A structure design method of wireless energy transmission device capable of bearing high atmospheric pressure

Abstract

The application provides a wireless energy transmission device structure design method capable of bearing high atmospheric pressure, a sealing ring, a limiting convex platform, a limiting concave groove, a limiting pin and a limiting screw are used to ensure the compression amount of the sealing ring, limit the movement between modules and improve the atmospheric pressure resistance; the limiting pin, the limiting hole, the limiting screw, the limiting pin and the limiting hole are used to ensure the cooperation between the primary side and the secondary side equipment, improve the atmospheric pressure resistance and ensure the wireless energy transmission effect; the limiting screw, the limiting pin and the limiting hole are used to ensure the limiting precision and the limiting strength of the multi-layer printed board; a heat-conducting convex platform is designed on a high-heat-conducting carbon plate to cooperate with a heat-conducting pad to complete the heat dissipation of a high-power device, and a graphite heat-distribution film is used to cooperate with a pressing plate to complete the heat dissipation of the high-power device. The sealing ring, the limiting convex platform, the limiting concave groove, the limiting pin, the limiting screw, the graphite heat-distribution film and the carbon plate are used to complete the high atmospheric pressure resistance and force-heat design of the wireless energy transmission and communication device, ensure the cooperation between the primary side and the secondary side equipment, improve the atmospheric pressure resistance and the heat dissipation performance, and ensure the wireless energy transmission effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of basic electrical elements, in particular to a structure design method of a wireless energy transmission device capable of bearing high atmospheric pressure. BACKGROUND

[0002] The wireless energy transmission and communication system is composed of a primary device, a secondary device, a mounting plate, a cable and the like, and mainly completes the functions of wireless energy transmission, wireless communication (transmission and reception) and emergency instruction sending. The wireless primary and secondary devices cooperate to complete the wireless transmission of electric energy, the wireless transmission and reception of data and the wireless transmission of emergency instructions.

[0003] At present, the position offset adaptability of the primary and secondary devices is ±2mm, and the angle tolerance range is ≥±2°. The wireless energy transmission device needs to be able to bear the impact of high atmospheric pressure.

[0004] However, the prior art cannot bear high atmospheric pressure and the heat dissipation performance needs to be improved. SUMMARY

[0005] The present application is to solve the problems of poor atmospheric pressure impact resistance and heat dissipation performance of the wireless energy transmission device, and provides a structure design method of a wireless energy transmission device capable of bearing high atmospheric pressure. The sealing ring is designed according to the shape and weight of the primary and secondary devices; the limiting boss and the limiting groove are designed between the upper cover plate, each module and the mounting plate, which ensures the compression amount of the sealing ring and limits the movement between the modules, thereby improving the atmospheric pressure resistance; the limiting pin is designed at the bottom of the primary device, and the limiting hole is designed at the bottom of the secondary device, which ensures the cooperation of the primary and secondary devices, improves the atmospheric pressure resistance and ensures the wireless energy transmission effect; the limiting screw is designed to fix the interconnection plug of the multi-layer printed board, and the limiting pin and the limiting hole between the limiting screws ensure the limiting precision and strength of the multi-layer printed board; the high-thermal-conductivity carbon plate is used, and the heat-conducting boss is designed on the high-thermal-conductivity carbon plate to complete the heat dissipation of the high-power device together with the heat-conducting pad; for the high-power device that cannot use the high-thermal-conductivity carbon plate for heat conduction, the graphite heat film is used together with the pressing plate to complete the heat dissipation of the high-power device. The sealing ring, the limiting boss, the limiting groove, the limiting pin, the limiting screw, the graphite heat film and the carbon plate are used to complete the high atmospheric pressure resistance and force-heat design of the wireless energy transmission and communication device, ensure the cooperation of the primary and secondary devices, improve the atmospheric pressure resistance and heat dissipation performance, and ensure the wireless energy transmission effect.

[0006] The present application provides a structure design method of a wireless energy transmission device capable of bearing high atmospheric pressure. The wireless energy transmission device comprises a primary device, a mounting plate and a secondary device which are detachably connected in sequence, and comprises the following steps:

[0007] S1, the first sealing structure is arranged between the modules of the primary side device and the secondary side device, between the primary side device and the mounting plate, and between the mounting plate and the secondary side device, the first sealing structure comprises a sealing ring mounting groove and a sealing ring placed in the sealing ring mounting groove, and the parameters of the sealing ring are designed according to the shape and weight of the primary side device and the secondary side device;

[0008] S2, the second sealing structure is arranged between the modules of the primary side device and the secondary side device, between the primary side device and the mounting plate, and between the mounting plate and the secondary side device, the second sealing structure comprises a limiting boss and a limiting groove, and a limiting groove sealing ring is placed in the limiting groove;

[0009] S3, the first limiting structure is arranged between the primary side device and the secondary side device, the first limiting structure comprises a limiting pin and a limiting hole;

[0010] S4, the second limiting structure is arranged between the printed boards arranged in the primary side device and the secondary side device, the second limiting structure comprises an upper limiting screw and a lower limiting screw;

[0011] S5, the first heat dissipation structure is arranged at the top of the primary side device and the secondary side device, the first heat dissipation structure comprises an upper cover plate and a heat conduction boss arranged on the side of the upper cover plate facing the device, and the upper cover plate is a carbon plate;

[0012] S6, the second heat dissipation structure is arranged in the middle layer structure and the lower layer structure of the primary side device and the secondary side device, and the second heat dissipation structure is a uniform heating film.

[0013] As a preferred mode, in step S1, the depth of the sealing ring mounting groove is 2.75-0+0.05mm, the width is 5-0+0.15mm, the roughness of the matching surface of the sealing ring mounting groove and the sealing ring is 1.6, the groove bottom round angle of the sealing ring mounting groove is R0.5mm, and the groove edge round angle is R0.2mm.

[0014] The sealing ring is square, the diameter of the sealing ring is 3.55mm, the material is damping glue 6103-1, the round angle of the adjacent two sides of the sealing ring is R27.5mm, and the compression rate of the sealing ring in use is 17.5%-18.5%.

[0015] As a preferred mode, in step S2, the limiting boss and the limiting groove are arranged along the shape of the primary side device and the secondary side device.

[0016] The width of the limiting boss is 4.6±0.05mm, the height is 2.6±0.05mm, the width of the limiting groove is 5-0+0.15mm, and the depth is 5.35-0+0.05mm.

[0017] As a preferred mode, in step S3, the mounting plate is a hollow structure, two limiting pins are arranged on one side of the primary device, the limiting pins are cylinders, the diameter of the limiting pins is 6-0.05-0.1 mm;

[0018] Two protruding limiting holes are arranged on the surface of the secondary device, the limiting holes are cylindrical hollow structures, the height of the limiting holes is less than or equal to the thickness of the mounting plate, the outer diameter of the limiting holes is 10 mm, the inner diameter of the limiting holes is 6+0.1+0.06 mm, and the height of the limiting holes is 4 mm;

[0019] The center distance of the two limiting holes is the same as the center distance of the two limiting pins and is 14±0.05 mm, and the distance from the upper limiting hole to the center of the secondary device is the same as the distance from the upper limiting pin to the center of the primary device and is 45±0.05 mm.

[0020] As a preferred mode, in step S4, the upper limiting screw passes through the upper layer electric connector and the upper layer printed board in sequence and is connected with the upper layer printed board through threads, the lower limiting screw passes through the lower layer electric connector and the lower layer printed board in sequence and is connected with the lower layer printed board through threads, the bottom of the upper limiting screw is inserted into the upper circular hole of the lower limiting screw for positioning and the pin of the upper layer electric connector is not stressed;

[0021] The upper limiting screw comprises an upper layer nut, an upper layer limiting section, an upper layer first cylindrical section, an upper layer threaded section and a second cylindrical section connected in sequence from top to bottom, and the upper layer limiting section is a square structure which is detachably connected with the inner wall of the electric connector and prevents rotation;

[0022] The lower limiting screw comprises a lower layer nut, a lower layer limiting section, a lower layer cylindrical section, a lower layer threaded section and a mounting hole arranged in the lower layer nut and the lower layer limiting section;

[0023] The second cylindrical section passes through the upper layer electric connector and the upper layer printed board in sequence and is inserted into the mounting hole.

[0024] As a preferred mode, a T-shaped groove or a cross-shaped groove is arranged on the surface of the upper layer nut, the length and the width of the upper layer limiting section are both 2.1 mm, the diameter of the upper layer first cylindrical section is 2 mm, the upper layer threaded section is M2-6H, and the diameter of the second cylindrical section is 1.2-0.1-0.2 mm;

[0025] A T-shaped groove or a cross-shaped groove is arranged on the surface of the lower layer nut, the length and the width of the lower layer limiting section are both 2.1 mm, the diameter of the lower layer first cylindrical section is 2 mm, the lower layer threaded section is M2-6H, and the diameter of the mounting hole is 1.2+0.1-0 mm.

[0026] As a preferred mode, in step S5, the first heat dissipation structure further comprises a flexible heat conduction pad arranged between the heat conduction boss and the high-power device.

[0027] As a preferred mode, the thickness of the flexible heat conduction pad is 1 mm.

[0028] As a preferred mode, in step S6, the second heat dissipation structure is a graphite heat film, and one side of the second heat dissipation structure is fixed on the surface of the high-power device after being folded into an L shape, and the other side is fixed on the metal shell through a pressing plate.

[0029] As a preferred mode, the thermal conductivity of the graphite heat film is greater than 7 W / m·k, and one side of the second heat dissipation structure is adhered to the surface of the high-power device through GD-414 glue.

[0030] The technical solution of the present application is:

[0031] A wireless energy transmission device structure design method capable of bearing high atmospheric pressure, which comprises a sealing ring, a limiting boss, a limiting groove, a limiting pin, a limiting screw, a graphite heat film, a carbon plate and the like;

[0032] By adopting the method of the sealing ring, the sealing between the modules is ensured.

[0033] By adopting the design method of the limiting boss and the limiting groove, the ability of the primary device and the secondary device to resist high atmospheric pressure is improved.

[0034] By designing the limiting pin at the bottom of the primary device and the limiting hole at the bottom of the secondary device, the cooperation of the primary device and the secondary device is ensured, the ability to resist high atmospheric pressure is improved, and the wireless energy transmission effect is ensured.

[0035] A wireless energy transmission device structure design method capable of bearing high atmospheric pressure, which comprises the following steps:

[0036] (1) According to the shape and weight of the primary device and the secondary device, a sealing ring for sealing is designed.

[0037] (2) A limiting boss and a limiting groove are designed between the upper cover plate, the modules and the mounting plate, so as to ensure the compression amount of the sealing ring and limit the movement between the modules, and improve the ability to resist atmospheric pressure.

[0038] (3) A limit pin is designed at the bottom of the primary side device, and a limit hole is designed at the bottom of the secondary side device to ensure the coordination between the primary and secondary side devices, improve the ability to resist atmospheric pressure, and ensure the wireless energy transmission effect;

[0039] (4) By designing limit screws, it is used to fix the indirect plug-in of the multilayer printed circuit board. At the same time, the limit pins and limit holes between the limit screws ensure the limit accuracy and limit strength of the multilayer printed circuit board;

[0040] (5) By using a high thermal conductivity carbon plate, designing a thermal conductive boss on the high thermal conductivity carbon plate, and cooperating with a thermal pad to achieve heat dissipation of high-power devices;

[0041] (6) For high-power devices that cannot be heated by high-conductivity carbon plates, graphite heat-dissipating film is used in conjunction with a pressure plate to achieve heat dissipation of the high-power devices.

[0042] The present invention has the following advantages:

[0043] The present invention adopts sealing rings, limiting bosses, limiting grooves, limiting pins, limiting screws, graphite heat-dissipating films, carbon plates and other measures to complete the high atmospheric pressure resistance and thermal design of the wireless energy transmission and communication device, ensure the coordination of the primary and secondary side equipment, improve the atmospheric pressure resistance and heat dissipation performance, and ensure the wireless energy transmission effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a flow chart of a method for designing a structure of a wireless energy transmission device that can withstand high atmospheric pressure;

[0045] Figure 2 A schematic diagram of a wireless energy transmission device structure that can withstand high atmospheric pressure;

[0046] Figure 3 A partial enlarged view of the sealing ring groove in a structural design method for a wireless energy transmission device capable of withstanding high atmospheric pressure;

[0047] Figure 4 A schematic diagram of a sealing ring structure for a wireless energy transmission device capable of withstanding high atmospheric pressure;

[0048] Figure 5 A schematic diagram of the internal limiting boss structure of the primary and secondary side devices in a structural design method for a wireless energy transmission device that can withstand high atmospheric pressure;

[0049] Figure 6 A schematic diagram of the design of the mounting plate and the primary and secondary side equipment limit bosses for a structural design method of a wireless energy transmission device that can withstand high atmospheric pressure;

[0050] Figure 7aA primary edge structure limiting pin structure schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0051] Figure 7b A secondary edge structure limiting hole structure schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0052] Figure 8 A limiting screw installation schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0053] Figure 9a An upper limiting screw front view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0054] Figure 9b An upper limiting screw top view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0055] Figure 9c An upper limiting screw bottom view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0056] Figure 10a A lower limiting screw front view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0057] Figure 10b A lower limiting screw top view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0058] Figure 10c A lower limiting screw bottom view of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0059] Figure 11 A high-thermal-conductivity carbon plate upper thermal conduction boss structure schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0060] Figure 12 A high-thermal-conductivity carbon plate upper thermal conduction path schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0061] Figure 13 A graphite heat uniform film thermal conduction schematic diagram of a wireless energy transmission device structure design method capable of bearing high atmospheric pressure

[0062] Reference signs:

[0063] 1. Primary side equipment; 2. Mounting plate; 3. Secondary side equipment; 4. First sealing structure; 41. Sealing ring mounting groove; 42. Sealing ring; 5. Second sealing structure; 51. Limiting boss; 52. Limiting groove; 6. First limiting structure; 61. Limiting pin; 62. Limiting hole; 7. Second limiting structure; 71. Upper limiting screw; 711. Upper nut; 712. Upper limiting section; 713. Upper first cylindrical section; 714. Upper threaded section; 715. Second cylindrical section; 72. Lower limiting screw; 721. Lower nut; 722. Lower limiting section; 723. Lower cylindrical section; 724. Lower threaded section; 725. Mounting hole; 8. First heat dissipation structure; 81. Upper cover; 82. Thermal boss; 83. Flexible thermal pad; 9. Second heat dissipation structure. DETAILED DESCRIPTION

[0064] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0065] Example 1

[0066] like Figure 1 As shown in FIG, a structural design method of a wireless energy transmission device capable of withstanding high atmospheric pressure is shown in FIG. Figure 2 As shown, the wireless energy transmission device includes a primary side device 1, a mounting plate 2, and a secondary side device 3 that are detachably connected in sequence, and includes the following steps:

[0067] S1. A first sealing structure 4 is provided between each module of the primary device 1 and the secondary device 3, between the primary device 1 and the mounting plate 2, and between the mounting plate 2 and the secondary device 3. The first sealing structure 4 includes a sealing ring mounting groove 41 and a sealing ring 42 placed in the sealing ring mounting groove 41. The parameters of the sealing ring 42 are designed based on the shape and weight of the primary device 1 and the secondary device 3.

[0068] like Figure 3 As shown, the depth of the sealing ring installation groove 41 is 2.75-0+0.05mm, the width is 5-0+0.15mm, the mating surface roughness of the sealing ring installation groove 41 and the sealing ring 42 is 1.6, the groove bottom radius of the sealing ring installation groove 41 is R0.5mm, and the groove edge radius is R0.2;

[0069] like Figure 4 As shown, the sealing ring 42 is square, has a diameter of 3.55 mm, is made of damping rubber 6103-1, has a fillet of R27.5 mm on two adjacent sides of the sealing ring 42, and has a compression rate of 17.5% to 18.5% when in use;

[0070] S2, between each module of the primary side device 1 and the secondary side device 3, between the primary side device 1 and the mounting plate 2, and between the mounting plate 2 and the secondary side device 3, a second sealing structure 5 is arranged, the second sealing structure 5 comprises a limiting boss 51 and a limiting groove 52, and a sealing ring for the limiting groove is placed in the limiting groove 52;

[0071] As shown in Figures 5-6 , the limiting boss 51 and the limiting groove 52 are arranged along the shape of the primary side device 1 and the secondary side device 3;

[0072] The width of the limiting boss 51 is 4.6±0.05mm, and the height is 2.6±0.05mm, the width of the limiting groove 52 is 5-0+0.15mm, and the depth is 5.35-0+0.05mm;

[0073] S3, a first limiting structure 6 is arranged between the primary side device 1 and the secondary side device 3, the first limiting structure 6 comprises a limiting pin 61 and a limiting hole 62;

[0074] The mounting plate 2 is a hollow structure, as shown in Figure 7a , two limiting pins 61 are arranged on one side of the primary side device 1, the limiting pin 61 is a cylinder, and the diameter of the limiting pin 61 is 6-0.05-0.1mm;

[0075] As shown in Figure 7b , two protruding limiting holes 62 are arranged on the surface of the secondary side device 3, the limiting hole 62 is a cylindrical hollow structure, the height of the limiting hole 62 is less than or equal to the thickness of the mounting plate 2, the outer diameter of the limiting hole 62 is 10mm, the inner diameter is 6+0.1+0.06mm, and the height is 4mm;

[0076] The center distance of the two limiting holes 62 is the same as that of the two limiting pins 61, and both are 14±0.05mm, and the distance from the upper limiting hole 62 to the center of the secondary side device 3 is the same as that from the upper limiting pin 61 to the center of the primary side device 1, and both are 45±0.05mm;

[0077] The limiting pin 61 is designed at the bottom of the primary side device, and the limiting hole 62 is designed at the bottom of the secondary side device. During installation, the secondary side device is first installed on the mounting plate, and then the primary side device is installed;

[0078] When the primary side device is installed, the alignment of the primary side and the secondary side device can be ensured by the limiting pin 61 and the limiting hole 62, the atmospheric pressure resistance can be improved, and the wireless energy transmission effect can be ensured;

[0079] S4, as shown in Figure 8 , a second limiting structure 7 is arranged between the printed boards arranged in the primary side device 1 and the secondary side device 3, the second limiting structure 7 comprises an upper limiting screw 71 and a lower limiting screw 72;

[0080] The upper limit screw 71 passes through the upper electrical connector and the upper printed circuit board in sequence and is connected to the upper printed circuit board through threads. The lower limit screw 72 passes through the lower electrical connector and the lower printed circuit board in sequence and is connected to the lower printed circuit board through threads. The bottom of the upper limit screw 71 is inserted into the upper circular hole of the lower limit screw 72 for positioning and to remove stress from the pins of the upper electrical connector.

[0081] like Figures 9a-9c As shown, the upper limiting screw 71 includes an upper nut 711, an upper limiting section 712, an upper first cylindrical section 713, an upper threaded section 714, and a second cylindrical section 715, which are connected in sequence from top to bottom. The upper limiting section 712 is a square structure that is detachably connected to the inner wall of the electrical connector and prevents rotation.

[0082] like Figures 10a-10c As shown, the lower limiting screw 72 includes a lower nut 721, a lower limiting section 722, a lower cylindrical section 723, a lower threaded section 724, and a mounting hole 725 provided in the lower nut 721 and the lower limiting section 722, which are connected in sequence from top to bottom.

[0083] The second cylindrical section 715 sequentially passes through the upper electrical connector and the upper printed circuit board and is inserted into the mounting hole 725;

[0084] The upper nut 711 has a slot or a cross slot on its surface. The length and width of the upper limiting section 712 are both 2.1 mm. The diameter of the upper first cylindrical section 713 is 2 mm. The upper threaded section 714 is M2-6H. The diameter of the second cylindrical section 715 is 1.2-0.1-0.2 mm.

[0085] The surface of the lower nut 721 is provided with a slot or a cross slot. The length and width of the lower limiting section 722 are both 2.1 mm. The diameter of the lower cylindrical section 723 is 2 mm. The lower threaded section 724 is M2-6H. The diameter of the mounting hole 725 is 1.2+0.1-0 mm.

[0086] S5, such as Figure 2 、 Figure 11 As shown, a first heat dissipation structure 8 is provided on top of the primary side device 1 and the secondary side device 3. The first heat dissipation structure 8 includes an upper cover plate 81 and a heat conducting boss 82 provided on the side of the upper cover plate 81 facing the device. The upper cover plate 81 is a carbon plate.

[0087] like Figure 12 As shown, the first heat dissipation structure 8 further includes a flexible thermal pad 83 provided between the thermally conductive boss 82 and the high-power device, and the thickness of the flexible thermal pad 83 is 1 mm;

[0088] S6, such as Figure 13As shown, a second heat dissipation structure 9 is provided in the middle structure and the lower structure of the primary side device 1 and the secondary side device 3. The second heat dissipation structure 9 is a heat diffusion film.

[0089] The second heat dissipation structure 9 is a graphite heat-dissipating film. After being folded into an L shape, one side of the second heat dissipation structure 9 is fixed on the surface of the high-power device, and the other side is fixed to the metal shell through a pressing plate.

[0090] The thermal conductivity of the graphite heat-spreading film is greater than 7 W / m·K. One side of the second heat dissipation structure 9 is bonded to the surface of the high-power device by GD-414 adhesive.

[0091] Example 2

[0092] A structural design method for a wireless energy transmission device capable of withstanding high atmospheric pressure, such as Figures 1-2 As shown, this method utilizes sealing rings, limiting bosses, limiting grooves, limiting pins, limiting screws, graphite heat-dissipating films, carbon plates and other measures to complete the high atmospheric pressure resistance and thermal design of the wireless energy transmission and communication device, ensuring that the equipment can still work normally at high atmospheric pressure.

[0093] Step 1: Use sealing ring to ensure the sealing between modules

[0094] Sealing ring 42 Figure 4 As shown, according to the shape and weight of the primary and secondary devices, a sealing ring 42 with a diameter of 3.55mm is designed, and the rubber material is selected as damping rubber 6103-1. In order to ensure the sealing effect of the sealing ring 42, the compression rate of the sealing ring 42 needs to be between 17.5% and 18.5%, so the size of the sealing ring installation groove 41 is as follows: Figure 3 As shown, the depth is 2.75 (0, +0.05) mm, the groove width is 5 (0, +0.15) mm, the roughness of the sealing ring mounting groove 41 and the mating surface is 1.6 mm, the groove bottom radius is R0.5 mm, and the groove edge radius is R0.2 mm.

[0095] Step 2: Design the limiting boss and limiting groove

[0096] On the basis of placing the sealing ring, a limiting boss 51 and a limiting groove 52 are designed between the upper cover plate and each module, such as Figure 5 As shown, a sealing ring is placed in the groove 52, the limiting groove 52 has a width of 5 (0, +0.15) mm and a depth of 5.35 (0, +0.05) mm, and the limiting boss 51 has a width of 4.6±0.05 mm and a height of 2.6±0.05 mm, which ensures the sealing and atmospheric pressure resistance between the modules of the primary side device and the secondary side device.

[0097] A limiting boss 51 and a limiting groove 52 are also designed between the primary side device, the secondary side device and the mounting plate. The size is consistent with the primary side and the secondary side device itself to ensure the sealing and atmospheric pressure resistance between the primary side device, the secondary side device and the mounting plate. Figure 6 shown.

[0098] Step 3: Design the limit pins and limit holes

[0099] This wireless energy transmission and communication device requires that the primary and secondary devices have a positional offset adaptability of ±2mm and an angular tolerance range of ≥±2°, ensuring that the primary and secondary devices are properly aligned. If the primary and secondary devices are fixed separately to the mounting plate, installation tolerances can make it difficult to align them perfectly after installation, impacting wireless signal transmission. Therefore, a stop pin 61 and a stop hole 62 are designed on the primary and secondary devices, respectively, and the pin and hole are aligned in the hollow space of the mounting plate, ensuring installation accuracy and smooth wireless transmission.

[0100] A limit pin 61 is designed at the bottom of the primary device, and a limit hole 62 is designed at the bottom of the secondary device. During installation, the secondary device is first installed on the mounting plate, and then the primary device is installed. When installing the primary device, the limit pin 61 and the limit hole 62 can be used to ensure that the primary and secondary devices are aligned, thereby improving the ability to resist atmospheric pressure and ensuring the wireless energy transmission effect. Figure 7a 、 7b shown.

[0101] Step 4: Design the limit screws

[0102] The primary and secondary side devices of this wireless energy transmission and communication device have three layers of printed circuit boards, and the electrical performance is transmitted between the printed circuit boards through the RM342 series electrical connector. Due to the processing tolerances of the shell and printed circuit boards, the RM342 may not be aligned when plugged in. The misalignment of the socket will cause the RM342 pins to be stressed, resulting in signal instability when subjected to external force. Figure 8 The design of the upper limit screw 71 and the lower limit screw 72 can solve this problem. Figures 9a-9c , 10a~10c design, the middle section of the limit screw is a 2.1mm×2.1mm square area, which is used to limit the inner wall of the RM342 socket to prevent the screw from rotating. There is a second cylindrical section 715 with a diameter of 1.2 below the upper limit screw 71, which is used to position it with the mounting hole 725 with a diameter of 1.2 of the lower limit screw 72 during installation. The limit screw positioning ensures that the RM342 pin is not subjected to force.

[0103] Step 5 Design high thermal conductivity carbon plate thermal boss

[0104] The primary and secondary side devices of the wireless energy transmission and communication device have high-power devices in the uppermost layer. In order to ensure that the heat of the high-power devices is quickly conducted out, the upper cover plate is made of high-thermal-conductivity carbon plate (the thermal conductivity coefficient is 3 times that of aluminum), and a heat-conducting boss 82 is designed on the upper cover plate 81. See Figure 11 , and the heat dissipation of the high-power devices is completed by cooperating with the flexible heat-conducting pad 83. The heat dissipation path is shown in Figure 12 . The flexible heat-conducting pad 83 is 1mm above the high-power devices, the heat-conducting boss 82 is above the flexible heat-conducting pad 83, the heat of the high-power devices is conducted to the heat-conducting boss 82 through the flexible heat-conducting pad 83, and then is conducted to the device shell through the heat-conducting boss 82.

[0105] Step 6: Designing a graphite heat film

[0106] The primary and secondary side devices of the wireless energy transmission and communication device also have high-power devices in the middle layer and the lower layer, but the middle layer and the lower layer do not have cover plates, so they cannot be cooled by designing heat-conducting bosses, but they can be cooled by designing a second heat dissipation structure 9. As shown in Figure 13 , the second heat dissipation structure 9 has a thermal conductivity greater than 7W / m.k and can be folded into an L shape. One end of the second heat dissipation structure 9 is glued to the top of the high-power device by GD-414, the other end is fixed to the nearby metal shell by a pressing plate after being folded into an L shape, and the heat of the high-power device can be conducted to the device shell through the second heat dissipation structure 9, preventing the temperature of the high-power device from being too high to affect use and ensuring the normal operation of the device.

[0107] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can make equivalent replacements or changes to the technical solution and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure, the wireless energy transmission device comprising a primary side device (1), a mounting plate (2), and a secondary side device (3) that are sequentially detachably connected, characterized in that: The following steps are involved: S1. A first sealing structure (4) is provided between each module of the primary device (1) and the secondary device (3), between the primary device (1) and the mounting plate (2), and between the mounting plate (2) and the secondary device (3). The first sealing structure (4) includes a sealing ring mounting groove (41) and a sealing ring (42) placed in the sealing ring mounting groove (41). Parameters of the sealing ring (42) are designed according to the shape and weight of the primary device (1) and the secondary device (3). S2. A second sealing structure (5) is provided between each module of the primary side device (1) and the secondary side device (3), between the primary side device (1) and the mounting plate (2), and between the mounting plate (2) and the secondary side device (3). The second sealing structure (5) includes a limiting boss (51) and a limiting groove (52). A sealing ring for the limiting groove is placed in the limiting groove (52); S3, providing a first limiting structure (6) between the primary side device (1) and the secondary side device (3), wherein the first limiting structure (6) comprises a limiting pin (61) and a limiting hole (62); S4. A second limiting structure (7) is provided between the printed circuit boards provided in the primary side device (1) and the secondary side device (3), wherein the second limiting structure (7) comprises an upper limiting screw (71) and a lower limiting screw (72); S5. A first heat dissipation structure (8) is provided on top of the primary side device (1) and the secondary side device (3), wherein the first heat dissipation structure (8) comprises an upper cover plate (81) and a heat-conducting boss (82) provided on a side of the upper cover plate (81) facing the device, and the upper cover plate (81) is a carbon plate; S6. A second heat dissipation structure (9) is provided in the middle structure and the lower structure of the primary side device (1) and the secondary side device (3), wherein the second heat dissipation structure (9) is a heat-spreading film.

2. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, characterized in that: In step S1, the depth of the sealing ring installation groove (41) is 2.75-0+0.05mm, the width is 5-0+0.15mm, the mating surface roughness of the sealing ring installation groove (41) and the sealing ring (42) is 1.6, the groove bottom fillet of the sealing ring installation groove (41) is R0.5mm, and the groove edge fillet is R0.2mm; The sealing ring (42) is square, has a diameter of 3.55 mm, is made of damping rubber 6103-1, has a fillet of R27.5 mm on two adjacent sides of the sealing ring (42), and has a compression rate of 17.5% to 18.5% when in use.

3. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, wherein: In step S2, the limiting boss (51) and the limiting groove (52) are both arranged along the shape of the primary side device (1) and the secondary side device (3); The width of the limiting boss (51) is 4.6±0.05mm and the height is 2.6±0.05mm; the width of the limiting groove (52) is 5-0+0.15mm and the depth is 5.35-0+0.05mm.

4. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, wherein: In step S3, the mounting plate (2) is a hollow structure, and two limiting pins (61) are provided on one side of the primary side device (1), wherein the limiting pins (61) are cylindrical and have a diameter of 6-0.05-0.1 mm; Two protruding limiting holes (62) are provided on the surface of the secondary side device (3), the limiting holes (62) are cylindrical hollow structures, the height of the limiting holes (62) is less than or equal to the thickness of the mounting plate (2), the outer diameter of the limiting holes (62) is 10 mm, the inner diameter is 6+0.1+0.06 mm, and the height is 4 mm; The center distance between the two limiting holes (62) is the same as the center distance between the two limiting pins (61), and both are 14±0.05 mm. The distance from the upper limiting hole (62) to the center of the secondary side device (3) is the same as the distance from the upper limiting pin (61) to the center of the primary side device (1), and both are 45±0.05 mm.

5. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, wherein: In step S4, the upper limiting screw (71) passes through the upper electrical connector and the upper printed circuit board in sequence and is connected to the upper printed circuit board through a thread, and the lower limiting screw (72) passes through the lower electrical connector and the lower printed circuit board in sequence and is connected to the lower printed circuit board through a thread, and the bottom of the upper limiting screw (71) is inserted into the upper circular hole of the lower limiting screw (72) for positioning so that the pin of the upper electrical connector is not subjected to force; The upper limiting screw (71) comprises an upper nut (711), an upper limiting section (712), an upper first cylindrical section (713), an upper threaded section (714), and a second cylindrical section (715) connected in sequence from top to bottom; the upper limiting section (712) is a square structure that is detachably connected to the inner wall of the electrical connector and prevents rotation; The lower limiting screw (72) comprises a lower nut (721), a lower limiting section (722), a lower cylindrical section (723), a lower threaded section (724), and a mounting hole (725) provided in the lower nut (721) and the lower limiting section (722), which are sequentially connected from top to bottom. The second cylindrical section (715) sequentially passes through the upper electrical connector and the upper printed circuit board and is inserted into the mounting hole (725).

6. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 5, characterized in that: The surface of the upper nut (711) is provided with a straight groove or a cross groove, the length and width of the upper limiting section (712) are both 2.1 mm, the diameter of the upper first cylindrical section (713) is 2 mm, the upper threaded section (714) is M2-6H, and the diameter of the second cylindrical section (715) is 1.2-0.1-0.2 mm; The surface of the lower nut (721) is provided with a straight groove or a cross groove, the length and width of the lower limiting section (722) are both 2.1 mm, the diameter of the lower cylindrical section (723) is 2 mm, the lower threaded section (724) is M2-6H, and the diameter of the mounting hole (725) is 1.2+0.1-0 mm.

7. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, wherein: In step S5, the first heat dissipation structure (8) further includes a flexible heat-conducting pad (83) arranged between the heat-conducting boss (82) and the high-power device.

8. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 7, characterized in that: The thickness of the flexible thermal pad (83) is 1 mm.

9. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 1, characterized in that: In step S6, the second heat dissipation structure (9) is a graphite heat-dissipating film. After the second heat dissipation structure (9) is folded into an L shape, one side is fixed to the surface of the high-power device, and the other side is fixed to the metal shell through a pressure plate.

10. The method for designing a structure of a wireless energy transmission device capable of withstanding high atmospheric pressure according to claim 9, characterized in that: The thermal conductivity of the graphite heat-spreading film is greater than 7 W / m·K, and one side of the second heat dissipation structure (9) is bonded to the surface of the high-power device by GD-414 adhesive.

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