Full-automatic wafer film spreading equipment

Abstract

The application provides a full-automatic wafer film expanding device, which comprises a machine table and a multi-axis manipulator, the manipulator is installed on the machine table, and a large-iron-ring feeding device, a large-iron-ring discharging device and a film expander are further arranged on the machine table; the film expander comprises a large-iron-ring pressing assembly, a lifting film-expanding assembly and a film cutting mechanism, the large-iron-ring pressing assembly is arranged above the lifting film-expanding assembly, and the film cutting mechanism is arranged around the lifting film-expanding assembly; small iron rings are fed by the large-iron-ring feeding device, and the multi-axis manipulator is used to load the small iron rings on the large-iron-ring pressing assembly and place large iron rings on the lifting film-expanding assembly; the film on the large iron rings is uniformly expanded by the large-iron-ring pressing assembly and the lifting film-expanding assembly, and is then transferred to the small iron rings, and the film cutting mechanism is used for cutting the transferred film; the large iron rings and the small iron rings after film expansion are transported to the large-iron-ring discharging device by the multi-axis manipulator, and then are discharged, so that the full automation of the film expanding process is realized.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, and in particular to a fully automated wafer expansion equipment. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. High-purity polycrystalline silicon is dissolved, doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon ingot. After grinding, polishing, and slicing, the silicon ingot is formed into a silicon wafer, or wafer.

[0003] After the wafer is processed, it needs to be attached to a blue film for laser cutting or scribing to divide the entire wafer into several dies. Then, a film expander is used to expand the blue film to separate the dies from each other, so that the dies can be used.

[0004] In the existing wafer expansion process, loading and unloading are generally done manually. Moreover, existing expansion machines usually do not have the function of cutting the film off the original iron ring. The film needs to be removed manually and then manually divided, which is inefficient. Long-term operation can easily lead to fatigue, further reducing efficiency. Summary of the Invention

[0005] To address the aforementioned problems, the present invention aims to provide a fully automated wafer expansion equipment. This equipment utilizes a combination of a large and small iron ring loading device, a large and small iron ring unloading device, and a multi-axis robotic arm to achieve automatic loading and unloading. A film cutting mechanism is installed on the expansion machine for automatic cutting and separation, thus realizing full automation of the expansion process.

[0006] This invention employs the following method: A fully automated wafer expansion equipment includes a machine base and a multi-axis robot arm. The multi-axis robot arm is mounted on the machine base. The equipment also includes an expansion machine, and the machine base is further equipped with a large and small iron ring feeding device and a large and small iron ring unloading device. The expansion machine includes a large and small iron ring clamping assembly, a lifting expansion assembly, and a film cutting mechanism. The large and small iron ring clamping assembly is positioned above the lifting expansion assembly, and the film cutting mechanism surrounds the lifting expansion assembly. The large and small iron rings are fed by the large and small iron ring feeding device, and the multi-axis robot arm loads the small iron rings from the feeding device onto the large and small iron ring clamping assembly. The large iron ring is placed on the lifting expansion assembly. The film on the large iron ring is uniformly expanded by the large and small iron ring clamping assembly and the lifting expansion assembly, and then transferred to the small iron ring. The film cutting mechanism completes the transfer. The multi-axis robot arm transports the expanded large and small iron rings to the large and small iron ring unloading device for unloading.

[0007] In one embodiment of the present invention, the multi-axis manipulator is provided with a first iron ring adsorption component. The front of the first iron ring adsorption component is used to adsorb large iron rings, and the back is used to adsorb small iron rings. When it is necessary to adsorb large iron rings, the first iron ring adsorption component rotates to face down to pick up the large iron rings; when it is necessary to adsorb small iron rings, the first iron ring adsorption component rotates to face down to pick up the small iron rings; the film expander is disposed next to the multi-axis manipulator.

[0008] In one embodiment of the present invention, the first iron ring adsorption assembly includes a small iron ring suction cup and a large iron ring suction cup, the large iron ring suction cup and the small iron ring suction cup being arranged in parallel, the large iron ring suction cup having vacuum suction holes arranged on the surface opposite to the small iron ring suction cup, and the small iron ring suction cup having vacuum suction holes arranged on the surface opposite to the large iron ring suction cup; the small iron ring suction cup is matched to the size and shape of the small iron ring, and the large iron ring suction cup is matched to the size and shape of the large iron ring.

[0009] In one embodiment of the present invention, the large and small iron ring feeding device is disposed on the right side of the machine platform. The large and small iron ring feeding device includes a large iron ring feeding rack, a small iron ring feeding mechanism, a large iron ring detection platform, and a feeding and conveying arm. The large iron ring feeding rack, the small iron ring feeding mechanism, and the large iron ring detection platform are arranged side by side. The large iron ring feeding rack has multiple layers of large iron ring feeding placement areas and large iron ring NG placement areas. The small iron ring feeding mechanism includes a first lifting drive component, a small iron ring lifting plate, and a limiting component. The limiting component and the small iron ring lifting plate are installed on the driving component, and the small iron ring is placed on the small iron ring lifting plate; the loading and conveying arm is used to transport the iron rings from the large iron ring loading rack to the large iron ring detection platform. The large iron ring detection platform includes a tray and a mounting base. The tray is installed on the mounting base through a shaft driving component, and a second detection CCD is set above the tray; the multi-axis robot grabs the small iron rings from the small iron ring loading mechanism, and the multi-axis robot grabs the qualified large iron rings from the large iron ring detection platform;

[0010] The large and small iron ring feeding device is located on the left side of the machine platform. The large iron ring feeding device includes a large iron ring feeding mechanism, a small iron ring feeding rack, a small iron ring detection platform, and a feeding and conveying arm. The large iron ring feeding mechanism, the small iron ring feeding rack, and the small iron ring detection platform are arranged side by side on the left side of the machine platform. The small iron ring feeding rack has multiple layers of small iron ring feeding placement areas and small iron ring NG placement areas. The difference between the large iron ring feeding mechanism and the small iron ring feeding mechanism lies in the structure of the limiting component; the rest of the structures are the same. The structure of the small iron ring detection platform is the same as that of the large iron ring detection platform. The multi-axis robot places the expanded small iron rings on the small iron ring detection platform and places the expanded large iron rings on the large iron ring feeding mechanism. The feeding and conveying arm is used to transport the small iron rings on the small iron ring detection platform to the small iron ring feeding rack.

[0011] In one embodiment of the present invention, the limiting component of the small iron ring feeding mechanism includes a limiting plate, which is fixed to the outer surface of the first lifting drive member. Limiting posts are installed on the limiting plate, and four limiting posts are provided, each passing upward through the corresponding corner of the small iron ring lifting plate. The inner circumferential surface of the small iron ring abuts against the outer wall of the four limiting posts, thus limiting the small iron ring in the horizontal direction. The difference between the limiting component of the large iron ring unloading mechanism and the limiting component of the small iron ring feeding mechanism lies in the different spacing of the four limiting posts. The four limiting posts of the limiting component of the large iron ring unloading mechanism contact the outer circumferential surface of the large iron ring, clamping the large iron ring between the four limiting posts.

[0012] In one embodiment of the present invention, the unloading conveying arm structure is the same as the loading conveying arm structure. The loading conveying arm includes an XYZ axis moving assembly and large and small iron ring suction cups. The large and small iron ring suction cups are mounted on the XYZ axis moving assembly. A first detection CCD is also mounted on the XYZ axis moving assembly. The surfaces of the large and small iron ring suction cups are provided with two circles of vacuum suction holes of different sizes. Depending on whether the iron ring being transported is large or small, the system switches to working with the large circle of vacuum suction holes or the small circle of vacuum suction holes. The first detection CCD is used to determine the position of the iron ring.

[0013] In one embodiment of the present invention, the film expanding machine further includes a lower mounting frame and an upper mounting frame. The lower mounting frame is provided with a support plate, and the upper mounting frame is fixed on the support plate. The large and small iron ring pressing assembly is installed on the upper mounting frame. The lifting film expanding assembly is connected to the support plate. A film cutting mechanism is provided around the lifting film expanding assembly inside the lower mounting frame. The large and small iron ring pressing assembly presses the large iron ring. The lifting film expanding assembly moves upward to evenly expand the film on the large iron ring. The large and small iron ring pressing assembly presses downward to cause the small iron ring on it to adhere to the film on the large iron ring. It moves downward with the lifting film expanding assembly into the film cutting mechanism. The film cutting mechanism works to cut the film, realizing the transfer of the film to the small iron ring.

[0014] In one embodiment of the present invention, the large and small iron ring pressing assembly includes a large iron ring pressing ring, a first driving member and a second driving member, and a small iron ring pressing block disposed inside the large iron ring pressing ring; the first driving member is mounted on the upper mounting frame and connected to the large iron ring pressing ring, the large iron ring pressing ring being matched with the size of the large iron ring, driving the large iron ring pressing ring to move down and press against the large iron ring on the lifting and expanding film assembly; the small iron ring pressing block is connected to the ejection component mounted on the second driving member, the second driving member being mounted on the upper mounting frame and arranged parallel to the first driving member, driving the small iron ring... Small iron rings adsorbed on the pressing block move down and adhere to the membrane on the large iron ring; the small iron ring pressing block has through holes, and multiple ejection cylinders are provided on the small iron ring pressing block, with the push rods of the ejection cylinders passing through the through holes; a magnet is provided inside the small iron ring pressing block; the support plate has a first telescopic hole, and the lifting and expanding membrane assembly is installed under the support plate, which can extend or retract from the first telescopic hole; the lifting and expanding membrane assembly also includes a second lifting drive and a lifting platform, the lifting platform is installed on the second lifting drive, and a heating element and a temperature sensor are integrated inside the lifting platform.

[0015] In one embodiment of the present invention, the film cutting mechanism includes a mounting plate, a film cutting blade, and a third driving member arranged around the lifting and expanding film assembly. The mounting plate is installed under the support plate, and a through hole is provided in the mounting plate for the second lifting driving member of the lifting and expanding film assembly to pass through. Multiple film cutting blades are provided, and each film cutting blade is driven by one of the third driving members. The third driving member is installed on the mounting plate, and the film cutting blades are driven to move closer to each other to achieve inward contraction in the axial direction of the through hole to form a closed shape, so as to cut the expanded and stretched film completely off the large iron ring.

[0016] In one embodiment of the present invention, a heating and temperature control module is provided on the lower surface of the cutting blade for heating the cutting blade. There are four cutting blades in a C-shape. The third driving member drives the blade to retract inward to form a closed circle, which contacts the pulled-down film and melts it. A high-temperature resistant silicone strip is provided on the lower surface of the cutting blade near the through hole.

[0017] In one embodiment of the present invention, two sets of film expanders are provided.

[0018] The beneficial effects of this invention are as follows: This invention provides a fully automatic wafer expansion equipment. Compared with the prior art, this invention has at least the following technical effects: The originally semi-automatic expansion process is automated by using a combination of large and small iron ring loading and unloading devices and a multi-axis robot. A cutting mechanism is installed on the expansion machine for automatic cutting and separation, achieving full automation of the expansion process and achieving higher expansion efficiency and yield. The equipment uses an XYZ three-axis robot for loading. After loading, the wafer is inspected by a high-precision CCD optical module to remove defective products. Then, a multi-axis robot with double-layer special suction cups is used for loading, simultaneously adsorbing large and small iron rings and transferring them into the expansion machine. The robot places the large iron rings on the lifting expansion assembly and the small iron rings on the large and small iron ring pressing assembly. Automatic expansion operation then occurs. The equipment is equipped with two sets of expansion machines that operate alternately, improving equipment efficiency. After the film is expanded, the large iron ring is transferred to the large iron ring unloading mechanism by a multi-axis robot. The small iron ring is placed on the small iron ring detection platform, which is equipped with a high-precision CCD optical module to detect the expanded film product and check whether the expanded film gap meets the usage requirements. Then the product is automatically unloaded into the small iron ring box of the small iron ring unloading rack. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a fully automatic wafer expansion device according to the present invention.

[0020] Figure 2 This is a schematic diagram of the structure of a multi-axis robotic arm in a fully automated wafer expansion device according to the present invention.

[0021] Figure 3 This is a schematic diagram of the structure of the loading and transporting arm of a fully automatic wafer expansion device according to the present invention.

[0022] Figure 4 This is a schematic diagram of the structure of the large and small iron ring suction cups of a fully automatic wafer expansion device according to the present invention.

[0023] Figure 5 This is a schematic diagram of the small iron ring feeding mechanism of a fully automatic wafer expansion device according to the present invention.

[0024] Figure 6This is a side view of the small iron ring feeding mechanism of a fully automatic wafer expansion device according to the present invention.

[0025] Figure 7 This is a schematic diagram of the small iron ring feeding mechanism of a fully automatic wafer expansion device of the present invention in the state where the small iron ring is not loaded.

[0026] Figure 8 This is a schematic diagram of the large iron ring feeding mechanism of a fully automatic wafer expansion equipment according to the present invention.

[0027] Figure 9 This is a schematic diagram of the structure of the expander of a fully automatic wafer expansion device according to the present invention.

[0028] Figure 10 This is a cross-sectional structural diagram of the film expander of a fully automatic wafer expansion equipment according to the present invention.

[0029] Figure 11 This is a schematic diagram of the structure of the large and small iron ring clamping assembly of the wafer expansion machine in a fully automatic wafer expansion equipment according to the present invention.

[0030] Figure 12 This is a schematic diagram of the installation status of the lifting and expanding assembly and the cutting mechanism of the fully automatic wafer expansion equipment of the present invention.

[0031] Figure 13 This is a schematic diagram of the film cutting mechanism of the film expanding machine in a fully automatic wafer film expanding equipment according to the present invention.

[0032] Figure 14 This is a schematic diagram of the structure of the large iron ring detection platform of a fully automated wafer expansion equipment according to the present invention.

[0033] Explanation of reference numerals: 1-Machinery, 2-Multi-axis robot, 21-Small iron ring suction cup, 22-Large iron ring suction cup;

[0034] 3-Small and large iron ring feeding device,

[0035] 31-Large iron ring feeding rack, 311-Large iron ring feeding and placement area, 312-Large iron ring NG placement area.

[0036] 32-Small iron ring feeding mechanism, 321-First lifting drive component, 322-Small iron ring lifting plate, 323-Limiting component, 3231-Limiting plate, 3232-Limiting post.

[0037] 33-Large iron ring inspection platform, 331-Tray, 332-Mounting base, 333-Shaft drive component, 334-Second inspection CCD.

[0038] 34-Feeding and handling arm, 341-XYZ axis moving assembly, 342-Large and small iron ring suction cups, 343-First detection CCD;

[0039] 4-Size iron ring feeding device,

[0040] 41-Large iron ring unloading mechanism, 42-Small iron ring unloading rack, 421-Small iron ring unloading placement area, 422-Small iron ring NG placement area, 43-Small iron ring detection platform, 44-Unloading and handling arm;

[0041] 5-Expanding film machine

[0042] 51-Large and small iron ring clamping assembly; 511-Large iron ring clamping ring; 512-First driving component; 513-Second driving component; 514-Small iron ring clamping block; 515-Ejection cylinder.

[0043] 52-Lifting and expanding film assembly, 521-Second lifting drive component, 522-Lifting platform,

[0044] 53-Film cutting mechanism, 531-Mounting plate, 532-Film cutting blade, 533-Third drive component, 534-Heating and temperature control module, 535-Silicone strip, 54-Lower mounting bracket, 55-Upper mounting bracket, 56-Support plate;

[0045] 6 - Small iron ring, 7 - Large iron ring. Detailed Implementation

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0047] Please see Figures 1 to 14 A fully automated wafer expansion device includes a machine base 1, a multi-axis robot arm 2, and an expansion machine 5. The expansion machine 5 is located beside the machine base 1, next to the multi-axis robot arm 2. The multi-axis robot arm is mounted on the machine base 1. The machine base 1 is also equipped with a large and small iron ring feeding device 3 and a large and small iron ring unloading device 4. The expansion machine 5 includes a large and small iron ring clamping assembly 51, a lifting expansion assembly 52, and a film cutting mechanism 53. The large and small iron ring clamping assembly 51 is located above the lifting expansion assembly 52, and the film cutting mechanism 53 is arranged around the lifting expansion assembly 52. ​​The expansion machine 5 uses the large and small iron rings... The feeding device 3 feeds the material, and in conjunction with the multi-axis robot 2, it loads the small iron rings from the large and small iron rings feeding device 3 onto the large and small iron ring pressing assembly 51. The large iron ring is placed on the lifting and expanding film assembly 52. ​​Through the cooperation of the large and small iron ring pressing assembly 51 and the lifting and expanding film assembly 52, the film on the large iron ring is evenly expanded and transferred to the small iron ring. The film cutting mechanism 53 cuts to complete the conversion. The multi-axis robot 2 transports the expanded large and small iron rings to the large and small iron ring unloading device 4 to complete the unloading. This achieves automated feeding, film expansion and unloading, replacing manual labor and improving production efficiency and yield.

[0048] Please see Figures 1 to 2In one embodiment of the present invention, the multi-axis manipulator 2 is equipped with a first iron ring adsorption component. The front of the first iron ring adsorption component is used to adsorb large iron rings, and the back is used to adsorb small iron rings. When a large iron ring needs to be adsorbed, the first iron ring adsorption component rotates to face down to pick up the large iron ring from the large iron ring detection platform of the large and small iron ring feeding device or the film expander. When a small iron ring needs to be adsorbed, the first iron ring adsorption component rotates to face down to pick up the small iron ring from the small iron ring feeding mechanism of the large and small iron ring feeding device or the film expander. The film expander 5 is located beside the multi-axis manipulator 2. This facilitates the multi-axis manipulator 2 in adsorbing and loading large and small iron rings. The first iron ring adsorption assembly includes a small iron ring suction cup 21 and a small iron ring suction cup 22, which are arranged in parallel. Vacuum suction holes are arranged on the surface of the small iron ring suction cup 22 facing away from the small iron ring suction cup 21, and vacuum suction holes are arranged on the surface of the small iron ring suction cup 21 facing away from the small iron ring suction cup 22. The small iron ring suction cup 21 matches the size and shape of the small iron ring, and the small iron ring suction cup 22 matches the size and shape of the large iron ring. This facilitates the adsorption of iron rings of the corresponding size, enabling a single robotic arm to simultaneously load and unload large iron rings. Only the adsorption assembly needs to rotate, eliminating the need for two separate sets of equipment and reducing equipment procurement costs.

[0049] Please see Figure 1 , Figures 3 to 8 , Figure 14In one embodiment of the present invention, the large and small iron ring feeding device 3 is disposed on the right side of the machine base 1. The large and small iron ring feeding device 3 includes a large iron ring feeding rack 31, a small iron ring feeding mechanism 32, a large iron ring detection platform 33, and a feeding and conveying arm 34. The large iron ring feeding rack 31, the small iron ring feeding mechanism 32, and the large iron ring detection platform 33 are arranged side by side. The large iron ring feeding rack 31 is provided with multiple layers of large iron ring feeding placement area 311 and large iron ring NG placement area 312. The small iron ring feeding mechanism 32 includes a first lifting drive component 321, a small iron ring lifting plate 322, and a limiting component 323. The limiting component 323 and the small iron ring lifting plate 322 are installed on the first lifting drive component 321, and the small iron rings are placed on the small iron ring lifting plate 322. The feeding and conveying arm 34 is used to feed the large iron rings onto the machine base 1. The iron rings on the large iron ring loading rack 31 are transported to the large iron ring inspection platform 33. The large iron ring inspection platform 33 includes a tray 331 and a mounting base 332. The tray 331 is mounted on the mounting base 332 via a shaft drive component 333. A second inspection CCD 334 is installed above the tray 331. A multi-axis robot 2 picks up small iron rings 6 from the small iron ring loading mechanism 32 and picks up qualified large iron rings 7 from the large iron ring inspection platform 33. The large iron ring loading rack 31 is provided with multiple storage compartments for placing iron boxes containing large iron rings in separate areas. Unqualified large iron rings 7 are picked up by the loading and conveying arm 34 and placed into iron boxes in the large iron ring NG placement area 312. Each storage compartment is equipped with a sensor for arrival detection to determine whether an iron box containing wafers is placed in the storage compartment.

[0050] The large and small iron ring feeding device 4 includes a large iron ring feeding mechanism 41, a small iron ring feeding rack 42, a small iron ring detection platform 43, and a feeding and conveying arm 44. The large iron ring feeding mechanism 41, the small iron ring feeding rack 42, and the small iron ring detection platform 43 are arranged side by side on the left side of the machine base 1. The small iron ring feeding rack 42 has multiple layers of small iron ring feeding placement areas 421 and small iron ring NG placement areas 422. The difference between the large iron ring feeding mechanism 41 and the small iron ring feeding mechanism 32 lies in the structure of the limiting component 323; the rest of the structures are the same. The structure of the small iron ring detection platform 43 is the same as that of the large iron ring feeding mechanism 41. The structure of the large iron ring inspection platform 33 is the same as that of the small iron ring unloading rack 42. The structure of the small iron ring unloading rack 42 is the same as that of the large iron ring loading rack 31. The multi-axis robot 2 places the expanded small iron rings on the small iron ring inspection platform 43 and places the expanded large iron rings on the large iron ring unloading mechanism 41 (i.e., the waste area). The unloading and conveying arm 44 is used to transport the OK small iron rings 6 on the small iron ring inspection platform 43 to the small iron ring box in the small iron ring unloading placement area 421 in the small iron ring unloading rack 42. The NG small iron rings are placed in the small iron ring box in the NG placement area 422 through the unloading and conveying arm 44.

[0051] Please see Figure 1 , Figures 5 to 8 In one embodiment of the present invention, the limiting component 323 of the small iron ring feeding mechanism 32 includes a limiting plate 3231, which is fixed to the outer surface of the first lifting drive member 321. Limiting posts 3232 are installed on the limiting plate 3231. The limiting posts 3232 are provided with four posts that pass upward through the corresponding corners of the small iron ring lifting plate 322. The inner circumferential surface of the small iron ring 6 abuts against the outer wall of the four limiting posts 3232, thereby limiting the small iron ring 6 in the horizontal direction. The difference between the limiting component of the large iron ring unloading mechanism 41 and the limiting component 323 of the small iron ring feeding mechanism 32 is that the spacing of the four limiting posts is different. The four limiting posts of the limiting component of the large iron ring unloading mechanism 41 contact the outer circumferential surface of the large iron ring 7, clamping the large iron ring 7 between the four limiting posts. The function of the first lifting drive component 321 is that for each small iron ring fed, the small iron ring feeding mechanism 32 will drive the small iron ring placed on it to move up by the thickness of one small iron ring, ensuring that the top small iron ring of the small iron ring feeding mechanism 32 is always at the same height when the multi-axis robot 2 picks up the small iron ring, ensuring that the multi-axis robot 2 accurately picks up the small iron ring; the same applies to the large iron ring unloading mechanism 41, ensuring that the height at which the large iron ring after the film expansion is placed after the multi-axis robot 2 picks up the large iron ring is always consistent, ensuring accurate unloading.

[0052] Please see Figure 1 , Figure 3 , Figure 4 In one embodiment of the present invention, the unloading conveying arm 44 has the same structure as the loading conveying arm 34. The loading conveying arm 34 includes an XYZ axis moving assembly 341 and large and small iron ring suction cups 342. The large and small iron ring suction cups 342 are mounted on the XYZ axis moving assembly 341. A first detection CCD 343 is also mounted on the XYZ axis moving assembly 341. The surface of the large and small iron ring suction cups 3421 is provided with two circles of vacuum suction holes of different sizes. Depending on whether the large iron ring 7 or the small iron ring 6 is being transported, the system switches to the large circle vacuum suction hole or the small circle vacuum suction hole. The first detection CCD 343 is used to determine the position of the iron ring. The first detection CCD 343 on the loading conveying arm 34 checks the products in the frame one by one to see if there is any missing material. The program records the position of all iron rings, and subsequent transport operations are performed based on this position information. The unloading conveying arm 44 works similarly.

[0053] Please see Figure 1 , Figures 9 to 13In one embodiment of the present invention, the film expanding machine 5 further includes a lower mounting frame 54 and an upper mounting frame 55. The lower mounting frame 54 is provided with a support plate 56, and the upper mounting frame 55 is fixed on the support plate 56. The large and small iron ring pressing assembly 51 is installed on the upper mounting frame 55. The support plate 56 is connected to and installed with the lifting film expanding assembly 52. ​​A film cutting mechanism 53 is provided around the lifting film expanding assembly 52 inside the lower mounting frame 54. The large and small iron ring pressing assembly 51 presses the large iron ring. The lifting film expanding assembly 52 moves upward to evenly expand the film on the large iron ring 7. The large and small iron ring pressing assembly 51 presses down to drive the small iron ring on it to adhere to the film on the large iron ring. It moves downward with the lifting film expanding assembly 52 into the film cutting mechanism 53. The film cutting mechanism 53 works to cut the film, realizing the transfer of the film to the small iron ring. The large and small iron ring pressing assembly 51 includes a large iron ring pressing ring 511, a first driving member 512 and a second driving member 513, and a small iron ring pressing block 514 disposed inside the large iron ring pressing ring 511; the first driving member 512 is mounted on the upper mounting frame 55 and connected to the large iron ring pressing ring 511, the large iron ring pressing ring 511 is matched with the size of the large iron ring 7, and drives the large iron ring pressing ring 511 to move down and press the large iron ring on the lifting and expanding film assembly 52; the small iron ring pressing block 514 is connected to the ejection part of the second driving member 513, the second driving member 513 is mounted on the upper mounting frame 55 and is arranged parallel to the first driving member 512, and drives the small iron rings adsorbed on the small iron ring pressing block 514 to move down and adhere to the large iron ring. The membrane; the small iron ring pressing block 514 has a through hole, and the small iron ring pressing block 514 is provided with a plurality of ejection cylinders 515, the push rod of the ejection cylinder 515 passes through the through hole; a magnet is provided inside the small iron ring pressing block 514; the support plate 56 has a first telescopic hole, the lifting and expanding film assembly 52 is installed under the support plate 56, and can extend or retract from the first telescopic hole; the lifting and expanding film assembly 52 also includes a second lifting drive 521 and a lifting platform 522, the second lifting drive 521 is equipped with the lifting platform 522, the lifting platform 522 is provided with a heating element and integrates a temperature sensor, which heats the membrane and wafer on the lifting and expanding film assembly 52 to a specified temperature, which helps to improve the accuracy of the expanding film.The film cutting mechanism 53 includes a mounting plate 531, a film cutting blade 532, and a third driving member 533 arranged around the lifting and expanding film assembly 52. ​​The mounting plate 531 is installed under the support plate 56. A through hole is provided in the mounting plate 531 for the second lifting driving member 521 of the lifting and expanding film assembly 52 to pass through. Multiple film cutting blades 532 are provided, and each film cutting blade 532 is driven by a third driving member 533. The third driving member 533 is installed on the mounting plate 531. The third driving member 533 drives the film cutting blades 532 to move closer to each other so as to shrink inward in the axial direction of the through hole to form a closed shape, so as to cut the expanded and stretched film completely from the large iron ring. The lower surface of the cutting blade 532 is provided with a heating and temperature control module 534 for heating the cutting blade 532. There are four cutting blades 532 in a C-shape. After the third driving member drives them to retract, they form a closed circle (imitating the shape of the stretched film), which contacts the pulled film and melts it. A high-temperature resistant silicone strip 535 is provided on the lower surface of the cutting blade 532 near the through hole. The through hole and the first telescopic hole are coaxial.1. A large iron ring is placed on the lifting and expanding film assembly 52, located at the edge of the first telescopic hole of the support plate 56. A small iron ring is placed on the small iron ring pressing block 514 and fixed by magnetic adsorption. 2. The large iron ring pressing block 511 is driven downward by the first driving member 512 to press down on the large iron ring, preventing the film on the iron ring from shifting during film expansion. It stays for 30 seconds until the heating element in the lifting platform 522 heats the film on the large iron ring and the wafer to a constant temperature (which can improve the film expansion accuracy). 3. The lifting platform 522 of the lifting and expanding film assembly 52 slowly rises under the action of the second lifting driving member 521, uniformly expanding the film on the large iron ring, and the wafer on it also expands accordingly. 4. The second driving component 513 drives the small iron pressure block to press down, pressing the small iron ring onto the expanded film on the large iron ring. The small iron ring is smaller than the large iron ring. The pressing down is mainly to bond the small iron ring to the blue film on the large iron ring, thereby transferring the wafer and blue film from the large iron ring to the small iron ring; 5. Subsequently, under the drive of the second lifting and expanding assembly 52, the lifting platform 522 will first move upward a certain distance, and then move downward to the film cutting position. In order to further stretch the blue film on the side, the edge wrapping phenomenon is achieved during cutting; 6. The film is lowered to the cutting position, and the four sets of cutting blades 532 simultaneously cut the film inward under the drive of the third drive unit 533. During cutting, a portion of the blue film remains. Under the combined action of stretching and heating, the blue film shrinks, forming an edge-wrapping phenomenon. Below the cutting blades 532 is a high-temperature resistant foamed silicone strip 535. During the cutting process, it compresses the cut film between itself and the small iron ring (during the inward retraction of the cutting blades 532, the film is sandwiched between the silicone strip 535 and the small iron ring on the lifting platform). 2. Driven by the gradual movement, it gradually moves to above the edge of the small iron ring, so that the edge of the membrane can be attached to the small surface of the small iron ring, ensuring perfect edge wrapping; 7. Then the lifting and expanding membrane assembly 52 rises to the initial position, the first driving component 512 drives the large iron ring pressing ring 511 to move upward, the second driving component 513 drives the small iron ring pressing block 514 to move upward, and at the same time, the push rod of the ejection cylinder 515 on the small iron ring pressing block 514 is pushed out from the through hole, so that the large and small iron rings stay on the lifting and expanding membrane assembly 52, waiting for the multi-axis robot 2 to move them away.

[0054] Please see Figures 1 to 14 In one embodiment of the present invention, the film expanding machine 5 is provided with two sets, and the large iron ring detection platform 33 is provided with two sets. The two sets are used alternately to further improve production efficiency. Preferably, the first driving component 512, the second driving component 513, and the third driving component 533 can be telescopic cylinders, and the first lifting driving component 321 and the second lifting driving component 521 are electric telescopic cylinders.

[0055] The present invention has the following working principle:

[0056] Eleven sets of large iron ring feeding boxes (each box can hold 25 large iron rings) are manually placed on the large iron ring feeding area 311 of the large iron ring feeding rack 31. The feeding area has a frame positioning detection function. After feeding is completed, the feeding and conveying arm 34 will check the products in the box one by one to see if there are any missing materials. The program will record the position of all iron rings, and subsequent handling operations will be carried out based on this position information. Small iron rings are placed in a special small iron ring feeding mechanism 32. Small iron rings can be stacked for feeding, so a stack of products can hold 200 small iron rings. The loading and handling arm 34 has XYZ three axes. It uses the vacuum suction cups 3421 of its customized second adsorption component (large and small iron ring suction cups 3421) to pick up products. These suction cups 3421 are made of a single piece of aluminum alloy and have two rings of vacuum suction holes for the large and small iron rings. The vacuum zone automatically switches according to the product being handled, enabling the handling of two different sizes of iron rings. The large iron ring to be loaded is placed on the large iron ring detection platform 33, where it undergoes visual inspection using a second detection CCD 334. The detection mechanism has a rotating θ-axis below it, which can align the large iron ring for easy gripping by the multi-axis robotic arm. Since the large iron ring contains a wafer, the loading and handling arm 34 will detect defective products and transport them to the NG (non-performing) product storage box.

[0057] The multi-axis robotic arm 2 (which can be a six-axis robotic arm) has suction cups on both sides (i.e., small iron ring suction cup 22 and small iron ring suction cup 21). For two sizes of iron rings, it first picks up the small iron ring, rotates it 180 degrees, and then picks up the large iron ring. Then, it is transported together into the film expander 5. The large iron ring is placed on the lifting film expander assembly 52, and then the small iron ring is placed under the small iron ring pressing block 514. The small iron ring is attracted by a magnet to prevent it from falling.

[0058] Subsequently, the film expander 5 performs the film expansion operation. To improve the expansion accuracy, an additional heating and temperature control system (heating element and temperature sensor) is installed in the film expansion lifting platform to maintain the entire lifting platform 522 at a constant temperature, heating the film on the large iron ring. After the film on the large iron ring is heated to a constant temperature, the lifting platform 522 of the film expansion assembly 52 slowly rises, the film expands, and the gaps between the grains attached to the film gradually increase until the expansion ratio requirement is met. Then, the second driving component 513 drives the small iron ring to descend, pressing the small iron ring onto the blue film, where it stays for a period of time to ensure that the blue film and the small iron ring are fully bonded. A secondary film expansion process is then performed, stretching the outer blue film to a certain height before lowering it to the cutting position. Four contour-cutting blades 532, equipped with heating and temperature control modules 534 (which can be PTC heating elements and corresponding control circuit boards), are simultaneously driven inwards by a third drive unit 533. The temperature of the cutting blades 532 melts and cuts the film. Because the film itself is in a stretched state, the sudden cut causes it to shrink inwards, wrapping around the small iron ring. A high-temperature resistant soft rubber strip is located below the cutting blades 532, which can press the cut film firmly, ensuring the shrunken film adheres tightly to the small iron ring.

[0059] After cutting, the lifting platform 522 of the lifting and expanding film assembly 52 rises to the initial position. Then the large and small iron ring pressing assembly 51 rises and pushes out the small iron ring through the ejection cylinder 515 to prevent the small iron ring from rising with the small iron ring pressing block 514.

[0060] The multi-axis robot 2 picks up the large iron ring, then rotates 180° to pick up the small iron ring, places the small iron ring on the small iron ring detection platform 43, and then puts the large iron ring on the large iron ring feeding mechanism 41. The large iron rings after film expansion can be stacked. The feeding mechanism can hold 200 large iron rings at a time.

[0061] The CCD on the small iron ring inspection platform 43 will inspect the small iron rings after the film is expanded. After the inspection is completed, the small iron rings will be transported by the unloading and conveying arm 44 to the small iron ring unloading rack 42 for sorting and placement.

[0062] Several points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change.

[0063] Secondly: The accompanying drawings of the embodiments disclosed in this invention only involve the structures involved in the embodiments disclosed in this invention. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this invention can be combined with each other.

[0064] Finally, the above description is only a preferred embodiment of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of the present invention are within the scope of protection of the present invention.

[0065] It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of this invention should also be considered within the scope of protection of this invention.

Claims

1. A fully automated wafer expansion device, comprising a machine base and a multi-axis robot arm, wherein the multi-axis robot arm is mounted on the machine base, characterized in that: The system also includes a film expander, on which a large and small iron ring feeding device and a large and small iron ring unloading device are installed. The film expander includes a large and small iron ring pressing assembly, a lifting and expanding assembly, and a film cutting mechanism. The large and small iron ring pressing assembly is located above the lifting and expanding assembly, and the film cutting mechanism is arranged around the lifting and expanding assembly. The large and small iron rings are fed by the large and small iron ring feeding device, and the multi-axis robot arm loads the small iron rings from the large and small iron ring feeding device onto the large and small iron ring pressing assembly. The large iron rings are placed on the lifting and expanding assembly. The film on the large and small iron rings is evenly expanded by the large and small iron ring pressing assembly and the lifting and expanding assembly, and then transferred to the small iron rings. The film cutting mechanism cuts the film to complete the transfer. The multi-axis robot arm transports the expanded large and small iron rings to the large and small iron ring unloading device to complete the unloading. The large and small iron ring feeding device is located on the right side of the machine platform. The device includes a large iron ring feeding rack, a small iron ring feeding mechanism, a large iron ring detection platform, and a feeding and conveying arm. The large iron ring feeding rack, the small iron ring feeding mechanism, and the large iron ring detection platform are arranged side-by-side. The large iron ring feeding rack has multiple layers of large iron ring feeding and placement areas and large iron ring NG (not yet loaded) placement areas. The small iron ring feeding mechanism includes a first lifting drive component, a small iron ring lifting plate, and a limiting component. The first lifting drive component is equipped with... The limiting component and the small iron ring lifting plate are described above, with the small iron ring placed on the small iron ring lifting plate; the loading and conveying arm is used to transport the large iron ring from the large iron ring loading rack to the large iron ring detection platform, the large iron ring detection platform includes a tray and a mounting base, the tray is mounted on the mounting base via an θ-axis drive component, and a second detection CCD is set above the tray; a multi-axis robot grabs the small iron ring from the small iron ring loading mechanism, and the multi-axis robot grabs the qualified large iron ring from the large iron ring detection platform; The large and small iron ring feeding device includes a large iron ring feeding mechanism, a small iron ring feeding rack, a small iron ring detection platform, and a feeding and conveying arm. The large iron ring feeding mechanism, the small iron ring feeding rack, and the small iron ring detection platform are arranged side by side on the left side of the machine platform. The small iron ring feeding rack has multiple layers of small iron ring feeding placement areas and small iron ring NG placement areas. The difference between the large iron ring feeding mechanism and the small iron ring feeding mechanism lies in the structure of the limiting component; the rest of the structures are the same. The structure of the small iron ring detection platform is the same as that of the large iron ring detection platform. The multi-axis robot places the expanded small iron rings on the small iron ring detection platform and places the expanded large iron rings on the large iron ring feeding mechanism. The feeding and conveying arm is used to transport the small iron rings on the small iron ring detection platform to the small iron ring feeding rack.

2. The fully automated wafer expansion equipment according to claim 1, characterized in that: The multi-axis manipulator is equipped with a first iron ring adsorption component. The front of the first iron ring adsorption component is used to adsorb large iron rings, and the back is used to adsorb small iron rings. When a large iron ring needs to be adsorbed, the first iron ring adsorption component rotates to face down to pick up the large iron ring; when a small iron ring needs to be adsorbed, the first iron ring adsorption component rotates to face down to pick up the small iron ring. The film expander is located next to the multi-axis manipulator. The first iron ring adsorption component includes a small iron ring suction cup and a large iron ring suction cup. The large iron ring suction cup and the small iron ring suction cup are arranged in parallel. Vacuum suction holes are arranged on the surface of the large iron ring suction cup opposite to the surface of the small iron ring suction cup, and vacuum suction holes are arranged on the surface of the small iron ring suction cup opposite to the surface of the large iron ring suction cup. The size and shape of the small iron ring suction cup match the size and shape of the small iron ring, and the size and shape of the large iron ring suction cup match the size and shape of the large iron ring.

3. The fully automated wafer expansion equipment according to claim 1, characterized in that: The limiting component of the small iron ring feeding mechanism includes a limiting plate, which is fixed to the outer surface of the first lifting drive component. Limiting posts are installed on the limiting plate, and four of these posts pass upwards through the corresponding corners of the small iron ring lifting plate. The inner circumferential surface of the small iron ring abuts against the outer walls of the four limiting posts, thus limiting the small iron ring horizontally. The difference between the limiting component of the large iron ring unloading mechanism and the limiting component of the small iron ring feeding mechanism lies in the different spacing of the four limiting posts. The four limiting posts of the limiting component of the large iron ring unloading mechanism contact the outer circumferential surface of the large iron ring, clamping the large iron ring between the four limiting posts.

4. The fully automated wafer expansion equipment according to claim 1, characterized in that: The unloading conveying arm structure is the same as the loading conveying arm structure. The loading conveying arm includes an XYZ axis moving assembly and large and small iron ring suction cups. The large and small iron ring suction cups are mounted on the XYZ axis moving assembly. A first detection CCD is also mounted on the XYZ axis moving assembly. The surfaces of the large and small iron ring suction cups are provided with two circles of vacuum suction holes of different sizes. Depending on whether the iron ring being transported is large or small, the system switches to working with the large circle of vacuum suction holes or the small circle of vacuum suction holes. The first detection CCD is used to determine the position of the iron ring.

5. The fully automatic wafer expansion equipment according to claim 1, characterized in that: The film expanding machine also includes a lower mounting frame and an upper mounting frame. The lower mounting frame is provided with a support plate, and the upper mounting frame is fixed on the support plate. The large and small iron ring clamping components are installed on the upper mounting frame. The lifting and expanding film component is connected to the support plate. The film cutting mechanism is arranged around the lifting and expanding film component inside the lower mounting frame. The large and small iron ring clamping components clamp the large iron ring. The lifting and expanding film component moves upward to evenly expand the film on the large iron ring. The large and small iron ring clamping components press down to drive the small iron ring on it to adhere to the film on the large iron ring. Cooperating with the lifting and expanding film component, it moves downward to the film cutting mechanism. The film cutting mechanism works to cut the film and realize the transfer of the film to the small iron ring.

6. The fully automated wafer expansion equipment according to claim 5, characterized in that: The large and small iron ring pressing assembly includes a large iron ring pressing ring, a first driving member and a second driving member, and a small iron ring pressing block disposed inside the large iron ring pressing ring; the first driving member is mounted on the upper mounting frame and connected to the large iron ring pressing ring, the large iron ring pressing ring being matched with the size of the large iron ring, driving the large iron ring pressing ring to move down and press the large iron ring on the lifting and expanding film assembly; the small iron ring pressing block is connected to the ejection component mounted on the second driving member, the second driving member being mounted on the upper mounting frame and arranged parallel to the first driving member, driving the small iron rings adsorbed on the small iron ring pressing block to move down and adhere to the film on the large iron ring; the small iron ring pressing block has a through hole, and multiple ejection cylinders are disposed on the small iron ring pressing block, the push rods of the ejection cylinders passing through the through hole.

7. The fully automated wafer expansion equipment according to claim 6, characterized in that: A magnet is provided inside the small iron ring pressing block; the support plate has a first telescopic hole, and the lifting and expanding film assembly can extend or retract from the first telescopic hole. The lifting and expanding film assembly includes a second lifting drive and a lifting platform. The lifting platform is installed on the second lifting drive, and a heating element and a temperature sensor are integrated inside the lifting platform.

8. The fully automatic wafer expansion equipment according to claim 5, characterized in that: The film cutting mechanism includes a mounting plate, a film cutting blade, and a third driving component arranged around the lifting and expanding film assembly. The mounting plate is installed under the support plate and has a through hole for the second lifting driving component of the lifting and expanding film assembly to pass through. Multiple film cutting blades are provided, and each film cutting blade is driven by a third driving component. The third driving component is installed on the mounting plate and drives the film cutting blades to move closer to each other so as to shrink inward toward the axis of the through hole to form a closed shape, thereby cutting the expanded and stretched film completely off the large iron ring.

9. The fully automatic wafer expansion equipment according to claim 8, characterized in that: The lower surface of the cutting blade is provided with a heating and temperature control module for heating the cutting blade. There are four cutting blades in a C-shape. The third driving member drives the blade to retract and form a closed circle, which contacts the pulled-down film and melts it. A high-temperature resistant silicone strip is provided on the lower surface of the cutting blade near the through hole.

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