An interactive device, an interactive method and a polishing apparatus for polishing a silicon wafer

Abstract

The application relates to the field of semiconductor wafer polishing, in particular to an interactive device for polishing silicon wafers, which comprises a fixing base, a carrier mechanism and a polishing head mechanism; a partition mechanism, which comprises a baffle plate, the baffle plate is located in a containing space, and the baffle plate is slidably connected to the fixing base along a first direction; when the polishing head is in a first state, the baffle plate is arranged on the side of the polishing head; when the polishing head is in a second state, the baffle plate is arranged directly below or on the side of the polishing head; and a cleaning mechanism, which is located on the side of the containing space, and the cleaning mechanism has at least a first mode and a second mode; in the first mode, the baffle plate is arranged between the polishing head and the carrier, the cleaning mechanism enters between the polishing head and the baffle plate and cleans the polishing head; and in the second mode, the cleaning mechanism is not in action. The technical problem that the silicon wafers are easily contaminated during the interaction process is solved, and the technical effect of reducing the contamination of the silicon wafers during the interaction is achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor wafer polishing, and in particular to an interactive device, interactive method, and polishing equipment for polishing silicon wafers. Background Technology

[0002] Polishing is one of the key processes in the manufacturing of semiconductor silicon wafers. To obtain silicon wafers with superior surface quality, a final mirror polishing is required on the front side of the wafer. This process necessitates strict control over any potential surface defects and minimizing surface contamination.

[0003] In existing technologies, the interaction between the silicon wafer and the polishing head / stage generally suffers from insufficient separation of wastewater after cleaning. In some cases, the same wafer stage is used for wafer adsorption, peeling, and polishing head cleaning. These issues significantly increase the likelihood of surface contamination, easily leading to excessive LPD parameters and affecting wafer yield. Furthermore, if foreign matter falls onto the adsorption stage, there is a risk of wafer breakage during polishing, resulting in substantial production losses.

[0004] Therefore, the technical problem with existing technologies is that silicon wafer interaction processes are prone to contamination. Summary of the Invention

[0005] This application provides an interaction device, interaction method, and polishing equipment for polishing silicon wafers, which solves the technical problem of easy contamination during the silicon wafer interaction process and achieves the technical effect of reducing contamination during silicon wafer interaction.

[0006] In a first aspect, the present application provides an interactive device for polished silicon wafers, which adopts the following technical solution:

[0007] An interactive device for polishing silicon wafers includes: a fixed base; a carrier mechanism slidably connected to the fixed base along a first direction, the carrier mechanism including: a carrier for carrying silicon wafers; the carrier moving to form a first station for loading silicon wafers, a second station for loading or unloading silicon wafers, and a third station for unloading silicon wafers; and a polishing head mechanism located above the carrier mechanism, with an accommodating space formed between the polishing head mechanism and the carrier mechanism, the polishing head mechanism including: a polishing head for loading or unloading silicon wafers, the polishing head being located directly above the second station, the polishing head having at least a first state and a second state, in the first state: the polishing head acts downwards on the carrier to load or unload silicon wafers. The film is unloaded; in the second state: the throwing head has no action; a partition mechanism, the partition mechanism including: a baffle, the baffle being located within the accommodating space, the baffle being slidably connected to the fixed base along a first direction; in the first state, the throwing head is in the first state, the baffle is movably arranged on the side of the throwing head; in the second state, the throwing head is in the second state, the baffle is movably arranged directly below or on the side of the throwing head; and a cleaning mechanism, the cleaning mechanism being located on the side of the accommodating space, the cleaning mechanism having at least a first mode and a second mode, in the first mode, the baffle is arranged between the throwing head and the carrier, the cleaning mechanism enters between the throwing head and the baffle and cleans the throwing head; in the second mode, the cleaning mechanism has no action.

[0008] Preferably, the carrier includes: a first carrier, which moves to form a first station and a second station, the first carrier being used for loading silicon wafers at the first station and for wafer loading at the second station; and a second carrier, which is located on one side of the first carrier, and moves to form a second station and a third station, the second carrier being used for wafer unloading at the second station and wafer unloading at the third station.

[0009] Preferably, the first carrier and the second carrier are in multiple sets and the number of sets is equal, and the carriers are arranged linearly along a first direction; the number of the throwing heads is equal to the number of the first carrier or the second carrier.

[0010] Preferably, the carrier mechanism further includes: a movable seat slidably connected to the fixed seat, the carrier being disposed on the movable seat; a first driving assembly, the first driving assembly including: a lead screw arranged along a first direction, the lead screw being connected to the fixed seat and having a rotational degree of freedom of rotation about an axis, the lead screw being threadedly connected to the movable seat; and a motor connected to the end of the lead screw, the motor being used to drive the lead screw to rotate so that the movable seat is driven by the lead screw.

[0011] Preferably, the partition mechanism further includes: a second driving component, the second driving component being used to drive the baffle to slide, the second driving component comprising:

[0012] A cylinder is connected to the fixed base. The cylinder acts on the baffle in a first direction, causing the baffle to move in the first direction to reach directly below the throwing head or to the side of the throwing head.

[0013] Preferably, the baffle includes: a baffle body for blocking the liquid generated by the cleaning mechanism in the first mode, the baffle body having a flow guiding area that is inclined for guiding the liquid to the outside of the accommodating space; and an extension that is vertically fixed to the edge of the baffle body, the extension having a notch and forming a drainage area that faces the outside of the polishing equipment.

[0014] Preferably, the cleaning structure includes a brush head assembly, which is located with a rotational degree of freedom of horizontal rotation, allowing the brush head assembly to rotate between the baffle and the blasting head to clean the blasting head.

[0015] Secondly, this application provides an interactive method for polishing silicon wafers, which adopts the following technical solution:

[0016] An interactive method for polishing silicon wafers includes: loading: driving a carrier to a first station to load silicon wafers, and driving or holding a baffle above a second or third station; wafer loading: driving the carrier to a second station to load silicon wafers, and driving or holding the baffle above the first or third station; wafer unloading: driving or holding the carrier to a second station to unload silicon wafers, and driving or holding the baffle above the first or third station; unloading: driving the carrier to a third station to unload silicon wafers, and driving or holding the baffle above the first or second station; cleaning: driving the baffle between the polishing head and the carrier, and a cleaning mechanism cleaning the polishing head, and repeating the above steps after cleaning.

[0017] Preferably, the cleaning mechanism cleans the blasting head by: driving the cleaning mechanism to rotate and enter between the baffle and the blasting head, and cleaning the blasting head; and driving the cleaning mechanism to rotate and reset.

[0018] Thirdly, the polishing equipment provided in this application adopts the following technical solution:

[0019] A polishing apparatus, comprising an interactive device for polishing silicon wafers.

[0020] In summary, this application includes at least one of the following beneficial technical effects:

[0021] 1. In this application, silicon wafers are transported by a carrier for loading, unloading, and discharge. A movable baffle is installed between the carrier and the polishing head. When the polishing head needs to be cleaned, the position of the baffle changes to separate the carrier and the polishing head, preventing the cleaning liquid from falling onto the carrier. Instead, the baffle mechanism separates the liquid, greatly reducing liquid contamination of the carrier and improving the cleanliness of the carrier surface. This reduces contamination of the silicon wafers during the interaction with the carrier, solving the technical problem of easy contamination during silicon wafer interaction and achieving the technical effect of reducing silicon wafer interaction contamination.

[0022] 2. The carrier has multiple sets, each carrier is independent and has a first station for loading, a second station for loading and unloading, and a third station for unloading. The carrier mechanism drives multiple sets of carriers, improving the efficiency of loading and unloading and unloading, and improving polishing efficiency.

[0023] 3. In this application, the baffle has an inclined guide area and a drain area for draining liquid, and the drain area faces the outside of the polishing equipment. The cleaning liquid is directed through the guide area and the drain area, which reduces the possibility of liquid contamination of the carrier and further improves the cleanliness of the carrier surface, thereby reducing the contamination of the silicon wafer when it interacts with the carrier. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the interactive device described in this application;

[0025] Figure 2 This is a schematic diagram of the carrier structure of the interactive device described in this application;

[0026] Figure 3 This is a schematic diagram of the carrier station of the interactive device described in this application;

[0027] Figure 4 This is a schematic diagram of the carrier mechanism transformation of the interactive device described in this application;

[0028] Figure 5 This is a schematic diagram of the cleaning mechanism of the interactive device described in this application;

[0029] Figure 6 This is a flowchart illustrating the interaction method described in this application;

[0030] Figure 7-8 This is a schematic diagram of the carrier station transformation in the interaction method described in this application;

[0031] Figure 9 This is a schematic diagram of the head of the interactive device described in this application.

[0032] Explanation of reference numerals in the attached drawings: 100, fixed seat; 110, first seat; 120, second seat; 130, third seat; 200, throwing head mechanism; 210, throwing head; 220, accommodating space; 300, carrier mechanism; 310, carrier; 311, first carrier; 312, second carrier; 321, first station; 322, second station; 323, third station; 330, moving seat; 340, first drive assembly; 341, lead screw; 342, motor; 400, partition mechanism; 410, baffle; 411, baffle body; 412, guide zone; 413, extension edge; 414, drainage zone; 420, second drive assembly; 421, cylinder; 500, cleaning mechanism; 610, vision component; 620, lighting component; 710, airbag; 720, pressure chamber. Detailed Implementation

[0033] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] This application provides an interactive device, interactive method, and polishing equipment for polishing silicon wafers, which solves the technical problem of easy contamination during the silicon wafer interactive process and achieves the technical effect of reducing silicon wafer interactive contamination.

[0036] To better understand the above technical solutions, a detailed description of the technical solutions will be provided below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit the scope of this application.

[0037] This application first provides an interaction device for polishing silicon wafers to solve the technical problem of contamination on silicon wafers during the interaction process, such as... Figure 1 As shown, the interactive device includes a mounting base 100, a carrier mechanism 300, a wafer-throwing mechanism 200, a partition mechanism 400, and a cleaning mechanism 500; the mounting base 100 serves as the base for mounting and connecting the interactive device; the carrier mechanism 300 is used to carry silicon wafers; the wafer-throwing mechanism 200 is used for loading or unloading silicon wafers; the partition mechanism 400 is used to isolate the wafer-throwing mechanism 200 and the carrier mechanism 300; and the cleaning mechanism 500 is used to clean the wafer-throwing mechanism 210.

[0038] Fixed base 100, such as Figure 1 As shown, the mounting base 100 serves as the foundation for installing and connecting the interactive device. The aforementioned mechanisms are connected to the mounting base 100. The mounting base 100 can be the overall frame of the polishing equipment or a separate external frame, serving only as a connection and installation foundation. In one embodiment, the mounting base 100 includes a first base 110, a second base 120, and a third base 130. The first base 110 serves as the driving connection foundation for the partition mechanism 400; the second base 120 serves as the sliding connection foundation for the partition mechanism 400; and the third base 130 serves as the driving and sliding connection foundation for the carrier mechanism 300.

[0039] Carrier mechanism 300, such as Figure 2 As shown, the carrier mechanism 300 is used to transport silicon wafers. The carrier mechanism 300 is located below the throwing head mechanism 200. The carrier mechanism 300 is slidably connected to the fixed base 100. Specifically, the carrier mechanism 300 is slidably connected to the third base 130 along a first direction. The carrier mechanism 300 includes a carrier 310, a movable base 330, and a first driving component 340. The carrier 310 is used to carry the silicon wafer; the movable base 330 is used to arrange and carry one or more carriers 310; the first driving component 340 is used to drive the movable base 330 to slide and thus move the carrier 310.

[0040] Mobile seat 330, such as Figure 2 As shown, the movable base 330 is used to lay out and support one or more carriers 310. The carriers 310 are mounted on the movable base 330 as the mounting base for the carriers 310. The movable base 330 is driven by the first drive assembly 340 and has the degree of freedom of movement to move in the first direction, thereby driving the carriers 310 to slide in the first direction.

[0041] Carrier 310, such as Figure 2As shown, the carrier 310 is used to carry silicon wafers. The carrier 310 is located below the polishing head mechanism 200. Driven by a first driving member, the carrier 310 has the freedom to slide along a first direction. During the sliding process, the carrier 310 forms a first station 321, a second station 322, and a third station 323. At the first station 321, the carrier 310 cooperates with an external feeding mechanism to feed silicon wafers. At the second station 322, the carrier 310 interacts with the polishing head mechanism 200 to either load or unload silicon wafers. At the third station 323, the carrier 310 cooperates with an external unloading mechanism to unload silicon wafers. In one embodiment, the carrier 310 is a set, reciprocating along the first direction under the driving action of the first driving member, sequentially passing through the first station 321, the second station 322, and the third station 323, and repeating cyclically. A sensor is installed inside the carrier 310 to detect the presence or absence of silicon wafers, thereby assisting in the judgment.

[0042] In another embodiment, such as Figure 2 , 3 As shown, the carrier 310 includes a first carrier 311 and a second carrier 312. The first carrier 311 and the second carrier 312 are arranged on the movable seat 330. The first carrier 311 and the second carrier 312 are arranged adjacent to each other along a first direction. The first carrier 311 is used for loading and unloading silicon wafers, and the second carrier 312 is used for unloading and unloading silicon wafers. Specifically, the first carrier 311 and the second carrier 312 are both driven by the first driving component 340 and slide synchronously. The first carrier 311 moves to form a first station 321 and a second station 322. The first carrier 311 is located at the first station 321 for loading silicon wafers, and the first carrier 311 is located at the second station 322 for unloading silicon wafers. The second carrier 312 is located at the second station 322 for unloading silicon wafers, and the second carrier 312 is located at the third station 323 for unloading silicon wafers.

[0043] Among them, such as Figure 3As shown, there are multiple sets of the first carrier 311 and the second carrier 312. In one embodiment, there are two sets of both the first carrier 311 and the second carrier 312. It is worth noting that the number of the first carrier 311, the second carrier 312 and the throwing head 210 should be consistent and correspond one-to-one. Two sets of first carriers 311 and two sets of second carriers 312 are arranged linearly along a first direction. Each first carrier 311 and second carrier 312 has an independent and corresponding work station. Specifically, during the interaction of silicon wafers, when the two sets of first carriers 311 are located at the first work station 321 and cooperate with the feeding mechanism to feed silicon wafers, the two sets of second carriers 312 are located at the second work station 322 and cooperate with the polishing head mechanism 200 to unload silicon wafers. The first driving component 340 drives the carriers 310 to slide along the first direction. After the two sets of first carriers 311 reach the second work station 322, the two sets of first carriers 311 are located at the second work station 322 and cooperate with the polishing head mechanism 200 to feed silicon wafers. At the same time, the two sets of second carriers 312 reach the third work station 323 and cooperate with the unloading mechanism to unload silicon wafers.

[0044] First drive component 340, such as Figure 2 As shown, the first driving assembly 340 is used to drive the movable seat 330 to slide, thereby moving the carrier 310. The first driving assembly 340 includes a lead screw 341 and a motor 342. The lead screw 341 is arranged along a first direction and is rotatably connected to the third seat 130. The lead screw 341 has a rotational degree of freedom to rotate around an axis. The motor 342 is connected to the end of the lead screw 341 and is used to drive the lead screw 341 to rotate. The movable seat 330 is threadedly connected to the lead screw 341 and is also slidably connected to the third seat 130 via a slide rail. The third seat 130 is located at the bottom of the movable seat 330 and provides support for the movable seat 330. Thus, driven by the motor 342, the movable seat 330 and the carrier 310 disposed on the movable seat 330 can slide along the lead screw 341, thereby enabling the carrier 310 to transport the silicon wafer along the first direction.

[0045] Throwing mechanism 200, such as Figure 1 , 2As shown, the polishing head mechanism 200 is used for loading or unloading silicon wafers. The polishing head mechanism 200 is located above the carrier mechanism 300, forming an accommodating space 220 between the polishing head mechanism 200 and the carrier mechanism 300. The polishing head 210 is located above the second station 322 and acts downward on the carrier 310 located on the second station 322 to perform the loading or unloading operation. When there is no need for loading or unloading, the polishing head 210 does not perform any operation. The polishing head 210 acts on the first carrier 311 to load silicon wafers, and the polishing head 210 acts on the second carrier 312 to unload silicon wafers. The number of polishing heads 210 should be equal to the number of first polishing heads 210 (or second polishing heads 210), and the polishing heads 210 correspond one-to-one with the first carrier 311 for loading and one-to-one with the second carrier 312 for unloading.

[0046] It is worth noting that in the polishing equipment, the polishing head 210 is used to connect or adsorb silicon wafers for polishing and transfer. In one embodiment, the polishing head 210 is driven by a turntable or shaft to rotate. The polishing head 210 can perform sequential polishing on multiple polishing pads. That is, after the silicon wafer is mounted on the polishing head 210, the polishing head 210 is transferred to the polishing pads in the polishing equipment for polishing (or after multiple polishing passes). The polishing head 210 is then transferred out of the polishing equipment. In other words, the polishing head 210 has the function of horizontal rotation to complete the transfer, self-lifting and self-rotation around the axis. When there are multiple sets of polishing heads 210, each set of polishing heads 210 is evenly and symmetrically distributed on the turntable around the axis. When one set of polishing heads 210 adsorbs a silicon wafer and enters the polishing equipment, another set of polishing heads 210 sends out the polished silicon wafer. The polishing head 210 of existing polishing equipment generally has the above-mentioned functional structure, which will not be described in detail here.

[0047] Thus, the polishing head 210 moves to form at least a first state and a second state. In the first state, the polishing head 210 acts downward on the carrier 310 located on the second station 322 to load or unload the silicon wafer. In one embodiment, the first carrier 311 is located on the second station 322, and the polishing head 210 acts downward on the first carrier 311 to load the silicon wafer. The second carrier 312 is located on the second station 322, and the polishing head 210 acts downward on the second carrier 312 to unload the silicon wafer. In the second state, the polishing head 210 does not perform any action. Here, "not performing any action" means that when a set of polishing heads 210 adsorbs a silicon wafer and transfers it into the polishing equipment for polishing, that is, when a set of polishing heads 210 transfers the silicon wafer out of the polishing equipment and unloads it (the other sets of polishing heads 210 in the polishing equipment are all acting on the polishing pad and are in the polishing state), after unloading, the polishing head 210 is in the second state. At this time, the polishing head 210 is also cleaned by the partition mechanism 400 and the cleaning mechanism 500.

[0048] partition mechanism 400, such as Figure 4As shown, the baffle mechanism 400 is used to isolate the blasting head mechanism 200 and the carrier mechanism 300. The baffle mechanism 400 includes a baffle 410 and a second drive assembly 420. The baffle 410 is used to shield and isolate the carrier 310 when cleaning the blasting head 210; the second drive assembly 420 is used to drive the baffle 410 to move.

[0049] baffle 410, such as Figure 4 As shown, the baffle 410 is used to shield and isolate the carrier 310 during the cleaning of the shovel head 210. The baffle 410 is located within the accommodating space 220. The height of the baffle 410 is higher than that of the carrier. The baffle 410 is slidably connected to the fixed base 100. Specifically, the baffle 410 is slidably connected to the second base 120 along the first direction, so that the baffle 410 has the freedom of movement to slide along the first direction within the accommodating space 220. The second driving component 420 of the baffle 410 slides and changes position to prevent interference with the throwing head 210 during the loading and unloading process. For example, when the throwing head 210 is in the first state, the baffle 410 is moved and arranged on the side of the throwing head 210, that is, the baffle 410 is located on the first station 321 or the third station 323 of the carrier 310. When the throwing head 210 is in the second state, the baffle 410 is moved and arranged on the side or below the throwing head 210, that is, the baffle 410 is located on the first station 321, the second station 322, or the third station 323 of the carrier 310.

[0050] Furthermore, the baffle 410 includes a baffle body 411, a guide wheel, and an extension 413. The baffle body 411 is located within the accommodating space 220 and is used to clean the liquid generated when the baffle cleaning mechanism 500 cleans the shovel head 210. The baffle 410 has an inclined guide area 412, which is inclined and used to guide the liquid on the baffle body 411 out of the accommodating space 220. Multiple extensions 413 are vertically connected to three edges of the baffle body 411, forming notches on the extensions 413, i.e., drainage areas 414 of the baffle body 411. Liquid on the baffle body 411 passes through these drainage areas 414. 14. Drainage is performed, wherein the drainage area 414 is oriented towards the outside of the polishing equipment, that is, towards the side away from the polishing system (polishing disc, etc.). An inclined guide area 412 is set on the side of the baffle body 411 away from the drainage area 414, and the inclined direction is downward from the side away from the drainage area 414 to the side closer to the drainage area 414. Thus, when the second drive assembly 420 drives the baffle 410 to the position above the second station 322, the cleaning mechanism 500 cleans the polishing head 210 in the second state. The liquid falls onto the baffle 410, and the liquid flows along the guide area 412 through the baffle body 411 and is discharged from the drainage area 414, preventing the liquid from spilling onto the carrier 310.

[0051] The baffle body 411 is slidably connected to the second seat 120 via guide wheels. The second seat 120 is located on the side of the carrier mechanism 300. Multiple sets of guide wheels are provided, each set including a support rod and a guide wheel. The support rod is connected to the bottom of the baffle body 411, and the guide wheel is connected to the support rod. The guide wheel engages with a guide rail on the second seat 120, allowing the baffle 410 to move relative to the second seat 120. Thus, when the baffle body 411 is located at the first station 321 or the third station 323, it does not affect the loading and unloading of silicon wafers.

[0052] Second drive component 420, such as Figure 4 As shown, the second drive assembly 420 is used to drive the baffle 410 to move. The second drive assembly 420 includes a cylinder 421, which is arranged along a first direction and connected between the first seat 110 and the baffle 410. The first seat 110 is located above the carrier mechanism 300. The cylinder 421 drives the baffle 410 to slide along the first direction by extending and retracting. In one embodiment, the cylinder 421 and the baffle 410 can also be connected and driven by a connector.

[0053] Cleaning unit 500, such as Figure 5 As shown, the cleaning mechanism 500 is used to clean the polishing head 210. It is worth noting that the LPD parameters on the silicon wafer surface directly affect the wafer yield. The carrier 310, as the container for the silicon wafer, must minimize the possibility of contamination during interactions between the loading mechanism and the carrier 310, between the carrier 310 and the polishing head 210, and between the carrier 310 and the unloading mechanism. The cleaning mechanism 500 is located on the side of the accommodating space 220. The cleaning mechanism 500 has a horizontal rotational degree of freedom and at least has a first mode and a second mode, which can be switched between. In the first mode, the cleaning mechanism 500 enters between the polishing head 210 and the baffle 410 and cleans the polishing head 210. At this time, the baffle 410 is arranged on the second station 322, directly below the polishing head 210. In the second mode, the cleaning mechanism 500 is located outside the accommodating space 220 and does not perform any action. Specifically, the cleaning mechanism 500 includes a brush head assembly located on the side of the accommodating space 220. The brush head assembly is rotatably connected to the fixed base 100, thereby giving the brush head assembly a degree of freedom of horizontal rotation. Thus, the brush head assembly can rotate into the space between the polishing head 210 and the baffle 410 to brush the polishing head 210. It can be understood that, in order to improve the cleaning effect, the polishing head 210 has the function of spraying cleaning liquid. Furthermore, the brush head has side bristles for brushing the sides of the polishing head 210 and bottom bristles for brushing the bottom surface of the polishing head 210.

[0054] This application also provides an interactive method for polishing silicon wafers, such as... Figure 6As shown, the interaction method includes S1 loading, S2 wafer loading, S3 wafer unloading, S4 unloading, and S5 cleaning. During the loading, unloading, and cleaning steps, the position of the baffle 410 needs to be controlled to avoid interference with the polishing head 210 or to block the liquid generated during cleaning. Specifically, the interaction method for polishing silicon wafers includes:

[0055] S1. Loading materials:

[0056] The drive carrier 310 is driven to the first station 321 for silicon wafer loading, and the baffle 410 is driven or held to the second station 322 or the third station 323. Specifically, the first drive component 340 drives the carrier 310 to the first station 321, or defines the first station 321 as the first initial position of the carrier 310. When at the first station 321, the silicon wafer is transferred to the carrier 310 by an externally set loading mechanism, which is the silicon wafer loading process. While the carrier 310 is at the first station 321, the second drive component 420 drives the baffle 410 to the second station 322 or the third station 323, and the second station 322 or the third station 323 can be defined as the second initial position of the baffle 410.

[0057] S2, Top of film:

[0058] The drive carrier 310 moves to the second station 322 for silicon wafer loading, and drives or holds the baffle 410 to the first station 321 or the third station 323. Specifically, the first drive assembly 340 drives the carrier 310 from the first initial position to the second station 322. At this time, the silicon wafer is directly below the polishing head 210. The polishing head 210 descends to pick up the silicon wafer, completing the wafer loading. The polishing head 210 rotates into the polishing system, completing the polishing head 210 transfer. At the same time, a group of polishing heads 210 carry the polished silicon wafer out of the polishing system and arrive at the second station 322. While the carrier 310 moves to the second station 322, the second drive assembly 420 drives the baffle 410 from the second initial position to the first station 321 or the third station 323.

[0059] S3, Lowering the film:

[0060] Drive or hold the carrier 310 to the second station 322 for silicon wafer unloading, and drive or hold the baffle 410 to the first station 321 or the third station 323; specifically, based on step S2, the first driving component 340 holds the carrier 310 on the second station 322, and the polishing head 210 descends to place the polished silicon wafer on the carrier 310 to complete the silicon wafer unloading; at the same time, hold it on the first station 321 or the third station 323.

[0061] S4. Material feeding:

[0062] The drive carrier 310 is driven to the third station 323 for silicon wafer unloading, and the baffle 410 is driven or held to the first station 321 or the second station 322. Specifically, the first drive component 340 drives the carrier 310 to move from the second station 322 to the third station 323. When it is at the third station 323, the silicon wafer is removed from the carrier 310 by an external unloading mechanism, which is the silicon wafer unloading process. At the same time as the carrier 310 moves to the third station 323, the second drive component 420 drives the baffle 410 to the first station 321 or the second station 322.

[0063] S5. Cleaning:

[0064] The driving baffle 410 is positioned between the polishing head 210 and the carrier 310, and the cleaning mechanism 500 cleans the polishing head 210. Specifically, after one loading, unloading, and feeding process, the driving baffle 410 is moved to the second station 322, positioning itself between the polishing head 210 and the carrier 310. The driving brush head rotates and enters the space between the polishing head 210 and the carrier 310, brushing the polishing head 210. The liquid is blocked and guided by the baffle 410 to prevent it from falling into the carrier 310 and contaminating it. After cleaning, the brush head rotates back to its original position, and the above steps are repeated. Of course, if the polishing head 210 does not need cleaning, steps S1-S4 can be repeated directly.

[0065] In one embodiment, such as Figure 7 , 8 As shown, the carrier 310 includes a first carrier 311 and a second carrier 312. The first carrier 311 has a degree of freedom to move between a first station 321 and a second station 322, and the second carrier 312 has a degree of freedom to move between a second station 322 and a third station 323. The first carrier 311 is located at the first station 321 for loading silicon wafers, and the first carrier 311 is located at the second station 322 for loading silicon wafers. The second carrier 312 is located at the second station 322 for unloading silicon wafers, and the second carrier 312 is located at the third station 323 for unloading silicon wafers. The first carrier 311 and the second carrier 312 are linearly arranged, so that the first carrier 311 and the second carrier 312 each have independent working positions, that is, the first carrier 311 and the second carrier 312 can have different working positions. For example, when the first carrier 311 is located at the first working position 321, the second carrier 312 is located at the second working position 322; when the first carrier 311 is located at the second working position 322, the second carrier 312 is located at the third working position 323. Specifically, this includes:

[0066] S1. Loading materials:

[0067] The first driving component 340 drives the first carrier 311 to the first station 321, or defines the first station 321 as the first initial position of the first carrier 311. While at the first station 321, an externally configured loading mechanism transfers the silicon wafer onto the first carrier 311, which is the silicon wafer loading process. At this time, the second carrier 312 is located adjacent to the first carrier 311, i.e., the second carrier 312 is located at the second station 322, which can be defined as the first initial position of the second carrier 312. Simultaneously, while the first carrier 311 is at the first station 321, the second driving component 420 drives the baffle 410 to the third station 323, which can be defined as the second initial position of the baffle 410.

[0068] S2, Top of film:

[0069] The first driving component 340 drives the first carrier 311 to move from the first initial position to the second station 322. At this time, the silicon wafer is located directly below the polishing head 210. The polishing head 210 descends to pick up the silicon wafer, completing the wafer loading. The polishing head 210 rotates into the polishing system, completing the transfer of the polishing head 210. At the same time, a group of polishing heads 210 carry the polished silicon wafer out of the polishing system and arrive at the second station 322. While the first carrier 311 moves to the second station 322, the second driving component 420 drives the baffle 410 to move from the second initial position to the first station 321.

[0070] S3, Lowering the film:

[0071] Based on step S1, when the second carrier 312 is located on the second station 322, the silicon wafer carried by the shovel 210 is unloaded on the second carrier 312, and the drive baffle 410 is moved to the third station 323.

[0072] S4. Material feeding:

[0073] Based on step S2, while the first carrier 311 is located on the second station 322, the second carrier 312 arrives at the third station 323 to unload the silicon wafer from the lower plate in S1. At the same time as the first carrier 311 moves to the second station 322, the second drive assembly 420 drives the baffle 410 to move from the second initial position to the first station 321.

[0074] S5. Cleaning:

[0075] After one loading, unloading, and feeding process, the drive baffle 410 is moved to the second station 322, positioning it between the polishing head 210 and the first carrier 311 (or the second carrier 312). The drive brush head rotates and enters between the polishing head 210 and the first carrier 311 (or the second carrier 312), brushing the polishing head 210. The liquid is blocked and guided by the baffle 410, preventing it from falling into the first carrier 311 (or the second carrier 312) and contaminating it. After cleaning, the brush head rotates back to its original position, and the above steps are repeated. Of course, if the polishing head 210 does not need cleaning, steps S1-S4 can be repeated directly.

[0076] Furthermore, the number of first carriers 311 and second carriers 312 can be multiple, which also applies to the above-described interaction method steps.

[0077] This application also provides a polishing device, in which the aforementioned silicon wafer polishing interaction device is provided between the loading / unloading mechanism and the polishing system. This device is used for the transport and interaction of silicon wafers between the loading / unloading mechanism and the polishing system, and between the unloading mechanism and the polishing system. It is understood that the loading mechanism is used for loading silicon wafers, for example, a loading robot; the unloading mechanism is used for unloading silicon wafers, for example, an unloading robot; the polishing system refers to a structure used for polishing silicon wafers, including polishing discs, turntables, etc. The polishing system is an existing structure and will not be described in detail here.

[0078] Furthermore, such as Figure 9 As shown, this application can also detect the contamination status of the polishing head 210, and determine whether the polishing head 210 needs to be cleaned based on the contamination status. If cleaning is required, the above-mentioned step S5 is executed; if cleaning is not required, the above-mentioned step S5 is skipped.

[0079] like Figure 9 As shown, the bottom of the polishing head has an air bladder 710. The air bladder 710 covers the polishing head to form a pressure chamber 720. The polishing blade is adsorbed onto the air bladder 710 by the surface tension of water. The polishing pressure of the polishing blade is adjusted by adjusting the pressure in the pressure chamber 720. When it is necessary to remove the blade, the blade can be ejected by pressurizing the pressure chamber 720.

[0080] It is worth noting that when the polishing head 210 (airbag 710) is contaminated, the wafer adheres to the airbag 710 due to the surface tension of water. Generally, contamination refers to silicon powder, silicon sludge, polishing fluid crystals, and / or impurities generated during grinding and polishing. These substances adhere to the polishing head 210, causing contamination of the wafer. Since the polishing head 210 (airbag 710) is contaminated, pure water on the airbag 710 cannot form a complete water film. Therefore, the surface tension between the wafer and the contaminated airbag 710 is relatively low, meaning the wafer is easier to detach from the airbag compared to when it is uncontaminated. Specifically, a vision device and an illumination device 620 are provided on the moving base 330. In one embodiment, the vision device can be a camera, which is used to capture the wafer detachment time, where the detachment time refers to the time t from the start of inflation and expansion of the airbag 710 until the wafer detaches. x The illuminator 620 is used to provide a bright shooting view.

[0081] Furthermore, the above steps include a testing procedure and a verification procedure, wherein the testing procedure includes:

[0082] a. Define the time t when the pressure value in the pressure chamber 720 gradually increases from c1 to c2, and water is sprayed from the edge of the ejector plate. The time when the ejector plate completely detaches from the airbag 710 is defined as t. Based on multiple monitoring, the error of t can be: t∈[t1, t2].

[0083] b. During the film unloading process, the throwing head 210 descends above the first carrier 311 (or the second carrier 312), and the pressure value inside the airbag 710 gradually increases from c1. The camera monitors the film throwing status and records the time from when the film is adsorbed onto the throwing head 210 until it is completely detached from the throwing head 210, obtaining the falling time as t. x ;

[0084] c. Determine t x Is the time within the allowable error range? If t x If ∈[t1, t2], it is determined that there is no contamination on the airbag 710, the time for the detachment of the detachment piece is normal, and the detachment head 210 does not need to be cleaned.

[0085] If t x If t1 < t1, it is determined that the airbag 710 is contaminated, which makes the silicon wafer easy to fall off, and the polishing head 210 needs to be cleaned.

[0086] If it is determined that the 210 polishing head is contaminated and needs cleaning, a calibration procedure is executed. The calibration procedure includes:

[0087] e. The lighting component 620 turns on towards the jet head 210, the jet head 210 rises, and the camera captures the bottom of the jet head 210, that is, the camera acquires an image of the airbag 710.

[0088] f. Analyze image elements: Under the illumination of the illuminator 620, if there are highlight areas in the image, it indicates that there are impurities such as silicon material debris and polished liquid crystals, and the image needs to be cleaned.

[0089] If there are no highlight areas in the image, that is, there is no contamination on the airbag 710, then t x The reason for <t1 is other factors, such as: the water content between the shrapnel and the airbag 710 is low, which makes the surface tension of the water easily broken.

[0090] After performing the above detection and verification procedures, if it is determined that cleaning is required, then proceed with the "S5, Cleaning" step.

[0091] Technical effects:

[0092] 1. In this application, silicon wafers are transported via a carrier 310 for loading, unloading, and discharge. A movable baffle 410 is provided between the carrier 310 and the polishing head 210. When the polishing head 210 needs to be cleaned, the position of the baffle 410 changes to create a barrier between the carrier 310 and the polishing head 210, preventing the liquid from the polishing head 210 from falling onto the carrier 310. Instead, the barrier mechanism 400 blocks the liquid, greatly reducing liquid contamination of the carrier 310 and improving the cleanliness of the carrier 310 surface. This reduces contamination of the silicon wafers during the interaction process with the carrier 310, solving the technical problem of easy contamination during silicon wafer interaction and achieving the technical effect of reducing silicon wafer interaction contamination.

[0093] 2. The carrier 310 has multiple sets, each carrier 310 is independent and has a first station 321 for loading, a second station 322 for loading and unloading, and a third station 323 for unloading. The carrier mechanism 300 drives multiple sets of carriers 310, improving the efficiency of loading and unloading and unloading, and improving the polishing efficiency.

[0094] In this application, the baffle 410 has an inclined guide area 412 and a drain area 414 for draining liquid, and the drain area 414 faces the outside of the polishing equipment. The cleaning liquid is directed through the guide area 412 and the drain area 414, which reduces the possibility of liquid contamination of the carrier 310 and further improves the cleanliness of the surface of the carrier 310, thereby reducing the contamination of the silicon wafer when it interacts with the carrier 310.

[0095] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0096] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An interactive device for polished silicon wafers, characterized in that, include: Fixture (100); A carrier mechanism (300) is slidably connected to the fixed base (100) along a first direction, and the carrier mechanism (300) includes: The carrier (310) is used to carry silicon wafers; the carrier (310) is movable to form a first station (321) for loading silicon wafers, a second station (322) for loading or unloading silicon wafers, and a third station (323) for unloading silicon wafers. A projectile-throwing mechanism (200) is located above the carrier mechanism (300), and a receiving space (220) is formed between the projectile-throwing mechanism (200) and the carrier mechanism (300). The projectile-throwing mechanism (200) includes: A polishing head (210) is used for loading and unloading silicon wafers. The polishing head (210) is located directly above the second work station (322). The polishing head (210) has at least a first state and a second state. In the first state, the polishing head (210) acts downward on the carrier (310) to load or unload the wafer. In the second state, the polishing head (210) does not perform any action. A partition mechanism (400), the partition mechanism (400) comprising: A baffle (410) is located within the accommodating space (220) and is slidably connected to the fixed base (100) along a first direction; when the throwing head (210) is in a first state, the baffle (410) is movably arranged on the side of the throwing head (210); when the throwing head (210) is in a second state, the baffle (410) is movably arranged directly below or on the side of the throwing head (210); and A cleaning mechanism (500) is located on the side of the accommodating space (220). The cleaning mechanism (500) has at least a first mode and a second mode. In the first mode, the baffle (410) is arranged between the throwing head (210) and the carrier (310), and the cleaning mechanism (500) enters between the throwing head (210) and the baffle (410) to clean the throwing head (210). In the second mode, the cleaning mechanism (500) does not perform any action.

2. The interactive device for polishing silicon wafers according to claim 1, characterized in that, The carrier (310) includes: A first carrier (311) is moved to form a first station (321) and a second station (322). The first carrier (311) is used to load silicon wafers at the first station (321) and to load silicon wafers at the second station (322). The second carrier (312) is located on one side of the first carrier (311). The second carrier (312) moves to form a second station (322) and a third station (323). The second carrier (312) is used to unload wafers at the second station (322) and to unload silicon wafers at the third station (323).

3. The interactive device for polishing silicon wafers according to claim 2, characterized in that, The first carrier (311) and the second carrier (312) are in multiple sets and the number of sets is equal. The carriers (310) are arranged linearly along the first direction. The number of the throwing heads (210) is equal to the number of the first carrier (311) or the second carrier (312).

4. The interactive device for polishing silicon wafers according to claim 3, characterized in that, The carrier mechanism (300) also includes: A movable seat (330) is slidably connected to the fixed seat (100), and the carrier (310) is disposed on the movable seat (330). A first driving component (340) includes: A lead screw (341) is arranged along a first direction. The lead screw (341) is connected to the fixed seat (100) and has a rotational degree of freedom to rotate about an axis. The lead screw (341) is connected to the movable seat (330) by a thread. The motor (342) is connected to the end of the lead screw (341) and is used to drive the lead screw (341) to rotate so that the moving seat (330) is driven by the lead screw (341).

5. The interactive device for polishing silicon wafers according to claim 1, characterized in that, The partition mechanism (400) further includes: A second drive assembly (420) is used to drive the baffle (410) to slide. The second drive assembly (420) includes: A cylinder (421) is connected to the fixed base (100). The cylinder (421) acts on the baffle (410) in a first direction, causing the baffle (410) to move in the first direction to reach directly below or to the side of the throwing head (210).

6. The interactive device for polishing silicon wafers according to claim 1, characterized in that, The baffle (410) includes: A baffle body (411) is used to block the liquid generated by the cleaning mechanism (500) in the first mode. The baffle body (411) has a guide area (412) which is arranged at an angle to guide the liquid to the outside of the accommodating space (220). An edge (413) is vertically fixed to the edge of the baffle body (411). The edge (413) has a notch and forms a drainage area (414) facing the outside of the polishing equipment.

7. An interactive device for polishing silicon wafers according to claim 1 or 3, characterized in that, The cleaning mechanism includes: A brush head assembly, which is located with a rotational degree of freedom of horizontal rotation, so that the brush head assembly can rotate between the baffle (410) and the scouring head (210) to clean the scouring head (210).

8. An interaction method for an interaction device of a polished silicon wafer as described in any one of claims 1-7, characterized in that, include: Loading: Drive the carrier (310) to the first station (321) to load silicon wafers, and drive or hold the baffle (410) to the second station (322) or the third station (323); Wafer loading: Drive the carrier (310) to the second station (322) to load the silicon wafer, and drive or hold the baffle (410) to the first station (321) or the third station (323); Wafer unloading: Drive or hold the carrier (310) to the second station (322) to unload the silicon wafer, and drive or hold the baffle (410) to the first station (321) or the third station (323); Unloading: Drive the carrier (310) to the third station (323) to unload the silicon wafer, and drive or hold the baffle (410) to the first station (321) or the second station (322); Cleaning: The cleaning mechanism (500) cleans the throwing head (210) between the drive baffle (410) and the carrier (310). After cleaning, the above steps are repeated.

9. The interactive method for polishing silicon wafers according to claim 8, characterized in that, The cleaning mechanism (500) cleans the blast head (210) by: The drive cleaning mechanism (500) rotates and enters between the baffle (410) and the blasting head (210), and the cleaning mechanism (500) cleans the blasting head (210); Drive the cleaning mechanism (500) to rotate and reset.

10. A polishing device, characterized in that, The interactive device for polished silicon wafers as described in any one of claims 1-7.

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