Military heavy-duty truck part production mold capable of improving production efficiency
By using water tanks, transfer components, and semiconductor cooling chips in truck parts production molds, combined with hydraulic cylinders and connecting blocks, the problems of uneven cooling and difficult resetting were solved, achieving efficient uniform cooling and automatic material separation, and reducing the intensity of manual labor.
CN115847914BActive Publication Date: 2026-05-26WUXI TIANRUN FORGING DIES MFG CO LTD
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Patent Information
- Application Number
- CN202211740458.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-31
- Publication Date
- 2026-05-26
- Estimated Expiration
- 2042-12-31
AI Technical Summary
Technical Problem
Existing truck parts production molds have low cooling efficiency and uneven cooling, which cannot assist in lifting and resetting, increasing the intensity of manual labor.
Method used
It uses a water tank, a transmission component and a semiconductor cooling chip in combination. The heat-conducting component makes elastic contact with the lower mold to increase the heat exchange contact area. The hydraulic cylinder and connecting block are used to assist in lifting the lower mold, and the static inertia is used to assist in material separation.
Benefits of technology
It achieves uniform cooling, improves heat exchange efficiency, reduces the difficulty of manual operation, reduces the adhesion between materials and molds, and simplifies the material separation process.
✦ Generated by Eureka AI based on patent content.
Abstract
This invention discloses a production mold for military heavy-duty truck parts that can improve production efficiency. The mold includes a base, with supports fixedly connected to both the left and right sides of the base's top. Connecting blocks are fixedly connected to the top of the supports, and hydraulic cylinders are bolted to the top of the connecting blocks. Connecting components are mounted on the top of the connecting blocks, and a lower mold is mounted on one side of each connecting component. An upper mold is positioned on top of the lower mold. This invention utilizes a water tank, a transmission component, and a semiconductor cooling chip to achieve elastic contact between the heat-conducting component and various lower molds. The semiconductor cooling chip rapidly reduces water temperature, ensuring efficient heat exchange. Through the combined use of the connecting blocks, connecting components, and hydraulic cylinders, the lower mold can automatically move upwards after cooling with the assistance of a torsion spring. This causes relative sliding between the material and the lower mold due to static inertia, significantly reducing adhesion between the material and the lower mold.
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