Slab Furnace Inlet Temperature Prediction Method, Device, Equipment and Computer Storage Medium

Abstract

This application relates to a method, device, equipment and computer storage medium for predicting the temperature of a slab entering a furnace. The actual measured temperature values of multiple slabs are obtained, and the stack includes multiple slabs; the positions of each slab among the multiple slabs in the stack are obtained; according to the position of the first slab in the stack and the actual measured temperature value of the first slab, a prediction result is obtained, and the first slab is any one of the multiple slabs. In the above, the actual measured temperature values of each slab are measured by a high-temperature furnace inlet meter, and then according to the position of the first slab in the stack, with the actual measured temperature value as the calculation data, the temperature of the first slab is predicted, so as to obtain a more accurate prediction result and improve the accuracy of the prediction result of the slab temperature.

Description

Technical Field

[0001] This application belongs to the technical field of slab production, and particularly relates to a method, device, equipment and computer storage medium for predicting the temperature of slabs entering a furnace. Background Art

[0002] The secondary heating furnace computer calculates the heat transfer process inside the heating furnace through its own model, and obtains the overall temperature and its distribution of the steel billet; according to the optimization algorithm, it dynamically confirms the best heating curve of the heating furnace, and realizes the dynamic optimization of various production parameters through automatic / manual methods, which is a prerequisite for producing high-quality plates in the hot rolling line.

[0003] The basis for the secondary heating furnace computer to build a finite element model of the slab comes from the high-temperature thermometer at the furnace inlet. Due to the interference of scale, the accuracy error of the equipment itself and other factors, the predicted value of the temperature at the furnace inlet will show mutations. When the slabs are stacked, affected by the position of the slabs, the natural air-cooling states of the slabs are inconsistent, and the surface temperatures of the slabs are different, which in turn leads to unreasonable temperature differences in the core parts of the slabs compensated by the finite element model. That is to say, the current accuracy of predicting the slab temperature is relatively low. Summary of the Invention

[0004] Embodiments of the present invention provide a method, device, equipment and computer storage medium for predicting the temperature of slabs entering a furnace, which can improve the accuracy of predicting the slab temperature.

[0005] According to the first aspect of the present application, a method for predicting the temperature of slabs entering a furnace is provided, and the method may include:

[0006] Obtain the measured temperature values of multiple slabs, where the stack includes multiple slabs;

[0007] Obtain the position of each slab among the multiple slabs in the stack;

[0008] Obtain a prediction result according to the position of the first slab in the stack and the measured temperature value of the first slab, where the first slab is any one of the multiple slabs.

[0009] Optionally, the obtaining of the prediction result according to the position of the first slab in the stack and the measured temperature value of the first slab may include:

[0010] If the position of the first slab in the stack is the first or second layer from top to bottom, obtain the slab information of the first slab;

[0011] Obtain the temperature decay limit value of the first slab according to the slab information of the first slab;

[0012] Obtain the prediction result according to the temperature decay limit value and the measured temperature value of the first slab.

[0013] Optionally, obtaining a prediction result according to the temperature decay limit value and the measured temperature value of the first slab may include:

[0014] When the temperature decay limit value of the first slab is greater than the measured temperature value of the first slab, using the temperature decay limit value of the first slab as the predicted temperature of the first slab.

[0015] Optionally, obtaining a prediction result according to the temperature decay limit value and the measured temperature value of the first slab may include:

[0016] When the temperature decay limit value of the first slab is less than or equal to the measured temperature value of the first slab, correcting the measured temperature value of the first slab with a preset correction coefficient;

[0017] Using the measured temperature value of the first slab as the predicted temperature of the first slab.

[0018] Optionally, obtaining a prediction result according to the position of the first slab in the stack and the measured temperature value of the first slab may include:

[0019] If the position of the first slab in the stack is not the first or second layer from top to bottom, correcting the measured temperature value of the first slab with a preset correction coefficient;

[0020] Using the measured temperature value of the first slab as the predicted temperature of the first slab.

[0021] According to a second aspect of the present application, there is provided a device for predicting the temperature of a slab entering a furnace, and the device may include:

[0022] A first acquisition module, which acquires the measured temperature values of multiple slabs, and the stack includes multiple slabs;

[0023] A second acquisition module, which acquires the position of each slab in the stack among the multiple slabs;

[0024] A third acquisition module, which obtains a prediction result according to the position of the first slab in the stack and the measured temperature value of the first slab, and the first slab is any one of the multiple slabs.

[0025] Optionally, the third acquisition module includes:

[0026] A first acquisition sub-module, if the position of the first slab in the stack is the first or second layer from top to bottom, acquires the slab information of the first slab;

[0027] A second acquisition sub-module, which obtains the temperature decay limit value of the first slab according to the slab information of the first slab;

[0028] A third acquisition sub-module, which obtains a prediction result according to the temperature decay limit value and the measured temperature value of the first slab.

[0029] According to a third aspect of the present application, a slab entering furnace temperature prediction device is provided, and the slab entering furnace temperature prediction device may include:

[0030] A processor and a memory storing computer program instructions; wherein, when the processor executes the computer program instructions, the slab furnace temperature prediction method of any one of the first aspects is implemented.

[0031] According to a fourth aspect of the present application, a computer storage medium is provided, on which computer program instructions are stored. When the computer program instructions are executed by a processor, the method for predicting the slab entering the furnace temperature of any one of the first aspects is implemented.

[0032] According to a fifth aspect of the present application, a computer program product is provided, characterized in that the computer program product includes computer program instructions, and when the computer program instructions are executed by a processor, the slab entering furnace temperature prediction method of any one of the first aspects is implemented.

[0033] The technical solutions provided by the embodiments of this application bring at least the following beneficial effects:

[0034] The embodiments of the present application provide a method, apparatus, device, and computer storage medium for predicting the temperature of a slab entering a furnace, which includes obtaining the actual temperature values of a plurality of slabs, wherein a stack includes the plurality of slabs; obtaining the position of each slab in the stack; and obtaining a prediction result based on the position of a first slab in the stack and the actual temperature value of the first slab, wherein the first slab is any one of the plurality of slabs. The present application measures the actual temperature value of each slab using a high-temperature furnace entry meter, and then predicts the temperature of the first slab based on the position of the first slab in the stack and the actual temperature value as calculation data, thereby obtaining a more accurate prediction result and improving the accuracy of the slab temperature prediction result.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application, and do not constitute an improper limitation on the present application.

[0037] Figure 1 This is a flow chart showing a method for predicting slab furnace temperature according to an exemplary embodiment;

[0038] Figure 2 is a detailed flow chart of a method for predicting slab furnace temperature according to an exemplary embodiment;

[0039] Figure 3 is a structural block diagram of a slab charging temperature prediction device shown according to an exemplary embodiment;

[0040] Figure 4 is a structural block diagram of a slab charging temperature prediction device shown according to an exemplary embodiment. Detailed implementation manners

[0041] To enable those of ordinary skill in the art to better understand the technical solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0042] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such used data may be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0043] A slab charging temperature prediction method provided by the present application can be applied to a process such as Figure 1 and will be described in detail in combination with Figure 1 specifically.

[0044] Figure 1 is a flowchart of a slab charging temperature prediction method shown according to an exemplary embodiment. The method includes the following steps:

[0045] S101. Obtain the measured temperature values of multiple slabs. The stack includes multiple slabs.

[0046] Detect the temperature of the slabs through an in-furnace pyrometer to obtain the measured temperature value of the first slab. Multiple slabs are stacked on top of each other to form a stack.

[0047] S102. Obtain the position of each slab in the stack among the multiple slabs.

[0048] Specifically, during the production process, the third-level machine of the reheating furnace will record the number of layers of the stack and the positions of the slabs in the stack, and the position of any slab in the stack can be confirmed through the third-level machine of the reheating furnace.

[0049] S103. Obtain a prediction result based on the position of the first slab in the stack and the measured temperature value of the first slab. The first slab is any one of the multiple slabs.

[0050] Specifically, after confirming the position of the first slab in the stack, based on the position of the first slab in the stack and using the temperature decay limit value of the first slab as calculation data, the temperature of the first slab can be predicted, and finally a prediction result can be obtained.

[0051] In the slab furnace inlet temperature prediction method of the embodiment of the present application, the measured temperature values of each slab are measured by a high-temperature furnace inlet meter, and then based on the position of the first slab in the stack, using the measured temperature value as calculation data, the temperature of the first slab is predicted, so as to obtain a more accurate prediction result and improve the accuracy of the prediction result of the slab temperature.

[0052] As an alternative embodiment, Figure 2 is a refined flowchart of a slab furnace inlet temperature prediction method shown according to an exemplary embodiment. Please refer to Figure 2 In order to obtain a prediction result based on the position of the first slab in the stack and the temperature decay limit value of the first slab, the above S103 may include:

[0053] S201, if the position of the first slab in the stack is the first layer or the second layer from top to bottom, obtain the slab information of the first slab;

[0054] Specifically, the slab information may include data information such as the width, storage age, continuous casting temperature, and furnace inlet temperature of the slab. The storage age refers to the time duration between the time when the slab enters the heating furnace and the time when the slab is cut off.

[0055] S202, obtain the temperature decay limit value of the first slab according to the slab information of the first slab;

[0056] Specifically, input the slab information of the first slab, and the temperature decay limit value of the first slab can be analyzed through analysis tools such as MITALB. The temperature decay limit value refers to the limit value of the slab temperature decrease.

[0057] S203, obtain a prediction result according to the temperature decay limit value and the measured temperature value of the first slab.

[0058] In this embodiment, the heat of the slab is taken away by the external air flow in the stack, resulting in a sudden change in the temperature values of the slabs located in the first and second layers at the top of the stack. Therefore, when the first slab is located in the first and second layers at the top of the stack, it is necessary to compare the temperature decay limit value and the measured temperature value of the first slab to avoid the error that the measured temperature of the first slab is lower than the temperature decay limit value, thereby improving the prediction accuracy of the temperature of the first slab.

[0059] As an alternative embodiment, please refer to Figure 2, based on the temperature decay limit value and the measured temperature value of the first slab, obtain the prediction result. The above S203 may include:

[0060] S204, if the position of the first slab in the stack is the first or second layer from top to bottom, and when the temperature decay limit value of the first slab is greater than the measured temperature value of the first slab; use the temperature decay limit value of the first slab as the predicted temperature of the first slab.

[0061] In this embodiment, if the temperature decay limit value of the first slab is greater than the measured temperature value of the first slab, the measured temperature value of the first slab cannot be lower than the temperature decay limit value of the first slab. That is to say, the measured temperature value obtained by the high-temperature charging furnace for detecting the temperature of the first slab is an incorrect result, and the measured temperature value of the first slab cannot be used. Then, use the temperature decay limit value of the first slab as the predicted temperature of the first slab.

[0062] As an alternative embodiment, please refer to Figure 2 , based on the temperature decay limit value and the measured temperature value of the first slab, obtain the prediction result. The above S203 may also include:

[0063] S205, if the position of the first slab in the stack is the first or second layer from top to bottom, and when the temperature decay limit value of the first slab is less than or equal to the measured temperature value of the first slab,

[0064] S206, correct the measured temperature value of the first slab using a preset correction coefficient; use the measured temperature value of the first slab as the predicted temperature of the first slab.

[0065] In this embodiment, when the temperature decay limit value of the first slab is less than or equal to the measured temperature value of the first slab, that is to say, the temperature of the first slab has not dropped to the temperature decay limit value. At this time, the measured temperature value of the first slab can be used as the calculation basis. However, when the high-temperature charging furnace detects the measured temperature value, due to the detection error of the high-temperature charging furnace itself and the fact that a layer of iron skin will form on the surface of the slab in the high-temperature state, which affects the detection of the measured temperature value by the high-temperature charging furnace, resulting in a lower measured temperature value. Therefore, the measured temperature value detected by the high-temperature charging furnace will have an error and needs to be corrected according to the preset correction coefficient. Specifically, some correction coefficients are shown in Table 1 below:

[0066] Table 1

[0067] Measured temperature value (T) Storage age Correction factor T<100 30 30 T<100 40 20 500<＝T<600 15 60

[0068] Among them, the correction coefficient is inversely proportional to the storage age and directly proportional to the measured surface temperature value. Add the corresponding correction coefficient to the measured temperature value of the first slab to obtain the temperature prediction result of the first slab.

[0069] As an alternative embodiment, please refer to Figure 2 , and obtain a prediction result according to the position of the first slab in the stack and the temperature decay limit value of the first slab. The above S103 includes:

[0070] S207, if the position of the first slab in the stack is not the topmost or the second layer from the top, then correct the measured temperature value of the first slab by using a preset correction coefficient;

[0071] S208, take the measured temperature value of the first slab as the predicted temperature of the first slab.

[0072] In this embodiment, since the first slab is not in the topmost or the second layer from the top of the stack, the first slab will not be affected by the abnormal temperature caused by air flow. However, considering the error of the slab temperature detection result by the high-temperature furnace inlet meter, it is still necessary to correct it by using the correction coefficient shown in Table 1 to obtain the accurate temperature of the first slab.

[0073] It should be noted that the application scenarios described in the embodiments of the present application above are for more clearly explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art know that with the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0074] Based on the same inventive concept, the present application also provides a slab furnace inlet temperature prediction device 30. Specific details are described in combination with Figure 3 as follows.

[0075] Figure 3 is a schematic structural diagram of a slab furnace inlet temperature prediction device 30 shown according to an exemplary embodiment.

[0076] As shown in Figure 3 , the slab furnace inlet temperature prediction device 30 may specifically include:

[0077] A first acquisition module 31 that acquires the measured temperature values of multiple slabs, and the stack includes multiple slabs;

[0078] A second acquisition module 32 that acquires the position of each slab in the stack among the multiple slabs;

[0079] A third acquisition module 33 that obtains a prediction result according to the position of the first slab in the stack and the measured temperature value of the first slab, where the first slab is any one of the multiple slabs.

[0080] In one embodiment of the present application, the measured temperature values of each slab are obtained by measuring the temperature when the slab enters the furnace at a high temperature. Then, according to the position of the first slab in the stack, using the measured temperature value as calculation data, the temperature of the first slab is predicted, so as to obtain a more accurate prediction result and improve the accuracy of the prediction result of the slab temperature.

[0081] The third acquisition module 33 further includes:

[0082] The first acquisition sub-module, if the position of the first slab in the stack is the first layer or the second layer from top to bottom, acquires the slab information of the first slab;

[0083] The second acquisition sub-module, according to the slab information of the first slab, obtains the temperature decay limit value of the first slab;

[0084] The third acquisition sub-module, according to the temperature decay limit value and the measured temperature value of the first slab, obtains the prediction result.

[0085] Specifically, the first acquisition sub-module can be a high-temperature furnace inlet meter. The temperature of the slab is detected by the high-temperature furnace inlet meter to obtain the measured temperature value of the first slab. The heat of the slab is carried away by the external air flow in the stack, resulting in a sudden change in the temperature values of the slabs located in the first and second layers at the top of the stack. Therefore, when the first slab is located in the first and second layers at the top of the stack, it is necessary to compare the temperature decay limit value and the measured temperature value of the first slab, so as to improve the prediction accuracy of the temperature of the first slab.

[0086] Figure 4 The hardware structure diagram of the slab furnace inlet temperature prediction device provided by the embodiment of the present invention is shown.

[0087] The slab furnace inlet temperature prediction device may include a processor 41 and a memory 42 storing computer program instructions.

[0088] Specifically, the above-mentioned processor 41 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0089] The memory 42 may include a mass storage for data or instructions. By way of example and not limitation, the memory 42 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disc, a magneto-optical disc, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory 42 may include removable or non-removable (or fixed) media. Where appropriate, the memory 42 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, the memory 42 is a non-volatile solid-state memory.

[0090] In a particular embodiment, the memory 42 may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage media device, an optical storage media device, a flash memory device, an electrical, optical, or other physical / tangible memory storage device. Thus, generally, the memory 42 includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors 41), it is operable to perform the operations described with reference to the method according to an aspect of the present application.

[0091] The processor 41 reads and executes the computer program instructions stored in the memory 42 to implement any one of the slab charging temperature prediction methods in the above embodiments.

[0092] In one example, the slab charging temperature prediction device may further include a communication interface 43 and a bus 44. Among them, as shown in the figure, the processor 41, the memory 42, and the communication interface 43 are connected through the bus 44 and complete communication with each other.

[0093] The communication interface 43 is mainly used to implement communication between the various modules, devices, units, and / or devices in the embodiments of the present invention.

[0094] Bus 44 includes hardware, software, or both. By way of example and not limitation, bus 44 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, a Wireless Bandwidth interconnect, a Low Pin Count (LPC) bus, a Memory bus, a MicroChannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable bus or a combination of two or more of these. Where appropriate, bus 44 may include one or more buses 44. Although embodiments of the present application describe and illustrate a particular bus 44, the present application contemplates any suitable bus 44 or interconnect.

[0095] The slab charging temperature prediction device can be based on the current slab charging temperature prediction method, so as to realize the combination Figure 1 , Figure 2 and Figure 3 the slab charging temperature prediction method and device described.

[0096] In addition, in combination with the slab charging temperature prediction method in the above embodiments, embodiments of the present application can provide a computer storage medium to implement. Computer program instructions are stored on the computer storage medium; when the computer program instructions are executed by the processor 41, any one of the slab charging temperature prediction methods in the above embodiments is implemented.

[0097] It should be clear that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present application.

[0098] The functional blocks shown in the above-described structural block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present application are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted via a data signal carried in a carrier wave over a transmission medium or a communication link. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical discs, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.

[0099] In addition, an embodiment of the present application also provides a computer program product, including computer program instructions, which can implement the steps and corresponding contents of the foregoing method embodiments when executed by a processor 41.

[0100] It should also be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.

[0101] As described above, various aspects of the present disclosure have been described with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block in the flowcharts and / or block diagrams, and the combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to generate a machine such that the instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the functions / actions specified in one or more blocks of the flowchart and / or block diagram. Such a processor 41 can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each block in the block diagram and / or flowchart, and the combinations of blocks in the block diagram and / or flowchart, can also be implemented by dedicated hardware that performs the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0102] As described above, this is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A method for predicting the slab charging temperature, characterized in that Including: Obtaining the measured temperature values of multiple slabs, where the stack includes multiple slabs; Obtaining the position of each slab in the stack among the multiple slabs; Obtaining a prediction result based on the position of the first slab in the stack and the measured temperature value of the first slab, where the first slab is any one of the multiple slabs; When the position of the first slab in the stack is the first layer or the second layer from top to bottom, obtaining the slab information of the first slab; Obtaining the temperature decay limit value of the first slab based on the slab information of the first slab; Obtaining a prediction result based on the temperature decay limit value and the measured temperature value of the first slab, including: If the position of the first slab in the stack is the first layer or the second layer from top to bottom, and when the temperature decay limit value of the first slab is greater than the measured temperature value of the first slab, taking the temperature decay limit value of the first slab as the predicted temperature of the first slab; When the temperature decay limit value of the first slab is less than or equal to the measured temperature value of the first slab, correcting the measured temperature value of the first slab with a preset correction coefficient; taking the measured temperature value of the first slab as the predicted temperature of the first slab.

2. The method for predicting the slab charging temperature according to claim 1, wherein Obtaining a prediction result based on the position of the first slab in the stack and the measured temperature value of the first slab, including: If the position of the first slab in the stack is not the first layer or the second layer from top to bottom, correcting the measured temperature value of the first slab with a preset correction coefficient; Taking the measured temperature value of the first slab as the predicted temperature of the first slab.

3. A slab furnace inlet temperature prediction device, characterized in that, The device includes: A first acquisition module for obtaining the measured temperature values of multiple slabs, where the stack includes multiple slabs A second acquisition module for obtaining the position of each slab in the stack among the multiple slabs; A third acquisition module for obtaining a prediction result based on the position of the first slab in the stack and the measured temperature value of the first slab, where the first slab is any one of the multiple slabs; Wherein, the third acquisition module includes: A first acquisition sub-module for obtaining the slab information of the first slab when the position of the first slab in the stack is the first layer or the second layer from top to bottom; A second acquisition sub-module for obtaining the temperature decay limit value of the first slab based on the slab information of the first slab; A third acquisition sub-module for, if the position of the first slab in the stack is the first layer or the second layer from top to bottom, when the temperature decay limit value of the first slab is greater than the measured temperature value of the first slab, taking the temperature decay limit value of the first slab as the predicted temperature of the first slab; when the temperature decay limit value of the first slab is less than or equal to the measured temperature value of the first slab, correcting the measured temperature value of the first slab with a preset correction coefficient; taking the measured temperature value of the first slab as the predicted temperature of the first slab.

4. A slab furnace inlet temperature prediction device, characterized in that, The slab furnace inlet temperature prediction device includes: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the method for predicting the slab charging temperature according to any one of claims 1-2 is implemented.

5. A computer storage medium, characterized in that, Computer program instructions are stored on the computer storage medium, and when the computer program instructions are executed by the processor, the method for predicting the slab charging temperature according to any one of claims 1-2 is implemented.

6. A computer program product, characterized in that, The computer program product includes computer program instructions, and when the computer program instructions are executed by the processor, the method for predicting the slab charging temperature according to any one of claims 1-2 is implemented.

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