Wafer inspection station and method

Abstract

The application provides a wafer detection table and a detection method, and relates to the technical field of wafer detection tables. The wafer detection table comprises a bottom box and a detection disc for carrying a wafer to be detected, the detection disc is located above the bottom box, a positioning mechanism is installed on the bottom box and used for positioning and placing the wafer to be detected on the detection disc, a driving mechanism is installed on the bottom box and in transmission connection with the detection disc, the driving mechanism can rotate the detection disc, and a fixing mechanism is used for fixing the wafer on the detection disc. Compared with the prior art, the application has the following technical advantages: when measuring different positions of the same wafer, only a hand-operated rotating disc on the rotating device needs to be rotated to drive the detection disc to rotate, different positions of the wafer are measured, the wafer does not need to be repeatedly placed and taken out, the production efficiency is improved, the labor cost is saved, the surface scratch phenomenon caused by repeated contact and friction between the wafer surface and the detection platform is greatly reduced, and the production cost is saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer detection platform, in particular to a wafer detection platform and a detection method. BACKGROUND

[0002] In the semiconductor production process, single crystal is cut into wafers by a slicing machine, and the edges of the wafers formed by cutting are right-angled edges. At the same time, there may be wafer edge damage caused by polishing, slicing and other previous processes, so it is necessary to chamfer the edges of each wafer to facilitate subsequent grinding and polishing processes, and also to make the wafer more beautiful.

[0003] In the edge grinding process, the wafer edge width needs to be controlled in the wafer chamfering process due to the production needs of subsequent processes. The control method is to use a high-power optical microscope to measure the edge width. When measuring, the wafer to be measured is placed on the detection platform, and the high-power objective lens is aligned with the edge of the wafer to be measured to read the measurement. In order to evaluate the accuracy of the measurement, 3-5 points on the same wafer are often measured to collect data, and then the average value is calculated. In the current measurement, after measuring one point, the wafer needs to be taken out, adjusted in direction and position, and then measured again at the second point. This process is repeated until all points are measured. This method not only consumes time and effort, but also greatly reduces production efficiency. In addition, the operation requirements for personnel are higher, which is not conducive to the convenience of production. At the same time, the direct contact between the wafer and the detection platform can cause damage to the wafer surface, which may cause irreparable surface scratches and other defects, greatly wasting raw materials and increasing production costs. SUMMARY

[0004] One of the purposes of the present application is to provide a wafer detection platform, which optimizes multi-point measurement operation by setting a positioning mechanism, a fixing mechanism and a driving mechanism, facilitates detection, reduces damage to wafers and reduces production costs. Another purpose of the present application is to provide a wafer detection method, which improves production efficiency and greatly reduces material waste caused by detection by applying a wafer detection platform.

[0005] The specific technical solution is a wafer detection platform, which comprises a bottom box and a detection disc for carrying a wafer to be detected, the detection disc being located above the bottom box, further comprising a positioning mechanism, a fixing mechanism and a driving mechanism, the positioning mechanism being installed on the bottom box and used for positioning the wafer to be detected on the detection disc, the driving mechanism being installed on the bottom box and in transmission connection with the detection disc, the driving mechanism being capable of rotating the detection disc, and the fixing mechanism being used for fixing the wafer on the detection disc.

[0006] Preferably, the driving mechanism comprises a hand wheel, a first rotating shaft, a first bevel gear, a second bevel gear and a second rotating shaft, the hand wheel is rotatably installed on the side of the bottom box, one end of the first rotating shaft is fixedly installed on the hand wheel and the other end is fixedly installed with the first bevel gear, one end of the second rotating shaft is fixedly connected with the detection disc and the other end is fixedly installed with the second bevel gear, the second bevel gear and the first bevel gear are in meshing transmission connection.

[0007] Preferably, the first rotating shaft, the first bevel gear, the second bevel gear and the second rotating shaft are located inside the bottom box, the second rotating shaft is fixedly connected with the detection disc through the bottom box, and a bearing is arranged between the second rotating shaft and the bottom box.

[0008] Preferably, the fixing mechanism adopts vacuum negative pressure fixation, the second rotating shaft is hollow, a vacuum hole is formed above the detection disc, and a vacuum device is connected with the vacuum hole through the air exhaust pipe located in the second rotating shaft.

[0009] Preferably, a handle is fixedly installed on the hand wheel.

[0010] Preferably, a scale disc indicating angles is fixedly arranged on the bottom box, and the scale disc is located at the outer periphery of the detection disc.

[0011] Preferably, the alignment mechanism comprises an alignment block, and the alignment block is fixedly installed on the outer edge of the detection disc.

[0012] A wafer detection method comprises the following steps:

[0013] S1, first stably placing the bottom box on a detection platform,

[0014] S2, aligning and placing a wafer to be detected on the detection disc by means of the alignment mechanism and fixing the wafer to be detected on the detection disc by means of the fixing mechanism,

[0015] S3, moving a detection device to measure the edge width data of the wafer to be detected, then rotating the detection disc to measure the edge width data of a second place, and finally completing the measurement after measuring multiple edge width data.

[0016] Preferably, step S2 comprises:

[0017] S21, placing the wafer to be detected on the detection disc in a direction in which the large edge of the wafer to be detected faces the direction of the alignment block and pushing the wafer to be detected so that the large edge of the wafer to be detected is aligned and attached to the alignment block,

[0018] S22, opening a vacuum device to fix the wafer to be detected on the detection disc by suction at the vacuum hole due to negative pressure.

[0019] Preferably, the step S3 comprises:

[0020] S31, the moving detection device measures a width data of a part of the wafer to be detected,

[0021] S32, the detection disc and the wafer to be detected are rotated by rotating the hand-operated turntable, and a second width measurement is performed,

[0022] S33, S32 is repeated, and a plurality of width measurement data are measured.

[0023] Compared with the prior art, the present application has the following technical advantages: by setting the alignment mechanism, the fixing mechanism and the driving mechanism, when measuring different positions of the same wafer, only the hand-operated turntable on the device needs to be rotated to drive the detection disc to rotate by the umbrella-shaped gear, and the different positions of the wafer are measured, without the need of repeatedly putting in and taking out the wafer, which improves the production efficiency, saves the labor cost, greatly reduces the surface scratches caused by the repeated contact and friction between the wafer surface and the detection platform, and is beneficial to saving the production cost. BRIEF DESCRIPTION OF DRAWINGS

[0024] The accompanying drawings, which form a part of the present application, are intended to provide further understanding of the present application, and the illustrative embodiments of the present application and their description serve the purpose of explaining the present application. The accompanying drawings should not be construed in a limiting manner as to the present application.

[0025] Figure 1 is a structural schematic view of a wafer detection table,

[0026] Figure 2 is an internal schematic view of a wafer detection table,

[0027] Figure 3 is a schematic view of the fixing mechanism in the present application,

[0028] Among them:

[0029] 1-bottom box; 2-dial; 3-hand-operated turntable; 4-handle; 5-detection disc; 6-alignment block; 7-first rotating shaft; 8-first umbrella-shaped gear; 9-second umbrella-shaped gear; 10-bearing; 11-second rotating shaft; 12-vacuum hole; 13-vacuum extraction equipment; 14-exhaust pipe. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the embodiments and the drawings. Herein, the illustrative embodiments of the present application and their description serve to explain the present application, but do not constitute a limitation on the present application.

[0031] In the description of the present application, it should be noted that the terms "inner", "outer", "left", "right" are indicative of the positional or locational relationship based on the positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0032] Embodiment 1: Combination Figures 1-2 A wafer detection platform, comprising a base box 1 and a detection disc 5 for carrying a wafer to be detected, the detection disc 5 being located above the base box 1, further comprising a centering mechanism, a fixing mechanism and a driving mechanism, the centering mechanism being installed on the base box 1 for centering and placing the wafer to be detected on the detection disc 5, the driving mechanism being installed on the base box 1 and being in transmission connection with the detection disc 5, the driving mechanism being capable of rotating the detection disc 5, and the fixing mechanism being used for fixing the wafer on the detection disc 5.

[0033] A method for detecting a wafer using the detection platform, comprising the following steps:

[0034] S1, first stably placing the base box 1 on a detection platform,

[0035] S2, centering and placing the wafer to be detected on the detection disc 5 by means of the centering mechanism and fixing the wafer to be detected on the detection disc 5 by means of the fixing mechanism,

[0036] S3, moving a detection device to measure the edge width data of the wafer to be detected, then rotating the detection disc 5 to perform a second edge width measurement, and after measuring a plurality of edge width measurement data, completing the measurement.

[0037] Embodiment 2: Combination Figure 3 On the basis of the structure of embodiment 1, the driving mechanism comprises a hand-operated rotating disc 3, a first rotating shaft 7, a first umbrella-shaped gear 8, a second umbrella-shaped gear 9 and a second rotating shaft 11 located inside the base box 1, the hand-operated rotating disc 3 being rotatably installed on the side of the base box 1, one end of the first rotating shaft 7 being fixedly installed on the hand-operated rotating disc 3 and the other end being fixedly installed with the first umbrella-shaped gear 8, one end of the second rotating shaft 11 being fixedly connected with the detection disc 5 and the other end being fixedly installed with the second umbrella-shaped gear 9, the second umbrella-shaped gear 9 and the first umbrella-shaped gear 8 being in meshing transmission connection, the second rotating shaft 11 being fixedly connected with the detection disc 5 by vertically penetrating through the base box 1, and a bearing 10 being arranged between the second rotating shaft 11 and the base box 1;

[0038] The fixing mechanism adopts vacuum negative pressure fixing, the second rotating shaft 11 is hollow, the vacuum hole 12 is opened above the detection disc 5, the vacuum equipment 13 is connected with the vacuum hole 12 through the air exhaust pipe 14 in the second rotating shaft 11, and the vacuum equipment 13 is located outside the detection table.

[0039] The alignment mechanism comprises an alignment block 6 which is fixedly installed on the outer edge of the detection disc 5.

[0040] The method for detecting wafers by using the detection table comprises the following steps:

[0041] S1, first, the bottom box 1 is stably placed on the detection platform,

[0042] S2, the to-be-detected wafer is placed on the detection disc 5 in a direction in which the large edge direction of the wafer is opposite to the direction of the alignment block 6, and the to-be-detected wafer is pushed to make the large edge position of the wafer opposite to the alignment block 6,

[0043] S3, the vacuum equipment 13 is opened, so that the to-be-detected wafer is fixed on the detection disc 5 due to negative pressure at the vacuum hole 12,

[0044] S4, the detection equipment is moved to measure the edge width data of the to-be-detected wafer,

[0045] S5, the detection disc 5 and the to-be-detected wafer are rotated by rotating the hand-operated rotating disc 3 and transmitting through the first rotating shaft 7 and the second rotating shaft 11, so that the second edge width measurement is performed,

[0046] S6, S5 is repeated to measure multiple edge width measurement data, and the measurement is completed. After the measurement is completed, the vacuum equipment 13 is closed, and the wafer is taken out.

[0047] Example 3: on the basis of the structure of example 2, the hand-operated rotating disc 3 is fixedly installed with a rotating handle 4. By manually rotating the rotating handle 4, the hand-operated rotating disc 3 is driven to rotate, and the operation is more convenient.

[0048] Example 4: on the basis of the structure of example 2, the bottom box 1 is fixedly provided with a scale disc 2 indicating an angle, the scale disc 2 is located at the outer periphery of the detection disc 5, and is uniformly distributed at 1°, 5° or 10°, etc. per 360°. The specific setting is related to the measurement point position, and when measuring, the scale on the scale disc 2 is observed to reach the measurement point in the detection scheme.

[0049] The above merely describes the preferred embodiments of the present application, and is not intended to limit the present application in other forms. Any person skilled in the art can make changes or modifications to the equivalent embodiments with the disclosed technical content. However, any simple modification, equivalent change and modification made to the above embodiments without departing from the technical solution content of the present application and according to the technical essence of the present application still belongs to the protection scope of the technical solution of the present application.

Claims

1. A wafer inspection station, comprising: The device comprises a base box (1) and a testing tray (5) for carrying the wafer to be inspected, the testing tray (5) being located above the base box (1), characterized in that it further includes: an alignment mechanism, a fixing mechanism, and a driving mechanism. The alignment mechanism is mounted on the base box (1) and is used to align the wafer to be inspected on the inspection tray (5). The alignment mechanism includes an alignment stop (6), which is fixedly mounted on the outer edge of the inspection tray (5). The drive mechanism is mounted on the base box (1) and is connected to the detection disk (5) via a transmission connection. The drive mechanism enables the detection disk (5) to rotate. The fixing mechanism is used to fix the wafer on the detection disk (5). The driving mechanism includes: a hand-cranked turntable (3), a first rotating shaft (7), a first bevel gear (8), a second bevel gear (9), and a second rotating shaft (11). The hand-cranked turntable (3) is rotatably mounted on the side of the base box (1). One end of the first rotating shaft (7) is fixedly mounted on the hand-cranked turntable (3), and the first bevel gear (8) is fixedly mounted on the other end. One end of the second rotating shaft (11) is fixedly connected to the detection disc (5), and the second bevel gear (9) is fixedly mounted on the other end. A meshing transmission connection is established between the second bevel gear (9) and the first bevel gear (8). The first rotating shaft (7), the first bevel gear (8), the second bevel gear (9) and the second rotating shaft (11) are located inside the bottom box (1). The second rotating shaft (11) passes through the bottom box (1) and is fixedly connected to the detection disk (5). The bearing (10) is placed between the second rotating shaft (11) and the bottom box (1).

2. The wafer inspection stage according to claim 1, characterized in that, The fixing mechanism is fixed by vacuum negative pressure. The second rotating shaft (11) is hollow inside. A vacuum hole (12) is opened above the detection plate (5). The vacuum device (13) is connected to the vacuum hole (12) through the air extraction pipe (14) located inside the second rotating shaft (11).

3. The wafer inspection stage according to claim 2, characterized in that, A handle (4) is fixedly installed on the hand crank (3).

4. The wafer inspection stage according to claim 1, characterized in that, The bottom box (1) is fixedly provided with a scale (2) indicating the angle, and the scale (2) is located on the outer periphery of the detection plate (5).

5. A wafer inspection method, employing the wafer inspection stage according to any one of claims 1-4, characterized in that, Includes the following steps: S1. First, place the bottom box (1) stably on the testing platform. S2. Using the alignment mechanism, the wafer to be inspected is aligned and placed on the detection disk (5), and the fixing mechanism is used to fix the wafer to be inspected on the detection disk (5). S3. The mobile testing device measures the width data of one edge of the wafer to be tested, and then the second edge width is measured by rotating the testing disk (5). After measuring multiple edge width data, the measurement is completed. Step S2 includes: S21. Place the wafer to be inspected on the detection disk (5) with its larger side facing the alignment block (6) and push the wafer to be inspected so that its larger side is aligned and in contact with the alignment block (6). S22. Turn on the vacuum pump (13) so that the wafer to be inspected is sucked and fixed on the inspection plate (5) by the negative pressure at the vacuum hole (12).

6. The wafer inspection method according to claim 5, characterized in that, Step S3 includes: S31. The mobile inspection equipment measures the width data of one edge of the wafer under inspection. S32. By rotating the hand-cranked turntable (3), the detection disc (5) and the wafer to be inspected are rotated to perform a second edge width measurement. S33. Repeat S32 to measure multiple side width measurements and complete the measurement.

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