A circuit board chip mounting device

Abstract

The present application relates to a circuit board chip mounter, belonging to the technical field of chip mounting processes, and comprising: a loading mechanism for placing and supporting a circuit board, including a loading platform and a loading tray placed on the loading platform, and the circuit board is placed on the loading tray; a transmission mechanism connected to the loading mechanism, including a horizontal movement component and a vertical lifting component; a chip mounting mechanism connected to the horizontal movement component, including a rotating shaft rod parallel to the loading platform, an annular suction nozzle seat sleeved on the upper end of the rotating shaft rod, a suction nozzle connected to the annular suction nozzle seat, and elastic pressing cylinders arranged on both sides of the annular suction nozzle seat; the rotating shaft rod is connected to the vertical lifting component, one end of which is connected with a driving motor, the elastic pressing cylinders are sleeved on the rotating shaft rod, and when the suction nozzle places electronic components, the elastic pressing cylinders are pressed against the circuit board; and a feeding mechanism for arranging and placing electronic components. The present application reduces the probability of damage to the circuit board, thereby improving the chip mounting quality and the finished product rate.

Description

Technical Field

[0001] The present application relates to the technical field of patch technology, and in particular to a circuit board patch device. Background Art

[0002] The placement machine is a combination of mechanical, electrical, optical and computer control technologies. It can quickly and accurately place SMD components on the pads specified on the PCB through functions such as suction, displacement, positioning and placement.

[0003] In the related art, the patch machine includes a frame, a conveying device, a feeding device, a patch head device and a control device; the conveying device is used to convey the PCB board along the X direction; the control device is used to control the operation of the patch head device, the conveying device and the feeding device; the patch head device is used to simultaneously absorb multiple electronic components arranged according to a rule, and simultaneously mount the absorbed multiple electronic components on the PCB board. The patch head device includes an air pipe, a moving part, a rotating assembly and a patch head assembly, and the patch head assembly includes a nozzle base, an air seat plate and a nozzle, and the nozzle is installed on the nozzle base. The electronic components are adsorbed by the nozzle, and then moved to the circuit board for installation through the conveying device.

[0004] During the patch process, electronic components are placed on the circuit board. Because the contact surface between the patch head device and the circuit board is only the electronic components, the contact area is small and the local pressure is strong. When the pressure exerted by the patch joint on the components and the circuit board is too great, it will cause damage to the circuit board, resulting in unnecessary losses and waste. Summary of the invention

[0005] The purpose of the present application is to provide a circuit board patch device, which can relieve the local pressure on the circuit board during the patch process, reduce the probability of the circuit board being damaged, thereby improving the patch quality and yield rate, and reducing losses and waste.

[0006] The present application provides a circuit board patch device that adopts the following technical solution:

[0007] A circuit board patch device, comprising:

[0008] A bearing mechanism, used for placing and supporting the circuit board, comprising a bearing platform and a bearing tray placed on the bearing platform, and the circuit board is placed on the bearing tray;

[0009] The transmission mechanism is connected to the bearing mechanism and includes a horizontal moving component and a vertical lifting component, wherein the vertical lifting component is slidably connected to the horizontal moving component;

[0010] The chip mounting mechanism is connected to the horizontal moving component, and includes a rotating shaft rod parallel to the carrying platform, an annular nozzle seat sleeved on the upper end of the rotating shaft rod, a nozzle connected to the annular nozzle seat, and elastic pressing cylinders arranged on both sides of the annular nozzle seat; the rotating shaft rod is connected to the vertical lifting component, and a driving motor is connected to one end thereof, the elastic pressing cylinders are sleeved on the rotating shaft rod, and when the nozzle places the electronic component, the elastic pressing cylinders are pressed against the circuit board; and

[0011] The feeding mechanism includes a loading table for arranging and placing electronic components.

[0012] With the above technical solution, the electronic components are neatly placed on the loading table, and the circuit boards are also neatly placed on the carrying plate. During chip mounting, the driving motor drives the rotating shaft rod to rotate, and the nozzle grabs the electronic components downward from the loading table. The chip mounting mechanism is driven by the transmission mechanism to move above the carrying plate, and then the chip mounting mechanism is lowered, and the rotating shaft rod is rotated to make the nozzle and the electronic component vertically opposite to the circuit board below. The chip mounting mechanism is further lowered to paste the electronic component onto the circuit board. At this time, the elastic pressing cylinders also press on the circuit board, increasing the pressure-receiving area of the circuit board and reducing the pressure per unit area. Especially, the pressure at the position where the electronic component is installed is reduced, which can effectively reduce the probability of the circuit board being damaged by pressure, thereby improving the yield of the product.

[0013] Optionally, the rotating shaft rod is parallel to the carrying platform, and bearing seats are connected to positions near the end faces at both ends of the rotating shaft rod, and the bearing seats are connected to the vertical lifting component.

[0014] With the above technical solution, both ends of the rotating shaft rod are connected to the vertical lifting component through bearing seats, so that the lifting heights at both ends of the rotating shaft rod are the same, and when applying pressure to the circuit board, the force received by the circuit board is more balanced.

[0015] Optionally, a plurality of annular nozzle seats are arranged at intervals on the rotating shaft rod, the elastic pressing cylinders are arranged at intervals between the annular nozzle seats, and a pressure ring is arranged at a position on the rotating shaft rod close to the bearing seat, and the pressure ring abuts against the elastic pressing cylinder at the end.

[0016] With the above technical solution, a plurality of annular nozzle seats are arranged on the rotating shaft rod, so that the chip mounting mechanism can simultaneously mount chips on multiple circuit boards, thereby improving the chip mounting efficiency of the entire device; the elastic pressing cylinders and the annular nozzle seats are arranged at intervals, so that each circuit board can receive the pressure from two elastic pressing cylinders, reducing the influence caused by uneven pressure; the pressure ring is used to limit the elastic pressing cylinders and the annular nozzle seats, avoiding the problem of misalignment between the electronic component and the circuit board caused by the axial movement of the elastic pressing cylinders and the annular nozzle seats. At the same time, different lengths or numbers of elastic pressing cylinders and annular nozzle seats can be combined on the rotating shaft rod, so that the chip mounting mechanism can meet the mounting requirements of different sizes of circuit boards and electronic components, making the entire device more widely applicable.

[0017] Optionally, the elastic pressing cylinder includes a rigid sleeve and a flexible sleeve. The rigid sleeve is sleeved on the rotating shaft rod, the flexible sleeve is sleeved outside the rigid sleeve, and the rigid sleeve and the flexible sleeve have the same length.

[0018] With the above technical solution, the inner ring of the elastic pressing cylinder is a rigid sleeve, which is not easily deformed under axial compression, and can ensure that the position of the annular nozzle seat on the rotating shaft rod does not change, ensuring the mounting accuracy of the electronic component and the circuit board; the outer ring of the elastic pressing cylinder is a flexible sleeve, which is easily deformed under pressure, avoiding greater damage to the circuit board.

[0019] Optionally, at least two nozzle mounting plates are connected to the circumferential surface of the annular nozzle seat. The nozzles are connected to the surfaces of the nozzle mounting plates, and the connecting surfaces are parallel to the tangent of the annular nozzle seat.

[0020] With the above technical solution, two or more nozzles are provided on one annular nozzle seat, and two or more groups of electronic components can be adsorbed simultaneously. The pick-and-place mechanism can grasp multiple groups in one material taking, reducing the material taking frequency of the pick-and-place mechanism and improving the assembly efficiency.

[0021] Optionally, the carrying mechanism further includes a frame. The carrying platform is installed on the frame. A positioning baffle is provided on one side of the carrying platform. When the carrying tray is placed on the carrying platform, one side abuts against the positioning baffle.

[0022] With the above technical solution, the frame is used to carry the entire device and maintain the stable operation of the device. The positioning baffle can position the placement of the carrying tray, making the alignment of the electronic component and the circuit board more accurate and improving the processing efficiency of the chip mounter.

[0023] Optionally, the axis of the carrying tray is parallel to the rotating shaft rod. A plurality of placement grooves are axially formed on the carrying tray, and the shape of the placement grooves is adapted to the shape of the circuit board.

[0024] With the above technical solution, placement grooves are provided on the carrying tray, and the circuit board is placed in the placement grooves, so that the circuit board will not move on the carrying tray, thereby improving the mounting accuracy of the electronic component and the circuit board.

[0025] Optionally, both ends of the carrying platform are connected to the frame. A plurality of protrusions are arranged on the carrying platform in an array. The electronic components are placed on the protrusions, and positioning protrusions are provided at the edges of the protrusions.

[0026] With the above technical solution, the electronic components are placed on the protrusions, which is convenient for the nozzles to pick up the electronic components. The positioning protrusions can limit the electronic components, improving the accuracy of the nozzles to pick up the electronic components.

[0027] Optionally, the horizontal movement component includes two support frames disposed on both sides of the bearing platform, two slide rails respectively connected to the two support frames, and a cross beam slidably connected between the two slide rails. The cross beam is suspended above the bearing platform and parallel to the rotating shaft rod, and the rotating shaft rod is connected to the cross beam through a vertical lifting component.

[0028] With the above technical solution, the cross beam drives the rotating shaft rod to move along the two slide rails, enabling the rotating shaft rod to move between the bearing plate and the loading platform, facilitating the grasping of electronic components and improving the chip mounting efficiency.

[0029] Optionally, the vertical lifting component includes two lifting cylinders vertically connected to the lower surface of the cross beam, and the piston rods of the lifting cylinders are connected to the rotating shaft rod.

[0030] With the above technical solution, the vertical lifting component adopts lifting cylinders, which is more convenient to drive and can control the stable lifting of the rotating shaft rod.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] 1. Drive the rotating shaft rod to descend, the suction nozzle grabs the electronic component downward from the loading platform, the transmission mechanism drives the chip mounting mechanism to move above the bearing plate, then lower the chip mounting mechanism, and rotate the rotating shaft rod so that the suction nozzle and the electronic component are vertically opposite to the circuit board below. Continue to lower the chip mounting mechanism to paste the electronic component onto the electronic component. At this time, the elastic pressing cylinder also presses on the circuit board, increasing the pressure-bearing area of the circuit board and reducing the pressure per unit area. Especially, the pressure at the position where the electronic component is installed is reduced, which can effectively reduce the probability of the circuit board being damaged by pressure, thereby improving the yield of the product.

[0033] 2. A plurality of annular suction nozzle seats are arranged on the rotating shaft rod, enabling the chip mounting mechanism to simultaneously perform chip mounting on multiple circuit boards, thereby improving the chip mounting efficiency of the entire device.

[0034] 3. Use the pressure ring to limit the elastic pressing cylinder and the annular suction nozzle seat, avoiding the problem of misalignment between the electronic component and the circuit board caused by the axial movement of the elastic pressing cylinder and the annular suction nozzle seat. At the same time, different lengths or numbers of elastic pressing cylinders and annular suction nozzle seats can also be combined on the rotating shaft rod, enabling the chip mounting mechanism to meet the mounting requirements of different sizes of circuit boards and electronic components, making the entire device more widely applicable.

[0035] 4. Two or more suction nozzles are arranged on one annular suction nozzle seat, enabling the simultaneous adsorption of two or more groups of electronic components. The chip mounting mechanism can grab multiple groups in one material taking, reducing the material taking frequency of the chip mounting mechanism and improving the assembly efficiency. Description of the Drawings

[0036] Figure 1 is the overall structural schematic diagram of the chip mounting device according to the embodiment of the present application;

[0037] Figure 2 It is a schematic structural diagram of the bearing mechanism in the embodiment of the present application;

[0038] Figure 3 It is a schematic structural diagram of the chip mounting mechanism in the embodiment of the present application;

[0039] In the figure, 11 is the bearing platform; 12 is the bearing disk; 13 is the frame; 14 is the positioning baffle; 15 is the placement groove; 21 is the rotating shaft rod; 22 is the annular nozzle seat; 23 is the nozzle; 24 is the elastic pressing cylinder; 25 is the driving motor; 26 is the bearing seat; 27 is the pressing ring; 28 is the nozzle mounting plate; 31 is the loading table; 32 is the convex platform; 41 is the support frame; 42 is the slide rail; 43 is the cross beam; 44 is the lifting cylinder. Detailed implementation manners

[0040] The following will further describe the present application in detail in conjunction with the attached Figure 1 - attached Figure 3 , and make a further detailed description of the present application.

[0041] The present application provides a circuit board chip mounting device. Referring to Figure 1 , the device includes a bearing mechanism, a transmission mechanism, a chip mounting mechanism, and a feeding mechanism. The bearing mechanism serves as the support structure of the entire device, and at the same time is used to place the circuit board to be chipped, position and arrange the circuit board, and facilitate the installation of electronic components; the feeding mechanism is installed on the bearing mechanism and is used to place the electronic components to be installed; the chip mounting mechanism is installed on the transmission mechanism and can move under the drive of the transmission mechanism, grab the electronic components from the feeding mechanism, and mount the electronic components on the circuit board; the transmission mechanism is installed on the bearing mechanism and is used to drive the chip mounting mechanism to translate and lift.

[0042] Referring to Figure 1 and 2 , the bearing mechanism includes a bearing platform 11, a bearing disk 12, and a frame 13. The frame 13 is used to install and place the chip mounting device, and the specific structure can be adjusted according to actual production needs. In this embodiment, the bearing platform 11 is installed on the top of the frame 13 and forms a gantry structure together with the frame 13. The bearing platform 11 is set as a flat plate, and two positioning baffles 14 are arranged at a position near one end of its upper surface. The positioning baffles 14 are right-angled, and the two positioning baffles 14 are arranged opposite to each other. The bearing disk 12 is set as a rectangular plate structure, and the two top corners of the bearing disk 12 abut against the inner corners of the two positioning baffles 14, so that the placement position of the bearing disk 12 is standardized, effectively limiting and supporting the bearing disk 12. For enhanced effect, two positioning baffles 14 can also be arranged on the other side of the bearing disk 12.

[0043] The carrier plate 12 is used to place the circuit board. In order to prevent the circuit board from moving or being placed inaccurately, in this embodiment, a plurality of placement grooves 15 are formed on the upper surface of the carrier plate 12. At least one row of placement grooves 15 is arranged along the length direction of the carrier plate 12. The circuit board is placed in the placement grooves 15, and the shape of the circuit board is the same as that of the placement grooves 15. The depth of the placement grooves 15 is less than the thickness of the circuit board, so that a part of the circuit board can be exposed, which is convenient for chip mounting and removal.

[0044] Referring to Figure 2 , the feeding mechanism is installed on the frame 13. The heights of both sides of the frame 13 are higher than the height of the carrier platform 11. The feeding mechanism includes a carrier table 31. The carrier table 31 adopts a rectangular plate structure and is fixed at both ends on the frames 13 on both sides of the carrier platform 11, so that the height of the carrier table 31 is greater than the height of the carrier platform 11. At least one row of rectangular bosses 32 is arranged on the carrier table 31. The number of bosses 32 in each row is the same as the number of placement grooves 15 on the carrier plate 12. Electronic components are placed on the bosses 32, which is convenient for grasping the electronic components and grasping and installing them one by one onto the circuit boards in each placement groove 15. Similarly, in this embodiment, it is also necessary to position the initial position of the electronic components. In this application, a plurality of positioning protrusions (not shown in the figure) are provided on the edge of the upper surface of the bosses 32, and the positioning protrusions are used to abut against the side surfaces of the electronic components to prevent the electronic components from shifting. In this embodiment, the carrier plate 12 and the bosses 32 are used in combination. When installing different circuit boards, they need to be replaced accordingly. The bosses 32 can also be detachably installed on the carrier table 31. Grooves are formed on the upper surface of the carrier table 31, and the bosses 32 can be embedded into the grooves.

[0045] Referring to Figure 1 , the transmission mechanism is arranged above the carrier platform 11 and includes a horizontal movement component and a vertical lifting component. The horizontal movement component includes a support frame 41, a slide rail 42, and a cross beam 43. The support frame 41 is provided in two groups, and each group has two columns, which are respectively connected to the frames 13 on both sides of the carrier platform 11. Two slide rails 42 are provided and are respectively connected to the tops of the two support frames 41. The heights of the two slide rails 42 are the same and they are parallel to each other. The cross beam 43 is slidably connected between the two slide rails 42 and hangs above the carrier platform 11, and reciprocates above the carrier platform 11. In this embodiment, the cross-sectional shape of the slide rail 42 is T-shaped. Rollers are provided at both ends of the cross beam 43 and are arranged up and down opposite to each other. The rollers abut against the upper and lower sides of the slide rail 42 to reduce the sliding resistance of the cross beam 43. At the same time, servo motors are provided at both ends of the cross beam 43 to drive the cross beam 43 to move.

[0046] The vertical lifting component includes two lifting cylinders 44. The two lifting cylinders 44 are vertically connected to the positions near the ends of the lower surface of the cross beam 43. The chip mounting mechanism is connected to the piston rods of the lifting cylinders 44 and is driven by the lifting cylinders 44 to move up and down and is driven by the cross beam 43 to move left and right.

[0047] Refer to Figure 1 and 3 3 , the chip mounting mechanism includes a rotating shaft rod 21, an annular nozzle seat 22, a nozzle 23, an elastic pressing cylinder 24, a driving motor 25, a bearing seat 26, a pressing ring 27 and a nozzle mounting plate 28. The rotating shaft rod 21 is set as a smooth shaft, parallel to the cross beam 43, and its length is not less than that of the cross beam 43. Bearing seats 26 are installed at both ends of the rotating shaft rod 21, and the two bearing seats 26 are installed at the lower ends of the piston rods of two lifting cylinders 44. The rotating shaft rod 21 is driven by the piston rod to move up and down. One end of the rotating shaft rod 21 passes through one of the bearing seats 26 and is connected with a driving motor 25. A speed reducer is arranged on the driving motor 25 to drive the rotation of the rotating shaft rod 21.

[0048] A plurality of circular annular nozzle seats 22 are sleeved on the rotating shaft rod 21 at positions between the two bearing seats 26. In this embodiment, three annular nozzle seats 22 are provided, and the three annular nozzle seats 22 are arranged at equal intervals. Four elastic pressing cylinders 24 are also sleeved on the rotating shaft rod 21. The four elastic pressing cylinders 24 and the three annular nozzle seats 22 are arranged alternately and abutted against each other. The diameter of the elastic pressing cylinder 24 is not less than that of the annular nozzle seat 22. The positions of the three annular nozzle seats 22 correspond to the positions of the bosses 32 on the carrier 31. Two pressing rings 27 are also sleeved on the rotating shaft rod 21 near the two bearing seats 26. The two pressing rings 27 are respectively abutted against the two outermost elastic pressing cylinders 24. The pressing rings 27 are slidably arranged on the rotating shaft rod 21 and locked on the rotating shaft rod 21 by radially penetrating set screws. The two pressing rings 27 sandwich the four elastic pressing cylinders 24 and the three annular nozzle seats 22 in the middle to prevent the elastic pressing cylinders 24 and the annular nozzle seats 22 from moving.

[0049] In this embodiment, the elastic pressing cylinder 24 is divided into an inner and outer two-layer structure, including an inner metal rigid sleeve and an outer elastic foam flexible sleeve. The rigid sleeve and the flexible sleeve have the same length. The rigid sleeve is sleeved on the rotating shaft rod 21 and is used to abut against the annular nozzle seat 22 and the pressing ring 27 to prevent the annular nozzle seat 22 from being misaligned. The flexible sleeve is sleeved outside the rigid sleeve and is used to be deformed under pressure to protect the circuit board.

[0050] In order to improve the chip - mounting efficiency of the chip - mounting mechanism, at least two suction nozzles 23 are installed on each annular suction nozzle seat 22. Specifically, at least two suction nozzle mounting plates 28 are connected to the circumferential surface of the annular suction nozzle seat 22. An embedding groove is formed on the outer circumferential surface of the annular suction nozzle seat 22. The suction nozzle mounting plate 28 is embedded into the embedding groove and fixed by bolts. The upper surface of the suction nozzle mounting plate 28 is parallel to the tangent of the annular suction nozzle seat 22. The suction nozzle 23 is fixed on the upper surface of the suction nozzle mounting plate 28. When grasping the electronic components, the rotating shaft rod 21 rotates to grasp. After grasping one row, the rotating shaft rod 21 rotates by a certain angle, the suction nozzle 23 is replaced, and then another row is grasped; when chip - mounting, first, one row of electronic components is mounted, then the rotating shaft rod 21 rotates by a certain angle, and the next row of electronic components is continuously mounted.

[0051] The implementation principle of the embodiment of this application is as follows: Before chip - mounting, first place the circuit board on the carrier plate 12 and arrange it neatly in the placement groove 15. At the same time, place the electronic components on the boss 32 and also arrange them neatly; drive the cross beam 43 to move, so that the rotating shaft rod 21 moves above the carrier table 31. Rotate the rotating shaft rod 21 to make the suction nozzle 23 face downwards. The lifting cylinder 44 drives the rotating shaft rod 21 to descend to grasp the electronic components, and rotate the rotating shaft rod 21 by an angle to continue grasping; move the rotating shaft rod 21 above the carrier plate 12, lower the rotating shaft rod 21, and the suction nozzle 23 places the electronic components on the circuit board for mounting. At the same time, the elastic pressing cylinder 24 is pressed against the circuit board. Then, the rotating shaft rod 21 is lifted - rotated - lowered to mount the next row of electronic components.

[0052] The embodiments of this specific implementation manner are all preferred embodiments of this application, and do not limit the protection scope of this application accordingly. The same components are denoted by the same reference numerals. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A circuit board chip mounting device, characterized in that, Comprising: A carrying mechanism for placing and supporting a circuit board, including a carrying platform (11) and a carrying tray (12) placed on the carrying platform (11), and the circuit board is placed on the carrying tray (12); A transmission mechanism connected to the carrying mechanism, including a horizontal movement component and a vertical lifting component, and the vertical lifting component is slidably connected to the horizontal movement component; A chip placement mechanism connected to the horizontal movement component, including a rotating shaft rod (21) parallel to the carrying platform (11), an annular nozzle seat (22) sleeved on the upper end of the rotating shaft rod (21), a nozzle (23) connected to the annular nozzle seat (22), and elastic pressing cylinders (24) arranged on both sides of the annular nozzle seat (22); the rotating shaft rod (21) is connected to the vertical lifting component, and a driving motor (25) is connected to one end thereof, the elastic pressing cylinders (24) are sleeved on the rotating shaft rod (21), and when the nozzle (23) places an electronic component, the elastic pressing cylinders (24) are pressed against the circuit board; And A feeding mechanism, including a loading table (31) for arranging and placing electronic components; The rotating shaft rod (21) is parallel to the carrying platform (11), and bearing seats (26) are connected to positions near the end faces at both ends of the rotating shaft rod (21), and the bearing seats (26) are connected to the vertical lifting component; A plurality of annular nozzle seats (22) are spaced on the rotating shaft rod (21), elastic pressing cylinders (24) are spaced between the annular nozzle seats (22), and a pressing ring (27) is arranged at a position on the rotating shaft rod (21) close to the bearing seat (26), and the pressing ring (27) abuts against the elastic pressing cylinder (24) at the end; The elastic pressing cylinder (24) includes a rigid sleeve and a flexible sleeve, the rigid sleeve is sleeved on the rotating shaft rod (21), the flexible sleeve is sleeved outside the rigid sleeve, and the rigid sleeve and the flexible sleeve have the same length.

2. The PCB chip mounting device according to claim 1, characterized in that, At least two nozzle mounting plates (28) are connected to the circumferential surface of the annular nozzle seat (22), and the nozzle (23) is connected to the surface of the nozzle mounting plate (28), and the connecting surface is parallel to the tangent of the annular nozzle seat (22).

3. A circuit board chip mounting device according to claim 1, characterized in that, The carrying mechanism further includes a frame (13), the carrying platform (11) is installed on the frame (13), a positioning baffle (14) is arranged on one side of the carrying platform (11), and when the carrying tray (12) is placed on the carrying platform (11), one side abuts against the positioning baffle (14).

4. A circuit board chip mounting device according to claim 1, characterized in that, The axis of the carrying tray (12) is parallel to the rotating shaft rod (21), and a plurality of placement grooves (15) are axially formed in the carrying tray (12), and the shape of the placement grooves (15) is adapted to the shape of the circuit board.

5. A circuit board chip mounting device according to claim 3, characterized in that, Both ends of the loading table (31) are connected to the frame (13), a plurality of bosses (32) are arranged in a row on the loading table (31), electronic components are placed on the bosses (32), and positioning protrusions are arranged on the edges of the bosses (32).

6. A circuit board chip mounting device according to claim 1, characterized in that, The horizontal movement component includes two support frames (41) arranged on both sides of the bearing platform (11), two slide rails (42) respectively connected to the two support frames (41), and a cross beam (43) slidably connected between the two slide rails (42). The cross beam (43) is suspended above the bearing platform (11) and parallel to the rotating shaft rod (21). The rotating shaft rod (21) is connected to the cross beam (43) through a vertical lifting component.

7. A circuit board chip mounting device according to claim 6, characterized in that, The vertical lifting component includes two lifting cylinders (44) vertically connected to the lower surface of the cross beam (43). The piston rod of the lifting cylinder (44) is connected to the rotating shaft rod (21).

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