A material separation device and a material automatic processing equipment

Abstract

The present invention discloses a material separation device and a material automatic processing equipment. The material separation device includes a base and a separation component. A material channel is formed on the separation component, and it is configured to realize the separation of one material in the material channel from another adjacent material, so that the separated material is moved from the material channel to the target feeding position; a vacuum airway communicated with a negative pressure generating component is arranged on the separation component, and the vacuum airway is communicated with the material channel. When the material monitoring component monitors that there are multiple materials in the material channel, the material monitoring component sends a signal to the control system, and the control system controls the negative pressure generating component to generate negative pressure. The negative pressure forms an adsorption effect on the materials in the material channel from the vacuum airway, realizing the separation of the material near the vacuum airway in the material channel from the adjacent material near the target feeding position. The separation device proposed by the present invention simplifies the equipment structure and improves the material separation speed.

Description

Technical Field

[0001] The present invention relates to the field of automated equipment, and particularly to a material separation device and a material automated processing equipment. Background Art

[0002] Existing bag testing machines can detect various inductance products and automatically tape and package them. Structurally, they usually include a large batch of material feeding devices, single material feeding devices, single material implanting devices, packaging devices, etc. And in the single material feeding device of the existing bag testing machine, a separation part is usually provided. This separation part is used to adsorb one of the multiple sequentially arranged materials to a specified position to separate the material from a row of materials. And the material separation basically uses an electromagnet and a separation needle, and the material separation is realized through the continuous movement of this mechanical mechanism.

[0003] However, with the increase in market demand, accelerating the equipment speed has become an urgent problem to be solved. And the execution speed of this mechanical structure has become a bottleneck for accelerating the equipment speed. Moreover, the electromagnet, separation needle, proximity sensor, etc. used in the existing separation part are all consumables, and the overall maintenance cost of the equipment is relatively high.

[0004] Furthermore, it is inevitable to have action mistakes or accidents during the mechanical movement of the equipment. When the action of the separation needle is abnormal, it is easier to damage the material, which poses a quality hazard.

[0005] Therefore, it is urgent to propose a new technical solution to solve the problems existing in the prior art. Summary of the Invention

[0006] In order to solve the problems existing in the prior art, the present invention provides a material separation device, which realizes the separation of multiple materials by means of air pressure and vacuum. Compared with the prior art that uses components such as electromagnets, separation needles, and proximity sensors to realize material separation, the material separation device proposed by the present invention simplifies the equipment structure and improves the material separation speed. The specific technical solutions adopted are as follows:

[0007] A material separation device, which includes: a base;

[0008] A separation assembly, which is installed on one side surface of the base, and has a material passage formed thereon that allows materials to pass through. It is configured to separate one material in the material passage from another adjacent material, so that the separated material is moved from the material passage to the target feeding position;

[0009] A negative pressure generating assembly;

[0010] A material monitoring assembly, which is configured to monitor the materials in the material passage; and

[0011] A control system configured to control a negative pressure generating assembly to generate negative pressure according to a signal sent by the material monitoring assembly;

[0012] A vacuum airway communicating with the negative pressure generating assembly is provided on the separation assembly. The vacuum airway communicates with the material channel. When the material monitoring assembly detects that there are multiple materials in the material channel, the material monitoring assembly sends a signal to the control system. The control system controls the negative pressure generating assembly to generate negative pressure. The negative pressure forms an adsorption effect on the materials in the material channel from the vacuum airway, realizing the separation of the materials near the vacuum airway in the material channel and the materials adjacent to and near the target feeding position.

[0013] In the above technical solution, further, the material separation device further includes a material carrying track having an input end and an output end. The input end is connected to a hopper, and the output end passes out from below the material channel and extends to the target feeding position; multiple materials are arranged in a row on the material carrying track and are transported to the target feeding position by the material carrying track after passing through the material channel in sequence. The width of the material channel is smaller than the total width of two materials.

[0014] Further, the material monitoring assembly includes a first fiber optic sensor and a second fiber optic sensor. The first fiber optic sensor is installed on a base below the material channel and near the target feeding position. The second fiber optic sensor is located between the first fiber optic sensor and the target feeding position. When a material moves from the material channel to the target feeding position, it passes through the first fiber optic sensor and the second fiber optic sensor in sequence.

[0015] Furthermore, when multiple materials are transported by the material carrying track into the material channel and are arranged in a row in the material channel in sequence, the first fiber optic sensor and the second fiber optic sensor respectively sense the materials. After receiving the sensing signals sent by the first fiber optic sensor and the second fiber optic sensor, the control system controls the negative pressure generating assembly to generate negative pressure. The negative pressure adsorbs the materials sensed by the first fiber optic sensor from the vacuum airway, and the materials sensed by the second fiber optic sensor are transported to the target feeding position by the material carrying track.

[0016] Further, an opening is formed on the inner wall of the material channel, the vacuum airway communicates with the material channel from the opening, the first fiber optic sensor is close to the opening position. When the material is transported into the material channel and close to the opening, the first fiber optic sensor senses the material; when multiple materials are arranged in a row in the material channel, the material sensed by the second fiber optic sensor is closer to the target feeding position than the material sensed by the first fiber optic sensor. The negative pressure generated by the negative pressure generating component adsorbs the material sensed by the first fiber optic sensor through the vacuum airway, the material is adsorbed to the opening, the material forms a blockage to one or more materials adjacent to it and close to the input end, and the material sensed by the second fiber optic sensor is transported to the target feeding position.

[0017] In the above technical solution, further, the negative pressure generating component includes a vacuum pump and a vacuum pipeline for transmitting the high-pressure gas generated by the vacuum pump; the separation component includes a first cover plate and a second cover plate. The first cover plate and the second cover plate are relatively spaced apart on one side surface of the base to form the material channel. A hole is formed on the side wall of the first cover plate close to the material channel, and the hole extends from the side wall surface into the interior of the first cover plate until it communicates with the vacuum pipeline; an air gap is formed on the side wall of the second cover plate close to the material channel.

[0018] In the above technical solution, further, the material separation device further includes a turntable, and a circle of grooves are evenly arranged on the edge of the turntable. The turntable is arranged below the base; a feeding port is further formed on the base, and the feeding port forms the target feeding position of the material to be separated. The feeding port extends downward from one side surface of the base where the separation component is installed and corresponds to communicate with one of the grooves on the turntable, and the material is fed into the groove from the feeding port.

[0019] Further, if the groove corresponding to the feeding port contains material, the turntable is driven to rotate so that the next groove adjacent to the groove is rotated below the feeding port and receives the material; when the turntable is driven to rotate, the negative pressure generating component stops generating vacuum, and the adsorbed material is released. The material is transported to the feeding port and then fed into the groove of the turntable.

[0020] In the above technical solution, further, when the material monitoring component monitors one material in the material channel, the control device controls the negative pressure generating component to stop generating negative pressure, and the material is moved from the material channel to the target feeding position.

[0021] Further, the vacuum airway includes one or more sub-airways and a main airway communicating with the sub-airways. The vacuum pipeline communicates with the main airway. The negative pressure gas output from the vacuum pipeline is dispersed from the main airway into one or more sub-airways. One or more sub-airways extend towards the material channel, and one or more sub-airways respectively communicate with the material channel.

[0022] Further, air holes are formed in the base, and the vacuum airway communicates with the vacuum pipeline through the air holes.

[0023] Based on the above material separation device, the present invention further provides a material automatic processing device, which includes the above material separation device. The material separation device is used to separate materials and complete the feeding of the separated materials.

[0024] Compared with the prior art, the material separation device of the present invention uses the principle of vacuum suction to separate multiple materials. Compared with components such as electromagnets, separation needles, and proximity sensors used in existing material separation devices, the separation device provided by the present invention has a simpler structure. Compared with mechanical action separation, the vacuum suction separation has higher action instantaneity, higher separation efficiency, and there is no situation of mechanical component action damaging materials, so the safety is higher. Without the participation of redundant mechanical components in the action, the failure rate of the device is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 is a three-dimensional structural schematic diagram of the material separation device of the present invention in an embodiment;

[0027] Figure 2 is Figure 1 a three-dimensional structural perspective view of the shown material separation device;

[0028] Figure 3 is Figure 1 a planar structural schematic diagram of the separation component in the shown material separation device;

[0029] Figure 4 is Figure 1 a planar structural schematic diagram of the base in the shown material separation device;

[0030] Figure 5 isFigure 1 Schematic diagram of the structural decomposition of the material separation device shown;

[0031] Figure 6 Schematic flow chart of the material processing process of the material automatic processing equipment according to the present invention in an embodiment;

[0032] Figure 7 Top view schematic diagram of a partial structure of the component processing device of the material automatic processing equipment in an embodiment, where some components are not shown;

[0033] Figure 8 For Figure 7 Side view enlarged schematic diagram of a partial structure of the component processing device in , where only the relevant part structure of the discharging part is schematically shown;

[0034] Figure 9 For Figure 7 Side view enlarged schematic diagram of a partial structure of the component processing device in , where only the relevant part structure of the implanting part is schematically shown.

[0035] Wherein: 100 - base; 101 - feeding port; 102 - air hole;

[0036] 110 - separation component; 111 - first cover plate; 112 - second cover plate; 113 - air gap; 114 - material channel; 115 - vacuum airway; 116 - sub - airway; 117 - main airway;

[0037] 120 - turntable; 121 - groove;

[0038] 130 - discharging part; 131 - discharging vacuum suction nozzle; 132 - receiving cavity; solenoid valve (not shown);

[0039] 140 - implanting part; 141 - implanting vacuum suction nozzle; 142 - implanting driving part;

[0040] 150 - machine platform;

[0041] 160 - first fiber optic sensor; 170 - second fiber optic sensor;

[0042] 200 - material (component);

[0043] 300 - carrier tape; 310 - carrier tape hole; 320 - receiving groove. Detailed implementation manners

[0044] To make the above - mentioned objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0045] The detailed description of the present invention is mainly presented by programs, steps, logical blocks, processes, or other symbolic descriptions, which directly or indirectly simulate the operation of the technical solutions in the present invention. Those skilled in the art use these descriptions and statements herein to effectively introduce the essence of their work to other technical personnel in the art.

[0046] As used herein, "one embodiment" or "an embodiment" means that the features, structures, or characteristics related to the embodiment can be included in at least one implementation of the present invention. The appearances of "in one embodiment" in different parts of this specification do not necessarily refer to the same embodiment, nor do they have to be separate or alternative embodiments that are mutually exclusive of other embodiments. In addition, the order of the modules in the method, flowchart, or functional block diagram representing one or more embodiments is not a fixed order and does not refer to any specific order, nor does it constitute a limitation of the present invention.

[0047] Embodiment 1:

[0048] See Figures 1-5 , Figure 1 is a schematic three-dimensional structure diagram of the material separation device according to the present invention in one embodiment; Figure 2 is Figure 1 a perspective three-dimensional structure view of the material separation device shown; Figure 3 is Figure 1 a schematic plan view of the separation component in the material separation device shown; Figure 4 is Figure 1 a schematic plan view of the base in the material separation device shown; Figure 5 is Figure 1 a schematic exploded view of the structure of the material separation device shown.

[0049] See Figure 1, the material separation device proposed by the present invention may include a base 100, a separation component 110, a negative pressure generating component (not shown), a material monitoring component, and a control system (not shown). The separation component 110 is installed on one side surface of the base 100, and a material passage 114 allowing materials to pass through is formed thereon. It is configured to separate one material in the material passage 114 from another adjacent material, so that the separated material is moved from the material passage 114 to the target feeding position; the material monitoring component is configured to monitor the materials in the material passage 114; the control system is configured to control the negative pressure generating component to generate negative pressure according to the signal sent by the material monitoring component; a vacuum airway 115 communicating with the negative pressure generating component is provided on the separation component 110, and the vacuum airway 115 communicates with the material passage 114. When the material monitoring component monitors that there are multiple materials in the material passage 114, the material monitoring component sends a signal to the control system, and the control system controls the negative pressure generating component to generate negative pressure. The negative pressure forms an adsorption effect on the materials in the material passage 114 from the vacuum airway 115, realizing the separation of the materials near the vacuum airway 115 in the material passage 114 from the adjacent materials near the target feeding position.

[0050] In one embodiment, the material separation device may further include a material transport track (not shown). The material transport track has an input end and an output end. The input end is connected to a hopper (not shown), and the output end passes out from below the material passage 114 and extends to the target feeding position; a plurality of materials are arranged in a row on the material transport track and are sequentially transported to the target feeding position by the material transport track after passing through the material passage 114. The width of the material passage is smaller than the total width of two materials. Figure 1 The base 100 is U-shaped, and the material transport track can pass through the opening of the U-shaped base, pass through the material passage of the separation component, and then extend to the target feeding position.

[0051] In one embodiment, the material monitoring component may include a first fiber optic sensor 160 and a second fiber optic sensor 170. The first fiber optic sensor 160 is installed on the base 100 below the material passage 114 and near the target feeding position. The second fiber optic sensor 170 is located between the first fiber optic sensor 160 and the target feeding position. When a material moves from the material passage to the target feeding position, it sequentially passes through the first fiber optic sensor and the second fiber optic sensor. See Figure 4 . That is, when a material moves in the material passage, it first passes through the first fiber optic sensor and then through the second fiber optic sensor.

[0052] See Figure 1 When multiple pieces of the material are conveyed by the material conveying track into the material channel 114 and are arranged in a row in the material channel 114 in sequence, the first fiber optic sensor 160 and the second fiber optic sensor 170 respectively sense the materials (when sensing different materials, the installation interval positions of the first fiber optic sensor 160 and the second fiber optic sensor 170 also need to be installed according to the size and running speed of the materials, so that the first fiber optic sensor 160 and the second fiber optic sensor 170 can respectively sense two different adjacent materials). After the control system receives the sensing signals sent by the first fiber optic sensor 160 and the second fiber optic sensor 170, it controls the negative pressure generating assembly to generate negative pressure. The negative pressure adsorbs the material sensed by the first fiber optic sensor 160 from the vacuum airway 115, and the material sensed by the second fiber optic sensor 170 is conveyed by the material conveying track to the target feeding position.

[0053] In one embodiment, an opening is formed on the inner wall of the material channel 114, and the vacuum airway 115 communicates with the material channel 114 from the opening. The first fiber optic sensor 160 is close to the opening position. When the material is conveyed into the material channel 114 and is close to the opening, the first fiber optic sensor 160 senses the material; when multiple pieces of the material are arranged in a row in the material channel 114, the material sensed by the second fiber optic sensor 170 is closer to the target feeding position than the material sensed by the first fiber optic sensor 160. The negative pressure generated by the negative pressure generating assembly adsorbs the material sensed by the first fiber optic sensor 160 through the vacuum airway 115. The material is adsorbed to the opening, and the material forms a blockage to one or more materials adjacent to it and close to the input end. The material sensed by the second fiber optic sensor 170 is conveyed to the target feeding position.

[0054] In one embodiment, the negative pressure generating assembly (not shown) may include a vacuum pump and a vacuum pipeline for conveying the high-pressure gas generated by the vacuum pump; the separation assembly 110 includes a first cover plate 111 and a second cover plate 112. The first cover plate 111 and the second cover plate 112 are relatively spaced apart on one side surface of the base 100 to form the material channel 114. A hole is formed on the side wall of the first cover plate 111 close to the material channel 114, and the hole extends from the side wall surface into the interior of the first cover plate 111 until it communicates with the vacuum pipeline; an air gap 113 is formed on the side wall of the second cover plate 112 close to the material channel 114. The setting of the air gap 113 can enable the material to be better adsorbed by the negative pressure of the vacuum airway 115.

[0055] In one embodiment, the material separation device may further include a turntable. A circle of grooves is evenly arranged on the edge of the turntable. The turntable is arranged below the base 100. An inlet 101 is formed on the base 100, and the inlet 101 forms the target inlet position of the material to be separated. The inlet 101 extends downward from the side surface of the base 100 where the separation component 110 is installed and corresponds to and communicates with one of the grooves on the turntable. The material is fed into the groove from the inlet 101.

[0056] If the groove corresponding to the inlet 101 contains material, the turntable is driven to rotate so that the next groove adjacent to the groove is rotated below the inlet 101. When the turntable is driven to rotate, the negative pressure generating component stops generating vacuum, and the adsorbed material is released. The material is transported to the inlet 101 and then fed into the groove of the turntable.

[0057] In one embodiment, when the material monitoring component monitors a material in the material channel 114, the control device controls the negative pressure generating component to stop generating negative pressure, and the material is moved to the target inlet position. That is, when only one of the first optical fiber sensor 160 and the second optical fiber sensor 170 senses the material, it means that there is no phenomenon of multiple materials piling up in the material channel 114 and no separation is required, that is, the negative pressure adsorption function is not enabled.

[0058] In one embodiment, the vacuum airway 115 includes one or more sub-airways 116 and a main airway 117 communicating with the sub-airways 116. The vacuum pipeline is communicated with the main airway 117. The negative pressure gas output from the vacuum pipeline is dispersed from the main airway 117 into one or more sub-airways 116. One or more sub-airways 116 extend in the direction of the material channel 114, and one or more sub-airways 116 are respectively communicated with the material channel 114. If the opening positions of multiple sub-airways on the side wall of the first cover plate are close, multiple sub-airways can adsorb one material, and the adsorption intensity is relatively high at this time. If the opening positions of multiple sub-airways on the side wall of the first cover plate are relatively dispersed, each sub-airway may adsorb different materials.

[0059] In one embodiment, air holes 102 may be formed on the base 100. The vacuum airway 115 is communicated with the vacuum pipeline through the air holes 102. At this time, it is more likely to install the negative pressure generating component below the base 100 to reduce the volume of the device.

[0060] The material separation device of the present invention uses the principle of vacuum suction to separate multiple materials. Compared with components such as electromagnets, separation needles, and proximity sensors used in existing material separation devices, the separation device provided by the present invention is simpler in structure. Compared with mechanical action separation, vacuum suction separation has higher action instantaneity, higher separation efficiency, and there is no situation where mechanical component actions damage the materials, so the safety is higher. Without the participation of redundant mechanical components in the action, the failure rate of the equipment is lower.

[0061] Embodiment 2:

[0062] Based on the above-mentioned material separation device, the present invention also proposes a material automatic processing device. This automatic processing device not only includes the above-mentioned material separation device, but may also include a carrier tape loading device, a component loading device, a component processing device, and a material packaging device. The carrier tape loading device is used to load the carrier tape packaging components, the component loading device is used to load the components (the materials separated by the above-mentioned material separation device can be components), the component processing device is used to implant the components into the storage groove of the carrier tape, and the material packaging device is used to package the carrier tape containing the components.

[0063] In one embodiment, the processing process of the material automatic processing device (hereinafter simply referred to as the automatic device) of the present invention for materials can be as Figure 6 shown, Figure 6 shows a flowchart of a material processing process. The materials can include various components. In one embodiment, it can be used as a guiding operation flowchart for the component processing process. The following will Figure 1 describe the flowchart shown in:

[0064] Figure 1 The flowchart shown in can be divided into the following several processing processes: Process 1: Obtain the carrier tape packaging components through the carrier tape loading device; Process 2: Load the components through the component loading device; Process 3: Implant the components into the carrier tape through the component processing device; Process 4: Package the carrier tape implanted with components through the material packaging device. The order of Process 1 and Process 2 is not sequential. Generally, for production efficiency, Process 1 and Process 2 are parallel. One or more detection processes can be set according to needs in Process 1, Process 2, or Process 3, mainly for detecting the appearance and electrical performance of the components. Of course, it is not that a detection process cannot be set in Process 4. Only detecting before packaging can control defects at the front end of production, reduce the error correction cost, and improve production efficiency.

[0065] In one embodiment, Process 1 requires using a master tape and a lower tape to cooperate to produce a carrier tape for packaging components (the carrier tape can also be directly purchased with the support of the production cost budget). The carrier tape has receiving grooves for receiving components.

[0066] In one embodiment, Process 2 is for feeding. The components to be packaged need to be fed to a specified position and then fed into the carrier tape (feeding is the previous process of implanting components in Process 3, that is, feeding prepares for implanting components into the carrier tape). Before and after feeding, the appearance and electrical performance of the components can be detected. If defective products are detected, they are stored in a defective product box and waiting for the staff to confirm whether they are indeed defective for the second time.

[0067] In one embodiment, Process 3 is to implant components into the receiving grooves of the carrier tape one by one. Before or after implantation, the appearance and electrical performance of the components can also be detected. If defects are detected before implantation, the materials can be directly discharged. If defects are detected after implantation, the materials can be taken out from the receiving grooves.

[0068] In one embodiment, Process 4 is to package the carrier tape implanted with components. At this time, an upper tape can be provided to package the carrier tape through the upper tape, and the finished product tape is obtained after packaging.

[0069] In order to improve the efficiency of material packaging, it is possible to start from the above four processing processes respectively, develop automated equipment for each operation step, so as to realize the automation of the operation step. Further, it is also necessary to develop appropriate sub-devices or mechanisms for the sub-steps within each step to realize the automation of the sub-step. For example, for Process 1, since this process includes three sub-steps: supplying the master tape, supplying the lower tape, and pasting the lower tape, therefore, it may be necessary to develop three sub-devices or mechanisms for the above three sub-steps. Of course, in order to realize the full-process automation of material packaging, these automated devices for each step can also be integrated together. The present invention is proposed based on the above inventive concept, and multiple embodiments will be used hereinafter to exemplarily introduce the automated devices for each operation step of the present invention and the entire set of automated equipment.

[0070] Carrier tape feeding device

[0071] In one embodiment, the present invention provides a carrier tape feeding device, which is mainly used to complete the feeding of the carrier tape. It can convey the carrier tape to the subsequent process station to receive subsequent operations.

[0072] The carrier tape loading device can be called a carrier tape loading device, which can be used as a loading device of a component processing device to transport an empty carrier tape to the component processing device to complete the implantation of components. At this time, the above-mentioned back-end station is the material implantation station. Of course, the carrier tape loading device described in this embodiment may also be used as a loading device of other material handling devices, and this embodiment is not particularly limited.

[0073] In one embodiment, see Figure 1 The carrier tape loading device described in the present invention includes two feeding devices, one feeding device is used to feed the mother tape, and the other feeding device is used to feed the lower tape (it should be noted that the mother tape is a plastic strip with a through hole arranged thereon, and the shape and size of the through hole are adapted to the shape and size of the components to be packaged, and the lower tape is attached to one side of the mother tape, and the lower tape seals the through hole on the mother tape. Therefore, the mother tape with the lower tape attached to one side forms a carrier tape that can package components). After both feeding devices have fed, the mother tape and the lower tape are simultaneously conveyed to the lower pressing station, and the lower tape is attached to the surface of one side of the mother tape at the lower pressing station. A lower pressing device is arranged at the lower pressing station, and the lower pressing device reciprocates up and down and cooperates with a certain temperature to complete the pressing of the lower tape and the mother tape, and the carrier tape is obtained after the pressing is completed. Among them, the lower pressing device can include an instant-heating soldering iron (referred to as "electric soldering iron") that is powered on. The electric soldering iron is connected to an electromagnet. Driven by the electromagnet, the electric soldering iron reciprocates up and down to complete the pressing action. In actual application, it is also necessary to select a suitable heating temperature of the electric soldering iron according to the material and characteristics of the lower tape and the mother tape, and set a suitable pressing time. In order to ensure firm pressing, the electric soldering iron will stay on the lower tape for a certain period of time during the downward pressing process, and give the tape a certain downward pressure to ensure the adhesion of the lower tape and the mother tape. At this point, the component processing device obtains a carrier tape that can be used to package components from the first front-end processing route, and a storage groove is formed on the carrier tape.

[0074] In one embodiment, the master tape and the lower tape are both roll materials, the master tape roll and the lower tape roll are respectively fixed on the reserved workstations on the frame, the master tape and the lower tape are both transported to the lower lamination workstation and then the lower tape is pasted on the master tape through the lower lamination device, thereby obtaining the carrier tape.

[0075] In one embodiment, the carrier tape loading device described in the present invention further includes a carrier tape driving unit, and the carrier tape driving unit transports the prepared carrier tape to a subsequent workstation.

[0076] In one embodiment, if the carrier tape is provided directly without being processed through a master tape and a bottom tape, the carrier tape loading device of the present invention may only include a carrier tape driving unit, and the carrier tape is loaded to the material implantation station through the carrier tape driving unit.

[0077] The carrier loading device provided in this embodiment can be used as a component and integrated with the component loading device, component processing device, and material packaging device to form a complete set of automated equipment. When the carrier loading device is used as a component of the complete set of automated equipment, the carrier loading device loads the carrier into the component processing device for subsequent loading operations. For the specific process, reference can be made to the relevant content of the automated equipment in the subsequent embodiments.

[0078] Of course, the carrier loading device can also be used as the loading device of other types of material processing devices.

[0079] Component loading device

[0080] In one embodiment, the present invention provides a component loading device that can store, load, and feed components to sequentially transport the components to the subsequent process for receiving subsequent operations.

[0081] The component loading device can be used as the loading device of the component processing device to transport the components into the component processing device. At this time, the subsequent process mentioned above is the material implantation station on the component processing device. For details, please refer to Figure 6 . Of course, the component loading device may also be used as the loading device of other component operation devices, and this embodiment does not make special restrictions.

[0082] The component loading device in the embodiment of the present invention can be used to scatter the concentrated materials. After being scattered, the materials can be arranged in a single row in sequence to prepare for feeding the materials into the carrier later. After the materials are arranged in a single row in sequence, a detection device can be set to sequentially perform electrical performance detection on each component (the electrical performance detection can include two resistance detections and one capacitance detection). If defective products are detected, the defective products will be discharged into the corresponding storage box. Installing the detection device in the component loading device can control the quality of the components during the loading process, so as to control the defects before storage and reduce the rework cost. Of course, the detection device may not be installed in the component loading device, and only the storage, loading, and feeding of the components are completed during the loading process, and the electrical performance detection, as a screening process, is carried out in the subsequent process. The specific stage at which the electrical performance detection process is placed can be determined according to the actual integrated structure of the component processing device.

[0083] In one embodiment, the component feeding device described in the present invention may include a hopper, a material vibration plate and a material transmission track. One end of the hopper is connected to the feeding port of the material vibration plate, and the discharge port of the material vibration plate is connected to the material transmission track. A sensor is also provided on the material vibration plate, and the sensor can monitor the amount of material in the material vibration plate. If it is detected that the amount of material is insufficient, the hopper is controlled to add material to the material vibration plate. After adding the set amount of material, the hopper is controlled to stop adding material. The material vibration plate can arrange the material in a single row on the material transmission track through mechanical vibration. Among them, the hopper is used to store components, the material vibration plate can sort materials through vibration, and the material transmission track can transport the material in a single row for easy feeding.

[0084] In one embodiment, if the detection process is implanted in the component feeding device, the detection device can be inverted under the material transmission track (the installation position is related to the detection method. In this embodiment, the detection device is inverted mainly because during the electrical performance test, probes will be extended from bottom to top to detect whether the resistance and capacitance performance are qualified. Therefore, the detection device is inverted under the material transmission track). When the material is conveyed to the detection station (in this embodiment, the detection station coincides with the feeding station of the material transmission track), the detection device performs electrical performance detection on the material.

[0085] In one embodiment, the detection device described in this embodiment may include three detection processes, two of which may be resistance detection and the other may be capacitance detection (of course, they may also be reallocated, and this embodiment only provides an example to illustrate the problem and is not intended to limit the present invention).

[0086] In one embodiment, the detection device is described, which may include three detection components, each detection component corresponding to a detection process. For example, the first detection component and the second detection component for resistance detection respectively include two detection probes. When it is detected that there are components in the detection station, the detection probe extends and pierces the target detection part of the component, and obtains the resistance value of the resistor from the target detection part to judge whether the electrical properties of the detected component are qualified. If qualified, enter the next detection process, and if unqualified, the component is placed in the corresponding defective storage box. The third detection component for capacitance detection includes two detection probes, which are the same as resistance detection. The detection probe is required to pierce the target capacitance detection part of the component, and obtain the capacitance value from the target detection part to judge whether the electrical properties of the detected component are qualified. If qualified, enter the next detection process, and if unqualified, the component is placed in the corresponding defective storage box. The components that pass the three detection processes are transmitted to the material implantation station on the material transmission track. Through this layer-by-layer screening method, the defective control is at the front end of the storage to ensure the quality of the finished product.

[0087] The component loading device provided in this embodiment can be used as a component, integrated with the carrier tape loading device, the component processing device, and the material packaging device to form a complete set of automated equipment. When the component loading device is used as a part of the complete set of automated equipment, the component loading device loads components into the component processing device for subsequent loading operations. The specific process can refer to the relevant content of the automated equipment in the subsequent embodiments.

[0088] Of course, the component loading device can also be used as the loading device of other types of material processing devices. Such as the loading device for other materials, etc.

[0089] Component processing device

[0090] The present invention provides a component processing device, which can pick up, transfer, detect, and implant components, and convey the carrier tape with implanted components to the subsequent process station to receive subsequent operations.

[0091] The component processing device can be used as the loading device of the material packaging device, so as to convey the carrier tape with implanted components to be packaged into the material packaging device. At this time, the above-mentioned subsequent process station is the upper pressing station of the material packaging device. Of course, the component processing device may also be used as the loading device of other component operation devices, and this embodiment does not make special restrictions.

[0092] The component processing device provided by the present invention adopts a vacuum management solution, which can provide very effective help for the use, maintenance, and repair of the component processing device, and realize the intelligent management of the machine. It should be noted that in this embodiment, the term "processing" in the component processing device has a broad meaning. Picking up, transferring, detecting, excluding, unloading, placing, and mounting components can all be called processing of components. The components in this embodiment may include small components such as chips, resistors, and capacitors.

[0093] There are many types of component processing devices. Some component processing devices can use the principle of vacuum adsorption to package components into the storage grooves in the carrier tape, which involves component loading (i.e., component picking), component transfer, component detection, elimination of components with abnormal detection, and implantation of components with normal detection (i.e., component placement). Multiple actions among them need to be completed through vacuum adsorption. Additionally, there are also component processing devices whose purpose is not to package the components into the carrier tape, but to select the components that pass the inspection, and the selected components can be directly loaded into relevant containers. This involves component loading (i.e., component picking), component transfer, component detection, elimination of components with abnormal detection, and unloading of components with normal detection (directly loading the selected components into relevant containers), etc. Multiple actions among them need to be completed through vacuum adsorption. Furthermore, there are also component processing devices used to mount components on a carrier board such as a circuit board, which involves component loading (i.e., component picking), component transfer, component mounting, etc. Multiple actions among them need to be completed through vacuum adsorption.

[0094] See Figure 1 , and the general working process of the component processing device of the present invention will be described in conjunction with the accompanying drawings. The component processing device provided in this embodiment receives the carrier tape loaded by the carrier tape loading device and also receives the components loaded by the component loading device. The main function of the component processing device is to implant the components into the carrier tape. However, in order to ensure product quality, a detection function is also added to the component processing device, and the purpose is to control defects at the front end of production and reduce rework costs.

[0095] A material implantation station is provided in the component processing device, and the loaded components are implanted into the carrier tape at the material implantation station. The electrical performance detection process can also be completed at the material implantation station. Of course, in order to ensure quality, electrical performance detection can also be performed during the component loading process and at the material implantation station to greatly reduce the probability of implanting defective materials.

[0096] The process of packaging components into the storage grooves in the carrier tape will be described in detail below. See Figures 7-9 , the component processing device can package the component 200 into the storage groove 320 in the carrier tape 300. The component 200 can be a small passive component such as a chip.

[0097] See Figure 7 , a material implantation station is provided in the component processing device. The component processing device includes a machine table 150, and a turntable 120, a feeding section (material separation device can be used for feeding), a discharging section 130, an implantation section 140, and a material detection device (not shown) provided on the machine table 150.

[0098] The turntable 120 is driven to rotate during operation, and the rotation direction can be as shown in Figure 2 D2 in the figure. The turntable 120 includes a plurality of grooves 121 provided on the edge. For simplicity, Figure 2 only several grooves 121 provided on a partial edge of the turntable 120 are exemplarily shown in the figure. In fact, the grooves 121 are uniformly provided on all edge portions of the turntable 120.

[0099] The component processing device combines Figure 1 , 7 . The feeding part (i.e., the material separation device) includes a base 100 provided on the machine table 150 and a separation component provided on the base 100. When a plurality of components are transported to the material channel 114 of the separation component by the material transport track and are arranged in a row in the material channel 114 in sequence, both the first fiber optic sensor 160 and the second fiber optic sensor 170 sense the material. After the control system receives the sensing signals sent by the first fiber optic sensor 160 and the second fiber optic sensor 170, it controls the negative pressure generating component to generate negative pressure. The negative pressure adsorbs the material sensed by the first fiber optic sensor 160 from the vacuum airway 115 of the separation component, and the material sensed by the second fiber optic sensor 170 is transported to the feeding port by the material transport track. The component is fed from the feeding port 101 into the groove 121. If the groove 121 corresponding to the feeding port 101 contains a component, the turntable 120 is driven to rotate so that the next groove adjacent to the groove is rotated below the feeding port 101; when the turntable 120 is driven to rotate, the negative pressure generating component stops generating vacuum, and the adsorbed component is released. After the component is transported to the feeding port 101, it is fed into the groove of the turntable.

[0100] As the turntable 120 rotates, the material detection device can sequentially perform electrical performance detection and appearance detection on the component 200 adsorbed into the groove 121 of the turntable 120, such as resistance value detection or capacitance value detection, appearance color detection, and component placement detection, etc. The components 200 with abnormal detection need to be excluded from the turntable 120, and the discharging part 130 can be configured to perform the exclusion work on the components 200 with abnormal detection. Of course, for the components 200 with normal detection, the discharging part 130 does not perform the exclusion action and needs to adsorb the components 200 with normal detection.

[0101] Combined with Figure 7 , 8As shown, the discharging part 130 includes a discharging vacuum suction nozzle 131, a material receiving cavity 132, and an electromagnetic valve (not shown) disposed on the machine table. A first port of the electromagnetic valve is communicated with the discharging vacuum suction nozzle 131, a second port of the electromagnetic valve is communicated with the vacuum pump, and a third port of the electromagnetic valve is communicated with an air outlet pump (not shown). The electromagnetic valve is controlled to selectively communicate the first port with one of the second port and the third port. The discharging vacuum suction nozzle 131 is controlled by the electromagnetic valve to selectively communicate with one of the vacuum pump and the air outlet pump.

[0102] For the components 200 with normal detection, the electromagnetic valve makes the discharging vacuum suction nozzle 131 communicate with the vacuum pump, and the discharging vacuum suction nozzle 131 adsorbs the components 200 with normal detection in the groove 121 located at the discharging vacuum suction nozzle 131 through vacuum suction. For the components 200 with abnormal detection, the electromagnetic valve makes the discharging vacuum suction nozzle 131 communicate with the air outlet pump, and the discharging vacuum suction nozzle 131 blows out the components 200 with abnormal detection from the groove 121 located at the discharging vacuum suction nozzle 131 through blowing thrust, and the blown-out components 200 fall into the material receiving cavity 132. As the turntable 120 rotates, the grooves 121 on the edge of the turntable 120 will sequentially pass through the discharging vacuum suction nozzle 131 of the discharging part 130, and the components 200 with normal detection can be retained and the components 200 with abnormal detection can be excluded by cooperating with the action control of the electromagnetic valve.

[0103] As Figure 7 shown, three discharging parts 130 are schematically shown. Their discharging vacuum suction nozzles are respectively marked as 131a, 131b, and 131c, and their material receiving cavities are respectively marked as 132a, 132b, and 132c. There will also be three electromagnetic valves (not shown) for the three discharging parts 130. In other embodiments, one discharging part, two discharging parts, or more discharging parts can be provided, and the number of discharging parts depends on the application and design.

[0104] Combined with Figure 7 、 9 , the implanting part 140 includes an implanting vacuum suction nozzle 141 and an implanting driving part 142. The implanting vacuum suction nozzle 141 is communicated with the vacuum pump through a pipeline. The implanting vacuum suction nozzle 141 sucks the component 200 in the groove 121 located at the implanting vacuum suction nozzle 141 through vacuum suction and implants it into the receiving groove 320 of the carrier tape 300. The implanting driving part 142 drives the implanting vacuum suction nozzle 141 to reciprocate between the material taking position and the implanting position. As Figure 5As shown, the implanting vacuum nozzle 141 is located at the picking position. After moving downward, the implanting vacuum nozzle 141 reaches the implanting position (not shown). When the implanting vacuum nozzle 141 is at the picking position, it sucks the component 200 in the groove 121 located at the implanting vacuum nozzle 141, and when at the implanting position, it implants the sucked component 200 into the receiving groove 320 of the carrier tape 300.

[0105] Continue to refer to Figure 7 , as the turntable 120 rotates, the grooves 121 on the edge of the turntable 120 will successively pass through the feeding port 101, the discharging vacuum nozzle 131, and the implanting vacuum nozzle 141. The components 200 are fed one by one into the grooves 121 of the turntable 120. By cooperating with the action control of the solenoid valve, the components 200 with normal detection can be retained, and the components 200 with abnormal detection can be excluded. By cooperating with the reciprocating movement of the implanting vacuum nozzle 141 and the forward movement of the carrier tape 300, the implanting vacuum nozzle 141 can successively place the components 200 in the grooves 121 on the edge of the turntable 120 into the receiving grooves 320 of the carrier tape 300. Thus, the component processing device completes the work of implanting components into the master tape (carrier tape).

[0106] In one embodiment, the component processing device of the present invention further includes a carrier tape driving part (not shown). As Figure 7 shown, the carrier tape driving part drives the carrier tape 300 to move along D1 past the implanting part 140. The carrier tape 300 includes a plurality of receiving grooves 320 arranged in columns and carrier tape holes 310 arranged in columns. The carrier tape driving part drives the receiving grooves 320 of the carrier tape 300 to successively pass through the implanting vacuum nozzle 141 through the carrier tape holes 310 on the carrier tape 300.

[0107] In one embodiment, the carrier tape driving unit drives the carrier tape 300 past the implanting unit 140, and after the component 200 is implanted into the carrier tape 300, it drives the carrier tape 300 to continue moving forward to the appearance inspection station on the machine table 150. The appearance inspection station is provided with a detection window, and an image detection device is arranged directly above the detection window. The detection window has a magnifying lens, which can magnify the component 200 in the storage groove 320 to facilitate the image recognition of the component 200 by the image detection device. The appearance and positioning of the component 200 are inspected by the image detection device. If it is determined that the appearance of the component 200 is qualified and it is correctly received face-up in the storage groove 320, if it is detected that the appearance of the component 200 is unqualified or the positioning is incorrect, the carrier tape is allowed to continue moving forward to the screening station. A push-pull plate is arranged at the screening station. When the unqualified component 200 moves to the screening station, the push-pull plate is opened to take out the unqualified component 200. If no defect of the component 200 is detected, the carrier tape passes through the screening station and continues to move to the next station.

[0108] The component processing device provided in this embodiment can be used as a component and integrated with a carrier tape loading device, a component loading device, and a material packaging device to form a complete set of automated equipment. When the component processing device is used as a part of the complete set of automated equipment, the component processing device feeds the carrier tape containing components to the material packaging device for subsequent packaging operations. The specific process can refer to the relevant content of the automated equipment in the subsequent embodiments.

[0109] Of course, the component processing device can also be used as a loading device for other types of material processing devices, or can be used alone as a component processing equipment for production, and no special restrictions are made here.

[0110] Material packaging device

[0111] In one embodiment, the present invention provides a material packaging device, which is mainly used to package the carrier tape containing components, and the packaged carrier tape is made into a reel.

[0112] The material packaging device can be used as the next packaging device for the component processing device, which packages, reels, finishes, and labels the carrier tape processed by the component processing device to finally obtain a finished reel. Of course, the material packaging device described in this embodiment may also be used as a packaging device for other material operation devices, and no special restrictions are made in this embodiment.

[0113] In one embodiment, see Figure 6, the material packaging device of the present invention needs to first package the carrier tape containing components. That is, a feeding device is also required to supply the upper tape (the upper tape is used to package the carrier tape, that is, to paste the tape on the other side of the master tape to complete the component packaging). The material packaging device pastes the upper tape on one side surface of the carrier tape to form a package for the components.

[0114] In one embodiment, the material packaging device includes an upper pressing device. The upper pressing device is arranged at the upper pressing station. The upper tape supplied by the feeding device and the carrier tape supplied by the component processing device are both conveyed to the upper pressing station, and the packaging of the carrier tape (the upper tape is pasted on the carrier tape) is completed at the upper pressing station.

[0115] In one embodiment, the next station of the screening station in the component processing device can be connected to the upper pressing station. The carrier tape supplied by the component processing device is conveyed from the screening station to the upper pressing station. The upper pressing device arranged at the upper pressing station can include a power-on and heat-generating soldering iron (abbreviation: "soldering iron"). The soldering iron is connected to an electromagnet. The soldering iron moves up and down reciprocally under the drive of the electromagnet to bond the upper tape to the carrier tape. After the pressing action is completed, the upper tape packages the carrier tape to obtain a finished product tape, and the carrier tape driving part drives the finished product tape to continue moving to the next station.

[0116] In one embodiment, a winding station is also arranged on the material packaging device. The finished product tape is moved from the upper pressing station to the winding station. A tail label feeding device and an automatic winding device are arranged at the winding station. The tail label feeding device feeds the tail label to the winding station, and the automatic winding device automatically winds the finished product tape around a roller into a roll. When it is wound to the set length / thickness, a tape roll is obtained. The automatic winding device pastes the tail label on the terminal of the tape roll to obtain a finished product tape roll with packaging completed.

[0117] In one embodiment, a labeling station is also arranged on the material packaging device. The finished product tape roll with packaging completed is conveyed to the labeling station. A labeling device and a scanning device are arranged at the labeling station. The labeling device attaches a nameplate to the reel of the finished product tape roll, and the scanning device scans and detects whether the barcode on the nameplate is correct. Of course, the nameplate can be attached manually or by a machine in cooperation with a sensor for identification and attachment.

[0118] The material packaging device provided in this embodiment can be used as a component and integrated with a component feeding device, a carrier tape feeding device, and a component processing device to form a complete set of automated equipment. When the material packaging device is used as a part of the complete set of automated equipment, the material packaging device receives materials from the component processing device for packaging. Of course, the carrier tape feeding device can also be used as other types of material processing devices, which are not particularly limited here according to packaging requirements.

[0119] Material automatic processing equipment

[0120] The present invention provides a material automatic processing equipment, which can continuously and automatically complete operations such as component feeding, placement, packaging, and winding, thereby greatly improving the processing efficiency of materials.

[0121] In one embodiment, the automated equipment described in the present invention includes a frame, and a carrier tape feeding device, a component feeding device, a component processing device, and a material packaging device integrally installed on the frame. Among them:

[0122] The carrier tape feeding device is used to feed the carrier tape to the component processing device;

[0123] The component feeding device feeds components to the component processing device;

[0124] The component processing device places components in the receiving slots of the carrier tape and conveys the carrier tape containing the components to the material packaging device;

[0125] The material packaging device packages, winds, finishes, and labels the carrier tape containing components, and finally produces a finished product tape that can be sold externally.

[0126] In one embodiment, the automated equipment described in the present invention may further include a material separation device, and the material separation device can be used for separating and feeding materials.

[0127] It should be noted that the carrier tape feeding device, the component feeding device, the component processing device, the material packaging device, and the material separation device are not necessarily completely independent in structure, and some or several structural members may be reused between the devices. Correspondingly, the processing stations in each device are not necessarily completely staggered in spatial position, and some stations may partially overlap or even completely overlap. This structural reuse and station overlap are also for saving production space and shortening the production transfer route. For example, the feeding station in the component feeding device can be reused as a detection station.

[0128] It should be specifically noted that in some embodiments, the present invention is provided with only one type of transfer component. This transfer component can not only reciprocate between various devices to transfer the carrier tape from one device to another, but also enter the interior of each device to achieve the transfer of the carrier tape between various processing stations inside each device. In these embodiments, the carrier tape driving component mentioned in the present invention specifically refers to this transfer component. Of course, in order to improve the processing efficiency of the automated equipment, multiple groups of transfer components can be set, and multiple groups of transfer components act in parallel, so that the automated equipment can simultaneously perform material packaging on multiple carrier tapes. Of course, at the same moment, these carrier tapes are at different stations to receive different operations, ensuring that there is no interference or misalignment between them.

[0129] In some other embodiments, independent internal transfer components are provided inside each device as needed. These internal transfer components only move inside the device to which they belong to achieve the transfer of the carrier tape between various processing stations inside the device to which they belong. An external transfer component is additionally provided on the machine table or the frame. This external transfer component can reciprocate between various devices to transfer the carrier tape from one device to another. In these embodiments, the transfer mechanism mentioned in the present invention includes the internal transfer components and the external transfer components inside each device. Of course, in the present invention, the conveyance of the carrier tape is basically completed by the carrier tape driving component.

[0130] The carrier tape loading device in the automated equipment in the embodiments of the present invention adopts the carrier tape loading device in the embodiments of the present invention. Since the specific structure and working process of this carrier tape loading device have been described in detail above, they will not be elaborated here. Please refer to the relevant descriptions in the embodiments of the present invention. In addition, it should be noted that when the carrier tape loading device is described below, the internal components thereof will not be introduced one by one either. Please directly refer to the relevant descriptions in the above embodiments.

[0131] It should be noted that in some other embodiments, the carrier tape is loaded into the material implantation station manually. Therefore, in these embodiments, the automated equipment in the embodiments of the present invention is not equipped with the material loading device. It only includes a component loading device, a component processing device, and a material packaging device installed on the frame, which can sequentially complete the processing operations of the components.

[0132] The component loading device in the automated equipment in the embodiments of the present invention adopts the component loading device in the above embodiments of the present invention. Since the specific structure and working process of this component loading device have been described in detail above, they will not be elaborated here. Please refer to the relevant descriptions in the above embodiments.

[0133] The component processing device in the automated equipment in the embodiments of the present invention adopts the component processing device in the above embodiments of the present invention. Since the specific structure and working process of this component processing device have been described in detail in the previous text, they will not be elaborated here. Please refer to the relevant descriptions in the above embodiments.

[0134] The material packaging device in the automated equipment in the embodiments of the present invention adopts the material packaging device in the above embodiments of the present invention. Since the specific structure and working process of this material packaging device have been described in detail in the previous text, they will not be elaborated here. Please refer to the relevant descriptions in the above embodiments.

[0135] Each functional device in the automated equipment provided by the present invention can be disassembled, recombined, replaced or deleted according to the actual application environment, but it still does not affect its basic function as an automated equipment.

[0136] In addition to the material separation device, the automated equipment of the present invention also has a carrier tape loading device, a component loading device, a component processing device and a material packaging device. The carrier tape loading device is used for loading the carrier tape for packaging components. The component loading device is used for loading components. The component processing device is used for implanting the components into the receiving grooves of the carrier tape. The material packaging device is used for packaging the carrier tape containing components. Therefore, the automated equipment of the present invention can meet the needs of the entire packaging process, realize automated packaging, reduce labor costs and improve production efficiency.

[0137] In this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion. In addition to the listed elements, it may also include other elements not expressly listed.

[0138] In this article, the front, rear, upper, lower and other orientation words are defined based on the positions of the components in the drawings and the positions of the components relative to each other, only for the sake of clarity and convenience of expressing the technical solution. It should be understood that the use of the orientation words should not limit the scope of protection requested by this application. Without conflict, the above embodiments and the features in the embodiments in this article can be combined with each other. The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A material separation device, characterized in that, It includes: A base; A separation component, which is installed on one side surface of the base, and a material passage allowing materials to pass through is formed thereon. It is configured to separate one material in the material passage from another adjacent material, so that the separated one material is moved from the material passage to the target feeding position; A negative pressure generating component; A material monitoring component, which is configured to monitor the materials in the material passage; And A control system, which is configured to control the negative pressure generating component to generate negative pressure according to the signal sent by the material monitoring component; A vacuum airway communicating with the negative pressure generating component is provided on the separation component, and the vacuum airway communicates with the material passage. When the material monitoring component monitors that there are multiple materials in the material passage, the material monitoring component sends a signal to the control system, and the control system controls the negative pressure generating component to generate negative pressure. The negative pressure forms an adsorption effect on the materials in the material passage from the vacuum airway, realizing the separation of the materials near the vacuum airway in the material passage from the materials adjacent to them and near the target feeding position; It further includes a material conveying track, which has an input end and an output end. The input end is connected to a hopper, and the output end passes out from below the material passage and extends to the target feeding position; Multiple materials are arranged in a row on the material conveying track, and after passing through the material passage in sequence, they are transported to the target feeding position by the material conveying track. The width of the material passage is smaller than the total width of two materials; The material monitoring component includes a first fiber optic sensor and a second fiber optic sensor. The first fiber optic sensor is installed on the base below the material passage and near the target feeding position, and the second fiber optic sensor is located between the first fiber optic sensor and the target feeding position. When a material moves from the material passage to the target feeding position, it passes through the first fiber optic sensor and the second fiber optic sensor in sequence; When multiple materials are transported to the material passage by the material conveying track and are arranged in a row in the material passage in sequence, the first fiber optic sensor and the second fiber optic sensor respectively sense the materials. After receiving the induction signals sent by the first fiber optic sensor and the second fiber optic sensor, the control system controls the negative pressure generating component to generate negative pressure. The negative pressure adsorbs the materials sensed by the first fiber optic sensor from the vacuum airway, and the materials sensed by the second fiber optic sensor are transported to the target feeding position by the material conveying track; An opening is formed on the inner wall of the material passage, and the vacuum airway communicates with the material passage from the opening. The first fiber optic sensor is close to the opening position. When the material is transported into the material passage and close to the opening, the first fiber optic sensor senses the material; When multiple said materials are arranged in a line within the material channel, the material sensed by the second fiber optic sensor is closer to the target feeding position than the material sensed by the first fiber optic sensor. The negative pressure generated by the negative pressure generating assembly adsorbs the material sensed by the first fiber optic sensor through the vacuum airway. The material is adsorbed to the opening, and the material blocks one or more materials adjacent to it and close to the input end. The material sensed by the second fiber optic sensor is transported to the target feeding position; The negative pressure generating assembly includes a vacuum pump and a vacuum pipeline for conveying the high-pressure gas generated by the vacuum pump; The separation assembly includes a first cover plate and a second cover plate. The first cover plate and the second cover plate are relatively spaced apart on one side surface of the base to form the material channel. A hole is provided on the side wall of the first cover plate close to the material channel, and the hole extends from the side wall surface into the interior of the first cover plate until it communicates with the vacuum pipeline; An air gap is provided on the side wall of the second cover plate close to the material channel.

2. The material separation device according to claim 1, characterized in that, It further includes a turntable, and a circle of grooves are evenly provided on the edge of the turntable. The turntable is arranged below the base; An inlet is further provided on the base, and the inlet forms the target feeding position of the separated material. The inlet extends downward from the side surface of the base where the separation assembly is installed and corresponds to and communicates with one of the grooves on the turntable. The material is fed from the inlet into the groove; If the groove corresponding to the inlet contains material, the turntable is driven to rotate so that the next groove adjacent to the groove is rotated below the inlet to receive the material; When the turntable is driven to rotate, the negative pressure generating assembly stops generating vacuum, and the adsorbed material is released. The material is transported to the inlet and then fed into the groove of the turntable.

3. The material separation device according to claim 1, characterized in that When the material monitoring assembly monitors one material within the material channel, the control system controls the negative pressure generating assembly to stop generating negative pressure, and the material is moved from the material channel to the target feeding position.

4. The material separation device according to claim 1, wherein The vacuum airway includes one or more sub-airways and a main airway communicating with the sub-airways. The vacuum pipeline communicates with the main airway. The negative pressure gas output from the vacuum pipeline is dispersed from the main airway into one or more sub-airways. One or more sub-airways extend towards the material channel direction, and one or more sub-airways respectively communicate with the material channel.

5. The material separation device according to claim 1, characterized in that A gas hole is provided on the base, and the vacuum airway communicates with the vacuum pipeline through the gas hole.

6. An automated material processing device, characterized in that, It includes the material separation device according to any one of claims 1-5 above. The material separation device is used to separate materials and complete the feeding of the separated materials.

7. The material automatic processing equipment according to claim 6, wherein It further includes a carrier tape feeding device, a component feeding device, a component processing device, and a material packaging device. The carrier tape feeding device is used to feed the carrier tape packaging components. The component feeding device is used to realize the feeding of components. The component processing device is used to implant the components into the receiving grooves of the carrier tape. The material packaging device is used to realize the packaging of the carrier tape containing components. The material packaging device includes an upper pressing device, and the upper pressing device has a soldering iron. The upper pressing device presses the tape onto the surface of the carrier tape through the soldering iron.

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