Liquid discharge head and liquid discharge apparatus

Abstract

A liquid ejecting head and a liquid ejecting apparatus in which the reduction or prevention of the reduction in the liquid ejecting performance due to the buffering or stagnation of the flow of liquid caused by the collision of the liquids with each other in the flow channels is achieved. The liquid ejecting head includes a first pressure chamber extending in a first direction; a second pressure chamber extending in the first direction; a first communication passage connected to the first pressure chamber and extending in the first direction; a second communication passage connected to the second pressure chamber and extending in the first direction; a third communication passage connected to the first communication passage and extending in a second direction intersecting the first direction; a fourth communication passage connected to the second communication passage and extending in the second direction; a fifth communication passage connected to the third communication passage and the fourth communication passage and extending in the first direction; and a nozzle provided on the fifth communication passage.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. BACKGROUND

[0002] A liquid ejection head is known which has a pressure chamber, a piezoelectric element that applies pressure to a liquid in the pressure chamber, a nozzle that ejects the liquid, and a flow path that connects the pressure chamber and the nozzle (for example, Patent Literature 1).

[0003] In the flow path that connects the pressure chamber and the nozzle, for example, when buffering or stagnation of the liquid due to the liquid flowing against each other or the like occurs, it can be difficult to sufficiently obtain the ejection performance of the liquid ejected from the nozzle.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2013-184372 SUMMARY

[0005] The present disclosure can be implemented in the following manner.

[0006] According to a first aspect of the present disclosure, a liquid ejection head is provided. The liquid ejection head includes a first pressure chamber that extends along a first direction, a second pressure chamber that extends along the first direction, a first communication passage that is connected to the first pressure chamber and extends along the first direction, a second communication passage that is connected to the second pressure chamber and extends along the first direction, a third communication passage that is connected to the first communication passage and extends along a second direction that intersects the first direction, a fourth communication passage that is connected to the second communication passage and extends along the second direction, a fifth communication passage that is connected to the third communication passage and the fourth communication passage and extends along the first direction, and a nozzle that is provided on the fifth communication passage.

[0007] According to a second aspect of the present disclosure, a liquid ejection apparatus is provided. The liquid ejection apparatus includes the liquid ejection head according to the first aspect, and a control device that controls an ejection operation of a liquid ejected from the liquid ejection head. BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 FIG. 1 is a diagram showing an example of a liquid ejection apparatus according to a first embodiment.

[0009] Figure 2 FIG. 2 is an exploded perspective view of a liquid ejection head.

[0010] Figure 3 FIG. 3 is a sectional view taken along line III-III in FIG. 1. Figure 2

[0011] Figure 4 ​An explanatory diagram for schematically showing a flow path of ink in the liquid ejection head, in a plan view.

[0012] Figure 5 An enlarged sectional view of the vicinity of the piezoelectric element.

[0013] Figure 6 An explanatory diagram for showing a cross section of the flow path in the vicinity of the nozzle Nz of the liquid ejection head, in an enlarged manner.

[0014] Figure 7 A sectional view for schematically showing a flow path of ink of a conventional liquid ejection head as a comparative example.

[0015] Figure 8 A sectional view for showing an internal structure of the liquid ejection head as a second embodiment.

[0016] Figure 9 An explanatory diagram for showing a cross section of the flow path in the vicinity of the nozzle of the liquid ejection head as the second embodiment, in an enlarged manner.DETAILED DESCRIPTION

[0017] A. First Embodiment:

[0018] Figure 1 An explanatory diagram for showing one example of the liquid ejection apparatus 100 according to the first embodiment. The liquid ejection apparatus 100 according to the first embodiment is an inkjet printing apparatus that ejects ink as one example of a liquid, for example, toward a medium PP such as a print paper. The medium PP can be any printing object other than a print paper, such as a resin film or cloth. Figure 1 and Figure 1 X, Y, and Z shown in each of the following drawings represent three spatial axes orthogonal to each other. In the present specification, directions along these axes are also referred to as an X-axis direction, a Y-axis direction, and a Z-axis direction. The X-axis direction is one example of a first direction, and the Z-axis direction is one example of a second direction. In a case where a direction is particularly specified, a positive direction is denoted as "+" and a negative direction is denoted as "-," so that the direction toward which an arrow mark of each drawing is directed is denoted as a + direction and the opposite direction thereof is denoted as a - direction in a direction mark. In the present embodiment, an example in which the Z direction coincides with a vertical direction is shown, and an example in which the +Z direction is a vertically downward direction and the -Z direction is a vertically upward direction is shown. In addition, in a case where a positive direction and a negative direction are not defined, X, Y, and Z are described as an X-axis, a Y-axis, and a Z-axis. In addition, the first direction and the second direction can not be orthogonal to each other, and can intersect each other at an arbitrary internal angle.

[0019] As Figure 1As shown, the liquid discharge apparatus 100 is provided with a plurality of liquid discharge heads 1 that discharge liquid, a control device 90, a moving mechanism 91, a conveying mechanism 92, a liquid container 93, and a circulation mechanism 94. The control device 90 is, for example, a microcomputer including a microprocessor such as a CPU or an FPGA and a storage circuit such as a semiconductor memory. The control device 90 controls the operation of each part of the liquid discharge apparatus 100 by executing a program that is stored in advance in the storage circuit. The control device 90 can, for example, control the discharge operation of discharging ink from the liquid discharge heads 1. Specifically, the control device 90 supplies a signal or the like for controlling the discharge of ink to the liquid discharge heads 1. The liquid discharge heads 1 discharge the ink supplied from the liquid container 93 in an amount and at a timing corresponding to the signal supplied from the control device 90.

[0020] In the liquid container 93, ink is stored. As the ink, for example, an ink in which a pigment as a color material is dispersed in a solvent can be used, or an ink in which a dye is contained or an ink in which both a pigment and a dye as a color material are contained can be used. In the ink, various liquid-like compositions such as a general water-based ink, an oily ink, and a gel-like ink, a heat-dissolvable ink, and the like can be contained. As the liquid container 93, for example, a cartridge that is detachable to the liquid discharge apparatus 100, an ink bag in the form of a bag formed of a flexible film, an ink tank in which ink can be replenished, or the like can be used.

[0021] The circulation mechanism 94 is a pump for supplying the liquid stored in the liquid container 93 to the liquid discharge heads 1 under the control of the control device 90. The circulation mechanism 94 recovers the ink stored in the liquid discharge heads 1 and causes the recovered ink to flow back to the liquid discharge heads 1.

[0022] The moving mechanism 91 conveys the medium PP in the +Y direction under the control of the control device 90. The conveying mechanism 92 is provided with a housing box 921 that houses the plurality of liquid discharge heads 1 and a jointless belt 922 that fixes the housing box 921. The conveying mechanism 92 causes the jointless belt 922 that fixes the housing box 921 to operate under the control of the control device 90, thereby causing the liquid discharge heads 1 to reciprocate in the X-axis direction. The conveying direction of the medium PP and the moving direction of the liquid discharge heads 1 are not limited to being orthogonal, but can intersect at a predetermined angle. The liquid container 93 and the circulation mechanism 94 can also be housed in the housing box 921 together with the liquid discharge heads 1.

[0023] As shown in FIG. 1, the liquid discharge apparatus 100 is provided with a plurality of liquid discharge heads 1, a control device 90, a moving mechanism 91, a conveying mechanism 92, a liquid container 93, and a circulation mechanism 94. Figure 1As shown, the control device 90 outputs a drive signal Com for driving the liquid discharge head 1 and a control signal SI for controlling the liquid discharge head 1 to the liquid discharge head 1. The liquid discharge head 1 is driven by the drive signal Com under the control by the control signal SI, so that ink is discharged from some or all of the nozzles provided on the liquid discharge head 1. In the present embodiment, the direction of the ink discharge is the +Z direction. The liquid discharge head 1 discharges ink on the surface of the medium PP by making the ink discharge from the nozzles while the conveyance of the medium PP by the moving mechanism 91 and the reciprocating movement of the liquid discharge head 1 by the conveyance mechanism 92 are linked. As a result, a desired image is formed on the surface of the medium PP. The direction of the ink discharge is not limited to the +Z direction, but can be any direction crossing the X-Y plane.

[0024] By using Figures 2 to 5 The structure of the liquid discharge head 1 will be described. Figure 2 is an exploded perspective view of the liquid discharge head 1. Figure 3 is a sectional view taken along the line III-III in Figure 2 . In Figure 3 , the boundaries between the flow channels are schematically shown by broken lines for ease of understanding the technology. Figure 4 is a schematic diagram showing the flow channels of ink in the liquid discharge head 1 in a plan view. Figure 5 is a sectional view of the vicinity of the piezoelectric element PZq, which is enlarged. As Figure 2 shown, the liquid discharge head 1 has a nozzle substrate 60, a communication plate 2, a pressure chamber substrate 3, a vibration plate 4, a reservoir chamber forming substrate 5, a wiring substrate 8, a deformable sheet 61, and a deformable sheet 62.

[0025] As Figure 2As shown, the nozzle substrate 60 is a plate-shaped component that is elongated along the Y-axis direction. The nozzle substrate 60 is manufactured, for example, by processing a single-crystal silicon substrate using semiconductor manufacturing techniques such as etching. M nozzles Nz are formed on the nozzle substrate 60. M is a natural number greater than or equal to 1. Each nozzle Nz is a through-hole provided on the nozzle substrate 60. In this embodiment, the M nozzles Nz on the nozzle substrate 60 are arranged linearly in a nozzle array Ln extending in the Y-axis direction. The material of the nozzle substrate 60 is not limited to a silicon substrate; for example, a glass substrate, an SOI substrate, various ceramic substrates, or a metal substrate can be used. Examples of metal substrates include stainless steel substrates. Organic materials such as polyimide resin can also be used as the material of the nozzle substrate 60. However, it is preferable that the nozzle substrate 60 uses a material with approximately the same coefficient of thermal expansion as the connecting plate 2. This suppresses warping of the nozzle substrate 60 and the connecting plate 2 caused by differences in their coefficients of thermal expansion when the temperatures of the nozzle substrate 60 and the connecting plate 2 change. The surface of the nozzle substrate 60 in the -Z direction, which is also one surface of the nozzle substrate 60, is referred to as the "upper surface TN". For example... Figure 3 As shown, a connecting plate 2 is provided on the upper surface TN of the nozzle substrate 60.

[0026] like Figure 2 As shown, the connecting plate 2 is a plate-shaped component that is elongated along the Y-axis. The connecting plate 2 is manufactured, for example, by processing a single-crystal silicon substrate using semiconductor manufacturing technology. The connecting plate 2 is not limited to a silicon substrate; for example, a flat component such as a glass substrate, SOI substrate, various ceramic substrates, or metal substrate can be used. As a metal substrate, stainless steel substrates are an example. Preferably, the connecting plate 2 is made of a material with a thermal expansion coefficient that is approximately the same as that of the pressure chamber substrate 3. Therefore, when the temperature of the pressure chamber substrate 3 and the connecting plate 2 changes, warping of the pressure chamber substrate 3 and the connecting plate 2 caused by the difference in thermal expansion coefficients can be suppressed. Although an example of a single connecting plate 2 is shown in this embodiment, the connecting plate 2 is not limited to a single sheet and multiple sheets may be used. One surface of the connecting plate 2, specifically the surface on the -Z direction side, is referred to as the "upper surface TR," and the other surface of the connecting plate 2, specifically the surface on the +Z direction side, is referred to as the "lower surface BR."

[0027] like Figure 2 as well as Figure 3 As shown, ink channels are formed on the connecting plate 2. These channels can be formed, for example, by etching the connecting plate 2. Figure 2 As shown, a common supply channel RA1 extending in the Y-axis direction and a common discharge channel RA2 extending in the Y-axis direction are formed on the connecting plate 2. Figure 2 as well as Figure 3As shown, the connecting plate 2 also has M fifth connecting channels RR5, M connecting channels RX1, M connecting channels RK1, M first connecting channels RR1, M third connecting channels RR3, M fourth connecting channels RR4, M second connecting channels RR2, M connecting channels RK2, and M connecting channels RX2 corresponding to each of the M nozzles Nz. In this disclosure, the channel consisting of connecting channels RX1, RK1, RR1, RR3, RR5, RR4, RR2, RK2, and RX2 is also referred to as an "independent channel". On the connecting plate 2, the M independent channels are formed between a common supply channel RA1 and a common discharge channel RA2. In addition, on the connecting plate 2, a connecting channel RX1 that is shared by the M nozzles Nz, and a connecting channel RX2 that is shared by the M nozzles Nz, can be formed.

[0028] like Figure 3 As shown, one end of the connecting channel RX1 is connected to the common supply channel RA1. The connecting channel RX1 is configured to extend along the X-axis from the common supply channel RA1 towards the -X direction. The other end of the connecting channel RX1 is connected to one end of the connecting channel RK1. The connecting channel RK1 is configured to extend along the Z-axis from the connecting channel RX1 towards the -Z direction. The other end of the connecting channel RK1 is connected to one end of the first pressure chamber CB1. The other end of the first pressure chamber CB1 is connected to one end of the first connecting passage RR1.

[0029] The first connecting channel RR1 is configured to extend along the X-axis direction on the upper surface TR of the connecting plate 2. The first connecting channel RR1 is a flow channel defined by a groove formed on the upper surface TR of the connecting plate 2 by etching and the lower surface BC of the pressure chamber substrate 3. The groove in the groove formed on the upper surface TR of the connecting plate 2 corresponding to the first connecting channel RR1 is also referred to as the "first connecting plate groove portion". The first connecting channel RR1 is formed by being blocked by the lower surface BC of the pressure chamber substrate 3 through the first connecting plate groove. The other end of the first connecting channel RR1 is connected to one end of the third connecting channel RR3.

[0030] The third connecting channel RR3 is a through hole that passes through the connecting plate 2 along the Z-axis. The third connecting channel RR3 is configured to extend from the upper surface TR of the connecting plate 2 along the Z-axis and toward the +Z direction. The other end of the third connecting channel RR3 is connected to one end of the fifth connecting channel RR5.

[0031] A nozzle Nz is provided on the fifth connecting channel RR5. The fifth connecting channel RR5 is configured to extend along the X-axis direction on the lower surface BR of the connecting plate 2. The fifth connecting channel RR5 is a flow channel defined by a groove formed on the lower surface BR of the connecting plate 2 by etching and the upper surface TN of the nozzle substrate 60. The groove in the groove formed on the lower surface BR of the connecting plate 2 corresponding to the fifth connecting channel RR5 is also referred to as the "third connecting plate groove portion". The fifth connecting channel RR5 is formed by sealing the upper surface TN of the nozzle substrate 60 through the third connecting plate groove portion. The other end of the fifth connecting channel RR5 is connected to one end of the fourth connecting channel RR4.

[0032] In this embodiment, the fifth connecting channel RR5, the first connecting channel RR1, and the second connecting channel RR2 are formed by the same wet etching process. This simplifies the manufacturing process and reduces costs. Furthermore, in this embodiment, by placing an etching mask at the formation location of the fifth connecting channel RR5 and performing isotropic wet etching, the timing of etching the formation location of the fifth connecting channel RR5 is relatively delayed relative to the timing of etching the first connecting channel RR1 and the second connecting channel RR2. That is, the etching rate for the fifth connecting channel RR5 is set lower than the etching rate for the first connecting channel RR1 and the second connecting channel RR2. Therefore, the depth D5 of the fifth connecting channel RR5 can be set shallower than the depths D1 and D2 of the first connecting channel RR1 and the second connecting channel RR2. Alternatively, the depth D5 of the fifth connecting channel RR5 can be set equal to the depths D1 and D2 of the first connecting channel RR1 and the second connecting channel RR2. In this case, there is no need to configure an etching mask. The wet etching process of the fifth connecting channel RR5, the first connecting channel RR1, and the second connecting channel RR2 can be started at the same time.

[0033] The fourth connecting channel RR4 is a through hole that passes through the connecting plate 2 along the Z-axis direction. The fourth connecting channel RR4 is configured to extend from the lower surface BR of the connecting plate 2 along the Z-axis direction and toward the -Z direction. The other end of the fourth connecting channel RR4 is connected to one end of the second connecting channel RR2.

[0034] The second connecting channel RR2 is configured to extend along the X-axis direction on the upper surface TR of the connecting plate 2. The second connecting channel RR2 is a flow channel defined by a groove formed on the upper surface TR of the connecting plate 2 by etching and the lower surface BC of the pressure chamber substrate 3. The groove in the groove formed on the upper surface TR of the connecting plate 2 corresponding to the second connecting channel RR2 is also referred to as the "second connecting plate groove portion". The second connecting channel RR2 is formed by being blocked by the lower surface BC of the pressure chamber substrate 3 through the second connecting plate groove portion. The other end of the second connecting channel RR2 is connected to one end of the second pressure chamber CB2.

[0035] The other end of the second pressure chamber CB2 is connected to the connecting flow channel RK2. The connecting flow channel RK2 is configured to extend from the second pressure chamber CB2 along the Z-axis direction and toward the +Z direction. The connecting flow channel RK2 is connected to one end of the connecting flow channel RX2. The connecting flow channel RX2 is configured to extend from the connecting flow channel RK2 along the X-axis direction toward the -X direction. The other end of the connecting flow channel RX2 is connected to the common discharge flow channel RA2.

[0036] like Figure 2 as well as Figure 3 As shown, malleable sheets 61 and 62 are provided on both sides of the lower surface BR of the connecting plate 2 in the width direction. Malleable sheet 61 blocks the common supply channel RA1, the connecting channel RX1, and the connecting channel RK1. For example, an elastic material can be used as malleable sheet 61. Malleable sheet 61 absorbs pressure fluctuations of the ink within the common supply channel RA1, the connecting channel RX1, and the connecting channel RK1. Malleable sheet 62 blocks the common discharge channel RA2, the connecting channel RX2, and the connecting channel RK2. For example, malleable sheet 62 is made of an elastic material and absorbs pressure fluctuations of the ink within the common discharge channel RA2, the connecting channel RX2, and the connecting channel RK2.

[0037] like Figure 2 as well as Figure 3 As shown, a storage chamber forming substrate 5 is provided on the upper surface TR of the connecting plate 2. Figure 2 As shown, the storage chamber forming substrate 5 is a strip-shaped component in the Y-axis direction. The storage chamber forming substrate 5 is formed, for example, by injection molding of a resin material. Ink flow channels are formed inside the storage chamber forming substrate 5. Specifically, as... Figure 2 As shown, a common supply channel RB1 and a common discharge channel RB2 are formed on the substrate 5 forming the storage chamber. The common supply channel RB1 is connected to the common supply channel RA1, and the common discharge channel RB2 is connected to the common discharge channel RA2.

[0038] On the substrate 5 formed in the storage chamber, there is also an inlet 51 communicating with a common supply channel RB1 and an outlet 52 communicating with a common discharge channel RB2. Ink supplied from the liquid container 93 is introduced into the common supply channel RB1 through the inlet 51. In addition, ink flowing into the common discharge channel RB2 is recycled back into the liquid container 93 through the outlet 52.

[0039] like Figure 3 As shown, an opening 50 is provided on the storage chamber forming substrate 5. A pressure chamber substrate 3, a vibrating plate 4, and a wiring substrate 8 are disposed in the opening 50. A protective component for protecting the first piezoelectric element PZ1 and the second piezoelectric element PZ2 may also be provided in the opening 50.

[0040] like Figure 2 As shown, the pressure chamber base plate 3 is a long, plate-shaped component along the Y-axis. Figure 3 As shown, the pressure chamber substrate 3 is disposed on the upper surface TR of the connecting plate 2. For example, the pressure chamber substrate 3 is manufactured by processing a single-crystal silicon substrate using semiconductor manufacturing technology. Ink flow channels are formed on the pressure chamber substrate 3. Specifically, M first pressure chambers CB1 and M second pressure chambers CB2 corresponding to each of the M nozzles Nz are formed on the pressure chamber substrate 3. The pressure chamber substrate 3 is not limited to a silicon substrate; for example, it can also be formed using a glass substrate, an SOI substrate, various ceramic substrates, etc. The +Z direction side of the pressure chamber substrate 3, which is one side of the pressure chamber substrate 3, is referred to as the "lower surface BC," and the -Z direction side of the pressure chamber substrate 3, which is the other side of the pressure chamber substrate 3, is referred to as the "upper surface TC."

[0041] The first pressure chamber CB1 is configured to extend in the X-axis direction to connect the connecting channel RK1 and the first connecting channel RR1. The second pressure chamber CB2 is configured to extend in the X-axis direction to connect the connecting channel RK2 and the second connecting channel RR2. In the following description, without distinguishing between the first pressure chamber CB1 and the second pressure chamber CB2, they are all referred to as pressure chamber CBq.

[0042] like Figure 5 As shown, the vibrating plate 4 is a long, plate-shaped component along the Y-axis. Figure 3As shown, a vibrating plate 4 is disposed on the upper surface TC of the pressure chamber substrate 3. The vibrating plate 4 is a component capable of elastic vibration, applying pressure to the liquid within the pressure chamber CBq. For example, the vibrating plate 4 can be formed by an elastic membrane formed of silicon oxide disposed on the side of the pressure chamber substrate 3 and an insulating membrane formed of zirconium oxide disposed on the elastic membrane. M first piezoelectric elements PZ1 corresponding to each of the M first pressure chambers CB1 and M second piezoelectric elements PZ2 corresponding to each of the M second pressure chambers CB2 are disposed on the upper surface of the vibrating plate 4. In the following description, without distinguishing between the first piezoelectric elements PZ1 and the second piezoelectric elements PZ2, they are all referred to as piezoelectric elements PZq. The piezoelectric element PZq is an energy conversion element that converts the electrical energy of the drive signal Com into kinetic energy. In this embodiment, the piezoelectric element PZq is a driven element that deforms according to the potential change of the drive signal Com.

[0043] A wiring board 8 is mounted between the first piezoelectric element PZ1 and the second piezoelectric element PZ2 on the -Z direction side of the vibrating plate 4. The wiring board 8 serves as a component for electrically connecting the control device 90 and the liquid ejector head 1, and supplies power to the first piezoelectric element PZ1 and the second piezoelectric element PZ2. The wiring board 8 can be a flexible wiring board such as an FPC or FFC. A drive circuit 81 is mounted on the wiring board 8. The drive circuit 81 switches whether to supply a drive signal Com to the piezoelectric element PZ2 based on a control signal SI.

[0044] like Figure 4 As shown, the piezoelectric element PZq is a laminate formed by sandwiching a piezoelectric body ZMq between the lower electrode ZDq and the upper electrode ZUq. A pressure chamber CBq is provided on the +Z direction side of the piezoelectric element PZq. A predetermined reference potential is supplied to the lower electrode ZDq. The drive circuit 81 supplies a drive signal Com to the upper electrode ZUq via wiring 810. The drive signal Com supplied to the first piezoelectric element PZ1 is also referred to as drive signal Com1, and the drive signal Com supplied to the second piezoelectric element PZ2 is also referred to as drive signal Com2. In this embodiment, when ink is ejected from the nozzle Nz, the waveforms of the drive signal Com1 supplied by the drive circuit 81 to the first piezoelectric element PZ1 corresponding to the nozzle Nz and the drive signal Com2 supplied by the drive circuit 81 to the second piezoelectric element PZ2 corresponding to the nozzle Nz are approximately the same.

[0045] The piezoelectric element PZq deforms according to the potential change of the drive signal Com. The vibrating plate 4 is linked to the deformation of the piezoelectric element PZq and vibrates. The pressure inside the pressure chamber CBq changes due to the vibration of the vibrating plate 4. Due to the pressure change inside the pressure chamber CBq, the ink filled inside the pressure chamber CBq is ejected from the nozzle Nz through the first connecting channel RR1, the second connecting channel RR2, the third connecting channel RR3, the fourth connecting channel RR4, and the fifth connecting channel RR5. Specifically, when the first piezoelectric element PZ1 is driven by the drive signal Com1, a portion of the ink filled inside the first pressure chamber CB1 is ejected from the nozzle Nz through the first connecting channel RR1, the third connecting channel RR3, and the fifth connecting channel RR5. When the second piezoelectric element PZ2 is driven by the drive signal Com2, a portion of the ink filled inside the second pressure chamber CB2 is ejected from the nozzle Nz through the second connecting channel RR2, the fourth connecting channel RR4, and the fifth connecting channel RR5.

[0046] like Figure 6 As shown, ink introduced from liquid container 93 into inlet 51 via circulation mechanism 94 flows into common supply channel RA1 via common supply channel RB1. A portion of the ink flowing into common supply channel RA1 is diverted into connecting channels RX1 of individual channels. The ink flowing into connecting channel RX1 flows into first pressure chamber CB1 via connecting channel RK1. A portion of the ink flowing into first pressure chamber CB1 flows into second pressure chamber CB2 sequentially via first connecting channel RR1, third connecting channel RR3, fifth connecting channel RR5, fourth connecting channel RR4, and second connecting channel RR2. A portion of the ink flowing into second pressure chamber CB2 merges in common discharge channel RA2 after sequentially passing through connecting channel RK2 and connecting channel RX2. The ink flowing into common discharge channel RA2 is discharged from outlet 52 via common discharge channel RB2. Figure 6 As shown, the ink flow path from the common supply channel RA1 to the common discharge channel RA2 is also referred to as the "circulation channel RJ". Specifically, the circulation channel RJ includes the common supply channel RA1, an independent channel, and the common discharge channel RA2.

[0047] The liquid ejection device 100 of this embodiment circulates ink from the common supply channel RA1 through the circulation channel RJ to the common discharge channel RA2. Therefore, even during periods when ink inside the pressure chamber CBq is not ejected from the nozzle Nz, ink retention inside the nozzle Nz can be reduced or prevented. Thus, even during periods when ink inside the pressure chamber CBq is not ejected from the nozzle Nz, even if the ink becomes viscous inside the nozzle Nz due to evaporation of the liquid components, the liquid ejection device 100 of this embodiment can discharge the viscous ink from inside the nozzle Nz to the common discharge channel RA2 through ink circulation. This reduces or prevents ejection abnormalities caused by viscous ink remaining in the nozzle Nz, thereby reducing or preventing a decrease in ink ejection performance.

[0048] The liquid ejection device 100 of this embodiment ejects ink filled in the first pressure chamber CB1 and ink filled in the second pressure chamber CB2 from a nozzle Nz. Therefore, compared with a method that ejects only ink filled in one pressure chamber CBq from the nozzle Nz, the liquid ejection device 100 can increase the amount of ink ejected from the nozzle Nz.

[0049] use Figure 6 The details of the flow channel design near the nozzle Nz of the liquid ejector head 1 are explained. Figure 3 This is an explanatory diagram showing an enlarged view of the cross-section of the flow channel near the nozzle Nz of the liquid ejector head 1. Figure 6 The sectional view shown is equivalent to Figure 6 A magnified view of the area near nozzle Nz. Figure 6 In this disclosure, for ease of understanding, the boundaries between the flow channels are schematically shown using dashed lines. The length of the flow channel in the X-axis direction is also referred to as the "width," and the length of the flow channel in the Z-axis direction is referred to as the "depth."

[0050] like Figure 6 As shown, the width L1 of the first connecting channel RR1 is designed to be shorter than the width LP1 of the first pressure chamber CB1. In this embodiment, the width L1 of the first connecting channel RR1 is set to 3 / 5 of the width LP1 of the first pressure chamber CB1. Not limited to 3 / 5, the width L1 of the first connecting channel RR1 can also be set to any proportion such as 2 / 3, 1 / 3, 1 / 4, 3 / 4, 4 / 5, 2 / 5, or 1 / 5 of the width LP1 of the first pressure chamber CB1. Furthermore, not limited to the width L1 of the first connecting channel RR1 being shorter than the width LP1 of the first pressure chamber CB1, the width L1 can also be set to a width greater than or equal to LP1.

[0051] The width L2 of the second connecting channel RR2 is designed to be shorter than the width LP2 of the second pressure chamber CB2. In this embodiment, the width L2 of the second connecting channel RR2 is set to 3 / 5 of the width LP2 of the second pressure chamber CB2. Not limited to 3 / 5, the width L2 of the second connecting channel RR2 can also be set to any proportion such as 2 / 3, 1 / 3, 1 / 4, 3 / 4, 4 / 5, 2 / 5, or 1 / 5 of the width LP2 of the second pressure chamber CB2. Furthermore, not limited to the width L2 of the second connecting channel RR2 being shorter than the width LP2 of the second pressure chamber CB2, the width L2 can also be set to a width greater than LP2.

[0052] In this embodiment, the width L5 of the fifth connecting channel RR5 is designed to be shorter than the width L1 of the first connecting channel RR1 and shorter than the width L2 of the second connecting channel RR2. Therefore, in this embodiment, the width L5 of the fifth connecting channel RR5 is shorter than the sum of the widths L1 of the first connecting channel RR1 and L2 of the second connecting channel RR2. Alternatively, the width L5 can also be designed to be shorter than either width L1 or width L2. In this case, it is preferable that the width L5 is shorter than the sum of widths L1 and L2. However, this is not a limitation, and it is also possible to set the width L5 to be, for example, a length greater than or equal to the sum of widths L1 and L2.

[0053] The width L5 of the fifth connecting channel RR5 is set to 2 / 3 of the width L1 of the first connecting channel RR1. Not limited to 2 / 3, the width L5 of the fifth connecting channel RR5 can also be set to any proportion such as 1 / 3, 1 / 4, 3 / 4, 4 / 5, 3 / 5, 2 / 5, or 1 / 5 of the width L1 of the first connecting channel RR1. Furthermore, not limited to the fifth connecting channel RR5 being shorter than the width L1 of the first connecting channel RR1, for example, when the distance from the first pressure chamber CB1 to the nozzle Nz is short and the width L1 is short, the width L5 can also be set to a width greater than L1.

[0054] The width L5 of the fifth connecting channel RR5 is set to 2 / 3 of the width L2 of the second connecting channel RR2. Not limited to 2 / 3, the width L5 of the fifth connecting channel RR5 can also be set to any proportion such as 1 / 3, 1 / 4, 3 / 4, 4 / 5, 3 / 5, 2 / 5, or 1 / 5 of the width L2 of the second connecting channel RR2. Furthermore, not limited to the fifth connecting channel RR5 being shorter than the width L2 of the second connecting channel RR2, for example, when the distance from the second pressure chamber CB2 to the nozzle Nz is short and the width L2 is short, the width L5 can also be set to a width greater than L2.

[0055] In this embodiment, the width L5 of the fifth connecting channel RR5 is further designed to be shorter than the width LP1 of the first pressure chamber CB1 and shorter than the width LP2 of the second pressure chamber CB2. Therefore, in this embodiment, the width L5 of the fifth connecting channel RR5 is shorter than the sum of the widths LP1 and LP2 of the first and second pressure chambers CB1. However, the width L5 can also be designed to be shorter than either width LP1 or width LP2. In this case, it is preferable that the width L5 is shorter than the sum of widths LP1 and LP2. However, this is not a limitation; for example, the width L5 can be a length greater than or equal to the sum of widths LP1 and LP2.

[0056] In this embodiment, the width L5 is designed to be shorter than the sum of widths L1, L2, LP1, and LP2. However, it is not limited to this and can also be set to, for example, a length greater than or equal to the sum of widths L1 and L2.

[0057] The width L5 of the fifth connecting channel RR5 is set to 2 / 5 of the width LP1 of the first pressure chamber CB1. Not limited to 2 / 5, the width L5 of the fifth connecting channel RR5 can also be set to any proportion of the width LP1 of the first pressure chamber CB1, such as 2 / 3, 1 / 3, 1 / 4, 3 / 4, 4 / 5, 3 / 5, or 1 / 5. Furthermore, not limited to the width L5 of the fifth connecting channel RR5 being shorter than the width LP1 of the first pressure chamber CB1, for example, when the width LP1 is short, the width L5 can also be set to a width greater than LP1.

[0058] The width L5 of the fifth connecting channel RR5 is set to 2 / 5 of the width LP2 of the second pressure chamber CB2. Not limited to 2 / 5, the width L5 of the fifth connecting channel RR5 can also be set to any proportion such as 2 / 3, 1 / 3, 1 / 4, 3 / 4, 4 / 5, 3 / 5, or 1 / 5 of the width LP2 of the second pressure chamber CB2. Furthermore, it is not limited to the width L5 of the fifth connecting channel RR5 being shorter than the width LP2 of the second pressure chamber CB2; for example, if the width LP2 is short, the width L5 can also be set to a width greater than LP2.

[0059] like Figure 6As shown, in this embodiment, the ink flow channels within the liquid ejector head 1, specifically the first pressure chamber CB1, the second pressure chamber CB2, and the ink flow channels formed within the connecting plate 2, have an axisymmetric structure with the Z-axis including the nozzle Nz as the axis of symmetry. That is, the width L1 of the first connecting channel RR1 is set to be approximately the same as the width L2 of the second connecting channel RR2. Furthermore, in this embodiment, the width LP1 of the first pressure chamber CB1 and the width LP2 of the second pressure chamber CB2 are approximately the same as each other, and the width L1 of the first connecting channel RR1 and the width L2 of the second connecting channel RR2 are approximately the same as each other. However, the ink flow channels within the liquid ejector head 1 are not limited to an axisymmetric structure; they can also be non-axisymmetric structures. For example, the width LP1 of the first pressure chamber CB1 and the width LP2 of the second pressure chamber CB2 can be different from each other, and the width L1 of the first connecting channel RR1 and the width L2 of the second connecting channel RR2 can also be different from each other.

[0060] exist Figure 7 The thickness T2 of the connecting plate 2 and the thickness T3 of the pressure chamber substrate 3 are schematically shown. The depth D3 of the third connecting channel RR3, which serves as a through hole in the connecting plate 2, and the depth D4 of the fourth connecting channel RR4 are consistent with the thickness T2 of the connecting plate 2. The depth DP1 of the first pressure chamber CB1 and the depth DP2 of the second pressure chamber CB2 are consistent with the thickness T3 of the pressure chamber substrate 3. Figure 7 As shown, the thickness T2 of the connecting plate 2 is greater than the thickness T3 of the pressure chamber base plate 3. The ratio of thickness T2 to thickness T3 can be set arbitrarily. In this embodiment, the thickness T2 is set to be 4 to 6 times the thickness T3.

[0061] The depth D5 of the fifth connecting channel RR5 is designed to be shallower than the depth DP1 of the first pressure chamber CB1 and shallower than the depth DP2 of the second pressure chamber CB2. The ratio of depth D5 to depth DP1 and the ratio of depth D5 to depth DP2 can be arbitrarily set. For example, depth D5 can be set to 20% to 80% of depths DP1 and DP2. In this embodiment, depth D5 is set to 70% of depths DP1 and DP2. However, depth D5 can be approximately the same as or equal to depth DP1. Similarly, depth D5 can be approximately the same as or equal to depth DP2.

[0062] Furthermore, the depth D5 of the fifth connecting channel RR5 is designed to be shallower than the depth D1 of the first connecting channel RR1 and shallower than the depth D2 of the second connecting channel RR2. The ratio of depth D5 to depth D1 and the ratio of depth D5 to depth D2 can be arbitrarily set. For example, depth D5 can be set to 20% to 80% of depths D1 and D2. In this embodiment, depth D5 is 70% of depths D1 and D2. Additionally, in this embodiment, the depth D1 of the first connecting channel RR1 and the depth DP1 of the first pressure chamber CB1 are set to be approximately the same depth, and the depth D2 of the second connecting channel RR2 and the depth DP2 of the second pressure chamber CB2 are set to be approximately the same depth. However, depth D5 can be approximately the same as or equal to depth D1. Similarly, depth D5 can be approximately the same as or equal to depth D2.

[0063] Figure 8 A cross-sectional view of the ink flow path of a conventional liquid ejector head 1R, used as a comparative example, is shown schematically. Figure 9 As shown, the liquid ejector head 1R differs from the liquid ejector head 1 of this embodiment in the ink flow channel structure within the connecting plate 2. Specifically, the liquid ejector head 1R does not possess the first connecting channel RR1 and the second connecting channel RR2 present in the liquid ejector head 1 of this embodiment. However, the structures of the first pressure chamber CB1, the second pressure chamber CB2, the third connecting channel RR3, and the fourth connecting channel RR4 are the same as those in the liquid ejector head 1 of this embodiment. The distances between the first piezoelectric element PZ1 and the second piezoelectric element PZ2, and between the first pressure chamber CB1 and the second pressure chamber CB2, are the same as those in the liquid ejector head 1.

[0064] The liquid nozzle 1R is connected to a third connecting channel RR3 on the +Z direction side of the other end of the first pressure chamber CB1, and a fourth connecting channel RR4 on the +Z direction side of one end of the second pressure chamber CB2. A fifth connecting channel RR5 is provided on the lower surface BR of the connecting plate 2, between the third connecting channel RR3 and the fourth connecting channel RR4. The width LR5 of the fifth connecting channel RR5 of the liquid nozzle 1R is longer than the width L5 of the fifth connecting channel RR5 in this embodiment. Specifically, the width LR5 is longer than the width L5 by an amount equivalent to the sum of the width L1 of the first connecting channel RR1 and the width L2 of the second connecting channel RR2.

[0065] In the liquid ejector head 1R, ink inside the first pressure chamber CB1, pressurized by the first piezoelectric element PZ1, flows into the third connecting channel RR3 and moves in the +Z direction. Ink moving to the other end of the third connecting channel RR3 flows into the fifth connecting channel RR5, and the flow direction is switched to the -X direction. Similarly, ink inside the second pressure chamber CB2, pressurized by the second piezoelectric element PZ21, flows from the second pressure chamber CB2 into the fourth connecting channel RR4 and moves in the +Z direction. Ink moving to the other end of the fourth connecting channel RR4 flows into the fifth connecting channel RR5, and the flow direction is switched to the +X direction. Therefore, in the fifth connecting channel RR5, ink supplied from the fourth connecting channel RR4 in the +X direction collides with ink supplied from the third connecting channel RR3 in the -X direction. The ink in the fifth connecting channel RR5 is ejected from the nozzle Nz. In the liquid ejector head 1R, because the width LR5 of the fifth connecting channel RR5 is relatively long, ink collision is more likely to occur within the fifth connecting channel RR5 compared to the liquid ejector head 1 of this embodiment. Furthermore, buffering or stagnation of ink flow is also more likely to occur. In this case, there is a possibility that the ejection performance of ink ejected from the nozzle Nz cannot be adequately obtained.

[0066] In existing liquid ejector heads 1R, the ink remains in the fifth connecting channel RR5 for a longer period because its width is longer compared to the fifth connecting channel RR5 in this embodiment. Therefore, for example, the ink in the fifth connecting channel RR5 is easily dissipated to the outside of the liquid ejector head 1R via the nozzle substrate 60. There is a possibility that this heat dissipation will cause the ink temperature to drop below the desired value. If the ink temperature changes, the ink viscosity will also change. The ink viscosity has a significant impact on ejection characteristics. Therefore, in existing liquid ejector heads 1R, there is a possibility that the actual ejection characteristics deviate from the desired ejection characteristics due to the heat dissipation of ink from the fifth connecting channel RR5 to the outside.

[0067] In contrast, in the liquid ejector head 1 of this embodiment, the first pressure chamber CB1 and the second pressure chamber CB2 are connected to the first connecting channel RR1 and the second connecting channel RR2. By forming a flow channel extending from the pressure chamber CBq along the X-axis direction toward the nozzle Nz, the width L5 of the fifth connecting channel RR5 located directly above the nozzle Nz is set shorter compared to the conventional liquid ejector head 1R.

[0068] Because the distances from the third connecting channel RR3 and the fourth connecting channel RR4 to the nozzle Nz are shortened, the kinetic energy of the ink in the Z-axis direction becomes more likely to remain directly above the nozzle Nz compared to the existing liquid ejector head 1R. Therefore, compared to the existing liquid ejector head 1R, which has longer distances from the third connecting channel RR3 and the fourth connecting channel RR4 to the nozzle Nz, ink can be ejected more easily from the nozzle Nz. Furthermore, within the fifth connecting channel RR5, the kinetic energy of the ink in the X-axis direction is weakened compared to existing technologies, thereby mitigating buffering or retention of ink flow caused by ink collisions.

[0069] In the liquid ejector head 1 of this embodiment, by making the width L5 of the fifth connecting channel RR5 shorter than that of the prior art, the residence time of ink in the fifth connecting channel RR5 is shortened. Therefore, according to the liquid ejector head 1 of this embodiment, less heat is dissipated from the ink in the fifth connecting channel RR5 to the outside via the nozzle substrate 60, thereby reducing temperature and viscosity changes of the ink, and thus reducing or preventing a decrease in ink ejection performance.

[0070] Furthermore, in the liquid ejector head 1 of this embodiment, by providing a first connecting channel RR1 and a second connecting channel RR2 on the upper surface TR of the connecting plate 2, the ink flow channel can be positioned closer to the wiring substrate 8 installed between the first piezoelectric element PZ1 and the second piezoelectric element PZ2 than in the prior art. Therefore, the ink within the flow channel becomes more efficient at conducting heat generated at the wiring substrate 8. Thus, even if heat dissipation of ink occurs to the outside in the fifth connecting channel RR5, the ink temperature can be maintained in the first connecting channel RR1 and the second connecting channel RR2, thereby further reducing or preventing temperature and viscosity changes in the ink. As a result, compared to the conventional liquid ejector head 1R, the reduction or prevention of decreased ink ejection performance from the nozzle Nz can be reduced.

[0071] As described above, the liquid nozzle 1 of this embodiment includes: a first pressure chamber CB1 extending along a first direction; a second pressure chamber CB2 extending along the first direction; a first connecting channel RR1 connected to the first pressure chamber CB1 and extending along the first direction; a second connecting channel RR2 connected to the second pressure chamber CB2 and extending along the first direction; a third connecting channel RR3 connected to the first connecting channel RR1 and extending along a second direction intersecting the first direction; a fourth connecting channel RR4 connected to the second connecting channel RR2 and extending along the second direction; a fifth connecting channel RR5 connected to the third connecting channel RR3 and the fourth connecting channel RR4 and extending along the first direction; and a nozzle Nz disposed on the fifth connecting channel RR5. According to the liquid nozzle 1 of this embodiment, by providing the first connecting channel RR1 and the second connecting channel RR2 extending from the first pressure chamber CB1 and the second pressure chamber CB2 in the X-axis direction, the width L5 of the fifth connecting channel RR5 can be shortened. Therefore, within the fifth connecting channel RR5, the kinetic energy of the ink supplied from the third connecting channel RR3 and the fourth connecting channel RR4 in the Z-axis direction becomes more easily retained, making it easier for the ink to be ejected from the nozzle Nz compared to the existing liquid ejector head 1R. Furthermore, within the fifth connecting channel RR5, the kinetic energy of the ink in the X-axis direction is weaker than in the prior art, thus mitigating buffering or retention of ink flow caused by ink collision. Therefore, it is possible to reduce or prevent a decrease in the ejection performance of the ink ejected from the nozzle Nz. Moreover, by shortening the ink residence time within the fifth connecting channel RR5 compared to the prior art, it is possible to reduce the malfunction caused by external heat affecting the ink within the fifth connecting channel RR5 via the nozzle substrate 60, thereby reducing or preventing a decrease in ink ejection performance.

[0072] According to the liquid ejector head 1 of this embodiment, the width of the fifth connecting channel RR5 is shorter than the width of the first connecting channel RR1 and shorter than the width of the second connecting channel RR2. By setting the width L5 of the fifth connecting channel RR5 to be shorter than the widths L1 and L2 of the first connecting channel RR1 and the second connecting channel RR2 in the flow channel extending in the X-axis direction, the width L5 of the fifth connecting channel RR5 can be designed to be smaller, thereby reducing or preventing the deterioration of ink ejection performance.

[0073] According to the liquid ejector head 1 of this embodiment, the width L5 of the fifth connecting channel RR5 is shorter than the sum of the width L1 of the first connecting channel RR1 and the width L2 of the second connecting channel RR2. By setting the width L5 of the fifth connecting channel RR5 to be shorter than the sum of the widths L1 and L2 of the first connecting channel RR1 and the second connecting channel RR2 in the flow channel extending in the X-axis direction, the width L5 of the fifth connecting channel RR5 can be designed to be smaller, thereby reducing or preventing the deterioration of ink ejection performance.

[0074] According to the liquid ejector head 1 of this embodiment, the width L5 of the fifth connecting channel RR5 is shorter than the width LP1 of the first pressure chamber CB1 and shorter than the width LP2 of the second pressure chamber CB2. By setting the width L5 of the fifth connecting channel RR5 to be shorter than the widths LP1 and LP2 of the first pressure chamber CB1 and the second pressure chamber CB2 in the flow channel extending in the X-axis direction, the width L5 of the fifth connecting channel RR5 can be designed to be smaller, thereby reducing or preventing the deterioration of ink ejection performance.

[0075] According to the liquid ejector head 1 of this embodiment, the width L1 of the first connecting channel RR1 is shorter than the width LP1 of the first pressure chamber CB1, and the width L2 of the second connecting channel RR2 is shorter than the width LP2 of the second pressure chamber CB2. This prevents the widths L1 and L2 of the first connecting channel RR1 and the second connecting channel RR2 from increasing to exceed the widths LP1 and LP2 of the first pressure chamber CB1 and the second pressure chamber CB2, thereby preventing the ink flow path from becoming too long, and further reducing or suppressing the deterioration of ink ejection performance and the excessive enlargement of the liquid ejector head 1.

[0076] According to the liquid ejector head 1 of this embodiment, the depth D5 of the fifth connecting channel RR5 is shallower than the depth D1 of the first connecting channel RR1 and shallower than the depth D2 of the second connecting channel RR2. By designing the cross-sectional area of ​​the flow channels of the first connecting channel RR1 and the second connecting channel RR2 to be larger, the flow resistance in the first connecting channel RR1 and the second connecting channel RR2 can be reduced, and the ink flow rate can be accelerated in the fifth connecting channel RR5, which is easily affected by external air and thus tends to increase ink viscosity, thereby improving the ink ejection performance.

[0077] According to the liquid ejector head 1 of this embodiment, the depth D5 of the fifth connecting channel RR5 is shallower than the depth DP1 of the first pressure chamber CB1 and shallower than the depth DP2 of the second pressure chamber CB2. By designing the cross-sectional area of ​​the flow channels in the first pressure chamber CB1 and the second pressure chamber CB2 to be larger, the flow resistance in the first pressure chamber CB1 and the second pressure chamber CB2 can be reduced, and the ink flow rate can be accelerated in the fifth connecting channel RR5, which is easily affected by external air and thus easily increases the viscosity of the ink, thereby improving the ink ejection performance.

[0078] According to the liquid ejector head 1 of this embodiment, the first connecting channel RR1 is defined by a first connecting plate groove formed on the upper surface TR of the connecting plate 2 and the lower surface BC of the pressure chamber substrate 3 opposite to the upper surface TR of the connecting plate 2. The second connecting channel RR2 is defined by a second connecting plate groove formed on the upper surface TR of the connecting plate 2 and the lower surface BC of the pressure chamber substrate 3 opposite to the upper surface TR of the connecting plate 2. Therefore, the connection between the first connecting channel RR1 and the second connecting channel RR2 and the flow channels of the first pressure chamber CB1 and the second pressure chamber CB2 becomes easier. Furthermore, compared to the arrangement where the first connecting channel RR1 and the second connecting channel RR2 are disposed at the center in the thickness direction of the connecting plate 2, the first connecting channel RR1 and the second connecting channel RR2 can be easily formed on the connecting plate 2.

[0079] According to the liquid ejector head 1 of this embodiment, a third connecting channel RR3, a fourth connecting channel RR4, and a fifth connecting channel RR5 are disposed on the connecting plate 2. Therefore, compared with the method in which the third connecting channel RR3, the fourth connecting channel RR4, and the fifth connecting channel RR5 are formed across multiple substrates, these channels can be easily formed.

[0080] According to this embodiment, the liquid nozzle 1 has a third connecting channel RR3 and a fourth connecting channel RR4, which are through holes that penetrate the connecting plate 2 along the Z direction. The fifth connecting channel RR5 is defined by a third connecting plate groove formed on the lower surface BR of the connecting plate 2 and the upper surface TN of the nozzle substrate 60. Compared to a configuration where the fifth connecting channel RR5 is located at the center in the thickness direction of the connecting plate 2, this configuration makes it easier to form the fifth connecting channel RR5.

[0081] According to the liquid ejector head 1 of this embodiment, the thickness T2 of the connecting plate 2 is greater than the thickness T3 of the pressure chamber substrate 3. Therefore, it is easy to form multiple flow channels on the connecting plate 2.

[0082] The liquid ejector head 1 according to this embodiment includes: a first piezoelectric element PZ1 for changing the pressure of a first pressure chamber CB1; a second piezoelectric element PZ2 for changing the pressure of a second pressure chamber CB2; and a wiring board 8 disposed between the first piezoelectric element PZ1 and the second piezoelectric element PZ2, for supplying power to the first piezoelectric element PZ1 and the second piezoelectric element PZ2. By providing the first connecting channel RR1 and the second connecting channel RR2 close to the wiring board 8, the ink can easily receive heat from the wiring board 8, thereby reducing or preventing problems such as ink viscosity reduction, and further reducing or preventing a decrease in the ejection performance of the ink ejected from the nozzle Nz.

[0083] The liquid ejector head 1 according to this embodiment also includes multiple independent flow channels, including a first pressure chamber CB1, a second pressure chamber CB2, a first connecting channel RR1, a second connecting channel RR2, a third connecting channel RR3, a fourth connecting channel RR4, and a fifth connecting channel RR5. It also includes a common supply flow channel RA1 and a common discharge flow channel RA2. The common supply flow channel RA1 is connected to all of the multiple independent flow channels and is used to supply ink to each of the multiple independent flow channels. The common discharge flow channel RA2 is connected to all of the multiple independent flow channels and is used to discharge ink from each of the multiple independent flow channels. In the liquid ejector head 1 with an ink circulation structure, the degradation of ink ejection performance from the nozzle Nz can be reduced or prevented.

[0084] B. Second implementation method:

[0085] use Figure 8 as well as Figure 8 The structure of the liquid ejector head 1b, which is the second embodiment, will be described. Figure 9 This is a cross-sectional view showing the internal structure of the liquid ejection head 1b as a second embodiment. Figure 8 as well as Figure 9 In the diagram, for ease of technical understanding, the boundaries between the flow channels are schematically shown using dashed lines. The liquid ejector head 1b of the second embodiment differs from the liquid ejector head 1 of the first embodiment in that it has first connecting channels RR1b and second connecting channels RR2b instead of first connecting channels RR1 and second connecting channels RR2; otherwise, the structure is the same. Furthermore, the distance between the first piezoelectric element PZ1 and the second piezoelectric element PZ2, and the distance between the first pressure chamber CB1 and the second pressure chamber CB2, are also the same as those in the liquid ejector head 1.

[0086] In the first embodiment, an example is shown where the first connecting channel RR1 and the second connecting channel RR2 are defined by a groove formed on the upper surface TR of the connecting plate 2 by etching and a flow channel defined on the lower surface BC of the pressure chamber substrate 3. In contrast, as... Figure 9 As shown, in this embodiment, the first connecting channel RR1b is a flow channel defined by the first connecting plate groove RR12 formed on the upper surface TR of the connecting plate 2 and the groove RR11 formed on the lower surface BC of the pressure chamber substrate 3 by etching. The groove RR11 in the groove formed on the lower surface BC of the pressure chamber substrate 3 that corresponds to the first connecting channel RR1b is also referred to as the "first pressure chamber substrate groove RR11".

[0087] The second connecting channel RR2b is a flow channel defined by the second connecting plate groove RR22 formed on the upper surface TR of the connecting plate 2 and the groove RR21 formed on the lower surface BC of the pressure chamber substrate 3 by etching. The groove RR21 in the groove formed on the lower surface BC of the pressure chamber substrate 3 that corresponds to the second connecting channel RR2b is also called the "second pressure chamber substrate groove RR21".

[0088] Figure 9 This explanatory diagram shows an enlarged view of the cross-section of the flow channel near the nozzle Nz of the liquid ejection head 1b, which is a second embodiment. ​ The diagram shows the depth D21 of the first connecting channel RR1b and the depth D22 of the second connecting channel RR2b. In this embodiment, the depth D21 of the first connecting channel RR1b is approximately the same as the depth DP1 of the first pressure chamber CB1. The depth D21 is the sum of the depth D211 of the first pressure chamber substrate recess RR11 and the depth D212 of the first connecting plate recess RR12. Although in this embodiment, the depths D211 of recess RR11 and D212 of recess RR12 are set to be equal, this is not a limitation, and they may be set to different depths.

[0089] In this embodiment, the depth D22 of the second connecting channel RR2b is approximately the same as the depth DP2 of the second pressure chamber CB2. The depth D22 of the second connecting channel RR2b is the sum of the depth D221 of the second pressure chamber substrate recess RR21 and the depth D222 of the second connecting plate recess RR22. Although in this embodiment, the depths D221 and D222 of the recess RR21 and RR22 are set to be equal, this is not a limitation, and they may be set to different depths.

[0090] In this embodiment, the fifth connecting channel RR5 is formed in the same etching process as that used to form the first connecting plate recess RR12 and the second connecting plate recess RR22. This simplifies the manufacturing process and reduces costs. Furthermore, in this embodiment, the etching rates for the fifth connecting channel RR5, the first connecting plate recess RR12, and the second connecting plate recess RR22 are set to be the same. Therefore, the depth D5 of the fifth connecting channel RR5 is set to be equal to the depth D212 of the first connecting plate recess RR12 and equal to the depth D222 of the second connecting plate recess RR22.

[0091] like ​ As shown, in this embodiment, the width L21 of the first connecting channel RR1b is shorter than the width L1 of the first connecting channel RR1 in the first embodiment. This is because, in the first embodiment, the first connecting channel RR1 is connected to the end of the first pressure chamber CB1 in the +Z direction, while in this embodiment, the first connecting channel RR1b is connected to the end of the first pressure chamber CB1 in the -X direction. In this embodiment, the width L21 of the first connecting channel RR1b is approximately equal to the width L5 of the fifth connecting channel RR5. The width of the first pressure chamber substrate recess RR11 is equal to the width of the first connecting plate recess RR12, and is also equal to the width L21 of the first connecting channel RR1b. However, for example, the width of the first connecting plate recess RR12 can be set to be greater than the width L21. In this case, the first connecting plate recess RR12 can also be, for example, a structure extending to the +Z direction side of the first pressure chamber CB1, and can also be connected to the +Z direction side of the first pressure chamber CB1. Similarly, the width of the groove RR11 can be set to be greater than the width L21. In this case, it can also be extended and connected to the -Z direction side of the third connecting channel RR3.

[0092] In this embodiment, the width L22 of the second connecting channel RR2b is shorter than the width L2 of the second connecting channel RR2 in the first embodiment. This is because, in the first embodiment, the second connecting channel RR2 is connected to the end of the second pressure chamber CB2 on the +Z direction side, while in this embodiment, the second connecting channel RR2b is connected to the end of the second pressure chamber CB2 on the +X direction side. In this embodiment, the width L22 of the second connecting channel RR2b is approximately equal to the width L5 of the fifth connecting channel RR5. However, for example, the width of the second connecting plate recess RR22 can be set to be greater than the width L22. In this case, the second connecting plate recess RR22 can be, for example, a structure extending to the +Z direction side of the second pressure chamber CB2, or it can be connected to the +Z direction side of the second pressure chamber CB2. Similarly, the width of the recess RR21 can be set to be greater than the width L22, and in this case, it can also extend and connect to the -Z direction side of the fourth connecting channel RR4.

[0093] According to the liquid ejector head 1b of this embodiment, the first connecting channel RR1b is a flow channel defined by a first connecting plate groove RR12 formed on the upper surface TR of the connecting plate 2 and a groove RR11 formed on the lower surface BC of the pressure chamber substrate 3. The second connecting channel RR2b is a flow channel defined by a second connecting plate groove RR22 formed on the upper surface TR of the connecting plate 2 and a groove RR21 formed on the lower surface BC of the pressure chamber substrate 3. Therefore, by forming a portion of the flow channels of the first connecting channel RR1b and the second connecting channel RR2b on the pressure chamber substrate 3, it is possible to reduce or prevent the increase of inertial resistance in the first connecting channel RR1b and the second connecting channel RR2b.

[0094] According to the liquid ejector head 1b of this embodiment, the depth D5 of the fifth connecting channel RR5 is set to be equal to the depth D212 of the first connecting plate groove RR12 and equal to the depth D222 of the second connecting plate groove RR22. The etching rates of the fifth connecting channel RR5, the first connecting channel RR1b, and the second connecting channel RR2b can be set to be the same, thereby facilitating the formation of the fifth connecting channel RR5, the first connecting channel RR1b, and the second connecting channel RR2b in the same process.

[0095] C. Other methods:

[0096] This disclosure is not limited to the embodiments described above, and can be implemented through various structures without departing from its spirit. For example, in order to solve some or all of the above-described problems, or to achieve some or all of the above-described effects, the technical features in the embodiments corresponding to the technical features in the various methods described in the summary section can be appropriately replaced or combined. Furthermore, in this specification, any technical feature that is not described as an essential technical feature can be appropriately omitted.

[0097] (1) According to one aspect of this disclosure, a liquid ejector head is provided. The liquid ejector head includes: a first pressure chamber extending along a first direction; a second pressure chamber extending along the first direction; a first connecting channel connected to the first pressure chamber and extending along the first direction; a second connecting channel connected to the second pressure chamber and extending along the first direction; a third connecting channel connected to the first connecting channel and extending along a second direction intersecting the first direction; a fourth connecting channel connected to the second connecting channel and extending along the second direction; a fifth connecting channel connected to both the third and fourth connecting channels and extending along the first direction; and a nozzle disposed on the fifth connecting channel. According to this liquid ejector head, by including the first and second connecting channels extending from the first and second pressure chambers in the first direction, the length of the fifth connecting channel in the first direction can be shortened. Within the fifth connecting channel, the kinetic energy of the liquid supplied from the third and fourth connecting channels in the second direction tends to remain, while the kinetic energy in the first direction tends to weaken. As a result, it can alleviate buffering or stagnation of liquid flow caused by the collision of liquids within the fifth connecting channel. Therefore, it can reduce or prevent a decrease in the ejection performance of the liquid ejected from the nozzle.

[0098] (2) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the first direction is shorter than the length of the first connecting channel in the first direction, and also shorter than the length of the second connecting channel in the first direction. According to this method of liquid nozzle design, by making the length of the fifth connecting channel in the first direction smaller, it is possible to reduce or prevent a decrease in liquid ejection performance.

[0099] (3) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first connecting channel and the second connecting channel in the first direction. According to this method of liquid nozzle design, by making the length of the fifth connecting channel in the first direction smaller, it is possible to reduce or prevent a decrease in liquid ejection performance.

[0100] (4) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the first direction is shorter than the length of the first pressure chamber in the first direction, and also shorter than the length of the second pressure chamber in the first direction. According to this type of liquid nozzle, by designing the length of the fifth connecting channel in the first direction to be smaller, it is possible to reduce or prevent a decrease in the liquid ejection performance.

[0101] (5) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first pressure chamber and the second pressure chamber in the first direction. According to this type of liquid nozzle, by designing the length of the fifth connecting channel in the first direction to be smaller, it is possible to reduce or prevent a decrease in liquid ejection performance.

[0102] (6) Alternatively, in the liquid nozzle of the above-described manner, the length of the first connecting channel in the first direction is shorter than the length of the first pressure chamber in the first direction, and the length of the second connecting channel in the first direction is shorter than the length of the second pressure chamber in the first direction. With this type of liquid nozzle, the problem of excessively long liquid flow channels can be suppressed, thereby reducing or suppressing the decrease in liquid ejection performance and the increase in the size of the liquid nozzle.

[0103] (7) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first connecting channel, the second connecting channel, the first pressure chamber, and the second pressure chamber in the first direction. According to this liquid nozzle, by designing the length of the fifth connecting channel in the first direction to be smaller, it is possible to reduce or prevent a decrease in liquid ejection performance.

[0104] (8) Alternatively, in the liquid ejector head described above, the length of the fifth connecting channel in the second direction is shorter than the length of the first connecting channel in the second direction, and also shorter than the length of the second connecting channel in the second direction. According to this liquid ejector head, the flow resistance in the first and second connecting channels can be reduced, and the liquid flow rate can be accelerated in the fifth connecting channel, which is easily affected by external air and thus prone to increasing ink viscosity, thereby improving the liquid ejection performance.

[0105] (9) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the second direction is equal to the length of the first connecting channel in the second direction, and also equal to the length of the second connecting channel in the second direction. This method of liquid nozzle design can reduce manufacturing costs.

[0106] (10) Alternatively, in the liquid ejector head described above, the length of the fifth connecting channel in the second direction is shorter than the length of the first pressure chamber in the second direction, and also shorter than the length of the second pressure chamber in the second direction. According to this liquid ejector head, the flow resistance in the first and second pressure chambers can be reduced, and the liquid flow rate can be accelerated in the fifth connecting channel, which is easily affected by external air and thus prone to increasing ink viscosity, thereby improving the liquid ejection performance.

[0107] (11) Alternatively, the liquid nozzle in the above manner may include: a connecting plate having a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel and a fifth connecting channel; a pressure chamber substrate having a first pressure chamber and a second pressure chamber stacked on one side of the connecting plate; and a nozzle substrate having a nozzle having a nozzle stacked on the other side of the connecting plate.

[0108] (12) Alternatively, in the liquid ejector head described above, the first connecting channel is defined by a first connecting plate groove formed on one surface of the connecting plate and a surface of the pressure chamber substrate facing one surface of the connecting plate, and the second connecting channel is defined by a second connecting plate groove formed on one surface of the connecting plate and a surface of the pressure chamber substrate facing one surface of the connecting plate. According to this type of liquid ejector head, the connection between the first and second connecting channels and the flow channels of the first and second pressure chambers becomes easier.

[0109] (13) Alternatively, in the liquid ejector head described above, the first connecting channel is defined by a first connecting plate groove formed on one surface of the connecting plate and a first pressure chamber substrate groove formed on one surface of the pressure chamber substrate facing one surface of the connecting plate. The second connecting channel is defined by a second connecting plate groove formed on one surface of the connecting plate and a second pressure chamber substrate groove formed on one surface of the pressure chamber substrate facing one surface of the connecting plate. According to this type of liquid ejector head, by forming a portion of the flow path of the first connecting channel and the second connecting channel on the pressure chamber substrate, it is possible to reduce or prevent the increase of inertial resistance in the first connecting channel and the second connecting channel.

[0110] (14) Alternatively, in the liquid nozzle of the above-described manner, the length of the fifth connecting channel in the second direction is equal to the length of the first connecting plate groove in the second direction, and also equal to the length of the second connecting plate groove in the second direction. With this type of liquid nozzle, it is easy to form the fifth connecting channel, the first connecting channel, and the second connecting channel in the same process.

[0111] (15) Alternatively, in the liquid ejector head of the above-described manner, the third, fourth, and fifth connecting channels are disposed on the connecting plate. According to this method of liquid ejector head, compared with the method in which the third, fourth, and fifth connecting channels are formed across multiple substrates, these channels can be easily formed.

[0112] (16) Alternatively, in the liquid nozzle of the above-described manner, the third and fourth connecting channels are through holes that penetrate the connecting plate along the second direction, and the fifth connecting channel is defined by a third connecting plate groove formed on another surface of the connecting plate and a surface of the nozzle substrate facing the other surface of the connecting plate. According to this method of liquid nozzle, compared to the method where the fifth connecting channel is located at the center in the thickness direction of the connecting plate, forming the fifth connecting channel becomes easier.

[0113] (17) Alternatively, in the liquid ejector head of the above manner, the thickness of the connecting plate in the second direction is greater than the thickness of the pressure chamber substrate in the second direction. This type of liquid ejector head facilitates the formation of multiple flow channels on the connecting plate.

[0114] (18) Alternatively, the liquid ejector head described above may include: a first piezoelectric element for changing the pressure in the first pressure chamber; a second piezoelectric element for changing the pressure in the second pressure chamber; and a wiring board disposed between the first and second piezoelectric elements and for supplying power to both the first and second piezoelectric elements. With this type of liquid ejector head, the liquid is easily subjected to heat transfer from the wiring board, thereby reducing or suppressing a decrease in the liquid's viscosity, and consequently reducing or preventing a decrease in the liquid's ejection performance.

[0115] (19) Alternatively, the liquid nozzle described above may further include: multiple independent flow channels, each including a first pressure chamber, a second pressure chamber, a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel, and a fifth connecting channel; a common supply flow channel, which is shared with the multiple independent flow channels and is used to supply liquid to each of the multiple independent flow channels; and a common discharge flow channel, which is shared with the multiple independent flow channels and is used to discharge liquid from each of the multiple independent flow channels. According to this type of liquid nozzle, it is possible to reduce or prevent a decrease in the spray performance of the liquid ejected from the nozzle in a liquid nozzle having a liquid circulation structure.

[0116] (20) According to another aspect of the present disclosure, a liquid ejection device is provided. The liquid ejection device includes: a liquid ejection head of the above-described manner; and a control device that controls the ejection action of liquid ejected from the liquid ejection head.

[0117] This disclosure can also be achieved through various means other than liquid nozzles and liquid ejection devices. For example, it can be achieved through flow channel structures, methods for manufacturing liquid nozzles, methods for manufacturing liquid ejection devices, etc.

[0118] This disclosure is not limited to inkjet printing, but can also be applied to any liquid ejection device that ejects liquids other than ink, and the liquid ejection head used in such liquid ejection devices. For example, it can be applied to various liquid ejection devices and liquid ejection heads, such as those described below.

[0119] (1) Image recording devices such as fax machines.

[0120] (2) Color material ejection device used in the manufacture of color filters for image display devices such as liquid crystal displays.

[0121] (3) Electrode material ejection device used in the electrode formation of organic EL (Electro Luminescence) displays, field emission displays (FEDs), etc.

[0122] (4) A liquid ejection device that ejects liquids including organic matter from living organisms used in biochip manufacturing.

[0123] (5) Sample ejection device as a precision pipette.

[0124] (6) Lubricating oil spraying device.

[0125] (7) Resin liquid spraying device.

[0126] (8) A liquid spraying device that uses a needle to spray lubricating oil into precision machinery such as clocks and cameras.

[0127] (9) A liquid ejection device for spraying a transparent resin liquid, such as an ultraviolet-curable resin liquid, onto a substrate in order to form a small hemispherical lens (optical lens) or the like used in optical communication components.

[0128] (10) A liquid ejection device for ejecting acidic or alkaline etching solution for etching substrates, etc.

[0129] (11) A liquid ejection device having a liquid consumption head that ejects any other tiny amount of liquid droplets.

[0130] "Droplet" refers to the state of liquid ejected from a liquid ejection device, including granular, tear-like, and filamentous tail-like forms. Furthermore, "liquid" can refer to any material that can be consumed by the liquid ejection device. For example, "liquid" can refer to any material in a liquid phase state, including materials with high or low viscosity, as well as liquid materials such as sols, gel water, other inorganic solvents, organic solvents, solutions, liquid resins, and liquid metals (molten metal). In addition to liquids as a state of matter, substances in which functional material particles composed of solids such as pigments and metal particles are dissolved, dispersed, or mixed in a solvent are also included in "liquid." Furthermore, representative examples of combinations of the first and second liquids, besides the combination of ink and reaction liquid as described in the above embodiments, include the following combinations.

[0131] (1) The adhesive base and curing agent;

[0132] (2) Primer and thinner, varnish and thinner for coatings;

[0133] (3) The main solvent and diluent solvent of cells containing cell ink;

[0134] (4) Metal pigment dispersions and diluents for inks that express a metallic luster (metallic inks);

[0135] (5) Gasoline / diesel fuels for vehicles and biofuels;

[0136] (6) The main pharmaceutical components and protective components of the drug;

[0137] (7) The phosphor of a light-emitting diode (LED) and the sealing material.

[0138] Symbol Explanation

[0139] 1, 1b, 1R…Liquid ejector head; 2…Connecting plate; 3…Pressure chamber substrate; 4…Vibrating plate; 5…Storage chamber forming substrate; 8…Wiring substrate; 50…Opening; 51…Inlet; 52…Outlet; 60…Nozzle substrate; 61, 62…Plastic sheet; 81…Drive circuit; 90…Control device; 91…Moving mechanism; 92…Conveying mechanism; 93…Liquid container; 94…Circulation mechanism; 100…Liquid ejection device; 810…Wiring; 921…Receiving box; 922…Seamless belt; CB1…First pressure chamber; CB2…Second pressure chamber; CBq…Pressure chamber; Ln…Nozzle array; Nz…Nozzle; PP…Media; PZ1…First piezoelectric element; PZ2…Second… Two piezoelectric elements; PZq…piezoelectric element; RA1…common supply channel; RA2…common discharge channel; RB1…common supply channel; RB2…common discharge channel; RJ…circulation channel; RK1, RK2, RX1, RX2…connecting channels; RR1, RR1b…first connecting channel; RR11…recessed portion of first pressure chamber substrate; RR12…recessed portion of first connecting plate; RR2, RR2b…second connecting channel; RR21…recessed portion of second pressure chamber substrate; RR22…recessed portion of second connecting plate; RR3…third connecting channel; RR4…fourth connecting channel; RR5…fifth connecting channel; ZDq…lower electrode; ZMq…piezoelectric element; ZUq…upper electrode.

Claims

1. A liquid ejector head, comprising: A pressure chamber substrate having a first pressure chamber extending along a first direction and a second pressure chamber extending along the first direction; A nozzle substrate having a nozzle disposed thereon; The third connecting channel extends along a second direction that intersects the first direction, with the pressure chamber substrate and the nozzle substrate as its two ends. A fourth connecting channel extends along the second direction, with the pressure chamber substrate and the nozzle substrate as its two ends. A first connecting channel is connected to the first pressure chamber and the third connecting channel, and extends along the first direction within a range that does not overlap with the third connecting channel; The second connecting channel is connected to the second pressure chamber and the fourth connecting channel, and extends along the first direction within a range that does not overlap with the fourth connecting channel; A fifth connecting channel, which connects to the third and fourth connecting channels, extends along the first direction within a range that does not overlap with the third and fourth connecting channels, and has the nozzle disposed therein. The length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first connecting channel in the first direction and the lengths of the second connecting channel in the first direction.

2. The liquid ejector head as described in claim 1, wherein, The length of the fifth connecting channel in the first direction is shorter than the length of the first connecting channel in the first direction, and shorter than the length of the second connecting channel in the first direction.

3. The liquid ejector head as described in claim 1 or 2, wherein, The length of the fifth connecting channel in the first direction is shorter than the length of the first pressure chamber in the first direction, and also shorter than the length of the second pressure chamber in the first direction.

4. The liquid ejector head as described in claim 1, wherein, The length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first pressure chamber in the first direction and the lengths of the second pressure chamber in the first direction.

5. The liquid ejector head as described in claim 3, wherein, The length of the first connecting channel in the first direction is shorter than the length of the first pressure chamber in the first direction. The length of the second connecting channel in the first direction is shorter than the length of the second pressure chamber in the first direction.

6. The liquid ejector head as claimed in claim 1, wherein, The length of the fifth connecting channel in the first direction is shorter than the sum of the lengths of the first connecting channel in the first direction, the second connecting channel in the first direction, the first pressure chamber in the first direction, and the second pressure chamber in the first direction.

7. The liquid ejector head as claimed in claim 1, wherein, The length of the fifth connecting channel in the second direction is shorter than the length of the first connecting channel in the second direction, and also shorter than the length of the second connecting channel in the second direction.

8. The liquid ejector head as claimed in claim 1, wherein, The length of the fifth connecting channel in the second direction is equal to the length of the first connecting channel in the second direction, and is also equal to the length of the second connecting channel in the second direction.

9. The liquid ejector head as claimed in claim 1, wherein, The length of the fifth connecting channel in the second direction is shorter than the length of the first pressure chamber in the second direction, and also shorter than the length of the second pressure chamber in the second direction.

10. The liquid ejector head as claimed in claim 1, wherein, It has a connecting plate, the connecting plate having a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel, and a fifth connecting channel. The pressure chamber substrate is stacked on one surface of the connecting plate. The nozzle substrate is stacked on the other side of the connecting plate.

11. The liquid ejector head as claimed in claim 10, wherein, The first communication channel is defined by a first communication plate groove formed on one surface of the communication plate and a surface of the pressure chamber substrate facing one surface of the communication plate. The second communication channel is defined by a second communication plate groove formed on one side of the communication plate and a surface of the pressure chamber substrate facing one side of the communication plate.

12. The liquid ejector head as claimed in claim 10, wherein, The first communication channel is defined by a first communication plate groove formed on one surface of the communication plate and a first pressure chamber substrate groove formed on one surface of the pressure chamber substrate opposite to one surface of the communication plate. The second communication channel is defined by a second communication plate groove formed on one side of the communication plate and a second pressure chamber substrate groove formed on one side of the pressure chamber substrate opposite to one side of the communication plate.

13. The liquid ejector head as claimed in claim 12, wherein, The length of the fifth connecting channel in the second direction is equal to the length of the first connecting plate groove in the second direction, and is also equal to the length of the second connecting plate groove in the second direction.

14. The liquid ejector head according to any one of claims 10 to 13, wherein, The third, fourth, and fifth connecting channels are disposed on the connecting plate.

15. The liquid ejector head as claimed in claim 10, wherein, The third and fourth connecting channels are through holes that penetrate the connecting plate along the second direction. The fifth communication channel is defined by a third communication plate groove formed on another side of the communication plate and a surface of the nozzle substrate facing the other side of the communication plate.

16. The liquid ejector head as claimed in claim 10, wherein, The thickness of the connecting plate in the second direction is greater than the thickness of the pressure chamber substrate in the second direction.

17. The liquid ejector head as claimed in claim 1, comprising: A first piezoelectric element is used to change the pressure in the first pressure chamber; The second piezoelectric element is used to change the pressure in the second pressure chamber; A wiring board is disposed between the first piezoelectric element and the second piezoelectric element, and is used to supply power to the first piezoelectric element and the second piezoelectric element.

18. The liquid ejector head as described in claim 1, further comprising: Multiple independent flow channels, the independent flow channels including a first pressure chamber, a second pressure chamber, a first connecting channel, a second connecting channel, a third connecting channel, a fourth connecting channel, and a fifth connecting channel; A common supply channel is shared and connected to the plurality of independent channels, and is used to supply liquid to each of the plurality of independent channels; A common discharge channel is shared and connected to the plurality of independent channels, and is used to discharge liquid from each of the plurality of independent channels.

19. A liquid ejection device, comprising: The liquid ejector head as described in any one of claims 1 to 18; A control device that controls the ejection action of liquid from the liquid ejection head.

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