Circuit board with heat dissipation function and manufacturing method thereof

Abstract

The present application provides a method for manufacturing a circuit board with a heat dissipation function, comprising the following steps: providing a first metal layer; electroplating copper on the first metal layer to form a first heat-conducting portion; forming a first insulating layer on the first adhesive layer and the first heat-conducting portion, with a first blind hole being provided in the first insulating layer; filling the first blind hole with a thermoelectric separation metal to form a second heat-conducting portion; forming a first conductive circuit layer on the first insulating layer; forming a second insulating layer on the first conductive circuit layer, with a second blind hole being provided in the second insulating layer; electroplating copper in the second blind hole to form a third heat-conducting portion; and installing electronic components on the second insulating layer, thereby obtaining the circuit board. The circuit board manufactured by the manufacturing method of the present application has a good heat dissipation effect and a low manufacturing cost. The present application also provides a circuit board manufactured by the manufacturing method.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a circuit board with heat dissipation function and a manufacturing method thereof. Background Art

[0002] Electronic products are continuously evolving towards lighter weight, higher frequency, higher density, and higher performance. With the gradual implementation of 5G communications, the power requirements for electronic components are increasing. This results in significant heat dissipation from these components, which can easily cause localized overheating of circuit boards. To address this heat dissipation issue, existing technologies typically embed copper blocks within the circuit boards, but this heat dissipation is not ideal. Summary of the Invention

[0003] In view of this, the present application provides a method for manufacturing a circuit board with heat dissipation function, which has good heat dissipation effect and low cost.

[0004] In addition, it is also necessary to provide a circuit board with heat dissipation function produced by the above-mentioned production method.

[0005] An embodiment of the present application provides a method for manufacturing a circuit board with heat dissipation function, comprising the following steps:

[0006] Providing a first metal layer, the first metal layer comprising a body and a first column protruding from the body, with a first groove formed between the body and the first column;

[0007] forming a first adhesive layer in the first groove;

[0008] Electroplating copper on the first column to form a first heat conducting portion, and making the first heat conducting portion thermally conductive with the first column;

[0009] forming a first insulating layer on the first adhesive layer and the first heat conducting portion, wherein a first blind hole is formed in the first insulating layer;

[0010] Filling the first blind hole with a thermoelectric separation metal to form a second heat conducting portion, and making the second heat conducting portion thermally conductive with the first heat conducting portion;

[0011] forming a first conductive circuit layer on the first insulating layer, and thermally connecting the first conductive circuit layer to the second heat conducting portion;

[0012] forming a second insulating layer on the first conductive circuit layer, wherein a second blind hole is formed in the second insulating layer, and the second blind hole corresponds to the first blind hole;

[0013] Electroplating copper in the second blind hole to form a third heat conducting portion, and thermally conducting the third heat conducting portion to the first conductive circuit layer; and

[0014] An electronic component is mounted on the second insulating layer, and the electronic component is thermally connected to the third heat conducting portion, thereby obtaining the circuit board.

[0015] An embodiment of the present application further provides a circuit board with heat dissipation function, comprising:

[0016] The first metal layer includes a body and a first column protruding from the body, wherein a first groove is formed between the body and the first column;

[0017] a first adhesive layer, located in the first groove;

[0018] a first heat conducting portion, located on the first column and thermally connected to the first column, wherein the first heat conducting portion is made of copper;

[0019] a first insulating layer, located on the first adhesive layer and the first heat-conducting portion, wherein a first blind hole is formed in the first insulating layer, the first blind hole forming a second heat-conducting portion, and the second heat-conducting portion is thermally connected to the first heat-conducting portion, and the second heat-conducting portion is made of a thermoelectric separation metal;

[0020] a first conductive circuit layer, located on the first insulating layer and thermally connected to the second heat conducting portion;

[0021] a second insulating layer, located on the first conductive circuit layer, having a second blind hole formed in the second insulating layer, the second blind hole corresponding to the first blind hole, the second blind hole forming a third heat conducting portion, the third heat conducting portion being thermally connected to the first conductive circuit layer, and the third heat conducting portion being made of copper; and

[0022] The electronic component is located in the second insulating layer and is thermally connected to the third heat conducting portion.

[0023] In this application, copper is electroplated on the first column to form a first heat conduction portion, the thermoelectric separation metal is filled into the first blind hole to form a second heat conduction portion, and the second heat conduction portion is thermally connected to the first heat conduction portion. Copper is electroplated in the second blind hole to form a third heat conduction portion, and the third heat conduction portion is thermally connected to the second heat conduction portion. Heat generated by the electronic component is transferred to the first metal layer through the third heat conduction portion, the second heat conduction portion, and the first heat conduction portion, thereby reducing the temperature of the electronic component itself and improving the heat dissipation effect of the circuit board. At the same time, the third heat conduction portion made of copper, the second heat conduction portion made of thermoelectric separation metal, and the first heat conduction portion made of copper are alternately distributed. Since copper is less expensive than the thermoelectric separation metal, the production cost of the circuit board can be reduced while meeting the heat dissipation requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 Schematic diagram of the structure of the first metal layer provided in one embodiment of the present application.

[0025] Figure 2 is Figure 1 The diagram shows a structure after a first adhesive layer and a second adhesive layer are formed in the first groove and the second groove respectively.

[0026] Figure 3 is Figure 2 The diagram shows a structure in which a first heat conducting portion and a first heat conducting member are formed on the first column and the second column respectively, a first insulating layer is formed on the first adhesive layer and the first heat conducting portion, and a fourth insulating layer is formed on the second adhesive layer and the first heat conducting member.

[0027] Figure 4 is Figure 3 The schematic diagram of the structure after the first blind hole, the first blind groove and the through hole are opened in the first intermediate body is shown.

[0028] Figure 5 is Figure 4 The diagram shows a structure after a second heat conducting portion, a second heat conducting member and a first heat conducting channel are formed in the first blind hole, the first blind groove and the through hole respectively.

[0029] Figure 6 is Figure 5 The diagram shows a structure after a first copper foil layer and a second copper foil layer are formed on the first insulating layer and the fourth insulating layer respectively.

[0030] Figure 7 It will Figure 6 The diagram shows a structure after the first copper foil layer and the second copper foil layer are etched to form a first conductive circuit layer and a fourth conductive circuit layer respectively.

[0031] Figure 8 is Figure 7 The diagram shows a structure after a second insulating layer and a second metal layer are formed on the first conductive circuit layer and the fourth conductive circuit layer respectively.

[0032] Figure 9 is Figure 8 The diagram shows a structure after a second blind hole is opened in the second insulating layer, and a second blind groove and a third blind groove are opened in the second metal layer.

[0033] Figure 10 is Figure 9 The diagram shows a structure after a third heat conducting portion, a third heat conducting member and a fourth heat conducting member are formed in the second blind hole, the second blind groove and the third blind groove respectively.

[0034] Figure 11 is Figure 10The diagram shows a structure after a second conductive circuit layer and a fifth conductive circuit layer are formed on the second insulating layer and the second metal layer respectively.

[0035] Figure 12 is Figure 11 FIG. 1 is a schematic structural diagram of a structure after a third insulating layer is formed on the second conductive circuit layer.

[0036] Figure 13 is Figure 12 The schematic diagram of the structure after an opening is opened in the second intermediate body and a second heat conduction channel is formed in the opening.

[0037] Figure 14 is Figure 13 The schematic diagram of the structure after the third conductive circuit layer is formed on the third insulating layer is shown.

[0038] Figure 15 is Figure 14 The diagram shows a structure after a first solder mask layer and a second solder mask layer are formed on the third conductive circuit layer and the fifth conductive circuit layer respectively.

[0039] Figure 16 It is cutting Figure 15 The schematic diagram of the structure after the first solder mask layer, the third conductive circuit layer, the third insulating layer and the second conductive circuit layer is shown.

[0040] Figure 17 is Figure 16 A schematic structural diagram of a circuit board obtained after electronic components are installed in the groove shown.

[0041] Description of main component symbols

[0042] Circuit board 100

[0043] First metal layer 10

[0044] Ontology 101

[0045] First column 102

[0046] Second column 103

[0047] First slot 11

[0048] Second slot 12

[0049] First adhesive layer 20

[0050] Second adhesive layer 21

[0051] First heat transfer portion 22

[0052] First heat conducting member 23

[0053] First insulating layer 24

[0054] Fourth insulating layer 25

[0055] First Intermediate 30

[0056] First blind hole 31

[0057] First blind groove 32

[0058] Through hole 33

[0059] Second heat transfer portion 34

[0060] Second heat conducting member 35

[0061] First heat conduction channel 36

[0062] First copper foil layer 40

[0063] Second copper foil layer 41

[0064] First conductive circuit layer 42

[0065] Fourth conductive circuit layer 43

[0066] Second insulating layer 50

[0067] Second blind hole 501

[0068] Second metal layer 51

[0069] Second blind groove 511

[0070] The third blind groove 512

[0071] The third heat transfer portion 52

[0072] The third heat conducting member 53

[0073] Fourth heat conducting member 54

[0074] The second conductive circuit layer 60

[0075] Fifth conductive circuit layer 61

[0076] The third insulating layer 62

[0077] Second intermediate 70

[0078] Second heat conduction channel 71

[0079] The third conductive circuit layer 72

[0080] First solder resist layer 80

[0081] Second solder resist layer 81

[0082] Circuit board 82

[0083] Groove 821

[0084] Electronic components 90

[0085] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0086] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0087] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0088] In order to further illustrate the technical means and effects adopted by this application to achieve the intended purpose, the following detailed description of this application is made in conjunction with the accompanying drawings and preferred implementation methods.

[0089] An embodiment of the present application provides a method for manufacturing a circuit board with heat dissipation function, comprising the following steps:

[0090] Step S11, please refer to Figure 1 , providing a first metal layer 10.

[0091] In one embodiment, the first metal layer 10 includes a body 101 and a first column 102 and a second column 103 protruding from opposite surfaces of the body 101. A first slot 11 is formed between the body 101 and the first column 102, and a second slot 12 is formed between the body 101 and the second column 103. In one embodiment, the first column 102 and the second column 103 are opposite to each other.

[0092] The first metal layer 10 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive part and the heat conductive part are in different positions.

[0093] In one embodiment, the first metal layer 10 is made of aluminum nitride or potassium nitride. The first metal layer 10 has good thermal conductivity and certain electrical conductivity.

[0094] Step S12, see Figure 2 A first adhesive layer 20 and a second adhesive layer 21 are formed in the first groove 11 and the second groove 12 respectively.

[0095] The surface of the first adhesive layer 20 away from the body 101 is substantially flush with the surface of the first column 102 away from the body 101 , and the surface of the second adhesive layer 21 away from the body 101 is substantially flush with the surface of the second column 103 away from the body 101 .

[0096] Step S13, please refer to Figure 3 Copper is electroplated on the first pillar 102 and the second pillar 103 to form a first heat conducting portion 22 and a first heat conducting member 23 respectively.

[0097] The first heat conducting portion 22 is thermally connected to the first column 102 , and the first heat conducting member 23 is thermally connected to the second column 103 .

[0098] Step S14 , forming a first insulating layer 24 on the first adhesive layer 20 and the first heat conducting portion 22 , and forming a fourth insulating layer 25 on the second adhesive layer 21 and the first heat conducting member 23 , to obtain a first intermediate body 30 .

[0099] The material of the first insulating layer 24 and the fourth insulating layer 25 can be selected from one of the resins such as epoxy resin (epoxy resin), polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the first insulating layer 24 and the fourth insulating layer 25 are both polypropylene.

[0100] Step S15, please refer to Figure 4 A first blind hole 31 , a first blind groove 32 and a through hole 33 are opened in the first intermediate body 30 .

[0101] The first blind hole 31 passes through the first insulating layer 24, and the bottom of the first blind hole 31 corresponds to the first heat conducting portion 22. The first blind groove 32 passes through the fourth insulating layer 25, and the bottom of the first blind groove 32 corresponds to the first heat conducting member 23. The through hole 33 sequentially passes through the first insulating layer 24, the first adhesive layer 20, the body 101, the second adhesive layer 21, and the fourth insulating layer 25.

[0102] In one embodiment, the first blind hole 31 , the first blind groove 32 , and the through hole 33 can all be formed by laser drilling.

[0103] Step S16, see Figure 5 The first blind hole 31 , the first blind groove 32 and the through hole 33 are filled with thermoelectric separation metal to form a second heat conducting portion 34 , a second heat conducting member 35 and a first heat conducting channel 36 , respectively.

[0104] The second heat conducting portion 34 is thermally connected to the first heat conducting portion 22 , the second heat conducting member 35 is thermally connected to the first heat conducting member 23 , and the first heat conducting channel 36 is thermally connected to the body 101 .

[0105] In one embodiment, the thermoelectric separation metal is made of aluminum nitride or potassium nitride.

[0106] Step S17, please refer to Figure 6 A first copper foil layer 40 and a second copper foil layer 41 are formed on the first insulating layer 24 and the fourth insulating layer 25 , respectively.

[0107] Step S18, please refer to Figure 7 , the first copper foil layer 40 and the second copper foil layer 41 are etched to form a first conductive circuit layer 42 and a fourth conductive circuit layer 43 respectively.

[0108] The first conductive circuit layer 42 is thermally connected to the second heat conducting portion 34, allowing the heat generated by the first conductive circuit layer 42 to be transferred to the first metal layer 10 through the second heat conducting portion 34 and the first heat conducting portion 22. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the first conductive circuit layer 42. Furthermore, the alternating arrangement of the first heat conducting portions 22, made of copper, and the second heat conducting portions 34, made of thermoelectric separation metal, can reduce manufacturing costs while meeting heat dissipation requirements. Since copper is less expensive than thermoelectric separation metal, this can reduce manufacturing costs.

[0109] The fourth conductive circuit layer 43 is thermally connected to the second thermal conductor 35, allowing the heat generated by the fourth conductive circuit layer 43 to be transferred to the first metal layer 10 through the second thermal conductor 35 and the first thermal conductor 23. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the fourth conductive circuit layer 43. Furthermore, the alternating arrangement of the first thermal conductor 23, made of copper, and the second thermal conductor 35, made of thermoelectric separation metal, can reduce manufacturing costs while meeting heat dissipation requirements. Since copper is less expensive than thermoelectric separation metal, this can reduce manufacturing costs.

[0110] Step S19, please refer to Figure 8A second insulating layer 50 and a second metal layer 51 are formed on the first conductive circuit layer 42 and the fourth conductive circuit layer 43 , respectively.

[0111] The material of the second insulating layer 50 may be the same as that of the first insulating layer 24 , which will not be described in detail herein.

[0112] The second metal layer 51 is thermally connected to the fourth conductive circuit layer 43 .

[0113] In one embodiment, the second metal layer 51 is made of the thermoelectric separation metal.

[0114] Step S20, see Figure 9 A second blind hole 501 is opened in the second insulating layer 50 , and a second blind groove 511 and a third blind groove 512 are opened in the second metal layer 51 .

[0115] The second blind via 501 penetrates the second insulating layer 50, and the bottom of the second blind via 501 corresponds to the first conductive circuit layer 42. The second blind via 501 corresponds to the first blind via 31. The second blind groove 511 penetrates the second metal layer 51, and the bottom of the second blind groove 511 corresponds to the fourth conductive circuit layer 43. The second blind groove 511 corresponds to the first blind groove 32. The third blind groove 512 penetrates the second metal layer 51, and the bottom of the third blind groove 512 corresponds to the fourth conductive circuit layer 43. The third blind groove 512 and the first blind groove 32 are arranged alternately.

[0116] Step S21, please refer to Figure 10 Copper is electroplated in the second blind hole 501 , the second blind groove 511 and the third blind groove 512 to form a third heat conducting portion 52 , a third heat conducting member 53 and a fourth heat conducting member 54 , respectively.

[0117] like Figure 10 As shown, in one second blind hole 501, the third heat conducting portion 52 completely fills the second blind hole 501. In another second blind hole 501, the third heat conducting portion 52 is located only on the sidewalls and bottom of the second blind hole 501. When the third heat conducting portion 52 is located only on the sidewalls and bottom of the second blind hole 501, the second blind hole 501 electroplated with the third heat conducting portion 52 can also be filled with the thermoelectric isolation metal, so that the electroplated copper in the second blind hole 501 and the thermoelectric isolation metal in the second blind hole 501 together form the third heat conducting portion 52. The third heat conducting portion 52 is thermally conductive to the first conductive circuit layer 42.

[0118] In one embodiment, the third heat conducting member 53 is located on a sidewall of the second blind groove 511 , and the third heat conducting member 53 is thermally connected to the fourth conductive circuit layer 43 .

[0119] In one embodiment, the fourth heat conducting member 54 is located on a sidewall of the third blind groove 512 , and the fourth heat conducting member 54 is thermally connected to the fourth conductive circuit layer 43 .

[0120] Step S22, see Figure 11 A second conductive circuit layer 60 and a fifth conductive circuit layer 61 are formed on the second insulating layer 50 and the second metal layer 51 , respectively.

[0121] Specifically, a third copper foil layer (not shown) and a fourth copper foil layer are formed on the second insulating layer 50 and the second metal layer 51 respectively, and the third copper foil layer and the fourth copper foil layer are etched to form the second conductive circuit layer 60 and the fifth conductive circuit layer 61 respectively.

[0122] The second conductive circuit layer 60 is thermally connected to the third heat conducting portion 52, so that the heat generated by the second conductive circuit layer 60 is transferred to the first metal layer 10 through the third heat conducting portion 52, the first conductive circuit layer 42, the second heat conducting portion 34, and the first heat conducting portion 22 in sequence. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the second conductive circuit layer 60. Furthermore, the copper third heat conducting portion 52 (or the third heat conducting portion 52 made of a mixture of copper and thermoelectric separation metal), the second heat conducting portion 34 made of thermoelectric separation metal, and the copper first heat conducting portion 22 are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this can reduce manufacturing costs while meeting heat dissipation requirements.

[0123] The fifth conductive circuit layer 61 is thermally conductive with the third thermal conductor 53 and the fourth thermal conductor 54, allowing heat generated by the fifth conductive circuit layer 61 to be transferred to the first metal layer 10 through the third thermal conductor 53, the fourth thermal conductor 54, the fourth conductive circuit layer 43, the second thermal conductor 35, and the first thermal conductor 23. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the fifth conductive circuit layer 61. Furthermore, the third thermal conductor 53 (made of copper), the second thermal conductor 35 (made of thermoelectric separation metal), and the first thermal conductor 23 (made of copper) are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this reduces manufacturing costs while meeting heat dissipation requirements.

[0124] Step S23, please refer to Figure 12 , forming a third insulating layer 62 on the second conductive circuit layer 60 to obtain a second intermediate body 70 .

[0125] The material of the third insulating layer 62 may be the same as that of the first insulating layer 24 , which will not be described in detail herein.

[0126] Step S24, please refer to Figure 13 , an opening is opened in the second intermediate (not shown).

[0127] The opening sequentially passes through the third insulating layer 62 , the second conductive circuit layer 60 , and the second insulating layer 50 , and the bottom of the opening corresponds to the first conductive circuit layer 42 . The opening corresponds to the through hole 33 .

[0128] Step S25 , electroplating copper in the opening to form a second heat conduction channel 71 .

[0129] The second heat conduction channel 71 is thermally connected to the first conductive circuit layer 42 and the second conductive circuit layer 60 .

[0130] Step S26, see Figure 14 , forming a third conductive circuit layer 72 on the third insulating layer 62 .

[0131] The third conductive circuit layer 72 and the second conductive circuit layer 60 are both thermally connected to the second heat conduction channel 71, so that the heat generated by the third conductive circuit layer 72 and the second conductive circuit layer 60 is transferred to the first metal layer 10 through the second heat conduction channel 71, the first conductive circuit layer 42, and the first heat conduction channel 36. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the third conductive circuit layer 72 and the second conductive circuit layer 60. At the same time, the second heat conduction channels 71 made of copper and the first heat conduction channels 36 made of thermoelectric separation metal are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this can reduce production costs while meeting heat dissipation requirements.

[0132] Step S27, please refer to Figure 15 A first solder resist layer 80 and a second solder resist layer 81 are respectively formed on the third conductive circuit layer 72 and the fifth conductive circuit layer 61 to obtain a circuit substrate 82.

[0133] The first solder mask layer 80 and the second solder mask layer 81 can be made of solder mask ink, such as green ink. The first solder mask layer 80 is used to protect the third conductive circuit layer 72, and the second solder mask layer 81 is used to protect the fifth conductive circuit layer 61.

[0134] Step S28, see Figure 16 , cutting the first solder mask 80 along the thickness direction of the circuit substrate 82 to obtain a groove 821.

[0135] The groove 821 sequentially passes through the first solder mask 80 , the third conductive circuit layer 72 , the third insulating layer 62 and the second conductive circuit layer 60 , and the third heat conducting portion 52 is exposed in the groove 821 .

[0136] In one embodiment, the groove 821 may be formed by a fixed-depth trough.

[0137] Step S29, please refer to Figure 17 , the electronic component 90 is installed in the groove 821 to obtain the circuit board 100.

[0138] Among them, the electronic component 90 is thermally connected to the third heat-conducting part 52, so that the heat generated by the electronic component 90 is transmitted to the first metal layer 10 through the third heat-conducting part 52, the first conductive circuit layer 42, the second heat-conducting part 34 and the first heat-conducting part 22 in sequence. Since the first metal layer 10 is made of metal, it can absorb this part of the heat or dissipate the heat to the outside, thereby reducing the temperature of the electronic component 90 itself.

[0139] See also Figure 17 An embodiment of the present application further provides a circuit board 100 with a heat dissipation function, wherein the circuit board 100 includes a first metal layer 10, a first adhesive layer 20, a second adhesive layer 21, a first heat conducting portion 22, a first heat conducting member 23, a first insulating layer 24, a fourth insulating layer 25, a first conductive circuit layer 42, a fourth conductive circuit layer 43, a second insulating layer 50, a second metal layer 51, a second conductive circuit layer 60, a fifth conductive circuit layer 61, a third insulating layer 62, a third conductive circuit layer 72, a first solder mask layer 80, a second solder mask layer 81, and an electronic component 90.

[0140] In one embodiment, the first metal layer 10 includes a body 101 and a first column 102 and a second column 103 protruding from opposite surfaces of the body 101. A first slot 11 is formed between the body 101 and the first column 102, and a second slot 12 is formed between the body 101 and the second column 103. In one embodiment, the first column 102 and the second column 103 are opposite to each other.

[0141] In one embodiment, the first metal layer 10 is a thermoelectric separation metal. It should be noted that thermoelectric separation means that heat and electricity are separated, and the conductive part and the heat conductive part are in different positions.

[0142] In one embodiment, the first metal layer 10 is made of aluminum nitride or potassium nitride. The first metal layer 10 has good thermal conductivity and certain electrical conductivity.

[0143] The first adhesive layer 20 and the second adhesive layer 21 are located in the first groove 11 and the second groove 12 respectively.

[0144] The surface of the first adhesive layer 20 away from the body 101 is substantially flush with the surface of the first column 102 away from the body 101 , and the surface of the second adhesive layer 21 away from the body 101 is substantially flush with the surface of the second column 103 away from the body 101 .

[0145] The first heat conducting portion 22 and the first heat conducting member 23 are respectively located on the first column 102 and the second column 103. The first heat conducting portion 22 and the first heat conducting member 23 are both made of copper. The first heat conducting portion 22 is thermally conductive with the first column 102, and the first heat conducting member 23 is thermally conductive with the second column 103.

[0146] The first insulating layer 24 is positioned on the first adhesive layer 20 and the first heat conducting portion 22. A first blind hole 31 is defined in the first insulating layer 24. The first blind hole 31 extends through the first insulating layer 24, with the bottom of the first blind hole 31 corresponding to the first heat conducting portion 22. The first blind hole 31 forms a second heat conducting portion 34. The second heat conducting portion 34 is made of the thermoelectric separation metal and is thermally conductively connected to the first heat conducting portion 22.

[0147] The material of the first insulating layer 24 can be selected from one of epoxy resin, polypropylene (PP), BT resin, polyphenylene oxide (PPO), polyimide (PI), polyethylene terephthalate (PET), and polyethylene naphthalate (PEN). In this embodiment, the material of the first insulating layer 24 is polypropylene.

[0148] The fourth insulating layer 25 is positioned on the second adhesive layer 21 and the first thermal conductor 23. A first blind groove 32 is defined in the fourth insulating layer 25. The first blind groove 32 extends through the fourth insulating layer 25, and the bottom of the first blind groove 32 corresponds to the first thermal conductor 23. The first blind groove 32 forms a second thermal conductor 35. The second thermal conductor 35 is made of the thermoelectric separation metal. The second thermal conductor 35 is thermally conductive to the first thermal conductor 23.

[0149] The material of the fourth insulating layer 25 may be the same as that of the first insulating layer 24 , which will not be described in detail herein.

[0150] The circuit board 100 has a through hole 33. The through hole 33 sequentially passes through the first insulating layer 24, the first adhesive layer 20, the body 101, the second adhesive layer 21, and the fourth insulating layer 25. The through hole 33 forms a first heat conduction channel 36. The first heat conduction channel 36 is made of the thermoelectric separation metal and is thermally conductive to the body 101.

[0151] The first conductive circuit layer 42 is located on the first insulating layer 24. The first conductive circuit layer 42 is thermally connected to the second heat conducting portion 34, allowing the heat generated by the first conductive circuit layer 42 to be transferred to the first metal layer 10 through the second heat conducting portion 34 and the first heat conducting portion 22. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the first conductive circuit layer 42. Furthermore, the first heat conducting portions 22 made of copper and the second heat conducting portions 34 made of thermoelectric separation metal are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this can reduce manufacturing costs while meeting heat dissipation requirements.

[0152] The fourth conductive circuit layer 43 is located on the fourth insulating layer 25. The fourth conductive circuit layer 43 is thermally connected to the second thermal conductor 35, allowing heat generated by the fourth conductive circuit layer 43 to be transferred to the first metal layer 10 through the second thermal conductor 35 and the first thermal conductor 23. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the fourth conductive circuit layer 43. Furthermore, the alternating arrangement of the first thermal conductor 23, made of copper, and the second thermal conductor 35, made of thermoelectric separation metal, can reduce manufacturing costs while meeting heat dissipation requirements. Since copper is less expensive than thermoelectric separation metal, this arrangement can reduce manufacturing costs while meeting heat dissipation requirements.

[0153] The second insulating layer 50 is positioned on the first conductive circuit layer 42. A second blind hole 501 is defined in the second insulating layer 50. The second blind hole 501 penetrates the second insulating layer 50, and the bottom of the second blind hole 501 corresponds to the first conductive circuit layer 42. The second blind hole 501 corresponds to the first blind hole 31. The second blind hole 501 forms a third heat conducting portion 52, which is made of copper.

[0154] The material of the second insulating layer 50 may be the same as that of the first insulating layer 24 , which will not be described in detail herein.

[0155] The second metal layer 51 is located on the fourth conductive circuit layer 43. The second metal layer 51 is thermally conductive to the fourth conductive circuit layer 43. In one embodiment, the second metal layer 51 is made of the thermoelectric separation metal.

[0156] A second blind groove 511 and a third blind groove 512 are provided in the second metal layer 51. The second blind groove 511 passes through the second metal layer 51, and the bottom of the second blind groove 511 corresponds to the fourth conductive circuit layer 43. The second blind groove 511 corresponds to the first blind groove 32. The third blind groove 512 passes through the second metal layer 51, and the bottom of the third blind groove 512 corresponds to the fourth conductive circuit layer 43. The third blind groove 512 is staggered with the first blind groove 32. The second blind groove 511 and the third blind groove 512 form a third heat conductor 53 and a fourth heat conductor 54, respectively. The third heat conductor 53 and the fourth heat conductor 54 are both made of copper.

[0157] like Figure 17As shown, in one of the second blind holes 501, the third heat conducting portion 52 completely fills the second blind hole 501. In another second blind hole 501, the third heat conducting portion 52 is located only on the sidewalls and bottom of the second blind hole 501. When the third heat conducting portion 52 is located only on the sidewalls and bottom of the second blind hole 501, the material of the third heat conducting portion 52 is a mixture of copper and the thermoelectric separation metal. The third heat conducting portion 52 is thermally conductive to the first conductive circuit layer 42.

[0158] In one embodiment, the third heat conducting member 53 is located on a sidewall of the second blind groove 511 , and the third heat conducting member 53 is thermally connected to the fourth conductive circuit layer 43 .

[0159] In one embodiment, the fourth heat conducting member 54 is located on a sidewall of the third blind groove 512 , and the fourth heat conducting member 54 is thermally connected to the fourth conductive circuit layer 43 .

[0160] The second conductive circuit layer 60 is located on the second insulating layer 50. The second conductive circuit layer 60 is thermally connected to the third heat conducting portion 52, allowing heat generated by the second conductive circuit layer 60 to be transferred sequentially through the third heat conducting portion 52, the first conductive circuit layer 42, the second heat conducting portion 34, and the first heat conducting portion 22 to the first metal layer 10. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the second conductive circuit layer 60. Furthermore, the copper third heat conducting portion 52 (or the third heat conducting portion 52 made of a mixture of copper and thermoelectric separation metal), the second heat conducting portion 34 made of thermoelectric separation metal, and the copper first heat conducting portion 22 are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this reduces manufacturing costs while meeting heat dissipation requirements.

[0161] The fifth conductive circuit layer 61 is located on the second metal layer 51. The fifth conductive circuit layer 61 is thermally conductive with the third thermal conductor 53 and the fourth thermal conductor 54. Heat generated by the fifth conductive circuit layer 61 is transferred to the first metal layer 10 through the third thermal conductor 53, the fourth thermal conductor 54, the fourth conductive circuit layer 43, the second thermal conductor 35, and the first thermal conductor 23. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the fifth conductive circuit layer 61. Furthermore, the third thermal conductor 53 (made of copper), the second thermal conductor 35 (made of thermoelectric separation metal), and the first thermal conductor 23 (made of copper) are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this reduces manufacturing costs while meeting heat dissipation requirements.

[0162] The third insulating layer 62 is located on the second conductive circuit layer 60. The material of the third insulating layer 62 can be the same as that of the first insulating layer 24, which will not be described in detail herein.

[0163] The circuit board 100 also has an opening (not shown). The opening sequentially passes through the third insulating layer 62, the second conductive circuit layer 60, and the second insulating layer 50, with the bottom of the opening corresponding to the first conductive circuit layer 42. The opening corresponds to the through-hole 33. The opening forms a second heat conduction channel 71. The second heat conduction channel 71 is made of copper and is thermally conductive to the first conductive circuit layer 42 and the second conductive circuit layer 60.

[0164] The third conductive circuit layer 72 is formed on the third insulating layer 62. The third conductive circuit layer 72 and the second conductive circuit layer 60 are both thermally connected to the second heat conduction channel 71, allowing heat generated by the third conductive circuit layer 72 and the second conductive circuit layer 60 to be transferred to the first metal layer 10 through the second heat conduction channel 71, the first conductive circuit layer 42, and the first heat conduction channel 36. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate it to the outside, thereby reducing the temperature of the third conductive circuit layer 72 and the second conductive circuit layer 60. Furthermore, the second heat conduction channels 71, made of copper, and the first heat conduction channels 36, made of thermoelectric separation metal, are alternately arranged. Since copper is less expensive than thermoelectric separation metal, this reduces manufacturing costs while meeting heat dissipation requirements.

[0165] The first solder mask layer 80 and the second solder mask layer 81 are respectively located on the third conductive circuit layer 72 and the fifth conductive circuit layer 61. Both the first solder mask layer 80 and the second solder mask layer 81 can be made of solder mask ink, such as green ink. The first solder mask layer 80 is used to protect the third conductive circuit layer 72, and the second solder mask layer 81 is used to protect the fifth conductive circuit layer 61.

[0166] The circuit board 100 further defines a groove 821 that sequentially passes through the first solder mask 80 , the third conductive circuit layer 72 , the third insulating layer 62 , and the second conductive circuit layer 60 , and the third heat conducting portion 52 is exposed in the groove 821 .

[0167] The electronic component 90 is located in the groove 821. The electronic component 90 is thermally connected to the third heat conducting portion 52, so that the heat generated by the electronic component 90 is transferred to the first metal layer 10 through the third heat conducting portion 52, the first conductive circuit layer 42, the second heat conducting portion 34, and the first heat conducting portion 22 in sequence. Since the first metal layer 10 is made of metal, it can absorb this heat or dissipate the heat to the outside, thereby reducing the temperature of the electronic component 90 itself.

[0168] In this application, copper is electroplated on the first pillar 102 to form the first heat conducting portion 22. The first blind via 31 is filled with the thermoelectric separation metal to form the second heat conducting portion 34, which is thermally conductive with the first heat conducting portion 22. Copper is electroplated in the second blind via 501 to form the third heat conducting portion 52, which is thermally conductive with the second heat conducting portion 34. Heat generated by the electronic component 90 is transferred to the first metal layer 10 through the third heat conducting portion 52, the second heat conducting portion 34, and the first heat conducting portion 22, thereby reducing the temperature of the electronic component 90 and improving the heat dissipation effect of the circuit board 100. Furthermore, the alternating arrangement of the copper third heat conducting portion 52, the thermoelectric separation metal second heat conducting portion 34, and the copper first heat conducting portion 22 can reduce the manufacturing cost of the circuit board 100 while meeting heat dissipation requirements.

[0169] The above description is only an optimized specific implementation of the present application, but it is not limited to this implementation in actual application. For ordinary technicians in this field, other variations and changes made according to the technical concept of the present application should fall within the scope of protection of the present application.

Claims

1. A method for manufacturing a circuit board with heat dissipation function, characterized in that: The following steps are involved: Providing a first metal layer, the first metal layer comprising a body and a first column protruding from the body, with a first groove formed between the body and the first column; forming a first adhesive layer in the first groove; Electroplating copper on the first column to form a first heat conducting portion, and making the first heat conducting portion thermally conductive with the first column; forming a first insulating layer on the first adhesive layer and the first heat conducting portion, wherein a first blind hole is formed in the first insulating layer; Filling the first blind hole with a thermoelectric separation metal to form a second heat conducting portion, and making the second heat conducting portion thermally conductive with the first heat conducting portion; forming a first conductive circuit layer on the first insulating layer, and thermally connecting the first conductive circuit layer to the second heat conducting portion; forming a second insulating layer on the first conductive circuit layer, wherein a second blind hole is formed in the second insulating layer, and the second blind hole corresponds to the first blind hole; Electroplating copper in the second blind hole to form a third heat conducting portion, and thermally connecting the third heat conducting portion to the first conductive circuit layer; as well as An electronic component is mounted on the second insulating layer, and the electronic component is thermally connected to the third heat conducting portion, thereby obtaining the circuit board.

2. The method for manufacturing a circuit board according to claim 1, wherein: After forming the third heat conducting portion, the manufacturing method further includes: forming a second conductive circuit layer, a third insulating layer, and a third conductive circuit layer in sequence on the second insulating layer to obtain a circuit substrate; and cutting the third conductive circuit layer along the thickness direction of the circuit substrate to obtain a groove; The groove sequentially passes through the third conductive circuit layer, the third insulating layer and the second conductive circuit layer, and the third heat conducting portion is exposed in the groove, and the electronic component is located in the groove.

3. The method for manufacturing a circuit board according to claim 2, wherein: The first metal layer further includes a second column protruding from the body, the second column and the first column are respectively located on two opposite surfaces of the body, and a second groove is formed between the body and the second column. The manufacturing method further includes: forming a second adhesive layer in the second groove; Electroplating copper on the second column to form a first heat conducting member, and making the first heat conducting member thermally conductive with the second column; forming a fourth insulating layer on the second adhesive layer and the first heat conducting member, wherein the fourth insulating layer is provided with a first blind groove; Filling the first blind groove with the thermoelectric separation metal to form a second heat conducting member, and making the second heat conducting member thermally conductive with the first heat conducting member; forming a fourth conductive circuit layer on the fourth insulating layer, and thermally connecting the fourth conductive circuit layer to the second heat conducting member; forming a second metal layer on the fourth conductive circuit layer, and thermally connecting the second metal layer to the fourth conductive circuit layer; Opening a second blind groove in the second metal layer, and making the second blind groove correspond to the first blind groove; Electroplating copper on the sidewall of the second blind groove to form a third heat conducting member, and making the third heat conducting member thermally conductive with the fourth conductive circuit layer; and A fifth conductive circuit layer is formed on the second metal layer, and the fifth conductive circuit layer is thermally connected to the second metal layer and the third heat conducting member.

4. The method for manufacturing a circuit board according to claim 3, wherein: After forming the second blind groove in the second metal layer, the manufacturing method further includes: Opening a third blind groove in the second metal layer, and staggering the third blind groove with the first blind groove; and Copper is electroplated on the sidewall of the third blind groove to form a fourth heat conducting member, and the fourth heat conducting member is thermally connected to the fourth conductive circuit layer and the fifth conductive circuit layer.

5. The method for manufacturing a circuit board according to claim 3, wherein: After forming the first insulating layer, a first intermediate is obtained; after forming the third insulating layer, a second intermediate is obtained. The manufacturing method further includes: opening a through hole in the first intermediate body; Filling the through hole with the thermal and electrical separation metal to form a first heat conduction channel, and making the first heat conduction channel thermally conductive with the first conductive circuit layer and the fourth conductive circuit layer; An opening is formed in the second intermediate body, wherein the opening sequentially passes through the third insulating layer, the second conductive circuit layer, and the second insulating layer, and the bottom of the opening corresponds to the first conductive circuit layer, and the opening corresponds to the through hole; Electroplating copper in the opening to form a second heat conduction channel, and making the second heat conduction channel thermally conductive with the first conductive circuit layer and the second conductive circuit layer; After the third conductive circuit layer is formed, the second heat conduction channel is still thermally connected to the third conductive circuit layer.

6. The method for manufacturing a circuit board according to claim 1, wherein: The third heat conducting portion is located on the sidewall and the bottom of the second blind hole. After forming the third heat conducting portion, the manufacturing method further includes: Filling the second blind hole electroplated with the third heat conducting portion with the thermoelectric separation metal; The electroplated copper in the second blind hole and the thermal-electric separation metal in the second blind hole together form the third heat conducting portion.

7. A circuit board with heat dissipation function, characterized in that: include: The first metal layer includes a body and a first column protruding from the body, wherein a first groove is formed between the body and the first column; a first adhesive layer, located in the first groove; a first heat conducting portion, located on the first column and thermally connected to the first column, wherein the first heat conducting portion is made of copper; a first insulating layer, located on the first adhesive layer and the first heat-conducting portion, wherein a first blind hole is formed in the first insulating layer, the first blind hole forming a second heat-conducting portion, and the second heat-conducting portion is thermally connected to the first heat-conducting portion, and the second heat-conducting portion is made of a thermoelectric separation metal; a first conductive circuit layer, located on the first insulating layer and thermally connected to the second heat conducting portion; a second insulating layer, located on the first conductive circuit layer, having a second blind hole formed in the second insulating layer, the second blind hole corresponding to the first blind hole, the second blind hole forming a third heat conducting portion, the third heat conducting portion being thermally connected to the first conductive circuit layer, and the third heat conducting portion being made of copper; and The electronic component is located in the second insulating layer and is thermally connected to the third heat conducting portion.

8. The circuit board according to claim 7, wherein: Also includes: a second conductive circuit layer, located on the second insulating layer; a third insulating layer, located on the second conductive circuit layer; as well as a third conductive circuit layer, located on the third insulating layer; A groove is provided in the circuit board, the groove sequentially passes through the third conductive circuit layer, the third insulating layer and the second conductive circuit layer, the third heat conducting portion is exposed in the groove, and the electronic component is located in the groove.

9. The circuit board according to claim 8, wherein: The first metal layer further includes a second column protruding from the body, the second column and the first column are respectively located on two opposite surfaces of the body, and a second groove is formed between the body and the second column. The circuit board further includes: a second adhesive layer, located in the second groove; a first heat conducting member, located on the second column and thermally connected to the second column, wherein the first heat conducting member is made of copper; a fourth insulating layer, located on the second adhesive layer and the first heat conducting member, wherein a first blind groove is formed in the fourth insulating layer, the first blind groove forms a second heat conducting member, and the second heat conducting member is thermally connected to the first heat conducting member, and the material of the second heat conducting member is the thermoelectric separation metal; a fourth conductive circuit layer, located on the fourth insulating layer and thermally connected to the second heat conducting member; a second metal layer, located on the fourth conductive circuit layer and thermally connected to the fourth conductive circuit layer; a second blind groove is formed in the second metal layer, and the second blind groove corresponds to the first blind groove; a third heat conducting member is formed on a sidewall of the second blind groove, and the third heat conducting member is thermally connected to the fourth conductive circuit layer; and The fifth conductive circuit layer is located on the second metal layer and is thermally connected to the second metal layer and the third heat conducting member.

10. The circuit board according to claim 7, wherein: The third heat conducting portion is located on the sidewall and the bottom of the second blind hole, and the material of the third heat conducting portion is a mixture of copper and the thermoelectric separation metal.

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