Drive plate heat sink and appliance having same
By using the structural design of heat-conducting plates and heat exchange chambers, heat dissipation is achieved through the use of heat exchange fluid, which solves the problems of poor heat dissipation and condensation in enclosed environments, and realizes the effects of flexible heat dissipation and large-area heat exchange.
Patent Information
- Application Number
- CN202211565003.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-07
- Publication Date
- 2026-01-23
- Estimated Expiration
- 2042-12-07
AI Technical Summary
Existing radiators are not effective at heat dissipation in enclosed environments. Radiators designed with refrigerants have small heat exchange areas and are prone to condensation, making them unsuitable for large-area heat exchange.
The structure adopts a heat-conducting plate, heat exchange cavity and heat conduction cavity. It uses heat exchange fluid for heat dissipation. The heat conduction cavity and heat exchange cavity are independently sealed. The heat conduction plate conducts heat to the heat exchange cavity through heat conduction plates and middle plates, which increases the heat exchange area and avoids condensation.
It enables flexible heat dissipation in different environments, increases the heat exchange area, avoids condensation, improves heat dissipation efficiency, and enhances unit performance.
Smart Images

Figure CN115811872B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of heat dissipation equipment technology, and in particular to a drive plate heat sink and an electrical appliance having the heat sink. Background Technology
[0002] Taking air conditioners as an example, some electrical appliances contain driver boards with heat-generating components. These driver boards release heat when they are working. To ensure that the driver boards can function properly, specific structural designs are needed to dissipate the heat generated by the heat-generating components.
[0003] Currently, most heat dissipation structures on the market rely on natural airflow or refrigerant to cool the drive plate. Natural airflow-based radiators are subject to significant environmental limitations; they struggle to achieve effective cooling in relatively enclosed environments lacking sufficient natural airflow. Refrigerant-based radiators require piping and clamping structures for heat dissipation, resulting in a relatively small heat exchange area. Furthermore, the drive plate area may experience condensation due to rapid cooling. Additionally, refrigerant-based radiators are unsuitable for large-area heat exchange.
[0004] To solve the above problems, it is necessary to develop a heat sink structure that is suitable for different working environments and has a relatively simple structure. Summary of the Invention
[0005] The purpose of this invention is to provide a driver board heat sink and an electrical appliance having the heat sink, so as to solve the technical problem of limited application environment of heat sinks in the prior art. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are described in detail below.
[0006] To achieve the above objectives, the present invention provides the following technical solution:
[0007] The driver board heat sink provided by the present invention includes:
[0008] A heat-conducting plate, which makes thermal contact with the drive plate to be cooled;
[0009] The heat exchange cavity is a sealed chamber formed on the side of the heat-conducting plate away from the drive plate to be cooled, and the heat exchange fluid can flow through the heat exchange cavity;
[0010] A heat-conducting cavity, wherein the heat-conducting cavity is a sealed chamber formed between the heat-conducting plate and the heat exchange cavity;
[0011] The heat-conducting cavity can conduct heat from the heat-conducting plate to the heat exchange cavity.
[0012] Based on the above technical solution, the present invention can be further improved as follows.
[0013] As a further improvement of the present invention, the drive plate heat sink also includes a middle plate fixedly connected to the heat-conducting plate, and the heat-conducting cavity is formed between the middle plate and the heat-conducting plate.
[0014] As a further improvement of the present invention, the heat-conducting plate protrudes to one side of the middle plate and forms at least one heat-conducting sheet;
[0015] The heat-conducting sheet passes through the heat-conducting cavity and makes heat-conducting contact with the middle piece;
[0016] Alternatively, the middle plate is provided with through holes, the number of which is the same as the number of heat-conducting sheets and arranged in a one-to-one correspondence, the heat-conducting sheets pass through the through holes and make thermal contact with the middle plate.
[0017] As a further improvement of the present invention, the middle plate protrudes to one side of the heat exchange cavity and forms at least one heat dissipation column.
[0018] As a further improvement of the present invention, the drive plate heat sink also includes an upper plate fixedly connected to the middle plate, and the heat exchange cavity is formed between the upper plate and the middle plate.
[0019] As a further improvement of the present invention, at least two heat dissipation holes are provided on the upper plate, and the heat exchange fluid flows into or out of the heat exchange cavity through the heat dissipation holes.
[0020] As a further improvement of the present invention, a connector is fixedly provided at the heat dissipation hole, and the pipeline for conveying heat exchange fluid is connected to the heat dissipation hole through the connector.
[0021] The present invention also provides an electrical appliance, including a drive board and a drive board heat sink as described in any of the above claims.
[0022] As a further improvement of the present invention, the electrical appliance also includes a water receiving tray, the drive plate radiator is located below the water receiving tray, and the heat exchange chamber can be connected to the drain hole of the water receiving tray through a pipe.
[0023] As a further improvement of the present invention, the appliance is an air conditioner.
[0024] Compared with the prior art, the preferred embodiment of the present invention provides the following beneficial effects:
[0025] The drive plate radiator provided by this invention is not limited by the installation environment. It can use low-temperature refrigerant for cooling as needed, or it can achieve condensate cooling by connecting to the drain outlet of the top-discharge heat pump unit's water tray. Compared with existing radiators, its piping structure is relatively simple and has a larger heat exchange area, resulting in better heat dissipation. When using low-temperature refrigerant for heat dissipation, this radiator can achieve a larger heat exchange area than traditional refrigerant radiators, resulting in better heat exchange performance. In addition, due to the presence of the heat conduction cavity, it can effectively solve the problem of condensation at the drive plate caused by excessively rapid cooling in traditional radiators, while also accelerating heat dissipation efficiency. When using air ducts and / or condensate for heat dissipation, it can indirectly conduct heat to the water tray and evaporator, helping to prevent the water tray from freezing and thus improving unit performance. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0027] Figure 1 This is an exploded view of the heat sink for the driver board of this invention;
[0028] Figure 2 This is a schematic diagram of the heat-conducting plate in the drive board heat sink of the present invention;
[0029] Figure 3 This is a schematic diagram of the structure of the middle plate in the heat sink of the drive board of the present invention;
[0030] Figure 4 This is a schematic diagram of the upper plate of the driver board heat sink of the present invention;
[0031] Figure 5 This is a schematic diagram illustrating the application of the driver board heat sink of the present invention;
[0032] Figure 6 This is a schematic diagram illustrating the working principle of a certain embodiment of the electrical appliance of the present invention;
[0033] Figure 7 This is a schematic diagram of the connection structure of another embodiment of the electrical appliance of the present invention.
[0034] In the diagram: 1. Heat-conducting plate; 11. Heat-conducting sheet; 2. Middle sheet; 21. Through hole; 22. Heat dissipation column; 3. Upper sheet; 31. Heat dissipation hole; 32. Connecting skirt; 33. Cover; 4. Connector; 5. Ear plate; 6. Drive board; 7. Water tray; 8. Piping. Detailed Implementation
[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0036] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0037] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0038] The technical solution of the present invention will be described in detail below with reference to the accompanying drawings.
[0039] The present invention provides a drive plate heat sink, which includes a heat-conducting plate 1 and a heat exchange cavity and a heat-conducting cavity formed on the side of the heat-conducting plate 1 away from the drive plate 6 to be cooled. The heat generated at the drive plate 6 can be sequentially transported to the heat-conducting cavity and the heat exchange cavity through the heat-conducting plate 1. The heat exchange cavity is filled with a heat exchange fluid that can perform heat exchange treatment.
[0040] Compared to traditional heat exchangers, this heat exchanger has a simpler structure and is easier to arrange. It is also not limited by the external environment and can flexibly select different heat exchange fluids for heat exchange according to the actual environment. Furthermore, when a refrigerant is used as the heat exchange fluid, the heat-conducting cavity located between the heat exchange chamber and the heat-conducting plate 1 can isolate and protect the heat-conducting plate 1, preventing condensation from forming on the heat-conducting plate 1 due to excessively low temperatures, effectively ensuring the safety of the drive plate 6.
[0041] It should be noted that the heat exchange chamber and the heat conduction chamber are both independently set sealed chambers. They cannot be directly connected but are in contact with each other, thus ensuring that the heat in the heat conduction chamber can easily and quickly enter the heat exchange chamber.
[0042] Example 1:
[0043] This embodiment provides a driver plate heat sink, including a heat-conducting plate 1, a heat exchange cavity, and a heat-conducting chamber. The heat-conducting plate 1 is fixedly mounted on the driver plate 6 to be cooled, allowing the heat-conducting plate 1 to conduct heat through direct contact with the driver plate 6, with the transferred heat flowing into the heat-conducting chamber. The heat-conducting chamber is located between the heat-conducting plate 1 and the heat exchange cavity and is a sealed chamber. Since the heat exchange fluid flows through the heat exchange cavity, the heat located in the heat-conducting chamber can naturally flow to the heat exchange cavity and be quickly carried away by the heat exchange fluid. Simultaneously, as heat is dissipated, the heat-conducting chamber can also continuously absorb heat from the heat-conducting plate 1, thereby achieving a good heat dissipation effect.
[0044] Both the heat exchange cavity and the heat conduction cavity are arranged on the outside of the heat conduction plate 1. In this embodiment, a middle plate 2 and an upper plate 3 are arranged outside the heat conduction plate 1, wherein the heat conduction cavity is formed between the middle plate 2 and the heat conduction plate 1, and the heat exchange cavity is formed between the middle plate 2 and the upper plate 3. Figure 1 As shown.
[0045] Specifically, in order to form a heat-conducting cavity structure between the middle plate 2 and the heat-conducting plate 1, the heat-conducting plate 1 is set to be a sheet-like structure as a whole, and the middle plate 2 arches outward relative to the heat-conducting plate 1 and has a truncated cone or similar truncated cone structure. The edge of the middle plate 2 is in direct contact with and fixedly connected to the heat-conducting plate 1.
[0046] It should be noted that the contact portion between the edge of the middle plate 2 and the heat-conducting plate 1 is sealed and there is no seam, thereby ensuring that the heat-conducting cavity formed between the middle plate 2 and the heat-conducting plate 1 is sealed.
[0047] In this embodiment, the middle piece 2 is connected to the heat-conducting plate 1 by welding to fill the assembly gap, specifically by perimeter welding.
[0048] To further improve the heat conduction rate, the heat-conducting plate 1 is provided to protrude on one side facing the middle piece 2 and form a heat-conducting sheet 11, which can pass through the heat-conducting cavity and make heat-conducting contact with the middle piece 2.
[0049] Specifically, the number of heat-conducting plates 11 is multiple, and the multiple heat-conducting plates 11 are arranged in parallel with each other, such as... Figure 2 As shown.
[0050] The upper edge of the aforementioned heat-conducting plate 11 can directly contact the side wall of the middle plate 2. At this time, the heat-conducting plate 11 can transfer the heat conducted from the heat-conducting plate 1 to the middle plate 2.
[0051] In order to improve the heat transfer efficiency, as an optional implementation, the middle plate 2 is provided with through holes 21. The number of through holes 21 is the same as the number of heat-conducting plates 11 and they are arranged in a one-to-one correspondence. The heat-conducting plates 11 pass through the through holes 21 and make thermal contact with the middle plate 2.
[0052] To ensure the airtightness of the heat-conducting cavity, the contact portion between the heat-conducting plate 11 and the through-hole 21 needs to be sealed. In this embodiment, the seal between the heat-conducting plate 11 and the through-hole 21 can be achieved by welding.
[0053] Provided that the strength of the heat-conducting plate 1 meets the requirements, the heat-conducting plate 1 and the heat-conducting sheet 11 should be made as thin as possible, so as to ensure that the heat-conducting plate 1 has a good heat dissipation effect while reducing processing costs.
[0054] At this time, heat can be transferred to the middle plate 2 via the aforementioned heat-conducting plate 11. In order to improve heat exchange efficiency and ensure that the heat exchange cavity formed between the middle plate 2 and the upper plate 3 can exchange heat better, the middle plate 2 can be configured to bulge on one side facing the heat exchange cavity and form a heat exchange column.
[0055] like Figure 3 As shown, the heat exchange column is arranged around the outer periphery of the through hole 21 and surrounds the through hole 21.
[0056] When the upper plate 3 covers the middle plate 2, the heat exchange column points towards the heat exchange cavity and can directly contact the heat exchange fluid flowing through the heat exchange cavity, thereby effectively increasing the heat exchange area.
[0057] The structure of the above-mentioned upper piece 3 is explained below:
[0058] like Figure 4 As shown, the overall structure of the upper piece 3 is similar to that of the middle piece 2, and it is a frustoconical structure. A connecting skirt 32 is formed at its edge. The upper piece 3 is fixedly connected to the main structure of the middle piece 2 through the connecting skirt 32. The main part of the upper piece 3 is a cover 33, which is a frustoconical structure. The heat exchange cavity is formed between the upper piece 3 and the middle piece 2.
[0059] Similar to the above, the connecting skirt 32 can also be sealed to the middle piece 2 by welding or other means.
[0060] To facilitate the flow of heat exchange fluid through the heat exchange cavity, as an optional implementation, at least two heat dissipation holes 31 are provided on the upper plate 3, through which the heat exchange fluid flows into or out of the heat exchange cavity.
[0061] Specifically, one of the two heat dissipation holes 31 is for the heat exchange fluid to flow in, and the other is for the heat exchange fluid to flow out. In order to ensure that the pipeline 8 for conveying the heat exchange fluid can be firmly connected to the heat dissipation hole 31, a connector 4 is fixed at the heat dissipation hole 31, and the pipeline 8 for conveying the heat exchange fluid is connected to the heat dissipation hole 31 through the connector 4.
[0062] In addition, an ear plate 5 is fixedly installed at the aforementioned heat dissipation hole 31, and the connecting connector is fixed outside the heat dissipation hole 31 via the ear plate 5.
[0063] The main body of the aforementioned radiator (including the heat-conducting plate 1, the middle plate 2, and the upper plate 3) is made of aluminum, which has good thermal conductivity, while the aforementioned connector 4 is made of carbon steel. Adjacent components are sealed together by welding.
[0064] When using this driver board heatsink, it needs to be securely mounted on the driver board 6 that requires heat dissipation, such as... Figure 5 As shown. The smooth surface (i.e. the bottom surface) of the heat-conducting plate 1 contacts the driving plate 6 for heat transfer, and the heat at the heat-conducting plate 1 can be sequentially transferred to the heat-conducting cavity, the heat-conducting sheet 11, the heat dissipation column 22 and the heat exchange cavity.
[0065] Understandably, this drive plate radiator can be used without being limited by the installation environment, and can flexibly select refrigerant and condensate as heat exchange fluids according to installation requirements and equipment requirements. Since the heat exchange and cooling steps mainly occur within the heat exchange cavity, the heat located in the heat conduction cavity can be continuously transferred to the heat exchange cavity, thereby effectively preventing heat accumulation at the drive plate 6 and the heat conduction cavity, thus achieving a better heat dissipation and cooling effect.
[0066] Example 2:
[0067] The present invention also provides an electrical appliance, including a drive board 6 and a drive board heat sink as described in any of the above claims.
[0068] As an optional implementation, the appliance is an air conditioner.
[0069] At this point, the heat exchange fluids mentioned above can be selected from refrigerant and condensate, etc., as needed.
[0070] Specifically, when refrigerant is used as the heat exchange fluid, the heat carried away by the refrigerant can be used to replenish the refrigerant vaporization, which can help improve system performance, such as... Figure 6 As shown in the diagram (the arrows indicate the refrigerant flow direction in heating mode, and the refrigerant flow direction is reversed in defrost mode), the drive plate radiator and the one-way valve are located in... Figure 6Lower left. Compared to existing air-cooled radiators used in air conditioners, this drive plate radiator has the advantage of being unaffected by the environment during installation; compared to existing refrigerant radiators, this drive plate radiator has the advantages of a larger heat exchange area and a simpler piping structure, resulting in better heat exchange performance. Furthermore, the aforementioned heat-conducting cavity serves to separate the heat exchange chamber from the heat-conducting plate 1. By adjusting the thickness of the heat-conducting cavity, a balance between heat dissipation and subcooling can be achieved, ensuring heat dissipation while preventing condensation from forming on the drive plate 6 due to rapid cooling, thus ensuring the safe operation of the drive plate 6.
[0071] Specifically, when air ducts and condensate are used as heat exchange fluids, the heat carried away by the condensate and air ducts is transferred to the evaporator, which helps to improve system performance.
[0072] like Figure 7 As shown, the radiator connector 4 can be connected to the drain hole of the water tray 7 via pipe 8, and the radiator is located below the water tray 7. Above the radiator is a fan, and at least part of the air duct is formed above the water tray 7. The arrows in the diagram indicate the airflow direction. Since the drain hole is directly opposite the air duct, a good heat dissipation effect can be achieved through the combined action of the air duct and the condensate (the liquid carrying heat can be discharged through another pipe 8). Compared with traditional air-cooled heat exchangers, this system can achieve a certain heat dissipation effect by utilizing the air duct and carrying heat to the evaporator, thereby indirectly increasing the ambient temperature of the water tray 7 and above it. This can, to some extent, prevent the water tray 7 from freezing and improve the unit's performance.
[0073] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A driver board heat sink, characterized in that, include: A heat-conducting plate, which makes thermal contact with the drive plate to be cooled; The heat exchange cavity is a sealed chamber formed on the side of the heat-conducting plate away from the drive plate to be cooled, and the heat exchange fluid can flow through the heat exchange cavity; A heat-conducting cavity, wherein the heat-conducting cavity is a sealed chamber formed between the heat-conducting plate and the heat exchange cavity; The heat-conducting cavity can conduct heat from the heat-conducting plate to the heat exchange cavity; The drive plate heat sink also includes a middle plate fixedly connected to the heat-conducting plate, and the heat-conducting cavity is formed between the middle plate and the heat-conducting plate; The heat-conducting plate protrudes towards one side of the middle piece and forms at least one heat-conducting sheet; The heat-conducting sheet passes through the heat-conducting cavity and makes heat-conducting contact with the middle piece; Alternatively, the middle piece is provided with through holes, the number of through holes being the same as the number of heat-conducting pieces and arranged in a one-to-one correspondence, the heat-conducting pieces passing through the through holes and making heat-conducting contact with the middle piece; The drive plate heat sink also includes an upper plate fixedly connected to the middle plate, and the heat exchange cavity is formed between the upper plate and the middle plate.
2. The driver board heat sink according to claim 1, characterized in that, The middle plate protrudes to one side facing the heat exchange cavity and forms at least one heat dissipation column.
3. The driver board heat sink according to claim 1, characterized in that, The upper plate is provided with at least two heat dissipation holes, through which heat exchange fluid flows into or out of the heat exchange chamber.
4. The driver board heat sink according to claim 3, characterized in that, A connector is fixedly installed at the heat dissipation hole, and the pipeline for conveying heat exchange fluid is connected to the heat dissipation hole through the connector.
5. An electrical appliance, characterized in that, Includes a driver board and a driver board heat sink according to any one of claims 1-4.
6. The electrical appliance according to claim 5, characterized in that, The appliance also includes a water tray, the drive plate radiator is located below the water tray, and the heat exchange chamber can be connected to the drain hole of the water tray through a pipe.
7. The electrical appliance according to claim 5 or 6, characterized in that, The appliance is an air conditioner.
Citation Information
Patent Citations
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