Vacuum device, device for manufacturing electronic components
By using a support unit in the vacuum device to change the angle of the fixed surface of the chamber, the problems of chamber tilting and connection damage in large vacuum devices are solved, and efficient integrated transportation and assembly of multiple chambers are realized.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CANON TOKKI CORP
- Filing Date
- 2022-08-22
- Publication Date
- 2026-05-22
AI Technical Summary
In large vacuum devices, problems such as chamber tilting and connection damage caused by cantilever beam structures limit the efficiency of chamber transport and assembly.
By employing a support unit, the angle between the fixed surfaces of the first and second chambers can be changed through the connecting part, thereby achieving bending support and reducing labor and time during assembly.
The integrated transport of multiple chambers within a small space reduces labor and time during assembly and avoids size limitations during transport.
Smart Images
Figure CN115714096B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to vacuum devices and manufacturing apparatus for electronic devices. Background Technology
[0002] In vacuum equipment, there are known devices that have multiple chambers configured to reduce internal pressure. For example, in manufacturing apparatuses for electronic devices such as organic EL display devices, multiple cluster units and relay units are typically arranged alternately. The cluster units have chambers such as transport chambers and film deposition chambers for substrate film deposition processes. The relay units have chambers such as swirl chambers and path chambers, and are arranged between the cluster units for substrate transport processes. The chambers of these devices are each mounted on independent racks and transported to the factory or other facilities while each chamber is separate. Therefore, during assembly and manufacturing, the vertical and horizontal positions of the chambers need to be adjusted in order to connect them to each other.
[0003] On the other hand, Patent Document 1 discloses a structure in which multiple chambers are supported by a single frame. Additional chambers are connected to both ends of the chambers supported by the frame, and multiple chambers are supported by a single frame in a so-called cantilever beam configuration.
[0004] Prior art literature
[0005] Patent documents
[0006] Patent Document 1: Japanese Patent Application Publication No. 10-247675
[0007] As mentioned above, the structure in which multiple chambers are supported by a single frame saves labor and time in adjusting the position during assembly of the device after transport. However, in the case of large devices, the same structure cannot be used due to the anticipated problems of chamber tilting and damage to connections in the cantilever beam configuration, as well as the constraints imposed by the size limitations of the transport. Summary of the Invention
[0008] The purpose of this invention is to enable the integrated transport of multiple chambers in a small space within a vacuum device having multiple chambers configured to be depressurized internally, thereby reducing labor and time during assembly.
[0009] Solution for solving the problem
[0010] The vacuum device of the present invention comprises:
[0011] First chamber;
[0012] A second chamber, connected to the first chamber; and
[0013] Support unit, supporting the first chamber and the second chamber,
[0014] Its features are,
[0015] The support unit comprises: a first base having a first fixing surface for fixing the bottom surface of the first chamber; a second base having a second fixing surface for fixing the bottom surface of the second chamber; and a connecting portion for connecting the first base and the second base.
[0016] The support unit is bent through the connecting part to change the angle between the surface along the first fixed surface and the surface along the second fixed surface.
[0017] The effects of the invention
[0018] According to the present invention, in a vacuum device having multiple chambers configured to be depressurized internally, multiple chambers can be transported integrally in a small space, thereby reducing labor and time during assembly. Attached Figure Description
[0019] Figure 1 This is a schematic diagram showing a part of an electronic device manufacturing apparatus.
[0020] Figure 2 This is a schematic diagram of a relay device in its setup state.
[0021] Figure 3 This is a schematic 3D view of a relay device in its setup state.
[0022] Figure 4 is a schematic diagram of the relay device in the transmission state.
[0023] Figure 5 This is a schematic three-dimensional diagram of a relay device in the transmission state.
[0024] Figure 6 This is a schematic diagram of the connection part in the conveying state.
[0025] Figure 7 This is a schematic main view of the connection section in its set state.
[0026] Figure 8 This is a schematic bottom view of the connection section in its set state.
[0027] Figure 9 This is a schematic three-dimensional view of the connecting part.
[0028] Figure 10 This is a schematic diagram illustrating the drive mechanism of the leg components.
[0029] Figure 11 This is a schematic front view of the connection part in the transport state of a modified example.
[0030] Figure 12 This is an explanatory diagram of an organic EL display device according to an embodiment of the present invention.
[0031] Explanation of reference numerals in the attached figures
[0032] Rotation chamber (first chamber)...21, Path chamber (second chamber)...22, Support unit...25, Platform (first platform)...251, Fixed surface (first fixed surface)...251a, Movable platform (second platform)...252, Fixed surface (second fixed surface)...251b, Connecting part...253. Detailed Implementation
[0033] Hereinafter, with reference to the accompanying drawings, embodiments are described in detail by way of example for carrying out the present invention. However, it should be noted that the dimensions, materials, shapes, and relative arrangements of the components described in this embodiment are appropriately modified according to the construction and various conditions of the device to which the present invention is applied. That is, the scope of the present invention is not limited to the embodiments described below.
[0034] This invention relates to a vacuum apparatus comprising multiple chambers configured to allow for internal decompression. The invention can be applied, for example, to apparatuses for depositing various materials onto the surface of a substrate to form a film, and is preferably applied to apparatuses for forming thin films (material films) with desired patterns by vacuum evaporation. As the substrate material, any material can be selected, such as glass, a film of a polymer material, a silicon wafer, or a metal; for example, the substrate can be a glass substrate onto which a thin film such as polyimide is deposited. Furthermore, as the evaporation material, any material can be selected, such as organic materials or metallic materials (metals, metal oxides, etc.). In addition to the vacuum evaporation apparatus described below, the invention can also be applied to film-forming apparatuses including sputtering apparatuses and CVD (Chemical Vapor Deposition) apparatuses. Specifically, the technology of this invention can be applied to manufacturing apparatuses for organic electronic devices (e.g., organic light-emitting elements, thin-film solar cells), optical components, etc. Among these, a preferred application example of the invention is a manufacturing apparatus for forming organic light-emitting elements by evaporating evaporation materials and depositing them onto a substrate via a mask. The following description uses the application of the present invention to an electronic device manufacturing apparatus as an example, but the vacuum device of the present invention is not limited thereto and can be applied to various vacuum devices having multiple chambers.
[0035] [Electronic device manufacturing equipment]
[0036] Figure 1 It is a top view schematically showing a part of the structure of an electronic device manufacturing apparatus. Figure 1Manufacturing apparatuses are used, for example, to manufacture display panels for OLED display devices used in smartphones or OLED display devices used in VRHMDs. In the case of display panels for smartphones, for example, a 4.5-generation substrate (approximately 700mm x approximately 900mm), a 6th-generation full-size substrate (approximately 1500mm x approximately 1850mm), or a half-size substrate (approximately 1500mm x approximately 925mm) is used. After forming an organic EL element on this substrate, the substrate is cut to produce multiple small-sized panels. In the case of display panels for VRHMDs, for example, a silicon wafer of a specified size (e.g., 300mm) is used. After forming an organic EL element on this silicon wafer, the silicon wafer is cut along the area between the element formation areas (scribe lines) to produce multiple small-sized panels.
[0037] Electronic device manufacturing apparatuses generally include multiple cluster units 1 and relay units 2 connecting the cluster units 1 between them. Each cluster unit 1 includes multiple film deposition units 11 for processing substrates (e.g., film deposition), multiple mask storage units 12 for storing masks before and after use, and a transfer chamber 13 disposed centrally within them. Figure 1 As shown, the transfer chamber 13 is connected to multiple film-forming devices 11 and a mask storage device 12.
[0038] A transport robot 14 for transporting substrates and masks is disposed within the transport chamber 13. The transport robot 14 transports substrates from the path chamber 22 of the relay device 2 disposed upstream to the film forming apparatus 11. In addition, the transport robot 14 transports masks between the film forming apparatus 11 and the mask storage device 12. The transport robot 14 is, for example, a robot with a structure having a robotic hand mounted on a multi-jointed arm to hold the substrate or mask.
[0039] In the film deposition apparatus 11 (also called the film deposition chamber or vapor deposition apparatus), the vapor deposition material stored in the evaporation source is heated and evaporated by a heater, and then deposited onto the substrate through a mask. The film deposition apparatus 11 performs a series of film deposition processes, including the transfer of the substrate to the transfer robot 14, the adjustment (alignment) of the relative position of the substrate and the mask, the fixing of the substrate onto the mask, and film deposition.
[0040] In the mask storage device 12, new masks used in the film forming process of the film forming device 11 and used masks are stored in two separate boxes. The transfer robot 14 moves the used masks from the film forming device 11 to the boxes in the mask storage device 12, and moves the new masks stored in the other boxes in the mask storage device 12 to the film forming device 11.
[0041] The cluster device 1 is connected to a path chamber 22 for supplying substrates from the upstream side of the substrate flow direction to the cluster device 1, and a path chamber 22 for supplying substrates that have undergone film deposition in the cluster device 1 to other cluster devices on the downstream side. A transport robot 14 in the transport chamber 13 receives substrates from the upstream path chamber 22 and transports them to one of the film deposition devices 11 within the cluster device 1. Additionally, the transport robot 14 receives substrates that have undergone film deposition in the cluster device 1 from one of the multiple film deposition devices 11 and transports these substrates to the path chamber 22 of the relay device 2 connected to the downstream side.
[0042] The relay device 2 is equipped with a rotating chamber 21 for changing the orientation of the substrate and path chambers 22 respectively located on the upstream and downstream sides of the rotating chamber 21, for transporting substrates from the upstream cluster device 1 to the downstream cluster device 1. A transport robot 24 is installed in the rotating chamber 21, which receives the substrate from the upstream path chamber 22, rotates the substrate 180°, and transports it to the downstream path chamber 22. Therefore, since the substrates transported into the upstream and downstream cluster devices 1 have the same orientation, substrate processing becomes easier.
[0043] In this embodiment, the path chamber 22 includes a mounting stage for substrate placement. The path chamber 22, located upstream of the rotary chamber 21 in the relay device 2, has a fixed mounting stage that does not move or rotate. On the other hand, the path chamber 22 located downstream of the rotary chamber 21 includes an alignment mechanism, enabling the mounting stage to move in a first direction parallel to the mounting surface, move in a second direction parallel to the mounting surface and orthogonal to the first direction, and rotate around a third direction orthogonal to the first and second directions. By aligning the substrate in the relay device 2 beforehand, the alignment process can be made more efficient.
[0044] Alternatively, a buffer chamber 23 can be provided on the downstream side of the cluster device 1 instead of a path chamber 22. The relay device 2 provided on the upstream and / or downstream side of the cluster device 1 includes at least one of a swivel chamber 21, a path chamber 22, and a buffer chamber 23.
[0045] Cluster device 1 and relay device 2 are vacuum devices, and the internal chambers of the multiple chambers constituting cluster device 1 and relay device 2 can be depressurized. Film forming device 11, mask storage device 12, transfer chamber 13, buffer chamber 23, cyclone chamber 21, etc., are maintained at a high vacuum state during the manufacturing process of organic light-emitting elements. Path chamber 22 is usually maintained at a low vacuum state, but can also be maintained at a high vacuum state as needed.
[0046] In this embodiment, refer to Figure 1The structure of the electronic device manufacturing apparatus has been described, but the present invention is not limited thereto, and other types of devices and chambers may be used, and the arrangement of these devices and chambers may also be changed. For example, the electronic device manufacturing apparatus according to one embodiment of the present invention may also be an inline type instead of... Figure 1 The cluster type is shown. That is, it can also have a structure in which the substrate and mask are mounted on a carrier and film is formed while being transported within multiple film-forming devices arranged in a row. In addition, it can also have a structure that combines the cluster type and the linear type. For example, it is also possible for the film formation up to the base layer to be performed by the cluster type manufacturing device, while the sealing process and the cutting process from the film formation process of the electrode layer (cathode layer) onwards are performed by the linear type manufacturing device.
[0047] [Relay device]
[0048] Reference Figures 2-5 The relay device 2 according to an embodiment of the present invention will be described. In this embodiment, the length direction in which the substrate is transported from the upstream chamber to the downstream chamber in the substrate transport direction is defined as the X direction, the width direction orthogonal to the length direction is defined as the Y direction, and the height direction orthogonal to both the length and width directions is defined as the Z direction. The length direction (X direction) is also the direction of movement of the substrate between the chambers.
[0049] The relay device 2 in this embodiment has a characteristic structure that allows switching between two states: a setting state for transferring substrates between cluster devices and a transport state for transporting to a factory or other transport device. Figure 2 (a) is a schematic top view showing the structure of the relay device 2 in an arrangement where the swivel chamber 21 is connected to the path chamber 22 and the substrate can be transported between the swivel chamber 21 and the path chamber 22. Figure 2 (b) is its schematic front view. Figure 3 This is a schematic perspective view of the relay device 2 in its configured state. In this embodiment, the relay device 2 has path chambers 22 (second chamber and third chamber) adjacent to the upstream and downstream sides of the swivel chamber 21 (first chamber), and includes support units 25 that support the swivel chamber 21 and the path chambers 22. Furthermore, the relay device 2 has a gate valve 26 between the swivel chamber 21 and the path chambers 22, and the gate valve 26 is connected to the path chambers 22 via a transition plate 27.
[0050] The support unit 25 includes a base 251 (first base) supporting the rotary chamber 21, a movable base 252 (second base, third base) supporting the path chamber 22, and a connecting portion 253 connecting the base 251 and the movable base 252. The bottom surface of the rotary chamber 21 is fixed to the fixed surface 251a (first fixed surface) of the base 251. Similarly, the bottom surface of the path chamber 22 is fixed to the fixed surface 252a (second fixed surface, third fixed surface) of the movable base 252. Furthermore, the support unit 25 includes: a support column structure 254 supporting the base 251 from below; a leg member 255 supporting the movable base 252 from below; and a shaft clamping member 256 serving as a leg connecting member connecting the leg member 255 and the movable base 252.
[0051] The swivel chamber 21 in this embodiment is hexagonal when viewed from above. The support structure 254 that supports the swivel chamber 21 from below via the pedestal 251 consists of multiple supports, including supports for each vertex of the hexagon. Furthermore, the support structure 254 is equipped with a leveling device 2541 that allows for height-direction position adjustment during device assembly.
[0052] In this embodiment, the path chamber 22 is rectangular when viewed from above and is fixed to the movable base 252. In the relay device 2 in its installed state, the fixed surface 251a of the base 251, to which the rotary chamber 21 is fixed, and the fixed surface 252a of the movable base 252, to which the path chamber 22 is fixed, are arranged parallel to each other. The movable base 252 is supported on the leg member 255 via the shaft clamping member 256. Furthermore, the movable base 252 is connected to the base 251 via a connecting portion 253 composed of multiple components. That is, in the installed state, the movable base 252 is supported on the leg member 255 and the connecting portion 253. In addition, the leg member 255 has a level adjuster 2551, which, like the support structure 254, allows for height-direction position adjustment.
[0053] Furthermore, in this embodiment, the movable platform 252 is rotatably supported on the connecting portion 253 about its width direction (Y direction) as the axis of rotation. When the connection between the path chamber 22 and the swivel chamber 21 is released, and the movable platform 252 is rotated, the path chamber 22 rotates together with the movable platform 252. In addition, the leg member 255 is also rotatably supported on the shaft clamping member 256 about its width direction as the axis of rotation. The relay device 2 in the set state can be switched to the conveying state described later by rotating the movable platform 252 and the leg member 255 respectively. The structure that allows the movable platform 252 and the leg member 255 to rotate will be described in detail later.
[0054] Figure 4(a) is a schematic top view of the structure of the relay device 2 in the transmission state, and Figure 4(b) is a schematic front view of it. Figure 5This is a schematic perspective view of the relay device 2 in the transport state. In the relay device 2 in the transport state, the support unit 25 is bent so that the angle between the fixed surface 251a of the platform 251 and the fixed surface 252a of the movable platform 252 is approximately right-angled. Furthermore, the leg member 255 is folded relative to the movable platform 252 in a direction parallel to the fixed surface 252a of the movable platform 252. In this embodiment, the relay device 2 is configured such that the distance M1 from the rotation axis portion 252b, which is the rotation center of the movable platform 252, to the lower end of the support structure 254 is greater than the distance M2 from the rotation axis portion 252b to the end away from the connecting portion 253 of the movable platform 252. By adopting such a structure, when the movable platform 252 rotates relative to the platform 251, the movable platform 252 does not interfere with the ground, and the support unit 25 is bent at approximately a right angle, thus reducing the size of the relay device 2 during transport.
[0055] Furthermore, to avoid interference between the leg member 255 and the support structure 254, the leg member 255 is rotatably supported on the shaft clamping member 256 connected to the movable platform 252, and can be folded relative to the movable platform 252. That is, in the transport state, the movable platform 252 is supported only by the connecting part 253. In addition, if the weight of the movable platform 252, which includes the path chamber 22, is too large and the support by the connecting part 253 alone is insufficient, a modified structure can be considered that connects the movable platform 252 and the support structure 254 with another member to provide more secure support during transport.
[0056] As described above, by configuring the support unit 25 to be flexible, the angle between the fixed surface 252a and the fixed surface 251a changes, and the total length L2 of the relay device 2 in the transport state can be reduced compared to the total length L1 in the installation state. By deforming the device to reduce the total length of its largest side, significant advantages can be obtained during transport, such as reduced transport space and avoidance of size limitations during transport. In other words, since the relay device 2 of the present invention can transport multiple chambers as a single unit, position adjustments during installation can be easily made. Moreover, compared to the case where only the chambers and the platform are connected, the size of the device can be reduced for transport, thus helping to save space and avoiding size limitations during transport.
[0057] The gate valve 26 includes a disc 261 (valve core) and a body 262 (valve body). Movement of the disc 261 opens and closes the passage for the base plate to pass from the interior of the swivel chamber 21 to the interior of the path chamber 22. On the opposite side of the gate valve 26 from the surface connected to the swivel chamber 21, a transition plate 27 for connecting to the path chamber 22 is provided. The transition plate 27 and the path chamber 22 are connected by screws (not shown), and can be tightened using the screws by removing the cover on the upper surface of the path chamber 22. The transition plate 27 has sealing grooves 27a with sealing rings 28 on both the surface connected to the gate valve 26 and the surface connected to the path chamber 22. By connecting the gate valve 26 to the path chamber 22 via the transition plate 27 with the sealing grooves 27a, air leakage from the connection between the gate valve 26 and the path chamber 22 can be prevented. The disk 261 is raised to block the channel through which the substrate passes, and the gate valve 26 is closed. After sealing each chamber, a pump is used to evacuate the vacuum, thereby maintaining each chamber in a low vacuum or high vacuum state.
[0058] The transfer device 2 in the transport state can also seal each chamber to prevent moisture or other contaminants from entering the chambers during sea transport. Therefore, in the transport state, the cyclone chamber 21 is sealed by closing the gate valves 26 at both ends. Furthermore, the path chamber 22 is sealed by installing blanks 41 at both ends. The blanks 41 are made of SUS metal plates or similar materials with a thickness of approximately 5-20 mm. After sealing, the interiors of the cyclone chamber 21 and the path chamber 22 are depressurized to create a vacuum state for transport.
[0059] [Connecting part 253]
[0060] Reference Figures 6-9 The connection portion 253 between the connecting base 251 and the movable base 252 will be described below. Hereinafter, the movable base 252 (second base) and the connection portion 253, which are connected to the path chamber 22 located downstream of the rotary chamber 21, will be described using the accompanying drawings. Furthermore, the movable base 252 (third base) and the connection portion 253 (connection portion for the third base), which are connected to the path chamber 22 located upstream of the rotary chamber 21, have the same structure as the downstream side, and therefore their description is omitted.
[0061] Figure 6 (a) is a schematic top view showing the structure of the connecting part 253 in the conveying state. Figure 6(b) is a schematic front view. In this embodiment, the connecting portion 253 consists of three components: a platform connecting member 2531 connected to the platform 251; an intermediate member 2532 engaged with a pin member 38 connected to the lower surface of the path chamber 22; and a shaft clamping member 2533 through which the rotating shaft portion 252b of the movable platform 252 is inserted. The platform connecting member 2531 is connected to the platform 251 by screws 35 and extends along the length direction (X direction) beside the space where the disc body 261 of the gate valve 26 moves, and is respectively provided on both sides of the relay device 2 in the width direction. The intermediate member 2532 is a member that is long in the width direction (Y direction) of the relay device 2, and is connected to the platform connecting member 2531 at both ends in the width direction by screws 33 and 34. That is, the connecting part 253 is configured such that the main body 262 of the gate valve 26 and the space for the disc body 261 to move are surrounded by the base 251, the base connecting member 2531, and the intermediate member 2532. Furthermore, a pin hole 2532a is provided in the intermediate member 2532 for engaging with the pin member 38 connected to the path chamber 22. A pair of shaft clamping members 2533 are connected to both ends of the intermediate member 2532 in the width direction by screws 32. Moreover, the shaft clamping members 2533 support the movable base 252 by engaging with the rotating shaft portion 252b of the movable base 252 through the rotating shaft support hole 2533a.
[0062] Figure 7 (a) is a schematic front view showing the detailed structure of the connection part 253 in the set state. Figure 7 (b) is not shown. Figure 7 (a) is a schematic front view of the screw components, etc. The shaft clamping member 2533 has a rotating shaft support hole 2533a, a notch 2533b, a clamping threaded hole 2533c, a through hole 2533d (non-threaded hole), and a through elongated hole 2533e. The rotating shaft portion 252b of the movable base 252 is inserted into the rotating shaft support hole 2533a. The notch 2533b extends from the rotating shaft support hole 2533a to the end of the shaft clamping member 2533. The clamping threaded hole 2533c and the through hole 2533d extend perpendicularly to the face of the notch 2533b along the same central axis, and are through which the clamping screw 31 is inserted. By installing and tightening the clamping screw 31 into the clamping threaded hole 2533c, the shaft clamping member 2533 elastically deforms, securing the rotating shaft portion 252b of the movable base 252 in the rotating shaft support hole 2533a. That is, by loosening the clamping screw 31, the movable platform 252 can be rotated relative to the platform 251, and by tightening the clamping screw 31, the movable platform 252 can be fixed at a predetermined rotational position relative to the platform 251.
[0063] The through-hole 2533e is a hole through which the screw 32 for connection with the intermediate member 2532 is inserted, and two through-holes are provided on each shaft clamping member 2533. The through-hole 2533e is an elongated hole in the length direction (X direction) for adjusting the position of the path chamber 22 relative to the rotary chamber 21 when the movable base 252 is connected to the adapter plate 27. By providing two through-holes 2533e, the movable base 252 is firmly supported, and the shaft clamping member 2533 is prevented from rotating relative to the intermediate member 2532 when the screw 32 is loosened, thus improving the operability of the device setup operation. The details of the operation of connecting the movable base 252 to the adapter plate 27 while adjusting the position of the movable base 252 to put the relay device 2 into the setup state will be described later.
[0064] The pedestal connecting member 2531 and the intermediate member 2532 are connected by screws 33 mounted on the side and screws 34 mounted on the lower surface. The pedestal connecting member 2531 has a longitudinal wall portion 2531a, in which a screw 33 is inserted. The screw 34 mounted on the lower surface of the pedestal connecting member 2531 is inserted into a threaded hole in the lower part of the intermediate member 2532. In addition, a pin member 38 connected to the path chamber 22 engages with a pin hole 2532a in the intermediate member 2532.
[0065] Figure 8 (a) is a schematic bottom view showing the detailed structure of the connecting part 253. Figure 8 (b) is not shown. Figure 8 (a) is a schematic bottom view of screw components, etc. Furthermore, Figure 9 This is a detailed drawing showing the detailed structure of the connecting part 253. The platform connecting member 2531 is connected to the intermediate member 2532 by screws 33 inserted into the through hole 2531b of the longitudinal wall part 2531a provided on the side side and screws 34 inserted into the through elongated hole 2531c provided on the lower surface side. The through elongated hole 2531c is an elongated hole shape that extends in the width direction (Y direction) when the movable platform 252 is connected to the adapter plate 27, in order to adjust the position of the path chamber 22 relative to the rotary chamber 21 in the width direction. That is, the through elongated hole 2533e of the shaft clamping member 2533 and the through elongated hole 2531c of the platform connecting member 2531 extend in mutually orthogonal directions. A gap of about 5 to 20 mm is provided between the longitudinal wall portion 2531a of the pedestal connecting member 2531 and the end of the intermediate member 2532 facing the longitudinal wall portion 2531a. This gap is used for the intermediate member 2532 to move together with the path chamber 22 relative to the pedestal connecting member 2531 in the width direction.
[0066] Furthermore, the connecting portion 253 in this embodiment is composed of three types of components, but the connecting portion 253 may also be composed of more than one type of component. In addition, a space for the disc 261 of the gate valve 26 to move is provided on the connecting portion 253, but it is also conceivable to use a gate valve 26 with the disc 261 moving upward and not provide a space for the disc 261 to move on the connecting portion 253.
[0067] Furthermore, the elongated hole provided on the connecting part is not limited to the structure described above. For example, the hole through which the screw is inserted for connecting the connecting part 253 and the base 251 may also be formed as an elongated hole.
[0068] [Leg Components]
[0069] Figure 10 (a) is a schematic diagram showing the folded state of the leg member 255 relative to the movable base 252. Figure 10 (b) is a schematic diagram showing the state in which the leg member 255 supports the movable platform 252. When the relay device 2 is in the set state, the leg member 255 supporting the movable platform 252 is connected via the shaft clamping member 256. Furthermore, when the movable platform 252 rotates relative to the platform 251, to prevent the leg member 255 from interfering with the ground and being unable to rotate, the leg member 255 is also supported on the shaft clamping member 256 in a manner that allows it to rotate relative to the movable platform 252.
[0070] The shaft clamping member 256 has a rotating shaft support hole, a notch, a clamping threaded hole, and a through hole (non-threaded hole), and is connected to the movable base 252 by a screw 36. The rotating shaft support hole engages with the rotating shaft portion 255a of the leg member 255. The notch extends from the rotating shaft support hole to the end of the shaft clamping member 256. The clamping screw hole and the through hole extend perpendicularly to the face of the notch on the same central axis and allow the clamping screw to pass through. By installing and tightening the clamping screw 37 in the clamping threaded hole, the shaft clamping member 256 elastically deforms and secures the rotating shaft portion 255a of the leg member 255 in the rotating shaft support hole. That is, by loosening the clamping screw 37, the leg member 255 can rotate relative to the movable base 252, and by tightening the clamping screw 37, the leg member 255 is fixed in position relative to the movable base 252. By forming the structure described above, in the transport state, the leg member 255 is fixed in a folded state relative to the movable platform 252, and the leg member 255 does not interfere with the support structure 254.
[0071] Furthermore, in this embodiment, the relay device 2 is a structure in which the leg member 255 is also connected to the movable platform 252 in the transport state. However, it can also be a structure without rotation function that allows transport with the leg member 255 removed. Additionally, to prevent the leg member 255 from interfering with the support structure 254 when the relay device 2 bends, it can be configured to allow the length of the leg member 255 to extend or retract. Moreover, as a variation, it is certainly conceivable to construct a structure that provides more robust support by increasing the number of leg members.
[0072] [Setup of Relay Device 2]
[0073] The method for assembling the relay device 2, which will be transported to a factory or other facility in a conveying state, into a set-up state will be described. First, to connect the relay device 2 and the cluster device 1 at the same height along the through line, the height is adjusted using a leveling adjuster 2541 provided on the support structure 254. Next, the fastening of the shaft clamping member 2533 is loosened, allowing the movable platform 252 to rotate so that the fixed surface 252a of the movable platform 252 is approximately parallel to the fixed surface 251a of the platform 251. At the same time, the fastening of the shaft clamping member 256 is also loosened, allowing the leg member 255 to rotate and support the movable platform 252 and the path chamber 22. Then, the leveling adjuster 2551 of the leg member 255 is used to fix the posture of the movable platform 252 and support the path chamber 22 from below. Thus, the path chamber 22 is supported on the connecting part 253 and the leg member 255 via the movable platform 252.
[0074] Next, in order to connect the path chamber 22 and the rotary chamber 21, the position of the path chamber 22 relative to the rotary chamber 21 is finely adjusted. Since the path chamber 22 is connected to the adapter plate 27 by screw components, positional adjustments in various directions are required to ensure that the positions of the threaded fastening holes are consistent in each other's components. The path chamber 22 is fixed to the movable base 252 using screw components that pass through the bottom of the movable base 252. By clamping a shim between the path chamber 22 and the movable base 252, the position of the path chamber 22 in the height direction relative to the rotary chamber 21 can be finely adjusted. In addition, the horizontal position of the path chamber 22 relative to the rotary chamber 21 can be finely adjusted using a through hole 2533e that is long in the length direction (X direction) and a through hole 2531c that is long in the width direction (Y direction). Based on the above structure, a device with multiple chambers can be transported integrally in a small space, and after transport, the position of the path chamber 22 relative to the swirl chamber 21 can be finely adjusted, and the device can be easily connected and assembled.
[0075] Furthermore, the structure of the present invention is not limited to the above-described structure and various modifications can be made. For example, it is possible to replace the path chamber 22 with a buffer chamber 23 in the relay device 2, or to replace the swivel chamber 21 with a path chamber 22 using connecting portions 253 at both ends of the transport chamber 13 of the cluster device 1.
[0076] As another variation, a structure in which the path chamber 22 is connected to the connecting part 253 by screws or the like can be considered instead of the pin part 38. Figure 11 This is a schematic front view showing the detailed structure of the connecting part 253 in a modified example using screw 39. In this modified example, screw 39 is inserted through the through holes provided in the pedestal connecting member 2531 and the intermediate member 2532, and also through the threaded hole provided in the lower surface of the path chamber 22, thereby connecting the path chamber 22 to the connecting part 253. By adopting such a structure, the fastening force acts in the direction that brings the path chamber 22 and the connecting part 253 closer together, thus achieving a more secure connection compared to the case where only the pin engages with the hole. Furthermore, in the transport state, screw 39 is installed on the lower surface of the path chamber 22, and the pedestal connecting member 2531 and the intermediate member 2532 are connected by different components such as bolts and nuts, thereby preventing foreign matter from entering the threaded hole and the through hole. Alternatively, it is also conceivable to have a structure in which the screws and holes used for connecting the path chamber 22 to the intermediate member 2532 and the intermediate member 2532 to the pedestal connecting member 2531 are provided separately.
[0077] Manufacturing methods for electronic devices
[0078] Next, an example of a method for manufacturing an electronic device using the vacuum apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be shown, and a method for manufacturing an organic EL display device will be illustrated.
[0079] First, the manufactured organic EL display device will be explained. Figure 12 (a) is an overall view of the organic EL display device 50. Figure 12 (b) represents a cross-sectional structure of 1 pixel.
[0080] like Figure 12As shown in (a), in the display area 501 of the organic EL display device 50, a plurality of pixels 502 having a plurality of light-emitting elements are arranged in a matrix. This will be described in detail later, but each light-emitting element has a structure having an organic layer sandwiched between a pair of electrodes. Furthermore, the term "pixel" here refers to the smallest unit in the display area 501 capable of displaying a desired color. In the case of the organic EL display device of this embodiment, the pixel 502 is composed of a combination of a first light-emitting element 502R, a second light-emitting element 502G, and a third light-emitting element 502B that emit different colors from each other. The pixel 502 is mostly composed of a combination of red, green, and blue light-emitting elements, but it can also be a combination of yellow, cyan, and white light-emitting elements, as long as there is at least one color; there are no particular limitations.
[0081] Figure 12 (b) is Figure 12 (a) is a partial cross-sectional view of the SS line. Pixel 502 is composed of multiple light-emitting elements, each of which has a first electrode (anode) 504, a hole transport layer 505, any one of light-emitting layers 506R, 506G, and 506B, an electron transport layer 507, and a second electrode (cathode) 508 on substrate 503. The hole transport layer 505, light-emitting layers 506R, 506G, 506B, and electron transport layer 507 are equivalent to organic layers. Furthermore, in this embodiment, light-emitting layer 506R is an organic EL layer emitting red light, light-emitting layer 506G is an organic EL layer emitting green light, and light-emitting layer 506B is an organic EL layer emitting blue light. Light-emitting layers 506R, 506G, and 506B are respectively formed into patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue light.
[0082] Furthermore, the first electrode 504 is formed separately for each light-emitting element. The hole transport layer 505, the electron transport layer 507, and the second electrode 508 can be formed together by multiple light-emitting elements 502R, 502G, and 502B, or they can be formed for each light-emitting element. To prevent the first electrode 504 and the second electrode 508 from short-circuiting due to foreign matter, an insulating layer 509 is provided between the first electrode 504. Moreover, since the organic EL layer deteriorates due to moisture or oxygen, a protective layer 510 is provided to protect the organic EL element from the effects of moisture or oxygen.
[0083] exist Figure 12In (b), the hole transport layer 505 and the electron transport layer 507 are represented by a single layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer with a band structure can also be formed between the first electrode 504 and the hole transport layer 505, allowing holes to be smoothly injected from the first electrode 504 into the hole transport layer 505. Similarly, an electron injection layer can also be formed between the second electrode 508 and the electron transport layer 507.
[0084] Next, a specific example of a manufacturing method for an organic EL display device will be explained.
[0085] First, a substrate (base glass) 503 is prepared, which has a circuit (not shown) for driving an organic EL display device and a first electrode 504.
[0086] On a substrate 503 where the first electrode 504 is formed, acrylic resin is formed by spin coating, and the acrylic resin is patterned by photolithography to form an opening in the portion where the first electrode 504 is formed, thus forming an insulating layer 509. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.
[0087] A substrate 503 with an insulating layer 509 patterned on it is placed on a substrate carrier provided with an adhesive member. The substrate 503 is held in place by the adhesive member. A first organic material film-forming apparatus is introduced, and after flipping, a hole transport layer 505 is formed as a common layer on the first electrode 504 in the display area. The hole transport layer 505 is formed by vacuum evaporation. In fact, since the hole transport layer 505 is formed to a size larger than the display area 501, a high-precision mask is not required.
[0088] Next, the substrate 503, with the hole transport layer 505 formed thereon, is moved into the second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 506R is formed on the portion of the substrate 503 where the red light emitting element is arranged.
[0089] Similar to the deposition of the light-emitting layer 506R, a green light-emitting layer 506G is deposited using a third organic material deposition apparatus, and a blue light-emitting layer 506B is deposited using a fourth organic material deposition apparatus. After the deposition of the light-emitting layers 506R, 506G, and 506B is completed, an electron transport layer 507 is deposited over the entire display area 501 using a fifth deposition apparatus. The electron transport layer 507 is formed as a common layer for the three color light-emitting layers 506R, 506G, and 506B.
[0090] A substrate with an electron transport layer 507 is moved using a metallic vapor deposition material film-forming apparatus to form a second electrode 508.
[0091] Then, it is moved to a plasma CVD apparatus to form a protective film 510, completing the film formation process on the substrate 503. After flipping, as described in the above embodiments or examples, the substrate 503 is separated from the substrate carrier by peeling off the adhesive members from the substrate 503. Then, the organic EL display device 50 is completed by cutting.
[0092] From the moment the substrate 503 with the insulating layer 509 is moved into the film-forming apparatus until the film-forming of the protective layer 510 is completed, the light-emitting layer made of organic EL material may deteriorate due to moisture or oxygen if exposed to an atmosphere containing moisture or oxygen. Therefore, in this embodiment, the substrate is moved in and out of the film-forming apparatus under a vacuum atmosphere or an inert gas atmosphere.
Claims
1. A vacuum device comprising: The first chamber is designed to allow for internal decompression. The second chamber, configured to depressurize internally, is connected to the first chamber; and Support unit, supporting the first chamber and the second chamber, Its features are, The support unit comprises: a first base having a first fixing surface for fixing the bottom surface of the first chamber; a second base having a second fixing surface for fixing the bottom surface of the second chamber; and a connecting portion for connecting the first base and the second base. The support unit can be switched between two states: a setting state and a conveying state. It is bent by the connecting part to change the angle between the surface along the first fixed surface and the surface along the second fixed surface, thereby reducing the total length in the conveying state compared to the total length in the setting state.
2. The vacuum device according to claim 1, characterized in that, The vacuum device also has a gate valve disposed between the first chamber and the second chamber to open and close the passage for the substrate to pass from the inside of the first chamber to the inside of the second chamber.
3. The vacuum device according to claim 2, characterized in that, The connecting portion of the support unit is provided with space for the valve core of the gate valve to move.
4. The vacuum device according to claim 1, characterized in that, The connecting part consists of multiple components that are interconnected by fastening with screw components. The first base is connected to the connecting part by fastening with screw components. At least one of the through hole for inserting the shaft portion of the screw component for connecting the plurality of components to each other and the through hole for inserting the shaft portion of the screw component for connecting the connecting portion and the first base is an elongated hole that extends in the movement direction of the substrate moving between the first chamber and the second chamber.
5. The vacuum device according to claim 4, characterized in that, At least one of the through hole for inserting the shaft portion of the screw component for connecting the plurality of components to each other and the through hole for inserting the shaft portion of the screw component for connecting the connecting portion to the first base is an elongated hole that extends in a direction orthogonal to the direction of movement.
6. The vacuum device according to claim 1, characterized in that, The support unit also includes a support column, which is connected to the first pedestal and supports the first pedestal from below.
7. The vacuum device according to claim 6, characterized in that, The second base has a rotating shaft extending in a direction parallel to the first fixed surface, and is rotatably supported on the connecting portion. The connecting part has a shaft clamping member that can fasten the rotating shaft at a predetermined rotation position to fix the position of the second base relative to the first base.
8. The vacuum device according to claim 7, characterized in that, The support unit can be bent so that the angle between the second fixed surface and the first fixed surface is approximately a right angle. The distance from the rotating shaft to the lower end of the support column in a direction orthogonal to the first fixing surface is greater than the distance from the rotating shaft to the end of the second base on the side away from the connecting portion.
9. The vacuum device according to claim 1, characterized in that, The support unit further includes a leg member that supports the second pedestal from below, and a leg connecting member that connects the second pedestal and the leg member. The leg member is rotatably supported on the leg connecting member.
10. The vacuum device according to claim 9, characterized in that, When the first fixing surface is parallel to the second fixing surface, the leg member is perpendicular to the surface along the second fixing surface. When the first fixing surface is not parallel to the second fixing surface, the leg member is located along the direction of the second fixing surface.
11. The vacuum device according to claim 1, characterized in that, The first chamber is a rotary chamber equipped with a robotic arm for transporting substrates.
12. The vacuum device according to claim 11, characterized in that, The second chamber is a path chamber located downstream of the first chamber in the transport direction of the substrate and having a mounting stage for placing the substrate. The mounting stage is capable of being driven to move in at least one of the following directions: a first direction parallel to the mounting surface of the substrate; a second direction orthogonal to the first direction and parallel to the mounting surface of the substrate; and rotation about a third direction orthogonal to the first and second directions.
13. The vacuum device according to claim 12, characterized in that, The vacuum device also includes a third chamber connected upstream of the first chamber in the transport direction of the substrate. The support unit includes: a third base having a third fixing surface for fixing the third chamber; and a connecting portion for the third base, connecting the first base and the third base. The support unit is bent by the connecting part of the third base so that the angle between the surface along the first fixed surface and the surface along the third fixed surface changes.
14. The vacuum device according to claim 13, characterized in that, The third chamber is a path chamber equipped with a fixed mounting stage for placing the substrate.
15. An apparatus for manufacturing an electronic device, The manufacturing apparatus for this electronic device has: Multiple cluster devices, each equipped with a film deposition chamber for depositing films on a substrate; and Relay devices are respectively installed between adjacent cluster devices to transport the substrate from the upstream side of the substrate transport direction to the downstream side of the cluster device. Its features are, The relay device includes the vacuum device according to any one of claims 1 to 14.