Micro-component structure and method for manufacturing the same, and method for transferring LED chip

By introducing a stacked adhesive layer structure with spacing in the micro-component structure, the photodegradable adhesive layer is dissociated by a low-energy laser and the laser is blocked by the pyrolytic adhesive layer, which solves the problem of LED chip damage during laser transfer and improves the transfer yield and bonding force.

CN115706134BActive Publication Date: 2026-04-14CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
2 Cites 0 Cited by

Patent Information

Application Number
CN202110930516.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-08-13
Publication Date
2026-04-14
Estimated Expiration
2041-08-13

AI Technical Summary

Technical Problem

In the fabrication process of micro LED display panels, the laser transfer process causes significant damage to the LED chips, resulting in a low chip transfer yield.

Method used

In a micro-device structure, a stacked adhesive layer structure with spaced distribution is introduced, including a photodegradable adhesive layer and a thermal degradable adhesive layer. The photodegradable adhesive layer is in contact with the substrate, and the thermal degradable adhesive layer is located between the lead-out electrodes. The photodegradable adhesive layer is dissociated by a low-energy laser, and the thermal degradable adhesive layer blocks the direct irradiation of the chip by the laser.

Benefits of technology

It significantly reduces laser damage to LED chips, improves chip transfer yield, and enhances the bonding force between the chip and the display backplane.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The application relates to a micro component structure and a preparation method thereof and a transfer method of an LED chip, wherein the micro component structure comprises a substrate, a plurality of stacked glue layer structures arranged at a first surface of the substrate in a spaced manner and a plurality of LED chips arranged on the plurality of stacked glue layer structures correspondingly, the LED chip has two lead electrodes towards the surface of the stacked glue layer structure; the stacked glue layer structure comprises a photolysis glue layer and a pyrolysis glue layer arranged in a laminated mode, the photolysis glue layer is in contact with the first surface, the pyrolysis glue layer is located between the two lead electrodes, and the thickness of the pyrolysis glue layer is greater than the height of the lead electrodes. When the LED chip on the micro component structure is transferred through laser, the laser energy required for dissociating the photolysis glue layer in the stacked glue layer structure is low, so that the damage to the chip in the transfer process is small, and the existence of the pyrolysis glue layer can further slow down the damage of the laser to the chip, and the transfer yield of the chip is improved.
Need to check novelty before this filing date? Find Prior Art