An electric heating device and method for PCB press processing

Abstract

The application relates to an electric heating device for PCB pressing processing, which comprises a preheating conveying mechanism, the preheating conveying mechanism comprises a layer plate conveying part, a first preheating part and a layer plate leveling part, the layer plate conveying part comprises a conveying device and a plurality of conveying platforms arranged on the conveying device and used for conveying respective layer plates; the first preheating part is horizontally arranged on the surface of the conveying platform, and the layer plate to be preheated is arranged on the first preheating part; the layer plate leveling part comprises a leveling roller, the leveling roller is horizontally arranged above the conveying platform, and the leveling roller is rotatably arranged on a rack, and the leveling roller is used for leveling the layer plate below after preheating. The electric heating device for PCB pressing processing provided in the application can avoid the technical problem that the layer plate is prone to local curling and affecting the alignment between the subsequent layers when the heating device for PCB pressing is used for heating the layer plate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of multi-layer PCB processing, and particularly relates to an electric heating device and method for PCB pressing processing. BACKGROUND

[0002] Multi-layer PCBs are usually made by hot pressing single-layer laminates. In order to reduce the misalignment between layers, the laminates need to be preheated to reduce thermal deformation of the laminates during subsequent hot pressing.

[0003] However, the laminates are thin and may curl locally during preheating, which may cause the distance between Mark points (pickup points) at the edges of the laminates to deviate, and thus cause errors when the laminates are picked up and stacked by a robot, resulting in misalignment between layers of the multi-layer PCB. SUMMARY

[0004] An object of the present application is to provide an electric heating device for PCB pressing processing to solve the technical problem that the laminates may curl locally during heating by a conventional heating device for PCB pressing, affecting the alignment between layers.

[0005] To achieve the above object, the present application employs the technical scheme of providing an electric heating device for PCB pressing processing, which comprises:

[0006] A preheating and conveying mechanism, which comprises a laminate conveying part, a first preheating part, and a laminate flattening part. The laminate conveying part comprises a conveying device and a plurality of conveying platforms arranged on the conveying device for conveying laminates. The first preheating part is arranged on the surface of the conveying platforms. The laminates to be preheated are arranged on the first preheating part. The laminate flattening part comprises a flattening roller, which is horizontally arranged above the conveying platforms and rotatably arranged on a rack. The flattening roller is used to flatten the laminates preheated below.

[0007] A heat preservation and heating mechanism, which is arranged in a vacuum presser at the end of the preheating and conveying mechanism. After being processed by the preheating and conveying mechanism, the laminates enter the vacuum presser for pressing.

[0008] In one embodiment, the layer plate flattening part further comprises a vacuum suction mechanism, the vacuum suction mechanism comprising a vacuum suction hole, a vacuum pipe, a valve, and a vacuum generator, the vacuum suction hole being arranged on the first preheating part below the head and tail ends of the layer plate, one end of the vacuum pipe being communicated with the vacuum suction hole, the other end of the vacuum pipe being connected with the vacuum generator, and the valve being arranged on the vacuum pipe.

[0009] In one embodiment, the preheating conveying mechanism further comprises a layer plate surface cleaning part, the layer plate surface cleaning part comprising:

[0010] a first spool rotatably arranged above the flattening roller;

[0011] a second spool rotatably arranged above the flattening roller;

[0012] a lint-free cloth strip, one end of the lint-free cloth strip being wound on the first spool, the other end of the lint-free cloth strip being wound on the second spool, and the middle section of the lint-free cloth strip being sleeved on the bottom of the flattening roller, the lint-free cloth strip being used for cleaning the surface of the layer plate.

[0013] In one embodiment, the flattening roller is provided with an elastic buffering device at both ends, the elastic buffering device comprising:

[0014] an elastic fixing seat fixed on the rack, the elastic fixing seat being provided with a sliding groove;

[0015] a sleeve rod, one end of the sleeve rod being slidably fitted in the sliding groove, and the flattening roller being rotatably arranged at the other end of the sleeve rod;

[0016] an elastic member, one end of the elastic member being connected with the sliding groove, and the other end of the elastic member being connected with the sleeve rod.

[0017] In one embodiment, the flattening roller is internally provided with a chamber, and the chamber is provided with a second preheating part.

[0018] In one embodiment, the second preheating part is a cylindrical electric heating rod, and the second preheating part is kept at the bottom of the inner wall of the flattening roller under the action of its own gravity.

[0019] In one embodiment, the chamber of the flattening roller is a vacuum.

[0020] In one embodiment, the outer surface of the flattening roller is provided with an elastic heat-conducting layer, and the contact surface between the heat-conducting layer and the outer surface of the flattening roller is a corrugated curved surface.

[0021] Another object of the present application is to provide an electric heating method for PCB pressing processing, which adopts the electric heating device for PCB pressing processing described in any one of the above embodiments, and comprises the following steps:

[0022] S1, the laminates used for pressing multilayer PCB are sequentially placed on the laminate conveying part of the preheating conveying mechanism from bottom to top;

[0023] S2, the laminates are preheated by the first preheating part on the preheating conveying mechanism;

[0024] S3, after the laminates are preheated by the first preheating part, the temperature of the laminates is increased, which causes a small amount of curling of the laminates, and further causes the distance between the MARK points on the edges of the laminates to change;

[0025] S4, when the laminates are conveyed to the laminate flattening part by the conveying platform, the laminate flattening part flattens the laminates curled due to preheating, so that the laminates return to flat plate shape and tightly adhere to the surface of the conveying platform;

[0026] S5, the laminates after flattening are moved to the vicinity of the vacuum press, and after the MARK points on the edges of the laminates are recognized by the mechanical hand, the position of the laminates is accurately judged and placed into the vacuum press;

[0027] S6, the heat preservation heating mechanism in the vacuum press further heats and preserves the laminates, so as to facilitate pressing.

[0028] The one or more technical solutions described above in the embodiments of the present application have at least the following technical effects or advantages:

[0029] The electric heating device for PCB pressing processing provided by the embodiments of the present application has the following advantages: the laminate conveying part is arranged in the preheating conveying mechanism, the laminates are conveyed by the laminate conveying part, and the laminates are heated by the first preheating part arranged on the laminates, so that the laminates are preheated while being conveyed; when the laminates are conveyed to the flattening roller of the laminate flattening part by the conveying platform, the flattening roller rotates and flattens the laminates, so that the laminates curled due to heating return to flat plate shape, and the subsequent mechanical hand can accurately pick and position the laminates through the Mark points on the laminates, and then the laminates are accurately stacked in the vacuum press for pressing, thereby reducing the probability of interlayer misalignment of the manufactured multilayer PCB. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description only constitute some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0031] Figure 1 A structural schematic diagram of an electric heating device for PCB pressing processing provided by the embodiment of the present application is shown in the figure.

[0032] Figure 2 A structural schematic diagram of a layer plate flattening part cooperating with a layer plate provided by the embodiment of the present application is shown in the figure.

[0033] Figure 3 An enlarged sectional view of a flattening roller provided by the embodiment of the present application is shown in the figure.

[0034] Figure 4 A side view of a layer plate flattening part provided by the embodiment of the present application is shown in the figure.

[0035] In the figures, various reference signs are as follows:

[0036] 1, transport platform; 2, first preheating part; 3, flattening roller; 4, vacuum adsorption mechanism; 5, layer plate surface cleaning part; 6, second preheating part; 7, layer plate; 31, elastic buffering device; 32, elastic heat conduction layer; 41, vacuum adsorption hole; 42, vacuum pipeline; 43, valve; 51, first spool; 52, second spool; 53, dust-free cloth strip; 311, elastic fixing seat; 312, sleeve rod; 313, elastic member. DETAILED DESCRIPTION

[0037] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, in which the same or similar reference signs represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0038] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0039] In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and do not connote or imply a relative importance or a specific order of precedence. Thus, features identified as "first", "second", etc. can include one or more of such features either explicitly or implicitly.

[0040] In the present application, unless specifically defined otherwise, the terms "mounting", "connecting", "connecting", "fixing" and the like should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] When manufacturing a multi-layer PCB, a plurality of single-layer boards (such as copper circuit boards, prepregs, etc.) need to be stacked according to a specific rule and then heated and pressed to press and combine into a multi-layer PCB. In order to ensure the alignment between the single-layer boards during stacking, Mark points are arranged at the two ends of the single-layer boards, which are convenient and accurate for the subsequent mechanical hand to grab the single-layer boards and improve the stacking accuracy of the single-layer boards. However, when the single-layer boards are heated and pressed, the temperature of the single-layer boards rises suddenly, causing thermal deformation of the single-layer boards, which causes the originally aligned single-layer boards to deviate, resulting in the multi-layer PCB manufactured subsequently to have layer misalignment. Therefore, the single-layer boards are preheated before stacking to avoid the phenomenon that the subsequent multi-layer PCB has layer misalignment due to the sudden temperature rise of the single-layer boards. However, when the single-layer boards are preheated, the single-layer boards still have local curling and other phenomena, which causes the mechanical hand to have a large error when grabbing the single-layer boards through the Mark points, and thus the single-layer boards have a large error during stacking. Therefore, in order to eliminate the error of the mechanical hand grabbing the Mark points caused by the curling of the single-layer boards during preheating, the present application provides the following technical solutions.

[0042] Please refer to Figures 1 to 4The embodiment of the application provides a kind of electric heating device for PCB pressing processing, including heat preservation heating mechanism, preheating transport mechanism.Preheating transport department includes layer board transport department, first preheating part 2, layer board leveling part, layer board transport department includes transmission device and the multiple transport platforms 1 for transporting each layer board on transmission device;First preheating part 2 is laid flat on the surface of transport platform 1, and the layer board to be preheated is laid on first preheating part 2;Layer board leveling part includes leveling roller 3, and leveling roller 3 is horizontally arranged above transport platform 1, and leveling roller 3 is rotatably arranged on rack, and leveling roller 3 is used to level the layer board preheated below.Heat preservation heating mechanism is arranged in vacuum press at the end of preheating transport mechanism, and the layer board is pressed in vacuum press after being processed by preheating transport mechanism.

[0043] The electric heating device for PCB pressing processing provided by the embodiment is arranged with layer board transport department in preheating transport mechanism, transports layer board through layer board transport department, and heats layer board through first preheating part 2 (which can be electric heating plate or other structures) arranged on layer board, so that layer board can be preheated while being carried, and then when transport platform 1 transports layer board to below leveling roller 3 of layer board leveling part, leveling roller 3 rotates and levels layer board, so that the layer board that is deformed due to curling caused by heating is restored to planar panel, so that subsequent mechanical hand can accurately pick up and position layer board through Mark point on layer board, and then accurately stack each layer board to vacuum press for pressing, to reduce the probability of layer misplacement phenomenon of multi-layer PCB made.

[0044] Since the friction between layer board itself and first preheating part 2 is insufficient, when leveling roller 3 levels layer board, layer board is prone to sliding displacement and other phenomena, therefore, to cooperate leveling roller 3 to level layer board, in an embodiment, layer board leveling part further includes vacuum suction mechanism 4, and vacuum suction mechanism 4 includes vacuum suction hole 41, vacuum pipeline 42, valve 43 and vacuum generator, vacuum suction hole 41 is arranged on first preheating part 2 below the head and tail end of layer board, one end of vacuum pipeline 42 is communicated with vacuum suction hole 41, the other end of vacuum pipeline 42 is connected with vacuum generator, and valve 43 is arranged on vacuum pipeline 42.When leveling roller 3 passes through the head end of layer board, valve 43 close to the head end of layer board is opened at this time, so that the head end of layer board is adsorbed on first preheating part 2, and valve 43 close to the tail end of layer board is closed, so that the tail end of layer board can move, so that layer board is in a state that one end is fixed and the other end is movable.At this time, leveling roller 3 moves from the head end of layer board to the tail end of layer board (relative movement), and levels, so that the layer board curled due to heating can be naturally unfolded under the action of leveling roller 3, to facilitate subsequent mechanical hand to pick up Mark point on layer board.

[0045] In order to keep the cleanliness of the laminates, the preheating conveying mechanism further comprises a laminate surface cleaning part 5 in an embodiment. The laminate surface cleaning part 5 comprises a lint-free cloth strip 53, a second spool 52, and a first spool 51. The first spool 51 is rotatably arranged above the leveling roller 3. The second spool 52 is rotatably arranged above the leveling roller 3. One end of the lint-free cloth strip 53 is wound on the first spool 51, and the other end of the lint-free cloth strip 53 is wound on the second spool 52. The middle section of the lint-free cloth strip 53 is sleeved on the bottom of the leveling roller 3 (wrapped on the bottom of the leveling roller 3), and the lint-free cloth strip 53 is used for cleaning the surface of the laminate. The width of the lint-free cloth strip 53 can be set to be slightly wider than the width of the laminate, so that the lint-free cloth strip 53 can completely clean the upper surface of the laminate. By placing the lint-free cloth strip 53 on the bottom of the leveling roller 3, the laminate is cleaned by the leveling action of the leveling roller 3, and the cleanliness of the laminate is ensured.

[0046] In an embodiment, the leveling roller 3 is provided with an elastic buffer device 31 at both ends. The elastic buffer device 31 comprises an elastic member 313, a sleeve rod 312, and an elastic fixing seat 311. The elastic fixing seat 311 is fixed to the frame, and the elastic fixing seat 311 is provided with a sliding groove. One end of the sleeve rod 312 is slidably fitted in the sliding groove, and the leveling roller 3 is rotatably arranged at the other end of the sleeve rod 312. The elastic member 313 is located in the sliding groove, one end of the elastic member 313 is connected with the sliding groove, and the other end of the elastic member 313 is connected with the sleeve rod 312. By arranging the elastic buffer device 31, the pressure of the leveling roller 3 on the laminate is prevented from being too large to damage the laminate.

[0047] In an embodiment, a cavity is arranged in the leveling roller 3, and a second preheating part 6 (such as an electric heating rod) is arranged in the cavity. By arranging the second preheating part 6 in the leveling roller 3, the upper surface of the laminate can be preheated when the laminate is leveled by the leveling roller 3, and the temperature uniformity of each surface of the laminate is improved.

[0048] In order to improve the utilization rate of the heat of the second preheating part 6, the second preheating part 6 is a cylindrical electric heating rod in an embodiment. The second preheating part 6 is kept at the bottom of the inner wall of the leveling roller 3 under the action of its own gravity. As shown in FIG. 6, by arranging the second preheating part 6 in a cylindrical structure, the cylindrical second preheating part 6 can be kept at the bottom of the inner wall of the leveling roller 3 when the leveling roller 3 rotates. Thus, the heat emitted by the second preheating part 6 can be directly transmitted to the laminate through the shell of the leveling roller 3. Since the second preheating part 6 is not in contact with the inner wall of the leveling roller 3 at other positions, the heat loss of the second preheating part 6 is reduced. Most of the heat generated by the second preheating part 6 can be transmitted to the laminate through the bottom of the inner wall of the leveling roller 3, and the upper surface of the laminate is heated. Figure 3 ​

[0049] In one embodiment, the chamber of the flattening roller 3 is vacuum. The vacuum chamber can effectively reduce the heat dissipation of the second preheating part 6 to other positions (positions other than the bottom) of the flattening roller 3 by convection heat exchange, further improving the heat utilization rate of the second preheating part 6. Alternatively, the flattening roller 3 is made of a metal with excellent thermal conductivity, so that the flattening roller 3 can more quickly and efficiently transfer the heat of the second preheating part 6 to the layer plate.

[0050] In one embodiment, the outer surface of the flattening roller 3 is provided with an elastic heat-conducting layer 32, and the contact surface between the heat-conducting layer and the outer surface of the flattening roller 3 is a corrugated curved surface. The specific material of the elastic heat-conducting layer 32 can be heat-conducting rubber (such as boron nitride heat-conducting rubber, aluminum oxide heat-conducting rubber, etc.). By providing the elastic heat-conducting layer 32, when the flattening roller 3 flattens the layer plate, the elastic heat-conducting layer 32 can deform, so that the contact area between the elastic heat-conducting layer 32 and the layer plate is increased.

[0051] Further reducing the pressure exerted by the flattening roller 3 on the layer plate, avoiding damage to the layer plate when the flattening roller 3 flattens the layer plate, and in addition, the elastic heat-conducting layer also has a buffering effect, further protecting the layer plate.

[0052] At the same time, by increasing the contact area between the elastic heat-conducting layer 32 and the layer plate, the contact area between the dust-free cloth belt located therebetween and the layer plate is increased, thereby increasing the real-time cleaning area of the dust-free cloth belt and improving the cleaning effect of the layer plate surface cleaning part 5.

[0053] In addition, since the elastic heat-conducting layer 32 is made of heat-conducting rubber with good heat-conducting performance, increasing the contact area between the elastic heat-conducting layer 32 and the layer plate can make the heat generated by the second preheating part 6 transferred to the flattening roller 3, and then transferred to the layer plate through the elastic heat-conducting layer 32 (the contact heat transfer efficiency is related to the heat-conducting contact area of the two, the larger the heat-conducting area, the faster the heat transfer).

[0054] Another object of the present application is to provide an electric heating method for PCB pressing processing, which uses the electric heating device for PCB pressing processing of any one of the above embodiments. The electric heating method for PCB pressing processing comprises the following steps:

[0055] S1, the layer plates used for pressing multilayer PCBs are sequentially placed on the layer plate conveying part of the preheating conveying mechanism in the order from the lower layer to the upper layer;

[0056] S2, preheat the layer plates by the first preheating part 2 on the preheating conveying mechanism;

[0057] S3. After the shelf is preheated by the first preheating section 2, the temperature rises, causing the thin sheet-like shelf to curl slightly, which in turn causes the distance between the Mark points on the edge of the shelf to change.

[0058] S4. When the transport platform 1 transports the shelf to the shelf leveling section, the shelf leveling section levels the shelf that has curled due to preheating, so that the shelf is restored to a flat shape and closely adheres to the surface of the transport platform 1.

[0059] S5. After leveling, the shelf is moved to the vicinity of the vacuum presser. The robot arm identifies the Mark points on the edge of the shelf and accurately determines the position of the shelf and puts it into the vacuum presser.

[0060] S6. The heat preservation and heating mechanism inside the vacuum press further heats and preserves the temperature of the plates to facilitate pressing.

[0061] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electric heating method for PCB press processing, which employs an electric heating device for PCB press processing, characterized by, The electric heating device for PCB pressing processing comprises: A preheating conveying mechanism, which comprises a layer plate conveying part, a first preheating part and a layer plate flattening part. The layer plate conveying part comprises a conveying device and a plurality of conveying platforms arranged on the conveying device for conveying each layer plate. The first preheating part is arranged on the surface of the conveying platform. The layer plate to be preheated is arranged on the first preheating part. The layer plate flattening part comprises a flattening roller, which is horizontally arranged above the conveying platform and rotatably arranged on a rack. The flattening roller is used for flattening the layer plate below after preheating. A heat preservation and heating mechanism arranged in a vacuum press at the end of the preheating conveying mechanism. After the layer plate is processed by the preheating conveying mechanism, it enters the vacuum press for pressing. The electric heating method for PCB pressing processing comprises the following steps: S1. The layer plates used for pressing multilayer PCBs are sequentially arranged on the layer plate conveying part of the preheating conveying mechanism from the lower layer to the upper layer. S2. The layer plates are preheated by the first preheating part of the preheating conveying mechanism. S3. After the layer plate is preheated by the first preheating part, the temperature of the layer plate rises, causing a small amount of curling of the sheet-shaped layer plate, which further causes the distance between the Mark points at the edges of the layer plate to change. S4. When the conveying platform transports the layer plate to the layer plate flattening part, the layer plate flattening part flattens the layer plate that has curled due to preheating, so that the layer plate returns to a flat state and tightly adheres to the surface of the conveying platform. S5. After flattening, the layer plate moves to the vicinity of the vacuum press, and after the Mark points at the edges of the layer plate are recognized by the mechanical hand, the position of the layer plate is accurately determined and placed in the vacuum press. S6. The heat preservation and heating mechanism in the vacuum press further heats and preserves the layer plate for pressing.

2. The electric heating method for PCB pressing processing according to claim 1, characterized in that: The layer plate flattening part further comprises a vacuum suction mechanism, which comprises a vacuum suction hole, a vacuum pipeline, a valve and a vacuum generator. The vacuum suction hole is arranged on the first preheating part below the head and tail ends of the layer plate. One end of the vacuum pipeline is connected to the vacuum suction hole, and the other end of the vacuum pipeline is connected to the vacuum generator. The valve is arranged on the vacuum pipeline.

3. The electric heating method for PCB press processing according to claim 1, characterized in that, The preheating conveying mechanism further comprises a layer plate surface cleaning part, which comprises: A first spool rotatably arranged above the flattening roller; A second spool rotatably arranged above the flattening roller; A dust-free cloth strip, one end of which is wound around the first spool, the other end of which is wound around the second spool, and the middle part of which is sleeved around the bottom of the flattening roller. The dust-free cloth strip is used for cleaning the surface of the layer plate.

4. The electric heating method for PCB press processing according to claim 1, characterized in that, Elastic buffers are arranged at both ends of the flattening roller, which comprise: An elastic fixing seat fixed to the rack, and a sliding groove arranged on the elastic fixing seat. A sleeve rod is slidably connected to one end of the sliding groove, and the leveling roller is rotatably arranged at the other end of the sleeve rod; An elastic member is arranged in the sliding groove, one end of the elastic member is connected to the sliding groove, and the other end of the elastic member is connected to the sleeve rod.

5. The electric heating method for PCB pressing processing according to claim 1, characterized in that: The leveling roller is internally provided with a chamber, and the chamber is internally provided with a second preheating part.

6. The electric heating method for PCB pressing processing according to claim 5, characterized in that: The second preheating part is a cylindrical electric heating rod, and the second preheating part is kept at the bottom of the inner wall of the leveling roller under the action of its own gravity.

7. The electric heating method for PCB pressing processing according to claim 5, characterized in that: The chamber of the leveling roller is a vacuum.

8. The electric heating method for PCB pressing processing according to claim 5, characterized in that: The outer surface of the leveling roller is provided with an elastic heat-conducting layer, and the contact surface between the elastic heat-conducting layer and the outer surface of the leveling roller is a corrugated curved surface.

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