Electronic device and method of assembling electronic device

Abstract

This application provides an electronic device and a method for assembling the electronic device. An annular colloid can be used to assemble components of the electronic device. The annular colloid may include multiple colloid parts arranged end-to-end, with a gap between the ends of two adjacent colloid parts. The annular colloid may also include a colloid connector, which can fill the gap and make sealing contact with the components surrounding the gap to prevent common external contaminants from entering the electronic device. The solution provided by this application advantageously balances colloid utilization and the sealing performance of the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more specifically, to electronic devices and methods of assembling electronic devices. Background Technology

[0002] Electronic devices can be formed by assembling multiple components. For example, the display screen of an electronic device can be assembled with its housing; similarly, the housing can be formed by assembling a frame and a back cover. Waterproofing requirements for electronic devices dictate that they will not be damaged in various wet environments. For instance, within a specified time period and at a specified depth, water must not penetrate the device and cause damage. Waterproofing is achieved by placing an annular adhesive between two components, allowing their outer perimeters to interlock, thus ensuring the electronic device meets these requirements.

[0003] Ring-shaped colloids can be formed by cutting a single piece or by splicing multiple colloids together. Cutting a ring-shaped colloid into a single piece may result in low material utilization. Splicing a ring-shaped colloid may result in poor sealing, thus affecting the waterproofness of electronic devices. Summary of the Invention

[0004] This application provides an electronic device and a method for assembling the electronic device, with the aim of balancing the utilization rate of the colloid and the waterproofness of the electronic device.

[0005] In a first aspect, an electronic device is provided, comprising a first adherend, a second adherend, and an annular adhesive, the annular adhesive being adhered between the first adherend and the second adherend, the annular adhesive comprising:

[0006] A first colloidal component and a second colloidal component, wherein a first end of the first colloidal component is adjacent to a second end of the second colloidal component, and a gap exists between the first end and the second end;

[0007] A gel connector that fills the gap, wherein the gel connector is in sealed contact with the first adherend, the second adherend, the first gel component, and the second gel component at the gap.

[0008] This application provides a ring-shaped colloid. Because the colloid connector can seal and fill the gap formed by two colloid components, the ring-shaped colloid can possess relatively high water resistance and sealing performance. The ring-shaped colloid can be formed by splicing multiple colloid components, allowing for the application of more colloid raw materials, thus improving the utilization rate of colloid raw materials, reducing the processing cost of the ring-shaped colloid, and enhancing the environmental friendliness of processing the ring-shaped colloid.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the adhesive connector is sealed and bonded between the first adherend and the second adherend, the adhesive material of the adhesive connector is fused with the adhesive material of the first adhesive component, and the adhesive material of the adhesive connector is fused with the adhesive material of the second adhesive component.

[0010] Compared to adhesive-based seals, seals achieved through material fusion are more robust. Adding a colloid connector between two colloid components, with the connector's material blending seamlessly with the materials of the two colloid components, improves the sealing and waterproofing properties of the annular colloid.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the colloidal connector and the first colloidal component are fused together to form a mixing region, the mixing region including a portion of the components constituting the colloidal connector and a portion of the components constituting the first colloidal component.

[0012] In the mixing region formed by the colloidal connector and the first colloidal component, the molecular chains of the first colloidal component can interpenetrate, entangle, and intertwine with the molecular chains of the colloidal connector. This helps to reduce the gap between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector, increasing the difficulty for general external pollutants to pass through, thereby improving the sealing and waterproof properties of the annular colloid.

[0013] In conjunction with the first aspect, in some implementations of the first aspect, the first colloidal component includes a first adhesive layer, a second adhesive layer, and a first base layer, the first base layer being sealed and adhered between the first adhesive layer and the second adhesive layer, the colloidal connector being fused with both the first adhesive layer and the second adhesive layer, and the colloidal connector being sealed and adhered to one end of the first base layer.

[0014] The base layer provides mechanical support for the colloidal component. During processing, the colloidal component is cut from the colloidal raw material, so the edges of the adhesive layer and the base layer are usually flush. However, with only the adhesive layers of the first and second colloidal components, a well-sealed annular colloid is typically not formed. For example, the adhesive layer of the first colloidal component usually cannot both connect to the adhesive layer of the second colloidal component and be sealed to the substrate of the second colloidal component. By incorporating a colloidal connector, the adhesive layers of the first and second colloidal components can be connected, and the connector can be sealed between the first base layer of the first colloidal component and the second base layer of the second colloidal component. Therefore, the annular colloid can possess relatively high sealing and waterproof properties.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the minimum spacing between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

[0016] In other words, the first colloidal component and the colloidal connector fuse together to form molecular-level diffusion.

[0017] The free volume between the molecular chains of the first colloidal component and the colloidal connector can be smaller than the cluster volume of general external pollutants, which helps to prevent general external pollutants from passing through the junction of the first colloidal component and the colloidal connector, thereby improving the sealing and waterproof properties of the annular colloid.

[0018] In conjunction with the first aspect, in certain implementations of the first aspect, one or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the first colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

[0019] In other words, there is an intermolecular interaction (force) between the colloidal connector and the first colloidal component.

[0020] The intermolecular forces between the first colloidal component and the colloidal connector can form a molecular network between them. Firstly, this molecular network helps reduce the free volume between the molecular chains of the first colloidal component and the colloidal connector, thus increasing the difficulty for general external contaminants to pass through. Secondly, the molecular network helps increase the interaction forces between the first colloidal component and the colloidal connector, enhancing their fusion and making separation more difficult, thereby improving the sealing life of the annular colloid.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the first colloid component includes a first seam surface that is in sealing contact with the colloid connector, the first seam surface including a plurality of first raised regions and a plurality of first recessed regions, the first colloid component being in contact with each of the first raised regions and each of the first recessed regions.

[0022] In other words, when observing the junction of the first colloid component and the colloid connector from a cross-section of the annular colloid, it can be observed that the first joint surface may not include the area not in contact with the colloid connector, or the area of ​​the first joint surface not in contact with the colloid connector may be small enough to make it almost impossible for general external contaminants to pass through, thereby improving the sealing and waterproof properties of the annular colloid.

[0023] To ensure that the adhesive connector can contact all of the first joint surfaces, compressive stress can be generated inside the adhesive connector, for example. The adhesive connector and the first adhesive component can be pressed against each other at the junction to avoid the formation of gaps at the junction of the adhesive connector and the first adhesive component.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the viscosity of the colloidal connector is less than the viscosity of the first colloidal component.

[0025] Under pressurized or heated conditions, the viscosity of the colloidal connector can be lower than that of the colloidal component, which facilitates the flow of the colloidal connector into the gap between the first and second colloidal components.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, the material of the colloidal connector is any one of the following: acrylate, epoxy resin, polyurethane.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the modulus M1 of the colloidal connector at room temperature is: 10kPa≤M1≤100kPa.

[0028] The modulus of the colloidal connector at room temperature helps maintain the mechanical stability of the annular colloid and facilitates its flow into the gap between the first and second colloidal components. Using a suitable modulus M1 balances the mechanical properties of the annular colloid and the processability of the colloidal connector. When processing requirements are met, bonding two adhered objects together at room temperature helps reduce damage to the adhered objects or components on them, and also helps reduce energy consumption.

[0029] In conjunction with the first aspect, in some implementations of the first aspect, the modulus M2 of the colloidal connector at room temperature is: 10kPa≤M2≤1000kPa, and the modulus M3 of the colloidal connector at high temperature is: M3≤50kPa.

[0030] The modulus of the colloidal connector at room temperature helps maintain the mechanical stability of the annular colloid, while the modulus at high temperature facilitates flow into the gap between the first and second colloidal components. Using a suitable modulus M2 allows for a wider range of materials to be selected for the colloidal connector, which helps to increase the applicable scenarios of the solutions in this application, such as making it suitable for more types of electronic devices, like relatively large electronic devices.

[0031] In conjunction with the first aspect, in some implementations of the first aspect, a portion of the adhesive connector is located between the first adherend and the first adhesive member or between the second adhesive member and the second adherend.

[0032] Covering the gaps makes it more difficult for external dirt to pass through, thereby improving the sealing and waterproof properties of the ring-shaped colloid.

[0033] In conjunction with the first aspect, in some implementations of the first aspect, the first colloidal component is located on the short side of the electronic device, and the second colloidal component is located on the long side of the electronic device.

[0034] In conjunction with the first aspect, in some implementations of the first aspect, the first adhered object is a mid-frame and the second adhered object is a back cover; or, the first adhered object is a mid-frame and the second adhered object is a display screen; or, the first adhered object is a mid-frame and the second adhered object is a front cover; or, the first adhered object is a front cover and the second adhered object is a display screen.

[0035] The solution proposed in this application can be applied to a variety of possible sealing and waterproofing scenarios.

[0036] Secondly, a method for assembling an electronic device is provided, the method comprising:

[0037] Cut one or more colloidal raw materials to obtain multiple colloidal connectors and multiple colloidal components, wherein the multiple colloidal components include a first colloidal component and a second colloidal component;

[0038] The plurality of adhesive connectors and the plurality of adhesive components are disposed between the first and second adhered objects, the plurality of adhesive components are disposed end to end, the adhesive connectors are located between the plurality of adhesive components and the first adhered object, and the adhesive connectors cover the gap between two adjacent adhesive components.

[0039] The first and second objects to be adhered to are brought close together so that the adhesive connector fills the gap, and at the gap, the adhesive connector is in sealed contact with the first object to be adhered to, the second object to be adhered to, the first adhesive component, and the second adhesive component.

[0040] This application provides a method for assembling electronic devices. Because the colloidal connector can seal and fill the gap formed by two colloidal components, the annular colloid can possess relatively high water resistance and sealing performance. The annular colloid can be obtained by splicing multiple colloidal components, allowing more colloidal raw materials to be used in the annular colloid. This improves the utilization rate of colloidal raw materials, reduces the processing cost of the annular colloid, and enhances the environmental friendliness of processing the annular colloid.

[0041] In conjunction with the second aspect, in certain implementations of the second aspect, the colloidal connector satisfies one or more of the following:

[0042] The width W' of the colloidal connector is greater than or equal to the width W of the first colloidal component;

[0043] The thickness H' of the colloidal connector is greater than or equal to the thickness H of the first colloidal component;

[0044] The length L of the colloidal connector is greater than or equal to the width T of the gap.

[0045] The structure of the colloid connector can facilitate the colloid connector to fully fill the gap between the first colloid component and the second colloid component.

[0046] In conjunction with the second aspect, in certain implementations of the second aspect, the colloidal connector satisfies one or more of the following:

[0047] W' / W > 1.5;

[0048] H' / H > 1.5;

[0049] L / T > 1.5.

[0050] In conjunction with the second aspect, in some implementations of the second aspect, the modulus M1 of the colloidal connector at room temperature is: 10kPa≤M1≤100kPa.

[0051] The modulus of the colloidal connector at room temperature helps maintain the mechanical stability of the annular colloid and facilitates its flow into the gap between the first and second colloidal components. Using a suitable modulus M1 balances the mechanical properties of the annular colloid and the processability of the colloidal connector. When processing requirements are met, bonding two adhered objects together at room temperature helps reduce damage to the adhered objects or components on them, and also helps reduce energy consumption.

[0052] In conjunction with the second aspect, in some implementations of the second aspect, the modulus M2 of the colloidal connector at room temperature is: 10kPa≤M2≤1000kPa, and the modulus M3 of the colloidal connector at high temperature is: M3≤50kPa.

[0053] The modulus of the colloidal connector at room temperature helps maintain the mechanical stability of the annular colloid, while the modulus at high temperature facilitates flow into the gap between the first and second colloidal components. Using a suitable modulus M2 allows for a wider range of materials to be selected for the colloidal connector, which helps to increase the applicable scenarios of the solutions in this application, such as making it suitable for more types of electronic devices, like relatively large electronic devices.

[0054] In conjunction with the second aspect, in some implementations of the second aspect, the adhesive connector is sealed and bonded between the first adherend and the second adherend, the adhesive material of the adhesive connector is fused with the adhesive material of the first adhesive component, and the adhesive material of the adhesive connector is fused with the adhesive material of the second adhesive component.

[0055] Compared to adhesive-based seals, seals achieved through material fusion are more robust. Adding a colloid connector between two colloid components, with the connector's material blending seamlessly with the materials of the two colloid components, improves the sealing and waterproofing properties of the annular colloid.

[0056] In conjunction with the second aspect, in some implementations of the second aspect, the colloidal connector and the first colloidal component are fused together to form a mixing region, the mixing region including a portion of the components constituting the colloidal connector and a portion of the components constituting the first colloidal component.

[0057] In the mixing region formed by the colloidal connector and the first colloidal component, the molecular chains of the first colloidal component can interpenetrate, entangle, and intertwine with the molecular chains of the colloidal connector. This helps to reduce the gap between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector, increasing the difficulty for general external pollutants to pass through, thereby improving the sealing and waterproof properties of the annular colloid.

[0058] In conjunction with the second aspect, in some implementations of the second aspect, the first colloidal component includes a first adhesive layer, a second adhesive layer, and a first base layer, the first base layer being sealed and adhered between the first adhesive layer and the second adhesive layer, the colloidal connector being fused with both the first adhesive layer and the second adhesive layer, and the colloidal connector being sealed and adhered to one end of the first base layer.

[0059] The base layer provides mechanical support for the colloidal component. During processing, the colloidal component is cut from the colloidal raw material, so the edges of the adhesive layer and the base layer are usually flush. However, with only the adhesive layers of the first and second colloidal components, a well-sealed annular colloid is typically not formed. For example, the adhesive layer of the first colloidal component usually cannot both connect to the adhesive layer of the second colloidal component and be sealed to the substrate of the second colloidal component. By incorporating a colloidal connector, the adhesive layers of the first and second colloidal components can be connected, and the connector can be sealed between the first base layer of the first colloidal component and the second base layer of the second colloidal component. Therefore, the annular colloid can possess relatively high sealing and waterproof properties.

[0060] In conjunction with the second aspect, in some implementations of the second aspect, the minimum spacing between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

[0061] In other words, the first colloidal component and the colloidal connector fuse together to form molecular-level diffusion.

[0062] The free volume between the molecular chains of the first colloidal component and the colloidal connector can be smaller than the cluster volume of general external pollutants, which helps to prevent general external pollutants from passing through the junction of the first colloidal component and the colloidal connector, thereby improving the sealing and waterproof properties of the annular colloid.

[0063] In conjunction with the second aspect, in some implementations of the second aspect, one or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the first colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

[0064] In other words, there is an intermolecular interaction (force) between the colloidal connector and the first colloidal component.

[0065] The intermolecular forces between the first colloidal component and the colloidal connector can form a molecular network between them. Firstly, this molecular network helps reduce the free volume between the molecular chains of the first colloidal component and the colloidal connector, thus increasing the difficulty for general external contaminants to pass through. Secondly, the molecular network helps increase the interaction forces between the first colloidal component and the colloidal connector, enhancing their fusion and making separation more difficult, thereby improving the sealing life of the annular colloid.

[0066] In conjunction with the second aspect, in some implementations of the second aspect, the first colloid component includes a first seam surface that is in sealing contact with the colloid connector, the first seam surface including a plurality of first raised areas and a plurality of first recessed areas, the first colloid component being in contact with each of the first raised areas and each of the first recessed areas.

[0067] In other words, when observing the junction of the first colloid component and the colloid connector from a cross-section of the annular colloid, it can be observed that the first joint surface may not include the area not in contact with the colloid connector, or the area of ​​the first joint surface not in contact with the colloid connector may be small enough to make it almost impossible for general external contaminants to pass through, thereby improving the sealing and waterproof properties of the annular colloid.

[0068] To ensure that the adhesive connector can contact all of the first joint surfaces, compressive stress can be generated inside the adhesive connector, for example. The adhesive connector and the first adhesive component can be pressed against each other at the junction to avoid the formation of gaps at the junction of the adhesive connector and the first adhesive component.

[0069] In conjunction with the second aspect, in some implementations of the second aspect, the viscosity of the colloidal connector is less than the viscosity of the first colloidal component.

[0070] Under pressurized or heated conditions, the viscosity of the colloidal connector can be lower than that of the colloidal component, which facilitates the flow of the colloidal connector into the gap between the first and second colloidal components.

[0071] In conjunction with the second aspect, in some implementations of the second aspect, the material of the colloidal connector is any one of the following: acrylate, epoxy resin, polyurethane.

[0072] In conjunction with the second aspect, in some implementations of the second aspect, a portion of the adhesive connector is located between the first adherend and the first adhesive member or between the second adhesive member and the second adherend.

[0073] Covering the gaps makes it more difficult for external dirt to pass through, thereby improving the sealing and waterproof properties of the ring-shaped colloid.

[0074] In conjunction with the second aspect, in some implementations of the second aspect, the first adhered object is a mid-frame and the second adhered object is a back cover; or, the first adhered object is a mid-frame and the second adhered object is a display screen; or, the first adhered object is a mid-frame and the second adhered object is a front cover; or, the first adhered object is a front cover and the second adhered object is a display screen.

[0075] The solution proposed in this application can be applied to a variety of possible sealing and waterproofing scenarios.

[0076] Thirdly, an electronic device is provided, comprising a first adherend, a second adherend, and an annular adhesive, the annular adhesive being adhered between the first adherend and the second adherend, the annular adhesive comprising:

[0077] A colloidal component, wherein a first end of the colloidal component and a second end of the colloidal component are disposed adjacent to each other, and a gap is provided between the first end and the second end;

[0078] A gel connector that fills the gap, wherein the gel connector is in sealed contact with the first adherend, the second adherend, the first end, and the second end at the gap.

[0079] In conjunction with the third aspect, in some implementations of the third aspect, the adhesive connector is sealed and bonded between the first adherend and the second adherend, and the adhesive material of the adhesive connector is fused with the adhesive material of the adhesive component.

[0080] In conjunction with the third aspect, in some implementations of the third aspect, the colloidal connector and the first end are fused together to form a mixing region, the mixing region including a portion of the components constituting the colloidal connector and a portion of the components constituting the colloidal component.

[0081] In conjunction with the third aspect, in some implementations of the third aspect, the colloidal component includes a first adhesive layer, a second adhesive layer, and a first base layer, the first base layer being sealed and adhered between the first adhesive layer and the second adhesive layer, the colloidal connector being fused with both the first adhesive layer and the second adhesive layer, and the colloidal connector being sealed and adhered to one end of the first base layer.

[0082] In conjunction with the third aspect, in some implementations of the third aspect, the minimum spacing between the molecular chains of the colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

[0083] In other words, the colloidal component and the colloidal connector fuse together to form molecular-level diffusion.

[0084] In conjunction with the third aspect, in some implementations of the third aspect, one or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

[0085] In other words, there is an intermolecular interaction (force) between the colloidal connector and the colloidal component.

[0086] In conjunction with the third aspect, in some implementations of the third aspect, the colloid component includes a first seam surface that is in sealing contact with the colloid connector, the first seam surface including a plurality of first raised areas and a plurality of first recessed areas, the colloid component being in contact with each of the first raised areas and each of the first recessed areas.

[0087] In conjunction with the third aspect, in some implementations of the third aspect, the viscosity of the colloidal connector is less than the viscosity of the colloidal component.

[0088] In conjunction with the third aspect, in some implementations of the third aspect, the material of the colloidal connector is any one of the following: acrylate, epoxy resin, polyurethane.

[0089] In conjunction with the third aspect, in some implementations of the third aspect, the modulus M1 of the colloidal connector at room temperature is: 10kPa≤M1≤100kPa.

[0090] In conjunction with the third aspect, in some implementations of the third aspect, the modulus M2 of the colloidal connector at room temperature is 10kPa≤M2≤1000kPa, and the modulus M3 of the colloidal connector at high temperature is M3≤50kPa.

[0091] In conjunction with the third aspect, in some implementations of the third aspect, a portion of the adhesive connector is located between the first adherend and the adhesive component, or between the adhesive component and the second adherend.

[0092] In conjunction with the third aspect, in some implementations of the third aspect, the colloidal connector is located on the short side or the long side of the electronic device.

[0093] In conjunction with the third aspect, in some implementations of the third aspect, the first adhered object is a mid-frame and the second adhered object is a back cover; or, the first adhered object is a mid-frame and the second adhered object is a display screen; or, the first adhered object is a mid-frame and the second adhered object is a front cover; or, the first adhered object is a front cover and the second adhered object is a display screen.

[0094] Fourthly, a method for assembling an electronic device is provided, the method comprising:

[0095] Cut one or more colloidal raw materials to obtain colloidal connectors and colloidal parts;

[0096] The adhesive connector and the adhesive component are disposed between the first and second adherends, with the two ends of the adhesive component being adjacent to each other. The adhesive connector is located between the adhesive component and the first adherend, and the adhesive connector covers the gap between the two ends of the adhesive connector.

[0097] The first and second objects to be adhered to are brought close together so that the adhesive connector fills the gap, and at the gap, the adhesive connector is in sealed contact with the first object to be adhered to, the second object to be adhered to, and both ends of the adhesive connector.

[0098] In conjunction with the fourth aspect, in certain implementations of the fourth aspect, the colloidal connector satisfies one or more of the following:

[0099] The width W' of the colloidal connector is greater than or equal to the width W of the colloidal component;

[0100] The thickness H' of the colloidal connector is greater than or equal to the thickness H of the colloidal component;

[0101] The length L of the colloidal connector is greater than or equal to the width T of the gap.

[0102] In conjunction with the fourth aspect, in certain implementations of the fourth aspect, the colloidal connector satisfies one or more of the following:

[0103] W' / W > 1.5;

[0104] H' / H > 1.5;

[0105] L / T > 1.5.

[0106] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the modulus M1 of the colloidal connector at room temperature is: 10kPa≤M1≤100kPa.

[0107] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the modulus M2 of the colloidal connector at room temperature is: 10kPa≤M2≤1000kPa, and the modulus M3 of the colloidal connector at high temperature is: M3≤50kPa.

[0108] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the adhesive connector is sealed and bonded between the first adherend and the second adherend, and the adhesive material of the adhesive connector is fused with the adhesive material of the adhesive component.

[0109] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the colloidal connector and the colloidal component are fused together to form a mixing region, the mixing region including a portion of the components constituting the colloidal connector and a portion of the components constituting the colloidal component.

[0110] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the minimum spacing between the molecular chains of the colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

[0111] In other words, there is molecular-level diffusion between the colloidal component and the colloidal connector.

[0112] In conjunction with the fourth aspect, in some implementations of the fourth aspect, one or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

[0113] In other words, there is an intermolecular interaction (force) between the colloidal connector and the first colloidal component.

[0114] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the colloid component includes a first seam surface that is in sealing contact with the colloid connector, the first seam surface including a plurality of first raised areas and a plurality of first recessed areas, the colloid component being in contact with each of the first raised areas and each of the first recessed areas.

[0115] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the viscosity of the colloidal connector is less than the viscosity of the colloidal component.

[0116] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the material of the colloidal connector is any one of the following: acrylate, epoxy resin, or polyurethane.

[0117] In conjunction with the fourth aspect, in some implementations of the fourth aspect, a portion of the adhesive connector is located between the first adherend and the adhesive member or between the adhesive member and the second adherend.

[0118] In conjunction with the fourth aspect, in some implementations of the fourth aspect, the first adhered object is a mid-frame and the second adhered object is a back cover; or, the first adhered object is a mid-frame and the second adhered object is a display screen; or, the first adhered object is a mid-frame and the second adhered object is a front cover; or, the first adhered object is a front cover and the second adhered object is a display screen. Attached Figure Description

[0119] Figure 1 This is a schematic structural diagram of an electronic device.

[0120] Figure 2 This is an exploded view of an electronic device.

[0121] Figure 3 This is a schematic structural diagram of a process for ring-shaped colloids.

[0122] Figure 4 This is a schematic structural diagram of a process for ring-shaped colloids.

[0123] Figure 5 This is a schematic structural diagram of an electronic device provided in an embodiment of this application.

[0124] Figure 6 This is a schematic structural diagram of a ring-shaped colloid provided in an embodiment of this application.

[0125] Figure 7 This is a partial structural diagram of a ring-shaped colloid provided in an embodiment of this application.

[0126] Figure 8 This is a partial structural diagram of a ring-shaped colloid provided in an embodiment of this application.

[0127] Figure 9 This is a partial structural diagram of a ring-shaped colloid provided in an embodiment of this application.

[0128] Figure 10 This is a partial structural diagram of another annular colloid provided in an embodiment of this application.

[0129] Figure 11 This is a partial micrograph of a ring-shaped colloid provided in an embodiment of this application.

[0130] Figure 12 This is a schematic structural diagram of a method for assembling electronic devices provided in an embodiment of this application. Detailed Implementation

[0131] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0132] Figure 1 This is a schematic structural diagram of an electronic device provided in an embodiment of this application. The electronic device may be a mobile phone, tablet computer, e-reader, television, laptop computer, digital camera, in-vehicle equipment, wearable device, etc. Figure 1 The illustrated embodiment uses a mobile phone as an example of an electronic device.

[0133] Electronic device 100 may include a display screen 110 and a housing 120. The housing 120 may include a back cover 121 and a side frame 122, wherein the side frame 122 surrounds the outer periphery of the display screen 110 and the outer periphery of the back cover 121. The back cover 121 and the display screen 110 are arranged parallel to each other and spaced apart, with the back cover 121 and the display screen 110 located on opposite sides of the side frame 122, respectively. The cavity formed between the display screen 110, the side frame 122, and the back cover 121 can be used to house components such as power supplies, electronic devices, and circuit boards.

[0134] In one embodiment provided in this application, the back cover 121 and the side frame 122 can be two parts of the housing 120, respectively. The back cover 121 and the side frame 122 can be connected, and the connection method does not have to be an assembly method such as snap-fit, adhesive, welding, riveting, or clearance fit. The connection between the back cover 121 and the side frame 122 cannot be separated. In another embodiment provided in this application, the back cover 121 and the side frame 122 can be two different components. By assembling the back cover 121 and the side frame 122 together, the housing 120 of the electronic device 100 can be formed.

[0135] In some examples, such as Figure 1 As shown, the housing 120 may further include a front cover 123. A display screen 110 may be disposed on the front cover 123. The front cover 123 may, for example, surround the outer periphery of the display screen 110. A side bezel 122 may surround the outer periphery of the front cover 123. The front cover 123 and the rear cover 121 may be located on opposite sides of the side bezel 122.

[0136] Figure 2 This is an exploded view of electronic device 100. (Example) Figure 2 As shown, the electronic device 100 may include a mid-frame 130. In one example, the outer periphery of the mid-frame 130 may form a side border 122 of the electronic device. In other examples, the mid-frame 130 may be accommodated in a... Figure 1 The cavity formed by the housing 120 shown. This cavity may be formed, for example, by the display screen 110, the side frame 122, and the rear cover 121, or by the front cover 123, the side frame 122, and the rear cover 121.

[0137] The electronic device 100 may further include a first annular adhesive 141. The first annular adhesive 141 may be disposed on a first end face 131 of the middle frame 130 and adhered to the end face of the back cover 121 near the middle frame 130. The first annular adhesive 141 may be adhered between the edge of the middle frame 130 and the edge of the back cover 121.

[0138] In one example, the electronic device 100 may further include a second annular adhesive 142. The second annular adhesive 142 may be disposed on a second end face 132 of the mid-frame 130 and adhered to the end face of the display screen 110 near the mid-frame 130. The second annular adhesive 142 may be adhered between the edge of the mid-frame 130 and the edge of the display screen 110.

[0139] By setting the first annular colloid 141 and the second annular colloid 142, a relatively sealed cavity can be formed between the display screen 110, the second annular colloid 142, the middle frame 130, the first annular colloid 141, and the back cover 121 to prevent external pollutants from entering the cavity.

[0140] In another example, the electronic device 100 may further include a second annular adhesive 142 and a third annular adhesive 143. The second annular adhesive 142 may be disposed on the second end face 132 of the mid-frame 130 and adhered to the end face of the front cover 123 near the mid-frame 130. The second annular adhesive 142 may be adhered between the edge of the mid-frame 130 and the edge of the front cover 123. The third annular adhesive 143 may be disposed on the display screen 110 and adhered to the end face of the front cover 123 near the display screen 110. The third annular adhesive 143 may be adhered between the edge of the display screen 110 and the front cover 123.

[0141] By setting the first annular colloid 141, the second annular colloid 142, and the third annular colloid 143, a relatively sealed cavity can be formed between the front cover 123, the third annular colloid 143, the display screen 110, the second annular colloid 142, the middle frame 130, the first annular colloid 141, and the rear cover 121 to prevent external pollutants from entering the cavity.

[0142] It should be understood that the electronic device 100 may also have annular colloids in other locations. The solutions provided in this application embodiment can be applied not only to… Figure 2 The scenario shown can also be applied to other than Figure 2 Other scenarios besides those shown.

[0143] Figure 3 This is a schematic structural diagram illustrating the processing technology of a ring-shaped colloid 140. Figure 3 In the example shown, the annular colloid 140 can be integrally cut and molded. The annular colloid 140 can be, for example, [missing information - likely a specific type of colloid]. Figure 2The first annular colloid 141, the second annular colloid 142, and the third annular colloid 143 are contained within.

[0144] By cutting the colloidal raw material 1400, at least two parts can be obtained, including a ring-shaped colloid 140 and colloidal material located within the ring-shaped colloid 140. Since the ring-shaped colloid 140 is obtained by cutting from a relatively intact colloidal raw material 1400, therefore... Figure 3 The annular colloid 140 shown has relatively good material coherence. The interior of the annular colloid 140 has (almost) no gaps that allow common external contaminants (such as water, water molecule clusters, dust, etc.) to pass through. The annular colloid 140 is also relatively unlikely to have gaps (or ports) or other structures that would result in poor sealing. This facilitates electronic devices achieving high levels of waterproofing (e.g., IPX7 and above). However, the colloidal material within the annular colloid 140 is usually recycled as processing waste because it cannot be reused. This may result in a relatively low utilization rate of the colloidal raw material 1400, thereby increasing the processing cost of the annular colloid 140 and making the processing of the annular colloid 140 relatively less environmentally friendly.

[0145] Figure 4 This is a schematic structural diagram illustrating the processing technology of a ring-shaped colloid 140. Figure 4 In the example shown, the annular colloid 140 can be assembled from multiple colloid components.

[0146] Multiple colloidal parts can be obtained by cutting the colloidal raw material. These multiple colloidal parts may, for example, include at least one first colloidal part 1403 and at least one second colloidal part 1404.

[0147] like Figure 4 As shown, multiple first colloidal parts 1403 can be obtained by cutting on the first colloidal material 1401. Multiple second colloidal parts 1404 can be obtained by cutting on the second colloidal material 1402.

[0148] Then, multiple adhesive components can be placed between the two adhered objects, and the multiple adhesive components can be connected end to end or adjacent to each other to roughly form a frame structure.

[0149] like Figure 4 As shown, one end of the first colloidal component 1403 can be disposed adjacent to one end of the second colloidal component 1404.

[0150] Then, multiple adhesive components can be relatively tightly bonded between two objects, and adjacent adhesive components can adhere to each other. The method of triggering the adhesion between the adhesive components and the objects, and the adhesion between the multiple adhesive components, can be, for example, applying pressure.

[0151] like Figure 4As shown, one end of the first colloidal component 1403 and the adjacent end of the second colloidal component 1404 can partially contact each other, but generally there is a gap at the junction between the first colloidal component 1403 and the second colloidal component 1404. Figure 4 The gap shown.

[0152] Ultimately, a structure can be formed between the two adhered objects as follows: Figure 4 The ring-shaped colloid 140 is shown.

[0153] Cyclic colloid 140 can be, for example, Figure 2 The three ring-shaped colloids are: a first ring-shaped colloid 141, a second ring-shaped colloid 142, and a third ring-shaped colloid 143. When the ring-shaped colloid 140 is the first ring-shaped colloid 141, the two adhered objects can be, for example, respectively... Figure 2 The middle frame 130 and back cover 121 are shown. When the annular adhesive 140 is a second annular adhesive 142, the two adhered objects can be, for example, respectively... Figure 2 The middle frame 130 and front cover 123 are shown. When the annular adhesive 140 is a third annular adhesive 143, the two adhered objects can be, for example, respectively... Figure 2 The display screen 110 and the front cover 123 are shown.

[0154] exist Figure 4 In the example shown, the annular colloid 140 can be assembled from, for example, four colloid components. These four colloid components are connected end-to-end or adjacent to each other to form the annular colloid 140. These four colloid components may include two first colloid components 1403 and two second colloid components. The first colloid components 1403 may be located, for example, at the head or tail of the electronic device. The second colloid components 1404 may be located, for example, on one side of the electronic device, between the head and tail of the electronic device. It should be understood that in other scenarios, the frame assembly may consist of more or fewer colloid components; the first colloid components 1403 and the second colloid components 1404 may also be located in other positions on the electronic device.

[0155] Compared to Figure 3 In the example shown, in Figure 4 In the example shown, more material from the colloidal raw material can be applied to the ring-shaped colloid, thus the utilization rate of the colloidal raw material can be relatively high, which helps to reduce the processing cost of the ring-shaped colloid and improve the environmental friendliness of its processing. However, since the ring-shaped colloid can be assembled from multiple colloidal components, therefore... Figure 4The annular colloid shown has relatively poor material coherence. Gaps (or ports) may form between adjacent colloid components, resulting in poor sealing. This can allow common external contaminants (such as water and dust) to pass through the annular colloid. This could prevent electronic devices from meeting high levels of water resistance (e.g., IPX7 and above).

[0156] Figure 5 This is a schematic structural diagram of an electronic device 100 provided in an embodiment of this application. The electronic device 100 may be, for example, […]. Figure 1 or Figure 2 The electronic device 100 shown. (Through...) Figure 5 The cross-section shown in the image illustrates a cross-sectional view of the electronic device 100.

[0157] The electronic device 100 may include a first adherend 10, a second adherend 20, and an annular colloid 140. The annular colloid 140 may be adhered between the first adherend 10 and the second adherend 20 to prevent external contaminants from entering the space enclosed by the first adherend 10, the second adherend 20, and the annular colloid 140 through the junction between the first adherend 10 and the annular colloid 140, and the junction between the first adherend 10 and the second adherend 20.

[0158] In this embodiment, the shape of the annular colloid 140 may include any annular shape such as a circular ring, square ring, polygonal ring, or elliptical ring. The annular colloid 140 may have material continuity. The annular colloid 140 may not have discontinuous ends.

[0159] Observe alone Figure 5 The cyclic colloid 140 in the diagram can be used to obtain a schematic structural diagram of the cyclic colloid 140, as shown below. Figure 6 As shown. Along Figure 6 The annular colloid 140 is observed at the AA section shown, and the following can be obtained. Figure 7 , Figure 10 The schematic structural diagram shown is shown.

[0160] The following is through Figure 6 , Figure 7 The example shown illustrates the structure of cyclic colloid 140.

[0161] The annular colloid 140 may include multiple colloid components. These components may be arranged end-to-end to form a fence-like structure. For example... Figure 6As shown, the plurality of colloidal components may include a first colloidal component 1403 and a second colloidal component 1404. A first end 14031 of the first colloidal component 1403 may be adjacent to a second end 14041 of the second colloidal component 1404. A gap (or interface) may be formed between the first end 14031 and the second end 14041. This gap can be used to fill other substances. The position of this gap relative to the electronic device 100 can be arbitrary. For example, the gap may be located at... Figure 1 or Figure 2 The long side or short side of the electronic device 100 shown.

[0162] Optionally, the distance between the first adhesive 10 and the second adhesive 20 on both sides of the gap can be the same. That is, the gap can be located away from a position where the distance between the first adhesive 10 and the second adhesive 20 fluctuates.

[0163] For example, the distance between the first adhesive 10 and the second adhesive 20 on both sides of the gap can be a first distance. The first position of the first adhesive 10 and the second position of the second adhesive 20 are positioned opposite each other, and these first and second positions can be located on one side of the gap. The distance between the first and second positions is the second distance. The first distance and the second distance can be different. The distance from the gap to the first or second position can be greater than a target distance. This target distance can be, for example, 2mm, 5mm, 7mm, 10mm, etc.

[0164] The annular colloid 140 may further include multiple colloid connectors 1405. Any colloid connector 1405 may be connected between two adjacent colloid components. The colloid components and the colloid connectors 1405 may be made of the same or different materials. In one example, under pressurized or heated conditions, the viscosity of the colloid connector 1405 may be lower than the viscosity of the colloid component. Viscosity, also known as viscosity, refers to the resistance exhibited by a substance to flow.

[0165] Optionally, the colloidal parts and colloidal connectors 1405 may be made of one or more of the following materials: acrylate, epoxy resin, polyurethane, etc.

[0166] Optionally, the colloid connector 1405 may be connected between two adjacent colloid components in at least one of the following ways: the colloid connector 1405 covers the gap between the two adjacent colloid components to prevent the gap from being exposed; the colloid connector 1405 fills the gap between the two adjacent colloid components so that the annular colloid 140 is continuous at the gap.

[0167] In the first possible scenario, the colloid connector 1405 can cover the gap between the first end 14031 of the first colloid 1403 and the second end 14041 of the second colloid 1404.

[0168] Combination Figures 5 to 7 Around the gap, the adhesive connector 1405 can make sealing contact with the end face 101 of the first adherend 10 near the second adherend 20, and can also make sealing contact with the end face 201 of the second adherend 20 near the first adherend 10; around the gap, the adhesive connector 1405 can make sealing contact with the first side 14032 of the first adhesive component 1403, and can also make sealing contact with the second side 14042 of the second adhesive component 1404. Both the first side 14032 and the second side 14042 are located between the first adherend 10 and the second adherend 20, and both can be located on the same side of either the first adhesive component 1403 or the second adhesive component 1404. Figure 6 In the example shown, the first side 14032 and the second side 14042 may be located outside the first colloid 1403 or the second colloid 1404. In other examples, the first side 14032 and the second side 14042 may be located inside the first colloid 1403 or the second colloid 1404.

[0169] Because the adhesive connector 1405 can be in sealed contact with both the first adherend 10 and the second adherend 20 around the gap, external contaminants generally have difficulty passing through the junction between the adhesive connector 1405 and the first adherend 10, and the junction between the adhesive connector 1405 and the second adherend 20. Similarly, because the adhesive connector 1405 can be in sealed contact with both the first adhesive component 1403 and the second adhesive component 1404 around the gap, external contaminants generally have difficulty passing through the junction between the adhesive connector 1405 and the first adhesive component 1403, and the junction between the adhesive connector 1405 and the first adhesive component 1403. Therefore, external contaminants generally have difficulty entering the gap between the first adhesive component 1403 and the second adhesive component 1404.

[0170] Optionally, around the gap, the adhesive connector 1405 can also make a sealing contact with the third side 14033 of the first adhesive component 1403 and the fourth side 14043 of the second adhesive component 1404; the third side 14033 and the fourth side 14043 can be located on the same side of the first adhesive component 1403 or the second adhesive component 1404; the third side 14033 can be located on both sides of the first adhesive component 1403, and the fourth side 14043 can be located on both sides of the second adhesive component 1404, along with the second side 14042. In other words, the adhesive connector 1405 can cover the gap from both sides of the adhesive component.

[0171] Optionally, the adhesive connector 1405 may further include a first portion located between the first adherend 10 and the first adhesive component 1403, and between the first adherend 10 and the second adhesive component 1404. Around the gap, the adhesive connector 1405 may have a sealing contact with a first end face 14035 of the first adhesive component 1403, and a sealing contact with a second end face 14045 of the second adhesive component 1404. The first end face 14035 may be the end face of the first adhesive component 1403 near the first adherend 10, and the second end face 14045 may be the end face of the second adhesive component 1404 near the first adherend 10. The end face may be a surface perpendicular to the side surface.

[0172] In this configuration, the adhesive connector 1405 can make sealing contact with at least one end face and one side face of the first adhesive component 1403, and at least one end face and one side face of the second adhesive component 1404. That is, the adhesive connector 1405 can block the gap between the first adhesive component 1403 and the second adhesive component 1404 from at least two directions. The inclusion of this first portion in the adhesive connector 1405 enhances its ability to block the gap. The thickness of this first portion can be relatively small to reduce the impact of the adhesive connector 1405 on the flatness of the first adhered object 10.

[0173] Optionally, the adhesive connector 1405 may further include a second portion, which may be located between the second adherend 20 and the first adhesive component 1403, and between the second adherend 20 and the second adhesive component 1404. Around the gap, the adhesive connector 1405 may be in sealing contact with a third end face 14036 of the first adhesive component 1403, and may be in sealing contact with a fourth end face 14046 of the second adhesive component 1404; the third end face 14036 may be the end face of the first adhesive component 1403 near the second adherend 20, and the fourth end face 14046 may be the end face of the second adhesive component 1404 near the second adherend 20.

[0174] The adhesive connector 1405 includes this second portion, which helps to enhance the coverage of gaps by the adhesive connector 1405. The thickness of this second portion can be relatively small to reduce the impact of the adhesive connector 1405 on the flatness of the second adherend 20.

[0175] In a second possible scenario, the colloid connector 1405 may fill the gap between the first end 14031 of the first colloid component 1403 and the second end 14041 of the second colloid component 1404.

[0176] Combination Figures 5 to 7At the gap, the adhesive connector 1405 can make sealing contact with the end face 101 of the first adherend 10 near the second adherend 20, and can also make sealing contact with the end face 201 of the second adherend 20 near the first adherend 10. At the gap, the adhesive connector 1405 can make sealing contact with the first joint surface 14034 of the first adhesive component 1403, and can also make sealing contact with the second joint surface 14044 of the second adhesive component 1404. The first joint surface 14034 can be a side surface of the first adhesive component 1403 near the second adhesive component 1404. The second joint surface 14044 can be a side surface of the second adhesive component 1404 near the first adhesive component 1403.

[0177] Because the adhesive connector 1405 can be in sealed contact with both the first adherend 10 and the second adherend 20, external contaminants are unlikely to pass through the junction between the adhesive connector 1405 and the first adherend 10, and the junction between the adhesive connector 1405 and the second adherend 20. Similarly, because the adhesive connector 1405 can be in sealed contact with both the first joint surface 14034 and the second joint surface 14044, external contaminants are also unlikely to pass through the junction between the adhesive connector 1405 and the first joint surface 14034, and the junction between the adhesive connector 1405 and the first joint surface 14034.

[0178] In a third possible scenario, multiple sealing methods can be combined for the same gap to improve the sealing performance between two adjacent gel components. For example, the gel connector 1405 can both fill and cover the gap between two adjacent gel components. Alternatively, the gap between two adjacent gel components can be divided into a first gap portion and a second gap portion. The gel connector 1405 may include a portion covering the first gap portion and a portion filling the second gap portion. Optionally, the gel connector 1405 may fill a portion of the first gap portion and cover a portion of the second gap portion.

[0179] exist Figure 7 In the example shown, the adhesive connector 1405 can fill the gap between the first adhesive component 1403 and the second adhesive component 1404. The adhesive connector 1405 can make sealing contact with both the first adhesive component 1403 and the second adhesive component 1404. The following describes... Figures 7 to 9 Taking the sealing contact between the colloidal connector 1405 and the first colloidal component 1403 as an example, this paper illustrates one or more specific meanings of sealing contact. Other sealing contact scenarios can be referenced. Figures 7 to 9 The example shown.

[0180] Figure 7 Local magnification in Figure 1The junction between the first colloidal component 1403 and the colloidal connector 1405 is shown. (Partial magnification) Figure 1 For example, it could be a magnified image at the micrometer scale. The first seam surface 14034 of the first colloidal component 1403 may be uneven. To ensure a sealed contact between the first colloidal component 1403 and the colloidal connector 1405, the first seam surface 14034 and the colloidal connector 1405 can engage with each other, and the colloidal connector 1405 can contact (almost) the entire first seam surface 14034.

[0181] For example, the first seam surface 14034 may include a plurality of first protruding regions 14037 and a plurality of first recessed regions 14038. In the first protruding region 14037 of the first seam surface 14034, the adhesive connector 1405 has a corresponding second recessed region 14057, and the second recessed region 14057 and the first protruding region 14037 can be fitted together; in the first recessed region 14038 of the first seam surface 14034, the adhesive connector 1405 has a corresponding second protruding region 14058, and the second protruding region 14058 and the first recessed region 14038 can be fitted together.

[0182] In other words, when observing the junction of the first colloid component 1403 and the colloid connector 1405 from a cross-section of the annular colloid 140, it can be observed that the first joint surface 14034 may not include the area that is not in contact with the colloid connector 1405, or the area of ​​the first joint surface 14034 that is not in contact with the colloid connector 1405 may be small enough that it is almost impossible for general external pollutants to pass through, so the area of ​​the first joint surface 14034 that is not in contact with the colloid connector 1405 can be ignored.

[0183] To ensure that the adhesive connector 1405 can contact all of the first joint surfaces 14034, compressive stress may be generated inside the adhesive connector 1405, for example. The adhesive connector 1405 and the first adhesive component 1403 may be pressed against each other at the junction to avoid the formation of gaps at the junction of the adhesive connector 1405 and the first adhesive component 1403.

[0184] Figure 7 Local magnification in Figure 2 A partial area of ​​the first joint surface 14034 and the junction with the adhesive connector 1405 are shown. (Partial magnification) Figure 2 For example, it could be a magnified view at the nanoscale. At the junction of a local area of ​​the first seam surface 14034 and the colloidal connector 1405, the first colloidal component 1403 and the colloidal connector 1405 can diffuse into each other to form a mixing region 1407.

[0185] The mixing region 1407 may include some of the components constituting the colloidal binder 1405, as well as some of the components constituting the first colloidal component 1403. The composition of the mixing region 1407 can be analyzed using analytical methods such as Fourier transform infrared spectroscopy (FTIR) and energy dispersive spectroscopy (EDS).

[0186] In one example, the first colloid component 1403 and the colloid connector 1405 use the same colloid material, and the colloid of the first colloid component 1403 and the colloid of the colloid connector 1405 can be fused together. The composition in the mixing region 1407 can be the same as the composition of the colloid of the first colloid component 1403, and can also be the same as the composition of the colloid of the colloid connector 1405.

[0187] In another example, the first colloidal component 1403 and the colloidal connector 1405 use different colloidal materials. For example, if the first colloidal component 1403 includes a first colloidal component and the colloidal connector 1405 includes a second colloidal component, then the material in the mixing region 1407 can be obtained by mixing the first colloidal component and the second colloidal component.

[0188] The connection relationship between the colloid connector 1405 and the first colloid component 1403 (or the second colloid component 1404) may differ from that between the colloid connector 1405 and... Figure 5 The connection relationship between the first adherend 10 (or the second adherend 20) is as follows. Since both the first colloid component 1403 and the colloid connector 1405 include colloids, the colloids in the first colloid component 1403 and the colloid connector 1405 can fuse, mix, and cross-link with each other. That is to say, the connection relationship between the colloids in the first colloid component 1403 and the colloid connector 1405 can be reflected at least in the mixing of materials. However, the material of the first adherend 10 is not a colloid, so the connection relationship between the first adherend 10 and the colloid connector 1405 is mainly an adhesive relationship. The sealed contact between the first adherend 10 and the colloid connector 1405 can be manifested, for example, by a relatively strong adhesive force between the first adherend 10 and the colloid connector 1405. There can be a relatively obvious interface between the first adherend 10 and the colloid connector 1405.

[0189] For local magnification Figure 2 By observing the rectangular region B in the image, we can obtain the following: Figure 8 The schematic structural diagram shown is shown.

[0190] Figure 8 The area outlined by the double-dotted circle shows the mixed region 1407. (See image.) Figure 8As shown, within the mixing region 1407, the molecular chains of the first colloidal component 1403 (such as...) Figure 8 (As shown by the dashed curve in the figure) can interact with the molecular chains of the colloidal connector 1405 (such as... Figure 8 The molecules (as shown by the solid curves in the diagram) intertwine, entangle, and cross each other. This helps to minimize the free volume between the molecular chains of the first colloidal component 1403 and the colloidal connector 1405. To prevent common external pollutants from passing through the junction of the first colloidal component 1403 and the colloidal connector 1405, the free volume between the molecular chains of the first colloidal component 1403 and the colloidal connector 1405 can be smaller than the cluster volume of common external pollutants.

[0191] For example, the cluster diameter of water molecules can be approximately 10 nm. To achieve relatively high water resistance, the free volume between the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405 can be smaller than the cluster volume of water molecules (e.g., less than 78.5 nm). 2 78.5nm 2 50.2nm 2 19.6nm 2 7nm 2 3.1nm 2 0.8nm 2 (etc.). In one example, the minimum spacing between the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405 can be less than 10nm, 8nm, 5nm, 3nm, 2nm, 1nm, etc.

[0192] Optionally, the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405 can be close to each other, and one or more (intermolecular) interaction forces can be formed between the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405, such as chemical bonds, hydrogen bonds, van der Waals forces, electrostatic interactions, etc. For example, regarding... Figure 8 By observing the molecular chains of the first colloidal component 1403 and the colloidal connector 1405 in region C, we can obtain... Figure 9 The schematic structural diagram is shown below. Figure 9 As shown, for example, covalent bonds and hydrogen bonds can be formed between the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405.

[0193] The intermolecular forces between the first colloidal component 1403 and the colloidal connector 1405 can form a molecular network between them. Firstly, this molecular network helps reduce the free volume between the molecular chains of the first colloidal component 1403 and the colloidal connector 1405, thereby increasing the difficulty for general external pollutants to pass through. Secondly, the molecular network helps increase the interaction forces between the first colloidal component 1403 and the colloidal connector 1405, enhancing their fusion and increasing the difficulty of separation, thus improving the sealing life of the annular colloid 140.

[0194] The following is through Figure 6 , Figure 10 Another example is shown to illustrate the structure of cyclic colloid 140. Figure 10 The cyclic colloid 140 shown and Figure 7 The ring-shaped colloid 140 shown is similar. Figure 10 The annular colloid 140 shown may include a first colloid component 1403 and a second colloid component 1404, and a colloid connector 1405 connecting the first colloid component 1403 and the second colloid component 1404. Figure 10 In the example shown, the adhesive connector 1405 can fill the gap between the first adhesive component 1403 and the second adhesive component 1404. The adhesive connector 1405 can be in sealed contact with both the first adhesive component 1403 and the second adhesive component 1404.

[0195] and Figure 7 The cyclic colloid 140 shown is different. Figure 10 The first colloid component 1403 shown may include a first adhesive layer 1413 and a second adhesive layer 1423, and a first base layer 1433 bonded between the first adhesive layer 1413 and the second adhesive layer 1423; Figure 10 The second colloidal component 1404 shown may include a third adhesive layer 1414 and a fourth adhesive layer 1424, and a second base layer 1434 bonded between the third adhesive layer 1414 and the fourth adhesive layer 1424. The base material can be used to provide mechanical support for the annular colloidal component. The base material may be, for example, a resin material.

[0196] Figure 10 The enlarged view shows the junction between the first colloidal component 1403 and the colloidal connector 1405. Figure 10 The magnified view in the image could be, for example, a magnified view at the nanoscale. The junction between the second colloidal component 1404 and the colloidal connector 1405 can be referenced to the junction between the first colloidal component 1403 and the colloidal connector 1405, and will not be described again here.

[0197] At the junction of the first colloidal component 1403 and the colloidal connector 1405, the first adhesive layer 1413 of the first colloidal component 1403 and the colloidal connector 1405 can diffuse into each other to form a first mixing region 14071. In other words, the first adhesive layer 1413 and the colloidal connector 1405 can fuse, mix, and crosslink with each other. The first mixing region 14071 may include both components constituting the colloidal connector 1405 and components constituting the first adhesive layer 1413.

[0198] In one example, the first adhesive layer 1413 and the adhesive connector 1405 use the same adhesive material, and the adhesives of the first adhesive layer 1413 and the adhesive connector 1405 can be fused together. The composition in the first mixing region 14071 can be the same as the composition of the adhesive in the first adhesive layer 1413, and can also be the same as the composition of the adhesive in the adhesive connector 1405.

[0199] In another example, the first adhesive layer 1413 and the adhesive connector 1405 use different adhesive materials. For example, if the first adhesive layer 1413 includes a first adhesive component and the adhesive connector 1405 includes a second adhesive component, then the material in the first mixing region 14071 can be obtained by mixing the first adhesive component and the second adhesive component.

[0200] Similarly, at the junction of the first colloidal component 1403 and the colloidal connector 1405, the second adhesive layer 1423 of the first colloidal component 1403 and the colloidal connector 1405 can diffuse into each other to form a second mixing region 14072. In other words, the second adhesive layer 1423 and the colloidal connector 1405 can fuse together. The second mixing region 14072 may include both components constituting the colloidal connector 1405 and components constituting the second adhesive layer 1423.

[0201] The connection relationship between the adhesive connector 1405 and the first adhesive layer 1413 (or the second adhesive layer 1423) may differ from that between the adhesive connector 1405 and... Figure 5 The connection relationship between the first base layer 1433 and the adhesive connector 1405 is as follows: Since both the first adhesive layer 1413 and the adhesive connector 1405 include adhesives, the adhesives in the first adhesive layer 1413 and the adhesive connector 1405 can fuse, mix, and cross-link with each other. That is to say, the connection relationship between the first adhesive layer 1413 and the adhesive connector 1405 can be at least reflected in the mixing of materials. However, the material of the first base layer 1433 is not an adhesive; therefore, the connection relationship between the first base layer 1433 and the adhesive connector 1405 is mainly an adhesive relationship. The sealed contact between the first base layer 1433 and the adhesive connector 1405 can be manifested, for example, by a relatively strong adhesive force between them. The first base layer 1433 and the adhesive connector 1405 can have a relatively clear interface.

[0202] The description of the first mixing region 14071 and the second mixing region 14072 can be found in [reference]. Figures 7 to 9 The example employee's mixed area 1407 shown will not be described again here.

[0203] exist Figure 10 In the example shown, the first adhesive layer 1413 can be connected to the adhesive connector 1405, and the adhesive connector 1405 can be connected to the second adhesive layer 1423. The first adhesive layer 1413, the second adhesive layer 1423, and the adhesive connector 1405 can be integrated into one unit, covering the end of the first base layer 1433 near the adhesive connector 1405. Similarly, the third adhesive layer 1414 can be connected to the adhesive connector 1405, and the adhesive connector 1405 can be connected to the fourth adhesive layer 1424. The third adhesive layer 1414, the fourth adhesive layer 1424, and the adhesive connector 1405 can be integrated into one unit, covering the end of the second base layer 1434 near the adhesive connector 1405. In other words, the first adhesive layer 1413, the second adhesive layer 1423, the third adhesive layer 1414, the fourth adhesive layer 1424, and the adhesive connector 1405 can be integrated into one unit.

[0204] Figure 11 The micrographs were obtained using a scanning electron microscope (SEM) at the interface between the first colloidal component 1403 and the colloidal connector 1405. In the micrographs, the grayscale and morphology of different materials may vary slightly. The micrographs show the first colloidal layer 1413 and the second colloidal layer 1423 of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405, and partially magnify the first mixing region 14071 and the second mixing region 14072 formed between the first colloidal component 1403 and the colloidal connector 1405. It can be seen from the micrographs that there are no obvious interfaces between the first colloidal layer 1413 and the colloidal connector 1405, nor between the second colloidal layer 1423 and the colloidal connector 1405.

[0205] The following describes one or more situations of unsealed contact.

[0206] In the first case of unsealed contact, the adhesive connector 1405 does not contact the component surrounding the gap, thus forming a notch. This notch can be part of the gap, which can be the gap between the first adhesive component 1403 and the second adhesive component 1404. This notch can be observed, for example, with the naked eye or with a low-magnification magnifying glass.

[0207] For example, the adhesive connector 1405 may not be in sealed contact with the second adherend 20, thus creating a gap between the adhesive connector 1405 and the second adherend 20. The adhesive connector 1405 may fill, but not completely fill, the gap between the first adhesive component 1403 and the second adhesive component 1404. The adhesive connector 1405 may only contact a portion of the first joint surface 14034 of the first adhesive component 1403. The adhesive connector 1405 may not contact all of the first joint surface 14034 of the first adhesive component 1403. The adhesive connector 1405 may only contact a portion of the second joint surface 14044 of the second adhesive component 1404. The adhesive connector 1405 may not contact all of the first joint surface 14034 of the first adhesive component 1403.

[0208] In the second type of unsealed contact, there is a hole in the overall contact area between the colloid connector 1405 and the components surrounding the gap.

[0209] At the micrometer scale, the first seam surface 14034 of the first colloidal component 1403 may be uneven. The colloidal connector 1405 does not completely adhere to the first seam surface 14034. For example, in the first raised region 14037 of the first seam surface 14034, the colloidal connector 1405 has a corresponding second recessed region 14057, which does not contact the first raised region 14037 to form a hole; in the first recessed region 14038 of the first seam surface 14034, the colloidal connector 1405 has a corresponding second raised region 14058, which does not contact the first recessed region 14038 to form a hole.

[0210] Within the overall contact range between the colloid connector 1405 and the first joint surface 14034, the area of ​​the non-contact area between the first joint surface 14034 and the colloid connector 1405 can be relatively large, allowing general external contaminants to pass through the junction of the colloid connector 1405 and the first joint surface 14034, which may reduce the sealing performance of the annular colloid 140.

[0211] In one example, the compressive stress within the colloid connector 1405 may be relatively small, or tensile stress may exist within the colloid connector 1405. This prevents the formation of a sufficiently large compressive force between the colloid connector 1405 and the first colloid component 1403, making it relatively easy to form a relatively large hole at the junction of the colloid connector 1405 and the first colloid component 1403. For example, in scenarios involving drastic temperature changes, the hole between the colloid connector 1405 and the first colloid component 1403 may increase, making it easier for general external contaminants to pass through the junction of the colloid connector 1405 and the first joint surface 14034.

[0212] In the third type of unsealed contact, there is an interface at the junction between the colloid connector 1405 and the colloid component around the gap.

[0213] At the nanoscale, there can be a relatively distinct interface between the first joint surface 14034 and the colloidal connector 1405. Near this interface, gaps are relatively easy to form between the colloidal component and the colloidal connector.

[0214] The molecular chains of the first colloidal component 1403 and the colloidal connector 1405 can be located on opposite sides of the interface. The molecular chains of the first colloidal component 1403 and the colloidal connector 1405 can be essentially non-intertwined, non-entangled, and non-crossed.

[0215] A free space can be formed between the molecular chains of the first colloidal component 1403 and the colloidal connector 1405, which are close to each other. Since the molecular chains do not intersect, this free space can be relatively large. For example, the free volume between the molecular chains of the first colloidal component 1403 and the colloidal connector 1405 can be larger than the cluster volume of typical external pollutants (e.g., greater than 78.5 nm). 2 176.6nm 2 314nm 2 (etc.). In one example, the minimum spacing between the molecular chains of the first colloidal component 1403 and the molecular chains of the colloidal connector 1405 can be greater than 10 nm, 15 nm, 20 nm, etc.

[0216] If the adhesive connector 1405 only covers the exposed gap between two adjacent adhesive components, it is difficult to maintain a sealed contact between the adhesive connector 1405 and the adhesive component over a relatively long period of time (for example, the adhesive force can be lost relatively quickly). Therefore, it is relatively difficult to establish a sufficiently stable sealed connection between the adhesive connector 1405 and the adhesive component.

[0217] If the adhesive connector 1405 can fill the gap between two adjacent adhesive components, that is, the adhesive connector 1405 can completely seal the joint surface of each of the two adjacent adhesive components, and the adhesive connector 1405 can seal the joint surface of each adhesive component around the gap, then all the components around the gap can fit tightly with the adhesive connector 1405, which is beneficial to maintaining the sealed connection between the adhesive connector 1405 and the components around the gap.

[0218] Figure 12 A schematic structural diagram of a processing method for assembling electronic devices according to an embodiment of this application is shown. Figure 12 The method shown illustrates a processing technique for cyclic colloid 140.

[0219] By cutting one or more colloidal raw materials, multiple colloidal components and multiple colloidal connectors 1405 can be obtained. The multiple colloidal components may, for example, include at least one first colloidal component 1403 and at least one second colloidal component 1404.

[0220] like Figure 12 As shown, multiple first colloidal components 1403 can be obtained by cutting the first colloidal raw material 1401. Multiple second colloidal components 1404 can be obtained by cutting the second colloidal raw material 1402. Multiple colloidal connectors 1405 can be obtained by cutting the third colloidal raw material 1406.

[0221] Then, multiple adhesive components and multiple adhesive connectors 1405 are positioned between the first adherend 10 and the second adherend 20. The adhesive components can be arranged end-to-end. Each adhesive connector 1405 can be located between an adhesive component and the first adherend 10, covering the gap between two adjacent adhesive components. That is, the adhesive connector 1405 can overlap between two adjacent adhesive components. The multiple adhesive components and multiple adhesive connectors 1405 can be assembled during the adhesive bonding process or during the overall machine assembly process.

[0222] like Figure 12 As shown, the first end 14031 of the first colloid component 1403 can be disposed adjacent to the second end 14041 of the second colloid component 1404. The colloid connector 1405 can cover the gap between the first end 14031 and the second end 14041. The colloid connector 1405 can overlap between the first end 14031 and the second end 14041.

[0223] In one example, such as Figure 12 As shown, the width of the first colloid component 1403 can be the same as the width of the second colloid component 1404, for example, both being W. Optionally, the width W' of the colloid connector 1405 can be greater than or equal to the width W of the first colloid component 1403 or the second colloid component 1404. For example, W' / W > 1.5, or W' / W > 2, or W' / W > 3, or W' / W > 4, or W' / W > 5.

[0224] In one example, such as Figure 12 As shown, the thickness of the first colloidal component 1403 can be the same as the thickness of the second colloidal component 1404, for example, both being H. Optionally, the thickness H' of the colloidal connector 1405 can be greater than or equal to the thickness H of the first colloidal component 1403 or the second colloidal component 1404. For example, H' / H > 1.5, or H' / H > 2, or H' / H > 3, or H' / H > 4, or H' / H > 5.

[0225] In one example, such as Figure 12As shown, the length L of the adhesive connector 1405 can be greater than the width T of the gap, that is, the length L of the adhesive connector 1405 can be greater than or equal to the interval between the first end 14031 and the second end 14041. For example, L / T > 1.5, or L / T > 2, or L / T > 3, or L / T > 4, or L / T > 5.

[0226] Subsequently, the first adherend 10 and the second adherend 20 are forced to come closer together by means of, for example, pressure (such as room temperature pressing), or pressure and heat (such as high temperature pressing). The adhesive properties of the adhesive component and the adhesive connector 1405 may be activated by, for example, one or more of the following: pressure, heat, light (such as ultraviolet light (UV)).

[0227] Room temperature pressing can be applied, for example, to colloidal materials with relatively low modulus and relatively low hardness. The modulus M1 of materials suitable for room temperature pressing can, for example, be: 10 kPa ≤ M1 ≤ 100 kPa. Alternatively, 10 kPa ≤ M1 ≤ 50 kPa, or 10 kPa ≤ M1 ≤ 40 kPa, or 10 kPa ≤ M1 ≤ 30 kPa, or 10 kPa ≤ M1 ≤ 20 kPa, or 20 kPa ≤ M1 ≤ 50 kPa, or 30 kPa ≤ M1 ≤ 50 kPa, or 40 kPa ≤ M1 ≤ 50 kPa.

[0228] High-temperature pressing can be applied, for example, to colloidal materials with relatively high modulus and hardness (heating helps reduce the modulus and viscosity of colloidal materials), or to thermosetting colloidal materials (thermosetting colloidal materials are solid at room temperature; they can turn into a liquid state after heating; and they can turn into a solid state after cooling to room temperature). For materials suitable for high-temperature pressing, the modulus M2 at room temperature can, for example, be 10 kPa ≤ M1 ≤ 1000 kPa, and the modulus M2 at high temperature can, for example, be M3 ≤ 50 kPa. Optionally, M3 ≤ 40 kPa, or M3 ≤ 30 kPa, or M3 ≤ 20 kPa, or M3 ≤ 10 kPa, or M3 ≤ 5 kPa, or M3 ≤ 1 kPa.

[0229] like Figure 12 As shown, after pressurization, the adhesive connector 1405, originally located between the adhesive components and the parts, can enter the gap between two adjacent adhesive components. After pressurization, multiple adhesive components and multiple adhesive connectors 1405 can be relatively tightly adhered between the first adhered object 10 and the second adhered object 20, that is, each adhesive component and each adhesive connector can make sealed contact with the first adhered object 10 and the second adhered object 20. Furthermore, the adhesive connector 1405 can fill the gap between two adjacent adhesive components.

[0230] The adhesive connector 1405 can be pressed into the gap between two adjacent adhesive components. After pressing, mutual compressive forces can exist between the adhesive connector 1405 and the adhesive components, between the adhesive components and the adhered objects, and between the adhesive connector 1405 and the adhered objects. In one example, the peeling force required to peel the annular adhesive 140 from the first adhered object 10 and the second adhered object 20 can be greater than 8 N / cm, for example. Optionally, this peeling force can be greater than 12 N / cm, for example. Therefore, it is difficult for gaps that allow general external contaminants to pass through to appear between the adhesive connector 1405 and the adhesive components, between the adhesive components and the adhered objects, and between the adhesive connector 1405 and the adhered objects.

[0231] After lamination, the first adherend 10 and the second adherend 20 can achieve a relatively high level of waterproofing (e.g., IPX7 or higher). Some tests can be conducted to verify whether the first adherend 10 and the second adherend 20 meet the waterproofing requirements.

[0232] For example, samples can be applied Figures 5 to 11 The proposed solution has a high probability of the sample passing the standard waterproof test (e.g., 95-100%).

[0233] For example, during the waterproofing test of a sample, the influence of one or more of the following factors can be superimposed: torsion, soft pressure, alternating damp heat, temperature cycling, etc., so that the sample can be applied... Figures 5 to 11 The solution shown is as follows. In other words, it is applied in scenarios where a leak could be compromised. Figures 5 to 11 The sample of the proposed solution has a relatively high probability of passing the waterproof test.

[0234] Combination Figure 12 The following examples illustrate how the adhesive connector 1405 seals and connects two adjacent adhesive components. These examples can be applied to bonding scenarios involving the middle frame and the back cover. Process parameters for other bonding scenarios can be found in the examples below and will not be repeated here.

[0235] Example 1

[0236] The widths of the first colloidal component 1403 and the second colloidal component 1404 can both be approximately W = 2.5 mm. The width W' of the colloidal connector 1405 can also be approximately 2.5 mm.

[0237] The thickness of both the first colloidal component 1403 and the second colloidal component 1404 can be approximately H = 0.3 mm. The thickness H' of the colloidal connector 1405 can be approximately 0.3 mm.

[0238] After assembling multiple gel components, the gap distance (i.e., the gap width) T between the first end 14031 of the first gel component 1403 and the second end 14041 of the second gel component 1404 can be approximately 0.8 mm. The length L of the gel connector 1405 can be approximately 4 mm.

[0239] The modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 at room temperature (e.g., 25°C) is approximately 45–50 kPa.

[0240] The first adherend 10 and the second adherend 20 can be bonded together using a room temperature pressing process via a first adhesive component 1403, a second adhesive component 1404, and an adhesive connector 1405. The pressure used in the room temperature pressing process can be, for example, 1000 N.

[0241] Example 2

[0242] The widths of the first colloidal component 1403 and the second colloidal component 1404 can both be approximately W = 2.5 mm. The width W' of the colloidal connector 1405 can also be approximately 2.5 mm.

[0243] The thickness of both the first colloidal component 1403 and the second colloidal component 1404 can be approximately H = 0.3 mm. The thickness H' of the colloidal connector 1405 can be approximately 0.3 mm.

[0244] After assembling multiple gel components, the gap distance (i.e., the gap width) T between the first end 14031 of the first gel component 1403 and the second end 14041 of the second gel component 1404 can be approximately 0.8 mm. The length L of the gel connector 1405 can be approximately 4 mm.

[0245] The modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 at room temperature (e.g., 25°C) is approximately 45–50 kPa. After pressing and heating (e.g., at 60°C), the modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 can be reduced to approximately 35 kPa.

[0246] The first adherend 10 and the second adherend 20 can be bonded together using a high-temperature pressing process via a first adhesive component 1403, a second adhesive component 1404, and an adhesive connector 1405. The pressure used in the high-temperature pressing process can be, for example, 1000 N, and the temperature can be approximately 70 °C.

[0247] Example 3

[0248] The widths of the first colloidal component 1403 and the second colloidal component 1404 can both be approximately W = 2.5 mm. The width W' of the colloidal connector 1405 can also be approximately 2.5 mm.

[0249] The thickness of both the first colloidal component 1403 and the second colloidal component 1404 can be approximately H = 0.3 mm. The thickness H' of the colloidal connector 1405 can be approximately 0.3 mm.

[0250] After assembling multiple colloidal components, the gap distance (i.e., the gap width) T between the first end 14031 of the first colloidal component 1403 and the second end 14041 of the second colloidal component 1404 can be approximately 0.5 mm. The length L of the colloidal connector 1405 can be approximately 4 mm.

[0251] The modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 at room temperature (e.g., 25°C) is approximately 45–50 kPa. After pressing and heating, the modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 can be reduced to approximately 35 kPa.

[0252] The first adherend 10 and the second adherend 20 can be bonded together using a high-temperature pressing process via a first adhesive component 1403, a second adhesive component 1404, and an adhesive connector 1405. The pressure used in the high-temperature pressing process can be, for example, 1000 N, and the temperature can be approximately 70 °C.

[0253] Example 4

[0254] The widths of the first colloidal component 1403 and the second colloidal component 1404 can both be approximately W = 2.5 mm. The width W' of the colloidal connector 1405 can also be approximately 2.5 mm.

[0255] The thickness of both the first colloidal component 1403 and the second colloidal component 1404 can be approximately H = 0.3 mm. The thickness H' of the colloidal connector 1405 can be approximately 0.3 mm.

[0256] After assembling multiple colloidal components, the gap distance (i.e., the gap width) T between the first end 14031 of the first colloidal component 1403 and the second end 14041 of the second colloidal component 1404 can be approximately 0.8 mm. The length L of the colloidal connector 1405 can be approximately 2 mm.

[0257] The modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 at room temperature (e.g., 25°C) is approximately 45–50 kPa. After pressing and heating, the modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 can be reduced to approximately 35 kPa.

[0258] The first adherend 10 and the second adherend 20 can be bonded together using a high-temperature pressing process via a first adhesive component 1403, a second adhesive component 1404, and an adhesive connector 1405. The pressure used in the high-temperature pressing process can be, for example, 1000 N, and the temperature can be approximately 70 °C.

[0259] Example 5

[0260] The widths of the first colloidal component 1403 and the second colloidal component 1404 can both be approximately W = 2.5 mm. The width W' of the colloidal connector 1405 can also be approximately 2.5 mm.

[0261] The thickness of both the first colloidal component 1403 and the second colloidal component 1404 can be approximately H = 0.3 mm. The thickness H' of the colloidal connector 1405 can be approximately 0.6 mm.

[0262] After assembling multiple colloidal components, the gap distance (i.e., the gap width) T between the first end 14031 of the first colloidal component 1403 and the second end 14041 of the second colloidal component 1404 can be approximately 1.5 mm. The length L of the colloidal connector 1405 can be approximately 4 mm.

[0263] The modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 at room temperature (e.g., 25°C) is approximately 45–50 kPa. After pressing and heating, the modulus of the first colloidal component 1403, the second colloidal component 1404, and the colloidal connector 1405 can be reduced to approximately 35 kPa.

[0264] The first adherend 10 and the second adherend 20 can be bonded together using a high-temperature pressing process via a first adhesive component 1403, a second adhesive component 1404, and an adhesive connector 1405. The pressure used in the high-temperature pressing process can be, for example, 1000 N, and the temperature can be approximately 70 °C.

[0265] The method provided in this application can be applied to sealing and bonding scenarios between multiple adhesive components. In another example, the annular adhesive may have one adhesive component and one adhesive connector. The two ends (e.g., a first end and a second end) of the adhesive component are arranged adjacently to form a gap, and the adhesive connector can fill the gap. In this example, at the gap, the adhesive connector can make sealed contact with the first adherend, the second adherend, the first end of the adhesive component, and the second end of the adhesive component. Specific details of the sealed contact can be found in [reference needed]. Figures 7 to 11 The examples shown will not be elaborated upon further here. The processing methods for cyclic colloids can be found in [reference needed]. Figure 12 The examples shown will not be elaborated upon further here.

[0266] This application provides a ring-shaped colloid and a method for processing it. The ring-shaped colloid can have relatively high water resistance and sealing properties, and also improves the utilization rate of colloidal raw materials, reduces processing costs, and enhances the environmental friendliness of processing ring-shaped colloids.

[0267] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device comprising a first adherend, a second adherend, and an annular adhesive, wherein the annular adhesive is adhered between the first adherend and the second adherend, characterized in that, The annular colloid comprises: A first colloidal component and a second colloidal component, wherein a first end of the first colloidal component is adjacent to a second end of the second colloidal component, and a gap exists between the first end and the second end; A gel connector, wherein the gel connector fills the gap, and at the gap, the gel connector is in sealed contact with the first adhered object, the second adhered object, the first gel component, and the second gel component; Wherein, under pressure or temperature conditions, the viscosity of the colloidal connector is less than the viscosity of the first colloidal component; The colloidal connector satisfies one or more of the following: The width W' of the colloidal connector is greater than or equal to the width W of the first colloidal component, satisfying: W' / W > 1.

5. The thickness H' of the colloidal connector is greater than or equal to the thickness H of the first colloidal component, satisfying: H' / H > 1.

5. The length L of the colloid connector is greater than or equal to the width T of the gap, satisfying: L / T > 1.

5.

2. The electronic device according to claim 1, characterized in that, The adhesive connector is sealed and bonded between the first and second adhered objects. The adhesive material of the adhesive connector is fused with the adhesive material of the first adhesive component, and the adhesive material of the adhesive connector is fused with the adhesive material of the second adhesive component.

3. The electronic device according to claim 1, characterized in that, The colloidal connector and the first colloidal component fuse together to form a mixing region, the mixing region including some components constituting the colloidal connector and some components constituting the first colloidal component.

4. The electronic device according to claim 1, characterized in that, The first colloidal component includes a first adhesive layer, a second adhesive layer, and a first base layer. The first base layer is sealed and adhered between the first adhesive layer and the second adhesive layer. The colloidal connector is fused with both the first adhesive layer and the second adhesive layer, and the colloidal connector is sealed and adhered to one end of the first base layer.

5. The electronic device according to claim 1, characterized in that, The minimum spacing between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

6. The electronic device according to claim 1, characterized in that, One or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the first colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

7. The electronic device according to claim 1, characterized in that, The first colloid component includes a first seam surface that is in sealing contact with the colloid connector. The first seam surface includes a plurality of first raised areas and a plurality of first recessed areas. The first colloid component is in contact with each of the first raised areas and each of the first recessed areas.

8. The electronic device according to claim 1, characterized in that, The material of the colloidal connector is any one of the following: acrylate, epoxy resin, or polyurethane.

9. The electronic device according to claim 1, characterized in that, The modulus M1 of the colloidal connector at room temperature is: 10 kPa≤M1≤100 kPa.

10. The electronic device according to claim 1, characterized in that, The modulus M2 of the colloidal connector at room temperature is 10 kPa≤M2≤1000 kPa, and the modulus M3 of the colloidal connector at high temperature is M3≤50 kPa.

11. The electronic device according to claim 1, characterized in that, Some of the adhesive connectors are located between the first adherend and the first adhesive component, or between the second adhesive component and the second adherend.

12. The electronic device according to claim 1, characterized in that, The first colloidal component is located on the short side of the electronic device, and the second colloidal component is located on the long side of the electronic device.

13. The electronic device according to any one of claims 1 to 12, characterized in that, The first object to be glued is the middle frame, and the second object to be glued is the back cover; or... The first object to be adhered to is the middle frame, and the second object to be adhered to is the display screen; or... The first object to be glued is the middle frame, and the second object to be glued is the front cover; or... The first object to be glued is the front cover, and the second object to be glued is the display screen.

14. A method for assembling electronic devices, characterized in that, The method includes: Cut one or more colloidal raw materials to obtain multiple colloidal connectors and multiple colloidal components, wherein the multiple colloidal components include a first colloidal component and a second colloidal component; The plurality of adhesive connectors and the plurality of adhesive components are disposed between the first and second adhered objects, the plurality of adhesive components are disposed end to end, the adhesive connectors are located between the plurality of adhesive components and the first adhered object, and the adhesive connectors cover the gap between two adjacent adhesive components. The first and second objects to be bonded are brought close together so that the adhesive connector fills the gap. At the gap, the adhesive connector is in sealed contact with the first object to be bonded, the second object to be bonded, the first adhesive component, and the second adhesive component. Wherein, under pressure or temperature conditions, the viscosity of the colloidal connector is less than the viscosity of the first colloidal component; The colloidal connector satisfies one or more of the following: The width W' of the colloidal connector is greater than or equal to the width W of the first colloidal component, satisfying: W' / W > 1.

5. The thickness H' of the colloidal connector is greater than or equal to the thickness H of the first colloidal component, satisfying: H' / H > 1.

5. The length L of the colloid connector is greater than or equal to the width T of the gap, satisfying: L / T > 1.

5.

15. The method according to claim 14, characterized in that, The modulus M1 of the colloidal connector at room temperature is: 10 kPa≤M1≤100 kPa.

16. The method according to claim 14, characterized in that, The modulus M2 of the colloidal connector at room temperature is 10 kPa≤M2≤1000 kPa, and the modulus M3 of the colloidal connector at high temperature is M3≤50 kPa.

17. The method according to claim 14, characterized in that, The adhesive connector is sealed and bonded between the first and second adhered objects. The adhesive material of the adhesive connector is fused with the adhesive material of the first adhesive component, and the adhesive material of the adhesive connector is fused with the adhesive material of the second adhesive component.

18. The method according to claim 14, characterized in that, The colloidal connector and the first colloidal component fuse together to form a mixing region, the mixing region including some components constituting the colloidal connector and some components constituting the first colloidal component.

19. The method according to claim 14, characterized in that, The first colloidal component includes a first adhesive layer, a second adhesive layer, and a first base layer. The first base layer is sealed and adhered between the first adhesive layer and the second adhesive layer. The colloidal connector is fused with both the first adhesive layer and the second adhesive layer, and the colloidal connector is sealed and adhered to one end of the first base layer.

20. The method according to claim 14, characterized in that, The minimum spacing between the molecular chains of the first colloidal component and the molecular chains of the colloidal connector is less than 10 nm.

21. The method according to claim 14, characterized in that, One or more of the following exist between the molecular chains of the colloidal connector and the molecular chains of the first colloidal component: chemical bonds, hydrogen bonds, van der Waals forces, and electrostatic interactions.

22. The method according to claim 14, characterized in that, The first colloid component includes a first seam surface that is in sealing contact with the colloid connector. The first seam surface includes a plurality of first raised areas and a plurality of first recessed areas. The first colloid component is in contact with each of the first raised areas and each of the first recessed areas.

23. The method according to claim 14, characterized in that, The material of the colloidal connector is any one of the following: acrylate, epoxy resin, or polyurethane.

24. The method according to claim 14, characterized in that, Some of the adhesive connectors are located between the first adherend and the first adhesive component, or between the second adhesive component and the second adherend.

25. The method according to any one of claims 14 to 24, characterized in that, The first object to be glued is the middle frame, and the second object to be glued is the back cover; or... The first object to be adhered to is the middle frame, and the second object to be adhered to is the display screen; or... The first object to be glued is the middle frame, and the second object to be glued is the front cover; or... The first object to be glued is the front cover, and the second object to be glued is the display screen.

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