Circuit board

Abstract

As electronic devices become increasingly thinner and lighter, the space available for accommodating touch circuitry and light-emitting components is shrinking. Furthermore, light-emitting components adjacent to touch circuitry can negatively impact the sensing capabilities of the touch circuitry. Therefore, providing a circuit board that can improve the touch sensing performance of touch circuitry is a pressing issue in this field. This disclosure provides a circuit board comprising a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of dummy electrodes. The dummy electrodes are disposed on the circuit board and located in the region between the plurality of first touch electrodes and the plurality of second touch electrodes to improve the touch sensing performance of the plurality of first touch electrodes and the plurality of second touch electrodes.

Description

Technical Field

[0001] This case concerns a circuit board, specifically a printed circuit board with touch-sensitive electrodes. Background Technology

[0002] With the widespread use of touch panels in today's technology, improving the signal-to-noise ratio of touch panels to enhance their sensing capabilities has become an important issue in this field.

[0003] This patent discovers that dummy electrodes can improve the performance of touch sensors. More specifically, dummy electrodes can increase the ratio of the signal from the area touched by the finger to the signal from the area not touched by the finger, that is, dummy electrodes can improve the signal-to-noise ratio of touch sensing. Alternatively, dummy electrodes can increase the capacitance (in pF, Pico-Farad) of both the area touched by the finger and the area not touched by the finger, thereby making it easier for the touch sensing IC to identify the area touched by the finger.

[0004] The effect of virtual electrodes in improving touch sensor performance is particularly important for transparent touch sensors. This is because transparent touch sensors must meet certain optical requirements (e.g., light transmittance and haze). The conductive materials that meet these optical requirements (e.g., ITO, silver nanowires, metal mesh) and the design of their electrodes (e.g., shape, thickness, etc.) will result in lower conductivity of the touch electrodes—that is, lower sheet resistance (Ω / m). 2 Therefore, given the low conductivity of the touch electrodes in transparent touch sensors, utilizing virtual electrodes to improve touch sensing performance is a worthwhile approach.

[0005] In the case of transparent touch sensors, in addition to the aforementioned effect of improving the signal-to-noise ratio, virtual electrodes can also make the transparent touch sensor visually more uniform, making it less likely for the human eye to see the shape of the touch electrodes, thus improving the visual effect of the transparent touch sensor.

[0006] However, the effects of the aforementioned virtual electrodes (i.e., improved touch sensor performance and visual effects) are less important for opaque touch sensors. This is because opaque touch sensors do not require consideration of optical performance; therefore, they can employ electrode designs with the best conductors and conductivity to significantly improve touch sensing performance. Thus, even without virtual electrodes to enhance touch sensor performance, opaque touch sensors can achieve sufficient touch sensing capabilities. Furthermore, since opaque touch sensors do not need to consider visual effects, they naturally do not require virtual electrodes to improve their visual appeal. Therefore, there is no need to install virtual electrodes on opaque touch sensors.

[0007] However, this invention integrates the touch electrodes onto the LED matrix circuit board, and the presence of the LEDs may negatively impact touch sensing performance. Therefore, although this invention can employ a similar approach to opaque touch sensors (i.e., using electrodes with the best conductors and optimal conductivity) to improve touch sensing performance, it is still necessary to use virtual electrodes to further enhance the touch sensor's functionality and compensate for the potential negative impact of the LEDs on touch sensing performance, given that touch sensing performance is affected by the LEDs.

[0008] While some existing technologies mention the visual effects of virtual electrodes, none have disclosed any prior technology that can also improve touch sensitivity performance. Even if prior technologies implicitly suggest that "virtual electrodes can improve touch sensitivity," for the aforementioned reasons, those skilled in the art have no incentive to apply such prior technologies to "opaque touch sensors." Furthermore, in opaque touch sensors, there is a greater incentive to completely remove the conductive material in areas other than the touch electrodes. If conductive material remains, there is a risk of short circuits occurring if the conductive material in areas other than the "conductive electrodes" is not completely removed, thereby affecting touch performance.

[0009] On the other hand, some existing practices disclose the placement of a copper metal as a touch sensing unit on a printed circuit board (which forms a capacitive touch sensing case with the upper components). However, the previous practices do not disclose how the copper metal and the light-emitting diode should be arranged relative to each other (and whether the relative positions of the two affect the performance of touch sensing), nor do they disclose whether virtual electrodes are placed in areas other than the copper metal. Moreover, even if virtual electrodes are disclosed on the circuit board in some existing practices, those skilled in the art cannot know from the existing practices how to arrange the relative positions of the light-emitting diode and the virtual electrodes.

[0010] Therefore, some existing practices disclose that, technically, the light-emitting diodes (LEDs) may affect touch functionality. Some existing practices do not provide instructions on how to solve this problem, while this disclosure proposes technical means to solve the problem. Summary of the Invention

[0011] This disclosure provides a circuit board. The circuit board includes a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of dummy electrodes. The plurality of first touch electrodes are disposed on the circuit board and extend along a first direction. The plurality of second touch electrodes are disposed on the circuit board and extend along a second direction, wherein the plurality of first touch electrodes and the plurality of second touch electrodes are electrically insulated from each other, and the first direction and the second direction are not parallel. The plurality of dummy electrodes are disposed on the circuit board and are located in the region between the first touch electrodes and the plurality of second touch electrodes, wherein the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of dummy electrodes are opaque.

[0012] In some embodiments, the circuit board is opaque.

[0013] In some embodiments, the circuit board further includes a plurality of light-emitting element pads. The plurality of light-emitting element pads are disposed on the circuit board and are located in the region between the plurality of first touch electrodes and the plurality of second touch electrodes. The plurality of light-emitting element pads are electrically insulated from the plurality of virtual electrodes.

[0014] In some embodiments, the plurality of light-emitting element pads are surrounded by at least a portion of the plurality of virtual electrodes.

[0015] In some embodiments, the plurality of light-emitting element pads are located in the region between the plurality of first touch electrodes and the plurality of second touch electrodes. The spatial relationship between the plurality of light-emitting element pads, the plurality of virtual electrodes, the plurality of first touch electrodes, and the plurality of second touch electrodes is as follows: along the first direction, with the plurality of light-emitting element pads as the first sorting position, at least one of the plurality of virtual electrodes is arranged sequentially as the second sorting position, and at least one of the plurality of first touch electrodes or at least one of the plurality of second touch electrodes is arranged as the third sorting position.

[0016] In some embodiments, the number of the plurality of virtual electrodes located at the second sorting position is at least two.

[0017] In some embodiments, the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of light-emitting element pads are made of the same material.

[0018] In some embodiments, the plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of light-emitting element pads are disposed on the first conductive layer of the circuit board.

[0019] In some embodiments, each of the plurality of first touch electrodes includes a plurality of touch electrode blocks, wherein the circuit board further includes a plurality of first conductive vias and a plurality of traces. The plurality of first conductive vias are respectively disposed on the protrusions of each of the plurality of first touch electrode blocks, and extend from the first conductive layer to a second conductive layer of the circuit board. The plurality of traces are disposed on the second conductive layer of the circuit board, extend along the first direction, and respectively connect to adjacent plurality of first conductive vias.

[0020] In some embodiments, the circuit board further includes a plurality of second conductive vias. The plurality of second conductive vias are respectively disposed on the plurality of light-emitting element pads, and the plurality of second conductive vias extend from the first conductive layer to the second conductive layer.

[0021] In some embodiments, the plurality of first touch electrodes and the plurality of light-emitting element pads are disposed on the same layer of the circuit board. The plurality of second touch electrodes and the plurality of first touch electrodes are disposed on different planes of the circuit board.

[0022] In summary, the circuit board provided in this disclosure has a pattern of multiple virtual electrodes in the area between the first touch electrode and the second touch electrode, thereby improving the signal-to-noise ratio and enhancing the touch sensing capability. Attached Figure Description

[0023] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the accompanying drawings are described below:

[0024] Figure 1 This is a schematic side view of a circuit board according to an embodiment of the present disclosure;

[0025] Figure 2 For the purpose of this disclosure, some embodiments are shown. Figure 1 A schematic diagram of the etching pattern of the circuit board;

[0026] Figure 3 This disclosure provides an embodiment of the invention. Figure 2 A schematic diagram of a portion of the etched pattern on the circuit board.

[0027] Figure 4 For the purpose of this disclosure, some embodiments are shown. Figure 1 A schematic diagram of the etching pattern of the circuit board;

[0028] Figure 5This disclosure provides an embodiment of the invention. Figure 4 A schematic diagram of a portion of the etched pattern on the circuit board.

[0029] Figure 6 This disclosure provides an embodiment of the invention. Figure 4 A schematic diagram of a portion of the etched pattern on the circuit board.

[0030] Figure 7 This is a schematic diagram of the etching pattern of a circuit board according to an embodiment of the present disclosure.

[0031] [Symbol Explanation]

[0032] To make the above and other objects, features, advantages and embodiments of this disclosure more apparent and understandable, the accompanying symbols are explained as follows:

[0033] 100: Circuit board

[0034] 110: Multiple conductive layers

[0035] 112, 114, 116, 118: Conductive layers

[0036] 120: Multiple insulation layers

[0037] 200, 300, 300a, 300b: Etching patterns

[0038] 212, 214: First touch electrode

[0039] 212a, 212b, 212c, 214a, 214b, 214c: First touch electrode blocks

[0040] 222, 224: Second touch electrode

[0041] 222a, 222b, 224a, 224b: Second touch electrode blocks

[0042] 230, 230a, 230b: Multiple virtual electrodes

[0043] 242,244,322,324: Conductive vias

[0044] 310: Multiple light-emitting element mounting area

[0045] 312: Multiple LED pads

[0046] D1: First Direction

[0047] D2: Second Direction

[0048] W1, W2, W4: Width

[0049] W3: Interval Detailed Implementation

[0050] The following detailed description, in conjunction with the accompanying drawings, provides examples to better illustrate the subject matter. However, the provided examples are not intended to limit the scope of this invention, and the description of structural operations is not intended to limit the order of their execution. Any structure resulting from the recombination of elements, producing a device with equivalent functionality, falls within the scope of this invention. Furthermore, in accordance with industry standards and common practice, the accompanying drawings are for illustrative purposes only and are not drawn to their original dimensions. In reality, the dimensions of various features may be arbitrarily increased or decreased for ease of explanation. In the following description, the same elements will be labeled with the same symbols for ease of understanding.

[0051] The indices 1 to n in the component and signal numbers used in this specification and accompanying drawings are for convenience of referring to individual components and signals, and are not intended to limit the number of the aforementioned components and signals to a specific number. In this specification and accompanying drawings, if a component or signal number is used without specifying its index, it means that the component or signal number refers to any unspecified component or signal within the corresponding component or signal group.

[0052] Furthermore, the terms "comprising," "including," "having," "containing," etc., used in this document are all open-ended terms, meaning "including but not limited to." Additionally, the term "and / or" as used in this document includes any one or more of the related listed items and all combinations thereof.

[0053] In this document, when an element is referred to as a “connection” or “coupled,” it may mean an “electrical connection” or “electrical coupling.” “Connection” or “coupled” can also be used to indicate the operation or interaction between two or more elements. Furthermore, although terms such as “first,” “second,” etc., are used herein to describe different elements, these terms are only used to distinguish elements or operations described using the same technical terminology.

[0054] Please see Figure 1 , Figure 1 This is a schematic side view of a circuit board 100 according to an embodiment of the present disclosure. In some embodiments, the circuit board 100 may be implemented as a printed circuit board, a flexible printed circuit board, or other circuit board. Figure 1As shown, the circuit board 100 includes a plurality of conductive layers 110 and a plurality of insulating layers 120 separating the conductive layers 110 from each other. In some embodiments, the plurality of insulating layers and the plurality of conductive layers 110 are stacked alternately. The plurality of conductive layers 110 includes conductive layers 112, 114, 116, and 118. In this disclosure, for clarity and convenience, the circuit board 100 is shown as having four layers. However, in other embodiments, the circuit board 100 may be implemented with six layers, eight layers, or other substrates stacked with suitable numbers of layers, and therefore this disclosure should not be limited thereto.

[0055] like Figure 1 As shown, the circuit board 100 includes a conductive via 130. The conductive via 130 penetrates through conductive layers 112, 114, and 116 and extends to conductive layer 118. A first end of the conductive via 130 is located in conductive layer 112, and a second end is located in conductive layer 118. The inner edge / inner surface of the conductive via 130 is covered with metal. Therefore, a trace electrically coupled to the second end of the conductive via 130 in conductive layer 118 can transmit signals to an electrode or component electrically coupled to the first end of the conductive via 130. Although Figure 1 Only one conductive via 130 is shown. However, the circuit board 100 may contain a greater number of conductive vias, as will be described in detail in subsequent embodiments.

[0056] Please see Figure 2 , Figure 2 For the purpose of this disclosure, some embodiments are shown. Figure 1 A schematic diagram of the etching pattern 200 of the circuit board 100. Figure 2 The etched pattern 200 can be understood as Figure 1 A top view of the conductive layer 112 and the insulating layer 120 of the circuit board 100. (See attached image.) Figure 2 As shown, the conductive layer 112 of the circuit board 100 includes first touch electrodes 212 and 214, second touch electrodes 222 and 224, and a plurality of virtual electrodes 230. The first touch electrode 212 includes first touch electrode blocks 212a to 212c. The first touch electrode 214 includes first touch electrode blocks 214a to 214c.

[0057] For better understanding, Figure 2 Only a portion of the circuit board 100 is shown in this disclosure; therefore, the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224 are merely examples. In practice, the circuit board 100 may contain a greater number of first touch electrodes and second touch electrodes, and each of the first touch electrodes and second touch electrodes may contain a greater number of first touch electrode blocks and second touch electrode blocks. Therefore, this application is not limited to this.

[0058] The first touch electrode blocks 212a-212c in the first touch electrode 212 are electrically connected in series along the first direction D1 through multiple traces disposed in other layers of the circuit board 100, so that the first touch electrode 212 extends along the first direction D1. The first touch electrode blocks 214a-214c in the first touch electrode 214 are electrically connected in series along the first direction D1 through multiple traces disposed in other layers of the circuit board 100, so that the first touch electrode 214 extends along the first direction D1.

[0059] The second touch electrode blocks 222a and 222b in the second touch electrode 222 are electrically connected in series along the second direction D2, causing the second touch electrode 222 to extend along the second direction D2. The second touch electrode blocks 224a and 224b in the second touch electrode 224 are electrically connected in series along the second direction D2, causing the second touch electrode 222 to extend along the second direction D2. The first direction D1 is not parallel to the second direction D2. In some embodiments, the first direction D1 is perpendicular to the second direction D2. In other embodiments, the first direction D1 and the second direction D2 have an angle of less than 90 degrees.

[0060] Multiple virtual electrodes 230 are disposed and located in the region between the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224. In other words, multiple virtual electrodes 230 are disposed in the region between the first touch electrode blocks 212a-212c and 214a-214c and the second touch electrode blocks 222a-222b and 224a-224b.

[0061] It is important to note that the multiple virtual electrodes 230 are not electrically connected to other conductive patterns (e.g., the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224). In other words, the virtual electrodes 230 are insulated from the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224, and the multiple virtual electrodes 230 are insulated from each other, and this insulation can be achieved by etching lines.

[0062] In some embodiments of this invention, during the manufacturing process of the printed circuit board, patterns of the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, and a plurality of virtual electrodes 230 can be generated / formed from a copper foil substrate through exposure or etching processes (e.g., removing the original material by etching solution or laser). Therefore, the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, and the plurality of virtual electrodes 230 are opaque patterns formed by etching from the same material. It should be noted that this invention is not limited to copper foil; the conductive layer of the circuit board 100 can also be implemented using conductive films of other materials. In other words, the touch electrode patterns and virtual electrode patterns formed by etching the conductive film of the circuit board 100 are opaque patterns, and the plurality of virtual electrodes 230 are separated from the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224 by etched lines, thus forming electrical insulation.

[0063] Thus, this invention integrates the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, and multiple virtual electrodes 230 onto the same circuit board, which can reduce the thickness of the backlight module and improve the touch sensing capability by utilizing multiple virtual electrodes 230 to enhance the signal-to-noise ratio.

[0064] In some embodiments, since the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224 are touched by mutual capacitive sensing, the signals generated by other components (e.g., light-emitting diodes) on the circuit board 100 may affect the touch sensing between the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224. By providing a plurality of virtual electrodes 230 in the interval area between the first touch electrodes 212 and 214 and the second touch electrodes 222 and 224, the influence of other components on the touch electrodes in the conductive layer 112 can be reduced.

[0065] Please see Figure 3 , Figure 3 This disclosure provides an embodiment of the invention. Figure 2 A schematic diagram of a portion of the etched pattern 200 of the circuit board 100. (See diagram below.) Figure 3 As shown, a plurality of virtual electrodes 230a are filled in the region between the boundaries of the first touch electrode block 214a and the second touch electrode block 222a. A plurality of virtual electrodes 230a are also filled in the region between the boundaries of the first touch electrode block 214a and the second touch electrode block 222b. A plurality of virtual electrodes 230a are also filled in the region between the boundaries of the first touch electrode block 214b and the second touch electrode block 222b. A plurality of virtual electrodes 230a are also filled in the region between the boundaries of the first touch electrode block 214b and the second touch electrode block 222a. The plurality of virtual electrodes 230a can correspond to... Figure 2Multiple virtual electrodes 230. In other embodiments of this disclosure, Figure 2 The multiple virtual electrodes 230 can be implemented by smaller virtual electrodes to achieve better touch sensing performance, which will be described in detail in subsequent embodiments.

[0066] In some embodiments, the second touch electrode blocks 222a and 222b in the second touch electrode 222 are electrically connected by a connecting portion. The connecting portion has a width W2. The first touch electrode blocks 214a and 214b in the first touch electrode 214 each have two protrusions, left and right, and conductive vias are provided on each of the protrusions of the first touch electrode blocks 214a and 214b. For example, a conductive via 242 on the right protrusion of the first touch electrode block 214a and a conductive via 244 on the left protrusion of the first touch electrode block 214b. The conductive vias 242 and 244 can correspond to... Figure 1 Conductive via 130 in the middle.

[0067] For example, the first end of the conductive via 242 is disposed in the conductive layer 112 of the circuit board 100 and electrically connected to the first touch electrode block 214a. The second end of the conductive via 242 is disposed in the conductive layer 118 of the circuit board 100. In other words, the conductive via 242 extends from the conductive layer 112 to the conductive layer 118. The first end of the conductive via 244 is disposed in the conductive layer 112 of the circuit board 100 and electrically connected to the first touch electrode block 214b. The second end of the conductive via 244 is disposed in the conductive layer 118 of the circuit board 100. In other words, the conductive via 244 extends from the conductive layer 112 to the conductive layer 118.

[0068] The second end of conductive via 242 and the second end of conductive via 244 are electrically connected in the conductive layer 118 along the first direction D1 via a trace. Correspondingly, the first touch electrode block 214b and the first touch electrode block 214c in the conductive layer 118 can be electrically connected via another trace along the first direction D1. In this way, the first touch electrode 214 can be electrically connected in series along the first direction D1.

[0069] In some embodiments, in order to provide conductive vias 242 in the protrusions of the first touch electrode blocks 212a and 212b, the protrusions of the first touch electrode blocks 212a and 212b will have a wider width W1 than the connection portion of the second touch electrode 222.

[0070] In some embodiments, to provide better touch sensing performance, the space between the first touch electrode 214 and the second touch electrode 222 is not filled with a single dummy electrode, but rather with a plurality of dummy electrodes that are separated from each other. In other words, the width W4 of any of the plurality of dummy electrodes 230a is less than the distance W3 between the boundary of the first touch electrode block 214b in the first touch electrode 214 and the parallel boundary of the second touch electrode block 222b in the adjacent second touch electrode 222.

[0071] Please see Figure 4 , Figure 4 For the purpose of this disclosure, some embodiments are shown. Figure 1 A schematic diagram of the etched pattern of the circuit board 100 300. Figure 4 The etched pattern 300 in the central region can be understood as Figure 1 A partial front view of the conductive layer 112 and insulating layer 120 of the circuit board 100. (See attached image.) Figure 4 As shown, the conductive layer 112 of the circuit board 100 includes first touch electrodes 212 and 214, second touch electrodes 222 and 224, a plurality of virtual electrodes 230, and a plurality of light-emitting element mounting areas 310.

[0072] and Figure 2 Compared to the previous embodiments, Figure 4 In this embodiment, the etching pattern 300 differs in that multiple light-emitting element mounting areas 310 are reserved in the region between the touch electrodes of the conductive layer 112, and light-emitting element pads are provided in each light-emitting element mounting area 310. The detailed connection relationships and operation methods of other components in the etching pattern 300 are largely the same as previously described. Figure 2 The specific implementation examples are not described in detail here.

[0073] For a better understanding of the multiple light-emitting element mounting areas 310 and the light-emitting element pads therein, please refer to Figure 5 as well as Figure 6 . Figure 5 This disclosure provides an embodiment of the invention. Figure 4 A schematic diagram of a partial etched pattern 300a on the circuit board 100. Figure 6 This disclosure provides an embodiment of the invention. Figure 4 A schematic diagram of a partial etched pattern 300 of the circuit board 100.

[0074] Please see Figure 5A light-emitting element mounting area 310 is reserved in the region between the parallel boundaries of the first touch electrode block 214a and the second touch electrode block 222b. Each light-emitting element mounting area 310 is surrounded by a portion of one of the plurality of virtual electrodes 230a. The detailed connection relationships and operation methods of other elements in partial figure 300a are generally the same as previously shown. Figure 3 The specific implementation examples are not described in detail here.

[0075] Please see Figure 6 In some embodiments, one of the plurality of light-emitting element mounting areas 310 may be provided with two or at least two light-emitting element pads (e.g., a plurality of light-emitting element pads 312), one of the plurality of light-emitting element pads 312 corresponding to the cathode and anode of the light-emitting element, for electrically connecting the cathode and anode of the light-emitting element after the light-emitting element is mounted.

[0076] exist Figure 6 In the embodiment, the first touch electrode block 214b in the first touch electrode 214, the second electrode block 233b in the second touch electrode 222, the multiple virtual electrodes 230a, and the light-emitting element pad 312 are all disposed on the conductive layer 112 of the circuit board 100.

[0077] In other words, the spatial relationship between the multiple light-emitting component pads 312, the multiple virtual electrodes 230a, the first touch electrodes 212-214 and the second touch electrodes 222-224 is as follows: along the first direction D1, with one of the light-emitting component pads 312 as the first sorting position, at least one of the virtual electrodes 230a is arranged in sequence as the second sorting position, and at least one of the first touch electrodes 212-214 (e.g., the first touch electrode block 214b of the first touch electrode 214 shown in Figure 6) or at least one of the second touch electrodes 222-224 (e.g., the second touch electrode block 222b of the second touch electrode 222 shown in Figure 6) is the third sorting position.

[0078] In some embodiments of this invention, during the manufacturing process of the printed circuit board, the patterns of the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, the plurality of virtual electrodes 230, and the light-emitting element pad 312 can be generated / formed from a copper foil substrate through exposure or etching processes (e.g., removing the original material by etching solution or laser). Therefore, the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, the plurality of virtual electrodes 230, and the light-emitting element pad 312 are opaque patterns formed by etching from the same material. It should be noted that this invention is not limited to copper foil; the conductive layer of the circuit board 100 can also be implemented using conductive films of other materials.

[0079] Thus, this invention integrates the patterns of the first touch electrodes 212 and 214, the second touch electrodes 222 and 224, the multiple virtual electrodes 230, and the light-emitting element pad 312 on the same conductive layer of the circuit board, which can reduce the thickness of the backlight module, thereby improving the touch sensing capability by utilizing multiple virtual electrodes to enhance the signal-to-noise ratio, and reducing manufacturing costs.

[0080] In other embodiments, the light-emitting element pad 312, the first touch electrode 214, and the plurality of virtual electrodes 230a are disposed on the same layer (e.g., conductive layer 112) of the circuit board 100, but the second touch electrode 222 is disposed on another layer (e.g., conductive layer 114) of the circuit board 100. That is, the first touch electrode 214 and the second touch electrode 222 are located on different planes.

[0081] In other embodiments, the light-emitting element pad 312 and the plurality of virtual electrodes 230a are disposed on the same layer (e.g., conductive layer 112) of the circuit board 100, but the first touch electrode 214 and the second touch electrode 222 are located on another layer on the circuit board 100, and the first touch electrode 214 and the second touch electrode 222 may be located on the same layer (e.g., conductive layer 114) or different layers (e.g., one on conductive layer 114 and the other on conductive layer 116). That is, the light-emitting element pad 312 and the plurality of virtual electrodes 230a are located on the same plane, but on a different plane from the first touch electrode and the second touch electrode.

[0082] Multiple light-emitting element pads 312 are further used to provide conductive vias (e.g., conductive vias 322 and 324). Conductive vias 322 and 324 can be understood as... Figure 1 Conductive vias 130 are provided. In other words, conductive vias 322 and 324 are respectively disposed on the corresponding light-emitting element pads 312, and conductive vias 322 and 324 extend from conductive layer 112 to conductive layer 118. Figure 3 and Figure 5 Compared to the conductive vias 242 and 244, conductive vias 322 and 324 are used at the second end of the conductive layer 118 to receive / transmit data signals or other driving voltages / currents. The detailed connection relationships and operation methods of other components of conductive vias 322 and 324 are largely the same as those of the previous ones. Figure 3 and Figure 5 The conductive vias 242 and 244 in the embodiments will not be described again here.

[0083] exist Figure 6In this embodiment, one of the plurality of light-emitting element pads 312 is disposed in the region between the first touch electrode block 214b of the first touch electrode 214 and the second touch electrode block 222b of the second touch electrode 222. Along the first direction D1, with the second touch electrode block 222b of the second touch electrode 222 as the first sorting position, one of the plurality of virtual electrodes 230a, one of the plurality of light-emitting element pads 312, another of the plurality of virtual electrodes 230a, and the first touch electrode block 214b of the first touch electrode 214 are arranged sequentially. Thus, one of the plurality of light-emitting element pads 312 is partially surrounded by the virtual electrodes 230a.

[0084] Similarly, along a direction opposite to the second direction D2, with the second touch electrode block 222b of the second touch electrode 222 as the first sorting position, one of the plurality of virtual electrodes 230a, one of the plurality of light-emitting element pads 312, another of the plurality of virtual electrodes 230a, and the first touch electrode block 214b of the first touch electrode 214 are arranged sequentially. In this way, one of the plurality of light-emitting element pads 312 will be surrounded by a portion of the virtual electrodes 230a.

[0085] Please see Figure 7 , Figure 7 This is a schematic diagram of an etched pattern 300b of a circuit board according to an embodiment of this disclosure.

[0086] and Figure 6 Compared to the previous embodiments, Figure 7 Multiple virtual electrodes can be replaced by smaller virtual electrodes (e.g., multiple virtual electrodes 230b) to achieve better touch sensing performance.

[0087] exist Figure 7 In this embodiment, one of the plurality of light-emitting element pads 312 is disposed in the region between the first touch electrode block 214b of the first touch electrode 214 and the second touch electrode block 222b of the second touch electrode 222. Along the first direction D1, at least two of the plurality of virtual electrodes 230b and the first touch electrode block 214b of the first touch electrode 214 are arranged sequentially with one of the plurality of light-emitting element pads 312 as the first sorting position. Thus, one of the plurality of light-emitting element pads 312 is surrounded by at least two virtual electrodes 230a, or one of the plurality of light-emitting element pads 312 is surrounded by at least two layers of virtual electrodes 230a.

[0088] Similarly, along a direction opposite to the second direction D2, with one of the plurality of light-emitting element pads 312 as the first sorting position, at least two of the plurality of virtual electrodes 230b and the first touch electrode block 214b of the first touch electrode 214 are arranged sequentially. In this way, one of the plurality of light-emitting element pads 312 will be surrounded by at least two virtual electrodes 230a, or one of the plurality of light-emitting element pads 312 will be surrounded by at least two layers of virtual electrodes 230a.

[0089] In summary, this disclosure describes how the circuit substrate 100 is etched to generate patterns of touch electrodes (e.g., first touch electrodes 212 and 214 and second touch electrodes 222 and 224) and patterns of multiple virtual electrodes (e.g., multiple virtual electrodes 230) located in the area between the first and second touch electrodes. This improves the signal-to-noise ratio or increases the capacitance value, thereby enhancing touch sensing capabilities. Furthermore, in some embodiments of this disclosure, the etching process generates patterns of touch electrodes (e.g., first touch electrodes 212 and 214 and second touch electrodes 222 and 224), patterns of multiple virtual electrodes (e.g., multiple virtual electrodes 230) located in the area between the first and second touch electrodes, and patterns of multiple light-emitting element pads (e.g., light-emitting element pads 312). This integrates the touch electrodes and light-emitting element pads onto the same circuit substrate, reducing the thickness of the backlight module and enhancing touch sensing capabilities by utilizing multiple virtual electrodes to improve the signal-to-noise ratio.

[0090] Although the embodiments have been disclosed above, this case is not intended to limit the scope of the invention. Anyone skilled in the art may make various modifications and alterations without departing from the spirit and scope of the invention. Therefore, the scope of protection of this case shall be determined by the scope defined in the appended claims.

Claims

1. A circuit board, characterized in that, Include: A plurality of first touch electrodes are disposed on the circuit board, and the plurality of first touch electrodes extend along a first direction; A plurality of second touch electrodes are disposed on the circuit board, the plurality of second touch electrodes extending along a second direction, wherein the plurality of first touch electrodes and the plurality of second touch electrodes are electrically insulated from each other, wherein the first direction is not parallel to the second direction; Multiple virtual electrodes are disposed on the circuit board in the region between the multiple first touch electrodes and the multiple second touch electrodes, wherein the multiple first touch electrodes, the multiple second touch electrodes, and the multiple virtual electrodes are opaque; and Multiple light-emitting element pads are disposed on the circuit substrate in the region between the multiple first touch electrodes and the multiple second touch electrodes, wherein the multiple light-emitting element pads are electrically insulated from the multiple virtual electrodes, and wherein the multiple first touch electrodes, the multiple second touch electrodes and the multiple light-emitting element pads are disposed on a first conductive layer of the circuit substrate.

2. The circuit board as described in claim 1, characterized in that, The circuit board is opaque.

3. The circuit board as described in claim 1, characterized in that, The plurality of light-emitting element pads are surrounded by at least a portion of the plurality of virtual electrodes.

4. The circuit board as described in claim 1, characterized in that, The plurality of light-emitting element pads are located in the region between the plurality of first touch electrodes and the plurality of second touch electrodes. The spatial relationship between the plurality of light-emitting element pads, the plurality of virtual electrodes, the plurality of first touch electrodes and the plurality of second touch electrodes is as follows: along the first direction, with the plurality of light-emitting element pads as the first sorting position, at least one of the plurality of virtual electrodes is arranged in sequence as the second sorting position, and at least one of the plurality of first touch electrodes or at least one of the plurality of second touch electrodes is arranged as the third sorting position.

5. The circuit board as described in claim 4, characterized in that, The number of the plurality of virtual electrodes located in the second sorting position is at least two.

6. The circuit board as described in claim 1, characterized in that, The plurality of first touch electrodes, the plurality of second touch electrodes, and the plurality of light-emitting element pads are made of the same material.

7. The circuit board as described in claim 1, characterized in that, Each of the plurality of first touch electrodes comprises a plurality of first touch electrode blocks, and the circuit board further comprises: A plurality of first conductive vias are respectively disposed on the protrusions of the plurality of first touch electrode blocks, and the plurality of first conductive vias extend from the plurality of first conductive layers to a second conductive layer of the circuit board; as well as Multiple traces are disposed on a second conductive layer on the circuit board, the multiple traces extend along the first direction and are respectively connected to the multiple first conductive vias.

8. The circuit board as described in claim 1, characterized in that, Also includes: Multiple second conductive vias are respectively disposed on the multiple light-emitting element pads, and the multiple second conductive vias extend from the multiple first conductive layers to the second conductive layers.

9. The circuit board as described in claim 1, characterized in that, The plurality of first touch electrodes and the plurality of light-emitting element pads are disposed on the same layer of the circuit board, and the plurality of second touch electrodes and the plurality of first touch electrodes are disposed on different planes of the circuit board.

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