Fabric seam with electronic components

Abstract

The present disclosure relates to fabric seams with electronic components. One or more electronic components can be incorporated into a fabric seam. The fabric seam can connect two pieces of material in a fabric article or can form a border of a fabric article. The fabric seam can include a first fabric portion and a second fabric portion, and one or more electrically conductive strands extending between the first fabric portion and the second fabric portion. An electronic component can be coupled to the electrically conductive strands. The fabric seam can have one or more side pockets for capturing material, such as an edge of a piece of fabric. The fabric seam can have gaps that allow the electrically conductive strands within the fabric seam to diverge in different directions. An opening can be incorporated into the fabric seam to allow air or light to pass through and / or form a window in the fabric seam for an electronic component.

Description

[0001] This application claims priority to U.S. Patent Application No. 17 / 840508, filed June 14, 2022, and U.S. Provisional Patent Application No. 63 / 220912, filed July 12, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present invention relates generally to articles having fabric, and more specifically to articles having both fabric and electronic components. Background Technology

[0003] It may be desirable to form bags, furniture, clothing, and other items from materials such as fabrics. Fabric items typically do not contain electronic components. However, it may be desirable to incorporate electronic components into the fabric to provide enhanced functionality for the user of the fabric item.

[0004] Integrating electronic components into fabric can be challenging. Fabric is soft, making it difficult to mount structures onto it. Electronic components must be coupled to signal paths (e.g., signal paths transmitting data signals, power, etc.), but these paths can be damaged or components may detach if care is not taken when bending or stretching the fabric.

[0005] Therefore, it is desirable to provide improved technologies for integrating electronic components into articles with fabrics. Summary of the Invention

[0006] Interweaving equipment (e.g., weaving equipment, knitting equipment, braiding equipment, etc.) may be equipped with individually adjustable components. The use of individually adjustable components allows electronic components to be inserted into and / or embedded in the fabric during fabric production or formation.

[0007] The interlacing equipment creates a gap between a first fabric section and a second fabric section during the interlacing operation. The gap can be a void between fabric sections, or it can be a location or part between fabric sections. An insertion tool inserts electronic components into the gap, and the electronic components can be electrically coupled to conductive strands within the gap.

[0008] Interlacing equipment can be used to create fabric seams and embed one or more electronic components within them. The fabric seam can connect two pieces of material or form the boundary of a single piece of material. The fabric seam may include a first fabric portion and a second fabric portion, and one or more conductive strands extending between the first and second fabric portions. Electronic components may be coupled to the conductive strands and may have grooves in which the conductive strands are soldered or otherwise attached.

[0009] The fabric seam may have one or more side pockets for capturing the edges of materials such as a piece of fabric. The piece of fabric may be sewn into the side pockets or bonded to the side pockets using molten adhesive or fusible strands. The fabric seam may have gaps that allow conductive strands within the fabric seam to branch in different directions. Openings may be incorporated into the fabric seam to allow air or light to pass through and / or to form windows for electronic components within the fabric seam. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of an exemplary fabric article according to one embodiment.

[0011] Figure 2 A side view of an exemplary fabric according to one embodiment.

[0012] Figure 3 A side view of a material layer that can be incorporated into a fabric article according to one embodiment.

[0013] Figure 4 This is a schematic diagram illustrating how an interlacing apparatus can be used to produce a fabric when an insertion tool is used to insert one or more electronic components into the fabric, according to one embodiment.

[0014] Figure 5 This is a cross-sectional side view of an exemplary electronic component according to one embodiment.

[0015] Figure 6 This is a cross-sectional side view of an exemplary electronic component having an electronic device mounted on an interconnect substrate according to one embodiment.

[0016] Figure 7 This is a cross-sectional side view of an exemplary electronic component with a protective structure according to one embodiment.

[0017] Figure 8 This is a cross-sectional side view of an exemplary electronic component having a recess for receiving strands according to one embodiment.

[0018] Figure 9 A perspective view of an exemplary fabric article having a seam with integrated electronic components, according to one embodiment.

[0019] Figure 10 A perspective view of an exemplary fabric article having a seam with one or more integrated electrodes according to one embodiment.

[0020] Figure 11 A perspective view of an exemplary fabric article having a seam with one or more integrated tubes according to one embodiment.

[0021] Figure 12A front view of an exemplary fabric article having a seam with one or more integrated electronic components, according to one embodiment.

[0022] Figure 13 A cross-sectional side view of an exemplary fabric seam with opposite edges and no side pockets according to one embodiment.

[0023] Figure 14 A cross-sectional side view of an exemplary fabric seam according to one embodiment, having a first edge excluding a side pocket and a second edge having a side pocket.

[0024] Figure 15 A cross-sectional side view of an exemplary fabric seam having a first side pocket and a second side pocket according to one embodiment.

[0025] Figure 16 A cross-sectional side view of an exemplary fabric seam joined to a piece of material using a stitch according to one embodiment.

[0026] Figure 17 A cross-sectional side view of an exemplary fabric seam connected to a piece of material using an attachment structure according to one embodiment.

[0027] Figure 18 A top view of an exemplary fabric seam with a gap according to one embodiment.

[0028] Figure 19 The image shows a top view of an exemplary fabric seam according to one embodiment, which has gaps between the strips that allow the strips to bend in different directions.

[0029] Figure 20 A cross-sectional side view of an exemplary fabric seam having one or more openings according to one embodiment.

[0030] Figure 21 This is a top view of an exemplary fabric seam with an array of openings according to one embodiment.

[0031] Figure 22 This is a cross-sectional side view of an exemplary fabric seam with a window for electronic components according to one embodiment. Detailed Implementation

[0032] Electronic devices, housings, and other articles can be formed from fabrics, such as textiles. Textiles may include strands of insulating and conductive materials. The conductive strands can form signal paths through the fabric and can be coupled to electronic components, such as light-emitting diodes and other light-emitting devices, integrated circuits, sensors, haptic output devices, and other circuits.

[0033] Interlacing equipment (sometimes referred to as entanglement equipment) may include weaving equipment, knitting equipment, braiding equipment, or any other suitable equipment for interlacing, looping, overlapping, or otherwise coupling material strands together to form a strand network (e.g., a fabric). Interlacing equipment may be provided with individually adjustable components, such as warp strand positioning equipment (e.g., heddles or other warp strand positioning equipment), weft strand positioning equipment, reed, tensioning equipment, warp feed equipment (e.g., devices for individually distributing and tensioning warp strands), needle bed, feeder, guide rod, strand handling and component insertion equipment, and other components for forming woven articles. The individual adjustability of these components allows interlacing operations (e.g., weaving, knitting, braiding, and / or other interlacing operations) to be performed without requiring continuous lockstep synchronization of each of these devices, thereby allowing the weaving of fabrics with desired properties. As an example, normal reed movement and other weaving operations can be periodically paused and / or periodically desynchronized with other components to accommodate component insertion operations, thereby inserting electronic components (sometimes referred to as nodes or smart nodes) into the fabric during fabric production or formation.

[0034] Items (such as) Figure 1 Article 10 may include fabric and may sometimes be referred to as a fabric article or a fabric-based article. Article 10 may be an electronic device or an accessory to an electronic device, such as a laptop computer; a computer monitor containing an embedded computer; a tablet computer; a cellular phone; a media player; or other handheld or portable electronic devices; smaller devices, such as wristwatches, hanging devices, headphones or handsets, devices embedded in glasses, or other equipment worn on a user's head; or other wearable or micro-devices; a television set; a computer monitor that does not contain an embedded computer; a gaming device; a navigation device; an embedded system, such as a system in which the fabric article 10 is installed in a kiosk, car, airplane, or other means of transportation (e.g., autonomous or non-autonomous transportation); other electronic equipment, or devices that perform the functions of two or more of these devices. If desired, item 10 may be a removable housing for electronic equipment, may be a strap, may be a wristband or headband, may be a removable cover for the device, may be a shell or bag having a strap or other structure for receiving and carrying electronic equipment and other items, may be a necklace or armband, may be a wallet, sleeve, pocket, or other structure into which electronic equipment or other items may be inserted, may be part of a chair, sofa, or other seating (e.g., a cushion or other seating structure), may be part of clothing or other wearable items (e.g., a hat, belt, wristband, headband, etc.), or may be any other suitable item incorporating fabric.

[0035] Article 10 may include interwoven material strands such as monofilaments and yarns forming fabric 12. As used herein, "interwoven" and "entangled" material strands may refer to material strands that interlace with each other, loop together, overlap each other, or are otherwise coupled together (e.g., as part of a network of strands constituting a fabric). Fabric 12 may form all or part of a housing wall or other layer in an electronic device, may form an internal structure in an electronic device, or may form other fabric-based structures. Article 10 may be soft (e.g., article 10 may have a fabric surface that produces a slight touch), may be rigid (e.g., the surface of article 10 may be formed of a rigid fabric), may be rough, may be smooth, may have ribs or other patterned textures, and / or may be formed as part of a device having portions formed of non-woven structures of plastic, metal, glass, crystalline materials, ceramics, or other materials.

[0036] The material strands used to form fabric 12 can be monofilament strands (sometimes referred to as fibers), or they can be threads, yarns, or other strands formed by interlacing multiple material filaments together. The strands can be formed from polymers, metals, glass, graphite, ceramics, natural materials (such as cotton or bamboo), or other organic and / or inorganic materials, and combinations thereof. Conductive coatings, such as metallic coatings, can be formed on non-conductive strands (e.g., plastic cores) to make them conductive. Reflective coatings, such as metallic coatings, can be applied to the strands to make them reflective. The strands can also be formed from monofilament metal wires (e.g., bare metal wires), multifilaments, or combinations of different materials. The strands can be insulating or conductive.

[0037] The strands in fabric 12 may be conductive along their entire length, or may have conductive portions. The strands may have metallic portions selectively exposed by partially removing insulation (e.g., to form connections with other conductive strand portions and / or to electronic components). Strands may also be formed by selectively adding a conductive layer to a portion of a non-conductive strand. Threads and other multifilament yarns already formed from interlaced filaments may contain a mixture of conductive and insulating strands (e.g., metallic or metal-coated strands with or without an outer insulation layer may be used in combination with insulating solid plastic or natural strands). In some arrangements (sometimes described herein as an example), fabric 12 may be a woven fabric, and the strands constituting fabric 12 may include warp and weft strands.

[0038] Conductive and insulating strands can be woven, knitted, or otherwise interwoven to form conductive paths. These conductive paths can be used to form signal paths (e.g., signal buses, power lines for transmitting power), to form part of capacitive touch sensor electrodes, resistive touch sensor electrodes, or other input-output devices, or to form other patterned conductive structures. The conductive structures in fabric 12 can be used to transmit current (such as power), digital signals, analog signals, sensor signals, control signals, data, input signals, output signals, or other suitable electrical signals.

[0039] Article 10 may include additional mechanical structures 14, such as polymer adhesives for holding the strands of fabric 12 together, support structures (such as frame members), housing structures (e.g., electronic device housings), and other mechanical structures.

[0040] To enhance the mechanical robustness and conductivity of strand-to-strand connections and / or strand-to-component connections, additional structures and materials (e.g., solder, crimped metal connections, welded parts, conductive adhesives (such as anisotropic conductive films and other conductive adhesives), non-conductive adhesives, fasteners, etc.) may be used in the fabric 12. Strand-to-strand connections may be formed at locations where strands intersect perpendicularly to each other, or at intersections of other strands where a connection is desired. At locations where strand-to-strand connections are not desired, insulating material may be inserted between intersecting conductive yarns. The insulating material may be plastic or other dielectric, and may include insulated strands or conductive strands with insulating coatings or insulated conductive monofilaments, etc. Solder connections may be formed between conductive strands and / or between conductive strands and electronic components by melting solder to allow the solder to flow onto the conductive strands. The solder may be melted using an induction welding head, hot air, a reflow oven, a laser or thermoforming welder, or other welding equipment. In some arrangements, the outer dielectric coating (e.g., the outer polymer layer) can be melted away in the presence of molten solder, thereby allowing the underlying metal yarns to be welded together. In other arrangements, the outer dielectric coating can be removed prior to welding (e.g., using laser ablation equipment or other coating removal equipment).

[0041] Circuit 16 may be included in article 10. Circuit 16 may include electronic components coupled to fabric 12, electronic components housed within a housing formed of fabric 12, or electronic components attached to fabric 12 using welding, solder joints, adhesives (e.g., conductive adhesives such as anisotropic conductive adhesives or other conductive adhesives), crimp connections, or other electronic and / or mechanical adhesives. Circuit 16 may include metallic structures for carrying current, electronic components (such as integrated circuits), light-emitting diodes, sensors, and other electronic devices. Control circuitry in circuit 16 may be used to control the operation of article 10 and / or support communication with article 18 and / or other devices.

[0042] Article 10 can interact with electronic equipment or other attached articles 18. Article 18 can be attached to article 10, or article 10 and article 18 can be separate articles configured to operate on each other (e.g., when one article is a housing and the other is a device housed within that housing, etc.). Circuitry 16 may include an antenna and other structures for supporting wireless communication with article 18. Article 18 may also interact with article 10 using a wired communication link or other connection that allows the exchange of information.

[0043] In some cases, article 18 may be an electronic device, such as a cellular phone, computer, or other portable electronic device, and article 10 may form a cover, housing, bag, or other structure that receives the electronic device in a pocket, internal cavity, or other part of article 10. In other cases, article 18 may be a wristwatch device or other electronic device, and article 10 may be a strip or other fabric article attached to article 18 (e.g., article 10 and article 18 may together form a fabric-based article, such as a wristwatch with a strap). In still other cases, article 10 may be an electronic device, fabric 12 may be used to form the electronic device, and attached article 18 may include accessories or other devices that interact with article 10. Signal paths formed by conductive yarns and monofilaments may be used to route signals in article 10 and / or article 18.

[0044] The fabric constituting article 10 may be formed from yarns and / or monofilaments interwoven using any suitable weaving equipment. Utilizing a suitable arrangement sometimes described herein as an example, fabric 12 may be a woven fabric formed using a loom. In this type of illustrative configuration, the fabric may have a plain weave, square weave, satin weave, twill weave, or variations thereof, may be a three-dimensional fabric, or may be other suitable fabrics. However, this is merely illustrative. If desired, fabric 12 may comprise knitted fabric, warp-knitted fabric, weft-knitted fabric, braided fabric, other suitable types of fabric, and / or any combination of two or more of these types of fabric.

[0045] Figure 2 A cross-sectional side view of an illustrative fabric 12 is shown. (See figure.) Figure 2 As shown, fabric 12 may include ply yarns 80. Ply yarns 80 may include warp ply yarns 20 and weft ply yarns 22. If desired, additional ply yarns that are neither warp nor weft ply yarns may be incorporated into fabric 12. Figure 2 The examples are merely illustrative. Figure 2 In the exemplary configuration, fabric 12 has a single layer of woven ply 80. If desired, a multi-layer fabric construction can be used for fabric 12.

[0046] Article 10 may include non-woven materials (e.g., structures formed from plastics, metals, glass, ceramics, crystalline materials such as sapphire). These materials may be formed using molding operations, extrusion, machining, laser processing, and other manufacturing techniques. In some configurations, part or all of article 10 may include one or more layers of material such as Figure 3 Layer 24 may include layers of polymers, metals, glass, fabrics, adhesives, crystalline materials, ceramics; a substrate on which components are mounted; a patterned material layer; a material layer containing patterned metal traces, thin-film devices (such as transistors); and / or other layers.

[0047] Figure 4 The diagram illustrates how electronic components can be inserted into fabric 12 during its formation. Figure 4 As shown, fabric 12 can be formed from fabric portions (such as fabric portions 12-1 and 12-2). Fabric portions 12-1 and 12-2 can be formed from interlaced ply yarns 80. For example, a first set of ply yarns 80 can be used to form fabric portion 12-1, and a second set of ply yarns 80 can be used to form fabric portion 12-2. Fabric portions 12-1 and 12-2 can be different parts of a single layer of fabric 12, or fabric portion 12-1 can form one or more first layers of fabric 12, and fabric portion 12-2 can form one or more second layers of fabric 12.

[0048] Using the interlacing apparatus 120, the strands 80 can be interlaced to form fabric 12. The interlacing apparatus 120 can be a weaving apparatus, a knitting apparatus, a braiding apparatus, or other suitable interlacing apparatus. The interlacing apparatus 120 can be used to create one or more areas in fabric 12 for receiving electronic components, such as pockets 66 (sometimes referred to as gaps, spaces, cavities, voids, locations, sites, etc.). Areas in fabric 12 for receiving electronic components, such as pockets 66, can be formed by creating spaces or gaps between portions of fabric 12, such as fabric portion 12-1 and fabric portion 12-2. The term "pocket" can be used to refer to a gap between fabric portions, and / or can be used to refer to a location or site between fabric portions (e.g., the location between material strands in fabric 12, with or without an actual gap).

[0049] Electronic components can be inserted into pocket 66 using a component insertion device (such as insertion tool 54) during fabric 12 formation. Insertion tool 54 can hold component 26 and can position component 26 in pocket 66 during interlacing operations (e.g., by moving component 26 toward pocket 66 in direction 140). If desired, component 26 can be electrically and / or mechanically connected to one or more conductive strands 80C in pocket 66. After component 26 is inserted and attached, interlacing device 120 can continue interlacing operations (which may include closing pocket 66 if desired) to continue forming fabric 12.

[0050] In some arrangements, processing steps may be performed after the component 26 is inserted into the pocket 66, such as alignment of the component 26 with the conductive strand 80C, electrical connection (e.g., soldering) of the component 26 to the conductive strand 80C, encapsulation of the electrical connection between the component 26 and the conductive strand 80C, and / or verification of the integrity of the electrical connection between the component 26 and the conductive strand 80C.

[0051] In some arrangements, the gap between the first fabric portion 12-1 and the second fabric portion 12-2 can be maintained in place after the electronic component 26 is surrounded in the fabric 12 (e.g., a space may exist between fabric portions 12-1 and 12-2 after the fabric 12 is formed). In other arrangements, after the electronic component 26 is surrounded in the gap, the first fabric portion 12-1 and the second fabric portion 12-2 can be pulled together such that the gap 66 is eliminated (e.g., fabric portions 12-1 and 12-2 can contact each other without an intervening gap after the fabric 12 is formed). The fabric 12 may have a protrusion where the electronic component 26 is located, or the fabric 12 may not have a protrusion where the electronic component 26 is located (e.g., if desired, the fabric may have a substantially uniform thickness across the location with and without the electronic component 26).

[0052] Figure 5 The image shows a side view of an exemplary electronic component of a type that can be used in article 10. Electronic components in article 10 (such as...) Figure 5The exemplary electronic components 26 may include discrete electronic components (such as resistors, capacitors, and inductors), connectors, batteries, and input-output devices (such as switches, buttons, light-emitting components (such as light-emitting diodes), audio components (such as microphones and speakers), vibrators (e.g., vibrating piezoelectric actuators), solenoids, electromechanical actuators, motors, and other electromechanical devices, microelectromechanical systems (MEMS) devices, pressure sensors, photodetectors, proximity sensors (light-based proximity sensors, capacitive proximity sensors, etc.), force sensors (e.g., piezoelectric sensors), strain gauges, humidity sensors, temperature sensors, accelerometers, gyroscopes, compasses, magnetic sensors (e.g., Hall effect sensors and magnetoresistive sensors such as giant magnetoresistive sensors), touch sensors, and other sensors, components forming displays, touch sensor arrays (e.g., arrays of capacitive touch sensor electrodes forming a touch sensor that detects touch events in two dimensions), and other input-output devices, energy storage devices, electronic components forming control circuits (such as non-volatile and volatile memories), microprocessors, application-specific integrated circuits, system-on-a-chip devices, baseband processors, wired and wireless communication circuits, and other integrated circuits).

[0053] Electronic components such as component 26 may be semiconductor dies (e.g., laser dies, LED dies, integrated circuits, etc.) or packaged components (e.g., semiconductor dies or other devices encapsulated in plastic, ceramic, or other package structures). One or more electronic terminals, such as contact pads 30, may be formed on the body 28 of component 26. The body 28 (sometimes referred to as device 28, electronic device 28, etc.) may be semiconductor dies (e.g., laser dies, LED dies, integrated circuits, etc.) or may be packages for components (e.g., plastic or other dielectric packages containing one or more semiconductor dies or other electronic devices). Contacts for the body 28, such as pads 30, may be protruding leads, may be flat contacts, may be formed in an array, may be formed on any suitable surface of the body 28, or may be any other suitable contacts used to form an electrical connection with component 26. For example, pads 30 may be metal solder pads.

[0054] like Figure 6As shown in the example, the body 28 may be mounted on a support structure such as substrate 36. Intermediate layer 36 (sometimes referred to as interconnect substrate, printed circuit substrate, etc.) may be a printed circuit, ceramic carrier, or other substrate. Layers forming interconnect substrate 36 may include one or more flexible printed circuit layers (such as polyimide layers), one or more rigid printed circuit board material layers (such as glass fiber-filled epoxy resin (e.g., FR4)), and / or other material layers (e.g., other dielectric materials such as silicone, other elastomeric materials, other flexible polymers, etc.). Interconnect substrate 36 may be larger than body 28 or may have other suitable dimensions. Interconnect substrate 36 may have a planar shape with a thickness of 700 micrometers, greater than 500 micrometers, less than 500 micrometers, or other suitable thickness. Body 28 may have a thickness of 500 micrometers, greater than 300 micrometers, less than 1000 micrometers, or other suitable thickness. The area occupied by the main body 28 and the substrate 36 (the area seen from above) can be 10 micrometers × 10 micrometers, 100 micrometers × 100 micrometers, 1 mm × 1 mm or more, or 10 mm × 10 mm or less, and can be rectangular, square or L-shaped, or can have other suitable shapes and sizes.

[0055] Interconnect substrate 36 may include signal paths (such as metal traces 38). Metal traces 38 (sometimes referred to as interconnects, signal paths, etc.) may have portions forming contacts such as pads 34, 40. Pads 34, 40 may be formed on the upper surface, lower surface, and / or sides of interconnect substrate 36. Conductive material (such as conductive material 32) may be used to mount body 28 to interconnect substrate 36. Conductive material 32 may be solder (e.g., low-temperature solder, high-temperature solder, etc.), may be conductive adhesive (isotropic conductive adhesive or anisotropic conductive film), may be formed during soldering, and / or may be other conductive materials used to couple electronic device pads (body pads) (such as pad 30 on body 28) to interconnect substrate pads 34. Metal traces 38 in substrate 36 may couple pads 34 to other pads (such as pad 40). If desired, pad 40 may be larger and / or wider spaced than pad 34, thereby facilitating the attachment of substrate 36 to conductive yarns and / or other conductive paths in article 10. Solder, conductive adhesive, or other conductive bonding agents may be used to couple pad 40 to conductive strands, printed circuit traces, or other conductive path materials in article 10.

[0056] Figure 7An example of a component 26 including a protective structure (such as protective structure 130 on interconnect substrate 36) is shown. Protective structure 130 may be, for example, a plastic structure that completely or partially encapsulates device 28 and interconnect substrate 36 to provide mechanical robustness, protection against moisture and other environmental contaminants, heat dissipation, and / or electrical insulation. Protective structure 130 may be formed from molded plastic (e.g., injection-molded plastic, insert-molded plastic, transfer-molded plastic, low-pressure molded plastic, two-part molded plastic, etc.) that has been molded or molded into the desired shape over one or more devices 28 and substrate 36 and subsequently attached to substrate 36; it may be a layer of encapsulant material (e.g., thermoplastic) that has been melted to encapsulate device 28; it may be a layer of polymer (such as polyimide) that has been cut or machined into the desired shape and subsequently attached to substrate 36; or it may be formed using other suitable methods. Exemplary materials that can be used to form protective structure 130 include epoxy resins, polyamides, polyurethanes, silicones, thermoplastics, other suitable materials, or any combination of two or more of these materials. The protective structure 130 may be formed on one or both sides of the substrate 36 (e.g., it may completely or partially surround the substrate 36).

[0057] The protective structure 130 may be completely opaque, completely transparent, or may have both opaque and transparent areas. The transparent portions of the protective structure 130 may allow light emitted from one or more devices 28 to pass through the protective structure 130, and / or allow external light to reach (and be detected by) one or more devices 28. If desired, one or more openings, recesses, grooves, and / or other features may be formed in the protective structure 130. For example, openings may be formed in the protective structure 130 to allow light to be detected by and / or emitted from one or more devices 28. The protective structure 130 may include one or more grooves for receiving strands (e.g., conductive or insulated strands) in the fabric 12.

[0058] If necessary, the protective structure 130 can have different thicknesses. Figure 7 The examples are merely illustrative, where the protective structure 130 has a uniform thickness across the entire substrate 36. In some arrangements, the protective structure 130 may be an encapsulating material, such as a thermoplastic, that has been melted to create a robust connection between the component 26 and the strands 80 of the fabric 12. For example, the protective structure 130 may surround portions of the strands 80, fill recesses, grooves, or other features in the component 26 to facilitate interlocking the component 26 to the strands 80, and / or fill gaps in the fabric 12. If desired, the protective structure 130 may comprise one or more different types of materials (e.g., one or more different thermoplastic materials with different melting temperatures).

[0059] If needed, substrate 36 can be large enough to accommodate multiple electronic devices, each with its own body 28. For example, one or more light-emitting diodes, sensors, microprocessors, and / or other electronic devices can be mounted on a common substrate (such as...). Figure 7 The substrate 36). The light-emitting diode (LED) may be a miniature LED (e.g., an LED semiconductor die with an area of ​​approximately 10 μm x 10 μm, greater than 5 μm x 5 μm, less than 100 μm x 100 μm, or other suitable sizes). The LED may include LEDs of different colors (e.g., red, green, blue, white, etc.), infrared light, or ultraviolet light. Redundant LEDs or other redundant circuitry may be included on the substrate 36. Multiple electronic devices (each with a corresponding body 28) are mounted on a common substrate. Figure 7 In the configuration of the type shown, electronic component 26 may include any suitable combination of electronic devices (e.g., light-emitting diodes, sensors, integrated circuits, actuators, energy storage devices, and / or combinations thereof). Figure 5 Other devices of the type described in electronic component 26).

[0060] Figure 6 and Figure 7 The example is for illustrative purposes only, in which device 28 is located on only one side of substrate 36. If desired, device 28 can be mounted on both sides of substrate 36.

[0061] Electronic component 26 may be coupled to fabric structures, individual strands, printed circuits (e.g., rigid printed circuits formed of epoxy resin or other rigid printed circuit board materials filled with glass fibers, or flexible printed circuits formed of sheets of polyimide substrate or other flexible polymer materials), metal or plastic components with signal traces, or other structures in article 10.

[0062] In some configurations, article 10 may include an electrical connection between component 26 and conductive paths in fabric 12. For example, as Figure 8 As shown, component 26 can be coupled to conductive strands 80C of fabric 12. Conductive strands 80C (sometimes referred to as "wires") can be configured to deliver electrical signals (e.g., power, digital, analog, sensor, control, data, input, output, or other suitable currents) to and / or from component 26. Strands 80C can be warp strands in fabric 12 (e.g.,...). Figure 2 Meridian strand 20), latitudinal strand (e.g., Figure 2The component 26 may be coupled to a single conductive strand 80C, two conductive strands 80C, or two or more conductive strands 80C, if desired. The component 26 may also be coupled, or alternatively, to an insulating strand in the fabric 12, if desired. The arrangement of the component 26 coupled to a pair of conductive strands 80C is sometimes described herein as an illustrative example.

[0063] Component 26 may have contact pads (such as pad 40). Conductive material 82 may be used to couple pad 40 to conductive strand 80C. Conductive material 82 may be solder, anisotropic conductive adhesive, or other conductive material. Arrangements of conductive material 82 formed by solder may sometimes be described herein as illustrative examples. Figure 8 In the example, pad 40 is formed on the same surface of substrate 36 on which device 28 is mounted. Conductive material 82 can be used to electrically and mechanically couple component 26 to strands 80C of fabric 12. If desired, pad 40 may also be formed, or alternatively, on the lower surface of substrate 36 (e.g., the surface opposite to the surface on which device 28 is mounted). Figure 8 The examples are merely illustrative.

[0064] In some configurations, it may be desirable to provide a more robust mechanical connection between component 26 and fabric 12 to ensure that component 26 does not loosen when fabric 12 is bent or stretched. To enhance the robustness of the connection between strands 80C and component 26, component 26 may have one or more recesses for receiving strands 80C. For example, one or more strands 80 may pass through a portion of component 26 to help secure component 26 to fabric 12. Strands 80 may pass through openings (sometimes referred to as recesses, grooves, notches, holes, slots, notches, etc.) in component 26. Openings may be formed in device 28, interconnect substrate 36, protective structure 130, and / or other portions of component 26. Figure 8 An example is shown where the conductive strand 80C is received within a groove (such as groove 50 formed in the protective structure 130). However, this is merely illustrative. If desired, groove 50 may alternatively or additionally be formed in other portions of the interconnect substrate 36, device 28, and / or component 26. Figure 8 The position, shape, and geometry of the groove 50 are merely illustrative.

[0065] The recess 50 in the protective structure 130 (sometimes referred to as a recess, groove, opening, hole, slot, notch, etc.) can be formed by removing a portion of the protective structure 130 (e.g., using a laser, mechanical saw, mechanical grinder, or other equipment), or by molding the protective structure 130 (e.g., injection molding, insert molding, etc.) or otherwise forming it into a shape including the recess 50. The recess 50 may have a width between 2 mm and 6 mm, between 0.3 mm and 1.5 mm, between 1 mm and 5 mm, between 3 mm and 8 mm, greater than 3 mm, less than 3 mm, or other suitable width. If desired, the recess 50 may have different depths (e.g., to expose contact pads 40 located at different surface heights of the interconnect substrate 36).

[0066] exist Figure 8 In the example, the recess 50 exposes the conductive pad 40 on the interconnect substrate 36. Strands 80C can each pass through an associated recess 50 in the protective structure 130. Solder or other conductive material 82 can be used to electrically and mechanically couple the strands 80C to the conductive pad 40 in the recess 50 of the protective cover 130. Because the strands 80C are wedged between portions of the protective cover 130, they prevent detachment from the substrate 36. Besides holding the strands 80C in place so that the component 26 remains attached to the fabric 12, the recess 50 can also serve as a physical guide to align the component 26 relative to the fabric 12 during component insertion and attachment operations. This can be advantageous, for example, when inserting and attaching the component 26 to the fabric 12 without visual contact.

[0067] Each strand 80C can be aligned with an associated pad 40 on component 26. If desired, the pad 40 can be formed from an elongated strip of conductive material (e.g., metal) extending from one edge of substrate 36 to the opposite edge of substrate 36. This provides a large area for forming the mechanical and electrical connection between substrate 36 and the strands 80C. The elongated shape of the pad 40 allows the conductive material 82 to attach a longer portion of the strand 80C to the pad 40. The connection between the pad 40 and the strands 80C can, for example, span the width of substrate 36, thus providing a robust connection between substrate 36 and the strands 80C. However, this is merely illustrative. If desired, the exposed conductive portions of the pad 40, conductive material 82, and strands 80C can span a width less than the entire width of component 26.

[0068] One or more electronic components, such as electronic component 26, may be incorporated into a fabric seam or hem. A fabric seam may connect two or more sections of fabric, connect fabric to non-woven materials (e.g., leather, metal, plastic, etc.), and / or form the outer edge (e.g., boundary) of a fabric article. If desired, the fabric seam incorporating the electronic components may be manufactured as a separate article, which may then be incorporated into a garment article to provide the garment article with a desired set of electronic functions (e.g., sensing, visual output, health tracking, location tracking, heart rate tracking, display functionality, etc.).

[0069] Figure 9 This is a perspective view illustrating a fabric seam. Figure 9 In the example, fabric seam 12A is joined between the first and second fabric portions 12B. However, this is merely illustrative. If desired, seam 12A may be joined to only one fabric portion 12B (e.g., in an arrangement where seam 12A is positioned along the boundary of a fabric article, such as a collar, shirt hem, dress, trousers, etc.), may be joined to one fabric portion 12B and a non-fabric portion (e.g., a piece of leather, plastic, metal, etc.), and / or may be a separate article without a fabric portion 12B or other material on either side. Typically, seam 12A can be any suitable type of seam (e.g., any type of stitching), such as an exposed seam, a closed seam, a curved seam, a straight seam, a folded seam, a flat seam, a fine-thread seam, an overlapping seam, a French seam, a seam at the boundary of a fabric piece, etc.

[0070] like Figure 9 As shown, electronic components 26 can be incorporated into seam 12A. One, two, three, four, ten, twenty, more than twenty, or fewer than twenty electronic components 26 can be incorporated into a given seam 12A. Electronic components 26 can be incorporated into the fabric seam 12A during its formation (e.g., as in bonding). Figures 1 to 8 (as described above), or it can be incorporated into the fabric seam 12A after the seam 12A is formed.

[0071] If desired, electronic component 26 may be configured for health-related functions such as health tracking, activity tracking, medical applications, biometric applications, health applications, personal training, rehabilitation, stress relief, focus, whole-body motion tracking, physical therapy, sun exposure monitoring, fall detection, posture monitoring, and / or other suitable health-related functions. It may include wireless payment circuitry for contactless payments and / or may include one or more sensors, tactile output devices, light sources (such as status indicators and / or displays), wireless power receiving circuitry, and / or communication circuitry for communicating with electronic devices.

[0072] Electronic component 26 may include one or more sensors for acquiring health-related measurements and / or user input, and may include light sensors (visible light sensors, color-sensitive light sensors, ultraviolet light sensors, etc.), optical proximity sensors, capacitive proximity sensors, temperature sensors, force sensors (e.g., strain gauges, capacitive force sensors, resistance sensors, force sensors for measuring biometric information, etc.), microphones for sensing audio and / or ultrasonic signals, magnetic sensors (e.g., Hall effect sensors, giant magnetoresistive sensors, or other sensors or magnetometers for measuring magnetic fields), gas pressure sensors, heart rate sensors, blood oxygen level sensors (e.g., based on emitted and probe light), electrocardiogram sensors (e.g., sensors for measuring electrical signals on the user's body), humidity sensors, and moisture content sensors. Rate sensors, particle sensors (e.g., sensors that use light measurements and / or other measurements to measure the concentration of particles in the air), image sensors (cameras), gas pressure sensors, carbon dioxide sensors and / or sensors that measure the concentration of other gases, motion sensors for detecting position, orientation and / or movement (e.g., accelerometers, magnetic sensors such as compass sensors, gyroscopes, barometers, and / or inertial measurement units containing some or all of these sensors), radio frequency sensors, depth sensors (e.g., structured infrared light sensors and / or depth sensors based on stereo imaging devices), optical sensors, such as self-mixing sensors that acquire transit time measurements and light detection and ranging (LiDAR) sensors, accelerometers and / or other sensors for acquiring user tap input (e.g., single tap, double tap, triple tap, etc.).

[0073] The fabric seam 12A may have multiple parts, such as fabric part 12-1, fabric part 12-2, and part 12-3. (As a combination) Figure 4 The fabric portions 12-1 and 12-2 may be formed by interlaced strands 80. Fabric portions 12-1 and 12-2 may be different parts of a single layer of fabric 12, or fabric portion 12-1 may form one or more first layers of fabric 12, and fabric portion 12-2 may form one or more second layers of fabric 12. The portion 12-3 of the fabric seam 12A may be a single layer of fabric between portions 12-1 and 12-2, or it may be a spacer fabric between portions 12-1 and 12-2 (e.g., portion 12-3 may be a spacer fabric having an inner warp-knitted layer and an outer warp-knitted layer connected by a spacer layer, such as one or more monofilaments or other spacer strands connected between the inner and outer warp-knitted layers), or it may be a spacer layer, such as one or more monofilaments connected between fabric portions 12-1 and 12-2, and / or it may be a gap between fabric portions 12-1 and 12-2 (e.g., similar to...). Figure 4(The gap of pocket 66). If necessary, part 12-3 can be omitted, and fabric part 12-1 can be directly attached to fabric part 12-2.

[0074] Electronic components 26 can be coupled to conductive strands 80C in the fabric seam 12A. For example, each component 26 may have one or more recesses 50 (such as...). Figure 8 As shown, each recess receives an associated conductive strand 80C. The conductive strand 80C may be soldered or otherwise mechanically and / or electrically coupled to a contact pad on component 26. If desired, the electrical connection between the strand 80C and component 26 may be encapsulated with a thermoplastic material (e.g., protective structure 130) or other encapsulation material.

[0075] In an arrangement where multiple electronic components 26 are incorporated into the fabric seam 12A, each electronic component 26 may be coupled to a different conductive strand 80C, or some electronic components 26 may be coupled to one or more identical strands 80C. Electronic components 26 coupled to the same conductive strand 80C may be isolated from each other (e.g., separated by one or more insulating sections of the strand 80C) and / or electrically coupled to each other (e.g., one component 26 may transmit a signal to another component 26 via the conductive strand 80C). If desired, the components 26 and the strands 80C may form an interconnect network of sensors, input devices, and / or output devices within a given fabric article (e.g., shirts, trousers, dresses, wristbands, headbands, other wearable fabric articles, non-wearable fabric articles such as bags, vehicle interiors, etc., and / or any other suitable fabric article).

[0076] like Figure 9 As shown, seam 12A may have one or more gaps, such as gap 62, which allow portions of the fabric seam 12A to branch off from each other. This allows electrical pathways within seam 12A (e.g., electrical pathways formed by strands 80C) to diverge in different directions (e.g., reaching other portions of the fabric article, connecting with other conductive strands 80C in the fabric article and / or other seams 12A in the fabric article, accommodating bends or curves in the fabric article, etc.). Gap 62 may extend through some or all of the thickness of seam 12A (e.g., through some or all of portions 12-1, 12-2, and 12-3).

[0077] The fabric seam 12A may have one or more side pockets, such as side pocket 52 for receiving the end 54 of the fabric portion 12B. Figure 9In the example, seam 12A has a first side pocket 52 for receiving the end 54 of a first fabric portion 12B and a second side pocket 52 for receiving the end 54 of a second fabric portion 12B. The opening 52 (sometimes referred to as an outer pocket, opening, cavity, gap, U-shaped opening, groove, slot, etc.) can be a side pocket extending along part or all of the length of seam 12A. The side pocket 52 can be formed during the formation of fabric 12 or can be formed after the formation of fabric 12 (e.g., by removing the seam that joins the upper fabric portion 12-1 to the lower fabric portion 12-2). The end 54 of fabric portion 12B can be attached to seam 12A within the side pocket 52 by sewing, adhesive, a fusible material (e.g., fusible strands 80, which are interwoven with and melted to attach the end 54 to seam 12A of portions 12B, 12-1, 12-2, and / or 12-3), welding, and / or any other suitable attachment technique.

[0078] Figure 10 This illustrates how seam 12A can incorporate one or more electrodes, such as electrode 86. Electrode 86 can be a sheet of conductive material, such as metal or indium tin oxide, or electrode 86 can be formed from a patch of conductive strands 80C in the fabric seam 12A. Electrode 86 can be located between upper fabric portion 12-1 and lower fabric portion 12-2, or electrode 86 can be formed on the exposed outer surface of seam 12A. If desired, conductive strands 80C can include portions overlapping electrode 86, such as segment 84. If desired, segment 84 of strand 80C and electrode 86 can be separated by a gap and can form a capacitor (e.g., forming capacitive touch sensor electrodes for input devices such as capacitive buttons and / or forming part of an array of capacitive touch sensing electrodes to form a touch-sensitive area in fabric seam 12A).

[0079] Figure 12 The diagram illustrates how seam 12A can be incorporated with one or more tubes, such as tube 92. Tube 92 can be coupled to an end member, such as a planar member 88. Planar member 88 may have one or more openings, such as opening 90 exposed to the outside of fabric seam 12A. Tube 92 can be used to deliver fluid and / or gas to planar member 88, such that the fluid or gas can exit seam 12A via opening 90. This type of arrangement can be used to provide cooling and / or heating effects (e.g., control circuitry 16 can provide cooling air to a user via tube 92 and opening 90). If desired, tube 92 can alternatively or additionally be used to receive fluid and / or gas through opening 90 and can deliver fluid and / or gas elsewhere in fabric seam 12A.

[0080] Figure 12 The front view of illustrative article 10 shows a fabric seam with integrated electronic components. Figure 12 In the example, item 10 is a garment, such as a shirt. The shirt may have fabric portions 12B joined together using seams 12A. For example, one seam 12A may form a collar around the user's neck, another seam 12A may form a strap around the user's arm, another seam 12A may extend down to the back of the shirt, another seam 12A may extend down to the side of the shirt, and so on. Figure 12 The seam location is only an illustrative example. Electronic component 26 may be incorporated into seam 12A.

[0081] Electronic component 26 may have a single setting function predetermined during manufacturing (e.g., component 26 may be specifically configured for posture monitoring during manufacturing), setting functions determined by the user or a third party (e.g., the user's physician) during the initial setup process (e.g., the user may configure component 26 as a fitness tracking device), and / or adjustable functions or sets of functions that can be freely changed and reconfigured based on the user's needs. For example, the user may configure device 26 as a fall detection device during regular use and may reconfigure device 26 as a physical therapy assistant during physical therapy.

[0082] Based on the desired function of each component 26, the electronic components 26 may be placed in locations within the article 10. For example, electronic components 26 surrounding the arm of the shirt 10 may have a heart rate sensor for monitoring heart rate and / or may have a motion sensor (e.g., an accelerometer) for tracking arm movements. Electronic components 26 along the back of the shirt 10 may have a posture monitoring device and a haptic output device that provides haptic output to remind the user to straighten his or her back when the posture monitoring device indicates that the user's back is slumped. Electronic components 26 surrounding the collar of the shirt 10 may include a light sensor for monitoring sun exposure levels. These examples are merely illustrative. Typically, electronic components 26 may be configured with any suitable set of input-output functions and may be placed in any suitable location within the fabric article 10.

[0083] like Figure 12As shown, some seams 12A have bends and curves (e.g., changing direction within article 10), some seams 12A branch into multiple directions (e.g., connecting to other seams 12A), some seams 12A are wider than others, some seams 12A have more or fewer electronic components 26 than others, and so on. If desired, some seams 12A may not have electronic components 26, but may include conductive strands 80C forming signal paths to other seams 12A that do have electronic components 26. The electronic components 26 may operate as a separate device including individual control circuitry, controllable by control circuitry located within article 10, and / or controllable by control circuitry within external electronic devices (e.g., a user's personal electronic device, such as a cellular phone, laptop, tablet, watch, etc.). These examples are merely illustrative. Other configurations of article 10 may be used if desired.

[0084] Figure 13 , Figure 14 and Figure 15 An illustrative example of the edge shape that can be used for seam 12A is shown. Figure 13 In the example, seam 12A has no opening (e.g., Figure 9 The side pocket 52 has opposing first edges 56A and second edges 56B. Edges 56A and 56B may have any suitable side profile (e.g., curved, rectangular, slanted, etc.). Edges 56A and 56B may have the same side profile or may have different side profiles. Since there is no side pocket 52, other fabric portions such as fabric portion 12B may be sewn or otherwise attached to the outside of seam 12A (e.g., instead of being fitted inside the side pocket of seam 12A).

[0085] exist Figure 14 In the example, seam 12A has opposing first edges 56A and second edges 56B. One edge, such as edge 56A, may not have an opening (e.g., may not have a side pocket 52), while the other edge, such as edge 56B, may have a side pocket 52 for receiving material such as fabric portion 12B.

[0086] exist Figure 15 In the example, seam 12A has opposing first 56A and second edges, both of which have associated side pockets 52 for receiving materials such as fabric portions 12B.

[0087] Figure 17 and Figure 18 An exemplary example of an attachment technique for attaching fabric seam 12A to fabric portion 12B is shown. Figure 16In the example, fabric portion 12B is received within side pocket 52 and sewn to fabric seam 12A using thread 58. Thread 58 may be formed by strands 80 interwoven with strands 80 of fabric seam 12A and strands 80 of fabric portion 12B. Thread 58 may be any suitable type of thread (e.g., chain stitch, lockstitch, straight stitch, etc.).

[0088] exist Figure 17 In the example, fabric portion 12B is received within side pocket 52 and bonded to fabric seam 12A using structure 60. Structure 60 may be an adhesive layer, a weld, a set of fusible strands 80 that have been melted to bond seam 12A to fabric 12B, and / or other suitable attachment structures.

[0089] Figure 18 and Figure 19 This is a top view of an exemplary fabric seam 12A, which has gaps to allow signal paths within seam 12A to branch off from each other in different directions. Figure 18 This illustrates how a gap 62 can be formed between seam strips 64 in fabric seam 12A. The seam strips 64 may have a uniform width or may have different widths between the gaps 62. For example, one strip 64 may have a width D1 between adjacent gaps 62, while another strip 64 may have a width D2 between adjacent gaps 62, where D2 is less than D1. The gaps 62 may be formed in seam 12A during the formation of seam 12A (e.g., by a warp knitting machine or bonding machine). Figure 4 Other equipment described may be used to produce fabric 12A with gap 62, or gap 62 may be formed in seam 12A after seam 12A has been knitted, woven or otherwise formed. Each strip 64 may include one conductive strand 80C, may include multiple conductive strands 80C, and / or may have no conductive strands 80C.

[0090] Initially, joint 12A may be flat. For example, joint 12A may initially be located on a plane (e.g., Figure 16 In the XY plane), and strip 64 may be parallel to the axis (e.g., Figure 18 (Extending along the Y-axis). When the seam 12A is joined to an article such as the fabric article 10, the strip 64 can be bent in one or more directions, such as... Figure 19 As shown. Strip 64 can be in any suitable direction (e.g., Figure 19The strip 64 can be bent in the X, Y, and / or Z directions and can be bent any suitable number of times (e.g., the strip 64 may have one, two, three, or more than three turns). The seam 12A and the strip 64 forming part of the seam 12A can be sufficiently flexible and / or stretchable to allow signal paths (e.g., strands 80C) within the seam 12A to branch without damaging the signal paths or electronic components 26. This allows signals from electronic components 26 to be routed to different locations within the article 10 (e.g., the side seam 12A on the shirt 10 may have a first strip 64 branching to the arm seam 12A and a second strip 64 branching to the collar seam 12A, as shown). Figure 12 (as in the example).

[0091] For example, the fabric seam 12A can form part of a glove having sensors and / or other electronic components 26 positioned along the user's individual fingers. The seam 12A may have a central base portion at the user's palm (or on the back of the user's hand) and may have different strips 64 extending from the base portion and branching to extend along the user's individual fingers. If desired, this allows the electronic components 26 along the individual fingers to be connected to each other and / or connected to a common control circuit using a single fabric seam.

[0092] If necessary, one or more portions of seam 12A may form a connector. For example, seam 12A may have a portion with one or more electrical contacts (e.g., an exposed portion of conductive strand 80C, a metal lead or contact pad coupled to strand 80C, etc.), which are configured to mate with the electrical contacts of a mating connector (e.g., a connector on another seam 12A in article 10 and / or a connector outside article 10).

[0093] In some arrangements, the opening can be incorporated into the fabric seam 12A. For example... Figure 20 As shown, for example, opening 68 can be incorporated into fabric seam 12A to increase airflow and / or allow light to pass through fabric seam 12A. Figure 21 As shown in the top view, the fabric seam 12A may have a single opening 68, two openings, and / or an array of openings. The opening 68 may extend completely or partially through the thickness of the fabric seam 12A. The opening 68 may be located between electronic components 26 and / or the electronic components 26 may be located between openings 68. The opening 68 may be used to increase the breathability of the fabric 12 and / or may be configured to allow light or other elements to pass through the fabric 12.

[0094] exist Figure 22In the example, fabric seam 12A includes a window that exposes electronic component 26 to the outside of seam 12A to allow light, air, and / or other elements to reach and / or be emitted from component 26 to the outside. Electronic component 26 may be housed within an opening 74 of fabric seam 12A. Opening 74 may be a pocket created during the formation of fabric seam 12A (e.g., similar to...). Figure 4 The opening 74 can be formed in the pocket 66, or it can be formed in the seam 12A after the seam 12A is formed. The opening 74 can form a window that allows the component 26 to transmit signals to the outside and / or detect signals from the outside through the opening 74.

[0095] For example, component 26 may include optical components, such as optical component 72. Optical component 72 may be a light sensor, a light-emitting device, a proximity sensor including a light emitter and a light sensor, a heart rate sensor, and / or other optical components. In an exemplary arrangement, optical component 72 may be used to collect information about an external object, such as external object 70. For example, external object 70 may be the skin of a user resting against fabric seam 12A, and optical component 72 may detect heart rate, blood oxygen level, color, presence, distance, and / or other information about external object 70 by collecting measurements via window 74. Other types of electronic components may operate via window 74 in fabric seam 12A if desired. The use of optical components is merely exemplary.

[0096] As described above, one aspect of this technology involves collecting and using information, such as information from input-output devices. This disclosure envisions, in some cases, the collection of data including personal information that uniquely identifies or can be used to contact or locate specific individuals. Such personal information data may include demographic data, location-based data, telephone numbers, email addresses, Twitter IDs, home addresses, data or records related to a user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, usernames, passwords, biometric information, or any other identifying information or personal information.

[0097] This disclosure recognizes that the use of such personal information within the technology disclosed herein can be used to benefit users. For example, the personal information data can be used to deliver targeted content that is of interest to the user. Therefore, the use of such personal information data enables the user to have control over the content delivered. Furthermore, this disclosure also anticipates other uses of personal information data that are beneficial to the user. For example, health and fitness data can be used to provide insights into the user's overall health status or can be used as positive feedback for individuals using technology to pursue health goals.

[0098] This disclosure assumes that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are generally recognized as meeting or exceeding industry or governmental requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as data collection and / or use change. Personal information from users should be collected for the entity's lawful and reasonable purposes and not shared or sold outside of these lawful uses. Furthermore, such collection / sharing should be conducted only after obtaining informed consent from users. In addition, such entities should consider taking any necessary steps to protect and safeguard access to such personal information data and ensure that others with access to such personal information data comply with their privacy policies and processes. Additionally, such entities may be subject to third-party evaluations to demonstrate their compliance with widely accepted privacy policies and practices. Furthermore, policies and practices should be adapted to the specific types of personal information data collected and / or accessed, and to applicable laws and standards, including specific considerations regarding jurisdiction. For example, in the United States, the collection or access to certain health data may be governed by federal and / or state laws such as the Health Insurance and Accountability Act (HIPAA), while in other countries health data may be subject to other regulations and policies and should be processed accordingly. Therefore, different privacy practices should be maintained for different types of personal data in each country.

[0099] Regardless of the foregoing, this disclosure also anticipates implementation schemes for users to selectively block the use or access to their personal information data. That is, this disclosure anticipates providing hardware and / or software components to prevent or block access to such personal information data. For example, the technology may be configured to allow users to opt-in or opt-out at any time during or after registering for the service. Alternatively, users may choose not to provide specific types of user data. Furthermore, users may choose to limit the length of time user-specific data is retained. In addition to providing opt-in and opt-out options, this disclosure envisions providing notifications related to access to or use of personal information. For example, users may be informed when downloading an application (“Application”) that their personal information data will be accessed, and then reminded again before the application accesses the personal information data.

[0100] Furthermore, the purpose of this disclosure is to manage and process personal information data to minimize the risk of unintentional or unauthorized access or use. Once data is no longer needed, this risk can be minimized by limiting data collection and deleting data. Additionally, and where applicable, including in certain health-related applications, data deidentification can be used to protect user privacy. Where appropriate, deidentification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or characteristics of stored data (e.g., collecting location data at the city level rather than address level), controlling how data is stored (e.g., aggregating data among users), and / or other methods.

[0101] Therefore, while this disclosure broadly covers the use of information, including personal information data, to implement one or more of the various disclosed embodiments, it is also contemplated that various embodiments can be implemented without accessing personal information data. That is, various embodiments of the present invention will not be rendered inoperable due to the absence of all or part of such personal information data.

[0102] According to one embodiment, an article is provided, the article comprising: a fabric seam having a first fabric portion and a second fabric portion and a conductive strand extending between the first fabric portion and the second fabric portion; a side pocket located between the first fabric portion and the second fabric portion; and an electronic component located within the fabric seam, the electronic component having a groove, and the conductive strand being electrically coupled to the electronic component within the groove.

[0103] According to another embodiment, the first fabric portion and the second fabric portion include a warp-knitted layer.

[0104] According to another embodiment, the article includes a third fabric portion having an edge that extends into the side pocket.

[0105] According to another embodiment, the article includes an adhesive for bonding the edge to the first and second fabric portions in the side pocket.

[0106] According to another embodiment, the article includes stitching that joins the edge to the first and second fabric portions in the side pocket.

[0107] According to another embodiment, at least one of the first fabric portion and the second fabric portion includes a fusible strand that has been melted to bond the edge to the first fabric portion and the second fabric portion in the side pocket.

[0108] According to another embodiment, the article includes an additional side pocket located between the first fabric portion and the second fabric portion, with the electronic component inserted between the side pocket and the additional side pocket.

[0109] According to another embodiment, the article includes an array of openings located in the seams of the fabric.

[0110] According to another embodiment, the fabric seam includes a window through which the electronic components are exposed to the outside of the fabric seam.

[0111] According to another embodiment, the electronic component includes an optical sensor that collects information about external objects through the window.

[0112] According to one embodiment, a fabric seam is provided, the fabric seam including a first fabric layer and a second fabric layer; a first side pocket and a second side pocket, the first side pocket and the second side pocket being located between the first fabric layer and the second fabric layer; a conductive strand inserted between the first fabric layer and the second fabric layer; and an electronic component coupled to the conductive strand between the first side pocket and the second side pocket.

[0113] According to another embodiment, the first fabric layer and the second fabric layer comprise a warp-knitted layer.

[0114] According to another embodiment, the electronic component includes a groove in which the conductive strands are soldered.

[0115] According to another embodiment, the fabric seam includes an additional conductive strand inserted between the first fabric layer and the second fabric layer, the conductive strand and the additional conductive strand being separated by a gap in the fabric seam.

[0116] According to another embodiment, the conductive strand and the additional conductive strand extend in different directions.

[0117] According to one embodiment, a fabric seam is provided, the fabric seam including a first fabric portion and a second fabric portion; a first conductive strand and a second conductive strand extending between the first fabric portion and the second fabric portion, the first conductive strand and the second conductive strand being separated by a gap in the first fabric portion and the second fabric portion; and an electronic component inserted between the first fabric portion and the second fabric portion and electrically coupled to the first conductive strand.

[0118] According to another embodiment, the gap separates a first strip and a second strip of the fabric seam, wherein the first conductive strand is located in the first strip and the second conductive strand is located in the second strip.

[0119] According to another embodiment, the first strip and the second strip are bent away from each other.

[0120] According to another embodiment, the first fabric portion and the second fabric portion comprise warp-knitted fabric.

[0121] According to another embodiment, the electronic component has a groove, and the first conductive strand is soldered to the electronic component within the groove.

[0122] The foregoing description is merely illustrative, and various modifications can be made by those skilled in the art without departing from the scope and substance of the described embodiments. The aforementioned embodiments can be implemented independently or in any combination.

Claims

1. An article comprising: A fabric seam having a first fabric portion and a second fabric portion, wherein the first fabric portion and the second fabric portion have corresponding overlapping first and second edges; A conductive strand extending between the first fabric portion and the second fabric portion; A side pocket located between the first fabric portion and the second fabric portion; A third fabric portion having a third edge extending into the side pocket, wherein the third fabric portion extends beyond the first edge and the second edge; as well as An electronic component is located within the fabric seam, wherein the electronic component has a groove, wherein the conductive strands are electrically coupled to the electronic component within the groove, and wherein the side pocket faces away from the electronic component.

2. The article of claim 1, wherein the first fabric portion and the second fabric portion comprise a warp-knitted layer.

3. The article of claim 1, further comprising an adhesive for bonding the third edge to the first and second fabric portions in the side pocket.

4. The article of claim 1, further comprising a seam connecting the third edge to the first and second fabric portions in the side pocket.

5. The article of claim 1, wherein at least one of the first fabric portion and the second fabric portion comprises a fusible strand that has been melted to bond the third edge to the first fabric portion and the second fabric portion in the side pocket.

6. The article of claim 1, further comprising an additional side pocket located between the first fabric portion and the second fabric portion, wherein the electronic component is inserted between the side pocket and the additional side pocket.

7. The article of claim 1, further comprising an array of openings located in the fabric seam.

8. The article of claim 1, wherein the fabric seam includes a window through which the electronic component is exposed to the outside of the fabric seam.

9. The article of claim 8, wherein the electronic component includes an optical sensor that collects information about an external object through the window.

10. A fabric seam, comprising: A first fabric layer and a second fabric layer, the first fabric layer and the second fabric layer having corresponding first edges and second edges, the first edges and the second edges being aligned with each other; A first side pocket and a second side pocket, the first side pocket and the second side pocket being located between a first fabric layer and a second fabric layer, wherein the first side pocket is configured to receive a third fabric portion extending beyond the first edge and the second edge; A conductive strand is inserted between the first fabric layer and the second fabric layer; as well as An electronic component is coupled to the conductive strand between the first side pocket and the second side pocket, wherein the conductive strand and the electronic component are located between the first side pocket and the second side pocket.

11. The fabric seam of claim 10, wherein the first fabric layer and the second fabric layer comprise a warp-knitted layer.

12. The fabric seam of claim 10, wherein the electronic component includes a groove in which the conductive strands are welded.

13. The fabric seam of claim 10, further comprising an additional conductive strand inserted between the first fabric layer and the second fabric layer, wherein the conductive strand and the additional conductive strand are separated by a gap in the fabric seam.

14. The fabric seam of claim 13, wherein the conductive strand and the additional conductive strand extend in different directions.

15. A fabric seam, comprising: A first fabric portion and a second fabric portion, the first fabric portion and the second fabric portion having corresponding first edges and second edges, the first edges and the second edges being aligned with each other; A first side pocket and a second side pocket, the first side pocket and the second side pocket being located between a first fabric portion and a second fabric portion, wherein the first side pocket is configured to receive a third fabric portion extending beyond the first edge and the second edge; A first conductive strand and a second conductive strand, the first conductive strand and the second conductive strand extending between a first fabric portion and a second fabric portion, wherein the first conductive strand and the second conductive strand are separated by a gap in the first fabric portion and the second fabric portion. as well as An electronic component is located between the first side pocket and the second side pocket, the electronic component is inserted between the first fabric portion and the second fabric portion and electrically coupled to the first conductive strand.

16. The fabric seam of claim 15, wherein the gap separates the first strip and the second strip of the fabric seam, wherein the first conductive strand is located in the first strip and the second conductive strand is located in the second strip.

17. The fabric seam of claim 16, wherein the first strip and the second strip are bent away from each other.

18. The fabric seam of claim 16, wherein the first fabric portion and the second fabric portion comprise warp-knitted fabric.

19. The fabric seam of claim 16, wherein the electronic component has a groove, and wherein the first conductive strand is soldered to the electronic component within the groove.

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