Integrated conductive via for optical devices

Abstract

Embodiments of the present disclosure generally relate to optical devices. In particular, embodiments of the present disclosure relate to optical devices having one or more optical component circuits. Optical devices including one or more optical component circuits prevent exposure of light to a user when a conductive path is interrupted by a breach of a hole, for example, to prevent a user from dropping a substrate, or to prevent a user from dropping the optical device. The conductive path allows current to flow from a power source through the hole to one or more light sources and, in some embodiments, to one or more light detectors. A breach of the hole that causes an interruption in the conductive path prevents the provision of current to the one or more light sources and / or the one or more light detectors to prevent (e.g., automatically prevent) exposure of light to the user.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to optical devices. In particular, embodiments of the present disclosure relate to optical devices having one or more optical component circuits. BACKGROUND

[0002] Optical devices can be used to manipulate the propagation of light. One example of an optical device is a flat optical device, such as a metasurface. Another example of an optical device is a waveguide combiner, such as an augmented reality waveguide combiner. Optical devices in the visible and near-infrared spectrum can require structures, such as nanostructures, disposed on a substrate surface having a macroscopic size. However, as an emerging technology, processing a transparent substrate to form an optical device is complex and challenging. The complexity and challenges of processing a transparent substrate present particular demands for improved safety and system durability. For example, it can be desirable to quickly prevent at least one optical device and a user from being exposed to light in the event that the optical device can be potentially damaged. As such, there is a need in the art for optical devices integrated with optical component circuits that immediately turn off light sources and / or light detectors of the optical component circuits if the optical device can be potentially damaged. SUMMARY

[0003] In one embodiment, an optical device is provided. The optical device includes a plurality of structures disposed over a first surface of a substrate of the optical device. The optical device further includes a conductive via surrounding and integrated with the plurality of structures. The conductive via is disposed over the first surface or over a second surface opposite the first surface. The conductive via includes a first via contact and a second via contact. The first via contact is operable to connect to at least one of a light source or a light detector. The second via contact is operable to connect to a power source. The power source is operable to connect to the light source or the light detector at the power source contact.

[0004] In another embodiment, an optical device is provided. The optical device includes a plurality of structures disposed over a first surface of a substrate of the optical device. The optical device further includes a conductive via surrounding and integrated with the plurality of structures. The conductive via is disposed over the first surface or over a second surface opposite the first surface. The conductive via includes a first via contact and a second via contact. The first via contact is operable to connect to at least one of a light source or a light detector. The second via contact is operable to connect to a power source. The power source is operable to connect to the light source or the light detector at the power source contact, such that when at least a portion of the conductive via is broken, power is disconnected from the light source and the light detector.

[0005] In another embodiment, a device is provided. The device includes one or more optical devices. Each optical device includes a plurality of structures and a conductive via disposed above a first surface of a substrate. The conductive via surrounds the plurality of structures and is disposed above the first surface or above a second surface opposite the first surface. The conductive via includes a first via contact and a second via contact. The device further includes at least one of a light source or a detector connected to the first via contact. The device further includes a power supply connected to the second via at a power contact and to the light source or the light detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order that the manner in which the above-described features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be obtained by reference to its embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the drawings illustrate only typical embodiments of the disclosure and are not to be considered limiting of its scope, as the disclosure may admit to other equally effective embodiments.

[0007] FIG. 1A and FIG. 1B is a schematic top view illustrating a substrate of two optical devices having at least one optical component circuit according to one embodiment.

[0008] FIGS. 1C-1G is a schematic cross-sectional view of an optical device according to an embodiment.

[0009] To facilitate understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements disclosed in one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0010] Embodiments described herein generally relate to optical devices having one or more optical component circuits. The optical devices described herein having one or more optical component circuits prevent the optical device and a user from being exposed to light from a light source and / or a light detector when a conductive path of the optical component circuit is interrupted. Embodiments of the optical devices described herein include a plurality of structures disposed above a first surface of a substrate, and a conductive via surrounding and integrated with the plurality of structures, the conductive via being disposed above the first surface or above a second surface opposite the first surface.

[0011] FIG. 1A and FIG. 1B is a schematic top view illustrating a substrate of two optical devices 100 having at least one optical component circuit 102. It will be understood that although two optical devices 100 are illustrated, more or fewer optical devices are contemplated. FIG. 1A and FIG. 1BEach of the optical devices 100 described herein can be coupled to the same optical component circuit 102, although each of the optical devices 100 described herein can be coupled to separate optical component circuits 102. The substrate 101 includes a surface 103 having a length 107 and a width 109. In one embodiment, which can be combined with other embodiments described herein, the surface 103 of the substrate 101 can have a macroscopic dimension, such as a length 107 greater than about 2 centimeters (cm) and a width 109 greater than about 2 cm. In one embodiment, which can be combined with other embodiments described herein, the surface 103 of the substrate can have a macroscopic dimension, such as a length 107 greater than about 0.5 millimeters (mm) and a width greater than about 0.5 mm.

[0012] The substrate 101 can also be selected to transmit an appropriate amount of light at a desired wavelength or range of wavelengths, such as one or more wavelengths from about 100 nanometers (nm) to about 3000 nm. Without limitation, in some embodiments, the substrate 101 is configured such that the substrate 101 transmits greater than or equal to about 50% to about 100% of the infrared (IR) to ultraviolet (UV) region of the optical spectrum. The substrate 101 can be formed of any appropriate material, so long as the substrate 101 can sufficiently transmit light at the desired wavelength or range of wavelengths and can serve as a sufficient support for one or more optical devices 100 described herein. In some embodiments, which can be combined with other embodiments described herein, the material of the substrate 101 has a relatively lower refractive index compared to the refractive index of the structural material of the plurality of structures 112a, 112b of the one or more optical devices 100. In other embodiments, which can be combined with other embodiments described herein, the material of the substrate 101 has a refractive index similar to the refractive index of the structural material of the plurality of structures 112a, 112b of the one or more optical devices 100.

[0013] Substrate selection can include a substrate of any appropriate material, including but not limited to: amorphous dielectrics, non-amorphous dielectrics, crystalline dielectrics, silicon oxide, polymers, and combinations thereof. In some embodiments, which can be combined with other embodiments described herein, the substrate 101 includes a transparent material. In one embodiment, which can be combined with other embodiments described herein, the substrate 101 is transparent, having an absorption coefficient less than 0.001. Suitable examples can include oxides, sulfides, phosphides, tellurides, or combinations thereof. In one example, the substrate 101 includes silicon (Si), silicon dioxide (SiO2), silicon nitride (SiN), fused silica, quartz, silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium nitride (GaN), sapphire, high refractive index transparent materials such as high refractive index glass, or combinations thereof.

[0014] The embodiments described herein provide one or more optical devices 100, such as FIG. 1A and FIG. 1B Optical devices 100A and 100B are shown. In some embodiments that may be combined with other embodiments described herein, the optical devices 100A and 100B are flat optical devices, such as metasurfaces. In other embodiments that may be combined with other embodiments described herein, the optical devices 100A and 100B are waveguide combiners, such as augmented reality waveguide combiners. In one embodiment that may be combined with other embodiments described herein, one or more optical devices 100 may be used in diffuser applications. In another embodiment that may be combined with other embodiments described herein, one or more optical devices 100 may be used as one or more lenses of a camera, such as a cell phone camera for applications that may include, but are not limited to, user identification or image acquisition. In another embodiment that may be combined with other embodiments described herein, one or more optical devices 100 may be used in 3D sensing applications. In another embodiment that may be combined with other embodiments described herein, one or more optical devices 100 may be used in time-of-flight sensing applications. In another embodiment that may be combined with other embodiments described herein, one or more optical devices 100 may be used as one or more lenses or optical elements of an augmented reality device.

[0015] In one embodiment, the optical device 100A, 100B includes a plurality of structures 112a, 112b and holes 114a, 114b. The holes 114a, 114b are disposed around the plurality of structures 112a, 112b, for example, adjacent to the plurality of structures 112a, 112b. In one embodiment that may be combined with other embodiments described herein, the holes 114a, 114b ( FIGS. 1C-1F ) are disposed above the surface 103 of the substrate 101. In another embodiment that may be combined with other embodiments described herein, the holes 114a, 114b ( FIG. 1G 103 ). In one embodiment that may be combined with other embodiments described herein, the auxiliary portion 105 of the surface 103 of the substrate 101 includes one or more auxiliary structures (e.g., dummy structures) disposed on or integrated with the auxiliary portion. In another embodiment that may be combined with other embodiments described herein, the holes 114 a and 114 b are dark field masks and are disposed above the auxiliary portion 105.

[0016] The structures 112a, 112b may be nanostructures having submicron dimensions, for example nanometer-sized dimensions, such as a critical dimension 116 (FIGS. 1C-1G In one embodiment that may be combined with other embodiments described herein, the critical dimension 116 is about 20 nanometers (nm) to about 900 nm. In some embodiments that may be combined with other embodiments described herein, such as FIGS. 1C-1G As shown, at least one of the structures 112a has a critical dimension 116 that is different from the other critical dimensions 116 of the structures 112a. In other embodiments, each of the structures 112a has the same critical dimension 116. In one embodiment that may be combined with other embodiments described herein, the structure 112a of the optical device 100A and the structure 112b of the optical device 100A are the same. In another embodiment that may be combined with other embodiments described herein, the structure 112a of the optical device 100A and the structure 112b of the optical device 100A are different. In one embodiment that may be combined with other embodiments described herein, the structures 112a, 112b are formed from a substrate material. In another embodiment that may be combined with other embodiments described herein, the structures of the structures 112a, 112b include one or more structural materials. Although FIG. 1A and FIG. 1B While the structures 112a, 112b are depicted as having circular or oval cross-sections, the cross-sections of the structures 112a, 112b may have other shapes, including but not limited to square, rectangular, triangular, and / or irregularly shaped cross-sections. FIG. 1A and FIG. 1B While the structures 112a, 112b are depicted as being arranged in a rectangular pattern, the structures 112a, 112b may be arranged in other patterns, such as square, circular, oval, triangular, and / or irregularly shaped patterns. FIG. 1A and FIG. 1B While the apertures 114a, 114b are depicted as having a circular shape, the apertures 114a, 114b may have other shapes, such as rectangular, square, circular, oval, triangular, and / or irregular shapes. In some embodiments, which may be combined with other embodiments described herein, the apertures 114a, 114b are a different shape than the pattern of the structures 112a, 112b.

[0017] In one embodiment that may be combined with other embodiments described herein, the structural material of structures 112a, 112b includes a non-conductive material, such as a dielectric material. The dielectric material may include an amorphous dielectric, a non-amorphous dielectric, and a crystalline dielectric. Examples of dielectric materials include, but are not limited to, silicon-containing materials such as Si, silicon nitride (Si3N4), silicon oxynitride, and silicon dioxide. Silicon may be crystalline silicon, polycrystalline silicon, and / or amorphous silicon (amorphous silicon). In another embodiment that may be combined with other embodiments described herein, the structural material of structures 112a, 112b includes a metal-containing dielectric material. Examples of metal-containing dielectric materials include, but are not limited to, materials containing titanium dioxide (TiO2), zinc oxide (ZnO), tin dioxide (SnO2), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), cadmium tin oxide (Cd2SnO4), zinc tin oxide (SnZnO3), and niobium oxide (Nb2O5).

[0018] As described, the apertures 114a, 114b are disposed around the plurality of structures 112a, 112b, for example, adjacent to the plurality of structures 112a, 112b. In one embodiment that may be combined with other embodiments described herein, the optical devices 100A, 100B may include one or more additional apertures in addition to the apertures 114a, 114b. The apertures 114a, 114b have a width 118. In one embodiment that may be combined with other embodiments described herein, the width 118 is uniform throughout the apertures 114a, 114b. In another embodiment that may be combined with other embodiments described herein, the width 118 varies across at least a portion of the apertures 114a, 114b. In one embodiment that may be combined with other embodiments described herein, the width 118 is between approximately 10 μm and approximately 1000 μm. In one embodiment that may be combined with other embodiments described herein, the apertures 114a, 114b form a closed loop. In another embodiment that may be combined with other embodiments described herein, the apertures 114a, 114b have an opening. The holes 114a, 114b include one or more hole materials. The one or more hole materials include at least one conductive material. In one embodiment that may be combined with other embodiments described herein, the one or more hole materials may also include an opaque material so as not to transmit one or more wavelengths in the range of about 100 to about 3000 nm. The opaque holes 114a, 114b can prevent stray light (i.e., light from an incident light beam that is larger than the surface area of ​​the structures 112a, 112b) from degrading the function of the optical devices 102a, 102b. In another embodiment that may be combined with other embodiments described herein, the one or more hole materials may also include a transparent material so as to transmit one or more wavelengths in the range of about 100 to about 3000 nm. The one or more hole materials (also, hole materials) include, but are not limited to, materials containing chromium (Cr), titanium nitride (TiN), amorphous silicon, titanium (Ti), titanium oxide (TiO2), indium tin oxide (ITO), gold (Au), copper (Cu), tungsten (W), and aluminum (Al).

[0019] FIGS. 1C-1E Figure 1 is a schematic cross-sectional view of an optical device 100A. FIG. 1C As shown, in one embodiment that may be combined with other embodiments described herein, the optical device 100A includes a hole 114a and a structure 112a disposed on the surface 103 of the substrate 101. FIG. 1D As shown, in one embodiment that can be combined with other embodiments described herein, the optical device 100A includes a structure 112a disposed on the surface 103 of the substrate 101, and the hole 114a is disposed on the peripheral structure 126 of the structure 112a. FIG. 1EAs shown, in one embodiment, which can be combined with other embodiments described herein, optical device 100A includes structure 112a disposed on surface 103 of substrate 101, and aperture 114a is disposed on a remaining portion of hard mask 128 disposed on peripheral structure 126 of structure 112a. Hard mask 128 can be utilized during fabrication of optical device 100A, and the remaining portion of hard mask 128 can remain under aperture 114a. In one embodiment, which can be combined with other embodiments described herein, the remaining portion of hard mask 128 can function as an aperture. As shown, in one embodiment, which can be combined with other embodiments described herein, optical device 100A includes structure 112a disposed on surface 103 of substrate 101, and aperture 114a is disposed on encapsulation layer 130 disposed over structure 112a. As shown, in one embodiment, which can be combined with other embodiments described herein, structure 112a is disposed on surface 103, and aperture 114a is disposed on surface 113 of substrate 101 opposite surface 103 of substrate 101. FIG. 1F As shown, in one embodiment, which can be combined with other embodiments described herein, optical device 100A includes structure 112a disposed on surface 103 of substrate 101, and aperture 114a is disposed on encapsulation layer 130 disposed over structure 112a. As shown, in one embodiment, which can be combined with other embodiments described herein, structure 112a is disposed on surface 103, and aperture 114a is disposed on surface 113 of substrate 101 opposite surface 103 of substrate 101. FIG. 1G As shown, in one embodiment, which can be combined with other embodiments described herein, optical device 100A includes structure 112a disposed on surface 103 of substrate 101, and aperture 114a is disposed on encapsulation layer 130 disposed over structure 112a. As shown, in one embodiment, which can be combined with other embodiments described herein, structure 112a is disposed on surface 103, and aperture 114a is disposed on surface 113 of substrate 101 opposite surface 103 of substrate 101.

[0020] Optical component circuit 102 includes one of one or more light sources 106. In another embodiment, which can be combined with other embodiments described herein, optical component circuit 102 also includes one or more light detectors 108. One or more light sources 106 and / or one or more light detectors 108 can be positioned in a propagation direction of one or more optical devices 100. One or more light sources 106 include, but are not limited to, a display (e.g., a microdisplay) and / or a light emitting device. A display includes, but is not limited to, a liquid crystal display (LCD) or any other display operable with one or more optical devices 100. A light emitting device includes, but is not limited to, a light-emitting diode (LED), a laser, a vertical-cavity surface-emitting laser (VCSEL), a non-VCSEL laser, or any light emitter. One or more light detectors 108 include, but are not limited to, a complementary metal-oxide-semiconductor (CMOS) detector or any other light detector operable with one or more optical devices 100.

[0021] One or more light sources 106 and, in some embodiments, one or more light detectors 108 of the optical component circuit 102 are electrically connected to the apertures 114a, 114b at a first aperture contact 120a and to the power source 104 at a power contact 122. The one or more light sources 106 and, in some embodiments, the one or more light detectors 108 are electrically connected via one or more wires 110. The power source 104 includes, but is not limited to, a battery, an actuator, or any other power source operable to provide power to the one or more light sources 106 and, in some embodiments, the one or more light detectors 108. The power source 104 is electrically connected via the wires 110. The power source 104 is electrically connected to the apertures 114a, 114b at a second aperture contact 120b to complete the optical component circuit 102. The optical component circuit 102 provides a conductive path 124 for current to flow from the power source 104 through the apertures 114a, 114b to the one or more light sources 106 and, in some embodiments, to the one or more light detectors 108.

[0022] like FIG. 1A As shown, when the aperture 114a is unbroken, the optical component circuit 102 of the optical device 100A provides a conductive path 124. When a portion of the aperture 114a is broken, the one or more light sources 106 and, in some embodiments, the one or more light detectors 108 are not powered. In some embodiments that may be combined with other embodiments described herein, with each of the optical devices 100A, 100B being coupled to the same optical component circuit 102, if one of the aperture 114a and the aperture 114b is broken, current does not flow to the one or more light sources 106 and / or the one or more light detectors 108 of the optical devices 100A, 100B. In some embodiments that may be combined with other embodiments described herein, with each of the optical devices 100A, 100B being coupled to a separate optical component circuit 102, as FIG. 1B As shown, if the hole 114a is broken, current does not flow to the one or more light sources 106 and / or one or more light detectors 108 of the optical device 100A, while current flows to the one or more light sources 106 and / or one or more light detectors 108 of the optical device 100B.

[0023] In summary, optical devices 100 having one or more optical component circuits 102 are provided. The optical devices 100 having one or more optical component circuits 102 described herein prevent exposure of light to a user when the conductive path 124 is interrupted via a hole breach, for example, to prevent a user from dropping the substrate 101, or to prevent a user from dropping the optical device 100A, 100B. The hole breach that causes the interruption of the conductive path 124 prevents the provision of electrical current to the one or more light sources 106 and / or the one or more light detectors 108 to prevent (e.g., automatically prevent) exposure of light to the user.

[0024] While the foregoing is directed to implementations of the present disclosure, other and further implementations of the disclosure can be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims

1. An optical device comprising: a plurality of structures disposed over a first surface of a substrate of the optical device and configured for an augmented reality waveguide; a conductive via, the conductive via surrounding the plurality of structures at a periphery of a region in which the plurality of structures are formed and integrated with the plurality of structures, the conductive via being disposed above the first surface or above a second surface opposite to the first surface, the conductive via having a first via contact point and a second via contact point, wherein: The first via contact is operable to connect to at least one of: light source; or a light detector; and The second aperture contact is operable to connect to a power source, and the power source is operable to connect to the light source or the light detector at the power contact. 2 . The optical device according to claim 1 , wherein the conductive hole is provided on a peripheral structure of the plurality of structures. 3 . The optical device of claim 2 , wherein the conductive hole is disposed on a remaining portion of a hard mask disposed on the peripheral structure of the plurality of structures. 4 . The optical device according to claim 1 , wherein an encapsulation layer is disposed over the plurality of structures and the first surface of the substrate, and the conductive via is disposed on the encapsulation layer. The optical device according to claim 1 , wherein the conductive hole has a circular, rectangular, square, elliptical, triangular, or irregular shape.

6. The optical device according to claim 1, wherein the hole material of the conductive hole includes a material containing chromium (Cr), titanium nitride (TiN), amorphous silicon, titanium (Ti), titanium oxide (TiO2), indium tin oxide (ITO), gold (Au), copper (Cu), tungsten (W), aluminum (Al), or a combination thereof.

7. An optical device comprising: a plurality of structures disposed over a first surface of a substrate of the optical device and configured for an augmented reality waveguide; a conductive via, the conductive via surrounding the plurality of structures at a periphery of a region in which the plurality of structures are formed and integrated with the plurality of structures, the conductive via being disposed above the first surface or above a second surface opposite to the first surface, the conductive via having a first via contact point and a second via contact point, wherein: The first via contact is operable to connect to at least one of: light source; or a light detector; and The second hole contact point is operable to connect to a power source, and the power source is operable to connect to the light source or the light detector at the power contact point, so that when at least a portion of the conductive hole is broken, power is disconnected from the light source and the light detector. The optical device according to claim 7 , wherein the conductive hole is provided on a peripheral structure of the plurality of structures. 9 . The optical device of claim 8 , wherein the conductive via is disposed on a remaining portion of a hard mask disposed on the peripheral structure of the plurality of structures. 10 . The optical device according to claim 8 , wherein an encapsulation layer is disposed over the plurality of structures and the first surface of the substrate, and the conductive via is disposed on the encapsulation layer.

11. The optical device according to claim 8, wherein the conductive hole has a circular, rectangular, square, elliptical, triangular, or irregular shape.

12. The optical device according to claim 8, wherein the hole material of the conductive hole includes a material containing chromium (Cr), titanium nitride (TiN), amorphous silicon, titanium (Ti), titanium oxide (TiO2), indium tin oxide (ITO), gold (Au), copper (Cu), tungsten (W), aluminum (Al), or a combination thereof.

13. The optical device according to claim 8, wherein the structural materials of the plurality of structures include materials containing titanium dioxide (TiO2), zinc oxide (ZnO), tin dioxide (SnO2), aluminum-doped zinc oxide (AZO), fluorine-doped tin oxide (FTO), cadmium stannate (Cd2SnO4), zinc stannate (SnZnO3), and niobium oxide (Nb2O5), Si, silicon nitride (Si3N4), silicon oxynitride, silicon dioxide, or a combination thereof.

14. An apparatus comprising: One or more optical devices, each optical device comprising: a plurality of structures disposed over the first surface of the substrate and configured for an augmented reality waveguide; as well as a conductive via, the conductive via surrounding the plurality of structures at a periphery of a region in which the plurality of structures are formed, the conductive via being disposed above the first surface or above a second surface opposite to the first surface, the conductive via including a first via contact point and a second via contact point; at least one of a light source or a detector connected to the first hole contact; as well as A power source is connected to the second aperture contact and to the light source or the detector at a power contact.

15. The device of claim 14, wherein each optical device further comprises a conductive path for flowing current from the power source through the conductive aperture to the light source or the detector.

16. The apparatus of claim 15, wherein the conductive path is operable to be interrupted to prevent the flow of the current from the power source to the light source or the detector.

17. The device of claim 16, wherein the first conductive path of the first optical device is interrupted and the second conductive path of the second optical device is operable to allow the current to flow from the power source through the conductive aperture to the light source or the detector.

18. The apparatus of claim 14, wherein the plurality of structures are nanostructures having submicron dimensions less than 1 micrometer (μm). The device of claim 14 , wherein the conductive via has a width between 10 μm and 1000 μm.

20. The device of claim 14, wherein the one or more light sources comprise a display or a light emitting device.

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