A silicon wafer picking device

Abstract

The present application discloses a silicon wafer collecting device, which includes a conveying unit extending along a first direction, 2N bearing mechanisms located on both sides of the conveying unit, and N picking units for picking up the silicon wafers on the conveying unit to the bearing mechanisms, wherein: the 2N bearing mechanisms are symmetrically arranged on both sides of the conveying unit respectively, each 1 picking unit cooperates with every 2 bearing mechanisms symmetrically arranged on both sides of the conveying unit, and each 1 picking unit is configured to pick up the silicon wafers on the conveying unit to every 2 bearing mechanisms on both sides of the conveying unit; each 1 bearing mechanism includes a first bearing unit and a second bearing unit arranged in parallel in sequence along a direction perpendicular to the first direction on one side of the conveying unit, and a first wafer receiving position of the first bearing unit and a second wafer receiving position of the second bearing unit are located on the same horizontal plane; N is a natural number greater than or equal to 1. The present application can improve the production capacity of the silicon wafer collecting device.

Description

Technical Field

[0001] The present application belongs to the field of silicon wafer sorting, and specifically, relates to a silicon wafer collecting device. Background Art

[0002] After the silicon wafers are sorted and tested by the sorting machine, they need to be classified and collected according to the sorted grades, and the silicon wafers of different grades are collected into different material boxes. At present, usually a row of material boxes is set on both sides of the conveyor line, and each row of material boxes is set with two layers above and below. However, with the continuous improvement of the sorting machine capacity, the current silicon wafer collection device is difficult to match the current sorting machine capacity.

[0003] Therefore, how to improve the current production capacity of silicon wafer receiving is a technical problem that urgently needs to be solved. Summary of the invention

[0004] In view of the problem that the production capacity of the current silicon wafer receiving device is difficult to match the sorting capacity of the sorting machine, the present application proposes a silicon wafer receiving device.

[0005] A silicon wafer receiving device comprises a conveying unit extending along a first direction, 2N carrying mechanisms located on both sides of the conveying unit, and N picking units for picking up silicon wafers on the conveying unit to the carrying mechanisms, wherein:

[0006] 2N carrying mechanisms are symmetrically arranged on both sides of the conveying unit, each picking unit cooperates with every two carrying mechanisms symmetrically arranged on both sides of the conveying unit, and each picking unit is configured to pick up the silicon wafer on the conveying unit to every two carrying mechanisms on both sides of the conveying unit;

[0007] Each of the carrying mechanisms comprises a first carrying unit and a second carrying unit which are arranged in parallel and in sequence on one side of the transmission unit along a direction perpendicular to the first direction, and a first film receiving position of the first carrying unit and a second film receiving position of the second carrying unit are located on the same horizontal plane;

[0008] N is a natural number greater than or equal to 1.

[0009] The first carrier unit and the second carrier unit are arranged in parallel in sequence perpendicular to the first direction on one side of the conveying unit, and the first wafer receiving position of the first carrier unit and the second wafer receiving position of the second carrier unit are located on the same horizontal plane, so that the first carrier unit and the second carrier unit can both receive the silicon wafers conveyed by the conveying unit at the same wafer receiving stage, which can greatly match the sorting capacity of the sorting machine.

[0010] In addition, by symmetrically arranging the carrying mechanisms on both sides of the conveying unit, each carrying mechanism includes a first carrying unit and a second carrying unit arranged in parallel, which is equivalent to having two carrying units on one side of the conveying unit to collect the silicon wafers on the conveying unit. Without increasing the length of the silicon wafer collecting device, the number of carrying units is increased, and the number of types of silicon wafers that can be carried is also increased.

[0011] Optionally, the silicon wafer collecting device further comprises a transition unit and a mounting seat, and the transition unit is mounted on the mounting seat;

[0012] Each carrying mechanism further includes a first lifting unit, the first carrying unit is slidably disposed on the first lifting unit, and the first lifting unit is used to drive the first carrying unit to rise to the first film receiving position and to descend to the transition position docking with the transition unit;

[0013] The transition unit is used for driving the first bearing unit to reciprocate between the first unloading position and the transition position below the second bearing unit.

[0014] The first lifting unit and the transition unit are arranged to drive the first carrying unit to reciprocate between the first wafer receiving position and the first wafer unloading position. When the first carrying unit is full of silicon wafers, the first carrying unit is transferred from the first wafer receiving position to the first wafer unloading position, so that workers can take out the silicon wafers in the first carrying unit located on the inner side of the conveying unit, thereby improving the unloading speed of the first carrying unit and further improving the production capacity of the silicon wafer collecting device.

[0015] Optionally, the first carrying unit includes a first base, at least one first carrying box and a docking portion, the first carrying box is tilted on the first base, and the docking portion is fixedly arranged at the bottom of the first base. When the first carrying unit descends to the transition position, the driving end of the transition unit docks with the docking portion, driving the first carrying unit to move from the transition position to the first unloading position.

[0016] By using the transition unit to drive the first carrier unit at the transition position to the first unloading position, a smooth transition of the first carrier unit can be achieved, thereby ensuring the quality of the silicon wafers in the first carrier unit.

[0017] Optionally, each bearing mechanism further includes a first guide rail, which extends from the transition position to the first film unloading position and is fixedly arranged on the mounting seat;

[0018] The first bearing unit also includes a guide assembly, which is arranged at the bottom of the first bearing unit and guides the first bearing unit along the first guide rail.

[0019] By setting the first guide rail and cooperating with the guide assembly on the first carrying unit, the first carrying unit can be stably moved from the transition position to the first unloading position, which can not only improve the efficiency of the position switching of the first carrying unit, but also ensure that the silicon wafers in the first carrying unit are quickly and stably switched without affecting the wafer collection quality.

[0020] Optionally, the first guide rail includes a first guide surface and a second guide surface that are perpendicular to each other; the guide assembly includes a second guide roller that cooperates with the first guide surface and cooperates with the second guide surface.

[0021] By providing a first guide surface and a second guide surface that are perpendicular to each other and a first guide roller and a second guide roller that respectively cooperate with the first guide surface and the second guide surface, the first bearing unit is guided from two different directions when the first bearing unit moves laterally, so that the guiding effect is smoother and the first bearing unit has higher flexibility when moving laterally.

[0022] Optionally, the transition unit includes a linear drive and a docking cylinder, the linear drive is fixedly mounted on the mounting seat, the docking cylinder is fixedly mounted on the driving end of the linear drive, and the docking cylinder is driven by the linear drive to move back and forth between the transition position and the first unloading position;

[0023] The driving end of the docking cylinder is controlled to extend to dock with the docking part, thereby driving the first bearing unit to move back and forth between the transition position and the first unloading position. The driving end of the docking cylinder is controlled to retract to disconnect from the docking part, thereby disconnecting the transition unit from the first bearing unit.

[0024] The driving end of the docking cylinder is controlled to extend to dock with the docking part or retract to disconnect with the docking part, and the structure is simple and reliable; the linear drive component drives the first bearing unit to move horizontally between the transition position and the first unloading position, and the horizontal movement of the first bearing unit is achieved by combining the linear drive component and the docking cylinder, which has a simple structure and controllable costs.

[0025] Optionally, the second carrying unit includes a second base and second carrying boxes having the same number as the first carrying boxes, and the second carrying boxes are tiltedly arranged on the second base.

[0026] The number of the second carrier boxes is designed to be the same as the number of the first carrier boxes, which can maximize the number of carrier boxes that can be used to collect films, thereby increasing the number of films collected by the collecting device and meeting the requirements of the collecting device for the number of carrier boxes under high production capacity.

[0027] Optionally, there are two first carrying boxes, which are spaced apart on the first base along the first direction; there are two second carrying boxes, which are spaced apart on the second base along the first direction;

[0028] Each picking unit includes two suction plates and two transverse shifting modules, the two transverse shifting modules are arranged at intervals along the first direction, the two suction plates are respectively arranged on a corresponding transverse shifting module, and the transverse shifting paths of the two suction plates pass through the top of the first carrying box and the second carrying box respectively;

[0029] The two lateral shift modules are configured to respectively drive the corresponding suction plates to synchronously or individually pick up the silicon wafers on the conveying unit into the corresponding first carrier box or the second carrier box.

[0030] Setting the number of the first carrying boxes to two can multiply the number of silicon wafers that each carrying unit can carry, thereby improving the wafer collection efficiency; the two transverse shift modules are configured to drive the corresponding suction plates to pick up the silicon wafers synchronously or individually, and can flexibly choose the method of picking up the silicon wafers on the conveying unit according to the work requirements.

[0031] Optionally, the silicon wafers carried by the two first carrying boxes of at least some of the first carrying units are of the first grade; and the silicon wafers carried by the two second carrying boxes of at least some of the second carrying units are of the second grade.

[0032] When collecting silicon wafers, at least some of the silicon wafers carried by the two first carrying boxes of the first carrying unit are of the first grade, and at least some of the silicon wafers carried by the two second carrying boxes of the second carrying unit are of the second grade. According to the number of grades of silicon wafers, the grades of silicon wafers carried by the two first carrying boxes of the first carrying unit and the two second carrying boxes of the second carrying unit can be arbitrarily combined, thereby increasing the types of silicon wafer grades that can be collected by the silicon wafer collecting device.

[0033] Optionally, the silicon wafers carried by the same carrying mechanism are silicon wafers of the same grade, and the 2N carrying mechanisms respectively carry silicon wafers of 2N different grades.

[0034] Having the same grade of silicon wafers carried by the same carrying mechanism can simplify the wafer collection logic and make it easier for workers to collect the same type of silicon wafers on the same carrying mechanism, thereby reducing the workload of workers and improving wafer collection efficiency.

[0035] Optionally, the silicon wafers carried by the same first carrying unit are of the same grade, and the silicon wafers carried by the same second carrying unit are of the same grade; 2N first carrying units and 2N second carrying units respectively carry 4N different grades of silicon wafers.

[0036] Since the wafer collecting positions of the first carrying unit and the second carrying unit are located on the same horizontal plane and the first carrying unit can move independently relative to the second carrying unit, controlling each first carrying unit and each second carrying unit to carry silicon wafers of different grades can maximize the number of silicon wafer grades that can be collected by the silicon wafer collecting device, thereby improving the utilization rate of each carrying unit.

[0037] Optionally, each carrying mechanism further includes a second lifting unit, the second carrying unit is slidably disposed on the second lifting unit, and the second lifting unit is used to drive the second carrying unit to rise to the second film receiving position and descend to the second film unloading position below the second film receiving position.

[0038] The second carrying unit is configured to be able to be raised and lowered along the second lifting unit. After the second carrying unit is full of silicon wafers, it can be lowered to a suitable height to complete the collection of the silicon wafers in the second carrying unit, which is beneficial to improving the user experience.

[0039] Optionally, the silicon wafer receiving device further includes a pulling unit, which is disposed at the first wafer unloading position and is used to pull the first carrying unit at the first wafer unloading position to be staggered with the second carrying unit.

[0040] By providing a pull-out unit, the first carrier unit can be pulled out to be staggered with the second carrier unit, which makes it more convenient to take out the silicon wafer in the first carrier unit, thereby improving the user experience.

[0041] Optionally, the silicon wafer collecting device further includes a first sensing device, which is disposed on the mounting seat and is located at one side of the transition position, and is used to sense whether the first carrying unit is located at the transition position.

[0042] A first sensing device is provided to sense whether the first carrying unit has moved to the transition position, so that the transition unit can accurately drive the first carrying unit to reciprocate between the first unloading position and the transition position below the second carrying unit, thereby improving the transfer efficiency of the first carrying unit and further improving the wafer collecting efficiency of the silicon wafer collecting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A top view of an embodiment of a silicon wafer receiving device;

[0044] Figure 2 for Figure 1 A three-dimensional schematic diagram of a silicon wafer collecting device;

[0045] Figure 3A A schematic diagram of an implementation of a carrying mechanism;

[0046] Figure 3B for Figure 3A A schematic diagram of the first load-bearing unit descending;

[0047] Figure 3C for Figure 3A A schematic diagram of the first load-bearing unit descending to the transition position;

[0048] Figure 3D for Figure 3AA schematic diagram of the first carrying unit in the figure moving horizontally to the first unloading position;

[0049] Figure 4 is a schematic diagram of an implementation of the first carrying unit;

[0050] Figure 5 for Figure 3C An enlarged schematic diagram of the middle transition part;

[0051] Figure 6 is a schematic diagram of an implementation of the second carrying unit;

[0052] In the figure: a conveying unit 1, a carrying mechanism 2, a first carrying unit 21, a first base 211, a first carrying box 212, a docking portion 213, a guide assembly 214, a first guide roller 2141, a second guide roller 2142, a second carrying unit 22, a second base 221, a second carrying box 222, a first lifting unit 23, a second lifting unit 24, a picking unit 3, a transition unit 5, a driving end 521 of a docking cylinder, a driving end 511 of a linear drive member, a linear drive member 51, a docking cylinder 52, a mounting seat 4, a first guide rail 41, a first guide surface 411, a second guide surface 412, a pulling unit 6, and a first sensing device 7. DETAILED DESCRIPTION

[0053] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Among them, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application.

[0054] The present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments. It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict.

[0055] In order to solve the problem that the production capacity of the current silicon wafer collecting device is difficult to match the production capacity of the silicon wafer sorting machine, the present application proposes a silicon wafer collecting device.

[0056] like Figure 1 , Figure 2 and Figure 3A As shown, the silicon wafer receiving device includes a conveying unit 1 extending along a first direction, 2N carrying mechanisms 2 located on both sides of the conveying unit 1, and N picking units 3 for picking up the silicon wafer 8 on the conveying unit 1 to the carrying mechanisms 2, wherein:

[0057] 2N carrying mechanisms 2 are symmetrically arranged on both sides of the conveying unit 1, and each pick-up unit 3 cooperates with each two carrying mechanisms 2 symmetrically arranged on both sides of the conveying unit 1. Each pick-up unit 3 is configured to pick up the silicon wafer 8 on the conveying unit 1 to each two carrying mechanisms 2 on both sides of the conveying unit 1;

[0058] Each of the carrying mechanisms 2 includes a first carrying unit 21 and a second carrying unit 22 which are arranged in parallel and in a perpendicular direction to one side of the transmission unit 1, and a first film receiving position A1 of the first carrying unit 21 and a second film receiving position A2 of the second carrying unit 22 are located in the same horizontal plane;

[0059] N is a natural number greater than or equal to 1.

[0060] Figure 1 In the embodiment shown in FIG. 1 , the silicon wafer receiving device has eight carrier mechanisms 2, four pick-up units 3, and Figure 1 Taking the first picking unit 3 on the far left and the two carrying mechanisms 2 located on both sides of the conveying unit 1 as an example, the first picking unit 3 can pick up the silicon wafer on the conveying unit 1 to the carrying mechanism 2 on any side of the conveying unit 1.

[0061] The first carrier unit 21 and the second carrier unit 22 are arranged in parallel in sequence on one side of the conveying unit 1 along a direction perpendicular to the first direction, and the first wafer receiving position A1 of the first carrier unit 21 and the second wafer receiving position A2 of the second carrier unit 22 are located on the same horizontal plane, so that the first carrier unit 21 and the second carrier unit 22 can both receive the silicon wafers conveyed by the conveying unit 1 in the same wafer receiving stage (i.e., in a sorting time period of the silicon wafer sorting machine), which can greatly match the sorting capacity of the sorting machine.

[0062] By symmetrically arranging the carrying mechanisms 2 on both sides of the conveying unit 1, each carrying mechanism 2 includes a first carrying unit 21 and a second carrying unit 22 arranged in parallel. It is equivalent to having two carrying units on one side of the conveying unit 1 to collect the silicon wafers on the conveying unit 1. Without increasing the length of the silicon wafer collecting device, the number of carrying units is increased, and the number of types of silicon wafers that can be carried is also increased.

[0063] Optional, such as Figure 3A As shown, the silicon wafer receiving device further includes a transition unit 5 and a mounting seat 4, and the transition unit 5 is mounted on the mounting seat 4; each supporting mechanism 2 further includes a first lifting unit 23, and the first supporting unit 21 is slidably arranged on the first lifting unit 23, and the first lifting unit 23 is used to drive the first supporting unit 21 to rise to the first wafer receiving position and descend to the transition position docking with the transition unit 5;

[0064] The transition unit 5 is used to drive the first bearing unit 21 to reciprocate between the first unloading position and the transition position below the second bearing unit 22. For the first lifting unit 23, a lead screw nut, a linear lifting module, a lifting cylinder, etc. can be selected to realize the lifting of the first bearing unit 21, and this application does not make specific limitations.

[0065] Specifically, when the silicon wafers in the first carrying unit 21 are full, Figure 3B As shown, the first lifting unit 23 can be controlled to drive the first carrying unit 21 to descend from the first film receiving position A1; Figure 3C As shown, under the drive of the first lifting unit 23, the first carrying unit 21 descends to the transition position B. After the first carrying unit 21 moves to the transition position, the transition unit 5 drives the first carrying unit 21 to move horizontally toward the first unloading position C until it reaches Figure 3D As shown in the first unloading position C, after taking out the silicon wafers in the first unloading position C, it is only necessary to reversely follow the above steps to return the first carrying unit 21 from the first unloading position to the first receiving position.

[0066] The first lifting unit 23 and the transition unit 5 are provided to drive the first carrying unit 21 to reciprocate between the first wafer receiving position and the first wafer unloading position. When the first carrying unit 21 is full of silicon wafers, the first carrying unit 21 is transferred from the first wafer receiving position to the first wafer unloading position, so that workers can take out the silicon wafers in the first carrying unit 21 located on the inner side of the conveying unit 1, thereby improving the unloading speed of the first carrying unit 21 and further improving the production capacity of the silicon wafer collecting device.

[0067] Optional, such as Figure 4 As shown, the first carrying unit 21 includes a first base 211, at least one first carrying box 212 and a docking portion 213. The first carrying box 212 is tilted on the first base 211, and the docking portion 213 is fixedly arranged at the bottom of the first base 211. When the first carrying unit 21 descends to the transition position, the driving end of the transition unit 5 docks with the docking portion 213, driving the first carrying unit 21 to move from the transition position to the first unloading position.

[0068] By using the transition unit 5 to drive the first carrier unit 21 at the transition position to the first unloading position, a smooth transition of the first carrier unit 21 can be achieved, thereby ensuring the quality of the silicon wafers in the first carrier unit 21 .

[0069] In order to better enable the first carrying unit 21 to reciprocate between the transition position and the first unloading position, as shown in FIG. Figure 3A and 3B As shown, each carrying mechanism 2 further includes a first guide rail 41, and the first guide rail 41 extends from the transition position to the first film unloading position and is fixedly disposed on the first bottom mounting seat 4;

[0070] The first carrying unit 21 further includes a guide assembly 214 , which is disposed at the bottom of the first carrying unit 21 and guides the first carrying unit 21 along the first guide rail 41 .

[0071] By setting the first guide rail 41 and cooperating with the guide assembly 214 on the first carrying unit 21, the first carrying unit 21 can be stably moved from the transition position to the first unloading position, which can not only improve the efficiency of the position switching of the first carrying unit 21, but also ensure that the silicon wafers in the first carrying unit 21 are quickly and stably switched without affecting the wafer collection quality.

[0072] For an implementation of the first guide rail 41 and the guide assembly 214, as Figure 5 As shown, the first guide rail 41 includes a first guide surface 411 and a second guide surface 412 which are perpendicular to each other; the guide assembly 214 includes a second guide roller 2142 which cooperates with the first guide surface 411 and cooperates with the second guide surface 412 .

[0073] By providing a first guide surface 411 and a second guide surface 412 which are perpendicular to each other and a first guide roller 2141 and a second guide roller 2142 which cooperate with the first guide surface 411 and the second guide surface 412 respectively, when the first bearing unit 21 moves laterally, the first bearing unit 21 is guided from two different directions, so that the guiding effect is smoother and the first bearing unit 21 has higher flexibility when moving laterally.

[0074] For an implementation of the transition unit 5, Figure 5 As shown, the transition unit 5 includes a linear drive member 51 and a docking cylinder 52. The linear drive member 51 is fixedly mounted on the mounting seat 4, and the docking cylinder 52 is fixedly mounted on the driving end 511 of the linear drive member. The docking cylinder 52 is driven by the linear drive member 51 to move back and forth between the transition position and the first unloading position.

[0075] The driving end 521 of the docking cylinder is controlled to extend to dock with the docking part 213, thereby driving the first bearing unit 21 to move back and forth between the transition position and the first unloading position. The driving end 521 of the docking cylinder is controlled to retract to disconnect from the docking part 213, thereby disconnecting the transition unit 5 from the first bearing unit 21.

[0076] The driving end 521 of the docking cylinder is controlled to extend to dock with the docking part 213 or retract to disconnect with the docking part 213, and the structure is simple and reliable; the linear driving member 51 drives the first bearing unit 21 to move horizontally between the transition position and the first unloading position, and the horizontal movement of the first bearing unit 21 is achieved by combining the linear driving member 51 and the docking cylinder 52, which has a simple structure and controllable costs.

[0077] Optionally, the second carrying unit 22 includes a second base 221 and second carrying boxes 222 of the same number as the first carrying boxes 212 , and the second carrying boxes 222 are tiltedly arranged on the second base 221 .

[0078] The number of the second carrier boxes 222 is designed to be the same as the number of the first carrier boxes 212, which can maximize the number of carrier boxes that can be used to collect films, thereby increasing the number of films collected by the collecting device and meeting the requirements of the collecting device for the number of carrier boxes under high production capacity.

[0079] In one embodiment of the supporting mechanism 2, Figure 3A and Figure 6 As shown, there are two first carrying boxes 212 , which are spaced apart on the first base 211 along the first direction; there are two second carrying boxes 222 , which are spaced apart on the second base 221 along the first direction.

[0080] Each picking unit 3 includes two suction plates and two transverse shifting modules, the two transverse shifting modules are arranged at intervals along the first direction, the two suction plates are respectively arranged on a corresponding transverse shifting module, and the transverse shifting paths of the two suction plates pass through the first carrying box 212 and the second carrying box 222 respectively;

[0081] The two lateral shift modules are configured to respectively drive the corresponding suction plates to synchronously or individually pick up the silicon wafers on the conveying unit 1 into the corresponding first carrier box 212 or the second carrier box 222 .

[0082] Setting two first carrier boxes 212 can multiply the number of silicon wafers that each carrier unit can carry, thereby improving the wafer collection efficiency; the two transverse shift modules are configured to drive the corresponding suction plates to pick up silicon wafers synchronously or individually, respectively, and can flexibly select the method of picking up the silicon wafers on the conveying unit 1 according to the work requirements.

[0083] In one embodiment of the carrying mechanism 2, there is one first carrying box 212 and one second carrying box 222. This method is more suitable for situations where there are many types of silicon wafers. After the silicon wafers are full, one carrying box does not need to wait for other unfilled carrying boxes, and the wafer retrieval operation can be performed more flexibly.

[0084] There are many optional ways to use the carrier mechanism 2 of the silicon wafer receiving device of the present application to receive silicon wafers of different grades, and the following examples are given to illustrate:

[0085] Optionally, the silicon wafers carried by the two first carrying boxes 212 of at least some of the first carrying units 21 are of the first grade; and the silicon wafers carried by the two second carrying boxes 222 of at least some of the second carrying units 22 are of the second grade.

[0086] The silicon wafers carried by the two first carrying boxes 212 of at least part of the first carrying units 21 are of the first grade, including but not limited to:

[0087] (1) The silicon wafers carried by the two first carrying boxes 212 of a part of the first carrying units 21 are of the first grade, that is, the two first carrying boxes 212 carry silicon wafers of the same grade; the silicon wafers carried by the two first carrying boxes 212 of a part of the first carrying units 21 are respectively of the third grade and the fourth grade, that is, the two first carrying boxes 212 carry silicon wafers of different grades.

[0088] (2) The silicon wafers carried by the two first carrying boxes 212 of a portion of the first carrying units 21 are of the first grade, that is, the two first carrying boxes 212 carry silicon wafers of the same grade; and the silicon wafers carried by the two first carrying boxes 212 of a portion of the first carrying units 21 are of the third grade, that is, the two first carrying boxes 212 carry silicon wafers of the same grade but different from the first grade.

[0089] (3) The silicon wafers carried by the two first carrying boxes 212 of all the first carrying units 21 are of the first grade, that is, the two first carrying boxes 212 carry silicon wafers of the same grade.

[0090] Of course, the first carrying boxes 212 of the first carrying units 21 of other parts may also be used to carry silicon wafers of other different grades.

[0091] The silicon wafers carried by the two second carrying boxes 222 of at least part of the second carrying units 22 are second-grade silicon wafers, and the receiving grade form is similar to that of the first carrying unit 21 .

[0092] When collecting silicon wafers, at least some of the silicon wafers carried by the two first carrying boxes 212 of the first carrying unit 21 are of the first grade, and at least some of the silicon wafers carried by the two second carrying boxes 222 of the second carrying unit 22 are of the second grade. According to the number of grades of silicon wafers, the grades of silicon wafers carried by the two first carrying boxes 212 of the first carrying unit 21 and the two second carrying boxes 222 of the second carrying unit 22 can be arbitrarily combined, thereby increasing the types of silicon wafer grades that can be collected by the silicon wafer collecting device.

[0093] Optionally, the silicon wafers carried by the same carrying mechanism 2 are silicon wafers of the same grade, and the 2N carrying mechanisms 2 respectively carry silicon wafers of 2N different grades.

[0094] Using the same carrier mechanism 2 to carry silicon wafers of the same grade can simplify the wafer collection logic, making it easier for workers to collect silicon wafers of the same type from the same carrier mechanism 2, thereby reducing the workload of workers and improving wafer collection efficiency.

[0095] Optionally, the silicon wafers carried by the same first carrying unit 21 are silicon wafers of the same grade, and the silicon wafers carried by the same second carrying unit 22 are silicon wafers of the same grade; 2N first carrying units 21 and 2N second carrying units 22 carry 4N silicon wafers of different grades respectively. Figure 1 There are 8 carrying mechanisms 2 in total, and the 8 carrying mechanisms 2 include 8 first carrying units 21 and 8 second carrying units 22. The 8 first carrying units 21 and the 8 second carrying units 22 carry 16 different grades of silicon wafers respectively.

[0096] Since the wafer collecting positions of the first carrying unit 21 and the second carrying unit 22 are located on the same horizontal plane and the first carrying unit 21 can move independently relative to the second carrying unit 22, controlling each first carrying unit 21 and each second carrying unit 22 to carry silicon wafers of different grades can maximize the number of silicon wafer grades that can be collected by the silicon wafer collecting device, thereby improving the utilization rate of each carrying unit.

[0097] Optional, such as Figure 3A As shown, each carrying mechanism 2 further includes a second lifting unit 24, on which the second carrying unit 22 is slidably disposed, and the second lifting unit 24 is used to drive the second carrying unit 22 to rise to the second film receiving position and descend to the second film unloading position below the second film receiving position.

[0098] The second carrying unit 22 is configured to be able to be raised and lowered along the second lifting unit 24. After the second carrying unit 22 is full of silicon wafers, it can be lowered to a suitable height to complete the collection of the silicon wafers in the second carrying unit 22, which is beneficial to improving the user experience.

[0099] Optionally, the silicon wafer receiving device further includes a pulling unit 6 , which is disposed at the first unloading position and is used to pull the first carrying unit 21 at the first unloading position to be staggered with the second carrying unit 22 .

[0100] It should be noted that, for the pull-out unit 6 , a support plate and a pull-out slide rail may be used to pull the first carrying unit 21 located at the first unloading position to be offset from the second carrying unit 22 .

[0101] By providing the pulling unit 6, the first carrying unit 21 is pulled out to be offset from the second carrying unit 22, so that the silicon wafer in the first carrying unit 21 can be taken out more conveniently, which is beneficial to improving the user experience.

[0102] Optionally, the silicon wafer receiving device further includes a first sensing device 7, which is disposed on the mounting seat 4 and is located on one side of the transition position, and is used to sense whether the first bearing unit 21 is located at the transition position. The first sensing device 7 can be any sensing device such as a proximity switch, a photoelectric sensor, or a photoelectric sensor.

[0103] A first sensing device 7 is provided to sense whether the first carrying unit 21 has moved to the transition position, so that the transition unit 5 can accurately drive the first carrying unit 21 to reciprocate between the first unloading position and the transition position below the second carrying unit 22, thereby improving the transfer efficiency of the first carrying unit 21 and further improving the wafer collection efficiency of the silicon wafer collection device.

[0104] The invention of the present application and its implementation methods are described schematically above, and the description is not restrictive. The drawings show only one implementation method of the invention of the present application, and the actual structure is not limited thereto. Therefore, if ordinary technicians in the field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention, they should all fall within the scope of protection of this patent.

Claims

1. A silicon wafer picking-up device, characterized in that, the silicon wafer picking-up device includes a conveying unit extending along a first direction, 2N bearing mechanisms located on both sides of the conveying unit, and N picking-up units for picking up silicon wafers on the conveying unit to the bearing mechanisms, where: the 2N bearing mechanisms are symmetrically arranged on both sides of the conveying unit respectively, each picking-up unit is matched with every 2 bearing mechanisms symmetrically arranged on both sides of the conveying unit, and each picking-up unit is configured to pick up the silicon wafers on the conveying unit to every 2 bearing mechanisms on both sides of the conveying unit; each bearing mechanism includes a first bearing unit and a second bearing unit arranged in parallel in sequence along a direction perpendicular to the first direction on one side of the conveying unit, and a first wafer receiving position of the first bearing unit and a second wafer receiving position of the second bearing unit are located on the same horizontal plane; N is a natural number greater than or equal to 1; the silicon wafer picking-up device further includes a transition unit and a mounting base, and the transition unit is mounted on the mounting base; each bearing mechanism further includes a first lifting unit, the first bearing unit is slidably arranged on the first lifting unit, and the first lifting unit is used to drive the first bearing unit to rise to the first wafer receiving position and descend to a transition position for docking with the transition unit; the transition unit is used to drive the first bearing unit to reciprocate between a first wafer unloading position below the second bearing unit and the transition position.

2. The silicon wafer picking-up device according to claim 1, characterized in that, the first bearing unit includes a first base, at least one first bearing box and a docking part, the first bearing box is inclined on the first base, the docking part is fixedly arranged at the bottom of the first base, and when the first bearing unit descends to the transition position, the driving end of the transition unit is docked with the docking part to drive the first bearing unit to move from the transition position to the first wafer unloading position.

3. The silicon wafer picking-up device according to claim 2, characterized in that, each bearing mechanism further includes a first guide rail, and the first guide rail is fixedly arranged on the mounting base extending from the transition position to the first wafer unloading position; the first bearing unit further includes a guiding component, and the guiding component is arranged at the bottom of the first bearing unit and guides the first bearing unit along the first guide rail.

4. The silicon wafer picking-up device according to claim 3, characterized in that, the first guide rail includes a first guiding surface and a second guiding surface perpendicular to each other; the guiding component includes a first guiding roller matched with the first guiding surface and a second guiding roller matched with the second guiding surface.

5. The silicon wafer picking-up device according to claim 2, characterized in that, the transition unit includes a linear driving member and a docking cylinder, the linear driving member is fixedly mounted on the mounting base, the docking cylinder is fixedly mounted on the driving end of the linear driving member, and the docking cylinder is driven by the linear driving member to reciprocate between the transition position and the first wafer unloading position; Control the driving end of the docking cylinder to extend and dock with the docking part, thereby driving the first carrying unit to move back and forth between the transition position and the first wafer unloading position, and control the driving end of the docking cylinder to retract and disconnect from the docking part, thereby disconnecting the connection between the transition unit and the first carrying unit.

6. The silicon wafer collection device according to claim 2, wherein, the second carrying unit includes a second base and second carrying boxes having the same number as the first carrying boxes, and the second carrying boxes are inclined and arranged on the second base.

7. The silicon wafer collection device according to claim 6, wherein, there are 2 first carrying boxes, and the 2 first carrying boxes are arranged at intervals along the first direction on the first base; there are 2 second carrying boxes, and the 2 second carrying boxes are arranged at intervals along the first direction on the second base; each picking unit includes 2 suction cups and 2 transverse movement modules, the 2 transverse movement modules are arranged at intervals along the first direction, the 2 suction cups are respectively arranged on the corresponding 1 transverse movement module, and the transverse movement paths of the 2 suction cups respectively pass above the first carrying box and the second carrying box; the 2 transverse movement modules are configured to respectively drive the corresponding suction cups to pick up the silicon wafers on the transfer unit to the corresponding first carrying box or second carrying box synchronously or separately.

8. The silicon wafer collection device according to claim 7, wherein, the silicon wafers carried by the 2 first carrying boxes of at least part of the first carrying unit are of the first grade; the silicon wafers carried by the 2 second carrying boxes of at least part of the second carrying unit are of the second grade.

9. The silicon wafer collection device according to claim 1, wherein, the silicon wafers carried by the same carrying mechanism are of the same grade of silicon wafers, and the 2N carrying mechanisms respectively carry 2N different grades of silicon wafers.

10. The silicon wafer collection device according to claim 1, wherein, the silicon wafers carried by the same first carrying unit are of the same grade of silicon wafers, and the silicon wafers carried by the same second carrying unit are of the same grade of silicon wafers; the 2N first carrying units and the 2N second carrying units respectively carry 4N different grades of silicon wafers.

11. The silicon wafer collection device according to claim 1, wherein, each carrying mechanism further includes a second lifting unit, the second carrying unit is slidably arranged on the second lifting unit, and the second lifting unit is used to drive the second carrying unit to rise to the second wafer receiving position and descend to the second wafer unloading position below the second wafer receiving position.

12. The silicon wafer collection device according to claim 1, wherein, the silicon wafer collection device further includes a pulling unit, the pulling unit is arranged at the first wafer unloading position and is used to pull the first carrying unit at the first wafer unloading position to be staggered from the second carrying unit.

13. The silicon wafer collection device according to claim 1, wherein, The silicon wafer collection device further includes a first sensing device, which is arranged on the mounting seat and is located on one side of the transition position for sensing whether the first carrying unit is located at the transition position.

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