Heat dissipation device and electronic device

Abstract

The application discloses a heat dissipation device and an electronic device. The heat dissipation device is used for dissipating heat of an electronic device arranged in the heat dissipation device, and the heat dissipation device comprises a plurality of substrates, a sealing member and an elastic member. The plurality of substrates are arranged at intervals along a first direction, one of two adjacent substrates is a first substrate, and the other is a second substrate. The first substrate is provided with a groove on a side facing the second substrate, and the groove is used for accommodating the electronic device. The sealing member is connected between the two adjacent substrates and encloses the two adjacent substrates to form an accommodation space, and the accommodation space is used for accommodating a heat dissipation medium. The elastic member is arranged in the accommodation space, one end of the elastic member is used for being connected with the electronic device located in the groove, and the other end is connected with the second substrate. According to the heat dissipation device and the electronic device, the heat dissipation efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of heat sinks, and particularly relates to a heat dissipation device and an electronic device. BACKGROUND

[0002] During the working process of an electronic device, a large amount of heat is generated, and the accumulation of heat can seriously affect the working performance of the electronic device. A heat dissipation device is usually used to absorb the heat generated by the electronic device during work, and then dissipate the heat to the external environment. The connection between the electronic device and the heat dissipation device directly affects the efficiency of heat transfer from the electronic device to the heat dissipation device. The existing connection between the heat dissipation device and the electronic device is usually direct adhesion. If the thermal contact between the heat dissipation device and the electronic device is not good, the heat dissipation path will be blocked, and the heat dissipation efficiency will be affected. SUMMARY

[0003] The embodiments of the application provide a heat dissipation device and an electronic device, which can improve the heat dissipation efficiency.

[0004] The first aspect of the application provides a heat dissipation device for dissipating heat from an electronic device arranged in the heat dissipation device. The heat dissipation device comprises a plurality of substrates, a sealing member and an elastic member. The plurality of substrates are arranged at intervals along a first direction. One of the two adjacent substrates is a first substrate, and the other is a second substrate. The first substrate is provided with a groove on the side facing the second substrate, and the groove is used to accommodate the electronic device. The sealing member is connected between the two adjacent substrates and cooperates with the two adjacent substrates to form an accommodation space for accommodating a heat dissipation medium. The elastic member is arranged in the accommodation space. One end of the elastic member is used to connect with the electronic device located in the groove, and the other end is connected with the second substrate.

[0005] According to the embodiments of the first aspect of the application, the first substrate comprises an inner surface facing the second substrate and a first surface located on one side of the first substrate in a second direction. The groove comprises a first opening located on the first surface and a second opening located on the inner surface. The first direction and the second direction intersect.

[0006] According to any one of the preceding embodiments of the first aspect of the application, the heat dissipation device further comprises a barrier layer for sealing the second opening, and the elastic member is used to connect with the electronic device through the barrier layer.

[0007] According to any one of the preceding embodiments of the first aspect of the application, the heat dissipation device further comprises a heat-conducting layer arranged on the inner wall of the groove.

[0008] According to any one of the preceding embodiments of the first aspect of the application, the heat dissipation device further comprises a third substrate located on the side of the first substrate away from the second substrate. The third substrate is provided with a groove on the side facing the first substrate, and the projections of the groove of the first substrate and the groove of the third substrate along the first direction are misaligned.

[0009] According to any one of the foregoing embodiments of the first aspect of the application, a heat dissipation column is arranged on the first substrate, and the heat dissipation column is connected to the surface of the first substrate away from the groove.

[0010] According to any one of the foregoing embodiments of the first aspect of the application, at least one of the substrates comprises a through hole arranged therethrough, and the through hole is in communication with two adjacent accommodation spaces along the first direction.

[0011] According to any one of the foregoing embodiments of the first aspect of the application, the heat dissipation device further comprises a medium inlet and a medium outlet, and the medium inlet and the medium outlet are both in communication with the accommodation space.

[0012] According to any one of the foregoing embodiments of the first aspect of the application, the plurality of substrates comprises a first end plate and a second end plate, and the medium inlet and the medium outlet are both arranged on the first end plate, or both arranged on the second end plate, or arranged on the first end plate and the second end plate respectively.

[0013] The second aspect of the application provides an electronic device comprising an electronic component and the heat dissipation device according to any one of the foregoing first aspect.

[0014] The heat dissipation device and the electronic device according to the embodiments of the application, the heat dissipation device comprises a plurality of substrates, the plurality of substrates are arranged at intervals along a first direction, a groove is arranged on a first substrate, and the groove is used to accommodate an electronic component; two adjacent substrates and a sealing element arranged between the two substrates jointly form an accommodation space, and the accommodation space is used to inject a cooling medium to take away heat generated by the electronic component; one end of an elastic element is connected to a second substrate, and the other end of the elastic element is used to be connected to the electronic component located in the groove. By arranging the groove and the elastic element, the electronic component is placed in the groove, the groove plays a certain limiting role on the electronic component, and the elastic deformation of the elastic element is utilized, the compressed elastic element tightly presses the electronic component in the groove, so that the electronic component and the inner wall of the groove are tightly attached, and then the heat generated by the electronic component during operation is better transmitted to the first substrate, and the heat dissipation efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings required to be used in the embodiments of the application will be briefly introduced as follows, and other drawings can also be obtained by those of ordinary skill in the art without creative labor on the premise that the drawings are not attached.

[0016] Figure 1 It is a top view of a heat dissipation device according to the first aspect of the application;

[0017] Figure 2 It is a top view of a heat dissipation device according to the first aspect of the application; Figure 1 It is a sectional view of A-A in FIG. 4;

[0018] Figure 3A front view of a heat dissipation device according to an embodiment of the first aspect of the present application;

[0019] Figure 4 For Figure 3 A cross-sectional view of B-B.

[0020] Reference signs:

[0021] 10, heat dissipation device; 1, base plate; 11, first base plate; 111, first surface; 112, inner surface; 113, heat dissipation column; 12, second base plate; 13, groove; 131, first opening; 132, second opening; 14, third base plate; 15, first end plate; 16, second end plate; 17, through hole; 2, sealing member; 3, elastic member; 4, accommodating space; 5, bolt; 6, medium inlet; 7, medium outlet; 8, barrier layer; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0022] The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. The following detailed description is merely intended to explain the present application, and is not intended to limit the present application. The present application can be implemented without some of the specific details, which will be apparent to those skilled in the art. The following description of the embodiments is merely intended to provide a better understanding of the present application by showing examples of the present application, and in the drawings and the following description, at least some well-known structures and technologies are not shown in order to avoid unnecessary obscuring of the present application; and, for clarity, the sizes of some structures can be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0023] It should be noted that, in the present document, the meaning of "a plurality of" is two or more, unless otherwise specified. The terms "upper", "lower", "left", "right", "inner", "outer" and the like, indicate relative positions or orientations of the apparatus or elements shown in the figures, and are used merely for convenience in describing the present application and simplifying the description, and thus cannot be construed as indicating or implying that the apparatus or elements must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present application. In addition, relational terms such as first and second and the like are used merely to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such a process, method, article or device. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0024] The orientation words appearing in the following description are the directions shown in the figures, and are not specific structures of the embodiments of the present application. In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected. It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "above" another layer or another region, it can mean being directly on the other layer or another region, or containing other layers or regions between it and the other layer or another region. And if the component is turned over, the layer or the region will be "below" or "below" the other layer or another region. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] Electronic devices generate a large amount of heat during operation, and the accumulation of heat can seriously affect the working performance of the electronic devices. For example, power semiconductor modules are semiconductor assemblies used in power electronic circuits, and are usually used in vehicles, solar and industrial fields, such as inverters and rectifiers. When the power semiconductor module is working, the chip of the power semiconductor will generate a large amount of heat, and the accumulation of heat will seriously affect its working performance. With the development of chips towards high power and high integration, the problem of heat generation is increasingly prominent, and the requirement for heat dissipation is increasingly high.

[0026] The existing heat dissipation devices are various, such as the stacked heat dissipation device, which can set different numbers of heat dissipation units to expand or reduce the heat dissipation area to adapt to different electronic devices, or can simultaneously dissipate heat for multiple electronic devices to realize integration and miniaturization. However, the existing stacked heat dissipation device only considers the structure of the heat dissipation device itself, and does not consider the heat path connection between the heat dissipation device and the electronic device. The connection between the electronic device and the heat dissipation device directly affects the efficiency of heat transfer from the electronic device to the heat dissipation device. The existing connection between the heat dissipation device and the electronic device is usually directly attached, and the heat contact between the heat dissipation device and the electronic device is not good, which will cause poor heat dissipation path and affect the heat dissipation efficiency.

[0027] To solve the above problems, the embodiments of the present application provide a heat dissipation device and an electronic device, which can improve the heat dissipation efficiency. The embodiments of the heat dissipation device and the electronic device will be described below with reference to the accompanying drawings.

[0028] Please refer to Figures 1 to 4 The first aspect of the present application provides a heat dissipation device 10 for dissipating heat from an electronic device arranged in the heat dissipation device 10. The heat dissipation device 10 comprises a plurality of substrates 1, a sealing member 2 and an elastic member 3. The plurality of substrates 1 are arranged at intervals along a first direction X. One of the two adjacent substrates 1 is a first substrate 11, and the other is a second substrate 12. The first substrate 11 is provided with a groove 13 on the side facing the second substrate 12, and the groove 13 is used to accommodate the electronic device. The sealing member 2 is connected between the two adjacent substrates 1 and forms a containing space 4 together with the two adjacent substrates 1. The containing space 4 is used to accommodate a heat dissipation medium. The elastic member 3 is arranged in the containing space 4. One end of the elastic member 3 is used to connect with the electronic device located in the groove 13, and the other end is connected with the second substrate 12.

[0029] The heat dissipation medium passes between the two adjacent substrates 1 to take away the heat transferred from the electronic device to the substrate 1. The heat dissipation performance of the substrate 1 should be good. Optionally, the material of the substrate 1 is copper. The heat dissipation medium can be water or a mixture of water and ethylene glycol. Optionally, a heat dissipation channel is also arranged between the two substrates 1, and the heat dissipation medium flows along the heat dissipation channel. The plurality of substrates 1 are tightly connected by bolts 5. Optionally, the number of bolts 5 is 4, and the shape of the substrate 1 is rectangular. The four bolts 5 are arranged at the four corners of the substrate 1.

[0030] One of the two adjacent substrates 1 is the first substrate 11, and the other is the second substrate 12. The first substrate 11 is provided with a groove 13 on the side facing the second substrate 12. It should be understood that the same substrate 1 can be either the first substrate 11 or the second substrate 12 relative to its adjacent substrate 1. Specifically, there are two substrates 1 adjacent to the same substrate 1, which are located on both sides of the substrate 1. The substrate 1 is the first substrate 11 relative to one of its adjacent two substrates 1, and can be the first substrate 11 or the second substrate 12 relative to the other. That is, among the two adjacent surfaces of the two adjacent substrates 1, the substrate 1 with the groove 13 is the first substrate 11, and the other substrate 1 is the second substrate 12.

[0031] The seal 2 can be connected to the edge of the substrate 1 to form a closed containing space 4 with the two adjacent substrates 1 to prevent the leakage of the heat dissipation medium from damaging the external circuit or other structures. One end of the elastic member 3 is connected to the second substrate 12. After the electronic device is placed in the groove 13, the end of the elastic member 3 away from the first substrate 11 abuts against the electronic device. The compressed elastic member 3 makes the electronic device tightly fit the bottom wall of the groove 13, reduces the contact thermal resistance, and improves the heat dissipation efficiency. Optionally, the elastic member 3 is a spring.

[0032] The heat dissipation device 10 of the embodiment of the application includes a plurality of substrates 1, which are arranged at intervals along the first direction X. The first substrate 11 is provided with a groove 13 for accommodating an electronic device. Two adjacent substrates 1 and a seal 2 arranged between the two substrates 1 form a containing space 4 in which a cooling medium is injected to take away the heat generated by the electronic device. One end of an elastic member 3 is connected to the second substrate 12, and the other end is used to connect the electronic device located in the groove 13. By arranging the groove 13 and the elastic member 3, the electronic device is placed in the groove 13, which plays a certain limiting role on the electronic device. The elastic deformation of the elastic member 3 compresses the electronic device tightly in the groove 13, so that the electronic device and the inner wall of the groove 13 are tightly fitted, and the heat generated by the electronic device during operation is better transmitted to the first substrate 11, improving the heat dissipation efficiency.

[0033] In some alternative embodiments, the first substrate 11 includes a first surface 111 on a side of the first substrate 11 in the second direction Y and an inner surface 112 facing the second substrate 12, the recess 13 includes a first opening 131 on the first surface 111 and a second opening 132 on the inner surface 112, and the first direction X and the second direction Y are perpendicular to each other. That is, the recess 13 is in communication with the outside in both the first direction X and the second direction Y, and the elastic member 3 can abut against the electronic device in the recess 13 via the second opening 132. When the electronic device is installed, the electronic device can be inserted into the recess 13 via the first opening 131. Meanwhile, after the electronic device is installed in the recess 13, the lead terminal can connect the electronic device and the external circuit via the first opening 131. Alternatively, the first openings 131 of the recesses 13 on the plurality of first substrates 11 face the same direction, and the lead terminal is on the same side of the substrate 1, so as to facilitate the direct connection of the plurality of electronic devices and the external circuit.

[0034] In these alternative embodiments, the recess 13 has the first opening 131 and the second opening 132, so as to facilitate the installation of the electronic device in the recess 13 and the abutment of the elastic member 3 against the electronic device.

[0035] In some alternative embodiments, the heat dissipation device 10 further includes a barrier layer 8 for sealing the second opening 132, and the elastic member 3 is used to connect the electronic device through the barrier layer 8. The barrier layer 8 is used to separate the recess 13 and the accommodation space 4. The size of the barrier layer 8 can be only arranged on the second opening 132 of the recess 13, or can completely cover the inner surface 112 of the first substrate 11, so as to better separate the accommodation space 4 and the recess 13. Alternatively, the barrier layer 8 is made of a flexible material, and the end of the elastic member 3 away from the second substrate 12 abuts against the barrier layer 8, so as to tightly press the electronic device in the recess 13. Alternatively, the barrier layer 8 is a waterproof layer.

[0036] In these alternative embodiments, after the electronic device is installed in the recess 13 and the heat dissipation medium is circulated in the accommodation space 4, the barrier layer 8 isolates the electronic device and the heat dissipation medium, so as to avoid damage to the electronic device caused by the heat dissipation medium. The elastic member 3 connects the electronic device through the barrier layer 8, so as to tightly press the electronic device in the recess 13.

[0037] In some alternative embodiments, the heat dissipation device 10 further includes a heat-conducting layer (not shown in the figure) arranged on the inner wall of the recess 13. Alternatively, the heat-conducting layer is a heat-conducting silicone grease, which has high heat conductivity and is an insulating material. The heat-conducting layer is arranged on the inner wall of the recess 13. It should be understood that the heat-conducting layer is at least arranged on the bottom wall of the recess 13, so that the heat generated by the electronic device can be transmitted from the bottom wall of the recess 13 to the first substrate 11. The shape of the recess 13 can be adapted to the electronic device, and the heat-conducting layer is arranged on the bottom wall and the side wall of the recess 13, so that the heat-conducting layer is in complete contact with the electronic device.

[0038] In these alternative embodiments, a heat-conducting layer is arranged between the electronic device and the groove 13, reducing the contact thermal resistance, so that the heat generated by the electronic device can be transferred to the first substrate 11 more quickly, improving the heat dissipation efficiency.

[0039] In some alternative embodiments, as shown in Figure 3 The heat dissipation device 10 further comprises a third substrate 14, which is located on the side of the first substrate 11 away from the second substrate 12. The third substrate 14 is provided with a groove 13 on the side facing the first substrate 11, and the projections of the groove 13 of the first substrate 11 and the groove 13 of the third substrate 14 along the first direction X are staggered. It should be understood that the same substrate 1 can be the first substrate 11, the second substrate 12, or the third substrate 14. The number of substrates 1 can be multiple, and any three substrates 1 arranged in series are the third substrate 14, the first substrate 11, and the second substrate 12, respectively.

[0040] In these alternative embodiments, the projections of the groove 13 of the first substrate 11 and the groove 13 of the third substrate 14 along the first direction X are staggered, in other words, the projections of the grooves 13 located on the adjacent two substrates 1 along the first direction X are staggered, and the heat generated by the electronic device located in the groove 13 will not be concentrated in a certain area, and the electronic devices between the adjacent substrates 1 have less mutual influence, which is more conducive to heat dissipation.

[0041] In some alternative embodiments, the first substrate 11 is provided with a heat dissipation column 113 connected to the surface of the first substrate 11 away from the groove 13. The heat dissipation column 113 extends along the first direction X, and the shape of the heat dissipation column 113 can be cylindrical, elliptical cylindrical, quadrangular prism, water drop-shaped, etc. In these alternative embodiments, the heat dissipation column 113 is connected to the surface of the first substrate 11 away from the groove 13, and the heat generated by the electronic device is transferred from the bottom wall of the groove 13 to the first substrate 11. The area of the first substrate 11 located adjacent to the groove 13 has a higher heat, and the heat dissipation column 113 is arranged to increase the contact area with the heat dissipation medium, further improving the heat dissipation efficiency.

[0042] Please refer to Figure 3 and Figure 4 In some alternative embodiments, the heat dissipation device 10 further comprises a medium inlet 6 and a medium outlet 7, both of which are in communication with the containing space 4.

[0043] The number of medium inlets 6 and medium outlets 7 can be the same as the number of containing spaces 4, that is, each containing space 4 corresponds to one medium inlet 6 and one medium outlet 7. In this embodiment, the electronic devices between the adjacent two layers of substrates 1 have their own heat dissipation medium, and the heat dissipation between the electronic devices located in different layers is independent of each other and does not affect each other, and the heat dissipation rate is high.

[0044] Optionally, the number of the medium inlet 6 and the medium outlet 7 can be one, and at least one of the substrates 1 includes a through hole 17 penetratingly arranged, the through hole 17 communicating two adjacent accommodating spaces 4 along the first direction X.

[0045] In these optional embodiments, the through hole 17 is arranged on the substrate 1 to communicate the adjacent accommodating spaces 4, so that the heat dissipation medium entering through the medium inlet 6 can flow through all the accommodating spaces 4 in turn and finally flow out from the medium outlet 7, thereby playing a heat dissipation effect on all the electronic devices in the heat dissipation device 10. After the communication of the plurality of accommodating spaces 4, only one medium inlet 6 and one medium outlet 7 need to be arranged, which is convenient for processing.

[0046] In some optional embodiments, the plurality of substrates 1 includes a first end plate 15 and a second end plate 16, and the medium inlet 6 and the medium outlet 7 are arranged on the first end plate 15, or arranged on the second end plate 16, or arranged on the first end plate 15 and the second end plate 16 respectively. The first end plate 15 and the second end plate 16 are the substrates 1 located at the two ends along the first direction X in the plurality of substrates 1.

[0047] In these optional embodiments, whether the medium inlet 6 and the medium outlet 7 are arranged on the first end plate 15 or the second end plate 16 or arranged on the first end plate 15 and the second end plate 16 respectively, the heat dissipation medium entering from the medium inlet 6 needs to flow through all the accommodating spaces 4 before flowing out from the medium outlet 7, thereby playing a heat dissipation effect on all the electronic devices in the heat dissipation device 10.

[0048] The second aspect embodiment of the present application provides an electronic device, which includes electronic devices and the heat dissipation device 10 of any one of the foregoing first aspect embodiments, and the electronic devices are arranged in the groove 13. The number of the substrates 1 of the heat dissipation device 10 is arranged according to the number of the electronic devices.

[0049] The electronic device has the related structure of the heat dissipation device 10 of the foregoing first aspect embodiment, and can refer to the heat dissipation device 10 provided in the foregoing embodiments, and has all the beneficial effects of the foregoing heat dissipation device 10. To avoid repetition, details are not described herein.

[0050] In some optional embodiments, the surface of the electronic device facing the groove 13 is provided with a second heat conduction layer, the second heat conduction layer connects the electronic device and the inner wall of the groove 13, reduces the contact thermal resistance, and makes the heat generated by the electronic device be transmitted to the heat dissipation device 10 faster.

[0051] In accordance with the embodiments of the application described above, these embodiments are not meant to be exhaustive or limiting of the application. Many modifications and variations of the described embodiments will be apparent to those of ordinary skill in the art having the benefit of the teachings of this application. It is intended that the scope of the application encompass these and all such modifications and variations.

Claims

1. A heat dissipating device for dissipating heat from an electronic device disposed within said heat dissipating device, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a plurality of substrates, the substrates are arranged at intervals along a first direction, one of two adjacent substrates is a first substrate, and the other is a second substrate, the first substrate is provided with a groove on a side facing the second substrate, and the groove is used for accommodating an electronic device; A sealing member is connected between the two adjacent substrates and encloses a containing space with the two adjacent substrates, and the containing space is used for accommodating a heat dissipation medium; An elastic member is arranged in the containing space, one end of the elastic member is used for connecting with the electronic device in the groove, and the other end is connected with the second substrate; The heat dissipation device further comprises a barrier layer, the barrier layer is used for separating the groove and the containing space, and the elastic member is used for connecting with the electronic device through the barrier layer.

2. The heat dissipating device according to claim 1, wherein The first substrate comprises an inner surface facing the second substrate and a first surface on a side of the first substrate in a second direction, the groove comprises a first opening on the first surface and a second opening on the inner surface, and the first direction and the second direction intersect.

3. The heat dissipating device according to claim 2, wherein The barrier layer is used for sealing the second opening.

4. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises: A heat-conducting layer is arranged on an inner wall of the groove.

5. The heat dissipating device of claim 1, wherein The heat dissipation device further comprises a third substrate, the third substrate is arranged on a side of the first substrate away from the second substrate, the third substrate is provided with a groove on a side facing the first substrate, and the groove of the first substrate and the groove of the third substrate are misaligned in projection along the first direction.

6. The heat dissipating device of claim 1, wherein A heat dissipation column is arranged on the first substrate, and the heat dissipation column is connected with a surface of the first substrate away from the groove.

7. The heat dissipating device of claim 1, wherein At least one substrate comprises a through hole arranged through the substrate, and the through hole is connected with two adjacent containing spaces along the first direction.

8. The heat dissipating device of claim 1, wherein, The heat dissipation device further comprises a medium inlet and a medium outlet, and the medium inlet and the medium outlet are connected with the containing space.

9. The heat dissipating device of claim 8, wherein, The plurality of substrates comprise a first end plate and a second end plate, and the medium inlet and the medium outlet are arranged on the first end plate, or arranged on the second end plate, or arranged on the first end plate and the second end plate.

10. An electronic device, comprising: The heat dissipation device is used for dissipating heat of an electronic device.

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