A method for manufacturing a magnetic suspension coil mosaic plate

Abstract

The present application relates to a kind of magnetic levitation coil mosaic panel manufacturing method, the magnetic levitation coil mosaic panel is made of mother plate and daughter plate, comprising the following specific steps: front process-outer layer-welding prevention-gold conversion-molding-assembly-post process, wherein the welding prevention process is made by two times using two-color ink, and the coil is printed on the mother plate and daughter plate respectively, the molding is molded twice, and the mother plate blind hole is formed, then the daughter plate is formed according to the size of mother plate blind hole, after the mother plate and daughter plate are respectively formed, the daughter plate is embedded into the mother plate to obtain the whole mother-daughter plate.The present application realizes the embedding of daughter plate by making the welding prevention process twice and printing the coil on the mother plate and daughter plate respectively, and the whole process is simple and practical, the product quality is high, the cost is low, and batch production can be achieved.

Description

A method for manufacturing a magnetic levitation coil inlay plate Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, specifically a method for manufacturing an ultra-thick copper PCB for a new energy charging bus. Background Technology

[0002] Maglev trains, with their advantages of no wheel-rail contact, high speed, low noise, safety, and comfort, have rapidly become the main mode of transportation in urban areas, leading to increased attention on maglev technology. Currently, maglev technology is widely used in aerospace, transportation, decoration, and product design, with key functions including levitation, charging, and heating. As a new energy source, maglev technology has become a rising force in energy conservation and environmental protection. Lighting fixtures, as indispensable lighting tools in people's lives, are also moving towards maglev technology. Currently, the market is dominated by maglev products in decoration, lighting, and audio equipment. Magnetic levitation lighting design targets young people who are open to new things, have a certain purchasing power, and a love for technology. Combined with the current mainstream of smart homes and healthy living experiences, maglev lighting has a huge market potential.

[0003] With the transformation and upgrading of market products and the demand for orders, the demand for magnetic levitation coil inlay plate products has also increased. From the perspective of the technical difficulties of the product, the main challenges lie in the production and control technology of two-color ink and the control of deep tolerance of the ink. The product manufacturing process is quite difficult. Summary of the Invention

[0004] This invention provides a method for manufacturing magnetic levitation coil inlay plates that is simple in process, practical, produces high-quality products at low cost, and can be mass-produced.

[0005] To achieve the above objectives, the following technical solutions are employed.

[0006] A method for manufacturing a magnetic levitation coil inlay plate, wherein the magnetic levitation coil inlay plate is composed of a mother plate and a daughter plate, includes the following specific steps: pre-process – outer layer – solder resist – electroless gold plating – molding – assembly – post-process, wherein the solder resist process is made in two stages using two-color ink to print coils on the mother plate and the daughter plate respectively, the molding process is performed in two stages to blindly roll the mother plate, and then to roll the daughter plate according to the size of the blind roll on the mother plate, and after the mother plate and the daughter plate are rolled, they are assembled to embed the daughter plate into the mother plate to obtain the whole mother-daughter plate.

[0007] After the outer layer process, solder resist is made twice using two-color inks. Coils are printed on the mother board and daughter board respectively. After electroless gold coating, the mother board and daughter board are formed by milling in two separate processes. This process is simple and practical, with low production line investment costs. It can also achieve the integration of the daughter board into the mother board to form an integral mother-daughter board for magnetic levitation plate products. The products have high processing quality and can be mass-produced, which greatly improves the production efficiency of magnetic levitation coil inserts.

[0008] Furthermore, the outer layer process includes outer layer circuitry – outer layer etching – outer layer AOI. The outer layer process first fabricates the outer layer circuitry according to the requirements of the magnetic levitation board, then etches the outer layer according to conventional etching procedures. After etching, the board passes AOI inspection and proceeds to the next process. Boards that fail inspection flow into the rework process, ensuring that qualified products flow into the next process and guaranteeing product quality.

[0009] Furthermore, the solder resist process includes a first solder resist, text, and a second solder resist. The first solder resist is performed after the outer layer process, where the motherboard is inked and printed with coils. After the first solder resist, the text process is followed by ink curing, and then the second solder resist is performed, where the daughterboard is inked and printed with coils. The screen printing parameters for the two solder resist processes are consistent.

[0010] The above-mentioned solder resist process is carried out in two stages, one before and one after the text. The first solder resist process is performed on the motherboard, specifically by applying ink and printing coils on the motherboard. Then, the text process begins with text creation and ink curing. After the ink has cured, solder resist is applied to the daughterboard using different colored inks. Specifically, the daughterboard is then applied ink and printed with coils, so that the motherboard and daughterboard are printed with different colors to facilitate subsequent processing. The screen printing parameters for both solder resist processes are consistent to ensure that the ink thickness on the motherboard and daughterboard is the same, further ensuring product quality.

[0011] Furthermore, the thickness of the solder resist screen printing ink is all <0.3 mil. This ensures the thickness of the ink on both the mother and daughter boards, thereby guaranteeing product quality.

[0012] Furthermore, after the outer layer process and before the solder resist process, a plate grinding process is also included, which employs a sandblasting line. The addition of the plate grinding process is used to clean the stains on the plate surface, making the plate surface shiny, thus providing a basic guarantee for the subsequent solder resist process.

[0013] Furthermore, the molding process is divided into two molding stages: a first molding and a second molding. The first molding and the second molding respectively process the mother board and the daughter board. The mother board is blind-milled in two stages, and then the daughter board is milled according to the size of the blind milling of the mother board. The milling precision is high, ensuring that after the mother board and the daughter board are milled separately, the assembly of the daughter board into the mother board results in a high-quality overall mother-daughter board.

[0014] Furthermore, the first molding is blind mill molding, which includes the following steps:

[0015] S1: End mill selection: Choose a flat-headed cutter with a flat tip and a thick body;

[0016] S2: Leveling machine. A pad is added to the machine table. The pad is shaped horizontally using pre-designed milling platform data, so that all the table surfaces are controlled to be on the same horizontal plane.

[0017] S3: Positioning, using triangular positioning to mark the positioning pins of the board to be produced on the leveled table surface;

[0018] S4: Positioning motherboard, align the alignment holes on the motherboard with the positioning pins in S3 and then install it on the machine.

[0019] S5: Milling blind milling machine. Start the milling machine and mill one motherboard at a time to complete the forming blind milling of the motherboard.

[0020] The motherboard is blind-milled during the first forming process. At this time, a flat-headed milling cutter with a flat tip and a thick cutter body is selected to make the milled surface smooth. The motherboard is positioned before blind milling. The selection of the milling cutter and the positioning of the motherboard are combined to ensure the accuracy and quality of blind milling on the motherboard.

[0021] Furthermore, in step S3 above, after the positioning pins are installed, double-sided tape is applied to the leveled table surface to prevent the board from being sucked up by the vacuum cleaner. This avoids the board from warping due to excessive dust from the machine, which would affect the board's levelness and further ensure the accuracy and quality of the blind soldering of the motherboard.

[0022] Furthermore, the second forming process involves sequentially producing a sub-plate through both a rough milling machine and a fine milling machine. The overall dimensions of the sub-plate are reduced by 0.1 mm compared to the blind milling shape on the mother plate.

[0023] Furthermore, the assembly process employs a horizontal mechanical press. First, the motherboard is arranged on the machine table, and then the daughterboard is placed in the blind screw position on the motherboard. For the arranged mother and daughter board assembly, a buffer layer is horizontally rotated on the board surface, and the horizontal mechanical press is started to integrate the daughterboard into the motherboard.

[0024] Compared with existing technologies, the method for manufacturing magnetic levitation coil inlay plates of the present invention has the following advantages:

[0025] After the outer layer process, solder resist is made twice using two-color inks. Coils are printed on the mother board and daughter board respectively. After electroless gold coating, the mother board and daughter board are formed by milling in two separate processes. This process is simple and practical, with low production line investment costs. It can also achieve the integration of the daughter board into the mother board to form an integral mother-daughter board for magnetic levitation plate products. The products have high processing quality and can be mass-produced, which greatly improves the production efficiency of magnetic levitation coil inserts. Detailed Implementation

[0026] The method for manufacturing the magnetic levitation coil inlay plate of the present invention will be described in further detail below with reference to specific embodiments.

[0027] In a non-limiting embodiment of the present invention, a method for manufacturing a magnetic levitation coil inlay plate is disclosed. The magnetic levitation coil inlay plate is composed of a mother plate and a daughter plate, that is, the magnetic levitation coil inlay plate consists of two parts: a mother plate and a daughter plate. In this embodiment, the design of the data patterns of the mother plate and the daughter plate is preferably designed within the same unit and specification. Of course, the data patterns of the mother plate and the daughter plate can also be designed separately according to customer requirements. However, this separate design scheme is more expensive in terms of manufacturing cost compared to the design scheme in which the mother plate and the daughter plate are in the same unit.

[0028] In this embodiment, the process flow is illustrated using a magnetic levitation inlay board where the mother board and daughter board are in the same unit and specification. A method for manufacturing a magnetic levitation coil inlay board includes the following specific steps: pre-process – outer layer – solder resist – electroless gold plating – forming – assembly – post-process. The solder resist process uses two-color ink to create coils on both the mother board and daughter board. The forming process involves two steps: blind soldering of the mother board and then soldering the daughter board according to the size of the blind soldering on the mother board. After the mother board and daughter board are soldered, they are assembled by embedding the daughter board into the mother board to obtain the complete mother-daughter board. In this embodiment, the circuit uniformity of the magnetic levitation coil inlay board is 4 / 4 mil, and the surface copper thickness is within the specification range of 1.4 mil. In the design section, the substrate size at the cutting end is controlled within 450mm*600mm to avoid excessive size, which could lead to abnormal graphic tolerances due to expansion / contraction, uneven copper plating, etc. In this embodiment, the magnetic levitation coil inlay plate is manufactured by using two-color ink to create solder resist in two stages after the outer layer process. The coils are printed on the mother plate and the daughter plate respectively. After electroless gold plating, the mother plate and the daughter plate are formed by milling in two stages. The overall process is simple and practical, with low production line investment costs. It can also realize the embedding of the daughter plate into the mother plate to form an integral mother-daughter plate for use in magnetic levitation plate products. The product has high processing quality and can achieve mass production, which greatly improves the production efficiency of magnetic levitation coil inlay plates.

[0029] In a non-limiting embodiment of the present invention, the outer layer process includes outer layer circuitry, outer layer etching, and outer layer AOI. The outer layer process first fabricates the outer layer circuitry according to the requirements of the magnetic levitation board, then etches the outer layer according to conventional etching procedures. After etching, the board passes AOI inspection and proceeds to the next process. Boards that fail inspection flow into the rework process, ensuring that qualified products proceed to the next process and guaranteeing product quality.

[0030] In a non-limiting embodiment of the present invention, the solder resist process includes a first solder resist, text, and a second solder resist. The first solder resist is performed after the outer layer process, where the motherboard is coated with ink and coils are printed. After the first solder resist, the ink is cured in the text process, and then the second solder resist is performed, where the daughterboard is coated with ink and coils are printed. The parameters of the two solder resist screen printing processes are consistent. Specifically, the thickness of the solder resist screen printing ink is <0.3mil. In this embodiment, after the first solder resist and before the text process, exposure and development are included; after the second solder resist, exposure and development are also included. In this embodiment, the solder resist process is performed in two stages, one before and one after the text process. The first solder resist process involves solder resisting the motherboard. Specifically, the motherboard is coated with ink and printed with coils, followed by the first exposure and development. After the first exposure and development, to prevent subsequent processes from scratching the green ink surface, a white sheet is applied to the motherboard before proceeding to the text process for text creation and ink curing. After the ink cures, different colored inks are used to solder resist the daughterboard. Specifically, the daughterboard is coated with ink and printed with coils. After the second solder resist, a second exposure and development are performed. To prevent subsequent processes from scratching the green ink surface, a white sheet is applied to the motherboard before proceeding to the next process. In this embodiment, different colored inks are used for the two solder resist processes, allowing the motherboard and daughterboard to be printed with different colors, facilitating subsequent processing. The screen printing parameters for both solder resist processes are consistent, ensuring the same ink thickness on the motherboard and daughterboard, further ensuring product quality. In this embodiment, after the first printing of ink on the motherboard and the second printing of ink on the daughterboard, the inserts must be laid flat and left to stand still for more than 30 minutes. Before baking, check that there are no bubbles or ink flow on the board surface, and then expose it using an LDI machine with the exposure accuracy controlled within ±1 mil and the exposure scale controlled at 11 divisions. Mass production will begin after the first board is qualified.

[0031] In a non-limiting embodiment of the present invention, after the outer layer process and before the solder resist process, a grinding process is also included, wherein the grinding process is carried out using a sandblasting line. The addition of the grinding process is used to clean the stains on the board surface first, making the board surface shiny. Specifically, the drying section performs a full inspection of the board surface to ensure that there are no foreign objects, watermarks, oxidation and other defective quality problems on the board surface, providing a basic guarantee for the subsequent solder resist process.

[0032] In a non-limiting embodiment of the present invention, the molding process is divided into two molding stages: a first molding and a second molding. The first molding and the second molding respectively process the mother board and the daughter board. The mother board is blind-milled in two stages, and then the daughter board is milled according to the size of the blind milling of the mother board. The milling precision is high, ensuring that after the mother board and the daughter board are milled, the assembly of the daughter board into the mother board results in a high-quality overall mother-daughter board.

[0033] In a non-limiting embodiment of the present invention, the first molding is blind milling, which includes the following steps:

[0034] S1: Selection of milling cutter: Select a flat-headed cutter with a flat tip and a thick cutter body. In this embodiment, the cutter length is controlled within ±0.15mm of the depth specification.

[0035] S2: Leveling machine, add a pad to the machine table. In this embodiment, in order to ensure the consistency of the pad thickness, the milling platform data is designed. The height of ±0.05mm of the pad thickness specification is used as the parameter. The pad is formed horizontally by the pre-designed milling platform data so that the table is controlled on the same horizontal plane and the depth control accuracy is prevented from being affected by the different heights of the table.

[0036] S3: Positioning, using triangular positioning to mark the positioning pins of the board to be produced on the leveled table surface;

[0037] S4: Positioning motherboard, align the alignment holes on the motherboard with the positioning pins in S3 and then install it on the machine.

[0038] S5: Milling blind milling machine. Start the milling machine and mill one motherboard at a time to complete the forming blind milling of the motherboard.

[0039] The first forming process involves blind milling the motherboard. At this stage, a flat-head milling cutter with a flat tip and a thick cutter body is selected to ensure a smooth milled surface. The motherboard is positioned before blind milling. The selection of the milling cutter and the positioning of the motherboard are combined to ensure the accuracy and quality of the blind milling on the motherboard. In this embodiment, the first board is manufactured and tested. After the first board passes the test, batch production is carried out. Specifically, 100 pieces are used as the growth point. Every time 100 pieces are produced, the accuracy of the blind milling is monitored to ensure that the product quality is up to standard.

[0040] In a non-limiting embodiment of the present invention, after the positioning pins are applied in step S3 above, double-sided tape is applied to the leveled table surface to prevent the board from being sucked up by dust. This avoids the board from warping due to excessive dust from the machine, which would affect the board's levelness and further ensure the accuracy and quality of the blind soldering of the motherboard.

[0041] In a non-limiting embodiment of the present invention, the second forming process involves sequentially producing a sub-board through two milling plates: a rough milling plate and a fine milling plate. In this embodiment, the forming parameters are set as follows: 1PNL / stack, rotation speed S: 30KRPM, cutting speed: 0.5m / min, milling cutter size preferably 1.8mm, rough milling compensation 2.1mm, lifespan 1m; fine milling compensation 1.78mm, lifespan 3m; a paper pad is placed on the board surface; the overall dimensions of the sub-board are reduced by 0.1mm compared to the blind milling shape on the mother board, with a tolerance controlled within ±0.05mm.

[0042] Furthermore, the assembly process employs a horizontal mechanical press. First, the motherboard is arranged on the machine table, and then the daughterboard is placed in the blind screw position on the motherboard. For the arranged mother and daughter board assembly, a buffer layer is horizontally rotated on the board surface, and the horizontal mechanical press is started to integrate the daughterboard into the motherboard. Specifically, the arrangement of the motherboards is based on the size of the press table and the number of components to be assembled in each press. Calculated outwards from the center of the press table, the layout size is less than 2 / 3 of the table size to ensure balance of the pressure surface. After the motherboards are arranged, the daughterboards are manually placed onto them under pressure. Since the outer dimensions of the daughterboards are 0.1mm smaller than the dimensions of the blind solder joints on the motherboards, manual placement ensures initial embedding stability. For the arranged letter combination boards, a three-in-one release film or adhesive cushioning pad is placed horizontally on their surface as a buffer layer to prevent damage to the circuit patterns and appearance due to direct contact during pressing. The pressure is adjusted according to the depth of the blind solder joints to ensure the daughterboards are fully integrated into the motherboards, with a height tolerance within the customer-required ±0.05mm range, thus ensuring the functional integrity of the daughterboards and motherboards after component assembly.

[0043] The above embodiments are merely specific examples of the present invention, and their descriptions are quite specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these obvious substitutions all fall within the protection scope of the present invention.

Claims

1. A method for manufacturing a magnetic levitation coil inlay plate, wherein the magnetic levitation coil inlay plate is composed of a mother plate and a daughter plate, characterized in that, The process includes the following steps: pre-process – outer layer – solder resist – electroless gold coating – forming – assembly – post-process; wherein, the solder resist process is made in two stages using two-color inks. The first solder resist is applied to the motherboard and printed with coils, and the second solder resist is applied to the daughter board and printed with coils. The ink colors used for the two solder resist processes are different, and the thickness of the solder resist screen printing ink is less than 0.3 mil; the forming process is performed in two stages. The first forming is blind-spinning the motherboard, and the second forming is spinneret forming of the daughter board according to the size of the blind spinneret on the motherboard. The overall dimensions of the daughter board are 0.1 mm smaller than the blind spinneret shape on the motherboard; the assembly process uses a horizontal mechanical press. First, the motherboards are arranged on the machine table, the daughter board is placed in the blind spinneret position on the motherboard, a buffer layer is placed horizontally on the board surface, and then the horizontal mechanical press is started to press the daughter board into the motherboard.

2. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, The outer layer process includes outer layer circuit fabrication, outer layer etching, and outer layer automated optical inspection.

3. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, The solder resist process specifically includes: performing a first solder resist, printing coils on the motherboard; then proceeding to the text process to cure the ink; and then performing a second solder resist, printing coils on the daughterboard; the screen printing parameters for the two solder resist processes are consistent.

4. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, After the outer layer process and before the anti-welding process, there is also a grinding process, which uses a sandblasting line to grind the plate.

5. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, The first blind gong forming Includes the following steps: S1: Select a flat-head milling cutter with a flat tip and a thick cutter body; S2: Add a pad to the machine table and machine the pad to the same horizontal plane using the pre-designed milling platform data; S3: Use triangular positioning to make positioning pins on the pad; S4: Align and fix the alignment holes on the motherboard with the positioning pins; S5: Start the milling machine to perform blind milling on the motherboard.

6. The method for manufacturing a magnetic levitation coil inlay plate according to claim 5, characterized in that, After the positioning pin is applied in step S3, double-sided tape is attached to the pad.

7. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, The second gong plate forming process involves two separate processes: a rough gong and a fine gong, to produce the gong plate.

8. The method for manufacturing a magnetic levitation coil inlay plate according to claim 1, characterized in that, The buffer layer is a three-in-one release film or an adhesive buffer pad.