A solder application structure and a solder application method based on a cermet cavity

Abstract

The present invention discloses a soldering structure and a soldering method based on a cermet cavity, which relate to the technical field of electronic packaging. Among them, the soldering structure based on the cermet cavity includes a soldering part, a positioning base and a soldering base; the soldering part includes a soldering main body, soldering needles and positioning needles. The soldering main body includes a plate body and side walls. The plate body and the side walls together form a receiving cavity. A plurality of soldering needles are arranged at intervals in the receiving cavity, and the plurality of soldering needles are used to correspond to the to-be-soldered points in the cermet cavity one by one; the positioning base includes a receiving groove and a first positioning hole. One end of the positioning needle is connected to the side wall, and the other end of the positioning needle is used to insert into the first positioning hole; the soldering base includes a solder placement groove and a second positioning hole, and the second positioning hole is used for the positioning needle to insert. The present disclosure can not only effectively improve the soldering efficiency, but also, because the structures of the plurality of soldering needles are similar and the soldering amounts are also similar, it can effectively ensure the soldering effect of each to-be-soldered point.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and particularly relates to a tinning structure and a tinning method based on a cermet cavity. Background Art

[0002] For the increasing demand for integration, the chip flip-chip soldering technology is an effective way to miniaturize microwave devices. However, most microwave devices have requirements for airtightness and metal shielding, and the packaging of microwave devices generally uses a cermet cavity and a metal / ceramic cover for airtight packaging. At present, most flip-chip chips use stencil / screen printing for tinning, chip mounting, and then reflow soldering to achieve chip soldering.

[0003] However, the solder pads of the cermet cavity are concentrated inside the ceramic cavity. Due to the blockage of the side wall of the cermet cavity, the conventional stencil / screen printing tinning process cannot be used. In the related art, generally, manual tinning is carried out one by one on the tinning points, which not only has low operation efficiency but also poor tinning effect. Summary of the Invention

[0004] The purpose of the present invention is to provide a tinning structure and a tinning method based on a cermet cavity in order to solve the above technical problems.

[0005] The technical solution adopted by the present invention is as follows:

[0006] To achieve the purpose of the present invention, according to one aspect of the present disclosure, a tinning structure based on a cermet cavity is provided, including:

[0007] A tinning part, the tinning part includes a tinning main body, a plurality of tinning needles installed on the tinning main body, and a positioning needle installed on the tinning main body. The tinning main body includes a plate body and side walls connected to the edge of the plate body. The plate body and the side walls together form a receiving cavity. The plurality of tinning needles are arranged at intervals in the receiving cavity and are connected to the plate body, and the lowest point of the side wall is lower than the lowest point of the tinning needles. The plurality of tinning needles are used to correspond to the tinning points in the cermet cavity one by one;

[0008] A positioning base, the positioning base includes a receiving groove and a first positioning hole formed in the receiving groove. The receiving groove is used to accommodate the cermet cavity. One end of the positioning needle is connected to the side wall, and the other end of the positioning needle is used to insert into the first positioning hole;

[0009] A tinning base, the tinning base includes a tinning groove and a second positioning hole. The shape of the tinning groove matches the shape of the structure surrounded by the plurality of tinning needles. The second positioning hole is arranged on the tinning base and is located outside the tinning groove. The second positioning hole is used for the positioning needle to insert.

[0010] Optionally, multiple tinning pins are arranged in an array.

[0011] Optionally, a groove is formed at one end of the tinning pin away from the plate body, and the groove is used to accommodate solder paste and / or flux.

[0012] Optionally, the positioning base further includes a fine-tuning component, the fine-tuning component includes four fine-tuning parts, the four fine-tuning parts are arranged in pairs opposite to each other, and the four fine-tuning parts are respectively located around the accommodating groove. The fine-tuning part penetrates through the positioning base and can move along the axial direction of the fine-tuning part. One end of the fine-tuning part is located in the accommodating groove and is used to abut against the side wall of the metal-ceramic cavity, and the other end of the fine-tuning part is located outside the accommodating groove, so that the fine-tuning part can be used to adjust the position of the metal-ceramic cavity in the accommodating groove.

[0013] Optionally, the fine-tuning part includes a connecting rod and a first block and a second block respectively connected to both ends of the connecting rod. The connecting rod is formed as a threaded rod, and the connecting rod is threadedly connected to the positioning base. The first block is located in the accommodating cavity, and the second block is located outside the accommodating cavity.

[0014] Optionally, the first block is formed as a cylinder; and / or,

[0015] The second block is formed as a cylinder.

[0016] Optionally, at least one observation hole is further formed on the plate body, and a marking point corresponding to the observation hole is arranged on the bottom wall of the metal-ceramic cavity. When the observation hole is aligned with the marking point, the tinning pins are in one-to-one correspondence with the points to be tinned in the metal-ceramic cavity.

[0017] Optionally, the first positioning hole is filled with an elastic member, so that after the positioning pin of the tinning member is inserted into the first positioning hole, the tinning pins of the tinning member can have a spacing from the metal-ceramic cavity.

[0018] According to another aspect of the present disclosure, there is also provided a tinning method based on a metal-ceramic cavity, which is applied to the tinning structure based on a metal-ceramic cavity described in any one of the above technical solutions. The tinning method includes:

[0019] Applying a first flux to the inner bottom wall of the metal-ceramic cavity, applying a second flux to one end of the tinning pin away from the plate body, applying a third flux to the inner bottom wall of the solder placement groove, and then filling the solder placement groove with solder paste; wherein, the viscosity of the first flux is greater than the viscosity of the second flux, and the viscosity of the second flux is greater than the viscosity of the third flux;

[0020] Insert the positioning pins of the tinning part into the second positioning holes of the tinning base, so that the composition of solder paste and the third soldering flux is adsorbed by the second soldering flux on the tinning pins; then insert the positioning pins of the tinning part into the first positioning holes of the positioning base, so that the composition of the second soldering flux, solder paste and the third soldering flux is adsorbed by the first soldering flux in the cermet cavity.

[0021] Optionally, the tinning method further includes a fine-tuning step:

[0022] Arrange an elastomer in the first positioning hole, so that when the positioning pins of the tinning part are inserted into the first positioning hole, there is a spacing between the composition of the second soldering flux, solder paste and the third soldering flux and the first soldering flux;

[0023] Adjust the fine-tuning component so that the observation hole on the tinning part can be aligned with the marking point on the tinning base;

[0024] Apply a pressure to the tinning part towards the tinning base, so that the composition of the second soldering flux, solder paste and the third soldering flux contacts the first soldering flux.

[0025] The beneficial effects of the present invention at least include:

[0026] Through the above technical solution, the present disclosure can complete the tinning operation of the to-be-tinned points inside the cermet cavity at one time through multiple tinning pins on the tinning part, which can not only effectively improve the tinning efficiency, but also, since the structures of multiple tinning pins are similar and the tinning amounts are also similar, can effectively ensure the tinning effect of each to-be-tinned point.

[0027] Among them, the positioning base is used to define the positions of the cermet cavity and the tinning part, so that the tinning part can correspond to the cermet cavity, facilitating the tinning operation. The tinning base is used to add solder paste and / or soldering flux to the tinning groove more evenly, so that the tinning part can adsorb the solder paste and / or soldering flux from the tinning groove onto the tinning pins more evenly. The tinning part is used to add solder paste to the corresponding to-be-tinned points more evenly.

[0028] Other beneficial effects or advantages of the present invention will be described in detail in the specific implementation manner in combination with its specific structure. Description of the Drawings

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the proportional relationships of the various components in the drawings of this specification do not represent the proportional relationships in actual material selection and design. It is only a schematic diagram of the structure or position, where:

[0030] Figure 1 It is a schematic structural diagram of a tinning structure based on a cermet cavity provided by an embodiment of the present disclosure, where the cermet cavity is also shown;

[0031] Figure 2 It is a schematic structural view of a positioning base provided by an embodiment of the present disclosure, wherein a fine-tuning member is also shown;

[0032] Figure 3 It is a schematic structural view of a solder application member provided by an embodiment of the present disclosure;

[0033] Figure 4 It is a schematic structural view of a solder application needle provided by an embodiment of the present disclosure;

[0034] Figure 5 It is a schematic structural view of a cermet cavity provided by an embodiment of the present disclosure;

[0035] Figure 6 It is a schematic structural view of a solder application base provided by an embodiment of the present disclosure, wherein a solder application member and a scraper are also shown.

[0036] Explanation of reference numerals in the drawings:

[0037] 1 - Solder application member; 11 - Solder application main body; 111 - Plate body; 1111 - Observation hole; 112 - Side wall; 113 - Accommodation cavity; 12 - Solder application needle; 121 - Groove; 13 - Positioning needle; 2 - Positioning base; 21 - Accommodation groove; 22 - First positioning hole; 3 - Solder application base; 31 - Tin placement groove; 32 - Second positioning hole; 4 - Fine-tuning member; 41 - Connecting rod; 42 - First block; 43 - Second block; 100 - Cermet cavity; 101 - Marking point; 102 - Point to be tinned; 200 - Scraper. Detailed implementation manners

[0038] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention, that is, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0039] In the present disclosure, unless otherwise stated, the orientation terms such as "upper" and "lower" refer to the up and down directions defined by the solder application structure and method based on the cermet cavity of the present disclosure in the use state. The orientation terms such as "inner" and "outer" refer to the inside and outside of the specific structural contour. The terms such as "first" and "second" are only used to distinguish one element from another element, and do not have sequentiality and importance.

[0040] In addition, the orientation terms used above are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as a limitation to the present disclosure.

[0041] As Figures 1 to 6 shown, according to one aspect of the present disclosure, a tinning structure based on a cermet cavity is provided, including a tinning member 1, a positioning base 2, and a tinning base 3; the tinning member 1 includes a tinning main body 11, a plurality of tinning needles 12 mounted on the tinning main body 11, and a positioning needle 13 mounted on the tinning main body 11. The tinning main body 11 includes a plate body 111 and side walls 112 connected to the edge of the plate body 111. The plate body 111 and the side walls 112 together form a receiving cavity 113. The plurality of tinning needles 12 are arranged at intervals in the receiving cavity 113 and connected to the plate body 111, and the lowest point of the side walls 112 is lower than the lowest point of the tinning needles 12. The plurality of tinning needles 12 are used to correspond to the to-be-tinned points 102 in the cermet cavity 100 one by one; the positioning base 2 includes a receiving groove 21 and a first positioning hole 22 formed in the receiving groove 21. The receiving groove 21 is used to receive the cermet cavity 100. One end of the positioning needle 13 is connected to the side walls 112, and the other end of the positioning needle 13 is used to insert into the first positioning hole 22; the tinning base 3 includes a tinning groove 31 and a second positioning hole 32. The shape of the tinning groove 31 matches the shape of the structure surrounded by the plurality of tinning needles 12. The second positioning hole 32 is provided on the tinning base 3 and located outside the tinning groove 31. The second positioning hole 32 is used for the positioning needle 13 to insert.

[0042] Through the above technical solution, the present disclosure can complete the tinning operation of the to-be-tinned points 102 inside the cermet cavity 100 at one time through the plurality of tinning needles 12 on the tinning member 1, which can not only effectively improve the tinning efficiency, but also, since the structures of the plurality of tinning needles 12 are similar and the tinning amounts are also similar, can effectively ensure the tinning effect of each to-be-tinned point.

[0043] Among them, the positioning base 2 is used to define the positions of the cermet cavity 100 and the tinning member 1, so that the tinning member 1 can correspond to the cermet cavity 100, facilitating the tinning operation. The tinning base 3 is used to add the solder paste and / or flux more evenly into the tinning groove 31, so that the tinning member 1 can adsorb the solder paste and / or flux from the tinning groove 31 more evenly onto the tinning needles 12. The tinning member 1 is used to add the solder paste more evenly onto the corresponding to-be-tinned points 102.

[0044] It can be understood that a reinforcing rib structure can also be provided at the connection part between the tinning needle 12 and the plate body 111 of the present disclosure. On the one hand, it is beneficial to make the tinning needle 12 perpendicular to the plate body 111, so that the ends of the plurality of tinning needles 12 far from the plate body 111 can be located in the same plane, which is beneficial to the tinning operation.

[0045] As an exemplary description, the working process / principle of the present disclosure may be as follows: First, solder paste is placed in the solder placement groove 31 of the solder application base 3, and then the positioning pins 13 of the solder application member 1 are inserted into the second positioning holes 32, so that a certain amount of solder paste can be adsorbed on the solder application pins 12. Then, the metal-ceramic cavity 100 is placed in the accommodation groove 21 of the positioning base 2, and the positioning pins 13 of the solder application member 1 adsorbed with solder paste are inserted into the first positioning holes 22, so that the solder paste on the solder application pins 12 can be correspondingly applied to the solder points 102 to be soldered on the metal-ceramic cavity 100, that is, the solder application operation is completed.

[0046] It can be understood that in the present disclosure, the arrangement of the solder application pins 12 should correspond to the solder points 102 to be soldered on the metal-ceramic cavity 100, and the present disclosure does not make specific limitations thereon. For example, in an exemplary embodiment, as Figure 3 shown, multiple solder application pins 12 of the present disclosure can be arranged in an array.

[0047] In an exemplary embodiment of the present disclosure, as Figure 4 shown, a groove 121 can be formed at one end of the solder application pin 12 away from the plate body 111, and the groove 121 is used to accommodate solder paste and / or flux. In this way, on the one hand, the solder application pin 12 can more effectively adsorb solder paste and / or flux; on the other hand, the adsorbed solder paste can have a considerable volume, which is beneficial to ensuring the solder application effect.

[0048] It can be understood that the present disclosure does not make specific limitations on the shape of the groove 121. For example, the groove 121 can be formed into a cylindrical shape or a hemispherical shape, and the hemispherical groove 121 is beneficial to removing solder paste and flux. In addition, the volume of the groove 121 can also be selected according to actual needs, so that the amount of solder paste and flux that it can accommodate can meet the requirements.

[0049] In an embodiment of the present disclosure, the positioning base 2 of the present disclosure may further include a fine-tuning component. The fine-tuning component includes four fine-tuning members 4. The four fine-tuning members 4 are arranged in pairs opposite to each other, and the four fine-tuning members 4 are respectively located around the accommodation groove 21. The fine-tuning members 4 penetrate through the positioning base 2 and can move along the axial direction of the fine-tuning members 4. One end of the fine-tuning member 4 is located in the accommodation groove 21 and is used to abut against the side wall 112 of the metal-ceramic cavity 100, and the other end of the fine-tuning member 4 is located outside the accommodation groove 21, so that the fine-tuning member 4 can be used to adjust the position of the metal-ceramic cavity 100 in the accommodation groove 21.

[0050] In this way, the fine-tuning component can effectively adjust the position of the metal-ceramic cavity 100 in the positioning base 2, so as to facilitate the reliable and accurate docking of the solder application member 1 and the metal-ceramic cavity 100.

[0051] The fine-tuning member 4 of the present disclosure has various embodiments. For example, in an exemplary embodiment, as Figure 1 and Figure 2 shown, the fine-tuning member 4 of the present disclosure may include a connecting rod 41 and a first block 42 and a second block 43 respectively connected to both ends of the connecting rod 41. The connecting rod 41 is formed as a threaded rod, and the connecting rod 41 is threadedly connected to the positioning base 2. The first block 42 is located in the accommodating cavity 113, and the second block 43 is located outside the accommodating cavity 113. In this way, by rotating the second block 43, the connecting rod 41 can move in its axial direction, so that the first block 42 can abut against the cermet cavity 100 and move in the accommodating groove 21.

[0052] In another embodiment of the present disclosure, the fine-tuning member 4 may also include only one adjusting rod. The adjusting rod passes through the positioning base 2, and one end of the adjusting rod is located in the accommodating groove 21 and is used to abut against the cermet cavity 100, and the other end is located outside the positioning base 2 for easy manual operation.

[0053] The present disclosure does not limit the specific structures of the first block 42 and the second block 43. For example, in the present disclosure, both the first block 42 and the second block 43 may be formed as cylinders, or may have various structures such as triangular plates and quadrangular prisms.

[0054] To facilitate observing whether the tinning member 1 is aligned with the cermet cavity 100, in an embodiment of the present disclosure, as Figure 1 and Figure 3 shown, at least one observation hole 1111 may be formed on the plate body 111 of the present disclosure, and a marking point 101 corresponding to the observation hole 1111 is provided on the bottom wall of the cermet cavity 100. When the observation hole 1111 is aligned with the marking point 101, the tinning needles 12 correspond to the points to be tinned 102 in the cermet cavity 100 one by one. In this way, it is beneficial to check in real time whether the tinning member 1 is aligned with the cermet cavity 100, which is beneficial to ensuring the tinning effect.

[0055] The present disclosure does not specifically limit the shape of the observation hole 1111. For example, it may be a circular hole, a square hole, a triangular hole, etc. The present disclosure also does not specifically limit the shape of the marking point 101. It may be planar or three-dimensional, may be triangular, or may be square, circular or cross-shaped.

[0056] In an embodiment of the present disclosure, the first positioning hole 22 of the present disclosure may be filled with an elastic member (not shown), so that after the positioning pin 13 of the soldering member 1 is inserted into the first positioning hole 22, the soldering pin 12 of the soldering member 1 can have a spacing from the cermet cavity 100. In this way, after the positioning pin 13 of the soldering member 1 is inserted into the first positioning hole 22, there is still a certain spacing between the soldering pin 12 and the cermet cavity 100, and the soldering of the solder point 102 will not be directly performed. This is beneficial for the operator to judge in real time whether the soldering member 1 is aligned with the cermet cavity 100, and then by applying a pressure to the soldering member 1 towards the cermet cavity 100, the soldering pin 12 can be brought into contact with the cermet cavity 100, thereby completing the soldering operation.

[0057] The present disclosure does not limit the specific structure of the elastic member. For example, it can be a rubber ball, a foam column, a plastic ball, etc.

[0058] According to another aspect of the present disclosure, a soldering method based on the cermet cavity 100 is also provided, which is applied to the soldering structure based on the cermet cavity 100 according to any one of the above technical solutions. The soldering method includes:

[0059] Apply the first flux to the inner bottom wall of the cermet cavity 100, apply the second flux to the end of the soldering pin 12 away from the plate body 111, apply the third flux to the inner bottom wall of the solder placement groove 31, and then fill the solder placement groove 31 with solder paste; wherein, the viscosity of the first flux is greater than that of the second flux, and the viscosity of the second flux is greater than that of the third flux;

[0060] Insert the positioning pin 13 of the soldering member 1 into the second positioning hole 32 of the soldering base 3, so that the composition of the solder paste and the third flux is adsorbed by the second flux on the soldering pin 12; then insert the positioning pin 13 of the soldering member 1 into the first positioning hole 22 of the positioning base 2, so that the composition of the second flux, the solder paste and the third flux is adsorbed by the first flux in the cermet cavity 100.

[0061] In this way, since the viscosity of the second flux is greater than that of the third flux, the second flux on the soldering pin 12 can adsorb the composition of the solder paste and the third flux in the solder placement groove 31 (i.e., the layered deposit of the solder paste and the third flux) onto the soldering pin 12. Then, since the viscosity of the first flux is greater than that of the second flux, the first flux in the cermet cavity 100 can adsorb the composition of the second flux, the solder paste and the third flux on the soldering pin 12 (i.e., the layered deposit of the second flux, the solder paste and the third flux) onto the solder point 102 in the cermet cavity 100, thereby completing the soldering operation.

[0062] Among them, it can be understood that the coating thicknesses of the first flux, the second flux, and the third flux, as well as the depth of the solder placement groove 31, can be selected according to actual situations, and the present disclosure does not make specific limitations thereon. For example, in one implementation, the coating thicknesses of the first flux, the second flux, and the third flux can all be 10 micrometers, and the depth of the solder placement groove 31 can be 100 micrometers (that is, the depth of the solder paste is 90 micrometers).

[0063] In one implementation of the present disclosure, the method of the present disclosure may further include a fine-tuning step:

[0064] An elastomer is provided in the first positioning hole 22 such that when the positioning pin 13 of the solder application member 1 is inserted into the first positioning hole 22, there is a spacing between the composition of the second flux, the solder paste, and the third flux and the first flux;

[0065] Adjust the fine-tuning assembly so that the observation hole 1111 on the solder application member 1 can be aligned with the marking point 101 on the solder application base 3;

[0066] Apply a pressure to the solder application member 1 towards the solder application base 3 so that the composition of the second flux, the solder paste, and the third flux contacts the first flux.

[0067] As an exemplary statement, in an exemplary operation method of the present disclosure, the solder application method may specifically be: First step, clean each tool with deionized water and dry it.

[0068] Second step, evenly apply the first flux to the inside of the metal-ceramic cavity 100.

[0069] Third step, evenly apply the second flux to the end of the solder application needle away from the plate body 111.

[0070] Fourth step, evenly apply the third flux to the solder placement groove 31.

[0071] Fifth step, use a squeegee 200 to scrape the solder paste into the solder placement groove 31 coated with the third flux to fill the solder placement groove 31 with the solder paste.

[0072] Sixth step, insert the positioning pin 13 of the solder application member 1 into the second positioning hole 32, and then evenly and parallelly press down the solder application member 1 so that the solder paste is adsorbed to the end of the solder application needle 12 away from the plate body 111.

[0073] Seventh step, place the metal-ceramic cavity 100 into the positioning base 2, and use the fine-tuning assembly to fix the position of the metal-ceramic cavity 100 as much as possible to the center position of the positioning base 2.

[0074] Step 8: Insert the positioning pins 13 of the solder application part 1 with solder paste adsorbed into the first positioning holes 22. Due to the blockage of the elastomer in the first positioning holes 22, at this time, there is a certain distance between the solder application needles 12 and the cermet cavity 100.

[0075] Step 9: Adjust the fine-tuning part 4 to align the solder application part 1 with the cermet cavity 100.

[0076] Step 10: Apply a downward pressure to the solder application part 1 to make the solder paste on the solder application needles 12 fully contact the inner wall of the cermet cavity 100 coated with the first soldering flux.

[0077] Step 11: Remove the solder application part 1 and check the tin soldering condition inside the cermet cavity 100.

[0078] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0079] In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any appropriate manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination manners.

[0080] Furthermore, any combination can be made among various different embodiments of the present disclosure, as long as it does not violate the idea of the present disclosure, and it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A tinning structure based on a cermet cavity, characterized in that, it includes: A tinning part (1), the tinning part (1) includes a tinning main body (11), a plurality of tinning needles (12) installed on the tinning main body (11), and a positioning needle (13) installed on the tinning main body (11). The tinning main body (11) includes a plate body (111) and a side wall (112) connected to the edge of the plate body (111). The plate body (111) and the side wall (112) together form a receiving cavity (113). The plurality of tinning needles (12) are arranged at intervals in the receiving cavity (113) and are connected to the plate body (111), and the lowest point of the side wall (112) is lower than the lowest point of the tinning needles (12). The plurality of tinning needles (12) are used to correspond to the to-be-tinned points (102) in the cermet cavity (100) one by one; A positioning base (2), the positioning base (2) includes a receiving groove (21) and a first positioning hole (22) formed in the receiving groove (21). The receiving groove (21) is used to receive the cermet cavity (100). One end of the positioning needle (13) is connected to the side wall (112), and the other end of the positioning needle (13) is used to insert into the first positioning hole (22); A tinning base (3), the tinning base (3) includes a tin placement groove (31) and a second positioning hole (32). The shape of the tin placement groove (31) matches the shape of the structure surrounded by the plurality of tinning needles (12). The second positioning hole (32) is arranged on the tinning base (3) and is located outside the tin placement groove (31). The second positioning hole (32) is used for the positioning needle (13) to insert.

2. The tinning structure based on a cermet cavity according to claim 1, characterized in that, The plurality of tinning needles (12) are arranged in an array.

3. The tinning structure based on a cermet cavity according to claim 1, characterized in that, A groove (121) is formed at the end of the tinning needle (12) away from the plate body (111). The groove (121) is used to hold solder paste and / or flux.

4. The tinning structure based on a cermet cavity according to claim 1, characterized in that, The positioning base (2) further includes a fine-tuning component. The fine-tuning component includes four fine-tuning parts (4). The four fine-tuning parts (4) are arranged in pairs opposite to each other, and the four fine-tuning parts (4) are respectively located around the receiving groove (21). The fine-tuning part (4) passes through the positioning base (2) and can move along the axial direction of the fine-tuning part (4). One end of the fine-tuning part (4) is located in the receiving groove (21) and is used to abut against the side wall (112) of the cermet cavity (100), and the other end of the fine-tuning part (4) is located outside the receiving groove (21), so that the fine-tuning part (4) can be used to adjust the position of the cermet cavity (100) in the receiving groove (21).

5. The tinning structure based on a cermet cavity according to claim 4, It is characterized in that the fine-tuning member (4) includes a connecting rod (41), a first block (42) and a second block (43) respectively connected to both ends of the connecting rod (41). The connecting rod (41) is formed as a threaded rod, and the connecting rod (41) is threadedly connected to the positioning base (2). The first block (42) is located inside the accommodating cavity (113), and the second block (43) is located outside the accommodating cavity (113).

6. A soldering tin structure based on a cermet cavity according to claim 5, It is characterized in that the first block (42) is formed as a cylinder; and / or, the second block (43) is formed as a cylinder.

7. A soldering tin structure based on a cermet cavity according to claim 4, It is characterized in that at least one observation hole (1111) is further formed on the plate body (111), and a marking point (101) corresponding to the observation hole (1111) is arranged on the bottom wall of the cermet cavity (100). When the observation hole (1111) is aligned with the marking point (101), the soldering tin needles (12) are in one-to-one correspondence with the points to be soldered (102) inside the cermet cavity (100).

8. A soldering tin structure based on a cermet cavity according to any one of claims 1-7, It is characterized in that the first positioning hole (22) is filled with an elastic member, so that after the positioning needle (13) of the soldering tin member (1) is inserted into the first positioning hole (22), the soldering tin needles (12) of the soldering tin member (1) can have a spacing from the cermet cavity (100).

9. A soldering tin method based on a cermet cavity, It is characterized in that applied to the soldering tin structure based on a cermet cavity according to any one of claims 1-8, the soldering tin method includes: applying a first soldering flux to the inner bottom wall of the cermet cavity (100), applying a second soldering flux to one end of the soldering tin needle (12) away from the plate body (111), applying a third soldering flux to the inner bottom wall of the solder placement groove (31), and then filling the solder placement groove (31) with solder paste; wherein, the viscosity of the first soldering flux is greater than that of the second soldering flux, and the viscosity of the second soldering flux is greater than that of the third soldering flux; inserting the positioning needle (13) of the soldering tin member (1) into the second positioning hole (32) of the soldering tin base (3), so that the composition of the solder paste and the third soldering flux is adsorbed by the second soldering flux on the soldering tin needle (12); then inserting the positioning needle (13) of the soldering tin member (1) into the first positioning hole (22) of the positioning base (2), so that the second soldering flux, the composition of the solder paste and the third soldering flux are adsorbed by the first soldering flux inside the cermet cavity (100).

10. A soldering tin method based on a cermet cavity, It is characterized in that applied to the soldering tin structure based on a cermet cavity according to claim 7 or 8, the soldering tin method includes: Apply the first soldering flux to the inner bottom wall of the cermet cavity (100), apply the second soldering flux to the end of the solder feeding pin (12) away from the board body (111), apply the third soldering flux to the inner bottom wall of the solder placement groove (31), and then fill the solder placement groove (31) with solder paste; wherein, the viscosity of the first soldering flux is greater than that of the second soldering flux, and the viscosity of the second soldering flux is greater than that of the third soldering flux; Insert the positioning pin (13) of the solder feeding member (1) into the second positioning hole (32) of the solder feeding base (3) so that the composition of the solder paste and the third soldering flux is adsorbed by the second soldering flux on the solder feeding pin (12); then insert the positioning pin (13) of the solder feeding member (1) into the first positioning hole (22) of the positioning base (2) so that the composition of the second soldering flux, the solder paste and the third soldering flux is adsorbed by the first soldering flux in the cermet cavity (100); The solder feeding method further includes a fine-tuning step: An elastomer is provided in the first positioning hole (22) so that when the positioning pin (13) of the solder feeding member (1) is inserted into the first positioning hole (22), there is a spacing between the composition of the second soldering flux, the solder paste and the third soldering flux and the first soldering flux; Adjust the fine-tuning assembly so that the observation hole (1111) on the solder feeding member (1) can be aligned with the marking point (101) on the solder feeding base (3); Apply a pressure to the solder feeding member (1) towards the solder feeding base (3) so that the composition of the second soldering flux, the solder paste and the third soldering flux contacts the first soldering flux.

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