Positioning method, detection method and detection system

Abstract

A positioning method, a detection method and a detection system, the positioning method comprises the following steps: detecting at least two adjacent reference points on the surface of a to-be-detected object, obtaining first coordinate information of a first to-be-detected area in a first coordinate system; obtaining a conversion relationship between the first coordinate system and a second coordinate system; and obtaining second coordinate information of the first to-be-detected area and other to-be-detected areas in the second coordinate system according to the conversion relationship, the first coordinate information of the first to-be-detected area in the first coordinate system and a periodic distribution rule of the to-be-detected areas. Since the detection is performed on a limited number of reference points, the positioning speed of the to-be-detected area can be improved, accurate positioning of the to-be-detected point can be realized according to the coordinate information of the to-be-detected area in the second coordinate system, and therefore, rapid and high-precision detection of the to-be-detected area of the to-be-detected object can be realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, and in particular to a positioning method, a testing method, and a testing system. Background Technology

[0002] With the development of modern industry, precision machining is being used in more and more fields; at the same time, the requirements for machining accuracy are becoming increasingly stringent. To meet these accuracy demands and improve the pass rate of machined samples, it is necessary to frequently test the machining process and the machined products for morphological distortion to ensure that the distortion is within tolerable limits. In distortion detection applications in precision machining, it is often necessary to detect the height, film thickness, or linewidth of designated measurement points on the test object (e.g., at critical locations). Existing technologies detect these points by scanning a large area of ​​the test object's surface. When the number of test points is small, this method significantly reduces detection efficiency. Detecting only the test points can effectively improve detection efficiency; however, when detecting specific test points, precise positioning of the test points is required to ensure detection accuracy. Existing technologies struggle to locate specific positions on the test object's surface, resulting in slow detection speeds and poor accuracy. Summary of the Invention

[0003] The problem solved by this invention is to provide a positioning method, detection method, and detection system that can improve the speed and accuracy of positioning the area to be tested.

[0004] To address the above problems, embodiments of the present invention provide a positioning method for locating a test area in an object to be tested, the method comprising:

[0005] A detection device is provided, the detection device having a first coordinate system;

[0006] The test object is provided, which has a second coordinate system; the surface of the test object has a reference point, which is a point that can be identified by the detection device.

[0007] The detection device is used to obtain the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system;

[0008] Based on the reference point coordinate information of the at least two adjacent reference points in the first coordinate system and the positional correspondence between the test area and the reference points, the first coordinate information of the first test area corresponding to the at least two reference points in the first coordinate system is obtained.

[0009] Obtain the transformation relationship between the first coordinate system and the second coordinate system;

[0010] Based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained.

[0011] Optionally, the object to be tested includes a plurality of periodically arranged test areas, and the at least two adjacent reference points include a first reference point;

[0012] The steps of acquiring the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system using the detection device include:

[0013] The area to be tested is initially positioned to obtain the initial arrangement direction of the area to be tested and the coordinates of the first reference point in the first coordinate system.

[0014] The detection device searches for other reference points based on the coordinates of the first reference point, the initial arrangement direction, and the arrangement period of the area to be tested, and obtains the reference point coordinate information of other reference points in the first coordinate system.

[0015] Optionally, the edge of the object to be measured has a reference mark, the line connecting the reference mark and the center point of the object to be measured represents the direction of the coordinate axis of the second coordinate system, and the center point of the object to be measured represents the position of the origin of the second coordinate system;

[0016] The steps of performing initial positioning processing on the area to be measured to obtain the initial arrangement direction of the area to be measured and the reference point coordinates of the first reference point in the first coordinate system include:

[0017] The edge of the object to be tested is scanned to obtain the edge contour information of the object to be tested;

[0018] The position coordinates of the center point of the object under test and the reference mark in the first coordinate system are obtained based on the edge contour.

[0019] The initial arrangement direction of the test area is obtained based on the center point of the object to be tested and the position coordinates of the reference mark in the first coordinate system.

[0020] Optionally, the test area of ​​the test object is arranged in a periodic array, and the initial arrangement direction of the test area includes a first arrangement direction and a second arrangement direction; the at least two adjacent reference points also include a second reference point and a third reference point;

[0021] The step of using a detection device to search for other reference points in the first coordinate system based on the coordinates of the reference points, the initial arrangement direction, and the arrangement period of the area to be tested, and obtaining the reference point coordinate information of other reference points in the first coordinate system includes:

[0022] The detection device obtains the next reference point adjacent to the first reference point in the first arrangement direction as the second reference point, and obtains the coordinates of the second reference point in the first coordinate system.

[0023] The detection device obtains the next reference point adjacent to the first reference point in the second arrangement direction as the third reference point, and obtains the coordinates of the third reference point in the first coordinate system.

[0024] Optionally, the step of obtaining the transformation relationship between the first coordinate system and the second coordinate system includes:

[0025] Based on the center point of the object under test and the position coordinates of the reference mark in the first coordinate system, the transformation relationship between the first coordinate system and the second coordinate system is obtained.

[0026] Optionally, the step of using the detection device to obtain the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system includes:

[0027] Acquire an image of the surface of the object to be tested;

[0028] Based on the obtained image of the surface of the object to be tested, obtain the reference point coordinate information of at least two adjacent reference points in the first coordinate system.

[0029] Optionally, the first reference point is located near the center point of the object to be tested.

[0030] Optionally, the at least two reference points include a first reference point, a second reference point, and a third reference point;

[0031] The steps for obtaining the first coordinate information of the first area to be tested in the first coordinate system include:

[0032] Based on the coordinates of the first reference point and the coordinates of the second reference point, obtain the first extension direction of the first test area and the first dimension of the first test area in the first extension direction;

[0033] Based on the coordinates of the first reference point and the coordinates of the third reference point, the second extension direction of the first test area and the second dimension of the first test area in the second extension direction are obtained.

[0034] Optionally, the number of the first reference point, the second reference point, and the third reference point are all multiple; the coordinates of the first reference point, the second reference point, and the third reference point are also multiple corresponding numbers; the...

[0035] The first extension direction, the second extension direction, the first dimension, and the second dimension are all in multiple corresponding quantities;

[0036] The steps of obtaining the first extension direction of the first test area and the first size of the first test area in the first extension direction include: obtaining the median of a plurality of first extension directions as the first extension direction of the first test area; and obtaining the median of a plurality of first sizes as the first size of the first test area in the first extension direction.

[0037] The steps of obtaining the second extension direction of the first test area and the second size of the first test area in the second extension direction include: obtaining the median of a plurality of second extension directions as the second extension direction of the first test area; and obtaining the median of a plurality of second sizes as the second size of the first test area in the second extension direction.

[0038] Optionally, any straight line is selected as a reference straight line, and the first extension direction is characterized by the first angle between the line connecting the first reference point and the second reference point and the reference straight line; the median of the plurality of first extension directions is the average, median or weighted average of the plurality of first angles.

[0039] The second extension direction is represented by the second angle between the line connecting the first reference point and the third reference point and the reference line; the median of the multiple second extension directions is the average, median, or weighted average of the multiple second angles;

[0040] The first dimension is the first distance between the first reference point and the second reference point; the median of the first dimension is the average, median, or weighted average of multiple first distances.

[0041] The second dimension is the second distance between the first reference point and the third reference point; the median of the second dimension is the average, median, or weighted average of multiple second distances.

[0042] Optionally, the reference point includes the center point of the feature structure, which has an edge line;

[0043] The steps for obtaining the coordinates of the reference point in the first coordinate system include:

[0044] Multiple points on the edge line of the feature structure are detected to obtain the coordinates of the multiple points on the edge of the feature structure in the first coordinate system;

[0045] The edge line of the feature structure is fitted based on the coordinates of multiple points on the edge of the feature structure in the first coordinate system to obtain the fitted edge line;

[0046] Based on the fitted edge line, obtain the coordinates of the reference point in the first coordinate system.

[0047] Optionally, the feature structure is a grating mark, a cross mark, or a ring mark;

[0048] Alternatively, the reference point may be a corner point of the area to be tested.

[0049] Optionally, the surface of the object to be tested has feature points; the step of obtaining the transformation relationship between the first coordinate system and the second coordinate system includes:

[0050] The detection device is used to obtain the feature point measurement coordinates of at least one of the feature points in the first coordinate system;

[0051] Obtain the feature point design coordinates of the at least one feature point in the second coordinate system;

[0052] Based on the measured coordinates and designed coordinates of the feature points, the transformation relationship between the first coordinate system and the second coordinate system is obtained.

[0053] Optionally, the edge of the object to be tested has a reference mark; the at least one feature point includes the center point of the object to be tested and the location of the reference mark;

[0054] The step of acquiring the feature point measurement coordinates of at least one of the feature points in the first coordinate system using the detection device includes:

[0055] The edge of the object to be tested is scanned to obtain the edge contour information of the object to be tested;

[0056] The center point of the object under test and the feature point coordinates of the reference mark in the first coordinate system are obtained based on the edge contour.

[0057] Optionally, the transformation relationship includes at least one of translation and rotation.

[0058] Optionally, the step of obtaining the second coordinate information of the first test area and other test areas in the second coordinate system based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area includes:

[0059] Based on the transformation relationship and the first coordinate information of the first test area in the first coordinate system, the second coordinate information of the first test area in the second coordinate system is obtained; based on the second coordinate information of the first test area in the second coordinate system and the periodic distribution pattern of the test area, the second coordinate information of other test areas in the second coordinate system is obtained.

[0060] Alternatively, based on the first coordinate information of the first test area in the first coordinate system and the periodic distribution pattern of the test area, the first coordinates of other test areas in the first coordinate system are obtained; based on the first coordinate information of the first test area and other test areas in the first coordinate system and the transformation relationship, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained.

[0061] Accordingly, embodiments of the present invention also provide a detection method, the detection method comprising:

[0062] A target detection device is provided, the target detection device having a third coordinate system;

[0063] The second target coordinate information of the test area of ​​the test object in the second coordinate system is obtained by the positioning method described in any of the above-mentioned methods;

[0064] Obtain the target transformation relationship between the third coordinate system and the second coordinate system;

[0065] Based on the target transformation relationship and the second target coordinate information, the third target coordinate information of the area to be measured in the third coordinate system is obtained;

[0066] The target detection device locates the area to be tested based on the coordinate information of the third target.

[0067] After the target detection device locates the area to be tested based on the third target coordinate information, it detects the area to be tested to obtain the physical information of the area to be tested.

[0068] Accordingly, embodiments of the present invention also provide a detection system, the detection system comprising:

[0069] The test area positioning module is suitable for obtaining the second coordinate information of the test area in the second coordinate system using the positioning method described above;

[0070] The transformation relationship acquisition module acquires the target transformation relationship between the third coordinate system and the second coordinate system.

[0071] The target coordinate acquisition module is adapted to acquire the third target coordinate information of the area to be measured in the third coordinate system based on the target transformation relationship and the second target coordinate information;

[0072] The target detection device has the third coordinate system and is adapted to locate the area to be tested according to the third target coordinate information, and to detect the area to be tested to obtain the physical information of the area to be tested.

[0073] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0074] The technical solution of this invention involves detecting at least two adjacent reference points on the surface of the object to be tested to obtain first coordinate information of the first test area in a first coordinate system. By obtaining the transformation relationship between the first and second coordinate systems, and based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, second coordinate information of the first test area and other test areas in the second coordinate system is obtained. Because the detection of a limited number of reference points improves the positioning speed of the test area, it allows for the determination of the test area based on the test area...

[0075] The coordinate information in the second coordinate system enables precise positioning of the point to be measured, thereby enabling rapid and high-precision detection of the area to be measured of the object.

[0076] Furthermore, the reference point includes the center point of the feature structure; by obtaining the coordinates of multiple points on the edge of the feature structure, the edge line of the feature structure is fitted to obtain the fitted edge line. This can cancel out the errors of the coordinates of multiple points during the fitting process, thereby improving the accuracy of the reference point detection and thus improving the accuracy of the obtained transformation relationship. Attached Figure Description

[0077] Figure 1 This is a flowchart illustrating an embodiment of the positioning method according to the present invention;

[0078] Figure 2 This is a flowchart illustrating another embodiment of the positioning method according to the present invention;

[0079] Figure 3 This is a schematic diagram showing the position of the test area of ​​the wafer under test constructed by the positioning method according to an embodiment of the present invention in the second coordinate system;

[0080] Figure 4 This is a flowchart illustrating an embodiment of the detection method according to the present invention;

[0081] Figure 5 This is a schematic diagram of the frame structure of an embodiment of the detection system according to the present invention. Detailed Implementation

[0082] One or more specific embodiments of the invention will be described below. To provide a concise description of these embodiments, not all features of the actual implementation may be described in the specification. It should be understood that in the development of any such actual implementation, as in any engineering or design project, numerous decisions must be made regarding the implementation to achieve the developer's specific objectives, such as compliance with system-related and business-related constraints, which may change from one implementation to another. Furthermore, it should be understood that such development efforts may be complex and time-consuming, but will be nothing more than routine work of design, fabrication, and manufacture to those skilled in the art who have the benefits of this disclosure.

[0083] As mentioned above, many precision-machined objects have a wide range of dimensions, requiring three-dimensional measurement to obtain their machining error information. Inspection speed is a crucial parameter in industrial applications. Since inspection time is directly proportional to the inspection area, and considering that surface distortion of the object under test can cause height variations in the surrounding area, error detection can be achieved by performing three-dimensional measurements on the test area at key locations (e.g., critical parts of the object that may produce errors). In this process, finding a reasonable measurement location and eliminating measurement errors caused by uneven placement of the object becomes the key focus. Traditional inspection methods require measuring all areas before obtaining the outline image of the object, thus failing to achieve rapid positioning and inspection.

[0084] The technical solution of this invention detects at least two adjacent reference points on the surface of the object under test to obtain the first coordinate information of the first test area in a first coordinate system. By obtaining the transformation relationship between the first and second coordinate systems, and based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained. Because the detection of a limited number of reference points improves the positioning speed of the test area, it enables precise positioning of the test point based on the coordinate information of the test area in the second coordinate system, thereby achieving rapid and high-precision detection of the test area of ​​the object under test.

[0085] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0086] It should be noted that "A represents B" in this application refers to the existence of a known relationship between two features A and B before and after representation.

[0087] Figure 1 A flowchart illustrating an embodiment of the positioning method according to the present invention is shown. (Refer to...) Figure 1 This invention provides

[0088] A positioning method for locating the test area of ​​an object, which may specifically include the following steps:

[0089] Step S101: Provide a detection device, the detection device having a first coordinate system;

[0090] Step S102: Provide a test object, the test object having a second coordinate system; the surface of the test object has a reference point, the reference point being a point that can be identified by the detection device;

[0091] Step S103: Use the detection device to obtain the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system;

[0092] Step S104: Based on the reference point coordinate information of the at least two adjacent reference points in the first coordinate system and the positional correspondence between the test area and the reference points, obtain the first coordinate information of the first test area corresponding to the at least two reference points in the first coordinate system.

[0093] Step S105: Obtain the transformation relationship between the first coordinate system and the second coordinate system;

[0094] Step S106: Based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, obtain the second coordinate information of the first test area and other test areas in the second coordinate system.

[0095] The above-mentioned scheme can improve the positioning speed of the test area by detecting a limited number of reference points. It can achieve accurate positioning of the test point based on the coordinate information of the test area in the second coordinate system, thereby enabling fast and high-precision detection of the test area of ​​the test object.

[0096] The following description, in conjunction with the accompanying drawings, provides a more detailed account of a positioning method according to an embodiment of the present invention.

[0097] Figure 2 A flowchart illustrating another embodiment of the positioning method according to the present invention is shown. Please refer to... Figure 2 The positioning method includes:

[0098] Step S201 is executed, providing a detection device, which has a first coordinate system.

[0099] In this embodiment, the detection device includes an imaging apparatus. Specifically, the imaging apparatus includes a bright-field imaging apparatus or a dark-field imaging apparatus. For example, the imaging apparatus can be a telecentric imaging apparatus. The telecentric imaging apparatus only collects light parallel to the optical axis for imaging, so that the magnification is not affected by the position of the object under test, ensuring contour accuracy. The imaging apparatus may include any suitable imaging apparatus capable of implementing the measurement method of the present invention (e.g., capable of achieving sufficient contour accuracy measurement). In other embodiments, the imaging apparatus may also be a microscope, etc. The detection device may also include other measurement hardware, such as a moving platform, optical measurement components, etc.

[0100] The first coordinate system includes a first coordinate axis and a second coordinate axis. The plane formed by the first and second coordinate axes is the first coordinate plane. Specifically, the first coordinate system adopts a Cartesian coordinate system.

[0101] The first coordinate plane is the measurement plane of the imaging device. The imaging device is used to acquire an image of the object under test in the first coordinate plane. The image of the object under test in the first coordinate plane includes the position coordinate information of the object under test in the first coordinate plane.

[0102] In step S202, a test object is provided, which has a second coordinate system; the surface of the test object has a reference point, which is a point that can be identified by the detection device.

[0103] In this embodiment, the plane on which the object to be tested is placed is parallel to or coincides with the first coordinate plane, so that the imaging device can acquire an image of the object to be tested.

[0104] In this embodiment, the object to be tested is placed on a stage, and the surface of the stage supporting the object to be tested is parallel to or coincides with the first coordinate plane.

[0105] The second coordinate system includes a third coordinate axis and a fourth coordinate axis. The plane formed by the third and fourth coordinate axes is called the second coordinate plane. Specifically, the second coordinate system adopts a Cartesian coordinate system.

[0106] The second coordinate system is a self-built coordinate system of the object under test. Specifically, the edge of the object under test has a reference mark, the center point of the object under test is used to characterize the origin position of the second coordinate system, and the line connecting the center point of the object under test and the reference mark characterizes the direction of the third or fourth coordinate axis of the second coordinate plane. Wherein, the line connecting the center point of the object under test and the reference mark characterizes the direction of the third or fourth coordinate axis of the second coordinate plane by meaning that the line connecting the center point of the object under test and the reference mark has a known angle with the third or fourth coordinate axis, and the known angle is zero, a right angle, or an obtuse angle.

[0107] In this embodiment, the reference point is a point in the feature structure of the surface of the object to be tested. The imaging device can determine the feature structure based on corresponding detection information, and then determine the reference point through the determined feature structure. In other embodiments, the reference point can also be a corner point of the test area on the surface of the object to be tested, etc.

[0108] Execute step S203, using the detection device to obtain the reference point coordinate information of at least two adjacent reference points of the object under test in the first coordinate system.

[0109] The test object comprises multiple periodically arranged test areas, and the at least two reference points include a first reference point. The step of acquiring the reference point coordinates of at least two adjacent reference points in the test object under the first coordinate system using the detection device includes: performing initial positioning processing on the test areas to obtain the initial arrangement direction of the test areas and the first reference point coordinates under the first coordinate system; and using the detection device to search for other reference points based on the first reference point coordinates, the initial arrangement direction, and the arrangement period of the test areas to obtain the reference point coordinates of other reference points under the first coordinate system. The initial arrangement direction refers to the arrangement direction of the test areas in the design layout of the test object, which has a predetermined angle with the arrangement direction of the test areas in the actual production process. The predetermined angle is zero or an acute angle.

[0110] In this embodiment, the edge of the object to be measured has a reference mark. The line connecting the reference mark and the center point of the object to be measured represents the direction of the coordinate axis of the second coordinate system, and the center point of the object to be measured represents the origin of the second coordinate system. The line connecting the center point of the object to be measured and the reference mark represents the direction of the third or fourth coordinate axis of the second coordinate plane by meaning that the line connecting the center point of the object to be measured and the reference mark has a known angle with the third or fourth coordinate axis, where the known angle is zero, a right angle, or an obtuse angle. The center point of the object to be measured representing the origin of the second coordinate system means that there is a preset offset between the center point of the object to be measured and the origin of the second coordinate system, where the preset offset is zero or greater than zero and less than the distance between the center point of the object to be measured and a point on the edge of the object to be measured.

[0111] The steps of performing initial positioning processing on the area to be tested and obtaining the initial arrangement direction of the area to be tested and the coordinates of the first reference point in the first coordinate system include: scanning the edge of the object to be tested to obtain the edge contour information of the object to be tested; obtaining the position coordinates of the center point of the object to be tested and the reference mark in the first coordinate system based on the edge contour; and obtaining the initial arrangement direction of the area to be tested based on the position coordinates of the center point of the object to be tested and the reference mark in the first coordinate system.

[0112] In this embodiment, the object to be tested is a wafer, and the reference mark is a notch mark set on the edge of the wafer. In the wafer under test, the line connecting the center point of the wafer to be tested and the notch mark is used to characterize the direction of the third coordinate axis or the fourth coordinate axis of the second coordinate system. The fact that the line connecting the center point of the wafer to be tested and the notch mark characterizes the direction of the third coordinate axis or the fourth coordinate axis of the second coordinate system means that there is a known predetermined angle between the line connecting the center point of the wafer to be tested and the third coordinate axis or the fourth coordinate axis of the second coordinate system, where the known predetermined angle is zero, an acute angle, a right angle, or an obtuse angle.

[0113] In this embodiment, the line connecting the center point of the object under test and the reference mark is also used to characterize the arrangement direction of the test area.

[0114] In this embodiment, the initial arrangement direction includes a first arrangement direction and a second arrangement direction. The line connecting the center point of the object under test and the reference mark is also used to characterize the arrangement direction of the area under test, including: the line connecting the center point of the object under test and the reference mark has a first preset angle with the first arrangement direction, wherein the first preset angle is zero, a right angle, an acute angle, or an obtuse angle; or, the first arrangement direction and the second arrangement direction have a second preset angle.

[0115] The step of obtaining the initial arrangement direction of the test area based on the position coordinates of the center point of the test object and the reference mark in the first coordinate system includes: obtaining the direction of the line connecting the center point of the test object and the reference mark based on the position coordinates of the center point of the test object and the reference mark in the first coordinate system; and obtaining the initial arrangement direction based on the direction of the line, a first preset angle, and a second preset angle.

[0116] Specifically, when the first preset angle is zero, the direction of the line connecting the center point of the object under test and the reference mark is taken as the first arrangement direction of the initial arrangement direction, and the direction perpendicular to the first arrangement direction in the second coordinate plane is taken as the second arrangement direction. In other words, the initial arrangement direction is the direction of the third and fourth coordinate axes of the second coordinate plane.

[0117] In other embodiments, the test object includes multiple periodically arranged test areas, which are arranged along the same direction, i.e., the initial arrangement direction includes only a first arrangement direction or a second arrangement direction. The line connecting the center point of the test object and a reference mark has a third preset angle with the arrangement direction of the test object. The step of obtaining the initial arrangement direction of the test area based on the position coordinates of the center point of the test object and the reference mark in a first coordinate system includes: obtaining the direction of the line connecting the center point of the test object and the reference mark in the first coordinate system based on the position coordinates of the center point of the test object and the reference mark; and obtaining the initial arrangement direction based on the direction of the line and the third preset angle.

[0118] Theoretically, the arrangement direction of the test areas in a wafer is along the third and fourth coordinate axes. However, in actual production, the arrangement direction of the test areas in a wafer often deviates to some extent from the third and fourth coordinate axes. Therefore, by using the position coordinates of the center point of the test object and the notch mark in the first coordinate system, the initial arrangement direction is obtained to determine the approximate arrangement direction of the test areas in the wafer under test, thus preparing for subsequent searching for other reference points adjacent to the first reference point along the initial arrangement direction.

[0119] The step of using a detection device to search for other reference points based on the coordinates of the first reference point, the initial arrangement direction, and the arrangement period of the area to be tested, and obtaining the reference point coordinates of other reference points in the first coordinate system includes: using the detection device to obtain the next reference point adjacent to the first reference point in the first arrangement direction as the second reference point, and obtaining the second reference point coordinates in the first coordinate system; using the detection device to obtain the next reference point adjacent to the first reference point in the second arrangement direction as the third reference point, and obtaining the third reference point coordinates in the first coordinate system.

[0120] In this embodiment, the reference point is a point within the feature structure. The size of the feature structure is smaller than the field of view of the detection device. An image of the entire surface of the feature structure can be acquired in a single photograph, thereby obtaining the coordinates of the feature structure in a first coordinate system. Furthermore, the coordinates of the reference point within the feature structure in the first coordinate system can be determined using these coordinates.

[0121] In this embodiment, the test object is a wafer, the reference point includes the center of symmetry of the feature structure, and the feature structure has an edge line.

[0122] The step of obtaining the coordinates of the reference point in the first coordinate system includes: detecting multiple points on the edge line of the feature structure, and obtaining the coordinates of the multiple points on the edge of the feature structure in the first coordinate system; according to

[0123] The coordinates of multiple points on the edge of the feature structure in the first coordinate system are used to fit the edge line of the feature structure to obtain the fitted edge line; based on the fitted edge line, the coordinates of the reference point in the first coordinate system are obtained.

[0124] By obtaining the coordinates of multiple points on the edge of the feature structure and fitting the edge line of the feature structure to obtain the fitted edge line, the errors of the coordinates of multiple points can be canceled out during the fitting process, thereby improving the accuracy of reference point detection.

[0125] Specifically, the first reference point is a point in the first feature structure.

[0126] The steps for obtaining the coordinates of the first reference point include: detecting multiple points on the edge line of the first feature structure to obtain the coordinates of the multiple points on the edge of the first feature structure in the first coordinate system; fitting the edge line of the first feature structure based on the coordinates of the multiple points on the edge of the first feature structure in the first coordinate system to obtain a first fitted edge line; and obtaining the coordinates of the first reference point in the first coordinate system based on the first fitted edge line.

[0127] The second reference point is a point within the second feature structure. The second feature structure is adjacent to the first feature structure in the first arrangement direction. Correspondingly, the second reference point is adjacent to the first reference point in the first arrangement direction.

[0128] The steps for obtaining the coordinates of the second reference point include: detecting multiple points on the edge line of the second feature structure to obtain the coordinates of the multiple points on the edge of the second feature structure in the first coordinate system; fitting the edge line of the second feature structure based on the coordinates of the multiple points on the edge of the second feature structure in the first coordinate system to obtain a second fitted edge line; and obtaining the coordinates of the second reference point in the first coordinate system based on the second fitted edge line.

[0129] The third reference point is a point within the corresponding third feature structure. The third feature structure is adjacent to the first feature structure in the second arrangement direction. Correspondingly, the third reference point is adjacent to the first reference point in the second arrangement direction.

[0130] The step of obtaining the coordinates of the third reference point includes: detecting multiple points on the edge line of the third feature structure to obtain the coordinates of the multiple points on the edge of the third feature structure in the first coordinate system; fitting the edge line of the third feature structure according to the coordinates of the multiple points on the edge of the third feature structure in the first coordinate system to obtain a third fitted edge line; and obtaining the coordinates of the third reference point in the third coordinate system according to the third fitted edge line.

[0131] In this embodiment, the object to be tested is a wafer, and the feature structure is a grating-shaped mark. In other embodiments, the feature structure can also be a cross-shaped mark, a ring mark, etc.

[0132] Before obtaining the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system, the positioning method further includes: placing the object under test on the stage using an alignment device and aligning the object under test with the stage so that the object under test is in the first coordinate system.

[0133] In this embodiment, the first coordinate system includes a first coordinate axis and a second coordinate axis. Accordingly, the reference point coordinate information includes a first coordinate value along the first coordinate axis and a second coordinate value along the second coordinate axis.

[0134] The above is an exemplary embodiment of using the detection device to obtain the reference point coordinate information of at least two adjacent reference points in the test object in the first coordinate system. In other embodiments, it is also possible to obtain the reference point coordinate information of at least two adjacent reference points in the first coordinate system by capturing an image of the surface of the test object and obtaining the reference point coordinate information of at least two adjacent reference points in the first coordinate system based on the acquired image of the surface of the test object.

[0135] In other embodiments, the step of obtaining the reference point coordinate information of at least two adjacent reference points in the test object in the first coordinate system includes: obtaining the center coordinates of the center of the test object in the first coordinate system; obtaining a reference point adjacent to the center of the test object as a first reference point based on the center coordinates; and obtaining a second reference point and / or a third reference point based on the first reference point and the period of the test area. The step of obtaining the second reference point and / or the third reference point based on the first reference point and the period of the test area includes: obtaining a reference circle with the first reference point as the center and the radius of the period of the test area; and obtaining the second reference point and / or the third reference point within a preset distance from the edge of the reference circle.

[0136] The reference points on the surface of the object under test have a preset positional correspondence with the area under test. The coordinates of at least two adjacent reference points on the object under test in the first coordinate system are obtained, so as to determine the coordinates of the first area under test corresponding to the at least two adjacent reference points in the first coordinate system in subsequent steps.

[0137] Execute step S204, and obtain the first coordinate information of the first test area corresponding to the at least two adjacent reference points in the first coordinate system based on the reference point coordinates of the at least two adjacent reference points in the first coordinate system.

[0138] In this embodiment, the at least two reference points include a first reference point, a second reference point, and a third reference point.

[0139] Obtaining the first coordinate information of the first test area corresponding to the at least two reference points in the first coordinate system includes: obtaining the first extension direction of the first test area and the first dimension of the first test area in the first extension direction based on the coordinates of the first reference point and the second reference point; obtaining the second extension direction of the first test area and the second dimension of the first test area in the second extension direction based on the coordinates of the first reference point and the third reference point.

[0140] In this embodiment, the object to be tested is a wafer, the area to be tested is a patterned area formed on the surface of the wafer, the feature structure is a grating-shaped mark, and the reference point is the center of symmetry of the grating-shaped mark. In the wafer to be tested, the grating-shaped mark and the area to be tested have a preset relative positional relationship, and the periodic distribution patterns of the grating-shaped mark and the area to be tested are the same.

[0141] When obtaining the coordinates of at least two adjacent reference points in the first coordinate system, it is also equivalent to obtaining the coordinates of the centers of symmetry of at least two adjacent grating marks in the first coordinate system. By obtaining the coordinates of the centers of symmetry of at least two adjacent grating marks in the first coordinate system, the coordinates of the first test area in the first coordinate system can be obtained based on the preset relative positional relationship between the grating marks and the test area.

[0142] Specifically, the direction from the first reference point to the second reference point is taken as the first extension direction of the first test area, and the direction from the first reference point to the third reference point is taken as the second extension direction of the first test area; the distance between the first reference point and the second reference point is taken as the first dimension of the first test area in the first extension direction, and the distance between the first reference point and the third reference point is taken as the second dimension of the first test area in the second extension direction.

[0143] When the first extension direction of the first test area, the second extension direction of the first test area, the first dimension of the first test area in the first extension direction, and the second dimension of the first test area in the second extension direction are determined, the first coordinate information of the first test area in the first coordinate system can be determined.

[0144] In this embodiment, the object to be tested is a wafer, and the first reference point is a reference point near the center point of the surface of the wafer to be tested. Accordingly, the step of selecting a reference point from the surface of the object to be tested as the first reference point using a detection device includes: obtaining the edge contour of the object to be tested; obtaining the center point of the object to be tested based on the edge contour; and selecting a reference point near the center point of the object to be tested as the first reference point.

[0145] By selecting a reference point near the center point of the wafer surface under test as the first reference point, the first test area determined by at least two adjacent reference points is also located near the center point of the wafer under test, enabling subsequent...

[0146] When determining the positions of other test areas by taking the first test area as the starting point, the impact of the positioning error of the first test area on the positioning of other test areas can be reduced, thereby improving the positioning accuracy of the test areas.

[0147] In this embodiment, there are multiple first reference points, meaning that multiple reference points are selected as first reference points. Correspondingly, the second and third reference points correspond one-to-one with the first reference points, meaning that there are also multiple second and third reference points.

[0148] Correspondingly, there are also multiple coordinates of the first reference point, the second reference point, and the third reference point; there are also multiple coordinates of the first extension direction, the second extension direction, the first dimension of the first area to be tested in the first extension direction, and the second dimension of the first area to be tested in the second extension direction.

[0149] The steps of obtaining the first extension direction of the first test area and the first size of the first test area in the first extension direction include: obtaining the median of a plurality of first extension directions as the first extension direction of the first test area; and obtaining the median of a plurality of first sizes as the first size of the first test area in the first extension direction.

[0150] The steps of obtaining the second extension direction of the first test area and the second size of the first test area in the second extension direction include: obtaining the median of a plurality of second extension directions as the second extension direction of the first test area; and obtaining the median of a plurality of second sizes as the second size of the first test area in the second extension direction.

[0151] Wherein, any straight line is selected as the reference straight line, and the first extension direction is characterized by the first angle between the line connecting the first reference point and the second reference point and the reference straight line. Accordingly, the median value of the plurality of first extension directions is the average value, median value, or weighted average value of the plurality of first angles.

[0152] The second extension direction is characterized by a second angle between the line connecting the first reference point and the third reference point and the reference line. Accordingly, the median of the plurality of second extension directions is the average, median, or weighted average of the plurality of second angles.

[0153] The first dimension is the first distance between the first reference point and the second reference point. Accordingly, the median of the first dimension is the average, median, or weighted average of a plurality of the first distances.

[0154] The second dimension is the second distance between the first reference point and the third reference point. Accordingly, the median of the second dimension is the average, median, or weighted average of a plurality of second distances.

[0155] By setting the number of first reference points, second reference points, and third reference points to multiple, multiple first extension directions, multiple second extension directions, multiple first dimensions, and multiple second dimensions can be obtained. This allows for the acquisition of the median values ​​of the multiple first extension directions, the multiple second extension directions, the multiple first dimensions, and the multiple second dimensions. The median value of the multiple first extension directions is used as the first extension direction, the median value of the multiple second extension directions is used as the second extension direction, the median value of the multiple first dimensions is used as the first dimension of the first area to be tested in the first extension direction, and the median value of the multiple second dimensions is used as the second dimension of the first area to be tested in the second extension direction. This improves the detection accuracy of the first extension direction, the second extension direction, the first dimension of the first area to be tested in the first extension direction, and the second dimension of the first area to be tested in the second extension direction, thereby improving the positioning accuracy of the first area to be tested in the first coordinate system.

[0156] In this embodiment, the reference line is the line connecting the center point of the object under test and the reference mark. In other embodiments, the reference line may be any other line selected from the test area, and there is no limitation herein.

[0157] In this embodiment, the object to be tested is a wafer, the area to be tested is a patterned area formed on the surface of the wafer, the feature structure is a grating-shaped mark, and the reference point is the center of symmetry of the grating. When determining the first extension direction, the second extension direction, the first dimension of the first area to be tested in the first extension direction, and the second dimension of the first area to be tested in the second extension direction, the first coordinate position of the first area to be tested in the first coordinate system can be determined by taking the first reference point as the starting point.

[0158] The above example, using at least two reference points (including a first reference point, a second reference point, and a third reference point), describes the process of obtaining the first coordinate information of the first test area corresponding to the at least two reference points in the first coordinate system. In other embodiments, it is also possible to obtain the reference point coordinate information of only two adjacent reference points in the initial arrangement direction in the first coordinate system to obtain the first coordinate information of the corresponding first test area in the first coordinate system.

[0159] Specifically, the two adjacent reference points in the initial arrangement direction include a first reference point and a second reference point. The direction of the line connecting the first reference point and the second reference point is taken as the first extension direction of the corresponding first test area, and the direction perpendicular to the first extension direction in the coordinate plane is taken as the second extension direction of the first test area. Based on the known size of the test area, the first coordinate information of the corresponding first test area in the first coordinate system can be obtained.

[0160] In other embodiments, the test areas are arranged only along one direction, and the positioning method may only include obtaining the first size and the first extension direction; obtaining the position information of other test areas based on the first size and the first extension direction; or, it may only include obtaining the second size and the second extension direction, and obtaining the position information of other test areas based on the second size and the second extension direction.

[0161] Execute step S205 to obtain the transformation relationship between the first coordinate system and the second coordinate system.

[0162] The surface of the object to be tested has at least one feature point, which is a point that the detection device can identify.

[0163] The step of obtaining the transformation relationship between the first coordinate system and the second coordinate system includes: using the detection device to obtain the feature point measurement coordinates of at least one feature point in the first coordinate system; obtaining the feature point design coordinates of the at least one feature point in the second coordinate system; and obtaining the transformation relationship between the first coordinate system and the second coordinate system based on the feature point measurement coordinates and the feature point design coordinates.

[0164] The transformation relationship between the first coordinate system and the second coordinate system includes at least one of translation and rotation. Specifically, when the coordinate axes of the first coordinate plane and the second coordinate plane are parallel and have the same positive direction, the transformation relationship between the first coordinate system and the second coordinate system may only include translation; otherwise, the transformation relationship between the first coordinate system and the second coordinate system includes both translation and rotation.

[0165] In this embodiment, the transformation relationship includes rotation and translation. Accordingly, the at least one feature point includes two or more feature points. Specifically, the at least one feature point includes the center point of the object under test and the location of the reference mark.

[0166] The step of obtaining the feature point measurement coordinates of at least one feature point in the first coordinate system using the detection device includes: scanning the edge of the object to be measured to obtain the edge contour information of the object to be measured; and obtaining the feature point measurement coordinates of the center point of the object to be measured and the reference mark in the first coordinate system based on the edge contour.

[0167] The design coordinates of the center point of the object to be measured and the feature points of the reference mark in the second coordinate system are known quantities.

[0168] In this embodiment, obtaining the feature point measurement coordinates of at least one feature point in the first coordinate system using the detection device can be the same step as obtaining the reference point coordinates of at least two adjacent reference points in the object under test in the first coordinate system using the detection device, thereby simplifying the calculation process. In other embodiments, obtaining the feature point measurement coordinates of at least one feature point in the first coordinate system using the detection device can be the same as obtaining the reference point coordinates of at least two adjacent reference points in the object under test in the first coordinate system using the detection device, and these steps can be different.

[0169] The center point of the object under test and the location of the reference mark are respectively taken as the first feature point and the second feature point; the step of obtaining the rotation relationship includes: obtaining the first displacement vector of the first feature point relative to the second feature point in the first coordinate system; obtaining the second displacement vector of the first feature point relative to the second feature point in the second coordinate system; and obtaining the rotation relationship based on the angle between the first displacement vector and the second displacement vector.

[0170] The steps for obtaining the first displacement vector include: obtaining the measured coordinates of the first feature point in the first coordinate system; obtaining the measured coordinates of the second feature point in the first coordinate system; and obtaining the difference between the measured coordinates of the first feature point and the measured coordinates of the second feature point to obtain the first displacement vector.

[0171] The steps for obtaining the second displacement vector include: obtaining the design coordinates of the first feature point in the second coordinate system; obtaining the coordinates of the second feature point in the second coordinate system; and obtaining the difference between the design coordinates of the first feature point and the design coordinates of the second feature point to obtain the second displacement vector.

[0172] After obtaining the rotation relationship, the step of obtaining the translation relationship includes: rotating the measured coordinates of the first feature point using the rotation relationship to obtain the measured coordinates of the third feature point; and obtaining the translation vector based on the difference between the measured coordinates of the third feature point and the measured coordinates of the first feature point. The rotation of the measured coordinates of the first feature point using the rotation relationship eliminates the influence of the rotation relationship on the translation relationship.

[0173] The translation relationship includes: a first distance between the first coordinate system and the second coordinate system along the first coordinate axis; and a second distance between the first coordinate system and the second coordinate system along the second coordinate axis. The steps for obtaining the translation relationship include: obtaining the component of the translation vector in the first direction to obtain the first distance; and obtaining the component of the translation vector in the second direction to obtain the second distance.

[0174] In this embodiment, the first feature point is the center point of the wafer under test, and the second feature point is the location of the notch mark on the wafer under test. The second coordinate system is a self-built coordinate system of the wafer under test, and the coordinates of the center point and the notch mark of the wafer under test in the second coordinate system are known quantities, that is, the designed coordinates of the first feature point and the designed coordinates of the second feature point are both known quantities.

[0175] In this embodiment, the transformation relationship between the first coordinate system and the second coordinate system is obtained, that is, the transformation relationship between the first coordinate plane and the second coordinate plane is obtained.

[0176] Obtain the transformation relationship between the first coordinate system and the second coordinate system to prepare for the subsequent transformation of the first coordinate information of the first area to be measured in the first coordinate system to the second coordinate system.

[0177] Execute step S206 to obtain the second coordinate information of the first test area in the second coordinate system based on the transformation relationship and the first coordinate information of the first test area in the first coordinate system.

[0178] By obtaining the transformation relationship between the first coordinate system and the second coordinate system, and based on the transformation relationship and the first coordinate information of the area to be tested in the first coordinate system, the second coordinate information of the first area to be tested in the second coordinate system can be obtained.

[0179] Specifically, the transformation relationship between the first coordinate system and the second coordinate system can be represented by a transformation matrix. Using this transformation matrix, the coordinates of the same location in the first test area under the first coordinate system can be transformed to the second coordinate system, thus obtaining the second coordinate information of the first test area under the second coordinate system.

[0180] The second coordinate information of the first test area in the second coordinate system is obtained to prepare for obtaining the second coordinate information of other test areas in the second coordinate system, starting from the first test area.

[0181] Execute step S207: Based on the second coordinate information of the first test area and the periodic distribution pattern of the test area, obtain the second coordinate information of other test areas in the second coordinate system.

[0182] When the second coordinates of the first test area in the second coordinate system are obtained, the periodic distribution pattern of the test areas can be used to obtain the second coordinates of other test areas in the second coordinate system, starting from the first test area.

[0183] By performing steps S201 to S207 above, the second coordinate information of the test area of ​​the wafer under test in the second coordinate system can be quickly established. Please refer to... Figure 3 The diagram shows the position of the test area of ​​the wafer under test constructed by the positioning method in the embodiment of the present invention in the second coordinate system (second coordinate plane), wherein the squares represent the test areas on the surface of the wafer under test.

[0184] The above is an exemplary embodiment of the present invention for locating the position of the area to be measured in the second coordinate system of the object itself. Positioning methods that obtain the position information of the area to be measured in the second coordinate system by other means based on the reference point coordinate information of at least two adjacent reference points are still within the protection scope of the present invention.

[0185] For example, in other embodiments, the step of obtaining the second coordinate information of the first test area and other test areas in the second coordinate system based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area may further include: obtaining the first coordinate information of other test areas in the first coordinate system based on the first coordinate information of the first test area in the first coordinate system and the periodic distribution pattern of the test area; and obtaining the second coordinate information of the first test area and other test areas in the second coordinate system based on the first coordinates of the first test area and other test areas in the first coordinate system and the transformation relationship.

[0186] The key point of the process for obtaining the position information of the area to be measured in the second coordinate system according to the present invention is to quickly and accurately establish the location of the area to be measured based on the coordinate information of a very small number of points in the first coordinate system. Furthermore, the steps of the embodiments according to the present invention can be reordered, combined, and interchanged.

[0187] Accordingly, this invention also provides a detection method.

[0188] Figure 4 A schematic flowchart of a detection method according to an embodiment of the present invention is shown. Please refer to [link / reference]. Figure 4 A detection method, specifically including:

[0189] Step S401: Provide a target detection device, the target detection device having a third coordinate system;

[0190] Step S402: Use the positioning method to obtain the second target coordinate information of the test area of ​​the test object in the second coordinate system;

[0191] Step S403: Obtain the target transformation relationship between the third coordinate system and the second coordinate system;

[0192] Step S404: Based on the target transformation relationship and the second target coordinate information, obtain the third target coordinate information of the area to be measured in the third coordinate system;

[0193] Step S405: The target detection device locates the area to be tested based on the third target coordinate information;

[0194] Step S406: After the target detection device locates the area to be tested based on the third target coordinate information, the target detection device detects the area to be tested to obtain the physical information of the area to be tested.

[0195] In this embodiment, the target detection device can locate the test area based on the third target coordinate information of the test area of ​​the test object in the third coordinate system.

[0196] In this embodiment, by obtaining the coordinates of at least two adjacent reference points in the first coordinate system, the first coordinates of the corresponding first test area in the first coordinate system are obtained. Furthermore, by obtaining the transformation relationship between the first and second coordinate systems, and based on this transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained. This enables rapid and high-precision measurement of the test area of ​​the object under test based on the second test area coordinate information. Specifically, obtaining the second target coordinate information of the test area of ​​the object under test in the second coordinate system...

[0197] For information location methods, please refer to the previous section for an introduction, which will not be repeated here.

[0198] The third coordinate system and the second coordinate system have a target transformation relationship. This target transformation relationship can be represented by a target transformation matrix. According to the target transformation matrix, the coordinates of the same location in the measured area in the second coordinate system and its coordinates in the third coordinate system satisfy the following relationship:

[0199] (1)

[0200] or:

[0201] (2)

[0202] in, This represents the coordinates of the location in the area to be measured in the third coordinate system. This represents the coordinates of the same location in the area to be measured in the second coordinate system. This represents the target transformation matrix between the third coordinate system and the second coordinate system. Transformation matrix for target The inverse matrix.

[0203] In other words, the coordinates of the same location in the area to be measured in the third coordinate system. In the second coordinate system Transformation matrix The conversion can be performed conveniently, that is, the target transformation matrix can be used to transform the first coordinate information of the test area in the first coordinate system to the second coordinate system, and obtain the third target coordinate information of the test area in the third coordinate system.

[0204] The physical information includes one or more of the following: the width, thickness, and three-dimensional coordinates of the target within the test area. Accordingly, when the physical information includes the thickness of the target, the target detection device further includes a thickness detection module. The thickness detection module includes an ellipsometer or a spectrophotometer. The thickness detection module has the third coordinate system.

[0205] The method for obtaining the target transformation relationship between the third coordinate system and the second coordinate system is the same as the method for obtaining the transformation relationship between the first coordinate system and the second coordinate system described above, and will not be repeated here.

[0206] Accordingly, embodiments of the present invention also provide a detection system.

[0207] Figure 5 A schematic diagram of the framework structure of a detection system according to an embodiment of the present invention is shown. Please refer to... Figure 5 A detection system 50 includes a target area positioning module 501, a conversion relationship acquisition module 502, and a target detection device 503, wherein:

[0208] The test area positioning module 501 is adapted to obtain the second coordinate information of the test area in the second coordinate system using the positioning method described above. The positioning method is described in detail in the foregoing section and will not be repeated here.

[0209] The transformation relationship acquisition module 502 acquires the target transformation relationship between the third coordinate system and the second coordinate system.

[0210] The target detection device 503 has the third coordinate system and is adapted to locate the area to be tested according to the third target coordinate information, and to detect the area to be tested to obtain the physical information of the area to be tested. The detection method is described in the foregoing section and will not be repeated here.

[0211] The foregoing description only mentions preferred embodiments of the invention. However, the invention is not limited to the specific embodiments described herein. Those skilled in the art will readily appreciate that various obvious modifications, adjustments, and substitutions can be made to these embodiments to suit specific circumstances without departing from the spirit of the invention. In fact, the scope of protection of the invention is defined by the claims and may include other examples that are foreseeable to those skilled in the art. Such other examples will fall within the scope of protection of the claims if they have structural elements that are indistinguishable from the literal language of the claims, or if they include equivalent structural elements that are not significantly different from the literal language of the claims.

[0212] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A positioning method for locating a test area in an object to be tested, characterized in that, include: A detection device is provided, the detection device having a first coordinate system; The test object is provided, the test object has a second coordinate system; the surface of the test object has a reference point, the reference point is a point that can be identified by the detection device, and the test object includes a plurality of periodically arranged test areas; The test area is initially positioned to obtain the initial arrangement direction of the test area and the coordinates of the first reference point in the first coordinate system. The detection device searches for the second reference point and the third reference point according to the coordinates of the first reference point, the initial arrangement direction and the arrangement period of the test area to obtain the reference point coordinate information of the second reference point and the third reference point in the first coordinate system. The first reference point is located near the center point of the test object. Based on the reference point coordinates of adjacent first, second, and third reference points in the first coordinate system and the positional correspondence between the area to be tested and the reference points, the first extension direction of the first area to be tested and the first dimension of the first area to be tested in the first extension direction are obtained based on the coordinates of the first and second reference points; the second extension direction of the first area to be tested and the second dimension of the first area to be tested in the second extension direction are obtained based on the coordinates of the first and third reference points. Obtain the transformation relationship between the first coordinate system and the second coordinate system; Based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained.

2. The positioning method according to claim 1, characterized in that, The edge of the object to be measured has a reference mark, and the line connecting the reference mark and the center point of the object to be measured represents the direction of the coordinate axis of the second coordinate system. The center point of the object to be measured represents the position of the origin of the second coordinate system. The steps of performing initial positioning processing on the area to be measured to obtain the initial arrangement direction of the area to be measured and the reference point coordinates of the first reference point in the first coordinate system include: The edge of the object to be tested is scanned to obtain the edge contour information of the object to be tested; The position coordinates of the center point of the object under test and the reference mark in the first coordinate system are obtained based on the edge contour. The initial arrangement direction of the test area is obtained based on the center point of the object to be tested and the position coordinates of the reference mark in the first coordinate system.

3. The positioning method according to claim 1 or 2, characterized in that, The test area of ​​the test object is arranged in a periodic array, and the initial arrangement direction of the test area includes a first arrangement direction and a second arrangement direction; The step of using a detection device to search for other reference points in the first coordinate system based on the coordinates of the reference points, the initial arrangement direction, and the arrangement period of the area to be tested, and obtaining the reference point coordinate information of other reference points in the first coordinate system includes: The detection device obtains the next reference point adjacent to the first reference point in the first arrangement direction as the second reference point, and obtains the coordinates of the second reference point in the first coordinate system. The detection device acquires the next reference point adjacent to the first reference point in the second arrangement direction. As a third reference point, the coordinates of the third reference point in the first coordinate system are obtained.

4. The positioning method according to claim 2, characterized in that, The steps for obtaining the transformation relationship between the first coordinate system and the second coordinate system include: Based on the center point of the object under test and the position coordinates of the reference mark in the first coordinate system, the transformation relationship between the first coordinate system and the second coordinate system is obtained.

5. The positioning method according to claim 1, characterized in that, The steps of acquiring the reference point coordinate information of at least two adjacent reference points in the object under test in the first coordinate system using the detection device include: Acquire an image of the surface of the object to be tested; Based on the obtained image of the surface of the object to be tested, obtain the reference point coordinate information of at least two adjacent reference points in the first coordinate system.

6. The positioning method according to claim 1, characterized in that, The number of the first reference point, the second reference point, and the third reference point is multiple; the coordinates of the first reference point, the coordinates of the second reference point, and the coordinates of the third reference point are also multiple; the first extension direction, the second extension direction, the first dimension, and the second dimension are also multiple; The steps of obtaining the first extension direction of the first test area and the first size of the first test area in the first extension direction include: obtaining the median of a plurality of first extension directions as the first extension direction of the first test area; and obtaining the median of a plurality of first sizes as the first size of the first test area in the first extension direction. The steps of obtaining the second extension direction of the first test area and the second size of the first test area in the second extension direction include: obtaining the median of a plurality of second extension directions as the second extension direction of the first test area; and obtaining the median of a plurality of second sizes as the second size of the first test area in the second extension direction.

7. The positioning method according to claim 6, characterized in that, Any straight line is selected as a reference straight line, and the first extension direction is characterized by the first angle between the line connecting the first reference point and the second reference point and the reference straight line; the median of the multiple first extension directions is the average, median, or weighted average of the multiple first angles. The second extension direction is represented by the second angle between the line connecting the first reference point and the third reference point and the reference line; the median of the multiple second extension directions is the average, median, or weighted average of the multiple second angles; The first dimension is the first distance between the first reference point and the second reference point; the first dimension is... The median is the average, median, or weighted average of multiple first distances; The second dimension is the second distance between the first reference point and the third reference point; the median of the second dimension is the average, median, or weighted average of multiple second distances.

8. The positioning method according to claim 1, characterized in that, The reference point includes the center point of the feature structure, which has edge lines; The steps for obtaining the coordinates of the reference point in the first coordinate system include: Multiple points on the edge line of the feature structure are detected to obtain the coordinates of the multiple points on the edge of the feature structure in the first coordinate system; The edge line of the feature structure is fitted based on the coordinates of multiple points on the edge of the feature structure in the first coordinate system to obtain the fitted edge line; Based on the fitted edge line, obtain the coordinates of the reference point in the first coordinate system.

9. The positioning method according to claim 8, characterized in that, The feature structure is a grating-shaped mark, a cross-shaped mark, or a ring-shaped mark; Alternatively, the reference point may be a corner point of the area to be tested.

10. The positioning method according to claim 1, characterized in that, The surface of the object to be tested has feature points; the step of obtaining the transformation relationship between the first coordinate system and the second coordinate system includes: using the detection device to obtain the feature point measurement coordinates of at least one of the feature points in the first coordinate system; Obtain the feature point design coordinates of the at least one feature point in the second coordinate system; Based on the measured coordinates and designed coordinates of the feature points, the transformation relationship between the first coordinate system and the second coordinate system is obtained.

11. The positioning method according to claim 10, characterized in that, The edge of the object to be tested has a reference mark; the at least one feature point includes the center point of the object to be tested and the location of the reference mark; The step of acquiring the feature point measurement coordinates of at least one of the feature points in the first coordinate system using the detection device includes: The edge of the object to be tested is scanned to obtain the edge contour information of the object to be tested; The center point of the object under test and the feature point coordinates of the reference mark in the first coordinate system are obtained based on the edge contour.

12. The positioning method according to claim 10, characterized in that, The transformation relationship includes at least one of translation and rotation.

13. The positioning method according to claim 1, characterized in that, The steps for obtaining the second coordinate information of the first test area and other test areas in the second coordinate system based on the transformation relationship, the first coordinate information of the first test area in the first coordinate system, and the periodic distribution pattern of the test area include: Based on the transformation relationship and the first coordinate information of the first test area in the first coordinate system, the second coordinate information of the first test area in the second coordinate system is obtained; based on the second coordinate information of the first test area in the second coordinate system and the periodic distribution pattern of the test area, the second coordinate information of other test areas in the second coordinate system is obtained. Alternatively, based on the first coordinate information of the first test area in the first coordinate system and the periodic distribution pattern of the test area, the first coordinates of other test areas in the first coordinate system are obtained; based on the first coordinate information of the first test area and other test areas in the first coordinate system and the transformation relationship, the second coordinate information of the first test area and other test areas in the second coordinate system is obtained.

14. A detection method, characterized in that, include: A target detection device is provided, the target detection device having a third coordinate system; The positioning method as described in any one of claims 1 to 13 is used to obtain the second target coordinate information of the test area of ​​the object under test in the second coordinate system; Obtain the target transformation relationship between the third coordinate system and the second coordinate system; Based on the target transformation relationship and the second target coordinate information, the third target coordinate information of the area to be measured in the third coordinate system is obtained; The target detection device locates the area to be tested based on the third target coordinate information; after locating the area to be tested based on the third target coordinate information, the target detection device detects the area to be tested to obtain the physical information of the area to be tested.

15. A detection system, characterized in that, include: The test area positioning module is adapted to obtain the second target coordinate information of the test area in the second coordinate system using the positioning method as described in any one of claims 1 to 13; The transformation relationship acquisition module acquires the target transformation relationship between the third coordinate system and the second coordinate system. The target coordinate acquisition module is adapted to acquire the third target coordinate information of the area to be measured in the third coordinate system based on the target transformation relationship and the second target coordinate information; The target detection device has the third coordinate system and is adapted to locate the area to be tested according to the third target coordinate information, and to detect the area to be tested to obtain the physical information of the area to be tested.

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