5g circuit board pcb manufacturing method

Abstract

The application is a divisional application of application No. 202110464268.0. The 5G circuit board PCB manufacturing method comprises the following steps: S1: cutting; S2: inner layer circuit; S3: first inspection; S4: pressing plate; S5: drilling; S6: copper sinking and plate surface electroplating; S7: pattern electroplating; S9: resin hole plugging; S10: resin grinding; S11: automatic optical inspection; S12: copper sinking and VCP electroplating; S13: outer layer circuit pattern transfer; S14: pattern electroplating, a layer of tin is plated on the circuit pattern as an anti-etching protective layer of the circuit; S15: outer layer etching plate, forming an outer layer circuit pattern; S16: second inspection, passing through a reflow soldering furnace; S17: WF+two-dimensional code / character jet printing, a layer of uniform photosensitive solder resist ink is printed on the circuit board; S18: measuring impedance and Lowloss; S19: post-processing. The 5G circuit board PCB manufacturing method is provided, by canceling the tin plating process and etching process in step S7, two processes are optimized, and the problem of complicated existing production technology process is solved.

Description

[0001] This application is a divisional application, the original application's application number is 202110464268.0, the application date is April 28, 2021, and the invention name is "5G mainboard circuit board production method".

TECHNICAL FIELD

[0002] The present application relates to the field of circuit board, in particular to a 5G circuit board PCB manufacturing method.

BACKGROUND

[0003] With the rapid development of communication technology and the commercialization of 5G, as the most core material in the 5G industry chain, the design and manufacturing of electronic circuit board (PCB) will be unstoppable towards high frequency and high speed development trend, and high frequency and high speed circuit board PCB will further deepen the application in 5G communication field. 5G brings opportunities to the PCB industry, but also puts forward higher and more stringent requirements on technology, and its indicators in signal transmission speed, integration, heat dissipation and multi-layer are much higher than those of 4G. The existing 5G circuit board PCB manufacturing method is: cutting, inner layer one inspection, pressing plate, drilling + first gong, copper plating / plate surface electroplating, pattern electroplating (copper plating and tin plating), back drilling, etching, back drilling test, resin plug hole, resin grinding, automatic optical inspection AOI, copper plating / VCP, outer layer circuit, pattern electroplating (tinning), outer layer etching plate), two inspections (passing through IR furnace), WF + two-dimensional code, impedance + low loss, high voltage test, gold plating, character, gong plate, ET, FQC, PK. The existing 5G circuit board PCB manufacturing technology still has the defect of complicated production process, which leads to difficult improvement of production efficiency and difficult reduction of production cost.

SUMMARY

[0004] The present application solves the technical problem of complicated production process in the existing 5G circuit board PCB manufacturing method, and provides a 5G circuit board PCB manufacturing method with simple structure and reasonable design.

[0005] The present application is realized by the following technical scheme:

[0006] The 5G circuit board PCB manufacturing method comprises the following steps:

[0007] S1: cutting, cutting the copper-clad plate to form an inner layer copper-clad plate;

[0008] S2: inner layer circuit, a layer of photosensitive material is attached to the copper foil on the surface of the inner layer copper-clad plate, and after etching and developing, an inner layer circuit pattern is formed;

[0009] S3: one inspection, quality inspection is performed on the inner layer copper-clad plate after step S2;

[0010] S4: Pressing, the inner layer copper clad plate passed through quality detection and resin film are arranged in a preset arrangement mode, and then are subjected to pressing treatment to form a laminated circuit board;

[0011] S5: Drilling, drilling a through hole in the laminated circuit board;

[0012] S6: Copper deposition and surface plating, wherein the copper deposition is a method for depositing a copper layer in the through hole to make the through hole a conductive hole; and the surface plating is a method for plating the laminated circuit board to form a conductive copper layer on the surface of the laminated circuit board;

[0013] S7: Pattern plating, the conductive copper layer reaches a preset thickness;

[0014] S8: Back drilling, using mechanical drilling to make the conductive hole reach a preset depth;

[0015] S9: Resin hole plugging, using vacuum resin hole plugging, the conductive hole is divided into a resin-plugged hole and a non-resin-plugged hole;

[0016] S10: Resin grinding, grinding the excess resin after the resin-plugged hole is ground;

[0017] S11: Automatic optical inspection, checking the plugging degree;

[0018] S12: Copper deposition and VCP plating, plating the hole after the resin-plugged hole to be filled, and making the copper thickness of the non-resin-plugged hole and the surface reach a preset finished product copper layer thickness through VCP plating;

[0019] S13: Outer layer circuit pattern transfer, pasting a layer of dry film photosensitive material on the copper foil surface of the laminated circuit board, and then performing alignment exposure through a laser direct imaging technology, and forming a circuit pattern after development;

[0020] S14: Pattern plating, plating a layer of tin on the circuit pattern as an anti-etching protective layer of the circuit;

[0021] S15: Outer layer etching, forming an outer layer circuit pattern;

[0022] S16: Second inspection, passing through a reflow soldering furnace;

[0023] S17: WF+two-dimensional code / character printing, printing a layer of uniform photosensitive solder resist ink on the circuit board;

[0024] S18: Measuring impedance and Lowloss, measuring the impedance module and Lowloss in the production board;

[0025] S19: Post-processing.

[0026] The 5G circuit board PCB manufacturing method as described above, in step S4, uses plastic rivets for compression treatment.

[0027] The 5G circuit board PCB manufacturing method as described above, in step S5, the through hole is drilled once, and phenolic pad is used for production during the period, melamine pad is used as cover plate, and cover plate is drilled with pipe hole first.

[0028] The 5G circuit board PCB manufacturing method as described above, in step S8, further comprises the following steps:

[0029] S801: Use mechanical drilling to make the through hole reach the preset depth;

[0030] S802: Drill off the through hole section without connection or transmission effect;

[0031] S803: After back drilling, high pressure washing is used;

[0032] S804: Full inspection of aluminum sheet cover plate to prevent drilling leakage by using hole machine.

[0033] The 5G circuit board PCB manufacturing method as described above, in step S10, the excess resin includes the resin protruding from the hole after the hole is plugged, and the resin on the board surface.

[0034] The 5G circuit board PCB manufacturing method as described above, in step S15, further comprises the following steps:

[0035] S1501: Remove the film;

[0036] S1502: Etching;

[0037] S1503: One-time tin removal;

[0038] S1504: Dry film removal;

[0039] S1505: Etching the part of copper under the dry film which is not protected by tin;

[0040] S1506: Second time tin removal, until the circuit under the tin is exposed, that is, the outer layer circuit pattern is formed.

[0041] The 5G circuit board PCB manufacturing method as described above, in step S16, further comprises the following steps:

[0042] S1601: Check the outer layer circuit with optical inspection equipment;

[0043] S1602: Put the circuit board detected through the reflow soldering furnace.

[0044] The 5G circuit board PCB manufacturing method as described above, in step S19, further comprises the following steps:

[0045] S1901: gold sinking;

[0046] S1902: plate beating;

[0047] S1903: ET;

[0048] S1904: FQC;

[0049] S1905: FQC.

[0050] The 5G circuit board PCB manufacturing method as described above, in step S9, further comprises the following steps:

[0051] S901: increase the grinding plate before resin plug hole;

[0052] S902: roughen the copper surface.

[0053] Compared with the prior art, the present application has the following advantages:

[0054] The present application provides a 5G circuit board PCB manufacturing method, by canceling the tin plating process and etching process in step S7, optimizing two processes, solving the problem of complicated process of existing production technology. Achieve the purpose of providing production efficiency and reducing production cost. BRIEF DESCRIPTION OF DRAWINGS

[0055] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0056] Figure 1 is the process flow chart of the present application. DETAILED DESCRIPTION

[0057] In order to make the technical problems and beneficial effects of the present application more clear, the following will be further described in detail by combining with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application.

[0058] When the present application refers to "first", "second" and other ordinal numbers, unless it expresses the order according to the context, it should be understood as only for distinguishing.

[0059] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0060] 5G line board PCB manufacturing method, comprising the following steps:

[0061] S1: cutting, cutting the copper clad plate to form an inner layer copper clad plate; in this embodiment, high frequency high speed copper clad plate is used, and after cutting, the surface is also cleaned and dried.

[0062] S2: inner layer circuit, a layer of photosensitive material is pasted on the copper foil of the inner layer copper clad plate, and after etching and developing, the inner layer circuit pattern is formed; in this step, black film is used for alignment exposure, and after etching and developing, the inner layer circuit pattern is formed.

[0063] S3: inspection, quality detection is carried out on the inner layer copper clad plate after step S2;

[0064] S4: pressing plate, the inner layer copper clad plate passing through quality detection is arranged with resin film according to the preset arrangement mode, and then pressing treatment is carried out, so as to form laminated circuit board;

[0065] S5: drilling, drilling through holes in the laminated circuit board;

[0066] S6: copper deposition and plate surface electroplating, wherein the copper deposition is a method for depositing a layer of copper layer in each layer of the laminated circuit board in the through hole by copper deposition, so as to form a through hole; the plate surface electroplating is a method for electroplating the laminated circuit board by full plate electroplating, so as to form a conductive copper layer on the through hole and the plate surface of the laminated circuit board;

[0067] S7: pattern electroplating, so that the conductive copper layer reaches the preset thickness; copper plating is used to thicken the hole and the circuit copper layer, and improve the plating quality.

[0068] S8: back drilling, using mechanical drilling to make the through hole reach the preset depth;

[0069] S9: resin hole plugging, using vacuum resin hole plugging, the through hole is divided into resin hole plugging hole and non-resin hole plugging hole;

[0070] S10: resin grinding, grinding the excess resin after resin hole plugging;

[0071] S11: Automatic optical inspection, check the fullness of the plug hole; in this embodiment, a resin plug hole special automatic optical inspection machine is used to check the fullness of the plug hole at 100%;

[0072] S12: Copper plating and VCP plating, the holes after resin plug are plated and filled flat, and the copper thickness of the holes other than the resin plug and the copper on the surface of the plate reaches the preset finished product copper thickness through VCP plating;

[0073] S13: Outer layer circuit pattern transfer; a layer of dry film photosensitive material is pasted on the surface of the copper foil of the laminated circuit board, and then alignment exposure is performed through laser direct imaging technology, and after development, a circuit pattern is formed;

[0074] S14: Pattern plating, a layer of tin is plated on the circuit pattern as an anti-etching protective layer of the circuit;

[0075] S15: Outer layer etching, forming an outer layer circuit pattern;

[0076] S16: Second inspection, i.e. passing through a reflow soldering furnace; optical inspection equipment is used to check quality defects such as open circuit and short circuit of the outer layer circuit and appearance defects, and after inspection, the reflow soldering furnace is passed through, so that thermal stress is reduced and the dimensional stability of the high-frequency high-speed 5G mainboard circuit board is improved.

[0077] S17: WF+two-dimensional code / character jet printing, a layer of uniform photosensitive solder resist ink is printed on the circuit board; the production method of characters of the 5G mainboard circuit board is changed from silk printing to jet printing, and the two-dimensional code traceability information is jet printed at the same time: silk printed characters need to be cured after PCB solder resist, then the characters are silk printed through a screen, and finally the characters are baked at high temperature again. The jet printed characters are jet printed before the PCB is cured at high temperature with the solder resist, and the jet printed characters are cured at high temperature with the solder resist. Compared with silk printing, the jet printing production method reduces one high-temperature process, and at the same time, the screen tool is no longer needed, and the production efficiency is greatly improved. A layer of uniform photosensitive solder resist ink is printed on the circuit board to achieve the purpose of solder resist and insulation, and the jet printed two-dimensional code traceability information and marking characters are made before the solder resist ink is cured at high temperature.

[0078] S18: Measure impedance and Lowloss, measure the impedance module and Lowloss in the production board;

[0079] S19: Post-processing.

[0080] The application provides a 5G circuit board PCB manufacturing method, which cancels the tinning process and etching process in step S7, optimizes two processes, and solves the problem of complicated existing production technology process. The purpose of providing production efficiency and reducing production cost is achieved. The etching process is reduced by back drilling, which can effectively solve the etching caused by etching. The stub value of the back drilling is small, and the original process design is to etch the outer layer circuit, pattern plating, back drilling and etching. According to the process, the stub of the back drilling is 2.67 mil. When etching, the copper on the back drilling surface is exposed to the etching without tin protection. After the stub is etched, it is 0 mil, which causes the 5G signal test to fail. By adjusting the process and canceling the back drilling etching process, the etching caused by etching can be effectively solved, and the stub problem can be solved.

[0081] Further, as a preferred embodiment of the present scheme but not limited, in step S4, plastic rivets are used for pressing treatment. The mainboard high-layer circuit board secondary outer layer design requires three P pieces, three PP cannot use DIS fusion blocks, and needs to be controlled from the inner layer dry film alignment, and is produced by using fusion + 10 head rivets; the pressing process uses plastic rivets to solve the problem of rivet scraps caused by traditional metal rivet riveting process, adjusts the rivet length, and opens the flower surface upward to solve the copper foil folding problem at the riveting position.

[0082] Further, as a preferred embodiment of the present scheme but not limited, in step S5, the through hole is drilled once, and phenolic pad production is used during the period, and melamine pad is used as cover plate, and the cover plate is drilled with pipe hole. When drilling, melamine pad is used as bottom plate and cover plate, holes above 1.4 mm are produced with cover plate, the cover plate needs to be drilled with pipe hole, which can effectively solve the problem of 5G high-frequency high-speed plate drilling burr.

[0083] Further, as a preferred embodiment of the present scheme but not limited, in step S8, the following steps are further included:

[0084] S801: using mechanical drilling to make the through hole reach a preset depth;

[0085] S802: drilling off the through hole section without connection or transmission effect;

[0086] S803: high-pressure water washing after back drilling;

[0087] S804: full inspection of aluminum sheet cover plate to prevent missed drilling by number hole machine.

[0088] The depth control function of the mechanical drilling machine is used to drill a hole with a certain depth requirement on the through hole with a larger diameter drill tool, drill off the through hole section without any connection or transmission effect, avoid causing reflection, scattering, delay and other problems of 5G signal transmission, and bring "distortion" to the signal. Double back drilling, high-pressure water washing after back drilling, and full inspection of aluminum sheet cover plate to prevent missed drilling by number hole machine.

[0089] Further, as a preferred embodiment of the present solution but not limited, in step S10, the excess resin includes the resin protruding from the hole rear orifice, and the resin on the board surface.

[0090] Further, as a preferred embodiment of the present solution but not limited, in step S15, the following steps are further included:

[0091] S1501: film stripping;

[0092] S1502: etching;

[0093] S1503: first tin stripping;

[0094] S1504: dry film stripping;

[0095] S1505: etching the copper not protected by tin under the dry film;

[0096] S1506: second tin stripping until the circuit under the tin is exposed, i.e. forming the outer circuit pattern.

[0097] Further, as a preferred embodiment of the present solution but not limited, in step S16, the following steps are further included:

[0098] S1601: inspecting the outer circuit with an optical inspection device;

[0099] S1602: passing the circuit board detected to a reflow soldering furnace.

[0100] Further, as a preferred embodiment of the present solution but not limited, in step S19, the following steps are further included:

[0101] S1901: gold plating;

[0102] S1902: plate stripping;

[0103] S1903: ET;

[0104] S1904: FQC;

[0105] S1905: PK.

[0106] Further, as a preferred embodiment of the present solution but not limited, in step S9, the following steps are further included:

[0107] S901: increasing the grinding plate before resin hole plugging;

[0108] S902: roughening the copper surface. This can enhance the bonding force of the copper surface and the resin. In view of the 5G mainboard circuit board design requirement that "after 5 times of reflow soldering, the resin does not separate", the roughness of the copper surface is increased, and the mainboard model is added with step S9 processing

[0109] The working principle of the embodiment is as follows:

[0110] The application provides a 5G circuit board PCB manufacturing method, which cancels the tinning process and the etching process in step S7, optimizes two processes, solves the problem of complicated existing production technology process, and achieves the purposes of providing production efficiency and reducing production cost.

[0111] The above is an embodiment provided in combination with specific content, and it is not intended that the specific implementation of the application is limited to these descriptions. Any similar structure or method as the application, or any technical deduction or replacement made on the basis of the concept of the application, should be considered as the protection scope of the application.

Claims

1. A method of manufacturing a 5G circuit board (PCB), characterized by, The method comprises the following steps: S1: cutting, cutting the copper-clad plate to form an inner layer copper-clad plate; S2: inner layer circuit, pasting a layer of photosensitive material on the copper foil surface of the inner layer copper-clad plate, and forming an inner layer circuit pattern after etching and developing; S3: first inspection, quality inspection of the inner layer copper-clad plate after step S2; S4: plate pressing, arranging the inner layer copper-clad plate passing the quality inspection and a resin film according to a preset arrangement mode, and then performing pressing treatment to form a laminated circuit board; S5: drilling, drilling through holes in the laminated circuit board; S6: copper deposition and surface plating, wherein the copper deposition is a method for depositing a copper layer for conducting each layer of the laminated circuit board in the through hole by copper deposition, so that the through hole forms a conductive hole; and the surface plating is a method for plating the laminated circuit board by full plate plating to form a conductive copper layer on the conductive hole and the surface of the laminated circuit board; S7: pattern plating, so that the conductive copper layer reaches a preset thickness; S8: back drilling, using mechanical drilling to make the conductive hole reach a preset depth; S9: resin hole plugging, using vacuum resin hole plugging, and the conductive hole is divided into resin-plugged holes and non-resin-plugged holes; S10: resin grinding, grinding the excess resin after the resin-plugged holes are ground; S11: automatic optical inspection, checking the plugging fullness; S12: copper deposition and VCP plating, plating the holes after resin-plugging to fill the holes, and making the copper thickness of the non-resin-plugged holes and the surface reach a preset finished product copper layer thickness by VCP plating; S13: outer layer circuit pattern transfer, pasting a layer of dry film photosensitive material on the copper foil surface of the laminated circuit board, and then performing alignment exposure by laser direct imaging technology to form a circuit pattern after developing; S14: pattern plating, plating a layer of tin on the circuit pattern as an anti-etching protective layer of the circuit; S15: outer layer etching plate, forming an outer layer circuit pattern; S16: second inspection, passing a reflow soldering furnace; S17: WF+two-dimensional code / character printing, printing a layer of uniform photosensitive solder resist ink on the circuit board; S18: measuring impedance and Lowloss, measuring the impedance module and Lowloss in the production board; S19: post-processing; In step S4, plastic rivets are used for pressing treatment; In step S15, the following steps are further included: S1501: film stripping; S1502: etching; S1503: first tin stripping; S1504: dry film stripping; S1505: etching the part of the copper under the dry film which is not protected by tin; S1506: second tin stripping, until the circuit under the tin is exposed, that is, the outer layer circuit pattern is formed; In step S16, the following steps are further included: S1601: checking the outer layer circuit by using an optical inspection device; S1602: passing the circuit board passing the inspection through a reflow soldering furnace; In step S19, the following steps are further included: S1901: gold deposition; S1902: plate ringing; S1903: ET; S1904: FQC; S1905: FQC; In step S9, the following steps are further included: S901: adding plate grinding before resin hole plugging; S902: roughening the copper surface.

2. The 5G wiring board PCB manufacturing method according to claim 1, wherein, In step S5, the through hole is drilled once, during which phenolic pad is used for production, melamine pad is used as cover plate, and the cover plate is drilled with pipe hole first.

3. The method of claim 1, wherein the 5G line board PCB is manufactured by a process comprising: In step S8, the following steps are further included: S801: mechanical drilling is used to make the through hole reach the preset depth; S802: the through hole section without connection or transmission effect is drilled off; S803: high pressure water washing is used after back drilling; S804: the aluminum sheet cover plate is detected by the number of holes to prevent leakage drilling.

4. The method of claim 1, wherein the 5G line board PCB is manufactured by a process comprising: In step S10, the excess resin includes the resin protruding from the hole after the plug hole, and the resin on the board surface.

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