging module.

2. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 1, characterized in that, The thermal simulation chamber includes a plurality of wall panels, and the plurality of wall panels are connected to each other to form a cabin structure with a closed space. A heater and a heat exchanger are arranged on the inner side of each wall panel, and at least one of the wall panels is provided with a wiring hole.

3. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 2, characterized in that, The heating logic of the heater and the refrigeration logic of the heat exchanger are controlled by using six orbital elements.

4. The satellite multi-physical field digital twin semi-physical simulation platform according to any one of claims 1-3, characterized in that, The thermal layout board includes: a first printed circuit board and a second printed circuit board; A plurality of pluggable pins are arranged on the upper surface of the first printed circuit board for installing the thermal components and the electronic components, and the lower surface of the first printed circuit board is used for connecting the distributed measurement module; The upper surface of the second printed circuit board is connected to the lower surface of the first printed circuit board and is also connected to the distributed measurement module through a high-speed connector. The second printed circuit board is used as a logic control layer to control the operation and output of the thermal components, the electronic components and the distributed measurement module.

5. The satellite multi-physical field digital twin semi-physical simulation platform according to any one of claims 1-3, characterized in that, The thermal component includes: A power consumption unit, which can generate heat, and the heating power can be adjusted within a preset power range; A wireless communication unit, which is respectively connected to a coordination control unit and the control module; The coordination control unit is respectively connected to the power consumption unit and the wireless communication unit, and is configured to adjust the heating power of the power consumption unit according to the control instruction received from the control module by the wireless communication unit, and send the status information of the heat component to the control module through the wireless communication unit.

6. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 5, characterized in that, The wireless communication unit adopts ZigBee, Bluetooth, Wi-Fi, UWB or NFC wireless communication technology. The wireless communication unit is configured to send the status information of the heat component sent by the coordination control unit to the control module, receive the control instruction sent by the control module, and send the control instruction to the coordination control unit.

7. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 1, characterized in that, The distributed measurement module includes: a pressure sensor and a temperature sensor; There are multiple pressure sensors, and one pressure sensor is arranged at each vertex of the heat layout board. The pressure sensor is configured to measure the force and the center of gravity of the heat layout board. There are multiple temperature sensors, and the multiple temperature sensors are mounted on the heat layout board in an equally spaced array distribution manner, and are configured to measure the temperatures of multiple points on the heat layout board.

8. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 1, characterized in that, The infrared thermal imaging module includes: a bracket and an infrared camera; The bracket is installed outside the thermal simulation chamber, the infrared camera is installed on the bracket, an infrared-transmitting observation window is opened on the chamber wall of the thermal simulation chamber, and the lens of the infrared camera faces the heat layout board arranged in the thermal simulation chamber through the infrared-transmitting observation window.

9. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 1, characterized in that, The control module includes: a host computer and a server; The host computer is communicatively connected to the server. The host computer is respectively connected to the thermal simulation chamber, the heat layout board, the heat component, the distributed measurement module and the infrared thermal imaging module through a control bus, and is configured to control the working modes and working parameters of the thermal simulation chamber, the heat layout board, the heat component, the distributed measurement module and the infrared thermal imaging module according to the control information sent by the server. The server is communicatively connected to the thermal simulation chamber, the distributed measurement module and the infrared thermal imaging module, and the server can be communicatively connected to external devices. The server is configured to collect, store and process the chamber wall temperature data of the thermal simulation chamber, the pressure data and temperature data measured by the distributed measurement module, and the infrared image data obtained by the infrared thermal imaging module, and is configured to send control information to the host computer.

10. The satellite multi-physical field digital twin semi-physical simulation platform according to claim 9, characterized in that, System software is installed on the server. The system software is provided with an HMI interface, and the HMI interface can display the stored data according to user requirements.

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