A method for repairing a circuit board and a repaired circuit board

Abstract

The application provides a method for repairing a circuit board and the circuit board. The method comprises the following steps: 1) filling silver oil into a to-be-repaired area of a to-be-repaired circuit board to obtain a first repair product; 2) performing drying treatment on the first repair product to obtain a second repair product; 3) performing post-treatment on a silver oil layer in the second repair product, so that the silver oil layer has the same width as the to-be-repaired area, and a third repair product is obtained; and 4) performing copper plating treatment on the surface of the silver oil layer of the third repair product by using a rectifier to form a repaired circuit board. In the method, the copper plating layer formed has the same width as the to-be-repaired area, and the copper plating layer and the peripheral circuit board can be integrated without an interface, so that the copper plating layer and the repaired circuit board have strong binding force, the outer circuit of the repaired circuit board is not only beautiful in appearance, but also has normal circuit conduction capacity, and the repaired circuit board has a long service life.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method for repairing wiring and repairing circuit boards. Background Technology

[0002] After drilling and through-hole electroplating, the inner and outer layers of the printed circuit board are connected. The outer layer circuitry process involves creating an outer dry film to provide the pattern for the outer layer circuitry. The outer layer circuitry requires lamination, exposure, development, etching, and film removal to create the outer copper surface into the outer layer circuitry pattern. During this process, defects such as open circuits, gaps, scratches, and flying wires may occur in the outer layer circuitry. These defects can affect the functionality of the circuitry and require repair to restore its function.

[0003] Existing circuit repair methods involve adding a copper wire to the faulty area under high temperature and pressure. However, this method has the following drawbacks: the copper wire used for repair has a fixed width and type, making it impossible to match the width of the circuit to be repaired; the copper wire has poor adhesion to the printed circuit board (PCB), and the copper wire in the repair area is prone to falling off during subsequent production processes, leading to open circuits and posing a risk of defects during PCB production or testing; the repair copper wire overlaps with the copper at the circuit interface, increasing the copper thickness at the interface, affecting signal transmission and circuit functionality. Summary of the Invention

[0004] This invention provides a line repair method in which the copper plating layer formed in the repair method has excellent compatibility with the area to be repaired, enabling efficient repair of the area to be repaired and giving the repaired circuit board excellent signal transmission performance.

[0005] This invention provides a repair circuit board that has excellent signal transmission performance and a long service life.

[0006] This invention provides a method for patching lines, comprising the following steps:

[0007] 1) Fill the repaired area of ​​the circuit board with silver paint to obtain the first repair material;

[0008] 2) The first repair material is dried to obtain the second repair material;

[0009] 3) Post-process the silver paint layer in the second repair to make the silver paint layer the same width as the area to be repaired, thus obtaining the third repair;

[0010] 4) Use a rectifier to perform copper plating on the surface of the silver coating layer of the third repair to form a repair circuit board.

[0011] In the line repair method described above, the width of the area to be repaired is ≤50mm.

[0012] The silver oil has a resistance of ≤10Ω.

[0013] The drying treatment has a temperature of 150-155℃ and a time of 40-50min.

[0014] The post-treatment comprises, in sequence, a cutting treatment, a first polishing treatment and a second polishing treatment on the silver oil layer in the second repair patch.

[0015] The copper plating treatment comprises, after the copper sulfate solution is coated on the surface of the silver oil layer of the third repair patch, using a rectifier to perform the copper plating treatment.

[0016] The copper sulfate solution has a concentration of copper ions of ≥80g / L.

[0017] In the copper plating treatment, the voltage is ≤6V, the current is 2-2.5A, and the time is 120-180min.

[0018] The copper plating treatment is followed by, in sequence, a conduction detection treatment and a strength detection treatment on the repair circuit board.

[0019] The application provides a repair circuit board obtained by using the repair method.

[0020] The application provides a repair method, which comprises filling silver oil in a region to be repaired, drying to obtain a silver oil layer, performing post-treatment on the silver oil layer, performing copper plating treatment on the surface of the silver oil layer after the post-treatment to form a copper plating layer, and forming a repair circuit board. In the repair method, the copper plating layer formed has the same width as the region to be repaired, and the copper plating layer and the surrounding circuit board are integrated without an interface, so that the copper plating layer and the repair circuit board have strong bonding force, the outer circuit of the obtained repair circuit board not only has an attractive appearance, but also has normal conduction ability, and the repair circuit board has a long service life.

[0021] The application provides a repair circuit board obtained by using the repair method, which has excellent circuit conduction performance and signal transmission performance, and a long service life. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the following will briefly introduce the drawings needed to be used in the description of the embodiments of the present application. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained from these drawings without creative labor.

[0023] Figure 1 Process flow chart of the repair method in some embodiments of the present application;

[0024] Figure 2 Surface topography of the repair area of the circuit board to be repaired in Example 1 of the present application under 100 times magnification;

[0025] Figure 3 Surface topography of the repair area of the repaired circuit board in Example 1 of the present application under 100 times magnification;

[0026] Figure 4 Surface topography of the repair area of the repaired circuit board in Example 1 of the present application under 200 times magnification;

[0027] Figure 5 Surface topography of the repair area of the repaired circuit board in the comparative example of the present application under 200 times magnification. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0029] Figure 1 Process flow chart of the repair method in some embodiments of the present application. As shown in Figure 1 The first aspect of the present application provides a repair method, comprising the following steps:

[0030] S101: filling silver oil in the repair area of the circuit board to be repaired to obtain a first repair product;

[0031] S102: drying the first repair product to obtain a second repair product;

[0032] S103: post-processing the silver oil layer in the second repair product to make the silver oil layer have the same width as the repair area, to obtain a third repair product;

[0033] S104: copper plating is performed on the surface of the silver oil layer of the third repair object by using a rectifier to form a repair circuit board.

[0034] Specifically, S101 comprises: filling silver oil in the to-be-repaired area of the to-be-repaired circuit board to obtain a first repair object, and making the defective circuit of the to-be-repaired circuit board conductive by using the conductivity of the silver oil. The silver oil used in the present application is not particularly limited and can be selected from commonly used silver oil in the art.

[0035] In some embodiments, the circuit in the to-be-repaired area can be cut off by using a scalpel; then the copper foil in the circuit interface area is repaired and flattened by using a hard pen; the to-be-repaired area is cleaned by using a brush; then the silver oil is extracted from a storage bottle by using a needle tube, and the silver oil is injected into the brush tip of the brush, wherein the brush tip of the brush is a brush in the present application; then the silver oil is brushed to the to-be-repaired area by using the brush; after the silver oil is brushed, whether the to-be-repaired area is completely brushed with silver oil is checked by using a lens, and the silver oil is supplemented in the area not brushed with silver oil.

[0036] In the present application, the silver oil used needs to be stored in a refrigerator after use to maintain the activity of the silver oil.

[0037] S102 comprises: drying the first repair object obtained in S101 to dry the water in the silver oil, form a silver oil layer, and obtain a second repair object. The present application does not limit the specific way of drying treatment, and any way that can dry the water in the silver oil belongs to the protection scope of the present application. In some embodiments, an oven is used to dry the first repair object.

[0038] S103 comprises: post-treatment of the silver oil layer to make the surface of the silver oil layer flat and equal in width to the to-be-repaired area to obtain a third repair object. In some embodiments, the surface morphology of the silver oil layer and the size relationship between the silver oil layer and the to-be-repaired area can be observed by using a lens. If the surface of the silver oil layer is not flat enough or the silver oil layer is not equal in width to the to-be-repaired area, the post-treatment step can be repeated.

[0039] The present application does not limit the specific way of post-treatment, and any post-treatment way that can make the surface of the silver oil layer flat and equal in width to the to-be-repaired area belongs to the protection scope of the present application.

[0040] S104 comprises: copper plating is performed on the surface of the silver oil layer of the third repair object by using a rectifier to form a repair circuit board. The present application does not limit the specific source of copper in the copper plating process, as long as a copper plating layer can be formed in the to-be-repaired area.

[0041] In the present application, the type of rectifier is not particularly limited, and any rectifier capable of copper plating treatment falls within the protection scope of the present application. For example, the electroplating rectifier can be a silicon controlled rectifier and a high frequency switching rectifier. In the present application, the use of the rectifier for copper plating treatment has the following advantages: due to the small size and light weight of the rectifier, the space of the equipment can be saved, and the application occasions of the repair method are widened; the rectifier has the advantage of good energy saving effect, and the energy consumption of the repair method is saved; and the output stability of the rectifier is high, the output waveform is easy to control, the operation is convenient, the stability during operation is good, the copper plating layer can be better formed on the surface of the third repair object, the conductivity of the repaired circuit board is improved, and the service life of the repaired circuit board is prolonged.

[0042] In the repair method of the present application, the silver oil is first filled in the to-be-repaired area, then the silver oil layer is obtained by drying treatment, and then the silver oil layer is post-treated. The surface of the silver oil layer after post-treatment is subjected to copper plating treatment to form a repaired circuit board. In the repair method, the copper plating layer formed has the same width as the to-be-repaired area, and finally the integration of the copper plating layer and the surrounding circuit board is achieved without interface, so the bonding force between the copper plating layer and the repaired circuit board is strong, and the outer circuit of the obtained repaired circuit board not only has an aesthetic appearance, but also has normal circuit conduction capability, and the repaired circuit board also has a long service life.

[0043] In the present application, in order to make the appearance of the repaired circuit board more beautiful, and improve the circuit conduction capability of the repaired circuit board and prolong the service life of the repaired circuit board, S101 includes: confirming the type of the to-be-repaired area and the size of the to-be-repaired area, and performing corresponding repair according to the type and size of the to-be-repaired area. In some embodiments, the to-be-repaired circuit board is placed on a light table, the light is turned on, and the to-be-repaired area is observed using a 15x ocular lens to determine the type and size of the to-be-repaired area.

[0044] In the present application, the type of the to-be-repaired area includes at least one of open circuit, notch, scratch and flying wire. The repair method of the present application can repair any of the above types.

[0045] In some embodiments of the present application, when the width of the to-be-repaired area is ≤50mm, the repair method of the present application can better repair the to-be-repaired circuit board, and the obtained repaired circuit board has an aesthetic appearance, strong circuit conduction capability, and a long service life.

[0046] In some embodiments of the present application, in order to improve the adsorption force of the silver oil in the to-be-repaired area, prolong the service life of the repaired circuit board, and improve the conductivity of the repaired circuit board, the resistance of the silver oil is ≤10Ω. Further, the resistance of the silver oil is 6-10Ω.

[0047] In some embodiments of the present application, the temperature of the drying treatment is 150-155 DEG C, and the time of the drying treatment is 40-50 min.

[0048] In the present application, the temperature of the drying treatment and the time of the drying treatment within the above range can dry the moisture in the silver oil under the premise of saving energy consumption, and the silver oil does not spread during the drying process, and the silver oil layer formed on the surface of the area to be repaired after drying has better conductivity.

[0049] In some embodiments of the present application, the post-processing includes sequentially performing trimming treatment, first polishing treatment and second polishing treatment on the silver oil layer in the second repair.

[0050] Specifically, the post-processing includes: using a scalpel to perform trimming treatment on the second repair, so that the width of the silver oil layer of the second repair is consistent with the width of the area to be repaired; then using sandpaper to wipe the surface of the silver oil layer, performing first polishing treatment on the silver oil layer of the second repair to polish the surface of the silver oil layer flat; and finally using sandpaper to continue polishing the surface of the silver oil layer, performing second polishing treatment on the silver oil layer of the second repair to further make the surface of the silver oil layer more flat.

[0051] In specific embodiments, the mesh number of the sandpaper is 2400 mesh.

[0052] In the present application, when the post-processing includes the above process, the surface of the silver oil layer can be polished more flat, and the silver oil layer is the same width as the area to be repaired, which is beneficial to subsequent copper plating treatment, further improves the appearance of the repaired circuit board, and the conductivity of the repaired circuit board, and prolongs the service life of the repaired circuit board.

[0053] In some embodiments of the present application, the copper plating treatment includes: after the copper sulfate solution is coated on the surface of the silver oil layer of the third repair, the copper plating treatment is performed by using a rectifier.

[0054] Specifically, the copper plating treatment includes the following steps: turning on the power supply of the rectifier, setting the voltage of the copper plating treatment, connecting the brush plating pen, making the brush plating pen have current, confirming the current of the copper plating treatment to be consistent with the current to be used; coating the copper sulfate solution on the surface of the silver oil layer of the third repair; connecting the brush plating pen with the two ends of the circuit of the area to be repaired, and starting the copper plating treatment.

[0055] In the present application, the copper ions in the copper sulfate solution are plated on the surface of the silver oil layer of the third repair by using the rectifier, which can further improve the surface appearance and circuit conductivity of the repaired circuit board, and prolong the service life of the repaired circuit board.

[0056] Further, in order to improve the efficiency of the copper plating process, the concentration of copper ions in the copper sulfate solution is ≥80 g / L, so as to better form the copper plating layer on the surface of the silver oil layer of the third patch.

[0057] In some embodiments of the present application, in the copper plating process, the voltage is ≤6 V, the current is 2-2.5 A, and the time is 120-180 min. Further, in the copper plating process, the voltage is 3-6 V.

[0058] In the present application, the copper plating process with the above parameters can improve the efficiency of the copper plating process, save energy consumption of the copper plating process, better form the copper plating layer on the surface of the silver oil layer of the third patch, further improve the surface appearance and circuit conductivity of the repaired circuit board, and prolong the service life of the repaired circuit board.

[0059] In some embodiments, the rectifier can work on normal 220V alternating current or can be driven to work by external power generation.

[0060] The repair method of the present application can determine different thicknesses of the copper plating layer according to actual needs, and the thickness of the copper plating layer formed in the copper plating process can reach more than 20 μm. This is beneficial to subsequent grinding and micro-etching processes, and further prolongs the service life of the repaired circuit board.

[0061] In some embodiments of the present application, after the copper plating process, the repaired circuit board is sequentially subjected to a conduction detection process and a strength detection process.

[0062] In the present application, the conduction detection process includes connecting the test clips of a multimeter to both ends of the circuit in the repaired area, and testing whether the repaired circuit is conductive.

[0063] The strength detection process includes pasting a 3M tape on the repaired area, then pulling off the 3M tape, and checking whether the repaired area falls off.

[0064] In the present application, after the copper plating process, the repaired circuit board is sequentially subjected to a conduction detection process and a strength detection process, which can better judge the repair quality of the repaired circuit board and further prolong the service life of the repaired circuit board.

[0065] In some embodiments, the thickness of the copper plating layer can be tested by a CMI copper thickness tester, or the thickness of the copper plating layer can be confirmed by slicing.

[0066] The second aspect of the present application provides a repaired circuit board obtained by using the above repair method.

[0067] The circuit board repaired by the repairing method has excellent circuit conduction performance and signal transmission performance, and a long service life.

[0068] The scheme of the present application will be further described in combination with specific examples.

[0069] Example 1

[0070] The repairing method of the present example comprises the following steps:

[0071] 1) using a scalpel to cut off the circuit in the area to be repaired; then using a hard pen to repair and flatten the copper foil in the circuit interface area; using a brush to clean the area to be repaired; then using a needle tube to draw silver oil from a storage bottle, and injecting the silver oil into the pen tip of the pen; then using the pen to brush the silver oil to the area to be repaired; after brushing the silver oil, using a magnifying glass to check whether the area to be repaired is fully brushed with silver oil, and brushing the silver oil in the area not brushed with silver oil, until all the areas to be repaired of the circuit board to be repaired are filled with silver oil, to obtain a first repair product;

[0072] 2) placing the first repair product in an oven for drying treatment to obtain a second repair product;

[0073] 3) using a scalpel to trim the silver oil layer in the second repair product, using sandpaper and a rubber eraser to perform first polishing treatment on the silver oil layer in the second repair product, and using sandpaper to perform second polishing treatment on the silver oil layer in the second repair product, so that the silver oil layer is equal in width to the area to be repaired, to obtain a third repair product;

[0074] 4) turning on the power supply of the rectifier, setting the voltage for copper plating treatment, connecting the brush plating pen, allowing the brush plating pen to have current, and confirming the current for copper plating treatment; coating copper sulfate solution on the surface of the silver oil layer of the third repair product; connecting the brush plating pen to the two ends of the circuit in the area to be repaired, starting the copper plating treatment, and forming a repaired circuit board;

[0075] wherein the width of the area to be repaired is 3mm, the width of the silver oil is 0.1mm, and the resistance of the silver oil is 10Ω;

[0076] The temperature for drying treatment is 150℃, and the time for drying treatment is 40min;

[0077] The mesh number of the sandpaper is 2400 mesh;

[0078] The concentration of copper ions in the copper sulfate solution is 100g / L, the voltage in the copper plating treatment is 6V, the current is 2A, and the time is 150min.

[0079] Example 2

[0080] The repairing method of the present example comprises the following steps:

[0081] 1) using a scalpel to cut off the line of the area to be repaired; then using a hard pen to repair the copper foil of the line interface area; using a brush to clean the area to be repaired; then using a needle tube to extract silver oil from the storage bottle, injecting the silver oil into the pen tip of the pen; then using the pen to brush the silver oil to the area to be repaired; after brushing the silver oil, using a lens to check whether the area to be repaired is fully brushed with silver oil, supplementally brushing silver oil in the area not brushed with silver oil, and obtaining a first repair after all the areas to be repaired of the circuit board to be repaired are filled with silver oil;

[0082] 2) placing the first repair in an oven for drying treatment to obtain a second repair;

[0083] 3) using a scalpel to cut the silver oil layer in the second repair, using sandpaper eraser to perform first polishing treatment on the silver oil layer in the second repair, using sandpaper to perform second polishing treatment on the silver oil layer in the second repair, so that the silver oil layer is equal in width to the area to be repaired, and obtaining a third repair;

[0084] 4) turning on the power supply of the rectifier, setting the voltage of copper plating treatment, connecting the brush plating pen, making the brush plating pen have current, confirming the current of copper plating treatment; coating copper sulfate solution on the surface of the silver oil layer of the third repair; connecting the brush plating pen with the two ends of the line of the area to be repaired, starting copper plating treatment, and forming a repaired circuit board;

[0085] wherein the width of the area to be repaired is 3mm, the width of the line is 0.1mm, and the resistance of the silver oil is 15Ω;

[0086] The temperature of the drying treatment is 150℃, and the time of the drying treatment is 40min;

[0087] The mesh number of the sandpaper is 2400 mesh;

[0088] The concentration of copper ions in the copper sulfate solution is 100g / L, the voltage in the copper plating treatment is 6V, the current is 2A, and the time is 150min.

[0089] Example 3

[0090] The line repairing method of the present example comprises the following steps:

[0091] 1) using a scalpel to cut off the line of the area to be repaired; then using a hard pen to repair the copper foil of the line interface area; using a brush to clean the area to be repaired; then using a needle tube to extract silver oil from the storage bottle, injecting the silver oil into the pen tip of the pen; then using the pen to brush the silver oil to the area to be repaired; after brushing the silver oil, using a lens to check whether the area to be repaired is fully brushed with silver oil, supplementally brushing silver oil in the area not brushed with silver oil, and obtaining a first repair after all the areas to be repaired of the circuit board to be repaired are filled with silver oil;

[0092] 2) Place the first repair into the oven to perform the drying treatment to obtain a second repair;

[0093] 3) Use a scalpel to trim the silver oil layer in the second repair, use sandpaper eraser to perform a first polishing treatment on the silver oil layer in the second repair, and use sandpaper to perform a second polishing treatment on the silver oil layer in the second repair, so that the silver oil layer is equal in width to the area to be repaired, to obtain a third repair;

[0094] 4) Turn on the power of the rectifier, set the voltage of the copper plating treatment, connect the brush plating pen, so that the brush plating pen has current, and confirm the current of the copper plating treatment; apply copper sulfate solution to the surface of the silver oil layer of the third repair; connect the brush plating pen to the two ends of the area to be repaired, start the copper plating treatment, and form a repaired circuit board;

[0095] Wherein, the line width of the area to be repaired is 0.1mm, the width is 3mm, and the resistance of the silver oil is 10Ω;

[0096] The temperature of the drying treatment is 150℃, and the time of the drying treatment is 40min;

[0097] The mesh number of the sandpaper is 2400 mesh;

[0098] The concentration of copper ions in the copper sulfate solution is 100g / L, the voltage in the copper plating treatment is 1.5V, the current is 1A, and the time is 60min.

[0099] Example 4

[0100] The repair method of this embodiment includes the following steps:

[0101] 1) Use a scalpel to cut off the circuit of the area to be repaired; then use a hard pen to repair and flatten the copper foil of the circuit interface area; use a brush to clean the area to be repaired; then use a needle tube to draw silver oil from the storage bottle, and inject the silver oil into the tip of the pen; then use the pen to brush the silver oil to the area to be repaired; after brushing the silver oil, use a magnifying glass to check whether the area to be repaired is fully brushed with silver oil, and brush the silver oil in the area not brushed with silver oil; after all the areas to be repaired of the circuit board to be repaired are filled with silver oil, a first repair is obtained;

[0102] 2) Place the first repair into the oven to perform the drying treatment to obtain a second repair;

[0103] 3) Use a scalpel to trim the silver oil layer in the second repair, use sandpaper eraser to perform a first polishing treatment on the silver oil layer in the second repair, and use sandpaper to perform a second polishing treatment on the silver oil layer in the second repair, so that the silver oil layer is equal in width to the area to be repaired, to obtain a third repair;

[0104] 4) Turn on the power supply of the rectifier, set the voltage of the copper plating treatment, connect the brush plating pen, make the brush plating pen have current, confirm the current of the copper plating treatment; apply the copper sulfate solution to the surface of the silver oil layer of the third repair object; connect the brush plating pen with the two end circuits of the to-be-repaired area, start the copper plating treatment, and form the repaired circuit board;

[0105] The line width of the to-be-repaired area is 0.1 mm, the width is 3 mm, and the resistance of the silver oil is 10Ω.

[0106] The temperature of the drying treatment is 150℃, and the time of the drying treatment is 40 min.

[0107] The mesh number of the sandpaper is 2400 mesh.

[0108] The concentration of copper ions in the copper sulfate solution is 40 g / L, the voltage in the copper plating treatment is 6V, the current is 2A, and the time is 150 min.

[0109] Comparative Example

[0110] The repair method of the comparative example comprises the following steps:

[0111] 1) Cut off the circuit of the to-be-repaired area using a scalpel; then use a hard pen to repair and flatten the copper foil of the circuit interface area; use a brush to clean the to-be-repaired area; then use a needle tube to draw silver oil from a storage bottle, and inject the silver oil into the tip of the pen; then use the pen to brush the silver oil to the to-be-repaired area; after brushing the silver oil, use a magnifying lens to check whether the to-be-repaired area is fully brushed with silver oil, and brush the silver oil in the area where the silver oil is not brushed; after all the to-be-repaired areas of the to-be-repaired circuit board are filled with silver oil, a first repair object is obtained.

[0112] 2) Place the first repair object in an oven to perform a first drying treatment to obtain a second repair object;

[0113] 3) Use a scalpel to trim the silver oil layer in the second repair object, use sandpaper and a rubber eraser to perform a first polishing treatment on the silver oil layer in the second repair object, and use sandpaper to perform a second polishing treatment on the silver oil layer in the second repair object, so that the silver oil layer is the same width as the to-be-repaired area, and a third repair object is obtained.

[0114] 4) Brush the copper paste on the surface of the silver oil of the third repair object, and perform a second drying treatment to obtain a repaired circuit board.

[0115] The line width of the to-be-repaired area is 0.1 mm, the width is 3 mm, and the resistance of the silver oil is 10Ω.

[0116] The temperature of the first drying treatment is 150℃, and the time of the first drying treatment is 40 min.

[0117] The mesh number of the sandpaper is 2400 mesh.

[0118] The copper paste is a colloidal solution with a copper content of 85%, the temperature of the second drying treatment is 150°C, and the time of the second drying treatment is 4h.

[0119] The following tests were performed on the repaired circuit boards obtained in Examples 1-4 and the Comparative Example:

[0120] 1) Continuity test

[0121] The test clips of a multimeter were connected to both ends of the lines in the area to be repaired, and the continuity of the repaired lines was tested.

[0122] It was found that the circuits of the repaired circuit boards obtained in Examples 1-4 and the Comparative Example were all conductive.

[0123] 2) Strength test

[0124] A 3M tape was attached to the repaired area, and then the 3M tape was pulled off to check whether the repaired area fell off.

[0125] It was found that the copper plating layer formed after the copper plating treatment in Examples 1-4 adhered tightly to the repaired circuit board, while the copper plating layer formed after the second drying treatment in the Comparative Example was easily separated from the repaired circuit board.

[0126] 3) Thickness test of the copper plating layer

[0127] A CMI copper thickness tester was used to test the thickness of the copper plating layer.

[0128] It was found that the thickness of the copper plating layer in Example 1 was 22 μm, the thickness of the copper plating layer in Example 2 was 22 μm, the thickness of the copper plating layer in Example 3 was 5 μm, the thickness of the copper plating layer in Example 4 was 9 μm, and the thickness of the copper plating layer in the Comparative Example was uneven, ranging from 5-50 μm.

[0129] Further, since the thickness of the copper plating layer obtained in Examples 3 and 4 was too thin, the copper plating layer in the repaired area would be damaged in subsequent plate grinding and micro-etching treatments, resulting in color differences on the surface of the lines and affecting the subsequent process.

[0130] 4) Impedance test

[0131] The impedance of the repaired circuit boards in Examples 1-4 and the Comparative Example was measured. It was found that the impedance of the repaired circuit boards in Examples 1, 3-4 and the Comparative Example did not change significantly compared to the original circuit board, while the impedance of the repaired circuit board in Example 2 changed significantly. This was because the impedance of the silver oil in Example 2 was too large, resulting in a significant change in the impedance of the repaired circuit board.

[0132] 5) Surface morphology observation

[0133] The morphology of the to-be-repaired area and the morphology of the repaired area after repair in Example 1 were observed using a 100-fold magnifying lens, respectively.

[0134] Figure 2 The surface morphology chart of the to-be-repaired area of the to-be-repaired circuit board in Example 1 under a 100-fold magnifying lens; Figure 3 The surface morphology chart of the repaired area of the repaired circuit board in Example 1 under a 100-fold magnifying lens. From Figure 2 and Figure 3 It can be seen that the plated copper layer formed after repair is equal in width to the to-be-repaired area, and the plated copper layer and the surrounding circuit board are integrated, without an interface, and the outer circuit line of the repaired circuit board obtained is beautiful.

[0135] The morphology of the repaired area in Example 1 and the comparative example was observed using a 200-fold magnifying lens, respectively.

[0136] Figure 4 The surface morphology chart of the repaired area of the repaired circuit board in Example 1 under a 200-fold magnifying lens; Figure 5 The surface morphology chart of the repaired area of the repaired circuit board in the comparative example under a 200-fold magnifying lens. From Figure 4 and Figure 5 It can be seen that the repaired area of the repaired circuit board in Example 1 is relatively smooth, and the surface of the repaired area of the repaired circuit board in the comparative example is rough.

[0137] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A method of line completion, characterized by, The method comprises the following steps: 1) filling silver oil in a to-be-repaired area of a to-be-repaired circuit board to obtain a first repair object; 2) performing drying treatment on the first repair object to obtain a second repair object; 3) performing post-treatment on the silver oil layer in the second repair object, so that the silver oil layer is equal in width to the to-be-repaired area, to obtain a third repair object; 4) performing copper plating treatment on the surface of the silver oil layer of the third repair object by using a rectifier to form a repaired circuit board; The copper plating treatment comprises the following steps: turning on the power supply of the rectifier, setting the voltage of the copper plating treatment, connecting a brush plating pen, allowing the brush plating pen to have current, confirming that the current of the copper plating treatment is consistent with the current to be used, coating a copper sulfate solution on the surface of the silver oil layer of the third repair object, connecting the brush plating pen with two end circuits of the to-be-repaired area, and starting the copper plating treatment. The resistance of the silver oil is less than or equal to 10 Ω. The concentration of copper ions in the copper sulfate solution is greater than or equal to 80 g / L. In the copper plating treatment, the voltage is less than or equal to 6 V, the current is 2-2.5 A, and the time is 120-180 min.

2. The method of claim 1, wherein, The width of the to-be-repaired area is less than or equal to 50 mm.

3. The method of claim 1, wherein, The temperature of the drying treatment is 150-155 ℃, and the time of the drying treatment is 40-50 min.

4. The method of claim 1, wherein, The post-treatment comprises the following steps: performing cutting treatment, first polishing treatment and second polishing treatment on the silver oil layer in the second repair object in sequence.

5. The method of filling in according to any one of claims 1-4, wherein, After the copper plating treatment, the repaired circuit board is subjected to conduction detection treatment and strength detection treatment in sequence.

6. A repair of a circuit board, characterized by The repaired circuit board is obtained by using the repair method according to any one of claims 1-5.

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