A method and apparatus for repairing PCB circuit boards

Abstract

This application relates to a PCB board circuit repair method, comprising the following steps: acquiring a PCB board and obtaining an image of the PCB board using an image acquisition module; determining whether there are defects on the PCB board based on the acquired PCB board image and locking the location range of the defects; when the defect size is greater than a first threshold, fixing the line width using UV glue and repairing the defect using a solder bath; when the defect size is less than a second threshold, repairing the defect by spot welding with copper wires of equal line width. The above solution provided by this application allows for timely repair of PCB board problems, reducing the loss of defects to customers, eliminating customer complaints and external failure costs, improving production quality, and reducing wasteful scrap costs.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board (PCB) product manufacturing technology, and in particular to a method and apparatus for repairing PCB circuits. Background Technology

[0002] Printed circuit boards (PCBs) are currently crucial electronic components, serving as the support structure for electronic devices and the carrier for their electrical connections. With the rapid development of the industry, increasingly sophisticated designs are becoming crucial. Customers are demanding greater completeness of their product lines, leading to higher integration levels for electronic components. Consequently, the quality requirements for printed circuit boards are also increasing.

[0003] During the inspection of circuit boards, a large number of defects such as open circuits, gaps, and scratches are found. However, existing technologies lack methods to repair these problems, which leads to the direct scrapping of circuit boards and waste of resources. Summary of the Invention

[0004] Therefore, it is necessary to provide a PCB circuit repair method and device to address the lack of corresponding repair methods when problems are found during the inspection of existing circuit boards.

[0005] This application provides a method for repairing PCB circuits, including the following steps:

[0006] Obtain the PCB board and use the image acquisition module to acquire an image of the PCB board;

[0007] Determine if there are defects on the PCB board based on the acquired PCB board images, and pinpoint the location range of the defects;

[0008] When the defect size is larger than the first threshold, UV glue is used to fix the line width and the defect is repaired using a tin bath immersion tin machine; when the defect size is smaller than the second threshold, copper wire of equal line width is used for spot welding to repair the defect.

[0009] In one embodiment, after spot welding with copper wires of equal line width, the method further includes:

[0010] Wipe the PCB board multiple times along the direction of the defect;

[0011] Glue repair;

[0012] Use a UV lamp to bake for a preset time to ensure the circuit is cured.

[0013] In one embodiment, after repairing defects using a tin bath immersion machine or by spot welding copper wires of equal linewidth, the method further includes:

[0014] The circuitry on the PCB is inspected for compliance. If it fails to comply, the PCB is repaired using laser equipment.

[0015] In one embodiment, the repair of the PCB board using a laser device includes:

[0016] Calculate the line width and volume at the defect location;

[0017] The amount of laser cladding powder used is calculated based on the linewidth and volume.

[0018] The parameters of the laser equipment are set according to the amount of laser cladding powder used, and finally the PCB board is repaired by the laser equipment.

[0019] In one embodiment, the laser cladding powder is copper powder.

[0020] In one embodiment, determining whether the PCB board has a defect and locking the location range of the defect includes:

[0021] Binarize the image of the PCB board;

[0022] Extract the traces and widths of the circuit board;

[0023] The system automatically compares the trace and width of the circuit with the trace in the PCB design drawing, and marks the differences as the location range of the defect.

[0024] In one embodiment, determining whether the PCB board has defects based on the acquired PCB board image includes:

[0025] Obtain 3D imaging information of a preset circuit board;

[0026] Obtain 3D imaging information of the PCB board;

[0027] The three-dimensional imaging information of the PCB board is compared with the three-dimensional imaging information of the preset circuit board.

[0028] In one embodiment, the defect includes an open circuit or a broken circuit.

[0029] In one embodiment, the first threshold is 3-3.5 mil and the second threshold is 1.5-2 mil.

[0030] The present invention also provides a PCB board circuit repair device, the device comprising:

[0031] The acquisition module is used to acquire images of the PCB board using the image acquisition module;

[0032] The judgment and locking module is used to determine whether there are defects on the PCB board based on the acquired PCB board image, and to lock the location range of the defects.

[0033] The repair module is used to fix the line width with UV glue and repair the defect using a tin bath immersion tin machine when the defect size is greater than the first threshold; when the defect size is less than the second threshold, it is used to repair the defect by spot welding with copper wire of equal line width.

[0034] The beneficial effects of this invention include:

[0035] The PCB circuit repair method provided by this invention can repair circuit boards in a timely manner when problems are found, reducing the loss of defects to customers, eliminating customer complaints and external failure costs, improving production quality, and reducing waste of scrap costs. Attached Figure Description

[0036] Figure 1 This is a flowchart illustrating a PCB board circuit repair method provided in an embodiment of this application. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0043] like Figure 1 In one embodiment of this application, a PCB board circuit repair method is provided, comprising the following steps:

[0044] Step 101: Obtain the PCB board by using an image acquisition module to acquire an image of the PCB board;

[0045] Step 102: Determine whether there are defects on the PCB board based on the acquired PCB board image, and pinpoint the location range of the defects;

[0046] Step 103: When the defect size is greater than the first threshold, UV glue is used to fix the line width and the defect is repaired using a tin bath immersion tin machine; when the defect size is less than the second threshold, copper wires of equal line width are used for spot welding to repair the defect.

[0047] For step 103, for example, when the defect size is greater than 3mil, the repair method is as follows: fix the line width at the open position of the line with UV glue, and perform a 3M tape tensile test and a solder bath immersion test to ensure that the repaired position does not fall off; when the defect size is less than 2mil, the repair method is as follows: select copper wires of equal width for spot welding connection, and maintain consistency with the original line after repair, with a smooth surface and no welded joints; use an eraser to rub back and forth along the line direction 4-6 times to clean the dust off the line surface, apply glue evenly, with a glue application area of ​​3*8mm, and bake with a UV lamp for 6-10 seconds to fully cure the line, while ensuring that the relevant tests are qualified.

[0048] By adopting the above technical solution, when a problem is found in the circuit board, it can be repaired in a timely manner, reducing the loss of defects to the customer, eliminating customer complaints and external failure costs, improving production quality, and reducing waste of scrap costs.

[0049] In some embodiments, after spot welding with copper wires of equal line width, the method further includes: first step: wiping the PCB board multiple times along the line direction where the defect is located; second step: applying adhesive; third step: baking with a UV lamp for a preset time to ensure the line is cured.

[0050] In some embodiments, after repairing defects using a tin bath immersion machine or by spot welding copper wires of equal linewidth, the method further includes:

[0051] The circuitry on the PCB is inspected for compliance. If it fails to comply, the PCB is repaired using laser equipment.

[0052] Furthermore, the aforementioned repair of the PCB board using laser equipment includes:

[0053] Calculate the line width and volume at the defect location;

[0054] The amount of laser cladding powder used is calculated based on the linewidth and volume.

[0055] The parameters of the laser equipment are set according to the amount of laser cladding powder used, and finally the PCB board is repaired by the laser equipment.

[0056] In some embodiments, the laser cladding powder in this application is copper powder.

[0057] In some embodiments, determining whether a PCB board has defects and locking the location range of the defects includes: performing binarization processing on the image of the PCB board; extracting the traces and widths of the traces on the PCB board; automatically comparing the traces and widths with the traces in the PCB design drawings, and marking the differences as the location range of the defects.

[0058] In some embodiments, determining whether a PCB board has defects based on the acquired PCB board image includes: acquiring three-dimensional imaging information of a preset circuit board; acquiring three-dimensional imaging information of the PCB board; and comparing the three-dimensional imaging information of the PCB board with the three-dimensional imaging information of the preset circuit board.

[0059] In some embodiments, defects in this application include open circuits or broken circuits.

[0060] This application also provides a PCB board circuit repair device, the device comprising:

[0061] The acquisition module is used to acquire images of the PCB board using the image acquisition module;

[0062] The judgment and locking module is used to determine whether there are defects on the PCB board based on the acquired PCB board image, and to lock the location range of the defects.

[0063] The repair module is used to fix the line width with UV glue and repair the defect using a tin bath immersion tin machine when the defect size is greater than the first threshold; when the defect size is less than the second threshold, it is used to repair the defect by spot welding with copper wire of equal line width.

[0064] It should be understood that the units or modules described in the above-mentioned device are the same as those in the reference. Figure 1 The steps in the described method correspond to each other. Therefore, the operations and features described above for the method also apply to the device and the units contained therein, and will not be repeated here. This device can be pre-implemented in the browser or other security applications of an electronic device, or it can be loaded into the browser or its security applications of an electronic device through download or other means. The corresponding units in the device can cooperate with the units in the electronic device to implement the solutions of the embodiments of this application.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for repairing PCB circuits, characterized in that, Includes the following steps: Obtain the PCB board and use the image acquisition module to acquire an image of the PCB board; Determine if there are defects on the PCB board based on the acquired PCB board images, and pinpoint the location range of the defects; When the defect size is larger than the first threshold, UV glue is used to fix the line width and the defect is repaired using a tin bath dipping machine. When the defect size is smaller than the second threshold, the defect is repaired by spot welding with copper wire of equal line width. The first threshold is 3-3.5 mil, and the second threshold is 1.5-2 mil; After spot welding with copper wires of equal line width, the method further includes: Wipe the PCB board multiple times along the direction of the defect; Glue repair; Use a UV lamp to bake for a preset time to ensure the circuit is cured.

2. The PCB board circuit repair method according to claim 1, characterized in that, After repairing defects using a tin bath immersion machine or by spot welding copper wires of equal line width, the method also includes: The circuitry on the PCB is inspected for compliance. If it fails to comply, the PCB is repaired using laser equipment.

3. The PCB board circuit repair method according to claim 2, characterized in that, The method of repairing PCB boards using laser equipment includes: Calculate the line width and volume at the defect location; The amount of laser cladding powder used is calculated based on the linewidth and volume. The parameters of the laser equipment are set according to the amount of laser cladding powder used, and finally the PCB board is repaired by the laser equipment.

4. The PCB board circuit repair method according to claim 3, characterized in that, The laser cladding powder is copper powder.

5. The PCB board circuit repair method according to claim 1, characterized in that, The process of determining whether a PCB board has defects and pinpointing the location range of the defects includes: Binarize the image of the PCB board; Extract the traces and widths of the circuit board; The system automatically compares the trace and width of the circuit with the trace in the PCB design drawing, and marks the differences as the location range of the defect.

6. The PCB board circuit repair method according to claim 1, characterized in that, The step of determining whether there are defects in the PCB board based on the acquired PCB board image includes: Obtain 3D imaging information of a preset circuit board; Obtain 3D imaging information of the PCB board; The three-dimensional imaging information of the PCB board is compared with the three-dimensional imaging information of the preset circuit board.

7. The PCB board circuit repair method according to claim 1, characterized in that, The defects include open circuits or broken circuits.

8. A PCB board circuit repair device, characterized in that, The device includes: The acquisition module is used to acquire images of the PCB board using the image acquisition module; The judgment and locking module is used to determine whether there are defects on the PCB board based on the acquired PCB board image, and to lock the location range of the defects. The repair module is used to fix the line width with UV glue and repair the defect using a tin bath immersion tin machine when the defect size is greater than the first threshold; when the defect size is less than the second threshold, it is used to repair the defect by spot welding with copper wire of equal line width.

Images