Semiconductor process apparatus and gas inlet device therefor

Abstract

Embodiments of the present application provide a semiconductor process equipment and a gas inlet device thereof. The gas inlet device comprises a gas inlet block assembly and a connecting assembly, both of which are made of corrosion-resistant material; a mixing cavity, a gas conveying passage and a mixing passage are formed in the gas inlet block assembly, the gas inlet block assembly is sealingly connected with an upper cover of a process chamber, a gas inlet of the gas conveying passage is in communication with the mixing cavity, and a gas outlet of the gas conveying passage is in communication with the process chamber; a plurality of gas inlets of the mixing passage are formed on an outer surface of the gas inlet block assembly, and a gas outlet of the mixing passage is in communication with the mixing cavity; the plurality of connecting assemblies are arranged on the gas inlet block assembly, and the plurality of connecting assemblies are in one-to-one correspondence with the plurality of gas inlets of the mixing passage and are in communication with the plurality of gas inlets of the mixing passage, respectively, for being connected with a plurality of process gas supply sources to selectively introduce or stop introducing process gas into the mixing passage. Embodiments of the present application can prevent the reaction gas from corroding to form pollutants, thereby improving the yield of wafers.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing, in particular, the present application relates to a kind of semiconductor process equipment and its air inlet device. BACKGROUND

[0002] Currently, the process of ammonia-hydrogen fluoride dry etching is as follows: after the wafer enters the process chamber, it is driven by the base to rise to the process position, the dilution gas is introduced into the process chamber to control the pressure of the process chamber, after the process chamber reaches the process pressure, the wafer temperature also rises to the process temperature, the reaction gas and the dilution gas are pre-adsorbed in the process chamber, and the reaction gas and the dilution gas are mixed to form high-activity reactant ammonium fluoride (NH4F); then the reaction gas and the dilution gas are introduced into the process chamber again, at this time the reaction gas reacts with the silicon dioxide on the wafer surface and generates a solid by-product, and finally the by-product is volatilized after heat treatment in the annealing chamber, and the purpose of etching the wafer is achieved. In the actual process, the base temperature, the process pressure, the ratio of ammonia (NH3) and hydrogen fluoride (HF) in the reaction gas, the dilution gas flow, the time interval (Spacing), the temperature difference of the process chamber and other parameters will affect the final etching uniformity and selectivity.

[0003] In the prior art, the air inlet device in the semiconductor process equipment generally includes a mixing pipe structure made of stainless steel, a mixing chamber, an air inlet pipe and an air inlet flange, wherein the mixing pipe structure is connected with the mixing chamber, and the mixing chamber is connected with the upper cover of the process chamber through the air inlet pipe and the air inlet flange. In actual application, the reaction gas and the dilution gas of the process gas enter the mixing chamber through the mixing pipe structure, mix in the mixing chamber, and then enter the process chamber through the air inlet pipe and the air inlet flange. During the air inlet process, the hydrogen fluoride in the reaction gas will cause corrosion to the stainless steel pipe, especially the upper cover pipe, because the upper cover pipe is often exposed to the atmosphere, the water vapor attached to the inner wall of the upper cover pipe will enhance the corrosion of hydrogen fluoride to the stainless steel pipe, causing the inner wall of the pipe to corrode and turn black, reducing the smoothness of the inner wall of the pipe, and further reducing the corrosion resistance to hydrogen fluoride, so that the iron (Fe) corroded from the pipe enters the process chamber and falls on the wafer, which is difficult to remove, causing the particle index on the wafer surface to exceed the standard, thereby greatly reducing the yield of the wafer. SUMMARY

[0004] The present application is directed to the shortcomings of the prior art, and proposes a kind of semiconductor process equipment and its air inlet device to solve the technical problem that the wafer yield is reduced due to the pollution of the process chamber by the air inlet device in the prior art.

[0005] In a first aspect, embodiments of the present application provide a gas inlet device of a semiconductor process equipment, arranged on a top of a process chamber of the semiconductor process equipment, for inputting process gas into the process chamber, comprising: a gas inlet block assembly and a connecting assembly, the gas inlet block assembly and the connecting assembly are made of corrosion-resistant material; a mixing cavity, a gas conveying passage and a gas mixing passage are formed in the gas inlet block assembly, the gas inlet block assembly is sealingly connected with an upper cover of the process chamber, a gas inlet of the gas conveying passage is in communication with the mixing cavity, a gas outlet of the gas conveying passage is in communication with the process chamber; a plurality of gas inlets of the gas mixing passage are formed on an outer surface of the gas inlet block assembly, a gas outlet of the gas mixing passage is in communication with the mixing cavity; a plurality of the connecting assemblies are arranged on the gas inlet block assembly, and the plurality of the connecting assemblies are in one-to-one correspondence with the plurality of gas inlets of the gas mixing passage, and are respectively connected with a plurality of process gas supply sources to selectively input or stop inputting process gas into the gas mixing passage.

[0006] In an embodiment of the present application, the gas inlet block assembly is made of aluminum material, and comprises a first gas inlet block, a second gas inlet block and a third gas inlet block which are sealingly connected in sequence, the first gas inlet block is sealingly connected with the upper cover of the process chamber; the gas conveying passage is formed in the first gas inlet block and the second gas inlet block, the mixing cavity is formed between the second gas inlet block and the third gas inlet block; the gas mixing passage is formed in the second gas inlet block and the third gas inlet block.

[0007] In an embodiment of the present application, the gas inlet device further comprises a temperature control assembly, the temperature control assembly is arranged in the first gas inlet block, the second gas inlet block and the third gas inlet block to detect and control the temperature of the first gas inlet block, the second gas inlet block and the third gas inlet block.

[0008] In an embodiment of the present application, the gas conveying passage comprises a first gas conveying branch and a second gas conveying branch; the first gas conveying branch comprises a first vertical passage and a first horizontal passage which are in communication and are formed in the first gas inlet block, the first vertical passage extends along the length direction of the first gas inlet block, and the first horizontal passage extends along the radial direction of the first gas inlet block; the first vertical passage is in communication with the process chamber, and the first horizontal passage is in communication with the second gas conveying branch; the second gas conveying branch comprises two second horizontal passages which are in communication and are formed in the second gas inlet block, the two second horizontal passages are arranged along the radial direction of the second gas inlet block, one of the second horizontal passages is in communication with the first horizontal passage, and the other second horizontal passage is in communication with the mixing cavity.

[0009] In an embodiment of the present application, a mixing groove is formed on one side of the third gas inlet block, and an opening of the mixing groove is sealingly connected with the side of the second gas inlet block to form the mixing cavity.

[0010] In an embodiment of the present application, the gas mixing passage comprises a first gas mixing branch, a connecting branch and a plurality of second gas mixing branches; the first gas mixing branch comprises a third horizontal passage and a fourth horizontal passage which are in communication with each other and are formed in the third gas inlet block, the third horizontal passage and the fourth horizontal passage are arranged in extension along the radial direction of the third gas inlet block, the third horizontal passage is in communication with the gas mixing cavity, and the fourth horizontal passage extends to the side surface of the third gas inlet block; the connecting branch comprises a sixth horizontal passage formed in the third gas inlet block and a seventh horizontal passage formed in the second gas inlet block, the sixth horizontal passage and the seventh horizontal passage are arranged in communication, and the sixth horizontal passage and the fourth horizontal passage are in communication with each other; the plurality of second gas mixing branches comprise a plurality of fifth horizontal passages which are respectively formed in the second gas inlet block and the third gas inlet block, the fifth horizontal passages formed in the third gas inlet block are in communication with the sixth horizontal passage, and the fifth horizontal passages formed in the second gas inlet block are in communication with the seventh horizontal passage.

[0011] In an embodiment of the present application, the temperature control assembly comprises a heating component and a first temperature measuring component, the heating component and the first temperature measuring component are arranged in the first gas inlet block, the second gas inlet block and the third gas inlet block, and the first temperature measuring component is electrically connected with the heating component; the first temperature measuring component is used for detecting the temperature of the first gas inlet block, the second gas inlet block and the third gas inlet block, and controlling the heating power of the heating component according to the temperature.

[0012] In an embodiment of the present application, the temperature control assembly further comprises a second temperature measuring component, the second temperature measuring component is arranged in the first gas inlet block, the second gas inlet block and the third gas inlet block, and is used for detecting and displaying the temperature of the first gas inlet block, the second gas inlet block and the third gas inlet block.

[0013] In an embodiment of the present application, the connecting assembly comprises a connecting piece made of hastelloy and a valve, one end of the connecting piece is in sealing connection with the gas inlet of the gas mixing passage, the other end is in sealing connection with the valve, the valve is used for connecting with the process gas supply source and selectively connecting or disconnecting the gas mixing passage and the process gas supply source.

[0014] In an embodiment of the present application, the connecting assembly further comprises a pressing piece and a sealing joint, the pressing piece comprises two semi-annular sub-pressing pieces which are arranged oppositely on the outer periphery of the connecting piece and are connected with the gas inlet block assembly, and are used for pressing the connecting piece on the gas inlet block assembly; the connecting piece is in sealing connection with the valve through the sealing joint.

[0015] In a second aspect, the embodiments of the present application provide a semiconductor process equipment, comprising a process chamber and the gas inlet device provided in the first aspect.

[0016] The technical scheme provided by the embodiments of the present application has the beneficial technical effects that:

[0017] The embodiments of the present application use the gas inlet block assembly and the connecting assembly made of corrosion-resistant material. The reaction gas and the dilution gas of the process gas enter the mixing channel through the connecting assemblies, and then mix in the mixing chamber before entering the process chamber through the gas delivery channel. Since the process gas flows in the channel made of corrosion-resistant material at all times, the positions where the gas inlet device contacts the reaction gas can be prevented from corrosion, so that the embodiments of the present application can not only implement the ammonia-hydrogen fluoride dry etching process, but also be applicable to other processes, thereby greatly improving the applicability and scope of the embodiments of the present application. Furthermore, since the gas inlet device can prevent the hydrogen fluoride in the reaction gas from causing corrosion and forming pollutants in the gas inlet device, the stainless steel material used in the prior art can be avoided to cause pollution in the process chamber, thereby greatly improving the yield of wafers.

[0018] Additional aspects and advantages of the present application will be made apparent from the following description of the embodiments of the present application, which will become apparent from the following description of the embodiments of the present application, which will become apparent from the following description of the embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0019] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description of the embodiments of the present application, taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 A longitudinal sectional view of the gas inlet device provided by the embodiments of the present application cooperating with the process chamber is shown in the figure.

[0021] Figure 2 A horizontal structure schematic view of the gas device provided by the embodiments of the present application cooperating with the process chamber is shown in the figure.

[0022] Figure 3A A front view structure schematic view of the first gas inlet block provided by the embodiments of the present application is shown in the figure.

[0023] Figure 3B A left view structure schematic view of the first gas inlet block provided by the embodiments of the present application is shown in the figure.

[0024] Figure 3C A longitudinal sectional view of the first gas inlet block provided by the embodiments of the present application is shown in the figure.

[0025] Figure 3D A top view structure schematic view of the first gas inlet block provided by the embodiments of the present application is shown in the figure.

[0026] Figure 4A A second air inlet block front view structural schematic provided for the embodiment of the present application;

[0027] Figure 4B A second air inlet block right view structural schematic provided for the embodiment of the present application;

[0028] Figure 4C A second air inlet block left view structural schematic provided for the embodiment of the present application;

[0029] Figure 4D A second air inlet block transverse section view schematic provided for the embodiment of the present application;

[0030] Figure 5A A third air inlet block front view structural schematic provided for the embodiment of the present application;

[0031] Figure 5B A third air inlet block left view structural schematic provided for the embodiment of the present application;

[0032] Figure 5C A third air inlet block right view structural schematic provided for the embodiment of the present application;

[0033] Figure 5D A third air inlet block transverse section view schematic provided for the embodiment of the present application;

[0034] Figure 6A A top view schematic of a connecting assembly provided for the embodiment of the present application;

[0035] Figure 6B A longitudinal section view schematic of a connecting assembly provided for the embodiment of the present application;

[0036] Figure 6C A three-dimensional structural schematic of a pressing part provided for the embodiment of the present application. DETAILED DESCRIPTION

[0037] The present application is described in detail below, examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference signs represent the same or similar components or components having the same or similar functions throughout. In addition, if a detailed description of known technology is unnecessary for the features of the present application shown, it is omitted. The embodiments described below by referring to the accompanying drawings are exemplary, only for explaining the present application, and cannot be interpreted as a limitation of the present application.

[0038] Those skilled in the art can understand that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that the terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0039] The technical solutions of the present application and how the technical solutions solve the above technical problems will be described in detail below with specific examples.

[0040] The embodiments of the present application provide a gas inlet device of a semiconductor process equipment, which is arranged at the top of a process chamber of the semiconductor process equipment and used for inputting process gas into the process chamber. A structural schematic diagram of the gas inlet device is shown in Figure 1 and Figure 2 The gas inlet device comprises a gas inlet block assembly 1 and a connecting assembly 2, and the gas inlet block assembly 1 and the connecting assembly 2 are made of a material resistant to corrosion by hydrogen fluoride. The gas inlet block assembly 1 is formed with a gas mixing cavity 11, a gas conveying passage 12 and a gas mixing passage 13. The gas inlet block assembly 1 is sealingly connected to an upper cover 101 of the process chamber 100. The gas inlet of the gas conveying passage 12 is in communication with the gas mixing cavity 11, and the gas outlet of the gas conveying passage 12 is in communication with the process chamber 100. Multiple gas inlets of the gas mixing passage 13 are formed on the outer surface of the gas inlet block assembly 1, and the gas outlet of the gas mixing passage 13 is in communication with the gas mixing cavity 11. Multiple connecting assemblies 2 are arranged on the gas inlet block assembly 1, and the multiple connecting assemblies 2 are in one-to-one correspondence with the multiple gas inlets of the gas mixing passage 13 and are in communication with the multiple gas inlets, respectively, so as to be connected to multiple process gas supply sources and selectively input or stop inputting process gas into the gas mixing passage 13.

[0041] As shown in Figure 1 and Figure 2As shown, the semiconductor process equipment can be used to perform ammonia-hydrogen fluoride dry etching process, but the embodiments of the present application are not limited to the type of process performed, and those skilled in the art can adjust the settings according to the actual situation. The gas inlet block assembly 1 can be made of a solid structure of a material resistant to hydrogen fluoride corrosion. The gas inlet block assembly 1 can be sealed and connected to the upper cover 101 of the process chamber 100 by a sealing ring and a bolt, for mixing the reaction gas and dilution gas of the process gas and supplying the process gas into the process chamber 100. The gas inlet block assembly 1 can form a gas mixing chamber 11, a gas conveying passage 12 and a gas mixing passage 13. The gas conveying passage 12 can be a hole formed in the gas inlet block assembly 1, and the gas inlet of the gas conveying passage 12 can communicate with the gas mixing chamber 11, and the gas outlet can communicate with the process chamber 100. The gas mixing chamber 11 can be a cavity formed in the gas inlet block assembly 1, for mixing the reaction gas and dilution gas and then conveying them into the gas conveying passage 12 and into the process chamber 100. The gas mixing passage 13 can be a hole formed in the gas inlet block assembly 1, and the gas inlets of the gas mixing passage 13 can be formed on the outer surface of the gas inlet block assembly 1, and the gas outlet can communicate with the gas mixing chamber 11, for inputting the reaction gas and dilution gas into the gas mixing chamber 11. The plurality of connection assemblies 2 can be made of a material resistant to hydrogen fluoride corrosion, and are arranged on the gas inlet block assembly 1 and are respectively sealed and connected to the gas inlets of the gas mixing passage 13, for being respectively connected to a plurality of process gas supply sources, so as to supply the reaction gas and dilution gas into the gas mixing chamber 11 through the gas mixing passage 13.

[0042] The embodiments of the present application use the gas inlet block assembly and the connection assembly made of a material resistant to hydrogen fluoride corrosion. The reaction gas and dilution gas of the process gas enter the gas mixing passage through the plurality of connection assemblies, and then are mixed in the gas mixing chamber and then enter the process chamber through the gas conveying passage to perform the process. Since the process gas always flows in the channel formed by the corrosion-resistant material, the positions where the gas inlet device contacts the reaction gas can be prevented from being corroded, so that the embodiments of the present application can not only perform ammonia-hydrogen fluoride dry etching process, but also can be applied to other processes, thereby greatly improving the applicability and scope of the embodiments of the present application. Further, since the gas inlet device can prevent the hydrogen fluoride in the reaction gas from corroding the gas inlet device and forming pollutants, the stainless steel material used in the prior art can be avoided to pollute the process chamber, thereby greatly improving the yield of the wafer.

[0043] It should be noted that the embodiments of the present application do not limit the specific structure of the gas inlet block assembly 1. For example, the gas inlet block assembly 1 can also have a tubular structure. Therefore, the embodiments of the present application are not limited thereto, and those skilled in the art can adjust them according to the actual situation.

[0044] In an embodiment of the present application, as shown inFigure 1 and Figure 2 As shown in

[0045] As shown in Figure 1 and Figure 2 The gas inlet block assembly 1 can be made of aluminum. Aluminum reacts with hydrogen fluoride to form aluminum fluoride (ALF3), which is very dense and can effectively solve the problem of hydrogen fluoride corrosion. Aluminum is easy to process, has low processing costs, and short processing cycles. Therefore, the gas inlet block assembly 1 is made of aluminum, which not only avoids the problem of hydrogen fluoride corrosion of the gas inlet device, but also greatly reduces the application and maintenance costs of the embodiment. The first gas inlet block 3, the second gas inlet block 4, and the third gas inlet block 5 can be sequentially sealed and connected, and the first gas inlet block 3 is sealed and connected to the upper cover 101 of the process chamber 100. The gas inlet channel 12 can be formed in the first gas inlet block 3 and the second gas inlet block 4, the gas mixing chamber 11 can be formed between the second gas inlet block 4 and the third gas inlet block 5, and the gas mixing channel 13 can be formed in the second gas inlet block 4 and the third gas inlet block 5. The above design makes the embodiment simple to design and process, has good quality control and low cost, thereby greatly reducing the application and manufacturing costs of the embodiment.

[0046] It should be noted that the number of gas inlet blocks included in the gas inlet block assembly 1 is not limited in the embodiment, for example, the gas inlet block assembly 1 can include three or more gas inlet blocks. In addition, the specific positions of the gas mixing chamber 11, the gas inlet channel 12, and the gas mixing channel 13 are not limited in the embodiment, for example, the gas mixing channel 13 can be formed only in the third gas inlet block 5. Therefore, the embodiment is not limited thereto, and those skilled in the art can adjust it according to the actual situation.

[0047] In an embodiment of the present application, as shown in Figure 1 and Figure 2As shown, the air inlet device further comprises temperature control assemblies 6, which are arranged in the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5, and are used for detecting and controlling the temperature of the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5. Specifically, since the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5 are all made of aluminum material in a block structure, and the air mixing cavity 11, the air conveying passage 12 and the air mixing passage 13 are all formed in the three air inlet blocks, the temperature control assemblies 6 can be arranged inside each air inlet block, and it is not necessary to use the heating belt with a specific shape in the prior art, so that the manufacturing cost is greatly saved, and the economic benefit of the embodiment of the present application is greatly improved.

[0048] In an embodiment of the present application, as shown in Figures 1-3D The air conveying passage 12 comprises a first air conveying branch 121 and a second air conveying branch 122; the first air conveying branch 121 comprises a first vertical passage 31 and a first horizontal passage 32 which are formed in the first air inlet block 3 and are in communication with each other, the first vertical passage 31 is arranged along the length direction of the first air inlet block 3, and the first horizontal passage 32 is arranged along the radial direction of the first air inlet block 3; the first vertical passage 31 is in communication with the process chamber 100, and the first horizontal passage 32 is in communication with the second air conveying branch 122; the second air conveying branch 122 comprises two second horizontal passages 41 which are formed in the second air inlet block 4 and are in communication with each other, and the two second horizontal passages 41 are both arranged along the radial direction of the second air inlet block 4, one of the two second horizontal passages 41 is in communication with the first horizontal passage 32, and the other second horizontal passage 41 is in communication with the air mixing cavity 11.

[0049] As shown in Figures 1-3DAs shown, the first gas supply branch 121 is formed in the first gas inlet block 3, and the second gas supply branch 122 is formed in the second gas inlet block 4, so that the structure of the embodiment of the application is simple and easy to process, thereby greatly reducing the application manufacturing cost. The first gas inlet block 3 can have a cuboid structure, and a flange structure 30 is integrally formed at the bottom of the first gas inlet block 3. The first gas inlet block 3 can be connected to the upper cover 101 of the process chamber 100 through the flange structure 30 at the bottom, and is sealed and connected by a fastener cooperating with a sealing ring, but the specific sealing and connecting method is not limited in the embodiment of the application. The first vertical channel 31 extends along the length direction of the first gas inlet block 3, that is, the first vertical channel 31 can extend in the vertical direction, and the first horizontal channel 32 can be located at the top of the first gas inlet block 3. The first horizontal channel 32 can extend along the radial direction (for example, the horizontal direction) of the first gas inlet block 3 and is perpendicular to the first vertical channel 31. The first vertical channel 31 and the first horizontal channel 32 jointly form the first gas supply branch 121. The first horizontal channel 32 is used to communicate with the second gas supply branch 122 in the second gas inlet block 4, so that the second gas inlet block 4 can be arranged on one side of the first gas inlet block 3. By using the above design, not only the space at the top of the process chamber 100 can be greatly saved, thereby greatly reducing the space occupation, but also the structure of the embodiment of the application is reasonable and convenient to layout.

[0050] It should be noted that the first vertical channel 31 must extend along the vertical direction, and the first horizontal channel 32 must extend along the horizontal direction, and the person skilled in the art can adjust and set it according to the actual situation.

[0051] As shown in FIG. 1, Figures 1-4D The second gas inlet block 4 has a cuboid structure, and two second horizontal channels 41 extend inwardly from the front and left side surfaces of the second gas inlet block 4, that is, the two second horizontal channels 41 can extend along the radial direction of the second gas inlet block 4, and the radial direction of the second gas inlet block 4 can be parallel to the radial direction of the first gas inlet block 3, but the embodiment of the application is not limited thereto. The two second horizontal channels 41 are in communication with each other to form the second gas supply branch 122. Figure 4A The front side surface (i.e., the side surface shown in the figure) of the second gas inlet block 4 is parallel to the front side surface (i.e., the side surface shown in the figure) of the first gas inlet block 3. Figure 3AThe side surface) is fitted to communicate one of the second horizontal passages 41 with the first horizontal passage 32, and the other second horizontal passage 41 can communicate with the central position of the mixing cavity 11. With the above design, the third gas inlet block 5 is arranged on one side of the second gas inlet block 4, thereby further saving the top space of the process chamber 100. Further, the front side of the first gas inlet block 3 is provided with an annular first sealing groove 33 surrounding the gas inlet of the first horizontal passage 32, and a sealing ring can be arranged in the first sealing groove 33. The first gas inlet block 3 is sealingly connected with the second gas inlet block 4 through the first sealing groove 33 and the sealing ring, thereby realizing the sealing connection between the first gas supply branch 121 and the second gas supply branch 122. The front-rear direction of the first gas inlet block 3 further penetrates four first connecting holes 34, and the four first connecting holes 34 are arranged around the first sealing groove 33. Four first fasteners 35 are correspondingly arranged in the four first connecting holes 34 and connected with the four connecting holes on the front side of the second gas inlet block 4. However, the specific number of the first connecting holes 34 and the first fasteners 35 is not limited in the embodiment of the present application, and can be adjusted by the person skilled in the art according to the actual situation. Since the first sealing groove 33 and the four first connecting holes 34 are arranged around the gas inlet of the first horizontal passage 32, not only the structure of the embodiment of the present application is simple, but also the sealing effect between the first gas supply branch 121 and the second gas supply branch 122 is greatly improved. However, the sealing mode between the first gas inlet block 3 and the second gas inlet block 4 is not limited in the embodiment of the present application, and can be adjusted by the person skilled in the art according to the actual situation.

[0052] In an embodiment of the present application, as shown in Figures 1-5D the left side surface of the second gas inlet block 4 is provided with a mixing groove 51, and the opening of the mixing groove 51 is sealingly connected with the side surface of the second gas inlet block 4 to form the mixing cavity 11.

[0053] As shown in Figures 1-5D the left side surface of the second gas inlet block 4 is provided with a mixing groove 51, and the opening of the mixing groove 51 is sealingly connected with the side surface of the second gas inlet block 4 to form the mixing cavity 11. Figure 5C The right side surface of the third gas inlet block 5 is fitted with the left side surface of the second gas inlet block 4 to make the mixing groove 51 cooperate with the left side surface of the second gas inlet block 4 to form the mixing cavity 11. With the above design, since the mixing groove 51 is arranged on the third gas inlet block 5 and cooperates with the side surface of the second gas inlet block 4 to form the mixing cavity 11, not only the turbulence coefficient of the reaction gas and the dilution gas can be greatly improved, thereby greatly improving the mixing uniformity of the process gas, but also the structure of the embodiment of the present application is simple, thereby greatly reducing the application and manufacturing cost. Further, the left side surface of the second gas inlet block 4 (i.e. Figure 4CThe second sealing groove 42 is annularly arranged on the side surface of the second air inlet block 4, and a sealing ring can be arranged in the second sealing groove 42. The second air inlet block 4 is sealed and attached to the third air inlet block 5 through the second sealing groove 42 and the sealing ring, so as to realize the sealing of the mixing cavity 11. Four second connecting holes 43 are arranged in the left-right direction of the second air inlet block 4, and the four second connecting holes 43 are arranged near the four corners of the second air inlet block 4. Four second fasteners 44 are arranged in the four second connecting holes 43, and are connected with the connecting holes on the right side surface of the third air inlet block 5, so as to press the sealing ring in the second sealing groove 42. However, the specific number and distribution of the second connecting holes 43 and the second fasteners 44 are not limited in the embodiment of the present application, and can be adjusted by the person skilled in the art according to the actual situation. Since the multiple second connecting holes 43 are arranged at the corners of the second air inlet block 4, the structure of the embodiment of the present application is simple, and the sealing effect between the second air inlet block 4 and the third air inlet block 5 is greatly improved. However, the sealing method between the second air inlet block 4 and the third air inlet block 5 is not limited in the embodiment of the present application, and can be adjusted by the person skilled in the art according to the actual situation.

[0054] In an embodiment of the present application, as shown in Figures 1-5D The mixing channel 13 includes a first mixing branch 131, a connecting branch 133 and multiple second mixing branches 132. The first mixing branch 131 includes a third transverse channel 52 and a fourth transverse channel 53 which are arranged in the third air inlet block 5 and are in communication with each other. The third transverse channel 52 and the fourth transverse channel 53 are arranged along the radial direction of the third air inlet block 5. The third transverse channel 52 is in communication with the mixing cavity 11, and the fourth transverse channel 53 extends to the side surface of the third air inlet block 5. The connecting branch 133 includes a sixth transverse channel 56 arranged in the third air inlet block 5 and a seventh transverse channel 57 arranged in the second air inlet block 4. The sixth transverse channel 56 and the seventh transverse channel 57 are in communication with each other. The sixth transverse channel 56 is in communication with the fourth transverse channel 53. The multiple second mixing branches 132 include multiple fifth transverse channels 55 arranged in the second air inlet block 4 and the third air inlet block 5. The fifth transverse channels 55 arranged in the third air inlet block 5 are in communication with the sixth transverse channel 56, and the fifth transverse channels 55 arranged in the second air inlet block 4 are in communication with the seventh transverse channel 57.

[0055] As shown in Figures 1-5DAs shown, the mixing channel 13 may include a first mixing branch 131 and two second mixing branches 132, wherein the first mixing branch 131 is located within the third intake block 5, and the two second mixing branches 132 are respectively formed within the third intake block 5 and the second intake block 4. Specifically, the first mixing branch 131 includes a third transverse channel 52 and a fourth transverse channel 53 formed within the third intake block 5. Both the third transverse channel 52 and the fourth transverse channel 53 extend radially along the third intake block 5. The radial direction of the third intake block 5 may be parallel to the radial direction of the first intake block 3, but this embodiment is not limited thereto, and the third transverse channel 52 and the fourth transverse channel 53 are interconnected. A sixth transverse channel 56 is provided within the third intake block 5, and the sixth transverse channel 56 extends from the right side of the third intake block 5 (i.e., Figure 5C The sixth horizontal channel 56 extends to the left side (shown on the side) until it connects with the fourth horizontal channel 53. One end of the sixth horizontal channel 56 is arranged parallel to the mixing chamber 11, and the other end is perpendicularly connected to the fourth horizontal channel 53. A seventh horizontal channel 57 is provided inside the second air intake block 4. The seventh horizontal channel 57 extends from the left side of the second air intake block 4 (i.e., the side shown on the side) to the left side. Figure 4C The seventh transverse channel 57 (shown on the side) extends to the right side, with one end connected to and coaxially arranged with one end of the sixth transverse channel 56, and the other end having a closed structure. The sixth transverse channel 56 and the seventh transverse channel 57 together form the connecting branch 133. With the above design, the connecting branch 133 not only makes the structure of the embodiment of this application simple and easy to manufacture, but also further reduces the manufacturing cost.

[0056] The second gas mixing branch 132 is a fifth horizontal passage 55 formed in the third gas inlet block 5, and the other second gas mixing branch 132 is a fifth horizontal passage 55 formed in the second gas inlet block 4. The fifth horizontal passage 55 formed in the third gas inlet block 5 is in communication with the sixth horizontal passage 56, and the fifth horizontal passage 55 formed in the second gas inlet block 4 is in communication with the seventh horizontal passage 57. That is, two second gas mixing branches 132 are formed in the third gas inlet block 5 and the second gas inlet block 4 respectively, but the number and distribution of the second gas mixing branches 132 are not limited in the application, and the person skilled in the art can adjust and set them according to the actual situation. The plurality of second gas mixing branches 132 are in communication with the first gas mixing branch 131 through the connecting branch 133, but the application is not limited to this, and the person skilled in the art can adjust and set them according to the actual situation. The plurality of second gas mixing branches 132 are a plurality of fifth horizontal passages 55 formed in the second gas inlet block 4 and the third gas inlet block 5. The plurality of fifth horizontal passages 55 can be arranged side by side with the fourth horizontal passage 53 and are in communication with the fourth horizontal passage 53. In actual application, the first gas mixing branch 131 can be used to pass in hydrogen fluoride gas, and the two second gas mixing branches 132 can be used to pass in ammonia gas and nitrogen gas respectively. That is, the first gas mixing branch 131 and the second gas mixing branch 132 are used to pass in reaction gas and dilution gas respectively, but the specific number of the second gas mixing branch 132 and the specific type of process gas passed in by each gas mixing branch are not limited in the application, and the person skilled in the art can adjust and set them according to the actual situation. By using the above design, since the gas inlets of the first gas mixing branch 131 and the plurality of second gas mixing branches 132 are located on the same side of the third gas inlet block 5 and the second gas inlet block 4, not only the space occupation of the application can be greatly reduced, but also the structure design of the application is reasonable, thereby facilitating disassembly, maintenance and assembly.

[0057] Further, a third sealing groove 45 is formed in the left side (i.e. Figure 4C the side shown) of the second gas inlet block 4, and a sealing ring can be arranged in the third sealing groove 45. The second gas inlet block 4 is sealingly attached to the third gas inlet block 5 through the second sealing groove 42 and the sealing ring, thereby realizing the sealing of the seventh horizontal passage 57 and the sixth horizontal passage 56. Since the second gas inlet block 4 is connected to the third gas inlet block 5 through the four second fasteners 44, the second gas inlet block 4 and the third gas inlet block 5 cooperate to compress the sealing ring in the third sealing groove 45. Since the plurality of second connecting holes 43 are respectively located at the corners of the second gas inlet block 4, the application does not need to separately set a fastening structure for the third sealing groove 45, thereby further reducing the manufacturing cost and further simplifying the structure of the application.

[0058] It should be noted that the embodiments of the present application do not limit the specific positions of the plurality of second gas mixing branches 132. For example, the plurality of second gas mixing branches 132 can be formed in the third gas inlet block 5. Therefore, the embodiments of the present application are not limited in this way, and a person skilled in the art can adjust and set according to actual conditions.

[0059] In an embodiment of the present application, as shown in Figures 1-5D The temperature control assembly 6 includes a heating component 61 and a first temperature measuring component 62. The first gas inlet block 3, the second gas inlet block 4, and the third gas inlet block 5 are provided with the heating component 61 and the first temperature measuring component 62, and the first temperature measuring component 62 is electrically connected to the heating component 61. The first temperature measuring component 62 is used to detect the temperature of the first gas inlet block 3, the second gas inlet block 4, and the third gas inlet block 5, and control the heating power of the heating component 61 according to the temperature.

[0060] As shown in Figures 1-5D The heating component 61 can include a plurality of heating rods, which can be respectively arranged in the first gas inlet block 3, the second gas inlet block 4, and the third gas inlet block 5. However, the embodiments of the present application do not limit the number of heating rods included in the heating component 61, and a person skilled in the art can adjust and set according to actual conditions. In a specific embodiment of the present application, two 100W heating rods are inserted into the first gas inlet block 3, and the two heating rods are arranged axially parallel to the first gas inlet block 3, and then fixed in the first gas inlet block 3 by two top screws. Since the second gas inlet block 4 and the third gas inlet block 5 have a large volume, four 100W heating rods are arranged in each of the second gas inlet block 4 and the third gas inlet block 5. The four heating rods of the second gas inlet block 4 are inserted from the right side (i.e., the side shown in the figure) of the second gas inlet block 4, and are fixed by top screws. The four heating rods can be arranged close to the four second connecting holes 43, so that the heating efficiency of the second gas inlet block 4 is high and uniform. Figure 4B The four heating rods of the third gas inlet block 5 are inserted from the left side (i.e., the side shown in the figure) of the third gas inlet block 5, and are fixed by top screws. The four heating rods can be arranged close to the four third connecting holes 53, so that the heating efficiency of the third gas inlet block 5 is high and uniform. Figure 5BThe side) extends into, and is fixed by a top wire setting, four heating rods can be set close to the four corners of the left side of the third air inlet block 5, so that the heating efficiency of the third air inlet block 5 is higher and more uniform. The first temperature measuring part 62 can include three temperature sensors, which are respectively arranged in the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5, for detecting the temperature of the three. Further, the first temperature measuring part 62 can be electrically connected with the heating part 61 arranged on the corresponding air inlet block, for example, the first temperature measuring part 62 and the heating part 61 arranged on the first air inlet block 3 are connected, so that the first temperature measuring part 62 can control the heating power of the heating part 61 according to the temperature of the first air inlet block 3, thereby realizing the temperature control of the first air inlet block 3; the temperature control principle of the second air inlet block 4 and the third air inlet block 5 is the same as that of the first air inlet block 3, which will not be described here. With the above design, the temperature of the multiple air inlet blocks can be controlled respectively, thereby improving the temperature uniformity of the multiple air inlet blocks.

[0061] It should be noted that the specific connection mode of the heating part 61 and the first temperature measuring part 62 is not limited in the embodiment of the application, for example, the heating part 61 and the first temperature measuring part 62 are electrically connected with the lower computer of the semiconductor process equipment, and the temperature of the multiple air inlet blocks is controlled simultaneously or separately by the lower computer. Therefore, the embodiment of the application is not limited thereto, and those skilled in the art can adjust and set according to the actual situation.

[0062] In an embodiment of the application, as shown in Figures 1-5D The temperature control assembly 6 further includes a second temperature measuring part 63, which is arranged in the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5 respectively, for detecting and displaying the temperature of the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5. Specifically, the second temperature measuring part 63 further includes three temperature sensors, which are respectively arranged in the first air inlet block 3, the second air inlet block 4 and the third air inlet block 5, for detecting the real-time temperature of the multiple air inlet blocks. With the above design, since the second temperature measuring part 63 is arranged, the temperature of the multiple air inlet blocks can be detected in real time, thereby avoiding the failure of the first temperature measuring part 62 to detect the temperature of the multiple air inlet blocks, to further improve the safety and stability of the embodiment of the application. However, the number of temperature sensors included in the second temperature measuring part 63 is not limited in the embodiment of the application, as long as it corresponds to the number of air inlet blocks, therefore the embodiment of the application is not limited thereto, and those skilled in the art can adjust and set according to the actual situation.

[0063] In an embodiment of the application, as shown in Figure 2 , Figures 6A-6CAs shown, the connecting assembly 2 includes a connecting piece 21 made of Hastelloy material and a valve 22, one end of the connecting piece 21 is sealingly connected with the gas inlet of the mixing passage 13, and the other end is sealingly connected with the valve 22, the valve 22 is used to connect with the process gas supply source and selectively connect or disconnect the mixing passage 13 and the process gas supply source.

[0064] As shown, Figure 2 , Figures 6A-6C The connecting piece 21 can be a tubular structure made of Hastelloy material, one end of the connecting piece 21 is connected with the gas inlet of the mixing passage 13, that is, the connecting pieces 21 of the plurality of connecting assemblies 2 are respectively sealingly connected with the gas inlets of the first mixing branch 131 and the plurality of second mixing branches 132. For example, the embodiment of the present application includes three connecting assemblies 2, the connecting pieces 21 of the three connecting assemblies 2 are respectively sealingly connected with the gas inlets of one first mixing branch 131 and two second mixing branches 132, but the embodiment of the present application is not limited thereto, as long as the specific number of the connecting assemblies 2 corresponds to the number of the gas inlets of the mixing passage 13. The valve 22 can be a pneumatic diaphragm valve made of Hastelloy material, but the embodiment of the present application does not limit the specific type of the valve 22. The valve 22 is arranged at the connecting piece 21 connected with the process gas supply source, and is used to selectively connect or disconnect the mixing passage 13 and the process gas supply source to selectively supply process gas to the mixing passage 13. With the above design, since the connecting piece 21 and the valve 22 are both made of Hastelloy material, not only can they resist hydrogen fluoride corrosion and avoid pollution in the process chamber 100, but also the strength of the connecting assembly 2 can be greatly improved, thereby greatly reducing the failure rate and prolonging the service life of the embodiment of the present application.

[0065] In an embodiment of the present application, as shown, Figure 2 , Figures 6A-6CAs shown, the connecting assembly 2 further comprises a pressing member 23 and a sealing joint 24. The pressing member 23 comprises two semi-annular sub-pressing members 231 oppositely arranged on the outer periphery of the connecting member 21 and connected with the gas inlet block assembly 1, for pressing the connecting member 21 on the gas inlet block assembly 1. The connecting member 21 is sealingly connected with the valve 22 through the sealing joint 24. Specifically, the pressing member 23 can be an annular structure formed by the two semi-annular sub-pressing members 231, and the two sub-pressing members 231 cooperatively form a pressing groove 232. The two sub-pressing members 231 are respectively arranged on two sides of the connecting member 21, so that the boss at the bottom end of the connecting member 21 is located in the pressing groove 232. A plurality of through holes 233 are arranged on the two sub-pressing members 231, for respectively mounting a plurality of bolts. After the plurality of bolts pass through the plurality of through holes 233, the plurality of bolts are connected with the gas inlet block assembly 1, so as to press the connecting member 21 on the gas inlet block assembly 1, thereby realizing the sealing connection between the connecting member 21 and the gas inlet of the gas mixing passage 13. The sealing joint 24 can be a vacuum coupling radius seal (VCR) joint, and is specifically arranged between the connecting member 21 and the valve 22, for realizing the sealing connection between the connecting member 21 and the valve 22. By using the above design, since the process gas does not need to contact the sealing joint 24, the sealing connection between the connecting member 21 and the valve 22 is realized while the corrosion resistance to hydrogen fluoride is realized, thereby avoiding the pollution to the process chamber 100, and the sealing effect of the connecting assembly 2 can be greatly improved.

[0066] Based on the same inventive concept, the embodiments of the present application provide a semiconductor process equipment, comprising a process chamber and the gas inlet device provided in the above embodiments.

[0067] By using the embodiments of the present application, the following beneficial effects can be achieved at least:

[0068] By using the gas inlet block assembly and the connecting assembly made of the corrosion-resistant material, the reaction gas and the dilution gas of the process gas enter the gas mixing passage through the plurality of connecting assemblies, and then are mixed in the gas mixing cavity before entering the process chamber through the gas conveying passage to perform the process. Since the process gas flows in the passage formed by the corrosion-resistant material all the time, the position where the gas inlet device contacts the reaction gas can be prevented from being corroded, so that the embodiments of the present application can not only perform the ammonia-hydrogen fluoride dry etching process, but also can be applied to other processes, thereby greatly improving the applicability and application range of the embodiments of the present application. Further, since the gas inlet device can prevent the hydrogen fluoride in the reaction gas from corroding the gas inlet device to form pollutants, the pollution to the process chamber caused by the stainless steel material in the prior art is avoided, and the yield of the wafer is greatly improved.

[0069] It can be understood that the above embodiments are only exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and principle of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

[0070] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0071] The terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0072] In the description of the present application, it should be noted that unless otherwise specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between the two elements inside. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0073] In the description of the present application, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0074] The above is only part of the embodiments of the present application, and it should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present application, a number of improvements and refinements can also be made, and these improvements and refinements should also be considered as within the scope of protection of the present application.

Claims

1. A gas inlet device of a semiconductor processing apparatus, disposed at a top of a process chamber of the semiconductor processing apparatus, for inputting a process gas into the process chamber, characterized in that, The utility model relates to an air inlet device for a process chamber, comprising: an air inlet block assembly and a plurality of connecting assemblies, each of which is made of a corrosion-resistant material; the air inlet block assembly has a mixing cavity, a gas delivery channel and a gas mixing channel formed therein, the air inlet block assembly is sealingly connected to an upper cover of the process chamber, a gas inlet of the gas delivery channel is in communication with the mixing cavity, a gas outlet of the gas delivery channel is in communication with the process chamber, a plurality of gas inlets of the gas mixing channel are formed on an outer surface of the air inlet block assembly, and a gas outlet of the gas mixing channel is in communication with the mixing cavity; the plurality of connecting assemblies are arranged on the air inlet block assembly and in one-to-one correspondence with the plurality of gas inlets of the gas mixing channel, and are respectively used for connecting a plurality of process gas supply sources to selectively introduce or stop introducing process gas into the gas mixing channel; the air inlet block assembly comprises a first air inlet block, a second air inlet block and a third air inlet block which are sealingly connected in sequence, and the first air inlet block is sealingly connected to the upper cover of the process chamber; the gas delivery channel is formed in the first air inlet block and the second air inlet block, and the mixing cavity is formed between the second air inlet block and the third air inlet block; and the gas mixing channel is formed in the second air inlet block and the third air inlet block.

2. The air intake device of claim 1, wherein The air inlet block assembly is made of aluminum.

3. The air intake device of claim 1, wherein The air inlet device further comprises a temperature control assembly arranged in the first air inlet block, the second air inlet block and the third air inlet block for detecting and controlling the temperature of the first air inlet block, the second air inlet block and the third air inlet block.

4. The air intake device of claim 1, wherein The gas delivery channel comprises a first gas delivery branch and a second gas delivery branch; the first gas delivery branch comprises a first vertical channel and a first horizontal channel which are in communication with each other and are formed in the first air inlet block, the first vertical channel extends along the length direction of the first air inlet block, and the first horizontal channel extends along the radial direction of the first air inlet block; the first vertical channel is in communication with the process chamber, and the first horizontal channel is in communication with the second gas delivery branch; the second gas delivery branch comprises two second horizontal channels which are in communication with each other and are formed in the second air inlet block, both of the second horizontal channels extend along the radial direction of the second air inlet block, one of the second horizontal channels is in communication with the first horizontal channel, and the other second horizontal channel is in communication with the mixing cavity.

5. The air intake device of claim 1, wherein A mixing groove is formed on one side surface of the third air inlet block, and the opening of the mixing groove is sealingly connected to the side surface of the second air inlet block to form the mixing cavity.

6. The air intake device of claim 1, wherein The gas mixing passage comprises a first gas mixing branch, a connecting branch and a plurality of second gas mixing branches; the first gas mixing branch comprises a third horizontal passage and a fourth horizontal passage which are formed in the third gas inlet block and are in communication with each other, the third horizontal passage and the fourth horizontal passage are both arranged along the radial direction of the third gas inlet block, the third horizontal passage is in communication with the gas mixing cavity, and the fourth horizontal passage extends to the side surface of the third gas inlet block; the connecting branch comprises a sixth horizontal passage formed in the third gas inlet block and a seventh horizontal passage formed in the second gas inlet block, the sixth horizontal passage and the seventh horizontal passage are arranged in communication with each other, and the sixth horizontal passage and the fourth horizontal passage are in communication with each other; the plurality of second gas mixing branches comprise a plurality of fifth horizontal passages which are respectively formed in the second gas inlet block and the third gas inlet block, the fifth horizontal passages formed in the third gas inlet block are in communication with the sixth horizontal passage, and the fifth horizontal passages formed in the second gas inlet block are in communication with the seventh horizontal passage.

7. The air intake device of claim 3, wherein The temperature control assembly comprises a heating component and a first temperature measuring component, the heating component and the first temperature measuring component are arranged in the first gas inlet block, the second gas inlet block and the third gas inlet block, and the first temperature measuring component is electrically connected with the heating component; the first temperature measuring component is used for detecting the temperature of the first gas inlet block, the second gas inlet block and the third gas inlet block, and controlling the heating power of the heating component according to the temperature.

8. The air intake device of claim 7, wherein The temperature control assembly further comprises a second temperature measuring component, the second temperature measuring component is arranged in the first gas inlet block, the second gas inlet block and the third gas inlet block, and is used for detecting the temperature of the first gas inlet block, the second gas inlet block and the third gas inlet block.

9. The air intake device of any one of claims 1 to 8, wherein The connecting assembly comprises a connecting piece made of hastelloy and a valve, one end of the connecting piece is in sealing connection with the gas inlet of the gas mixing passage, the other end is in sealing connection with the valve, the valve is used for being connected with the process gas supply source and selectively connecting or disconnecting the gas mixing passage and the process gas supply source.

10. The air intake device of claim 9, wherein The connecting assembly further comprises a pressing piece and a sealing joint, the pressing piece comprises two half-ring-shaped sub-pressing pieces, the two sub-pressing pieces are arranged opposite to each other on the outer periphery of the connecting piece and are connected with the gas inlet block assembly, and are used for pressing the connecting piece on the gas inlet block assembly; the connecting piece is in sealing connection with the valve through the sealing joint.

11. A semiconductor process apparatus, characterized by comprising: The process chamber and the gas inlet device as claimed in any one of claims 1 to 10 are provided.

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