Structures and electronic devices to improve connector assembly reliability

Abstract

The present invention provides a structure and electronic device for improving the reliability of connector assembly, and the structure for improving the reliability of connector assembly includes: a surface mount device, a printed circuit board, a second pad and a solder layer; a solder pin is provided on the lower surface of the surface mount device; a first pad is provided on the upper surface of the printed circuit board, the first pad is arranged corresponding to the solder pin, and the first pad is provided with a first through hole; a second pad is arranged on the upper surface of the first pad, and the size of the second pad is smaller than the size of the first pad; the second pad is provided with a second through hole, and the second through hole is connected to the first through hole; the solder layer is distributed between the solder pin and the first pad, between the solder pin and the second pad, and inside the first through hole and the second through hole. The present invention drills through holes on the first pad and the second pad, increases the contact area with the solder layer, improves the connection strength, reduces the electrical short circuit phenomenon caused by solder paste interconnection, and improves the overall reliability of the connector.

Description

Technical Field

[0001] The present invention relates to the technical field of connectors, and in particular to a structure and electronic equipment for improving connector assembly reliability. Background Art

[0002] With the launch and upgrade of Intel's Stream Platform, the transmission requirements of the fourth generation PCIE GEN4 connector, a high-speed serial computer expansion bus standard (PCIE), have evolved to PCIE GEN5 to meet the needs of the overall Internet technology market. In order to meet this technical requirement, the signal integrity of the board is also adjusted to a higher level.

[0003] In order to improve the signal performance of the entire board and meet the requirements of the launched PCIE GEN5, the use of traditional DIP (Dual inline Package) connectors will produce a via penetration effect, thereby affecting the signal integrity. In order to reduce this loss, SMD (Surface Mounted Devices) package connectors are usually used to reduce signal loss, thereby improving the overall signal integrity margin of the system. However, although the use of SMD package connectors improves signal integrity, since SMD type connectors use the metal first pads on the printed circuit board and the connector, and are connected after soldering with solder paste, they are more likely to produce reliability risks such as solder paste interconnection and electrical short circuits compared to traditional DIP package connectors.

[0004] This is a shortcoming of the prior art. Therefore, it is very necessary to provide a structure for improving the reliability of connector assembly in view of the above defects in the prior art. Summary of the invention

[0005] The present invention provides a structure and electronic equipment for improving the reliability of connector assembly, so as to solve the problem of poor reliability of SMD packaged connectors in the prior art.

[0006] The present invention provides a structure for improving the reliability of connector assembly, comprising: a surface mount device, a printed circuit board, a second soldering pad and a solder layer; a soldering pin is provided on the lower surface of the surface mount device; a first soldering pad is provided on the upper surface of the printed circuit board, the first soldering pad is arranged corresponding to the soldering pin, and the first soldering pad is provided with a first through hole; a second soldering pad is arranged on the upper surface of the first soldering pad, the size of the second soldering pad is smaller than the size of the first soldering pad; the second soldering pad is provided with a second through hole, and the second through hole is connected with the first through hole; the solder layer is distributed between the soldering pin and the first soldering pad, between the soldering pin and the second soldering pad, and inside the first through hole and the second through hole.

[0007] According to a structure for improving the reliability of connector assembly provided by the present invention, the printed circuit board is provided with a third through hole, and the third through hole is connected to the second through hole and the first through hole; a portion of the third through hole is distributed with the solder layer, and a portion is used for arranging electronic components.

[0008] According to a structure for improving the reliability of connector assembly provided by the present invention, the third through hole, the second through hole or the first through hole is partially blocked.

[0009] According to a structure for improving connector assembly reliability provided by the present invention, the third through hole, the second through hole or the partial blocking of the first through hole is achieved by electroplating hole filling processing.

[0010] According to a structure for improving connector assembly reliability provided by the present invention, inner walls of the second through hole, the first through hole, and the third through hole are smoothly connected.

[0011] According to a structure for improving the reliability of connector assembly provided by the present invention, the inner walls of the second through hole, the first through hole and the third through hole are staggered and connected.

[0012] According to a structure for improving the reliability of connector assembly provided by the present invention, the printed circuit board includes multiple printed circuit boards, and the multiple printed circuit boards are stacked in sequence; the third through holes of the multiple printed circuit boards are connected; the third through holes of the multiple printed circuit boards are all connected to the second through holes and the first through holes.

[0013] According to a structure for improving connector assembly reliability provided by the present invention, the first through hole, the second through hole and the third through hole are formed by laser drilling.

[0014] According to a structure for improving connector assembly reliability provided by the present invention, the second pad is arranged at a central position of the first pad.

[0015] According to a structure for improving connector assembly reliability provided by the present invention, the second solder pad has the same shape as the first solder pad.

[0016] According to a structure for improving connector assembly reliability provided by the present invention, both the first soldering pad and the second soldering pad are made of metal materials, and the outer sides of the first soldering pad and the second soldering pad are provided with tin plating layers.

[0017] The present invention further provides an electronic device, comprising: a structure for improving connector assembly reliability as described in any one of the above items.

[0018] The structure and electronic device for improving the reliability of connector assembly provided by the present invention, in the first aspect, by arranging the second soldering pad on the first soldering pad, the contact area between the solder layer and the soldering pin is increased, the contact area between the solder paste and the second soldering pad is increased, the more contact areas between the solder paste and the second soldering pad and the first soldering pad, the greater the connection strength between the relative surface mount device and the second soldering pad; in the second aspect, by arranging the second through hole on the second soldering pad and the first through hole on the first soldering pad, the second through hole and the first through hole are connected, the solder paste flows into the second through hole and the first through hole, the inner walls of the second through hole and the first through hole are in contact with the solder paste layer, and the connection strength between the relative surface mount device and the second soldering pad is further improved. The contact area between the solder paste layer and the second pad and the first pad is increased to improve the connection strength and enhance the overall reliability of the connector; on the third aspect, after the surface mount device is placed on the printed circuit board, the excess solder paste flows into the second through hole, the first through hole and the third through hole along the inner wall of the second through hole, the first through hole and the third through hole, thereby reducing the lateral deformation of the solder paste layer and reducing the electrical short circuit caused by the interconnection of the solder paste; on the fourth aspect, by drilling the third through hole on the printed circuit board, the electronic components of the printed circuit board can be arranged on the outer surface of the printed circuit board and in the third through hole of the printed circuit board, thereby increasing the flexibility of the layout of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is one of the structural schematic diagrams of the lifting connector assembly in the related art;

[0021] Figure 2 This is the second structural schematic diagram of the lifting connector assembly in the related art;

[0022] Figure 3 This is the third structural schematic diagram of the lifting connector assembly in the related art;

[0023] Figure 4 It is one of the schematic diagrams of a structure for improving connector assembly reliability provided by some embodiments of the present invention;

[0024] Figure 5 This is a second schematic diagram of a structure for improving connector assembly reliability provided by some embodiments of the present invention;

[0025] Figure 6 This is a third schematic diagram of a structure for improving connector assembly reliability provided by some embodiments of the present invention;

[0026] Figure 7 This is a fourth schematic diagram of a structure for improving connector assembly reliability provided by some embodiments of the present invention;

[0027] Figure 8 This is the fourth structural schematic diagram of the lifting connector assembly in the related art;

[0028] Fig. 9 This is the fifth schematic diagram of a structure for improving connector assembly reliability provided by some embodiments of the present invention.

[0029] Reference numerals:

[0030] 110: surface mount device; 111: soldering pin; 120: printed circuit board; 121: first soldering pad; 122: second soldering pad; 130: solder layer; 140: electronic components. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limitations on the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0033] In the description of the embodiments of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.

[0034] In the embodiments of the present invention, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiment of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0036] In related technologies, such as Figures 1 to 3 , Figure 8 As shown, by providing the second solder pad 122 on the first solder pad 121, the contact area between the solder layer 130 and the solder pin 111 is increased, and the solder cracking caused by the stress of assembly and plugging is avoided to a certain extent, thereby improving the overall reliability of the connector.

[0037] However, due to the addition of the second solder pad 122, the area of ​​the solder paste and the first solder pad 121 and the second solder pad 122 is increased, and the relative amount of solder paste used will also increase. Under the premise that the sizes of the first solder pad 121 and the second solder pad 122 do not change, after the surface mount device 110 is placed on the printed circuit board 120, the solder paste is squeezed and laterally deformed and elongated, which is easy to cause solder paste interconnection and cause electrical short circuit.

[0038] In view of the above-mentioned defects in the prior art, the present invention provides a structure and an electronic device for improving the reliability of connector assembly.

[0039] Combine the following Figure 4-Figure 7 , Fig. 9 The present invention describes a structure and an electronic device for improving connector assembly reliability.

[0040] like Figure 4 and Figure 5As shown, the structure for improving the reliability of connector assembly provided by the present invention includes a surface mount device 110, a printed circuit board 120, a second soldering pad 122, and a solder layer 130; a soldering pin 111 is provided on the lower surface of the surface mount device 110; a first soldering pad 121 is provided on the upper surface of the printed circuit board 120, the first soldering pad 121 is arranged corresponding to the soldering pin 111, and the first soldering pad 121 is provided with a first through hole; the second soldering pad 122 is arranged on the side of the first soldering pad 121 facing the soldering pin 111, and the size of the second soldering pad 122 is smaller than the size of the first soldering pad 121; the second soldering pad 122 is provided with a second through hole, and the second through hole is connected to the first through hole; the solder layer 130 is distributed between the soldering pin 111 and the first soldering pad 121, between the soldering pin 111 and the second soldering pad 122, and inside the first through hole and the second through hole.

[0041] The structure for improving the reliability of connector assembly provided by the present invention increases the contact area between the solder layer 130 and the solder pin 111 by setting the second solder pad 122 on the first solder pad 121, and the contact area between the solder paste and the second solder pad 122 increases. The more contact areas between the solder paste, the second solder pad 122 and the first solder pad 121, the greater the connection strength between the surface mount device 110 and the second solder pad 122. On the other hand, the second through hole is provided on the second solder pad 122, the first solder pad 121 is provided with a first through hole, and the second through hole is provided on the second solder pad 122. The first through hole is connected to the first through hole, and the solder paste flows into the first through hole and the second through hole. The inner walls of the first through hole and the second through hole are in contact with the solder paste layer, further increasing the contact area between the solder paste layer and the second solder pad 122 and the first solder pad 121, thereby improving the connection strength and the overall reliability of the connector. At the same time, after the surface mount device 110 is placed on the printed circuit board 120, the excess solder paste flows into the second through hole and the first through hole along the inner walls of the second through hole and the first through hole, thereby reducing the lateral deformation of the solder paste layer and reducing the electrical short circuit phenomenon caused by the solder paste interconnection.

[0042] In the process of mounting the surface mount device 110 and the printed circuit board 120, solder paste printing, mounting and welding are key steps that determine the quality of the connector.

[0043] The surface mount device 110 is called Surface Mounted Devices in English and its Chinese name is Surface Mount Devices, which is used to place some simple pin components.

[0044] The surface mount devices 110 mainly include rectangular chip components, cylindrical chip components, composite chip components, and special-shaped chip components.

[0045] The production process steps of surface mount devices include standard wafer manufacturing, wafer repassivation, deposition of eutectic solder bumps on I / O pads, back grinding (only for thin products), protective encapsulation coating, testing with wafer selection platform, laser marking, and packaging into tape and reel form, and finally assembly on printed circuit board 120 using standard surface mount technology (SMT).

[0046] The surface mount device is a wafer level chip size package (WLCSP), which has the following characteristics: the package size is consistent with the bare chip size, and no adapter board is required between the chip and the printed circuit board 120.

[0047] Among them, the welding pin 111 is also called a welding lead. The welding pin 111 is connected from the internal circuit of the integrated circuit (chip) to the peripheral circuit. The end of the lead is soldered to form a solder joint with the pad on the printed circuit board 120 through soft soldering.

[0048] The soldering pins 111 are distributed on the lower surface of the SMD 110 facing the PCB 120 .

[0049] The number and location of the welding pins 111 can be set according to actual conditions.

[0050] For example, a plurality of soldering pins 111 are provided along the extension direction of the surface mount device 110 , and the plurality of soldering pins 111 are symmetrically distributed on both sides of the center line of the surface mount device 110 along the center line of the surface mount device 110 .

[0051] For example, a plurality of welding pins 111 are provided, and the plurality of welding pins 111 are distributed along the extension direction of the surface mount device 110 according to the wiring requirements of the internal circuit of the integrated circuit (chip).

[0052] The printed circuit board 120 provides electrical connections for the electronic components 140 .

[0053] The printed circuit board 120 can be divided into single-layer board, double-layer board, four-layer board, six-layer board and other multi-layer boards according to the number of layers of the circuit board.

[0054] On a single-sided board, parts are concentrated on one side and wires are concentrated on the other side. The layout method is rigid and the layout space is limited.

[0055] On a double-sided board, there are traces on both sides.

[0056] Multilayer boards use more single- or double-sided wiring boards to increase the area that can be wired.

[0057] The design of the printed circuit board 120 is mainly layout design; the main advantage of using the printed circuit board 120 is that it greatly reduces wiring and assembly errors and improves the automation level and production labor rate.

[0058] The upper surface of the printed circuit board 120 facing the surface mount device 110 is provided with first pads 121 , and the number and positions of the first pads 121 correspond to the number and positions of the welding pins 111 .

[0059] The first pads 121 are basic components of the surface mount assembly and are used to form a first pad 121 pattern of the printed circuit board 120, that is, a combination of first pads 121 designed for various special component types.

[0060] like Figure 4 As shown, the second pad 122 is disposed on the upper surface of the first pad 121 facing the welding pin 111 , and the upper surface of the second pad 122 faces the lower surface of the welding pin 111 .

[0061] It is understandable that if Figure 4 As shown, the size of the second solder pad 122 is smaller than that of the first solder pad 121. After the second solder pad 122 is placed on the upper surface of the first solder pad 121, the first solder pad 121 and the second solder pad 122 form a gradient. Compared with the assembly structure with only the first solder pad 121, the contact area between the solder layer 130 and the first solder pad 121 and the second solder pad 122 increases the side area of ​​the second solder pad 122, thereby improving the overall connection strength of the connector and avoiding solder cracks caused by the stress of assembly and plugging.

[0062] Among them, Figure 5 As shown, the second solder pad 122 is provided with a second through hole, and the first solder pad 121 is provided with a first through hole. The first through hole is connected to the second through hole. When the solder paste is flowing, it flows into the second through hole of the second solder pad 122 and the first through hole of the first solder pad 121 in sequence. After the solder paste solidifies, a solder paste layer is formed in the second through hole of the second solder pad 122 and the first through hole of the first solder pad 121.

[0063] It can be understood that the second solder pad 122 is provided with a second through hole, and the first solder pad 121 is provided with a first through hole, and the first through hole is connected to the second through hole. Compared with the first solder pad 121 and the second solder pad 122 having a gradient shape, the contact area between the solder layer 130 and the first solder pad 121 and the second solder pad 122 increases the inner surface of the first through hole and the second through hole, further improving the overall connection strength of the connector and avoiding tin cracks caused by the stress of assembly and plugging.

[0064] The solder layer 130 is a layer formed after the solder paste solidifies.

[0065] The second pad 122 is fixedly placed on the upper surface of the first pad 121. After the surface mount device 110 is placed on the printed circuit board 120, a solder layer 130 is distributed between the welding pin 111 and the upper surface of the second pad 122, the side of the second pad 122, the welding pin 111 and the upper surface of the first pad 121 not blocked by the second pad 122, the side of the first pad 121 and the inner wall of the first through hole and the inner wall of the second through hole. Since the contact area between the solder layer 130 and the first pad 121 and the second pad 122 is greatly increased, the overall connection strength of the connector is effectively improved to avoid tin cracking caused by the stress of assembly and plugging.

[0066] In some embodiments, Figure 4 and Figure 5 As shown, the printed circuit board 120 is drilled with a third through hole, and the third through hole of the printed circuit board 120 is connected with the second through hole of the second pad 122 and the first through hole of the first pad 121 .

[0067] A portion of the third through hole of the printed circuit board 120 is provided with a solder layer 130 , and a portion thereof is used for arranging electronic components 140 .

[0068] The flowing solder paste can flow into the second through hole of the second solder pad 122 , the first through hole of the first solder pad 121 , and then into the third through hole of the printed circuit board 120 in sequence.

[0069] It can be understood that by providing the second through hole of the second pad 122 , the first through hole of the first pad 121 , and the third through hole of the printed circuit board 120 , the following effects can be produced.

[0070] In the first aspect, excess solder paste can flow in, thereby preventing excessive solder paste from causing large lateral deformation when the surface mount device 110 is close to the printed circuit board 120, thereby avoiding the problem of line short circuit caused by solder paste interconnection.

[0071] In the second aspect, the addition of the third through hole of the printed circuit board 120 further increases the contact area between the solder paste layer and the component to be soldered, thereby increasing the connection strength and improving the overall reliability of the connector.

[0072] In the third aspect, when the third through hole of the printed circuit board 120 is partially filled with solder paste, the other part of the third through hole of the printed circuit board 120 can be used to arrange the electronic components 140 of the printed circuit board 120. Compared with the existing method of only being able to arrange the electronic components 140 on the surface of the printed circuit board 120, arranging the electronic components 140 in the third through hole of the printed circuit board 120 increases the availability of the printed circuit board 120 for arranging the electronic components 140.

[0073] Further, such as Figure 6 and Figure 7 As shown, the third through hole of the printed circuit board 120, the second through hole of the second pad 122 or the first through hole of the first pad 121 is partially blocked.

[0074] In this embodiment, the third through hole, the second through hole or the first through hole is partially blocked to prevent excessive solder paste in a flowing state from flowing out of the third through hole or flowing into the third through hole, the second through hole or the first through hole, resulting in too little solder paste between the surface mount device 110 and the printed circuit board 120, thereby affecting the strength of the connection.

[0075] It should be noted that the blocking height of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122 or the first through hole of the first solder pad 121, that is, the drilling depth and the aperture size of the second through hole of the second solder pad 122, the first through hole of the first solder pad 121 and the third through hole of the printed circuit board 120 toward one end of the surface mount device 110, can be calculated based on the size of the first solder pad 121, the size of the second solder pad 122 and the volume of solder paste recommended by the manufacturer.

[0076] In some embodiments, the blocking positions of the third through hole, the first through hole, and the second through hole are determined according to the volume of the solder paste, the area of ​​the second pad 122 , and the area of ​​the first pad 121 .

[0077] For example, when the volume of the solder paste is constant, the larger the area of ​​the second solder pad 122 and the first solder pad 121 is, the closer the blocking position is to the upper surface of the second solder pad 122 .

[0078] For example, when the volume of solder paste is constant, the smaller the area of ​​the second solder pad 122 and the first solder pad 121 is, the farther the blocking position is from the upper surface of the second solder pad 122 .

[0079] For example, when the areas of the second solder pad 122 and the first solder pad 121 are constant, the larger the volume of the solder paste, the farther the blocking position is from the upper surface of the second solder pad 122 .

[0080] For example, when the areas of the second solder pad 122 and the first solder pad 121 are constant, the smaller the volume of the solder paste is, the closer the blocking position is to the upper surface of the second solder pad 122 .

[0081] like Figure 7 As shown, the blocking position is located at an end of the third through hole of the printed circuit board 120 away from the upper surface of the second pad 122 .

[0082] In some embodiments, the aperture sizes of the third through hole, the first through hole, and the second through hole are determined according to the volume of the solder paste, the areas of the second pad 122 and the first pad 121 .

[0083] For example, when the volume of solder paste is constant, the smaller the area of ​​the second solder pad 122 and the first solder pad 121 is, the larger the aperture sizes of the third through hole, the first through hole and the second through hole are.

[0084] For example, when the volume of solder paste is constant, the larger the area of ​​the second solder pad 122 and the first solder pad 121 is, the smaller the aperture sizes of the third through hole, the first through hole and the second through hole are.

[0085] For example, when the areas of the second solder pad 122 and the first solder pad 121 are constant, the larger the volume of the solder paste, the larger the aperture sizes of the third through hole, the first through hole, and the second through hole.

[0086] For example, when the areas of the second pad 122 and the first pad 121 are constant, the larger the volume of the solder paste, the smaller the aperture sizes of the third through hole, the first through hole, and the second through hole.

[0087] In some embodiments, the aperture sizes and blocking positions of the third through hole, the first through hole, and the second through hole are determined according to the volume of the solder paste, the areas of the second pad 122 and the first pad 121 .

[0088] The aperture sizes of the third through hole, the first through hole and the second through hole are inversely proportional to the blocking position.

[0089] For example, when the volume of solder paste and the areas of the second pad 122 and the first pad 121 are constant, the larger the aperture sizes of the third through hole, the first through hole and the second through hole, the closer the blocking position is to the upper surface of the second pad 122 .

[0090] For example, when the volume of solder paste and the areas of the second pad 122 and the first pad 121 are constant, the smaller the aperture sizes of the third through hole, the first through hole and the second through hole are, the farther the blocking position is from the upper surface of the second pad 122 .

[0091] In some embodiments, the blocking position is located at a certain position within the third through hole of the printed circuit board 120, and the solder paste flows into the second through hole of the second solder pad 122, the first through hole of the first solder pad 121, and the third through hole of the printed circuit board 120 in sequence. The solder layer 130 contacts the inner walls of the second solder pad 122, the first solder pad 121, and the third through hole of the printed circuit board 120, respectively, thereby increasing the contact area and improving the reliability of the connector assembly.

[0092] Furthermore, the process for partially sealing the third through hole of the printed circuit board 120, the second through hole of the second pad 122, or the first through hole of the first pad 121 may adopt a drilling and sealing method known in the art.

[0093] In some embodiments, the third through hole of the printed circuit board 120 , the second through hole of the second pad 122 , or the first through hole of the first pad 121 is partially blocked by using an electroplating hole filling technology.

[0094] Furthermore, the drilling process of the third through hole of the printed circuit board 120, the second through hole of the second pad 122, or the first through hole of the first pad 121 may adopt a drilling method known in the art.

[0095] In some embodiments, the third through hole of the printed circuit board 120 , the second through hole of the second pad 122 , or the first through hole of the first pad 121 is drilled using a laser drilling technique.

[0096] The third through hole of the printed circuit board 120 , the second through hole of the second pad 122 , and the first through hole of the first pad 121 may be drilled in at least the following two ways.

[0097] First, holes are drilled on the printed circuit board 120 , the first solder pad 121 , and the second solder pad 122 , and then the printed circuit board 120 , the first solder pad 121 , and the second solder pad 122 are placed.

[0098] In this drilling method, the printed circuit board 120, the first solder pad 121 and the second solder pad 122 are drilled one by one first, and then the printed circuit board 120, the first solder pad 121 and the second solder pad 122 are fixed and placed in sequence, and the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122 and the first through hole of the first solder pad 121 are connected.

[0099] In this embodiment, the third through hole of the printed circuit board 120 , the second through hole of the second pad 122 , and the first through hole of the first pad 121 are connected in the following two ways.

[0100] First, the central axes of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122, and the first through hole of the first solder pad 121 are aligned, and the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122, and the first through hole of the first solder pad 121 are smoothly connected. The solder paste flows into the second through hole, the first through hole, and the third through hole along the inner walls of the second through hole, the first through hole, and the third through hole, thereby increasing the contact area between the solder paste and the printed circuit board 120, the second solder pad 122, and the first solder pad 121, and increasing the connection strength.

[0101] Second, the central axes of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122, and the first through hole of the first solder pad 121 are staggered, and the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122, and the first through hole of the first solder pad 121 are staggered and connected, and the solder paste flows along the inner wall of the second through hole of the second solder pad 122.

[0102] It can be understood that since the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122 and the first through hole of the first solder pad 121 are staggered and connected, in addition to the inner walls of the second through hole, the first through hole and the third through hole being exposed to the solder paste, part of the lower surface of the second solder pad 122 and part of the lower surface of the first solder pad 121 are also exposed to the solder paste, and part of the lower surface of the second solder pad 122 and part of the lower surface of the first solder pad 121 are in contact with the solder paste layer, further increasing the contact area between the solder paste and the printed circuit board 120, the second solder pad 122 and the first solder pad 121, thereby increasing the connection strength.

[0103] Second, the printed circuit board 120 , the first solder pad 121 and the second solder pad 122 are placed first, and then holes are drilled into the printed circuit board 120 , the first solder pad 121 and the second solder pad 122 .

[0104] In this drilling method, the printed circuit board 120 , the first solder pad 121 , and the second solder pad 122 are first fixed and placed in sequence, and then the printed circuit board 120 , the first solder pad 121 , and the second solder pad 122 are drilled.

[0105] It can be understood that since the positions of the printed circuit board 120, the first solder pad 121 and the second solder pad 122 are relatively fixed during drilling, the inner walls of the third through hole of the printed circuit board 120, the second through hole of the second solder pad 122 and the first through hole of the first solder pad 121 are smoothly connected after drilling, and the solder paste flows into the second through hole, the first through hole and the third through hole along the inner walls of the second through hole, the first through hole and the third through hole, thereby increasing the contact area between the solder paste and the printed circuit board 120, the second solder pad 122 and the first solder pad 121, and increasing the connection strength.

[0106] In related technologies, such as Figure 8 As shown, the printed circuit board 120 includes multiple printed circuit boards 120, which are stacked in sequence. The electronic components 140 are arranged on the outer surface of the topmost printed circuit board 120 closest to the surface mount device 110. The layout space of the topmost printed circuit board 120 is limited, and the layout flexibility is poor.

[0107] In some embodiments, Fig. 9As shown, the printed circuit board 120 includes multiple printed circuit boards 120, which are stacked in sequence; the third through holes of the multiple printed circuit boards 120 are connected; the third through holes of the multiple printed circuit boards 120 are connected with the second through holes of the second pad 122 and the first through holes of the first pad 121.

[0108] It is understandable that, due to the presence of the third through hole on the printed circuit board 120 , the electronic components 140 of the printed circuit board 120 can be arranged on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120 , thereby increasing the layout flexibility of the printed circuit board 120 .

[0109] In this embodiment, a plurality of printed circuit boards 120 are stacked in sequence, with gaps between adjacent printed circuit boards 120, and the third through holes of the plurality of printed circuit boards 120 are connected. The electronic components 140 can be arranged in the gaps between adjacent printed circuit boards 120, or in the third through holes of the printed circuit boards 120, thereby increasing the surface layout space of the printed circuit boards 120 and increasing the availability of the layout space of the printed circuit boards 120.

[0110] In some embodiments, the placement position of the second pad 122 relative to the first pad 121 can be placed according to actual needs.

[0111] For example, the second pad 122 is aligned with a side edge of the first pad 121 , and the central axis of the second pad 122 is misaligned with the central axis of the first pad 121 .

[0112] The second through hole of the second pad 122 is located at the center of the second pad 122 , the first through hole of the first pad 121 is located at the center of the first pad 121 , and the second through hole of the second pad 122 is connected to the first through hole of the first pad 121 but the inner walls are misaligned.

[0113] For example, the second pad 122 is disposed at the center of the first pad 121 , and the center axis of the second pad 122 is aligned with the center axis of the first pad 121 .

[0114] The outer edge of the first pad 121 protrudes from the second pad 122 , and the solder layer 130 covers the upper surface of the second pad 122 , the side surface of the second pad 122 , the upper surface of the first pad 121 not blocked by the second pad 122 , and the side surface of the first pad 121 .

[0115] In some embodiments, the second pad 122 is disposed at the center of the first pad 121 , the second through hole of the second pad 122 is located at the center of the second pad 122 , and the first through hole of the first pad 121 is located at the center of the first pad 121 .

[0116] In this embodiment, the second pad 122 is disposed at the center of the first pad 121 , and the contact areas of the solder layer 130 with the second pad 122 and the first pad 121 are evenly distributed, thereby avoiding stress concentration and improving connection strength.

[0117] The shapes of the second pad 122 and the first pad 121 may be the same or different, and the shapes of the second pad 122 and the first pad 121 may be set according to specific requirements.

[0118] For example, the second pad 122 and the first pad 121 may both be configured to be circular, rectangular, or irregular in shape.

[0119] Alternatively, the second pad 122 is configured to be circular, and the first pad 121 is configured to be rectangular.

[0120] In some embodiments, the second pad 122 and the first pad 121 have the same shape.

[0121] For example, the second pad 122 and the first pad 121 are both circular in shape, and the second pad 122 and the first pad 121 are coaxially arranged.

[0122] The materials of the first solder pad 121 and the second solder pad 122 may be the same or different, and may be set according to actual needs.

[0123] In some embodiments, the first solder pad 121 and the second solder pad 122 are made of the same material, that is, metal material, and a tin plating layer is disposed on the outer side of the metal material.

[0124] For example, the first pad 121 and the second pad 122 may be made of ceramic, steel, copper pad or the like.

[0125] In some embodiments, the first pad 121 and the second pad 122 are both made of copper.

[0126] In this embodiment, by using the same material for the first solder pad 121 and the second solder pad 122, the connection strength between the first solder pad 121, the second solder pad 122 and the solder layer 130 is the same, thereby ensuring the uniformity of the connection force between the first solder pad 121, the second solder pad 122 and the solder layer 130, avoiding stress concentration, avoiding solder cracks caused by stress during assembly and plugging, and improving the overall reliability of the connector.

[0127] The structure for improving the reliability of connector assembly provided by the present invention, in the first aspect, by arranging the second soldering pad 122 on the first soldering pad 121, the contact area between the solder layer 130 and the soldering pin 111 is increased, the contact area between the solder paste and the second soldering pad 122 is increased, the more contact areas between the solder paste and the second soldering pad 122 and the first soldering pad 121, the greater the connection strength between the relative surface mount device 110 and the second soldering pad 122; in the second aspect, by drilling a first through hole connected to the second soldering pad 122 and the first soldering pad 121, the solder paste flows into the second through hole, the first through hole and the third through hole, the inner walls of the second through hole, the first through hole and the third through hole are in contact with the solder paste layer, and the solder paste layer is further increased. The contact area with the second solder pad 122 and the first solder pad 121 increases the connection strength and improves the overall reliability of the connector; on the third aspect, after the surface mount device 110 is placed on the printed circuit board 120, the excess solder paste flows into the second through hole, the first through hole and the third through hole along the inner wall of the second through hole, the first through hole and the third through hole, thereby reducing the lateral deformation of the solder paste layer and reducing the electrical short circuit caused by the interconnection of the solder paste; on the fourth aspect, by drilling the third through hole on the printed circuit board 120, the electronic components 140 of the printed circuit board 120 can be arranged on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120, thereby increasing the layout flexibility of the printed circuit board 120.

[0128] Preferably, this embodiment further provides an electronic device, comprising any of the above structures for improving connector assembly reliability.

[0129] Among them, the electronic device can be any electronic device that uses a connector, such as a mobile phone, a computer, a sweeping robot, a smart watch, etc.

[0130] Specifically, since the electronic device shown in this embodiment includes the structure for improving the reliability of connector assembly shown in the above embodiments, the electronic device shown in this embodiment includes all the technical solutions of the above embodiments, and therefore, at least has all the beneficial effects achieved by all the technical solutions of the above embodiments, which will not be repeated here one by one.

[0131] The electronic device provided by the present invention is provided with a structure for improving the reliability of connector assembly. In the first aspect, by providing the second solder pad 122 on the first solder pad 121, the contact area between the solder layer 130 and the solder pin 111 is increased, and the contact area between the solder paste and the second solder pad 122 is increased. The more contact areas between the solder paste and the second solder pad 122 and the first solder pad 121, the greater the connection strength between the relative surface mount device 110 and the second solder pad 122. In the second aspect, by providing the second through hole on the second solder pad 122 and the first through hole on the first solder pad 121, the second through hole and the first through hole are connected, the solder paste flows into the second through hole and the first through hole, and the inner walls of the second through hole and the first through hole are in contact with the solder paste layer. The contact area between the solder paste layer and the second solder pad 122 and the first solder pad 121 is further increased, the connection strength is improved, and the overall reliability of the connector is enhanced; on the third aspect, after the surface mount device 110 is placed on the printed circuit board 120, the excess solder paste flows into the second through hole, the first through hole, and the third through hole along the inner walls of the second through hole, the first through hole, and the third through hole, thereby reducing the lateral deformation of the solder paste layer and reducing the electrical short circuit caused by the interconnection of the solder paste; on the fourth aspect, by drilling the third through hole on the printed circuit board 120, the electronic components 140 of the printed circuit board 120 can be arranged on the outer surface of the printed circuit board 120 and in the third through hole of the printed circuit board 120, thereby increasing the flexibility of the layout of the printed circuit board 120.

[0132] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A structure for improving the reliability of connector assembly, It is characterized in that include: Surface mount devices with solder pins on the bottom surface; A printed circuit board, wherein the upper surface is provided with a first pad, the first pad is arranged corresponding to the welding pin, the first pad is provided with a first through hole; the printed circuit board is provided with a third through hole; A second pad is disposed on the upper surface of the first pad, the size of the second pad is smaller than the size of the first pad; the second pad is provided with a second through hole, the second through hole is connected to the first through hole; the third through hole is connected to both the second through hole and the first through hole; The solder layer is distributed between the welding pin and the first welding pad, between the welding pin and the second welding pad, and filled in the first through hole, the second through hole and the third through hole; the solder layer is distributed in a part of the third through hole, and a part is used for arranging electronic components.

2. The structure for improving connector assembly reliability according to claim 1, It is characterized in that Partial blocking of the third through hole, the second through hole or the first through hole.

3. The structure for improving connector assembly reliability according to claim 2, It is characterized in that The third through hole, the second through hole or the partial blocking of the first through hole is achieved by electroplating hole filling processing.

4. The structure for improving connector assembly reliability according to claim 1, It is characterized in that The inner walls of the second through hole, the first through hole and the third through hole are smoothly connected.

5. The structure for improving connector assembly reliability according to claim 1, It is characterized in that The inner walls of the second through hole, the first through hole and the third through hole are staggered and connected.

6. The structure for improving connector assembly reliability according to claim 1, It is characterized in that The printed circuit board comprises a plurality of printed circuit boards, and the plurality of printed circuit boards are stacked in sequence; The third through holes of the plurality of printed circuit boards are connected; The third through holes of the plurality of printed circuit boards are all connected to the second through holes and the first through holes.

7. The structure for improving connector assembly reliability according to any one of claims 1 to 6, It is characterized in that The first through hole, the second through hole and the third through hole are formed by laser drilling.

8. The structure for improving connector assembly reliability according to any one of claims 1 to 6, It is characterized in that The second pad is disposed at a center position of the first pad.

9. The structure for improving connector assembly reliability according to any one of claims 1 to 6, It is characterized in that The second pad has the same shape as the first pad.

10. The structure for improving connector assembly reliability according to any one of claims 1 to 6, It is characterized in that The first soldering pad and the second soldering pad are both made of metal, and the outer sides of the first soldering pad and the second soldering pad are both provided with tin plating layers.

11. An electronic device, It is characterized in that The invention comprises a structure for improving the reliability of connector assembly as described in any one of claims 1 to 10.

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