Circuit board assembly and corresponding camera module

Abstract

The present application relates to a kind of circuit board assembly, it includes: photosensitive chip;And circuit board, it includes hard board, connector and flexible connecting band group, wherein the flexible connecting band group includes multiple sub connecting bands, the sub connecting band is made based on FPC process, and there is gap between adjacent sub connecting bands, and the two ends of each sub connecting band are connected with hard board and connector respectively;The photosensitive chip is installed on the hard board, and the connector is adapted to be electrically connected with the mainboard of electronic equipment.The present application also provides corresponding camera module.The present application can reduce the resistance of hard board movement, and is especially suitable for photosensitive chip anti-shake function or camera module based on gimbal anti-shake.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera modules, in particular, the present application relates to a kind of circuit board assembly and corresponding camera module. BACKGROUND

[0002] Mobile phone camera module is one of the important components of intelligent equipment, its application range and application quantity in market are growing continuously. With the progress of technology, whether work or life is advocating intelligent, and one of the important prerequisites for realizing intelligent is to realize good interaction with external environment, and one of the important ways to realize good interaction is visual perception, and visual perception mainly depends on camera module. It can be said that camera module has changed from the unknown intelligent equipment accessory to one of the key components of intelligent equipment.

[0003] In order to obtain more high-quality and stable image information, the function and structure of camera module are continuously improved and optimized in continuous development. For example, the demand for high image quality requires larger photosensitive element design and supporting module design, and larger photosensitive element will result in higher sensitivity of the whole module, which requires a module with higher stability to realize camera function. The existing camera module is pursuing high-precision and high-quality shooting mode, which requires a camera module design that can effectively resist external interference, especially in resisting shaking, which is one of the development hotspots of camera module at present and in the future. Anti-shake requires certain directional movement of one or more components in the camera module to compensate for the shaking offset.

[0004] The traditional optical anti-shake technology is to move the optical lens through the optical actuator to compensate for the shaking of the mobile phone (or other electronic devices used for shooting), so as to realize the effect of optical image stabilization (OIS), that is, optical anti-shake. However, under the current development trend, the weight and size of the lens of the camera module are getting larger and larger, which requires the size of the driving elements and corresponding structural elements of the driven lens to be continuously increased. Therefore, an optical anti-shake technology based on chip movement is proposed. Since the photosensitive chip or the circuit board assembly containing the photosensitive chip has a smaller weight, the optical anti-shake technology of moving the photosensitive chip will help to reduce the size of the camera module.

[0005] However, the traditional circuit board assembly is designed on the premise that the photosensitive chip is fixed. Specifically, Figure 1 A top view schematic diagram of a typical conventional circuit board assembly in the prior art is shown. The typical conventional circuit board assembly includes a circuit board and a photosensitive chip mounted on the circuit board. Referring to Figure 1The circuit board generally comprises a hard board 10 (PCB board), a soft board 20 (FPC board) and a connector 30. The connector 30 has an array of pins for plugging into and electrically connecting with the main board of a mobile phone. The soft board 20 serves as a connecting band between the hard board 10 and the connector 30. The photosensitive chip 40 can be attached to the surface of the hard board 10 (note that the photosensitive chip 40 can also be mounted on the hard board 10 in other ways). Due to the high image quality of the current camera module, the image data often needs more signal lines to be output externally, so the soft board 20 as a connecting band has a certain width. When the photosensitive chip 40 needs to move (for example, to move for anti-shake), the hard board 10 fixed with it also needs to move together. However, the wider flexible connecting band will hinder such movement, thereby causing the anti-shake response speed of the camera module to decrease, and may also cause the precision of the anti-shake movement to decrease.

[0006] Therefore, there is an urgent need for a flexible connecting band optimization solution that can better adapt to the anti-shake movement of the circuit board assembly. SUMMARY

[0007] The purpose of the present application is to overcome the shortcomings of the prior art and provide a flexible connecting band optimization solution that can better adapt to the anti-shake movement of the circuit board assembly.

[0008] To solve the above technical problems, the present application provides a circuit board assembly, comprising: a photosensitive chip; and a circuit board comprising a hard board, a connector and a flexible connecting band group, wherein the flexible connecting band group comprises a plurality of sub-connecting bands, the sub-connecting bands are made based on the FPC process, and have gaps between adjacent sub-connecting bands, and both ends of each sub-connecting band are connected to the hard board and the connector respectively; the photosensitive chip is mounted on the hard board, and the connector is adapted to be electrically connected with the main board of an electronic device.

[0009] The gap between adjacent sub-connecting bands is at least 0.5 mm.

[0010] The hard board is a PCB board made by a lamination process, and the sub-connecting bands are introduced into the hard board from the side and combined with the hard board by a lamination process.

[0011] The hard board has a plurality of wiring layers at different levels, and the plurality of sub-connecting bands are connected to the hard board from at least two wiring layers at different levels of the hard board.

[0012] The plurality of sub-connecting strips include a plurality of first sub-connecting strips and a plurality of second sub-connecting strips, the hard plate has a first wiring layer at a first height and a second wiring layer at a second height, the plurality of first sub-connecting strips are connected to the hard plate from the first height of the side of the hard plate and are electrically connected to the first wiring layer, and the plurality of second sub-connecting strips are connected to the hard plate from the second height of the side of the hard plate and are electrically connected to the second wiring layer.

[0013] The difference between the first height and the second height is not less than 0.2 mm.

[0014] The circuit board is a hard-soft combined board, and the hard plate and the plurality of sub-connecting strips are integrally formed based on a lamination process.

[0015] The plurality of sub-connecting strips are attached to the edge region of the surface of the hard plate through conductive glue.

[0016] The plurality of first sub-connecting strips are attached to the edge region of the upper surface of the hard plate through conductive glue, and the plurality of second sub-connecting strips are attached to the edge region of the lower surface of the hard plate through conductive glue.

[0017] In a top view, the first sub-connecting strips are arranged at gap positions between adjacent second sub-connecting strips, and the second sub-connecting strips are arranged at gap positions between adjacent first sub-connecting strips.

[0018] At least one wiring layer of the hard plate and the plurality of sub-connecting strips are integrally formed, and the side of the wiring layer integrally formed with the plurality of sub-connecting strips is flush with the side of the hard plate on the side of the hard plate connected to the sub-connecting strips.

[0019] At least one wiring layer of the hard plate and the plurality of sub-connecting strips are integrally formed, and the side of the wiring layer integrally formed with the plurality of sub-connecting strips is recessed inward relative to the side of the hard plate on the side of the hard plate connected to the sub-connecting strips, so that part of the sub-connecting strips extends into the hard plate.

[0020] At least one wiring layer of the hard plate and the plurality of sub-connecting strips are integrally formed, and the side of the wiring layer integrally formed with the plurality of sub-connecting strips protrudes from the side of the hard plate on the side of the hard plate connected to the sub-connecting strips, forming a protruding portion.

[0021] The first wiring layer and the plurality of first sub-connection bands are integrally formed; the second wiring layer and the plurality of second sub-connection bands are integrally formed; the first wiring layer and the second wiring layer are combined with other functional layers of the hard plate through a lamination process to form a PCB plate, and the plurality of first sub-connection bands and the plurality of second sub-connection bands are connected to the hard plate from different heights on the side surface of the hard plate.

[0022] According to another aspect of the present application, a camera module is also provided, which comprises a photosensitive assembly, a lens assembly fixed to the photosensitive assembly, and a gimbal optical actuator for driving the photosensitive assembly and the lens assembly to move as a whole; the photosensitive assembly comprises the circuit board assembly in any of the preceding aspects, and a filter and a filter support; the filter support is mounted or formed on the surface of the circuit board of the circuit board assembly, and the filter support surrounds the photosensitive chip.

[0023] According to still another aspect of the present application, a camera module is also provided, which comprises the circuit board assembly in any of the preceding aspects, a chip-end optical actuator for driving the circuit board assembly to move, and a lens assembly mounted on the static component of the chip-end optical actuator.

[0024] The chip-end optical actuator comprises an actuator housing as the static component, a chip carrier as the dynamic component, a suspension system connecting the chip carrier and the actuator housing, and a driving element, the suspension system suspends the chip carrier in the actuator housing; the circuit board assembly is mounted on the chip carrier.

[0025] The suspension system is an elastic element, and an electric lead wire is made on the elastic element, the electric lead wire connects the circuit board assembly with a second circuit board fixed to the actuator housing, and the second circuit board is electrically connected with the connector through a second connection band.

[0026] The electric lead wire made on the elastic element comprises a power supply line for supplying power to the circuit board assembly and / or a lead wire for applying a driving current to the driving element.

[0027] The driving element comprises a magnet and a coil; in a top view, the coil is mounted at the position of the four-corner region of the circuit board assembly.

[0028] The camera module further comprises a driving signal control unit for controlling the circuit board assembly to adjust the inclination angle relative to the optical axis of the lens assembly.

[0029] Compared with the prior art, the present application has at least one of the following technical effects:

[0030] 1. The flexible connecting strip is divided into multiple sub-connecting strips with gaps, so as to reduce the resistance of the hard board moving.

[0031] 2. In some embodiments of the present application, the sub-connecting strips are directly connected to the side of the hard board without transition, that is, the flexible connecting strip group at the side of the hard board has a divided surface type, so as to reduce the resistance of the hard board moving at the connection between the sub-connecting strips and the hard board.

[0032] 3. In some embodiments of the present application, the end region of each sub-connecting strip is separated, that is, the end region of each sub-connecting strip is not fused together, but has a gap in the width direction. Therefore, the part of the flexible connecting strip group extending into the hard board can provide additional buffer for the relative displacement of each sub-connecting strip and the hard board, so as to further reduce the resistance of the hard board moving caused by the sub-connecting strips.

[0033] 4. In some embodiments of the present application, multiple sub-connecting strips can be merged together through the protruding part, and then connected to the hard board. This design is beneficial to reduce the difficulty of the soft and hard combination board lamination process, so as to reduce the production cost, improve the yield and production efficiency. And because the protruding part can form a transition zone between the flexible connecting strip group and the hard board, it can also help to improve the structural reliability of the circuit board.

[0034] 5. In some embodiments of the present application, the sub-connecting strips are arranged in two layers or more layers, so that the position of the sub-connecting strips connected to the hard board avoids the corner area of the hard board, and thus the resistance of the hard board moving is further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 A top view of a typical conventional circuit board assembly in the prior art is shown;

[0036] Figure 2 A top view of a circuit board assembly according to an embodiment of the present application is shown;

[0037] Figure 3a A schematic diagram of a soft and hard combination board according to a technical route is shown;

[0038] Figure 3b Another soft and hard combination board according to another technical route is shown;

[0039] Figure 4 A schematic diagram of the hard board profile and the level of the flexible connecting strip group according to an embodiment of the present application is shown from the top view;

[0040] Figure 5Fig. 6 shows a schematic diagram of the contrast between the profile of the hard board and the level of the flexible connecting band set in a top view of another embodiment of the present application;

[0041] Figure 6 Fig. 7 shows a schematic diagram of the contrast between the profile of the hard board and the level of the flexible connecting band set in a top view of yet another embodiment of the present application;

[0042] Figure 7 Fig. 8 shows a schematic diagram of the contrast between the profile of the hard board and the level of the flexible connecting band set in a top view of still another embodiment of the present application;

[0043] Figure 8 Fig. 9 shows a schematic diagram of the side view of the circuit board based on conductive adhesive in one embodiment of the present application;

[0044] Figure 9 Fig. 10 shows a schematic diagram of the side view of the camera module in one embodiment of the present application. DETAILED DESCRIPTION

[0045] For a better understanding of the present application, various aspects of the present application will be described in greater detail below with reference to the accompanying drawings. It is to be understood that the detailed description is merely descriptive of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Throughout the specification, like reference numerals refer to like elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0046] It should be noted that the expressions first, second, etc. are used in this specification only to distinguish one feature from another, and do not indicate any limitation on the features. Thus, the first subject discussed below can also be referred to as the second subject without departing from the teachings of the present application.

[0047] In the drawings, the thickness, size, and shape of objects have been exaggerated slightly for ease of explanation. The drawings are merely examples and are not strictly drawn to scale.

[0048] It should also be understood that the expressions "comprise", "comprising", "have", "having", "contain", and / or "containing", when used in this specification, indicate the presence of stated features, integers, steps, operations, elements, and / or components but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. In addition, when expressions such as "at least one of" appear alongside a list of two or more items, they are used to indicate that every item in the list can be present or omitted along with one or more other items from the list. Furthermore, when describing embodiments of the present application, the expression "may" indicates that "one or more embodiments of the present application". Also, the expression "exemplary" is intended to mean example or illustrative.

[0049] As used herein, the terms "substantially," "almost," and like terms are used as terms of approximation and not as terms of degree, and are intended to account for the inherent deviations in measured and calculated values that would be recognized by those of ordinary skill in the art.

[0050] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an overly idealized or overly formal sense unless expressly so defined herein.

[0051] It should be noted that the embodiments and features of the embodiments in the present application can be combined with each other without conflict.

[0052] The present application will be further described with reference to the drawings and specific embodiments.

[0053] According to an embodiment of the present application, a circuit board assembly is provided, which includes a photosensitive chip and a circuit board. Figure 2A schematic top view of a circuit board assembly of one embodiment of the present application is shown. The circuit board assembly can include a hard board 10, a connector 30, and a flexible connection strip group. The flexible connection strip group includes a plurality of sub-connection strips 21, which are made based on FPC technology and have gaps 21a between adjacent sub-connection strips 21. Each of the sub-connection strips 21 has two ends connected to the hard board 10 and the connector 30, respectively. A photosensitive chip 40 is mounted on the hard board 10, and the connector 30 is adapted to be electrically connected to a main board of an electronic device (e.g., a mobile phone). The circuit board assembly of the present embodiment is used in a camera module. Compared with a conventional circuit board assembly of a camera module, the soft board part of the present embodiment is optimized, so that the anti-shake movement of the hard board and the photosensitive chip mounted thereon has less resistance and higher accuracy. In the present embodiment, the plurality of sub-connection strips 21 can be arranged in parallel, and the gap 21a between adjacent sub-connection strips 21 in the width direction can be 0.5 mm. In other embodiments, the gap 21a between adjacent sub-connection strips 21 can also be greater than 0.5 mm. However, it should be noted that when the number and width of the sub-connection strips 21 are large, the gap between adjacent sub-connection strips should not be too large to prevent the total width of the flexible connection strip group from being too large. In this context, the total width of the flexible connection strip group refers to the total width W including the gaps 21a between the sub-connection strips. In the present embodiment, in the flexible connection strip group, the plurality of gaps divide the soft board into a plurality of independent local regions (i.e., a plurality of independent sub-connection strips), so that the stress and deformation between the plurality of local independent regions are relatively independent and do not interfere with each other. In this way, the stress of each sub-connection strip is difficult to accumulate together, so that the flexible connection strip group can avoid exerting excessive stress on the moved hard board, thereby reducing the movement resistance of the hard board.

[0054] Further, in one embodiment of the present application, the hard board is a PCB board made by a lamination process, and the sub-connection strips are introduced from the side of the hard board and combined with the hard board by the lamination process. The PCB board is usually a multi-layer board having a plurality of wiring layers, and the wiring layers of different levels generally have an insulating material layer therebetween. Specifically, the PCB board is designed and produced by a laminated structure. The laminated structure is a plurality of material layers of different types and thicknesses combined together by processes such as pressing and baking, forming a circuit board shape. When the total thickness of the multi-layer board is large, the circuit board will be rigid, thereby constituting a hard board. The soft board usually has fewer levels and thicknesses, and is flexible (or elastic), i.e., compared with the hard board, the soft board is easy to deform.

[0055] In Figure 2 In the embodiment shown, all the sub-connection strips constituting the flexible connection strip group can be arranged at the same level, i.e., all the sub-connection strips are introduced into the hard board from the same height of the side of the hard board.

[0056] In the present application, the sub-connection strips are not only mechanically connected to the hard board, but also electrically connected to the hard board. In some embodiments, the circuit board is a rigid-flexible combined board, and the hard board and the plurality of sub-connection strips are integrally formed based on a lamination process. That is, in the present embodiment, the soft board and the hard board can be integrally formed by lamination during the manufacturing process. The end regions of the sub-connection strips can extend into the side surface of the hard board between the different height material layers of the hard board, so as to complete the conduction and fixation of the soft board and the hard board. The soft board in this case is the sub-connection strip, and the width and / or thickness of the sub-connection strip is generally smaller than that of a conventional soft board. However, the manufacturing process of the sub-connection strip is consistent with that of the conventional soft board, and thus the sub-connection strip can also be regarded as a special soft board. For the convenience of description, the manufacturing process of the soft board can be referred to as the FPC process. Figure 3a A schematic diagram of a rigid-flexible combined board is shown. Referring to Figure 3a The flexible sub-connection strip 21 based on the FPC process can extend into the interior of the hard board 10 from the side surface of the hard board 10, and the end 22 of the sub-connection strip 21 is located at the edge region of the hard board 10. At the same level as the sub-connection strip 21 in the hard board 10, the filling material 11 can be used for filling. The upper surface of the extending portion 23 of the sub-connection strip 21 can contact and electrically connect to the first wiring layer 12 located above the extending portion 23, and the lower surface of the extending portion 23 of the sub-connection strip 21 can contact and electrically connect to the second wiring layer 13 located below the extending portion 23.

[0057] Figure 3b Another rigid-flexible combined board is shown. Referring to Figure 3b In another embodiment of the present application, one of the wiring layers 14 of the hard board 10 is integrally formed with the plurality of sub-connection strips 21. Figure 4 A schematic diagram of the profile of the hard board and the level of the flexible connection strip group in a top view is shown in an embodiment of the present application. Referring to Figure 4 In the present embodiment, on the side of the hard board 10 connected to the sub-connection strip 21, the side of the wiring layer 14 integrally formed with the plurality of sub-connection strips 21 is flush with the side surface of the hard board 10 (i.e., the side surface of the other material layers of the hard board, which is the profile 15 of the side surface of the hard board in the top view). In the present embodiment, the sub-connection strip 21 is directly connected to the side surface of the hard board 10 without transition, that is, the flexible connection strip group at the position of the side surface of the hard board 10 already has a divided surface shape, so as to reduce the resistance to the movement of the hard board 10 at the connection between the sub-connection strip 21 and the hard board 10.

[0058] Further, Figure 5 A schematic diagram of the profile of the hard board and the level of the flexible connection strip group in a top view is shown in another embodiment of the present application. In the present embodiment, the rigid-flexible combined board can adoptFigure 3a The end regions of the plurality of sub-connecting strips 21 can be fused together to form an insertion portion 23 that extends into the rigid board 10. The upper surface of the insertion portion 23 can contact and electrically connect with the first wiring layer 12 above it, and the lower surface of the insertion portion 23 of the sub-connecting strip 21 can contact and electrically connect with the second wiring layer 13 below it (see Figure 3a ). The same level within the rigid board 10 as the sub-connecting strip 21 (i.e. the insertion portion 23) can be filled with the filling material 11.

[0059] Further, Figure 6 A comparison diagram of the profile of the rigid board and the level of the flexible connecting strip group in another embodiment of the present application is shown in the top view. Referring to Figure 6 , in this embodiment, one of the wiring layers 14 of the rigid board 10 is integrally formed with the plurality of sub-connecting strips 21 (see Figure 3b ). On the side of the rigid board 10 where the sub-connecting strips 21 are connected, the side surface of the wiring layer 14 (i.e. the wiring layer integrally formed with the plurality of sub-connecting strips) is recessed inward relative to the side surface of the rigid board 10, so that a portion of the sub-connecting strips 21 (i.e. the end regions 21b of the sub-connecting strips 21) extends into the rigid board. In this embodiment, the end regions 21b of the sub-connecting strips 21 are separated, i.e. the end regions 21b of the sub-connecting strips 21 are not fused together, but have a gap 21a in the width direction. Therefore, the portion of the flexible connecting strip group that extends into the rigid board can provide additional cushioning for the relative displacement of the sub-connecting strips and the rigid board, thereby further reducing the resistance caused by the sub-connecting strips to the movement of the rigid board.

[0060] Further, Figure 7 A comparison diagram of the profile of the rigid board and the level of the flexible connecting strip group in another embodiment of the present application is shown in the top view. Referring to Figure 7 , in this embodiment, at least one of the wiring layers 14 of the rigid board 10 is integrally formed with the plurality of sub-connecting strips 21 (see Figure 3b ). On the side of the rigid board 10 where the sub-connecting strips 21 are connected, the side surface of the wiring layer 14 (i.e. the wiring layer integrally formed with the plurality of sub-connecting strips) protrudes from the side surface of the rigid board 10, so that the wiring layer 14 forms a protruding portion 14a. The protruding portion 14a can be continuous (i.e. without a gap), and the width of the protruding portion 14a (in the top view) can be equal to the total width W of the flexible connecting strip group formed by the sub-connecting strips 21 (see Figure 2) consistent, can also be slightly larger than the total width W of the flexible connecting band group. In this embodiment, the plurality of sub-connecting bands 21 can be converged together through the protruding portion 14a, and then connected to the hard board 10. This design helps to reduce the difficulty of the soft and hard combination board lamination process, thereby reducing production costs, improving yield and production efficiency. And because the protruding portion can form a transition zone between the flexible connecting band group and the hard board, it can also help to improve the structural reliability of the circuit board.

[0061] It should be noted that the soft and hard combination board process is not the only way to implement the soft board (flexible connecting band group) and hard board connection of the present application. In other embodiments of the present application, the PCB and FPC boards can be made separately, and then the FPC board can be attached to the surface of the PCB board using conductive adhesive to achieve electrical connection between the two. Figure 8 A side view schematic diagram of a circuit board based on conductive adhesive paste according to an embodiment of the present application is shown. Referring to Figure 8 In this embodiment, the plurality of sub-connecting bands 21 constituting the flexible connecting band group are attached to the edge area of the surface of the hard board 10 by conductive adhesive 24. It should be noted that the circuit board of the connector part can also be implemented based on the manufacturing process of the PCB board, so the conductive adhesive paste process can also be used to electrically connect the connector and the flexible connecting band group. Among them, the conductive adhesive can be ACF glue, that is, anisotropic conductive adhesive. By using ACF glue to bond the end regions of each sub-connecting band of the flexible connecting band group and the surface of the hard board, and pressing them together, conduction and fixation can be achieved.

[0062] In the above embodiment, the flexible connecting band group is composed of a plurality of sub-connecting bands in the same layer. However, the present application is not limited to this. For example, in order to reduce the total width of the flexible connecting band group, the sub-connecting bands can be arranged in two layers or more. That is, in some embodiments of the present application, the plurality of sub-connecting bands constituting the flexible connecting band group can be connected to the hard board from at least two different heights on the side of the hard board. It should be noted that in a camera module, the photosensitive chip often needs more I / O channels to output high-quality image data, so in a traditional camera module, the soft board of the circuit board assembly has a certain width to arrange a sufficient number of data I / O channels on the soft board. In the present application, the soft board is divided into a flexible connecting band group with a plurality of sub-connecting bands, and due to the gaps between the plurality of sub-connecting bands, the total width of the flexible connecting band group with gaps may increase. Excessive total width may cause some sub-connecting bands 21 located on the outside to need to be connected from the proximity angle area 10a (referring to the corner area of the hard board under the top view angle, which can be combined with Figure 2) to the hard board 10. In some preferred embodiments of the present application, the sub-connection strips 21 are arranged in two layers or more layers, so that the positions of the sub-connection strips 21 to the hard board 10 are away from the corner areas of the hard board 10, thereby better reducing the resistance of the hard board 10 to move.

[0063] Further, in an embodiment of the present application, the sub-connection strips of the flexible connection strip group can be divided into two groups. Specifically, the plurality of sub-connection strips can include a plurality of first sub-connection strips (i.e., a first group of sub-connection strips) and a plurality of second sub-connection strips (i.e., a second group of sub-connection strips). The hard board has a first wiring layer at a first height and a second wiring layer at a second height, the plurality of first sub-connection strips access the hard board from the first height of the side of the hard board and are electrically connected to the first wiring layer, and the plurality of second sub-connection strips access the hard board from the second height of the side of the hard board and are electrically connected to the second wiring layer. In this embodiment, the difference between the first height and the second height is not less than 0.2 mm. It should be noted that the difference between the first height and the second height here refers to the distance from the upper surface of the first sub-connection strip to the upper surface of the second sub-connection strip, or the distance from the lower surface of the first sub-connection strip to the lower surface of the second sub-connection strip. That is, the thickness of the sub-connection strip itself cannot be ignored. Assuming that the thickness of the sub-connection strip (i.e., the soft board) itself is 0.1 mm, the gap between the bottom surface of the first group of sub-connection strips and the second group of sub-connection strips in the thickness direction is not less than 0.1 mm. At this time, the difference between the first height and the second height is not less than 0.2 mm.

[0064] Further, in an embodiment of the present application, in a top view, the first sub-connection strips are arranged at the gap positions between adjacent second sub-connection strips, and the second sub-connection strips are arranged at the gap positions between adjacent first sub-connection strips. That is, in a top view, the first sub-connection strips and the second sub-connection strips can be arranged staggered with each other instead of being overlapped. This design can better inhibit stress accumulation caused by the interference between sub-connection strips of different layers. Inhibition of stress accumulation will effectively reduce the resistance of the hard board to move.

[0065] Further, in an embodiment of the present application, the adhesion and fixation of the multi-layer sub-connection strips to the hard board can be achieved by using the process of conductive adhesive. Specifically, in this embodiment, the plurality of first sub-connection strips can be attached to the edge area of the upper surface of the hard board by conductive adhesive, and the plurality of second sub-connection strips can be attached to the edge area of the lower surface of the hard board by conductive adhesive. In this design scheme, the first sub-connection strips and the second sub-connection strips can have a larger gap in the thickness direction, thereby better inhibiting stress accumulation caused by the interference between sub-connection strips of different layers. Inhibition of stress accumulation will effectively reduce the resistance of the hard board to move.

[0066] Further, in one embodiment of the present application, the multi-layer sub-connection strips can be bonded and fixed to the hard board by using a rigid-flexible board manufacturing process. Specifically, in this embodiment, the first wiring layer and the plurality of first sub-connection strips are integrally formed; the second wiring layer and the plurality of second sub-connection strips are integrally formed; the first wiring layer and the second wiring layer are combined with other functional layers of the hard board by a lamination process to form a PCB board, and the plurality of first sub-connection strips and the plurality of second sub-connection strips are connected to the hard board from different heights on the side surface of the hard board.

[0067] Further, in a series of embodiments of the present application, a camera module based on the above-mentioned circuit board assembly is also provided. The camera module can include a photosensitive assembly, a lens assembly fixed to the photosensitive assembly, and a gimbal optical actuator. The gimbal optical actuator is used to drive the photosensitive assembly and the lens assembly to move as a whole. The photosensitive assembly can include the circuit board assembly in any of the preceding embodiments, and a filter and a filter support. The filter support is mounted or formed on the surface of the circuit board of the circuit board assembly, and the filter support surrounds the photosensitive chip. In this embodiment, the filter support can be a molded part molded directly on the surface of the circuit board (hard board), and the filter, the molded part, the photosensitive chip, and the hard board of the circuit board can form a package that encapsulates the photosensitive chip inside, thereby protecting the photosensitive chip.

[0068] Further, in another series of embodiments of the present application, a chip-controllable movement camera module based on the above-mentioned circuit board assembly is also provided. The controllable movement photosensitive chip can be used to realize the anti-shake function of the camera module, so the chip-controllable movement camera module can also be called chip anti-shake camera module. Figure 9 A side view cross-sectional schematic diagram of a camera module in one embodiment of the present application is shown. Referring to Figure 9The camera module may include: a circuit board assembly (including a circuit board 330 and a photosensitive chip 40) as described in any of the preceding embodiments, a chip-side optical actuator 100, and a lens assembly 200 mounted on a static component of the chip-side optical actuator. The chip-side optical actuator 100 is used to drive the circuit board assembly to move. In this embodiment, a filter 310 and a filter holder 320 may be mounted on the circuit board assembly. The filter holder 320 is mounted or formed on the surface of the circuit board 330 of the circuit board assembly, and the filter holder 320 surrounds the photosensitive chip 40. In this embodiment, the filter holder 320 may be a molding portion directly molded on the surface of the circuit board 330 (actually a rigid board 10). The filter, the molding portion, the photosensitive chip, and the rigid board of the circuit board may constitute a package that encapsulates the photosensitive surface of the photosensitive chip 40 inside, thereby protecting the photosensitive chip 40. For ease of description, the package consisting of the filter, molding part, photosensitive chip, and rigid circuit board in this embodiment is referred to as a chip package. In this embodiment, the chip-side optical actuator actually drives the chip package as a whole to move (e.g., anti-shake movement). The circuit board 330 may be composed of the rigid board 10, the sub-connecting strip 21, and the connector 30. Figure 9 Only one sub-connecting strip is shown, but it should be noted that this embodiment has multiple sub-connecting strips, which together constitute a flexible connecting strip group. Connector 30 can be electrically connected to the mobile phone motherboard 400. In this embodiment, the rigid board 10 does not rest against the mobile phone motherboard 400 to allow for anti-shake movement of the circuit board assembly. Figure 9 The x-axis and z-axis directions are shown, and the y-axis direction is perpendicular to the paper. The y-axis is not shown in the diagram. Figure 9 It is shown directly in the text.

[0069] Further, refer to Figure 9 In this embodiment, the chip-side optical actuator includes: an actuator housing as a static component, a chip carrier as a dynamic component, a suspension system connecting the chip carrier and the actuator housing, and a drive element. Figure 9In the figure, only the actuator housing is shown, and the chip carrier, suspension system, and driving element are not shown. The suspension system suspends the chip carrier in the actuator housing. The circuit board assembly is mounted on the chip carrier. The suspension system can be an elastic element (e.g., a spring), and an electrically conductive wire can be formed on the elastic element. The electrically conductive wire connects the circuit board assembly to a second circuit board fixed to the actuator housing, and the second circuit board is electrically connected to the connector through a second connection ribbon. The electrically conductive wire formed on the elastic element can include a power supply line for supplying power to the circuit board assembly and / or a wire for supplying driving current to the driving element. The electrically conductive wire formed on the elastic element can introduce a part of the circuit from the static component circuit to the dynamic component, thereby reducing the number of wires that need to be introduced from the flexible connection ribbon group, and further reducing the number of sub-connection ribbons and the width of the sub-connection ribbons. Further, using the spring to conduct the power supply line and the driving current of the coil can help to distribute the wider circuit that needs to be designed in the soft board from the soft board (flexible connection ribbon group), thereby helping to reduce the total width (including the gap) of the flexible connection ribbon group.

[0070] Further, in an embodiment of the present application, the driving element can include a magnet and a coil, and in a top view, the coil is mounted at a position of a corner region of the circuit board assembly. The camera module further includes a driving signal control unit for controlling the circuit board assembly to perform tilt adjustment relative to the optical axis of the lens assembly. That is, the circuit board assembly can perform tilt movement (tilt movement refers to rotation of the photosensitive chip around the x-axis or the y-axis, which can be combined with reference to Figure 9 ). The movement of the circuit board assembly refers to the movement of the part (i.e., the hard board and the photosensitive chip and other components fixed thereto) on which the photosensitive chip is mounted. A reference plane parallel to the photosensitive surface of the photosensitive chip is provided. The reference plane has two mutually perpendicular coordinate axes, x-axis and y-axis, so that the tilt movement is the rotation movement in two degrees of freedom, i.e., rotation around the x-axis and rotation around the y-axis. The corner region of the tilt movement hard board will form a larger resistance, so some embodiments in the foregoing that help to reduce the total width of the flexible connection ribbon group will have more significant effects when the chip tilt anti-shake is applied. The embodiments that help to reduce the total width of the flexible connection ribbon group can include, for example, embodiments in which the sub-connection ribbons of the flexible connection ribbon group are divided into multiple layers, embodiments in which the spring shares part of the circuit (e.g., the power supply line and / or the driving current supply line), and the like.

[0071] In some embodiments of the present application, the thickness of the hard board in the circuit board can be 0.2mm-0.45mm, and the thickness of the single-layer sub-connection strip can be 0.055mm-0.1mm. Preferably, the thickness of the single-layer sub-connection strip can be 0.055mm-0.070mm. In general, the smaller the thickness of the single-layer sub-connection strip, the smaller the resistance to the movement of the hard board. On the other hand, the thickness of the sub-connection strip should not be too small in order to ensure the structural reliability of the sub-connection strip. It should be noted that the thickness of the single-layer sub-connection strip herein refers to the overall thickness of the sub-connection strip, not the thickness of the single material layer inside the sub-connection strip. In the width direction, the gap between adjacent sub-connection strips is 0.5mm or more.

[0072] In some embodiments of the present application, the width of the single sub-connection strip can be no less than 1mm. The elastic modulus of the single sub-connection strip can be 1.5GP-5GP. An appropriate elastic modulus can ensure the shape recovery ability of the sub-connection strip. Here, the shape recovery ability refers to the ability of the sub-connection strip to return to the initial shape after the dynamic components (e.g. the hard board and the photosensitive chip thereon) complete the anti-shake movement and return to the initial position.

[0073] In some preferred embodiments, the total width of the flexible connection strip group is no more than 6mm.

[0074] In the single sub-connection strip, multiple lines can be arranged, which can be signal lines or power supply lines. The signal lines are usually arranged in pairs, i.e. the number of signal lines in the single sub-connection strip is usually even.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and not to limit it. Although the present application has been described in detail with reference to the embodiments, those skilled in the art should understand that modifications or equivalent replacements to the technical solutions of the present application do not deviate from the spirit and scope of the present application, and they should be covered in the scope of the claims of the present application.

Claims

1. A circuit board assembly, characterized in that, include: Photosensitive chip; as well as A circuit board includes a rigid board, a connector, and a flexible connecting strip assembly, wherein the flexible connecting strip assembly includes multiple sub-connecting strips, the sub-connecting strips are fabricated based on FPC technology, and there are gaps between adjacent sub-connecting strips. Each sub-connecting strip is connected to the rigid board and the connector at both ends, respectively. The photosensitive chip is mounted on the rigid board, and the connector is adapted to be electrically connected to the motherboard of an electronic device. The multiple sub-connecting strips include multiple first sub-connecting strips and multiple second sub-connecting strips. The rigid board has a first wiring layer at a first height and a second wiring layer at a second height. The multiple first sub-connecting strips are connected to the rigid board from the first height on the side of the rigid board and are electrically connected to the first wiring layer. The multiple second sub-connecting strips are connected to the rigid board from the second height on the side of the rigid board and are electrically connected to the second wiring layer.

2. The circuit board assembly according to claim 1, characterized in that, The gap between adjacent sub-connecting strips is at least 0.5 mm.

3. The circuit board assembly according to claim 1, characterized in that, The rigid board is a PCB board manufactured by lamination process, and the sub-connecting strip is introduced into the rigid board from the side and bonded to the rigid board by lamination process.

4. The circuit board assembly according to claim 3, characterized in that, The rigid board has multiple wiring layers located at different levels, and the multiple sub-connection strips are connected to the rigid board from at least two different wiring layers at different levels.

5. The circuit board assembly according to claim 1, characterized in that, The difference between the first height and the second height is not less than 0.2 mm.

6. The circuit board assembly according to claim 1, characterized in that, The circuit board is a rigid-flex board, and the rigid board and the multiple sub-connecting strips are integrally formed based on a lamination process.

7. The circuit board assembly according to claim 1, characterized in that, The multiple sub-connecting strips are attached to the edge area of ​​the rigid plate surface using conductive adhesive.

8. The circuit board assembly according to claim 1, characterized in that, The plurality of first sub-connecting strips are attached to the edge region of the upper surface of the rigid plate with conductive adhesive, and the plurality of second sub-connecting strips are attached to the edge region of the lower surface of the rigid plate with conductive adhesive.

9. The circuit board assembly according to claim 1, characterized in that, From a top-down view, the first sub-connecting strip is positioned at the gap between adjacent second sub-connecting strips, and the second sub-connecting strip is positioned at the gap between adjacent first sub-connecting strips.

10. The circuit board assembly according to claim 4, characterized in that, At least one of the wiring layers of the rigid board is integrally formed with the plurality of sub-connecting strips, and on the side of the rigid board connecting the sub-connecting strips, the side of the wiring layer integrally formed with the plurality of sub-connecting strips is flush with the side of the rigid board.

11. The circuit board assembly according to claim 4, characterized in that, At least one of the wiring layers of the rigid board is integrally formed with the plurality of sub-connecting strips. On the side of the rigid board that connects the sub-connecting strips, the side of the wiring layer integrally formed with the plurality of sub-connecting strips is recessed inward relative to the side of the rigid board, such that a portion of the sub-connecting strip extends into the rigid board.

12. The circuit board assembly according to claim 4, characterized in that, At least one of the wiring layers of the rigid board is integrally formed with the plurality of sub-connecting strips. On the side of the rigid board that connects the sub-connecting strips, the side of the wiring layer integrally formed with the plurality of sub-connecting strips protrudes from the side of the rigid board, forming a protrusion.

13. The circuit board assembly according to claim 1, characterized in that, The first wiring layer and the plurality of first sub-connecting strips are integrally formed; the second wiring layer and the plurality of second sub-connecting strips are integrally formed; the first wiring layer and the second wiring layer are combined with other functional layers of the rigid board through a lamination process to form a PCB board, and the plurality of first sub-connecting strips and the plurality of second sub-connecting strips are connected to the rigid board from different heights on the side of the rigid board.

14. A camera module, characterized in that, include: A photosensitive component, a lens assembly fixed to the photosensitive component, and a gimbal-type optical actuator for driving the overall movement of the photosensitive component and the lens assembly; The photosensitive component includes: a circuit board assembly according to any one of claims 1-13, and a filter and a filter holder; the filter holder is mounted or formed on the surface of the circuit board of the circuit board assembly, and the filter holder surrounds the photosensitive chip.

15. A camera module, characterized in that, include: The circuit board assembly according to any one of claims 1-13, and a chip-side optical actuator for driving the movement of the circuit board assembly; And a lens assembly mounted on the static component of the optical actuator at the chip end.

16. The camera module according to claim 15, characterized in that, The chip-side optical actuator includes: an actuator housing as a static component, a chip carrier as a dynamic component, a suspension system connecting the chip carrier and the actuator housing, and a drive element, wherein the suspension system suspends the chip carrier within the actuator housing; and the circuit board assembly is mounted on the chip carrier.

17. The camera module according to claim 16, characterized in that, The suspension system is an elastic element with electrical wires fabricated on it. The electrical wires connect the circuit board assembly to a second circuit board fixed to the actuator housing. The second circuit board is electrically connected to the connector via a second connecting strip.

18. The camera module according to claim 17, characterized in that, The electrical conductors fabricated on the elastic element include power lines that supply power to the circuit board assembly and / or conductors that apply drive current to the drive element.

19. The camera module according to claim 16, characterized in that, The driving element includes a magnet and a coil; in a top view, the coil is mounted at the four corners of the circuit board assembly.

20. The camera module according to claim 19, characterized in that, The camera module also includes a drive signal control unit, which controls the tilt angle adjustment of the circuit board assembly relative to the optical axis of the lens assembly.

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