A soft circuit board burning welding measuring device and method

Abstract

The application provides a soft circuit board burning welding measurement device and method, which comprises a soft circuit board provided with a first pad, a second pad, a measurement pad and an IC chip, the first pad is close to a general input and output pin of the IC chip and is connected through a first wire, the second pad and the measurement pad are connected through a second wire; a clamp can clamp the soft circuit board; a burning tool can be connected with a burning pin of the IC chip through a connector; a welding tool can weld the first pad and the second pad; a measurement tool can be connected with the measurement pad through a detection line. The application has the advantages that: when burning, the first pad and the second pad are disconnected, thus preventing the noise introduced by the exposed large measurement pad and long wire from entering the internal interference of the IC chip to disturb the burning signal, and improving the burning stability of the IC chip; after the burning is completed, the first pad and the second pad are welded, so that the measurement tool can measure the working signal of the IC chip through the measurement pad.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a device and method for measuring the burning and welding of a flexible circuit board. Background Art

[0002] Flexible printed circuit board, also known as FPC, is the abbreviation of Flexible Printed Circuit. It is a printed circuit board made of flexible insulating substrate. It has the characteristics of high bending degree, high wiring density, thin thickness and light weight. It can be appropriately designed according to different application scenarios and has been widely used in electronic products.

[0003] When designing a flexible printed circuit (FPC), some test pads are usually reserved to measure signals, such as Figure 1 As shown in the figure, the measurement pads are relatively large, with a diameter ≥0.8mm, and are exposed on the surface of the flexible printed circuit board. A long trace connects each measurement pad to a general-purpose input / output (I / O) pin of the IC chip, exceeding 32mm. The measurement pads and traces are made of metal (such as copper). Due to design and practical requirements, the measurement pads are fixed in position on the flexible printed circuit board, and the trace length between the measurement pads and the general-purpose input / output pins of the IC chip is fixed. Due to circuit board trace layout considerations, it is difficult to place large measurement pads near the IC chip pins.

[0004] When you purchase various programmable IC chips from semiconductor manufacturers, their data areas are blank. Before using the IC chip, you need to use a programming tool to program the control program and data into the IC chip. The programming tool is connected to the programming pins (TXD, RXD) of the IC chip.

[0005] When programming the IC chip on a flexible printed circuit board, the exposed large metal measurement pads and long traces easily introduce noise. This noise enters the IC chip through the general input and output pins of the IC chip, easily interfering with the programming signal, resulting in abnormal programming and IC chip operation.

[0006] Therefore, how to prevent the programming signal of the IC chip of the flexible printed circuit board from being interfered with by noise due to the large exposed measurement pads and long traces is a technical problem that needs to be solved urgently in this field. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide a device and method for measuring the burning soldering of a flexible printed circuit board, so as to prevent the burning signal of the IC chip of the flexible printed circuit board from being interfered with by noise due to the large exposed measurement pads and long traces.

[0008] The application is implemented as follows: a soft circuit board burning welding measuring device, comprising:

[0009] The soft circuit board, the carrier, the clamp, the burning tool, the measuring tool and the welding tool;

[0010] The soft circuit board is provided with a first pad, a second pad, a measuring pad and an IC chip, the first pad is close to the general input and output pin of the IC chip and is connected through a first wire, the second pad is located near the first pad, the measuring pad is located far from the first pad, the second pad and the measuring pad are connected through a second wire, and the diameter of the first pad is smaller than that of the measuring pad;

[0011] The clamp is fixedly connected with the carrier and can clamp the soft circuit board;

[0012] The burning tool is fixedly connected with the carrier and can be connected with the burning pin of the IC chip through a connector;

[0013] The welding tool is fixedly connected with the carrier and can weld the first pad and the second pad;

[0014] The measuring tool is fixedly connected with the carrier and can be connected with the measuring pad through a detection line.

[0015] Further, the soft circuit board is a single-layer wire structure, and the first pad and the second pad are horizontally adjacent;

[0016] The welding tool comprises a box body, an electric iron and solder, the box body is fixedly connected with the carrier, the electric iron and the solder can be placed in the box body, and the electric iron and the solder can also weld the first pad and the second pad.

[0017] Further, the soft circuit board is a double-layer wire structure, the first pad and the second pad are respectively located in the double layers and vertically adjacent, and the measuring pad and the second pad are located in the same layer;

[0018] The welding tool comprises a base, a support rod and a laser lamp, the base is fixedly connected with the carrier, the lower end of the support rod is fixedly connected with the base, the upper end of the support rod is fixedly connected with the laser lamp, the laser lamp is located above the soft circuit board, and the emitted laser light can weld the first pad and the second pad.

[0019] Further, the welding tool further comprises a transverse guide rail, a transverse sliding block, a longitudinal guide rail and a longitudinal sliding block, the transverse guide rail is fixedly connected with the base, the transverse sliding block is in sliding connection with the transverse guide rail, the longitudinal guide rail is fixedly connected with the transverse sliding block, and the longitudinal sliding block is in sliding connection with the longitudinal guide rail, and the lower end of the supporting rod is in rotational connection with the longitudinal sliding block.

[0020] Further, the clamp comprises a left clamp and a right clamp, and the left clamp and the right clamp are used for clamping the left side and the right side of the soft circuit board respectively.

[0021] Further, the length L1 of the first wire is less than or equal to 2 mm, the length L2 of the second wire is greater than 30 mm, and the distance L3 between the first pad and the second pad is 1 mm.

[0022] Further, the diameter D1 of the first pad is 0.08 mm, the diameter D2 of the second pad is 0.08 mm, and the diameter D3 of the measurement pad is greater than or equal to 0.8 mm.

[0023] A burning, welding and measuring method of a soft circuit board, comprising the following steps:

[0024] S1, a first pad, a second pad, a measurement pad and an IC chip are arranged on a soft circuit board, the first pad is close to a general input and output pin of the IC chip and is connected through a first wire, the second pad is located close to the first pad, the measurement pad is located far from the first pad, the second pad and the measurement pad are connected through a second wire, and the diameter of the first pad is smaller than the diameter of the measurement pad;

[0025] S2, a connector of a burning tool is connected with a burning pin of the IC chip, a burning signal enters the inside of the IC chip, and the burning tool is disconnected from the IC chip after burning is completed;

[0026] S3, the first pad and the second pad are connected;

[0027] S4, a detection line of a measurement tool is connected with the measurement pad, and a working signal of the IC chip is measured.

[0028] Further, in the S1, the soft circuit board is a single-layer wire structure, and the first pad and the second pad are horizontally adjacent;

[0029] The S3 is specifically that the first pad and the second pad are connected through tin soldering;

[0030] Further comprising:

[0031] S5, the first pad and the second pad are desoldered by using an electric soldering iron.

[0032] S6, connect the connector of the burning tool with the burning pin of the IC chip again, and the burning signal enters the interior of the IC chip again, and the burning tool is disconnected with the IC chip again after the burning is completed;

[0033] S7, connect the first pad and the second pad by soldering again;

[0034] S8, connect the detection line of the measuring tool with the measuring pad again, and measure the working signal of the IC chip.

[0035] Further, in the S1, the soft circuit board is a double-layer wiring structure, the first pad and the second pad are respectively located in the double layers and vertically adjacent, and the measuring pad and the second pad are located in the same layer.

[0036] The S3 is specifically connecting the first pad and the second pad by laser.

[0037] The advantage of the present application is that: the first pad, the second pad and the measuring pad are arranged on the soft circuit board, when burning, the first pad and the second pad are disconnected, which disconnects the measuring pad and the general input and output pin of the IC chip, compared with the measuring pad, the wiring between the first pad and the general input and output pin of the IC chip is shorter, which prevents the noise introduced by the exposed large measuring pad and long wiring from entering the interior of the IC chip to interfere with the burning signal, and improves the burning stability of the IC chip; after the burning is completed, the first pad and the second pad are welded, so that the measuring tool can measure the working signal of the IC chip through the measuring pad. BRIEF DESCRIPTION OF DRAWINGS

[0038] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0039] Figure 1 It is a structural schematic diagram of the soft circuit board in the background art.

[0040] Figure 2 It is a schematic diagram of the soft circuit board of the present application as a single-layer wiring structure.

[0041] Figure 3 It is a schematic diagram of the present application for welding the first pad and the second pad by an electric soldering iron.

[0042] Figure 4 It is a structural schematic diagram of the burning, welding and measuring device of the soft circuit board of the present application.

[0043] Figure 5 It is a schematic diagram of the soft circuit board of the present application as a double-layer wiring structure.

[0044] Figure 6 is a schematic diagram of connecting the first pad and the second pad by laser in the present application.

[0045] Reference signs: flexible circuit board 1; first pad 11; second pad 12; measurement pad 13; IC chip 14; general input and output pin 141; burning pin 142; first wire 15; second wire 16; wire 17; carrier 2; clamp 3; left clamp 31; right clamp 32; burning tool 4; connector 41; welding tool 5; base 51; support rod 52; laser lamp 53; transverse slider 54; longitudinal slider 55; measurement tool 6; detection line 61; probe 62. DETAILED DESCRIPTION

[0046] The embodiment of the present application provides a burning, welding and measuring device and method of a flexible circuit board, solves the problem that the exposed large metal measurement pad and the long wire are easy to introduce noise and interfere with the burning signal of the IC chip in the background art, and improves the burning stability of the IC chip and facilitates the measurement of the working signal of the IC chip.

[0047] To solve the above-mentioned shortcomings, the technical scheme in the embodiment of the present application is as follows:

[0048] The first pad and the second pad are arranged between the measurement pad of the flexible circuit board and the IC chip, the first pad is close to the general input and output pin of the IC chip and is connected through the first wire, the second pad is connected with the measurement pad through the second wire, the first pad is smaller than the measurement pad, and the second pad is close to the first pad; before burning, the first pad and the second pad are disconnected; when the burning signal enters the interior of the IC chip, the noise cannot reach the first pad and thus cannot enter the interior of the IC chip, so that the noise interference on the burning signal is prevented; after the burning is completed, the first pad and the second pad are welded, the working signal of the IC chip reaches the measurement pad through the general input and output pin, the first wire, the first pad, the second pad and the second wire, the detection line of the measurement tool is connected with the measurement pad, and thus the working signal of the IC chip can be measured to confirm whether the IC chip works normally.

[0049] In order to better understand the above technical scheme, the above technical scheme will be described in detail in combination with the drawings of the specification and the specific embodiments.

[0050] Reference Figures 1 to 4 , the first embodiment of the present application.

[0051] A burning, welding and measuring device of a flexible circuit board, comprising:

[0052] The flexible circuit board 1, the carrier 2, the clamp 3, the burning tool 4, the measurement tool 6 and the welding tool 5;

[0053] The soft circuit board 1 is provided with a first pad 11, a second pad 12, a measurement pad 13 and an IC chip 14, the first pad 11 is close to the general input and output pin 141 of the IC chip 14 and is connected through a first wire 15, the second pad 12 is close to the first pad 11, the measurement pad 13 is far from the first pad 11, the second pad 12 is connected with the measurement pad 13 through a second wire 16, the first pad 11 is smaller than the measurement pad 13;

[0054] The clamp 3 is fixedly connected with the carrier 2 and can clamp the soft circuit board 1;

[0055] The burning tool 4 is fixedly connected with the carrier 2 and can be connected with the burning pin 142 of the IC chip 14 through a connector 41; during burning, the connector 41 of the burning tool 4 is inserted into the burning pin 142 of the IC chip 14, the burning signal enters the inside of the IC chip 14, and after the burning is completed, the connector 41 of the burning tool 4 is pulled out of the burning pin 142 of the IC chip 14.

[0056] The welding tool 5 is fixedly connected with the carrier 2 and can weld the first pad 11 and the second pad 12; after the burning is completed, the welding tool 5 is used by a worker to weld the first pad 11 and the second pad 12, so that the measurement pad 13 and the general input and output pin 141 of the IC chip 14 are connected. Since the IC chip 14 has completed the burning, the burning signal will not be disturbed by the noise generated by the measurement pad 13 which is far away, the burning stability of the IC chip 14 is improved, the normal burning is realized, and then the IC chip 14 works normally.

[0057] The measurement tool 6 is fixedly connected with the carrier 2 and can be connected with the measurement pad 13 through a detection line 61. After the welding is completed, the measurement tool 6 is used by a worker to detect the working signal of the IC chip 14 through the measurement pad 13, in this embodiment, the front end of the detection line 61 has a probe 62, the probe 62 is contacted with the measurement pad 13; at this time, the working signal of the IC chip 14 passes through the general input and output pin 141, the first wire 15, the first pad 11, the second pad 12 and the second wire 16 to reach the measurement pad 13, so that whether the IC chip 14 works normally is confirmed.

[0058] The soft circuit board 1 is a single-layer wiring structure, the first pad 11 and the second pad 12 are horizontally adjacent; in this embodiment, the length L1 of the first wiring 15 is less than or equal to 2 mm, the length L2 of the second wiring is greater than 30 mm, and the distance L3 between the first pad 11 and the second pad 12 is 1 mm. The diameter D1 of the first pad 11 is 0.08 mm, the diameter D2 of the second pad 12 is 0.08 mm, and the diameter D3 of the measurement pad 13 is greater than or equal to 0.8 mm. The first pad 11 is small in size and is suitable to be arranged close to the IC chip 14, but is inconvenient to be connected with the measurement tool 6.

[0059] The welding tool 5 includes a box body, an electric soldering iron and solder, the box body is fixedly connected with the table 2, the electric soldering iron and solder can be placed in the box body, and the electric soldering iron and solder can also weld the first pad 11 and the second pad 12. After the burning tool 4 is disconnected from the IC chip, the worker takes out the electric soldering iron and solder from the box body, and welds the first pad 11 and the second pad 12. After the welding is completed, the working signal of the IC chip 14 is measured again.

[0060] In this embodiment, the clamp 3 includes a support and tweezers, the support is fixedly connected with the table, and the tweezers can be placed in the support. The worker clamps the soft circuit board 1 with the tweezers, and then welds the first pad 11 and the second pad 12 with the electric soldering iron.

[0061] The burning, welding and measuring method of the soft circuit board of this embodiment 1 includes the following steps:

[0062] S1, a first pad 11, a second pad 12, a measurement pad 13 and an IC chip 14 are arranged on a soft circuit board 1, the first pad 11 is close to a general input and output pin 141 of the IC chip 14 and is connected through a first wiring 15, the second pad 12 is located close to the first pad 11, the measurement pad 13 is located far away from the first pad 11, the second pad 12 and the measurement pad 13 are connected through a second wiring 16, and the first pad 11 is smaller than the measurement pad 13; the soft circuit board 1 is a single-layer wiring structure, and the first pad 11 and the second pad 12 are horizontally adjacent.

[0063] S2, connect the connector 41 of the burning tool 4 with the burning pin 142 of the IC chip 14, the burning signal enters the interior of the IC chip 14, disconnect the burning tool 4 from the IC chip 14 after the burning is completed; at this time, the first pad 11 and the second pad 12 are disconnected, the noise generated by the exposed large measuring pad 13 at a far distance cannot reach the first pad 11, so that the noise cannot enter the interior of the IC chip 14 to interfere with the burning signal. The burning stability of the IC chip 14 is improved, the normal burning is realized, and then the IC chip 14 works normally. After the burning, the working signal of the IC chip 14 needs to be measured in order to identify whether the IC chip 14 is normal, the first pad 11 and the second pad 12 are connected by welding.

[0064] S3, connect the first pad 11 with the second pad 12; specifically, connect the first pad 11 with the second pad 12 by tin soldering.

[0065] S4, connect the detection line 61 of the measuring tool 6 with the measuring pad 13, and measure the working signal of the IC chip 14. If the IC chip 14 works normally, the operation is ended; if the IC chip 14 works abnormally, the burning needs to be performed again, and the operation is turned to S5.

[0066] S5, disconnect the first pad 11 with the second pad 12 by using an electric soldering iron;

[0067] S6, connect the connector 41 of the burning tool 4 with the burning pin 142 of the IC chip 14 again, the burning signal enters the interior of the IC chip 14 again, and the burning tool 4 is disconnected from the IC chip 14 again after the burning is completed;

[0068] S7, connect the first pad 11 with the second pad 12 by tin soldering again;

[0069] S8, connect the detection line of the measuring tool 6 with the measuring pad 13 again, and measure the working signal of the IC chip 14. Whether the IC chip works normally is confirmed again.

[0070] Referring to Figure 5 and Figure 6 the second embodiment of the present application.

[0071] A burning, welding and measuring device of a soft circuit board, comprising:

[0072] a soft circuit board 1, a carrier 2, a clamp 3, a burning tool 4, a measuring tool 6 and a welding tool 5;

[0073] The flexible circuit board 1 has a double-layer wiring structure, the first pad 11 and the second pad 12 are respectively located in double layers and are vertically adjacent, and the measurement pad 13 and the second pad 12 are located on the same layer; in this embodiment, the sizes of the first pad 11, the second pad 12, the measurement pad 13 and the wiring dimensions refer to the first embodiment of the present invention.

[0074] The welding tool 5 includes a base 51, a support rod 52, and a laser lamp 53. The base 51 is fixedly connected to the carrier 2. The lower end of the support rod 52 is fixedly connected to the base 51, and the upper end of the support rod 52 is fixedly connected to the laser lamp 53. The laser lamp 53 is positioned above the flexible printed circuit board 1 and emits laser light that can weld the first pad 11 to the second pad 12. After the IC chip 14 is programmed, the flexible printed circuit board 1 is fixed in place using the fixture 3. The laser light (also known as laser light) emitted by the laser lamp 53 passes through the first pad 11 and the second pad 12, thereby bonding the first pad 11 to the second pad 12. This disconnects the first pad 11 from the second pad 12 during IC chip programming, preventing noise generated by the remote measurement pad 13 from reaching the first pad 11 and thus interfering with the programming signal. In this way, during measurement, the first pad 11 is connected to the second pad 12, and the staff uses the measuring tool 6 to measure the working signal of the IC chip 14 at the measuring pad 13. At this time, the working signal of the IC chip 14 passes through the general input and output pin 141, the first trace 15, the first pad 11, the second pad 12, and the second trace 16 to reach the measuring pad 13.

[0075] The welding tool 5 also includes a transverse guide rail, a transverse slider 54, a longitudinal guide rail, and a longitudinal slider 55. The transverse guide rail is fixedly connected to the base 51, the transverse slider 54 is slidably connected to the transverse guide rail, the longitudinal guide rail is fixedly connected to the transverse slider 54, and the longitudinal slider 55 is slidably connected to the longitudinal guide rail. The lower end of the support rod 52 is rotatably connected to the longitudinal slider 55. The lower end of the support rod 52 can rotate from 0° to 90°. When laser light is required, the support rod 52 is rotated to position the laser lamp 53 directly above the flexible printed circuit board 1. When laser light is not required, the support rod 52 is rotated in the opposite direction to move the laser lamp 53 away from the flexible printed circuit board 1. Because the positions of the first solder pads 11 and second solder pads 12 on each flexible printed circuit board 1 may vary slightly, the positions of the transverse slider 54 and longitudinal slider 55 are adjusted to change the plane positions of the support rod 52 and the laser lamp 53, thereby better targeting the first and second solder pads 11 and 12.

[0076] The clamp 3 includes a left clamp 31 and a right clamp 32, both of which are fixedly connected with the carrier 2, and are used for clamping the left side and the right side of the soft circuit board 1 respectively.

[0077] The soft circuit board burning, welding and measuring method of the second embodiment includes the following steps.

[0078] S1, a first pad 11, a second pad 12, a measuring pad 13 and an IC chip 14 are arranged on the soft circuit board 1, the first pad 11 is close to the general input and output pin 141 of the IC chip 14 and is connected through a first wire 15, the second pad 12 is located near the first pad 11, the measuring pad 13 is located far from the first pad 11, the second pad 12 and the measuring pad 13 are connected through a second wire 16, the first pad 11 is smaller than the measuring pad 13; the soft circuit board 1 is a double-layer wire structure, the first pad 11 and the second pad 12 are respectively located in the double layers and vertically adjacent, and the measuring pad 13 and the second pad 12 are located in the same layer.

[0079] S2, the connector 41 of the burning tool 4 is connected with the burning pin 142 of the IC chip 14, the burning signal enters the inside of the IC chip 14, and the burning tool 4 is disconnected with the IC chip 14 after the burning is completed; at this time, the first pad 11 and the second pad 12 are in a disconnected state, the noise generated by the exposed measuring pad 13 far away will not reach the first pad 11, so that the noise will not enter the inside of the IC chip 14 to interfere with the burning signal. The burning stability of the IC chip 14 is improved, the normal burning is realized, and then the IC chip 14 works normally.

[0080] S3, the first pad 11 and the second pad 12 are connected; specifically, the first pad 11 and the second pad 12 are connected by laser. Laser is also called laser. The first pad 11 and the second pad 12 are welded by laser, and the welding efficiency is high.

[0081] S4, the detection line 61 of the measuring tool 6 is connected with the measuring pad 13, and the working signal of the IC chip 14 is measured.

[0082] The other parts not described are referred to the first embodiment of the application.

[0083] While the foregoing description has described specific embodiments of the application, one ordinary skill in the art will appreciate that various modifications and changes can be made thereto without departing from the spirit and scope of the application, as set forth in the appended claims.

Claims

1. A method for measuring the burning welding of a flexible printed circuit board, characterized in that: The following steps are involved: S1. Arrange a first pad, a second pad, a measurement pad, and an IC chip on a flexible printed circuit board, wherein the first pad is close to a general-purpose input / output pin of the IC chip and is connected to the first pad via a first trace, the second pad is located near the first pad, and the measurement pad is located far from the first pad. The second pad and the measurement pad are connected via a second trace, and the diameter of the first pad is smaller than that of the measurement pad. S2, connecting the connector of the burning tool to the burning pin of the IC chip, so that the burning signal enters the interior of the IC chip, and disconnecting the burning tool from the IC chip after the burning is completed; S3, connecting the first pad to the second pad; S4. Connecting the detection line of the measuring tool to the measuring pad to measure the working signal of the IC chip.

2. The method for measuring the burning welding of a flexible printed circuit board according to claim 1, wherein: In S1, the flexible printed circuit board has a single-layer wiring structure, and the first pad and the second pad are horizontally adjacent to each other; The S3 specifically comprises connecting the first pad and the second pad by soldering; Also includes: S5, desoldering the first soldering pad and the second soldering pad using an electric soldering iron; S6, reconnecting the connector of the programming tool to the programming pin of the IC chip, so that the programming signal enters the interior of the IC chip again, and disconnecting the programming tool and the IC chip again after programming is completed; S7, connecting the first soldering pad and the second soldering pad again by soldering; S8. Connect the detection wire of the measuring tool to the measuring pad again to measure the working signal of the IC chip.

3. The method for measuring the burning welding of a flexible printed circuit board according to claim 1, wherein: In S1, the flexible printed circuit board has a double-layer wiring structure, the first pad and the second pad are respectively located in double layers and vertically adjacent to each other, and the measurement pad and the second pad are located in the same layer; The S3 specifically involves connecting the first pad and the second pad using laser.

4. A burn-in welding measurement device for a flexible printed circuit board, characterized in that: A method for measuring burn-in welding of a flexible printed circuit board according to any one of claims 1 to 3, comprising: Flexible printed circuit boards, carriers, fixtures, programming tools, measuring tools, and welding tools; The flexible printed circuit board is provided with a first pad, a second pad, a measurement pad, and an IC chip, wherein the first pad is close to a general input / output pin of the IC chip and is connected via a first trace, the second pad is located near the first pad, and the measurement pad is located far from the first pad, the second pad and the measurement pad are connected via a second trace, and the diameter of the first pad is smaller than the diameter of the measurement pad; The clamp is fixedly connected to the carrier and can clamp the flexible printed circuit board; The burning tool is fixedly connected to the carrier and can be connected to the burning pin of the IC chip through a connector; The welding tool is fixedly connected to the carrier and can weld the first welding pad and the second welding pad; The measuring tool is fixedly connected to the carrier and can be connected to the measuring pad via a detection line; The flexible printed circuit board has a single-layer wiring structure, and the first pad and the second pad are horizontally adjacent; The welding tool includes a box body, an electric soldering iron and solder, the box body is fixedly connected to the carrier, the electric soldering iron and solder can be placed in the box body, and the electric soldering iron and solder can also weld the first soldering pad and the second soldering pad; The clamp comprises a left clamp and a right clamp, and the left clamp and the right clamp are used to clamp the left side and the right side of the flexible circuit board respectively.

5. The burn-in welding measuring device for a flexible printed circuit board according to claim 4, characterized in that: The flexible printed circuit board has a double-layer wiring structure, the first pad and the second pad are respectively located in double layers and vertically adjacent to each other, and the measurement pad and the second pad are located in the same layer; The welding tool includes a base, a support rod and a laser lamp. The base is fixedly connected to the carrier, the lower end of the support rod is fixedly connected to the base, and the upper end of the support rod is fixedly connected to the laser lamp. The laser lamp is located above the flexible circuit board, and the emitted laser light can weld the first pad and the second pad.

6. The burn-in welding measuring device for a flexible printed circuit board according to claim 5, characterized in that: The welding tool also includes a transverse guide rail, a transverse slider, a longitudinal guide rail and a longitudinal slider. The transverse guide rail is fixedly connected to the base, the transverse slider is slidably connected to the transverse guide rail, the longitudinal guide rail is fixedly connected to the transverse slider, the longitudinal slider is slidably connected to the longitudinal guide rail, and the lower end of the support rod is rotatably connected to the longitudinal slider.

7. The burn-in welding measuring device for a flexible printed circuit board according to claim 4, characterized in that: The length L1 of the first trace is ≤2 mm, the length L2 of the second trace is greater than 30 mm, and the distance L3 between the first pad and the second pad is 1 mm.

8. The burn-in welding measuring device for a flexible printed circuit board according to claim 4, characterized in that: The diameter D1 of the first pad is 0.08 mm, the diameter D2 of the second pad is 0.08 mm, and the diameter D3 of the measuring pad is ≥ 0.8 mm.

Images