Stress reduction mechanism and method of using the same

Abstract

The present application provides a stress reduction mechanism and a method for using the same, which belongs to the technical field of eliminating film stress. The stress reduction mechanism includes an unwinding device, a main cold roller, and a winding device sequentially arranged along the conveying path of the flexible film. A vapor deposition device is arranged between the unwinding device and the main cold roller, which is used to heat and coat the flexible film; a plasma device is arranged between the main cold roller and the winding device, which is used to provide plasma to bombard the flexible film. The mechanism can not only coat the film, but also eliminate the stress generated during the coating process, thereby avoiding deformation, wrinkling, and the like of the film after coating.

Description

Technical Field

[0001] The present application relates to the technical field of eliminating film stress, and in particular to a stress reduction mechanism and a method for using the same. Background Art

[0002] In the prior art, there is a conductive film including an insulating base film and a conductive layer disposed on the insulating base film, which is a conductive film obtained by repeatedly evaporating or magnetron sputtering a metal layer on the base film. The evaporation coating or magnetron sputtering coating process is used on the surface of the base film, and the film needs to be unwound, rolled, etc., which will cause a large stress inside the film. If it is not eliminated in time, it will affect the coating effect and then reduce the performance of the conductive film. Summary of the invention

[0003] The purpose of the present application is to provide a stress reduction mechanism and a method of using the same, which can not only perform coating but also eliminate the stress generated during the coating process, thereby avoiding deformation, wrinkling, etc. of the film after coating.

[0004] In a first aspect, the present application provides a stress reduction mechanism for coating a flexible film and reducing the stress of the flexible film. The stress reduction mechanism includes an unwinding device, a main cold roller, and a winding device sequentially arranged along a conveying path of the flexible film. A vapor deposition device is arranged between the unwinding device and the main cold roller, for heating and coating the flexible film; a plasma device is arranged between the main cold roller and the winding device, for providing plasma to bombard the flexible film.

[0005] In the prior art, since the thickness of the coating is limited each time the flexible film is evaporated, in order to ensure the conductivity of the conductive film, it is necessary to increase the thickness of the coating by multiple evaporation, which will increase the stress of the flexible film, thereby causing deformation, wrinkling and other problems of the flexible film. In the present application, when the flexible film needs to be coated, a metal source can be provided in the evaporation device to form a coating on the surface of the flexible film; after one or more coatings, the metal source can be omitted from the evaporation device, and the flexible film can be directly baked by the evaporation device, and then the baked flexible film can be cooled by the main cold roller. By baking first and then cooling, the atoms of the baked coating can be thermally migrated, the coating is more dense and easy to shape, the flexible film is smoother, and the flexible film will not be deformed due to baking, and the stress inside the film can be eliminated. At the same time, the flexible film is bombarded by a plasma device to remove impurities on the surface of the coating and make the coating denser, thereby releasing and eliminating the stress inside the film.

[0006] In a possible embodiment, a first passing roller and a first curved roller for flattening the flexible film are also arranged between the unwinding device and the main cold roller, the first curved roller and the first passing roller are configured so that the flexible film passing through the first passing roller and the first curved roller is in a horizontal state, and the evaporation device is arranged between the first passing roller and the first curved roller.

[0007] The setting of the first arc roller can flatten the flexible film, and the flexible film on the evaporation device is in a horizontal state, which can make the coating of the flexible film more uniform and the baking effect better, and avoid local deformation of the flexible film caused by uneven heating.

[0008] In a possible implementation, the plasma device includes two plasma sources, and the two plasma sources are respectively arranged on two sides of the flexible film.

[0009] Plasma bombardment of both surfaces of the flexible film can provide a better stress relief effect within the film.

[0010] In a possible embodiment, a second roller close to the main cold roller and an auxiliary roller close to the winding device are also arranged between the winding device and the main cold roller. The auxiliary roller and the second roller are configured so that the flexible film passing through the second roller and the auxiliary roller is in a vertical state, and two plasma sources are respectively used to be arranged on both sides of the flexible film in the vertical state.

[0011] When plasma bombards the flexible film, the flexible film will shake. The flexible film bombarded by plasma is in a vertical state, which can prevent the flexible film from sagging during the bombardment process, and the stress elimination effect is better, and the coating is denser, so that the conductivity of the conductive film is also better. In addition, a certain amount of heat will be generated during the plasma bombardment process. The flexible film can be cooled secondary through the subsequent attached rollers, and the tension of the flexible film can be detected by the attached rollers to adjust the tension, so as to achieve a better stress elimination effect for the flexible film.

[0012] In a second aspect, the present application provides a method for using a stress reduction mechanism, the stress reduction mechanism comprising: an unwinding device, a main cold roller and a winding device sequentially arranged along the conveying path of the flexible film; and a vapor deposition device is arranged between the unwinding device and the main cold roller. The method of use comprises: sequentially arranging the flexible film on the unwinding device, the main cold roller and the winding device along the conveying path of the flexible film. When the flexible film is coated, the vapor deposition device is turned on and a metal source is provided, the film is unwound on the unwinding device, the flexible film is passed over the evaporation device for coating and a coating layer is formed on the flexible film, and then the flexible film covers part of the main cold roller so that the main cold roller cools the coating layer. When the stress of the flexible film is reduced, the vapor deposition device is turned on and no metal source is provided, the film is unwound on the unwinding device, the flexible film is passed over the evaporation device for heating and the flexible film is baked, and then the flexible film covers part of the main cold roller so that the main cold roller cools the flexible film.

[0013] When the flexible film needs to be coated, a metal source can be provided in the evaporation device to form a coating on the surface of the flexible film. After one or more coating operations, the metal source can be omitted from the evaporation device, and the flexible film can be directly baked by the evaporation device. The baked flexible film is then cooled by the main cold roller. By baking first and then cooling, the atoms of the baked coating can be thermally migrated, the coating becomes denser and easier to shape, the flexible film becomes smoother, and the flexible film will not be deformed due to baking, thereby eliminating the stress inside the film.

[0014] In a possible embodiment, a plasma device is arranged between the main cold roller and the winding device, and the method of use also includes: when the stress of the flexible film is reduced, the plasma device is turned on, and the flexible film after being cooled by the main cold roller continues to pass through the turned-on plasma device, so that the plasma device provides plasma to bombard the flexible film.

[0015] Bombarding the flexible film with a plasma device can remove impurities on the surface of the coating and make the coating denser, thereby releasing and eliminating stress inside the film.

[0016] In a possible implementation, when stress reduction is performed on the flexible film, the power of the plasma device is 2-4 kW. Film bombardment at this power can make the coating more compact and can better eliminate surface impurities, thereby eliminating and releasing stress inside the flexible film.

[0017] In a possible implementation, when stress reduction is performed on the flexible film, the baking temperature of the evaporation device is 60 to 90°C, and the cooling temperature of the main cold roller is -25 to 25°C. Limiting the baking temperature to this range can cause the thermal migration of the coating atoms on the flexible film, thereby making the coating denser, avoiding deformation of the coating, and achieving the effect of eliminating stress. The cooling temperature of the main cold roller is coordinated with the previous baking temperature to ensure that the performance of the film will not be affected by baking deformation, and can achieve a good effect of eliminating stress.

[0018] In a possible implementation, the tension of the flexible film during coating is greater than the tension of the flexible film during stress reduction. A greater tension during coating can make the coating more uniform and achieve a better coating effect; since the tension during coating is greater, the stress of the flexible film can be gradually accumulated, and a smaller tension during stress reduction can reduce the stress of the flexible film.

[0019] In a possible implementation, when stress reduction is performed on the flexible film, the tension of the flexible film unwinding is greater than the tension of the flexible film winding. By defining the tension as above, the stress reduction effect of the flexible film can be better. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, without paying any creative work, other related drawings can be obtained based on these drawings and they also belong to the protection scope of the present application.

[0021] Figure 1 A schematic diagram of the structure of the stress reduction mechanism provided in an embodiment of the present application.

[0022] Icons: 200-flexible film; 110-unwinding device; 120-third roller; 130-second curved roller; 140-first roller; 150-first curved roller; 160-main cold roller; 170-second roller; 180-auxiliary roller; 190-fourth roller; 210-fifth roller; 220-winding device; 230-evaporation device; 231-evaporation device; 240-plasma device; 241-plasma source; 232-wire feeding device; 2321-wire feeding drive shaft; 2322-wire reel; 2323-wire. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0024] The present application provides a stress reduction mechanism, which can not only coat the flexible film but also reduce the stress of the flexible film, so as to achieve a better coating effect of the flexible film and avoid wrinkles and deformation during the coating process. It should be noted that the flexible film here does not refer to an unchanging film structure. Before coating, the flexible film can be a polymer base film; after coating, the flexible film can be the sum of the polymer base film and the coating, and the thickness of the coating will also change according to the number of evaporation times.

[0025] Figure 1 This is a schematic diagram of the structure of the stress reduction mechanism provided in the embodiment of the present application. Figure 1 The stress reduction mechanism includes an unwinding device 110, a main cold roller 160 and a winding device 220 which are sequentially arranged along the conveying path of the flexible film 200. A vapor deposition device 230 is arranged between the unwinding device 110 and the main cold roller 160 for heating and coating the flexible film 200; a plasma device 240 is arranged between the main cold roller 160 and the winding device 220 for providing plasma to bombard the flexible film 200.

[0026] When the stress relief mechanism is needed, the flexible film 200 is first placed on the unwinding device 110, the main cold roller 160 and the winding device 220 in sequence along the conveying path of the flexible film 200. At this time, the evaporation device 230 is located between the unwinding device 110 and the main cold roller 160, and the evaporation device 230 is located on one side of the installed flexible film 200, so that the evaporation device 230 can act on the flexible film 200; the plasma device 240 is located between the main cold roller 160 and the winding device 220, and the plasma device 240 is located on one side or both sides of the installed flexible film 200, so that the plasma device 240 can act on the flexible film 200.

[0027] When the flexible film 200 is plated, it is unrolled on the unwinding device 110, and the flexible film 200 is plated over the evaporation device 230 to form a coating on the flexible film 200 (the evaporation device 230 provides a metal source during the coating), and then the flexible film 200 covers a portion of the main cold roller 160 so that the main cold roller 160 cools the coating. When the flexible film 200 is plated, the stress of the flexible film 200 is accumulated, so that the flexible film 200 generates a large internal stress after being plated multiple times, and the problem of wrinkling and deformation will occur if the coating is continued.

[0028] Therefore, after coating once or multiple times, the flexible film 200 is subjected to a stress reduction or even elimination process. The method may be: unwinding the flexible film 200 on the unwinding device 110, allowing the flexible film 200 to pass over the evaporation device 230 for heating to bake the flexible film 200 (the evaporation device 230 does not provide a metal source during baking), then the flexible film 200 covers a portion of the main cold roller 160 so that the main cold roller 160 cools the flexible film 200, and then the flexible film 200 passes through the plasma device 240 so that the plasma provided by the plasma device 240 bombards the flexible film 200.

[0029] By baking first and then cooling, the atoms of the baked coating can be thermally migrated, the coating is denser, the flexible film 200 is smoother, and the flexible film 200 will not be deformed due to baking, and the stress inside the film can be eliminated. At the same time, the flexible film 200 is bombarded by the plasma device 240 to remove impurities on the surface of the coating and make the coating denser, thereby releasing and eliminating the stress inside the film.

[0030] It should be noted that: generally speaking, the stress of the polymer base film is relatively small before coating, and no stress relief is required. Of course, if stress relief is desired before coating, it is also possible, and this application does not limit this.

[0031] In the present application, in order to control whether the evaporation device 230 provides a metal source, the evaporation device 230 includes an evaporation device 231 and a wire feeding device 232. The wire feeding device 232 includes a metal wire reel 2322 and a wire feeding drive shaft 2321. The metal wire 2323 on the metal wire reel 2322 is transmitted to the evaporation device 231 through the wire feeding drive shaft 2321. If it is necessary to provide a metal source to the evaporation device 230, the wire feeding drive shaft 2321 will work to transport the metal wire 2323 to the evaporation device 231; if it is not necessary to provide a metal source to the evaporation device 230, the wire feeding drive shaft 2321 will not work, and the evaporation device 231 will only have the effect of heating and baking.

[0032] In the present application, along the conveying path of the flexible film 200, the third roller 120, the second curved roller 130, the first roller 140 and the first curved roller 150 are sequentially arranged between the unwinding device 110 and the main cold roller 160, and the flexible film 200 is sequentially arranged on the unwinding device 110, the third roller 120, the second curved roller 130, the first roller 140, the first curved roller 150, the main cold roller 160 and the winding device 220. The first curved roller 150 and the second curved roller 130 are used to flatten the flexible film 200. When the flexible film 200 passes through the first roller 140 and the first curved roller 150, the flexible film 200 located between the first roller 140 and the first curved roller 150 is in a horizontal state. The evaporation device 231 is arranged below the flexible film 200 in a horizontal state, so that the coating of the flexible film 200 can be more uniform, the baking effect is better, and the local deformation of the flexible film 200 caused by uneven heating can be avoided.

[0033] Optionally, when the stress reduction process is performed on the flexible film 200, the baking temperature is 60-90°C, and the cooling temperature of the main cold roller 160 is -25-25°C. This can achieve a better stress reduction effect on the flexible film 200, and even eliminate most of the stress in the flexible film 200.

[0034] Exemplarily, the baking temperature is 60°C, 65°C, 70°C, 75°C, 80°C, 85°C or 90°C; the cooling temperature of the main cold roller 160 is -25°C, -20°C, -15°C, -10°C, -5°C, 0°C, 5°C, 10°C, 15°C, 20°C or 25°C.

[0035] Optionally, the plasma device 240 includes two plasma sources 241, and the two plasma sources 241 are respectively arranged on both sides of the flexible film 200. Plasma bombardment of both surfaces of the flexible film 200 can achieve a better stress elimination effect in the film. Furthermore, if both surfaces of the flexible film 200 are evaporated to form a coating, when both sides of the flexible film 200 are bombarded, the coating formed on both surfaces of the polymer base film can be denser, and the coating effect is better.

[0036] In the present application, along the conveying path of the flexible film 200, the second roller 170, the auxiliary roller 180, the fourth roller 190 and the fifth roller 210 are sequentially arranged between the main cold roller 160 and the winding device 220, and the flexible film 200 is sequentially arranged on the main cold roller 160, the second roller 170, the auxiliary roller 180, the fourth roller 190, the fifth roller 210 and the winding device 220.

[0037] When the flexible film 200 passes through the second roller 170 and the auxiliary roller 180, the flexible film 200 between the second roller 170 and the auxiliary roller 180 is in a vertical state, and two plasma sources 241 are respectively arranged on both sides of the flexible film 200 in a vertical state. The inventors have found that when the plasma bombards the flexible film 200, the flexible film 200 will shake, and if the flexible film 200 is in a horizontal state, the flexible film 200 will sag. If the flexible film 200 bombarded by plasma is in a vertical state, the flexible film 200 can be prevented from sagging during the bombardment process, and the plasma bombardment on both sides of the flexible film 200 is more uniform, the stress elimination effect is better, and the coating is denser, so that the conductivity of the conductive film is also better. A certain amount of heat is generated during the plasma bombardment, and the flexible film 200 can be cooled secondary by the subsequent auxiliary roller 180 . The tension of the flexible film 200 can also be detected by the auxiliary roller 180 so as to adjust the tension, thereby achieving a better stress elimination effect of the flexible film 200 .

[0038] It should be noted that, generally, when the flexible film 200 is coated, the plasma device 240 at the rear end of the main cold roller 160 is not turned on. The reason is that during evaporation coating, the film surface temperature usually reaches above 100°C (while the temperature can be controlled at 60-90°C during baking). If plasma bombardment is performed after the coating and after passing through the main cold roller 160, the elongation at break of the flexible film 200 may be very low, and the problem of tape breakage may occur easily. However, if the cooling effect of the main cold roller 160 is very good, the film surface temperature of the flexible film 200 after passing through the main cold roller 160 can be very low, and plasma bombardment can also be performed, and the stress of the flexible film 200 can be reduced during the coating process.

[0039] Optionally, the main cold roller 160 is a cooling roller with a hollow cylindrical structure, and a through hole is provided at the center of both end surfaces of the cooling roller, and the coolant enters the cooling roller from the through hole, and the coolant can be circulated to achieve a cooling effect. Optionally, the temperature of the coolant is -25 to 25°C, which can make the cooling effect of the film surface better. For example: by cooling the coated flexible film 200 through the above-mentioned main cold roller 160, the film surface temperature of the flexible film 200 can be less than 30°C, and then by plasma bombarding the film surface coating, the coating is made denser and the internal stress of the flexible film 200 is reduced.

[0040] In the present application, when stress reduction is performed on the flexible film 200, the power of the plasma device 240 is 2-4 kW. When the flexible film 200 is bombarded with the plasma device 240, the power of the plasma device 240 is 2-4 kW. As an example, the power of the plasma device 240 is 2 kW, 2.5 kW, 3 kW, 3.5 kW or 4 kW.

[0041] Optionally, the tension of the flexible film 200 during coating is greater than the tension of the flexible film 200 during stress reduction. For example, when the flexible film 200 is coated, the tension of the flexible film 200 is 300-400N. By way of example, the tension of the flexible film 200 during coating is 300N, 320N, 340N, 360N, 380N or 400N. When the flexible film 200 is subjected to stress reduction, the tension of the flexible film 200 is 50-250N. By way of example, the tension of the flexible film 200 during stress reduction is 50N, 100N, 150N, 200N or 250N. The above tension can be detected by the attached roller 180.

[0042] Further, when the stress reduction of the flexible film 200 is performed, the tension of the unwinding of the flexible film 200 is greater than the tension of the winding of the flexible film 200. For example: the tension of the unwinding of the flexible film 200 is 100-250N, and the tension of the winding of the flexible film 200 is 50-150N. As an example, the tension of the unwinding of the flexible film 200 is 100-250N, and the tension of the winding of the flexible film 200 is 50-150N. The tension of the unwinding of the flexible film 200 is 100N, and the tension of the winding of the flexible film 200 is 5N; the tension of the unwinding of the flexible film 200 is 250N, and the tension of the winding of the flexible film 200 is 150N; the tension of the unwinding of the flexible film 200 is 150N, and the tension of the winding of the flexible film 200 is 80N; the tension of the unwinding of the flexible film 200 is 200N, and the tension of the winding of the flexible film 200 is 120N.

[0043] It should be noted that the unwinding and rewinding of the flexible film 200 are performed by the unwinding device 110 and the rewinding device 220, which can not only flatten the running belt of the flexible film 200, but also perform the offset correction function on the flexible film 200, and can reduce or even eliminate the stress inside the flexible film 200.

[0044] The method of using the stress reduction mechanism provided in the embodiment of the present application is as follows:

[0045] S10, along the conveying path of the flexible film 200, the polymer base film is sequentially arranged on the unwinding device 110, the third roller 120, the second curved roller 130, the first roller 140, the first curved roller 150, the main cold roller 160, the second roller 170, the auxiliary roller 180, the fourth roller 190, the fifth roller 210 and the winding device 220. At this time, the polymer base film arranged between the first roller 140 and the first curved roller 150 is located above the evaporation device 231, and the polymer base film here is in a horizontal state; the polymer base film located between the second roller 170 and the auxiliary roller 180 is located between the two plasma sources 241, and the polymer base film here is in a vertical state.

[0046] S20, the flexible film 200 is then coated multiple times, specifically in the following manner: the wire 2323 on the wire disc 2322 is transported to the evaporation device 231 by using the wire feeding transmission shaft 2321, the metal atoms generated by heating the wire 2323 are evaporated on the surface of the polymer base film by using the evaporation device 231, and then cooled by the main cold roller 160 to form a coating. This is repeated multiple times, and when coating multiple times, the front and back sides of the polymer base film can be coated multiple times, or the same surface of the polymer base film can be coated multiple times.

[0047] Optionally, when performing step S20 , the tension of the flexible film 200 is 300-400N.

[0048] S30. Reduce and eliminate stress on the flexible film 200 (including the polymer base film and the coating on the polymer base film). The specific method is as follows: the wire feeding drive shaft 2321 does not work, and the metal wire 2323 is not transported. The evaporation device 231 only generates heat to bake the flexible film 200, and then the main cold roller 160 is used to cool the baked flexible film 200. The flexible film 200 is then bombarded with plasma provided by the plasma source 241, so that the coating can be made denser and the stress of the flexible film 200 can be reduced or even eliminated, thereby avoiding deformation or wrinkling of the flexible film 200 after coating.

[0049] Optionally, when performing step S30, the baking temperature of the evaporation device 231 is 60 to 90°C, the cooling temperature of the main cold roller 160 is -25 to 25°C, the power of the plasma source 241 is 2 to 4kW, the tension of the unwinding of the flexible film 200 is 100 to 250N, and the tension of the winding of the flexible film 200 is 50 to 150N.

[0050] (4) Perform coating again in the manner of step S20 and perform stress reduction and elimination in the manner of step S30 until the coating thickness reaches the target value.

[0051] Example

[0052] The stress reduction mechanism is used as follows:

[0053] (1) Along the conveying path of the flexible film 200, a PET film with a thickness of 10 μm is sequentially placed on the unwinding device 110, the third roller 120, the second curved roller 130, the first roller 140, the first curved roller 150, the main cold roller 160, the second roller 170, the auxiliary roller 180, the fourth roller 190, the fifth roller 210 and the winding device 220. At this time, the polymer base film placed between the first roller 140 and the first curved roller 150 is located above the evaporation device 231, and the PET film here is in a horizontal state; the PET film located between the second roller 170 and the auxiliary roller 180 is located between the two plasma sources 241, and the PET film here is in a vertical state.

[0054] (2) The PET film is then coated multiple times, specifically in the following manner: the aluminum wire on the aluminum wire reel is transported to the evaporation device 231 by using the wire feeding transmission shaft 2321, the aluminum atoms generated by heating the aluminum wire are evaporated on the surface of the PET film by using the evaporation device 231, and then cooled by the main cold roller 160 to form a coating. This process is repeated 10 times in total, of which 5 times of coating are on the front side of the PET film and 5 times of coating are on the back side of the PET film.

[0055] (3) The stress of the flexible film 200 is reduced and eliminated in the following specific manner: the wire feeding drive shaft 2321 does not work and the aluminum wire is not transported. The evaporation device 231 only generates heat to bake the flexible film 200. The main cold roller 160 is then used to cool the baked flexible film 200. The flexible film 200 is then bombarded with plasma provided by the plasma source 241.

[0056] (4) Perform coating again in the manner of step (2) and perform stress reduction and elimination in the manner of step (3) until the coating thickness reaches the target value, thereby obtaining a conductive film.

[0057] The Shore hardness of the original PET film and the Shore hardness of the conductive film after the above three steps were tested as shown in Table 1, and the wrinkling and deformation were observed; and the conductive film was prepared by different methods, and the density of the conductive film was tested as shown in Table 1.

[0058] The Shore hardness test standard is as follows: (1) On a stable film roll placement platform, use a handheld hardness tester to measure the hardness of the left, middle and right positions along the TD direction of the film roll at a distance of 15 cm from the edge of the film roll and record the results; (2) Complete the test according to step (1) before and after stress release, and compare the hardness values ​​of the film roll.

[0059] The wrinkle grading standard is as follows: take a sample of 1 m2 from the roll and lay it flat on the inspection platform. The fluorescent lamp must be placed directly above the material and the distance must be controlled at 80±20 cm. The person should be 45 cm away from the sample and inspect the film surface at multiple angles such as 90° and 45°. (1) Slight wrinkles, length ≤20 cm, number ≤3, wrinkles can be flattened with a tension of 50 N, defined as Grade A; (2) Severe wrinkles, length >20 cm, length ≤40 cm, number >3, number ≤15, wrinkles can be flattened with a tension of 50 N, defined as Grade B; (3) Severe wrinkles, length >40 cm, number >15, wrinkles cannot be flattened with a tension of 50 N, defined as Grade C.

[0060] Table 1 Preparation method and properties of conductive films

[0061]

[0062]

[0063] As can be seen from Table 1, after multiple coatings, the flexible film is baked using an evaporation device and then cooled using a main cold roller, which can reduce the Shore hardness of the flexible film and reduce the stress of the flexible film.

[0064] Further plasma bombardment is performed, and the tension of the unwinding and winding of the flexible film is controlled within a suitable range, so that the stress elimination effect of the flexible film can be better and the coating effect can be better.

[0065] The above is only a part of the embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A stress reduction mechanism for coating a flexible film and reducing the stress of the flexible film, characterized in that: The stress reduction mechanism comprises: An unwinding device, a main cold roller and a winding device are sequentially arranged along the conveying path of the flexible film; a vapor deposition device is arranged between the unwinding device and the main cold roller, for heating and coating the flexible film; the vapor deposition device includes an evaporation device and a wire feeding device, and the wire feeding device includes a metal wire disc and a wire feeding transmission shaft; a plasma device is arranged between the main cold roller and the winding device, for providing plasma to bombard the flexible film; The plasma device comprises two plasma sources; the two plasma sources are respectively arranged on two sides of the flexible film in a vertical state to bombard two surfaces of the flexible film in a vertical state respectively.

2. The stress reduction mechanism according to claim 1, characterized in that: A first passing roller and a first curved roller for flattening the flexible film are also arranged between the unwinding device and the main cold roller. The first curved roller and the first passing roller are configured so that the flexible film passing through the first passing roller and the first curved roller is in a horizontal state. The evaporation device is arranged between the first passing roller and the first curved roller.

3. The stress reduction mechanism according to claim 1, characterized in that: A second roller close to the main cold roller and an auxiliary roller close to the winding device are also provided between the winding device and the main cold roller, and the auxiliary roller and the second roller are configured so that the flexible film passing through the second roller and the auxiliary roller is in a vertical state; A fourth roller and a fifth roller are further arranged between the winding device and the auxiliary roller, and the fourth roller and the fifth roller are used to convey the flexible film passing through the auxiliary roller to the winding device.

4. A method for using a stress reduction mechanism, characterized in that: The stress reduction mechanism applied to any one of claims 1 to 3 above, the stress reduction mechanism comprising: an unwinding device, a main cold roller and a winding device sequentially arranged along the conveying path of the flexible film, the evaporation device comprising an evaporation device and a wire feeding device, the wire feeding device comprising a metal wire reel and a wire feeding transmission shaft; an evaporation device is arranged between the unwinding device and the main cold roller; the use method comprises: sequentially placing the flexible film on the unwinding device, the main cold roller and the winding device along the conveying path of the flexible film; When the flexible film is plated, the evaporation device is turned on and a metal source is provided, and the film is unrolled on the unwinding device, so that the flexible film passes over the evaporation device for plated and a plated layer is formed on the flexible film, and then the flexible film covers a portion of the main cold roller so that the main cold roller cools the plated layer; When stress reduction is performed on the flexible film, the evaporation device is turned on without providing a metal source, the flexible film is unwound on the unwinding device, the flexible film is heated and baked by passing over the evaporation device, and then the flexible film covers a portion of the main cold roller so that the main cold roller cools the flexible film; A plasma device is arranged between the main cold roller and the winding device, and the use method further comprises: When stress reduction is performed on the flexible film, the plasma device is turned on, and the flexible film cooled by the main cold roller continues to pass through the turned-on plasma device, so that the plasma device provides plasma to bombard the flexible film.

5. The method of use according to claim 4, characterized in that: When the flexible film is subjected to stress reduction, the power of the plasma device is 2-4 kW.

6. The method of use according to any one of claims 4 to 5, characterized in that: When stress reduction is performed on the flexible film, the baking temperature of the evaporation device is 60 to 90°C; and the cooling temperature of the main cold roller is -25 to 25°C.

7. The method of use according to any one of claims 4 to 5, characterized in that: The tension of the flexible film during the coating process is greater than the tension of the flexible film during the stress reduction process.

8. The method of use according to claim 7, characterized in that: When the stress reduction is performed on the flexible film, the tension of the unwinding of the flexible film is greater than the tension of the winding of the flexible film.

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