Bonding apparatus and bonding head adjustment method

Abstract

The present application provides a kind of bonding device and bonding head adjustment method capable of improving the yield of die bonding operation.The bonding device (1) includes chip holding part (101) configured relative to substrate (201) placed on substrate stage (204).The bonding device (1) adjusts the slope of the chip holding surface (101a) that holds the chip component (202) as detachable.The bonding device (1) includes: adjustment controller (20), which maintains the slope information related to the slope of each place of the stage main surface (204a) on which the substrate (201) is placed;And profiling fixture (10), with profiling surface (13a) to be pressed chip holding surface (101a), and the slope of profiling surface (13a) can be changed to make the slope of chip holding surface (101a) correspond to the slope shown by slope information.

Description

Technical Field

[0001] This invention relates to a coupling device and a method for adjusting the coupling head. Background Technology

[0002] Patent Document 1 discloses a flip-chip mounting method. The mounting method of Patent Document 1 is used when mounting a semiconductor chip onto a circuit board. A pick-and-place tool is used in the handling of the semiconductor chip. First, the pick-and-place tool picks up the semiconductor chip disposed on a support. Next, the pick-and-place tool, while holding the semiconductor chip, moves to a bonding stage on which the circuit board is placed. Furthermore, the pick-and-place tool moves in a manner that positions the semiconductor chip on the circuit board at a desired location.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-174861 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] When mounting semiconductor chips on a circuit board, the adsorption tool is moved in a manner that positions the semiconductor chip with the desired accuracy relative to the target location. The orientation of the semiconductor chip relative to the circuit board is also important during chip mounting. The orientation of the semiconductor chip relative to the circuit board refers to the slope of the semiconductor chip relative to the surface of the circuit board on which it is mounted.

[0008] For example, sometimes it is required that the bonding surface of a semiconductor chip facing the circuit board be configured parallel to the mounting surface of the circuit board. If the semiconductor chip is tilted relative to the mounting surface, mounting defects will occur. For example, there is a possibility of poor electrical bonding between the bump electrode of the semiconductor chip and the electrode pad of the circuit board. If the slope of the semiconductor chip relative to the mounting surface is large, a portion of the semiconductor chip may come into contact with the circuit board. If a portion of the semiconductor chip comes into contact with the circuit board, the semiconductor chip may suffer physical damage. If mounting defects occur, the yield of the die bonding operation will decrease.

[0009] This invention provides a bonding apparatus and a bonding head adjustment method that can improve the yield of die bonding operations.

[0010] Technical means to solve the problem

[0011] As an embodiment of the present invention, the bonding apparatus includes: a stage having a mounting surface for mounting a substrate; a bonding head having a chip holding surface for adsorbing and holding chip components, and an adjustment unit for adjusting the slope of the chip holding surface, and the chip components being configured relative to the substrate mounted on the stage; an information holding unit for holding slope information of the stage that establishes a correlation between the position on the mounting surface and the slope at the position; and a contouring fixture having a contouring surface for pressing the chip holding surface, and capable of changing the slope of the contouring surface so that the slope of the chip holding surface corresponds to the slope indicated by the slope information.

[0012] According to the bonding apparatus, even when the substrate is placed on the stage, the information holding section has the slope information of the stage. As a result, the slope of the bonding head can be adjusted according to the slope of the location where the chip component is to be placed. Therefore, the yield of die bonding operations can be improved.

[0013] In one embodiment, the contouring fixture may include a passive tilting portion comprising a contouring surface, the contouring surface being passively tilted by a force received from the contouring surface. The bonding device in one embodiment may also include a control unit that acquires slope information from an information holding unit, and controls the force applied to the chip holding surface by the chip holding surface based on the slope at the location when the chip holding surface is pressed against the contouring surface. According to this structure, the contouring fixture can be simplified.

[0014] In one embodiment, the passive tilting portion may include: a plate member comprising a contoured surface; and an elastically deformable portion disposed on the surface of the plate member opposite to the contoured surface. The elastically deformable portion may be made of resin material. This structure also simplifies the structure of the contouring fixture.

[0015] In one embodiment, the passive tilting portion may include: a plate member comprising a contouring surface; and an elastic deformation portion disposed on the surface of the plate member opposite to the contouring surface. The elastic deformation portion may be a metal spring. This structure also simplifies the structure of the contouring clamp.

[0016] In one embodiment, the contouring fixture may include an active tilting portion comprising a contouring surface that actively tilts regardless of the force applied to it. The active tilting portion may include: a plate member comprising the contouring surface; and a plate member drive portion disposed on a surface of the plate member opposite to the contouring surface, which actively controls the slope of the plate member. The plate member drive portion tilts the plate member so that the slope of the contouring surface corresponds to the slope indicated by slope information provided by an information holding portion. According to this structure, the contouring surface can be reliably tilted as indicated by the tilt information.

[0017] Another embodiment of the present invention is a bonding head adjustment method that adjusts the slope of a chip holding surface relative to a substrate, wherein the substrate is placed on the mounting surface of a stage having a mounting surface for mounting the substrate, and the chip holding surface is a chip holding surface of a bonding head for arranging chip components, which adsorbs and holds the chip components. The bonding head adjustment method includes: a first step of obtaining slope information that associates a position on the mounting surface with a slope at the position; and a second step of adjusting the slope of the chip holding surface based on the slope information associated with the position on the mounting surface, the position on the mounting surface corresponding to the position of the substrate for arranging the chip components. According to the bonding head adjustment method, even when the substrate is placed on the stage, the information holding section has slope information of the main surface of the stage. As a result, the slope of the bonding head can be adjusted according to the slope of the location where the chip components are to be arranged. Therefore, the yield of die bonding operations can be improved.

[0018] In another embodiment, the second step can use a contour jig that passively generates the slope of the contoured surface based on the pressure applied to the chip holding surface to adjust the slope of the chip holding surface. The method can also be used to adjust the slope of the connector based on the slope of the location where the chip component is to be positioned.

[0019] In another embodiment, the second step can use a contour jig that actively generates the slope of the contoured surface regardless of the pressure applied to the chip holding surface to adjust the slope of the chip holding surface. The method can also be used to adjust the slope of the connector based on the slope of the location where the chip component is to be positioned.

[0020] The effects of the invention

[0021] According to the present invention, a bonding apparatus and a bonding head adjustment method are provided that can improve the yield of die bonding operations. Attached Figure Description

[0022] Figure 1 This is a schematic diagram illustrating a situation where a coupling device and a coupling head adjustment method can be applied to the coupling operation.

[0023] Figure 2 This is a diagram showing the structure of the coupling device.

[0024] Figure 3 (a) is a diagram showing the relationship between the position and slope of the elastically deformable part. Figure 3 (b) is a graph showing the relationship between the weight and slope of the elastically deformable part. Figure 3 (c) is a graph showing the relationship between the rigidity and slope of the elastically deformable part.

[0025] Figure 4 (a) is a diagram representing one step of the joining operation. Figure 4 (b) indicates the joint operation. Figure 4 A diagram of the subsequent processes of (a). Figure 4 (c) indicates the joining operation Figure 4 The diagram shows the subsequent process of (b).

[0026] Figure 5 (a) is a diagram showing the process of adjusting the joint. Figure 5 (b) indicates the joint adjustment operation. Figure 5 A diagram of the subsequent processes of (a).

[0027] Figure 6 (a) indicates the joint adjustment operation. Figure 5 The diagram shows the subsequent process of (b). Figure 6 (b) indicates the joint adjustment operation. Figure 6 A diagram of the subsequent processes of (a).

[0028] Figure 7 (a) is a diagram representing a step in the jointing process following the joint adjustment operation. Figure 7 (b) indicates the joint operation. Figure 7 A diagram of the subsequent processes of (a).

[0029] Figure 8 (a) indicates the joining operation. Figure 7 The diagram shows the subsequent process of (b). Figure 8 (b) indicates the joint operation. Figure 8 A diagram of the subsequent processes of (a).

[0030] Figure 9 This is a diagram showing the structure of the coupling device in Modified Example 1.

[0031] Figure 10 This is a diagram showing the structure of the joining device in Modified Example 2.

[0032] Figure 11 (a) is a diagram showing the process of adjusting the joint. Figure 11 (b) indicates the joint adjustment operation. Figure 11 A diagram of the subsequent processes of (a).

[0033] Figure 12 (a) indicates the joint adjustment operation. Figure 11 The diagram shows the subsequent process of (b). Figure 12 (b) indicates the joint adjustment operation. Figure 12 A diagram of the subsequent processes of (a).

[0034] Explanation of symbols

[0035] 1, 1A, 1B: Engaging devices

[0036] 10, 10A, 10B: Contouring fixtures

[0037] 11, 11A: Passive tilting part

[0038] 12: Base

[0039] 13: Plate components

[0040] 13a: Phenomenological Surface

[0041] 14, 14A: Elastic deformation part

[0042] 14s: Variable stiffness part

[0043] 15: Active tilting section

[0044] 16: Drive column (drive part of plate component)

[0045] 16a: Driver end

[0046] 17: Support column

[0047] 20: Adjust the controller (information retention unit)

[0048] 101: Chip Holding Section

[0049] 101a: Chip holding surface

[0050] 102: Slope Adjustment Mechanism (Slope Adjustment Unit)

[0051] 102a: Movable part

[0052] 103: Actuator

[0053] 104: Main Controller (Control Unit)

[0054] 200: Connector

[0055] 201: Substrate

[0056] 201a: Mounting surface

[0057] 202: Chip Components

[0058] 202a: Chip bonding surface

[0059] 203: Chip Platform

[0060] 204: Substrate carrier (carrier)

[0061] 204a: Main surface of the stage (placement surface)

[0062] 206: Measuring apparatus

[0063] A1: Fixture reference axis

[0064] A2: Stage reference axis

[0065] D: Deviation

[0066] F: Pressing pressure

[0067] G1, G2, G3: Curves

[0068] R1, R2, R3: Corresponding regions

[0069] S1, S2, S3, S4, S4a, S4b, S4c, S4d, S5, S6, S7, S8: Steps

[0070] φ1, φ2: Control signals

[0071] X, Y, Z: Direction Detailed Implementation

[0072] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are used to denote the same components, and repeated descriptions are omitted.

[0073] like Figure 1 As shown, the bonding device 1 bonds a chip component 202 to a substrate 201. The bonding includes both mechanical and electrical bonding. The chip component 202 is, for example, a semiconductor chip obtained through the monolithization of a semiconductor wafer. The chip component 202 can also be other packaged electronic components. Multiple chip components 202 are placed on a chip stage 203. The substrate 201 is, for example, a circuit board with wiring patterns and electrode pads formed on it. The substrate 201 is placed on a substrate stage 204. The bump electrodes included in the chip component 202 are bonded to the electrode pads of the substrate 201. The bonding head 200 of the bonding device 1 moves onto the chip stage 203. Then, the bonding head 200 descends close to the chip stage 203. Then, the bonding head 200 holds the chip component 202. Then, the bonding head 200 holding the chip component 202 moves onto the substrate 201. Then, the bonding head 200 places the chip component 202 at a predetermined position on the substrate 201. Furthermore, the bonding head 200 performs the necessary processes for bonding the chip component 202 to the substrate 201. For example, the bonding head 200 applies heat to the chip component 202 in order to thermally harden the adhesive required for mechanical bonding.

[0074] When the chip component 202 is disposed on the substrate 201, the orientation of the chip component 202 relative to the substrate 201 is important. The orientation of the chip component 202 relative to the substrate 201 refers, for example, to the slope of the chip bonding surface 202a of the chip component 202 relative to the mounting surface 201a of the substrate 201 on which the chip component 202 is mounted. Ideally, the chip bonding surface 202a is parallel to the mounting surface 201a. For example, for bonding the chip component 202, the bonding head 200 of the bonding device 1 sometimes presses the chip component 202 toward the substrate 201. If the chip bonding surface 202a is parallel to the mounting surface 201a, the distribution of the pressing pressure will not be shifted. When the chip bonding surface 202a is parallel to the mounting surface 201a, heat can be uniformly applied to the adhesive disposed between the chip component 202 and the substrate 201. When the chip bonding surface 202a is inclined relative to the mounting surface 201a, there is a possibility that the distribution of the pressing pressure and the distribution of heat will be shifted. Even when the chip bonding surface 202a is extremely tilted relative to the mounting surface 201a, there may be a situation where a part of the chip component 202 comes into contact with the substrate 201.

[0075] Therefore, controlling the orientation of the chip component 202 relative to the substrate 201 is important. The bonding apparatus and bonding head adjustment method of this embodiment are bonding apparatus and bonding head adjustment methods for properly setting the orientation of the chip component 202 relative to the substrate 201.

[0076] A brief description of the bonding device 1 is provided. The bonding device 1 includes a bonding head 200, a substrate stage 204 (stage), an adjustment controller 20 (information holding part), and a contouring clamp 10 as its main structural components.

[0077] The connector 200 includes a chip holding section 101 and a slope adjustment mechanism 102 (adjustment unit). The chip holding section 101 has a chip holding surface 101a. The chip holding section 101 holds the chip component 202 on the chip holding surface 101a, allowing it to be mounted and detached. For example, a vacuum adsorption mechanism can be used to hold the chip component 202. The chip holding section 101 is mounted to the slope adjustment mechanism 102. The slope adjustment mechanism 102 changes the slope of the chip holding section 101 relative to a reference axis. The slope adjustment mechanism 102 maintains the slope of the chip holding section 101. The slope adjustment mechanism 102 includes a spherical pneumatic bearing. The slope adjustment mechanism 102 allows the movable part 102a constituting the bearing to tilt freely. Therefore, the slope adjustment mechanism 102 can set the chip holding section 101 to any slope. The position of the movable part 102a is maintained, for example, by vacuum adsorption. The slope adjustment mechanism 102 is mounted to an actuator 103. Actuator 103 moves slope adjustment mechanism 102 and chip holding part 101 in three axial directions. In the following description, the direction closer to or farther from substrate 201, etc., is defined as the Z direction. The direction orthogonal to the Z direction is defined as the X direction. Actuator 103 operates based on control signal φ1 provided by main controller 104 (control unit).

[0078] like Figure 2 As shown, when the chip holding portion 101 is pressed against the contouring fixture 10, the contouring fixture 10 deforms according to the pressing force. This deformation produces a slope for the contouring fixture 10. The slope can be controlled by the deviation D and the magnitude of the pressing force F. The deviation D is the distance from the fixture reference axis A1 of the contouring fixture 10 to the stage reference axis A2 of the slope adjustment mechanism 102. The contouring fixture 10 can produce any slope. Therefore, by making the chip holding portion 101 conform to the slope, the chip holding portion 101 can be adjusted to any slope. The conformation and slope maintenance are achieved by the slope adjustment mechanism 102.

[0079] The contouring clamp 10 has a passive tilting portion 11 and a base 12. The passive tilting portion 11 has a plate member 13 and an elastic deformation portion 14. The plate member 13 is a flat plate. The plate member 13 has rigidity to the point that it will not deform significantly due to the pressing of the chip holding portion 101. The plate member 13 has a contouring surface 13a. The chip holding surface 101a is pressed on the contouring surface 13a. The size of the contouring surface 13a may also be larger than the chip holding surface 101a. The elastic deformation portion 14 is clamped by the plate member 13 and the base 12. The elastic deformation portion 14 deforms significantly with respect to the pressing force F. The rigidity of the elastic deformation portion 14 is lower than the rigidity of the plate member 13. The rigidity referred to here indicates the degree of ease of deformation. The rigidity referred to here may also be called the elastic modulus or Young's modulus. The elastic deformation portion 14 is a block containing rubber or resin. For example, fluororubber or silicone rubber can be used for the elastic deformation portion 14. However, the elastic deformation section 14 is not limited to this; any elastic body can be used. The elastic deformation section 14 can be one or more metal springs. From the viewpoint of producing a significant slope, the thickness of the elastic deformation section 14 is greater than the thickness of the plate member 13. The clamp reference axis A1 can also be referred to as the neutral axis of the elastic deformation section 14. When the axis of the pressing force F overlaps with the clamp reference axis A1, the elastic deformation section 14 contracts in the Z direction without producing a slope. The axis of the pressing force F can also be referred to as the platform reference axis A2. When the axis of the pressing force F deviates from the clamp reference axis A1, the elastic deformation section 14 contracts in the Z direction. However, the amount of contraction varies depending on the location. Therefore, the plate member 13 disposed on the elastic deformation section 14 produces a slope.

[0080] The characteristics of the elastic deformation part 14 can be achieved through... Figure 3 The curve G1 of (a) and Figure 3 The curve G2 in (b) is used as an example. Figure 3 The horizontal axis of (a) represents the position. Figure 3 The vertical axis of (a) represents the slope. The horizontal axis indicates the position (deviation D) of the stage reference axis A2 relative to the fixture reference axis A1. A position of zero means that the stage reference axis A2 overlaps with the fixture reference axis A1. Figure 3 The horizontal axis of (b) represents the weight. Figure 3 In (b), the vertical axis represents the slope. The greater the weight, the greater the slope. Curve G2 illustrates the case where the weight and slope are proportional.

[0081] As a variation of Example 1, it will be described below, but the elastic deformation part 14 is not limited to a structure with constant rigidity. Figure 3 As shown in curve G3 (c), the rigidity of the elastic deformation section 14 can also be variable. In this case, by controlling the rigidity of the elastic deformation section 14 by keeping the pressing force constant, any slope can be generated.

[0082] The adjustment controller 20 provides a control signal φ2 to the main controller 104 to generate a press that produces the desired slope. The adjustment controller 20 maintains information linking the position of the chip component 202 to be positioned on the stage main surface 204a (placement surface) described later with the slope of the stage main surface 204a at that position. The adjustment controller 20 receives position information of the chip component 202 to be positioned next from the main controller 104. The adjustment controller 20 calls the slope information corresponding to the received position information. Then, the adjustment controller 20 sets the slope target of the chip holding section 101 based on the called slope information. Figure 3 (a) and Figure 3 Based on the characteristics of the elastic deformation section 14 shown in (b), the deviation D of the stage reference axis A2 relative to the fixture reference axis A1 is calculated. The deviation D is converted into the X and Y positions of the chip holding section 101. The adjustment controller 20 calculates the force by which the chip holding section 101 presses against the contouring fixture 10. The force by which the chip holding section 101 presses against the contouring fixture 10 is converted into the Z position of the chip holding section 101. The adjustment controller 20 outputs a control signal φ1 to the main controller 104 to move the chip holding section 101 to the calculated X, Y, and Z positions.

[0083] <Match Adjustment Method>

[0084] The following is for reference only. Figures 4-8 The following describes the joining method, which includes a joint adjustment method.

[0085] Preparation of substrate stage 204 (S1: Figure 4 (a) On the substrate stage 204, the substrate 201 is placed on the main surface 204a of the stage in a subsequent process. The positional relationship between the placed substrate 201 and the main surface 204a of the stage is known in advance. Specifically, the correspondence between the position on the substrate 201 where the chip component 202 is to be placed and the position on the main surface 204a of the stage corresponding to the position where the chip component 202 is to be placed is defined. Figure 4 In the example shown in (a), the corresponding regions R1, R2, and R3 of the three parts are illustrated. Ideally, the stage main surface 204a, as shown by the dashed line, is orthogonal to the Z direction. However, in reality, the stage main surface 204a may be tilted as shown by the solid line.

[0086] Next, the slope (S2 (first process)) of the main surface 204a of the stage is obtained: Figure 4(b)). The slope is obtained using a measuring device 206 that measures the desired slope of the measurable surface. The measuring device 206 measures the slope at each measuring position (corresponding region R1, R2, R3) on the main surface 204a of the stage. The measuring device 206 associates the position information with the slope information and outputs it to the adjustment controller 20.

[0087] Next, substrate 201 is placed on the main surface 204a of the stage (S3: Figure 4 (c) In processes S3 and later, the slope of the stage main surface 204a cannot be directly measured. However, the bonding device 1 of the embodiment has stored the slope information corresponding to the area where the chip component 202 is to be placed in the adjustment controller 20. Therefore, even when the substrate 201 is placed on the stage main surface 204a, the slope corresponding to the area where the chip component 202 is to be placed can be known.

[0088] Next, adjust the slope of the chip holding section 101 (S4 (second process): Figure 5 and Figure 6 ).

[0089] The adjustment controller 20 reads the slope information corresponding to the position of the chip component 202 to be configured. Furthermore, using the read slope information and the characteristic information of the elastic deformation section 14, it calculates the position (deviation D) of the stage reference axis A2 relative to the fixture reference axis A1 and the pressing force F. Based on the calculated deviation D and pressing force F, the adjustment controller 20 outputs a control signal to the main controller 104 indicating the target position of the chip holding section 101. Upon receiving the control signal, the main controller 104 outputs a control signal φ1 to the actuator to make the positions in the X and Y directions the target positions (S4a: see reference). Figure 5 (a)

[0090] In this state, the movable part 102a of the slope adjustment mechanism 102 is locked. That is, the movable part 102a cannot tilt. The main controller 104 provides a control signal φ1 to release the lock of the slope adjustment mechanism 102 (S4b: refer to...). Figure 5 (b)

[0091] The adjustment controller 20 outputs a control signal φ2 to the main controller 104 to make the Z-direction position of the chip holding part 101 the target position. The chip holding surface 101a of the chip holding part 101 is pressed against the contoured surface 13a. The elastic deformation part 14 undergoes a deflection deformation, thus tilting the plate member 13. The movable part 102a of the slope adjustment mechanism 102 that holds the chip holding part 101 tilts according to the slope of the contoured plate member 13 (S4c: see reference). Figure 6(a)). The plate member 13 of the contour jig 10 tilts due to the pressing force F. The slope of the contour jig 10 is not generated when the chip holding part 101 is not pressed. The slope of the contour jig 10 generated by pressing the chip holding part 101 is called the slope of the contour jig 10 passively generated.

[0092] Furthermore, when the slope of the contour jig 10 is generated, the main controller 104 provides a control signal φ1. As a result, the movable part 102a of the slope adjustment mechanism 102 is locked (S4d: refer to...). Figure 6 (b) Therefore, the slope of the chip holding section 101 is maintained.

[0093] Next, keep chip component 202 (S5: Figure 7 (a) The main controller 104 provides a control signal φ1 to the actuator 103, causing the connector 200 to move above the chip component 202. Next, the main controller 104 moves the connector 200 downward along the Z direction. Next, the main controller 104 holds the chip component 202 on the connector 200. Furthermore, the main controller 104 moves the connector 200 holding the chip component 202 upward along the Z direction.

[0094] Next, the chip component 202 is moved to the substrate 201 (S6: Figure 7 (b)). The main controller 104 provides a control signal φ1 to the actuator 103. As a result, the connector 200 moves above the region R1a on the substrate 201 where the chip components 202 are configured.

[0095] Next, the chip component 202 is mounted on the substrate 201 (S7: Figure 8 (a)). The main controller 104 provides a control signal φ1 to the actuator 103. As a result, the bonding head 200 moves downward toward the substrate 201 in the Z direction. At this time, the chip holding surface 101a of the chip holding portion 101 is parallel to the mounting surface 201a of the substrate 201. If the surface of the chip component 202 held by the chip holding portion 101 and the surface on the opposite side facing the substrate 201 are made parallel to each other, then the chip bonding surface 202a of the chip component 202 held by the chip holding surface 101a is also parallel to the mounting surface 201a of the substrate 201. The bonding head 200 performs the desired treatments required in bonding, such as heating for heat curing of the adhesive.

[0096] Next, the connector 200 is disengaged from the chip part 202 (S8: Figure 8(b) The main controller 104 provides a control signal φ1 to the bonding head 200. As a result, the adsorption action of the bonding head 200 stops. The main controller 104 provides a control signal φ1 to the actuator 103. As a result, the bonding head 200 moves upward from the substrate 201 along the Z direction. Through the above processes, the chip component 202 is mounted on the substrate 201.

[0097] <Effects>

[0098] In the bonding apparatus 1 and the bonding head adjustment method, even when the substrate 201 is placed on the substrate stage 204, the adjustment controller 20 has slope information of the stage main surface 204a. As a result, the slope of the chip holding section 101 can be adjusted according to the slope of the location where the chip component 202 is to be placed. Therefore, the yield of the die bonding operation can be improved.

[0099] The joining device of the present invention is not limited to the manner described above.

[0100] <Variation Example 1>

[0101] As mentioned above, the elastically deformable portion is not limited to a structure with constant rigidity. For example... Figure 3 As shown in curve G3 of (c), the rigidity of the elastic deformation part can also be variable. Figure 9 This is an example of a coupling device 1A capable of controlling the rigidity of the elastically deformable portion 14A to an arbitrary rigidity. The coupling device 1A includes a contouring clamp 10A. The contouring clamp 10A has a passive tilting portion 11A. The elastically deformable portion 14A of the passive tilting portion 11A of the contouring clamp 10A includes a variable rigidity portion 14s capable of controlling the rigidity (elastic modulus, Young's modulus). The variable rigidity portion 14s can be controlled, for example, by hydraulic, water, or air pressure, based on a control signal φ2 output by the adjustment controller 20.

[0102] <Variation Example 2>

[0103] The contour jig 10 in this embodiment is a contour jig 10 that passively generates the slope of the plate member 13 due to pressing pressure. For example, as Figure 10As shown, the slope of the contour clamp 10B of the bonding device 1B can also be actively generated. "Active" means that the slope is generated even without pressing the chip holding part 101. In Modification 2, the bonding device 1B has an active tilting part 15 instead of a passive tilting part 11. The active tilting part 15 has a plate member 13 and a drive post 16 (plate member drive part). The drive post 16 is, for example, disposed at a corner of the plate member 13. The front end of the drive end 16a abuts against the plate member 13. The support of the plate member 13 does not need to be entirely composed of drive posts 16. Drive posts 16 can also be provided at the three corners of the rectangular plate member 13. A support post 17 is disposed at one corner. The support post 17 does not have a variable protrusion length like the drive post 16. The drive post 16 receives a control signal φ2 from the adjustment controller 20. As a result, the protrusion length of the drive post 16 is adjusted. By adjusting the protrusion length of the drive post 16, the slope of the plate member 13 can be set to the desired slope.

[0104] According to the coupling device 1B, it can be achieved through... Figure 11 and Figure 12 The process shown is used to adjust the slope of the chip holding section 101. For example... Figure 11 As shown in (a), the chip holding part 101 is moved onto the contour jig 10B. The chip holding part 101 only needs to be positioned on the board member 13. Strict alignment as shown by the deviation D between the jig reference axis A1 and the stage reference axis A2, as in the embodiment, is not required. Next, as... Figure 11 As shown in (b), the controller 20 outputs a control signal φ2 to the drive column 16. The drive column 16 adjusts the length of the drive end 16a based on the control signal φ2. By adjusting the length of the drive end 16a, the plate member 13 is set to the desired slope. Then, the main controller 104 releases the lock of the slope adjustment mechanism 102. Subsequently, as... Figure 12 As shown in (a), the main controller 104 outputs a control signal φ1. The actuator 103 moves the slope adjustment mechanism 102 and the chip holding part 101 downward in the Z direction. At this time, the locking of the movable part 102a of the slope adjustment mechanism 102 is released. Therefore, the slope of the contour plate member 13 of the chip holding part 101 fixed to the movable part 102a is adjusted. At this time, it is sufficient for the chip holding surface 101a to contact the contour surface 13a. That is, no pressing force is generated. Thereafter, the main controller 104 locks the movable part 102a. Moreover, as shown in (a), the main controller 104 locks the movable part 102a. Figure 12 As shown in (b), the main controller 104 outputs a control signal φ1. The actuator 103 causes the slope adjustment mechanism 102 and the chip holding section 101 to move upward in the Z direction. Through the above process, the slope of the chip holding section 101 is adjusted.

Claims

1. A coupling device, comprising: A stage having a mounting surface for placing a substrate; The bonding head has a chip holding surface for adsorbing and holding chip components, and an adjustment unit for adjusting the slope of the chip holding surface, and the chip components are configured relative to the substrate placed on the stage. The information holding unit holds the slope information of the stage that establishes a correlation between the position on the mounting surface and the slope at the position; as well as A contouring fixture has a contoured surface to press the chip holding surface, and is capable of changing the slope of the contoured surface so that the slope of the chip holding surface corresponds to the slope indicated by the slope information. The contouring fixture is separately positioned along the X-direction and is independent of the platform. The X direction is orthogonal to the Z direction, and the Z direction is the direction in which the joint approaches or moves away from the mounting surface of the stage.

2. The joining device according to claim 1, wherein the contouring clamp includes a passively tilting portion, the passively tilting portion comprising the contouring surface, and the contouring surface is passively tilted by a force received from the contouring surface. The joining device further includes: The control unit obtains the slope information from the information holding unit, and controls the force applied by the chip holding surface to the contoured surface based on the slope at the position when the chip holding surface is pressed against the contoured surface.

3. The coupling device according to claim 2, wherein the passive tilting portion comprises: A plate member, including the contoured surface; and an elastically deformable portion disposed on the surface of the plate member opposite to the contoured surface, and The elastic deformation part is made of resin material.

4. The coupling device according to claim 2, wherein the passive tilting portion comprises: A plate member, including the contoured surface; and an elastically deformable portion disposed on the surface of the plate member opposite to the contoured surface, and The elastic deformation part is a metal spring.

5. The joining device according to claim 1, wherein the contouring clamp includes an active tilting portion, the active tilting portion comprising the contouring surface, and the contouring surface tilts actively regardless of the force received from the contouring surface. The active tilting unit includes: Plate component, including the contoured surface; And a plate component driving unit, disposed on the surface of the plate component opposite to the contoured surface, actively controls the slope of the plate component, and The plate member driving unit tilts the plate member so that the slope of the contoured surface corresponds to the slope shown by the slope information provided by the information holding unit.

6. A bonding head adjustment method for adjusting the slope of a chip holding surface relative to a substrate, the substrate being placed on a mounting surface of a stage having a mounting surface for mounting the substrate, the chip holding surface being a chip holding surface of a bonding head for arranging chip components, the bonding head adjustment method comprising: The first step is to obtain slope information that establishes a correlation between the position on the mounting surface and the slope at the position; as well as The second step involves adjusting the slope of the chip holding surface based on the slope information associated with its position on the mounting surface, where the position corresponds to the position of the substrate on which the chip components are disposed. The second step uses a contour jig that passively generates the slope of the contoured surface based on the pressure applied to the chip holding surface, to adjust the slope of the chip holding surface. The contouring fixture is separately positioned along the X-direction and is independent of the platform. The X direction is orthogonal to the Z direction, and the Z direction is the direction in which the joint approaches or moves away from the mounting surface of the stage.

7. A bonding head adjustment method for adjusting the slope of a chip holding surface relative to a substrate, the substrate being placed on a mounting surface of a stage having a mounting surface for mounting the substrate, the chip holding surface being a chip holding surface of a bonding head for arranging chip components, the bonding head adjustment method comprising: The first step is to obtain slope information that establishes a correlation between the position on the mounting surface and the slope at the position; as well as The second step involves adjusting the slope of the chip holding surface based on the slope information associated with its position on the mounting surface, where the position corresponds to the position of the substrate on which the chip components are disposed. The second step uses a contour jig that actively generates the slope of the contoured surface regardless of the pressure applied to the chip holding surface, in order to adjust the slope of the chip holding surface. The contouring fixture is separately positioned along the X-direction and is independent of the platform. The X direction is orthogonal to the Z direction, and the Z direction is the direction in which the joint approaches or moves away from the mounting surface of the stage.

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