Automatic imprinting equipment for microlens arrays

Abstract

The present invention discloses an automatic imprinting device for a microlens array, comprising multiple workstations, a stacking component that circulates between the workstations, and a moving stage that drives multiple support stages to switch between the workstations. The stacking component includes a wafer carrier for placing substrates, an imprinting mold with a lens microstructure layer, and a spacer between the wafer carrier and the imprinting mold. The multiple workstations include at least a loading and unloading station, a gap measurement station, an imprinting station, and a curing station. This application addresses the shortcomings of the "single-station manual allocation imprinting process" by enabling automatic wafer imprinting and forming, reducing the need for manual intervention and increasing the yield of microlens wafer substrates.

Description

Technical Field

[0001] The present application relates to the technical field of optical and optoelectronic manufacturing, and in particular to an automatic imprinting device for batch manufacturing of microlens arrays. Background Art

[0002] WLO wafer-level optical devices are a wafer-level lens manufacturing technology and process. Unlike the processing technology of traditional optical devices, this method uses semiconductor technology to batch replicate and process lenses on a whole glass substrate, press multiple lens wafers together and then cut them into single lenses. It has the advantages of small size, high consistency and high precision, and is widely used in automotive electronics and consumer electronics.

[0003] The existing wafer-level optical device manufacturing process requires ultraviolet light to imprint and cure the polymer to replicate the designed lens structure from the mold onto the substrate. The entire process requires eight steps, some of which must be completed manually. This process has the following problems:

[0004] 1 All process steps require operator intervention, such as loading the imprint mold, loading the substrate, dispensing the polymer, and aligning the imprint position;

[0005] 2. Manual distribution of polymers, low stability and accuracy;

[0006] 3. All steps are completed at the same workstation, which is inconvenient for wafer removal and has low production efficiency. Summary of the Invention

[0007] The purpose of this application is to solve the problem of insufficient "single-station manual allocation imprint process" and provide an automatic imprinting device that can realize automatic imprinting and molding of wafers, reduce the degree of manual intervention, and achieve higher output.

[0008] To achieve the above objectives, this application adopts the following technical solutions:

[0009] An automatic imprinting device for a microlens array comprises a plurality of workstations, a stacking component that circulates between the workstations, a moving stage that drives the stacking component to switch between the workstations, and an automatic control system. The stacking component comprises: a wafer carrier for placing a substrate, an imprinting mold with a lens microstructure layer, and a spacer located between the wafer carrier and the imprinting mold. The plurality of workstations comprises at least:

[0010] A loading and unloading station, used for stacking substrates to form the stacked components, identifying the identity information of the substrates and the imprinting mold, and taking out the imprinted substrates;

[0011] a gap measurement station, comprising a gap measurement device for measuring the gap between the substrate and the imprinting mold so as to calculate the amount of polymer required to fill the gap;

[0012] An imprinting station, comprising a dispensing arm capable of extending between the substrate and the imprinting mold, the imprinting station being used for automatically filling the polymer and imprinting the polymer;

[0013] The curing station is used to cure the polymer by ultraviolet light.

[0014] In one embodiment of the present application, the plurality of workstations are distributed on the same circle, the movable platform has a rotation axis extending along the Z-axis, the axis is perpendicular to the plane of the circle and passes through the center of the circle, a plurality of lower chucks for fixing the stacking components are installed on the movable platform, and a plurality of Z-axis lifting mechanisms corresponding to each of the workstations are arranged below the movable platform, and each of the Z-axis lifting mechanisms is used to drive the lower chuck and the stacking component to rise and fall along the Z-axis relative to the movable platform.

[0015] In one embodiment of the present application, the gap measurement station, the imprinting station and the curing station each have an upper chuck, each upper chuck is located directly above the movable platform, and each upper chuck is connected to the airflow of the vacuum adsorption system to adsorb and fix the imprinting mold.

[0016] In one embodiment of the present application, the loading and unloading station includes an image recognition device, which is used to recognize the identity codes of the substrate and the imprinting mold, and display and magnify the alignment marks of the substrate and the imprinting mold.

[0017] In one embodiment of the present application, the gap measuring device is an optical interference measuring device.

[0018] In one embodiment of the present application, the imprint station is configured as follows: during dispensing, the imprint mold is adsorbed on the upper chuck of the imprint station, and the wafer carrier, substrate and spacer are located on the Z-axis lifting mechanism.

[0019] In one embodiment of the present application, the upper chuck of the curing station is movable on a plane perpendicular to the Z-axis, the imprinting mold is fixed by the upper chuck of the curing station, the curing station includes an image acquisition device for detecting the alignment marks on the substrate and the imprinting mold, and the automatic control system is configured to: move the upper chuck based on the distance between the two alignment marks to align the imprinting mold with the alignment marks on the substrate.

[0020] In one embodiment of the present application, an observation hole opposite to the alignment mark is provided on the movable platform, and the image acquisition device is located below the observation hole.

[0021] In one embodiment of the present application, the automatic control system is configured as follows: at the loading and unloading station, the substrate and the imprinting mold are identified, and then the stacked component is transferred to the gap measurement station; at the gap measurement station, the required amount of polymer is calculated based on the feedback data of the gap measurement device, and then the stacked component is transferred to the imprinting station; at the imprinting station, the wafer carrier, substrate and spacer are separated from the imprinting mold, and the dispensing arm is extended between the substrate and the imprinting mold for dispensing, and then the polymer imprinting is completed, and then the stacked component is transferred to the curing station; at the curing station, the substrate is aligned with the imprinting mold, and then ultraviolet irradiation is performed for curing, and then the stacked component is transferred to the loading and unloading station.

[0022] Through the above technical solution, it is not difficult to see that this application eliminates manual intervention and confirmation steps in the optical device production process. By adopting different workstations, these workstations can work automatically and separately from each other, and the processed wafers circulate between multiple workstations, so that multiple wafers can be processed simultaneously, improving wafer production efficiency and output. Since operators only need to complete the loading and unloading steps, there is no need to deeply learn the imprinting process, which reduces the skill requirements of personnel and the probability of human error. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the planar layout of an automatic imprinting device provided in an embodiment of the present application.

[0024] Figure 2 A schematic structural diagram of a loading and unloading station provided in an embodiment of the present application.

[0025] Figure 3 A schematic structural diagram of a gap measurement station provided in an embodiment of the present application.

[0026] Figure 4 A schematic structural diagram of an imprinting station provided in an embodiment of the present application.

[0027] Figure 5 A schematic diagram of the movement of a chuck of a curing station provided in an embodiment of the present application.

[0028] Figure 6 A schematic diagram of a light curing station provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] In order to describe the technical content, structural features, achieved purposes and effects of the invention in detail, the technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. In the following description, for the purpose of explanation, many specific details are set forth to provide a detailed description of various exemplary embodiments or implementations of the invention. However, various exemplary embodiments may also be implemented without these specific details or in the presence of one or more equivalent arrangements. In addition, various exemplary embodiments may be different, but are not necessarily exclusive. For example, without departing from the inventive concept, the specific shape, structure and characteristics of the exemplary embodiment may be used or implemented in another exemplary embodiment.

[0030] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0031] Furthermore, in this application, spatially relative terms such as "under," "beneath," "under," "down," "above," "upper," "above," "higher," "side" (e.g., as in "sidewall"), etc., are used to describe the relationship of one element to another (other) element as shown in the accompanying drawings. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as "under" or "beneath" other elements or features would subsequently be positioned "above" the other elements or features. Thus, the exemplary term "under" can include both above and below orientations. Furthermore, the device can be otherwise positioned (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0032] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0033] As described in the background art, the applicant currently manufactures wafer-level optical devices in accordance with the following eight process steps:

[0034] 1. Manually load the transparent embossing mold with the microlens structure into the embossing machine;

[0035] 2. Place the substrate on the wafer carrier and perform manual pre-alignment, placing the chuck on the Z axis of the imprinter.

[0036] 3. Apply the correct amount of polymer to the substrate by manual puddle dispensing.

[0037] 4. Move the Z axis of the imprinter so that the substrate and the pre-installed imprint mold reach the predetermined distance.

[0038] 5. Align the substrate and the imprinting mold using the preset alignment marks on the imprinting mold and the substrate.

[0039] 6. Move the Z axis to make the substrate and the imprint mold reach the predetermined final distance. During the movement of the Z axis, the polymer will fill the space between the imprint mold and the substrate through capillaries, thereby filling the cavity on the imprint mold.

[0040] 7. Hardening the polymer by means of a UV light source mounted on or near the stamping machine, which can be directed through the stamping mold onto the UV-cured polymer for a predetermined time and intensity.

[0041] 8. Separate the imprint mold from the substrate and manually remove the substrate with the replicated microlens structure printed on it.

[0042] It can be seen that in the manufacturing process originally adopted by the applicant, multiple steps such as loading the imprint mold, substrate and dispensing glue need to be completed manually, the operation accuracy and efficiency are low, and all processing processes are carried out in one work position, so it can only be processed one piece at a time, and the loading and removal of the substrate are inconvenient, resulting in low output efficiency.

[0043] To this end, the present invention provides an automatic imprinting device for a micro lens array. Figure 1 The automatic stamping device includes: a plurality of workstations, a plurality of stacking components 500 that circulate and move between the plurality of workstations, a moving platform 600 that drives the stacking components 500 to transfer between the plurality of workstations, and an automatic control system.

[0044] The multiple workstations include at least: a feeding and unloading station 100, a gap measuring station 200, an imprinting station 300, and a curing station 400. The multiple workstations are distributed on the same circumference and fall within the projection of the moving stage 600 on the Z axis ( Figure 1The direction perpendicular to the page and outward is referred to as the "Z-axis" in this specification. The movable stage 600 has a rotational axis extending along the Z-axis, perpendicular to the plane of the multiple workstations and passing through the center of the circle. Multiple Z-axis lifting mechanisms (not shown) are located below the movable stage, corresponding to the multiple workstations. Each Z-axis lifting mechanism is capable of raising or lowering the lower chuck and stacking assembly along the Z-axis.

[0045] In order to improve processing efficiency and process multiple substrates at the same time, in one embodiment of the present application, a fixed lower chuck 12 can be configured for each workstation. The lower chuck 12 is mounted on the movable table 600 and changes the workstation as the movable table rotates. To facilitate replacement, the lower chuck 12 is preferably mounted on the movable table 600 in a detachable manner. The lower chuck 12 can be connected to the vacuum adsorption system of the imprinting equipment through a vacuum pipeline, thereby providing adsorption force for the stacking component 500 placed above the lower chuck 12. In addition, there is a fixed upper chuck at the measuring station, the imprinting station, and the curing station. The lower chuck is fixed and rotates with the movable table, while the upper chuck moves up and down in the fixed workstation and cannot rotate with the movable table. Each upper chuck is also connected to the vacuum adsorption system through a vacuum pipeline, so that the upper chuck can fix the imprinting mold by vacuum adsorption.

[0046] In this embodiment, the sizes of the upper chuck and the lower chuck are adapted to the size of the substrate 52 to be processed. The movable table adopts a rotatable disc-shaped structure, the size of which should exceed the size of the circumference of the multiple workstations, so that when the movable table rotates, the substrate to be processed can be rotated from one workstation to another. It should be noted that in other alternative embodiments, the arrangement of the multiple workstations or the shape of the movable table can also be set to other suitable shapes or sizes according to actual needs. It is only necessary to realize the unidirectional or bidirectional circulation of multiple stacked components 500 to be processed between the multiple workstations through the movement of the movable table. This does not limit the scope of protection of this application.

[0047] See also Figure 2, showing a schematic structural diagram of the feed and unload station provided in an embodiment of the present application. The feed and unload station 100 is used to stack substrates 52 and form a stacking component 500, identify the identity information (ID) of the substrate 52 and the imprinting mold 54, and take out the replicated substrate 52. The above-mentioned stacking component 500 is formed by manual stacking at the feed and unload station 100. The feed and unload station 100 is the only workstation in the automatic imprinting equipment of the present application that requires manual operation. The stacking component 500 includes a plurality of elements stacked together layer by layer, which are, from bottom to top: a wafer carrier 51 for placing the substrate 52, an imprinting mold 54 with a lens microstructure layer 541, and a spacer 53 located between the wafer carrier 51 and the imprinting mold 54. The substrate 52 to be processed is placed on the wafer carrier 51. A certain gap is maintained between the substrate 52 and the lens microstructure layer 541 through the support of the spacer 53. In the imprint station 300, a high molecular polymer is filled in the gap, and the imprint mold 54 is pressed downward. Finally, the polymer is cured by ultraviolet radiation in the curing station 400, thereby forming a microlens wafer substrate with several microlens structures on the substrate.

[0048] The loading and unloading station 100 includes an image recognition device, which includes a camera 11 and a display. To facilitate information management, one camera can identify the identification codes on the substrate and the stamping mold. To more accurately form the microlens structure, the substrate and stamping mold are also provided with alignment marks 521 and 542, respectively. Another camera 11 forms an auxiliary visual system to help the operator align the alignment marks on the substrate and stamping mold.

[0049] At the loading and unloading station 100, an operator "stacks" the materials needed for imprinting onto the lower chuck 12, which has an inspection port 121. The first step is to place the wafer carrier 51. The second step is to pre-align and place the substrate 52 onto the wafer carrier 51. At this point, the vacuum is activated to secure the wafer carrier 51 with the substrate 52 to the station's lower chuck 12. The third step is to place a spacer 53 on the wafer carrier 51. The fourth step is to pre-align the alignment marks 542 on the imprinting mold 54 with the alignment marks 521 on the substrate 52, and then place the imprinting mold 54 onto the spacer 53. This "stacking" of components is performed by the operator. With the help of an image recognition device, the alignment marks 521, 542 on the substrate 52 and the imprinting mold 54 are easily identified and accurately aligned. Therefore, the operator's actual work techniques are simpler than traditional methods, requiring less training time. The alignment accuracy requirements are lower, and precise adjustments are also made before subsequent curing. After the stacking component 500 is built, the rotary table 600 rotates 90 degrees and automatically transports the lower chuck 12 and the stacking component 500 to the next station.

[0050] Figure 3 The schematic diagram of the gap measurement station 200 provided in an embodiment of the present application is shown. The gap measurement station 200 includes an interferometric gap measurement device 21 for measuring the gap 55 between the substrate 52 and the imprint mold 54 to facilitate calculation of the amount of polymer required to fill the gap. When the stacking component 500 enters the gap measurement station 200, the corresponding Z-axis lifting mechanism of the station automatically raises the lower chuck 12 to the top of the gap measurement station. The imprint mold 54 of the stacking component 500 will contact the upper chuck 23, and then the vacuum is activated to fix it by vacuum adsorption. The substrate 52 and the wafer carrier 41 are supported on the lower chuck 12, thus fixing the stacking component 500. The distance between the substrate and the mold is determined by interferometry. Then, based on the size of the gap, the volume of polymer required to correctly fill the gap is calculated by software, usually in mL. After the gap measurement is completed, the vacuum on the upper chuck 23 is released, and the stacking component is lowered and unloaded. The movable table 600 then rotates and transports the lower chuck 12 and the stacking component 500 to the next station.

[0051] Figure 4 The schematic diagram of the imprint station 300 provided in an embodiment of the present application is shown. The imprint station 300 is used for automatically filling and imprinting polymers. The imprint station 300 is equipped with a dispensing arm 33 that can extend between the substrate 52 and the imprint mold 54. During dispensing, the imprint mold 54 is attached to the upper chuck 32, while the wafer carrier 51, substrate 52, and spacer 53 are located on the lower chuck 12.

[0052] When the stack 500 enters the imprint station, the station's corresponding Z-axis lift automatically rises to the top of the station. The upper chuck 32 secures the imprint mold 54 using vacuum. The Z-axis lift then moves downward, securing the imprint mold 54 to the upper chuck 32 while the wafer carrier, substrate, and spacer remain below. Second, the dispensing arm 33 extends between the substrate 52 and the imprint mold 54 and begins automatic glue dispensing. The amount of glue dispensed is calculated based on parameters fed back by the gap measurement device 21, enabling precise calculation and control of the amount of polymer 34 applied. Third, after dispensing is complete, the dispensing arm retracts outside the stack, and the Z-axis lift rises again at varying speeds until it is stopped by the spacer, completing the imprint. During the dispensing step, polymer 34 fills the gaps and structures between the substrate 52 and the imprint mold 54. Once imprinting is complete, the vacuum on the upper chuck 32 is released, and the entire stack 500 is unloaded by the lowering of the Z-axis lift. Subsequently, the moving table 600 rotates and transfers the lower chuck 12 and the stacked parts 500 to the curing station 400 .

[0053] Figure 5The figure shows a schematic diagram of the structure of the curing station 400 provided in an embodiment of the present application. The curing station is used to perform secondary alignment of the stacked components and complete UV curing. The curing station 400 is provided with a UV light source (not shown) and an image acquisition device 42. The upper chuck 43 of the curing station 400 can move on a plane perpendicular to the Z axis. The image acquisition device 42 is used to detect the distance and orientation between the alignment marks 521 and 542 on the substrate and the imprint mold, and feed back to the automatic control system. The automatic control system controls the movement of the upper chuck 43 in the XY plane, and adjusts the movement direction and distance of the upper chuck based on the distance and positional relationship between the two alignment marks, ultimately aligning the imprint mold with the alignment marks 542 and 521 on the substrate.

[0054] When the stack 500 enters the curing station, the station's Z-axis lift automatically rises to the top of the workstation, and the upper chuck 43 secures the imprint mold 54 using vacuum suction. The Z-axis lift then reaches a predetermined height. The image acquisition device 42 detects the alignment marks 521 and 542 on the substrate 52 and the imprint mold 54 (the alignment marks were pre-aligned when the stack was created at the loading and unloading station). The automatic control system determines the center difference between the two alignment marks and moves the upper chuck 43, which holds the imprint mold 54, to the alignment position, aligning the imprint mold 54 with the substrate 52. UV exposure then begins. Once UV exposure is complete, the vacuum on the upper chuck 43 is released, and the lower chuck 12 and the entire stack 500 are unloaded by lowering the Z-axis lift. Finally, the moving stage rotates, carrying the lower chuck 12 and the stack 500 to the next station, the loading and unloading station 100, where the operator can remove the newly replicated wafer substrate, completing the cycle.

[0055] Observation holes are provided in the loading and unloading station 100 and the curing station 400, respectively, facing the alignment marks. The image recognition device and the image acquisition device are both located below the observation holes. In this embodiment, the observation holes are larger than the alignment marks so that the image recognition device and the image acquisition device can simultaneously observe the alignment marks on both the substrate and the imprint mold through the observation holes.

[0056] As mentioned above, the automatic imprinting device of the present application has an automatic control system for controlling the various action execution components to act in a time sequence, so as to implement the following process steps:

[0057] 1. At the loading and unloading station 100, the wafer carrier 51, substrate 52, spacer 53, and imprint mold 54 are stacked one by one on the corresponding lower chuck 12 of the loading and unloading station 100. Image recognition is performed on the stacked components 500 manually stacked by the operator, and the identity information of the substrate 52 and the imprint mold 54 is read. The operator is assisted in performing preliminary alignment of the alignment marks 521 and 542 on the substrate 52 and the imprint mold 54. The stacked components 500 are then transferred to the gap measurement station 200.

[0058] 2. At the gap measurement station 200 , the gap between the substrate 52 and the imprint mold 54 is measured, and the required amount of polymer is calculated based on the feedback data of the gap measurement device. Then, the moving stage 600 rotates to bring the stacked component 500 to the imprint station 300;

[0059] 3. At the imprint station 300 , the wafer carrier 51 , substrate 52 , and spacer 53 are separated from the imprint mold 54 . The dispensing arm 33 is inserted between the substrate 52 and the imprint mold 54 to automatically dispense glue. The imprint mold 54 is then pressed against the surface of the polymer 34 to complete the polymer imprint. The stacked component 500 is then transferred to the curing station 400 .

[0060] 4. At the curing station 400, the substrate 52 is automatically aligned with the alignment marks on the imprint mold 54 using the image acquisition device 42 to achieve secondary precise alignment. UV curing is then performed, and the stacked components 500 are then transferred to the loading and unloading station 100.

[0061] 5. At the loading and unloading station 100, the operator takes out the wafer substrate after the imprinting is completed.

[0062] Through the above-mentioned production process, the automatic embossing equipment of this application has the following advantages:

[0063] 1. Almost eliminates all operator intervention and confirmation steps, avoiding error fluctuations caused by human operation;

[0064] 2. Through automatic dispensing, accurate and stable control of polymer dosage is achieved;

[0065] 3. By establishing different workstations, multiple workstations can be separated from each other and work independently and automatically, allowing multiple wafers to be processed simultaneously, thereby significantly increasing wafer production;

[0066] 4. Since operators only need to build stacked parts, they do not need to have a deep understanding and learning of the imprinting process and imprinting equipment, which reduces personnel requirements.

[0067] In this embodiment, the imprint mold, wafer stage, spacer, and microlens structure layer may adopt structures known in the prior art, and those skilled in the art may select them according to specific needs, which will not be described in detail herein.

[0068] The basic principles, main features and advantages of the present invention are shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims, the description and their equivalents.

Claims

1. An automatic imprinting device for a microlens array, characterized in that: The invention comprises a plurality of workstations, a stacking component that circulates between the plurality of workstations, a moving platform that drives the plurality of stacking components to switch between the plurality of workstations, and an automatic control system. The stacking component comprises: a wafer carrier for placing a substrate, an imprinting mold with a lens microstructure layer, and a spacer located between the wafer carrier and the imprinting mold. The plurality of workstations at least comprise: A loading and unloading station, used for stacking substrates to form the stacked components, identifying the identity information of the substrates and the imprinting mold, and taking out the imprinted substrates; a gap measurement station, comprising a gap measurement device for measuring the gap between the substrate and the imprinting mold so as to calculate the amount of polymer required to fill the gap; An imprint station, comprising a dispensing arm capable of extending between the substrate and the imprint mold, the imprint station being used to automatically fill the polymer and imprint the polymer, the dispensing arm determining a dispensing amount based on parameters fed back by the gap measuring device and automatically dispensing the polymer; a curing station for curing the polymer by ultraviolet light; The movable platform is provided with a plurality of lower chucks for fixing the stacked components. The gap measuring station, the stamping station and the curing station each have an upper chuck. The lower chucks drive the stacked components to be transferred as a whole between the plurality of workstations.

2. The automatic imprinting device for a microlens array according to claim 1, characterized in that: The multiple workstations are distributed on the same circumference, and the movable platform has a rotation axis extending along the Z-axis direction, which is perpendicular to the plane where the circumference is located and passes through the center of the circumference. A plurality of Z-axis lifting mechanisms corresponding to each of the workstations are arranged below the movable platform, and each of the Z-axis lifting mechanisms is used to drive the lower chuck and the stacking component to rise and fall along the Z-axis relative to the movable platform.

3. The automatic imprinting device for a microlens array according to claim 2, characterized in that: Each upper chuck is located directly above the moving platform, and each upper chuck is connected to the air flow of the vacuum adsorption system to adsorb and fix the imprinting mold.

4. The automatic imprinting device for a microlens array according to claim 3, characterized in that: The loading and unloading station includes an image recognition device, which is used to recognize the identity codes of the substrate and the imprinting mold, and display and amplify the alignment marks of the substrate and the imprinting mold.

5. The automatic imprinting device for a microlens array according to claim 3, characterized in that: The gap measuring device is an optical interference measuring device.

6. The automatic imprinting device for a microlens array according to claim 3, characterized in that: The imprint station is configured as follows: during dispensing, the imprint mold is adsorbed on the upper chuck of the imprint station, and the wafer carrier, substrate and spacer are located on the Z-axis lifting mechanism.

7. The automatic imprinting device for a microlens array according to claim 3, characterized in that: The upper chuck of the curing station can move on a plane perpendicular to the Z axis, and the imprint mold is fixed by the upper chuck of the curing station. The curing station includes an image acquisition device for detecting the alignment marks on the substrate and the imprint mold. The automatic control system is configured to: move the upper chuck based on the distance between the two alignment marks to align the imprint mold with the alignment marks on the substrate.

8. The automatic imprinting device for a microlens array according to claim 7, characterized in that: An observation hole opposite to the alignment mark is provided on the movable platform, and the image acquisition device is located below the observation hole.

9. The automatic imprinting device for a microlens array according to any one of claims 1 to 8, characterized in that: The automatic control system is configured to: identify the substrate and the imprinting mold at the loading and unloading station, and then transfer the stacked components to the gap measurement station; At the gap measurement station, the required amount of polymer is calculated based on the feedback data from the gap measurement device, and then the stacked components are transferred to the imprinting station; At the imprint station, the wafer carrier, substrate, and spacer are separated from the imprint mold, and the dispensing arm is inserted between the substrate and the imprint mold to dispense the glue, and then the polymer imprint is completed, and the stacked components are transferred to the curing station; At the curing station, the substrate is aligned with the imprinting mold and then cured by ultraviolet radiation, and then the stacked components are transferred to the loading and unloading station.

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