Serial fluid flow circuit in liquid-assisted air-cooled thermal control system

Abstract

Systems and methods can provide a serial fluid flow loop in a liquid-assisted air-cooled thermal control system in order to balance thermal gradients in the thermal control system.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to information handling systems, and more particularly to a liquid-assisted air cooling thermal control system in an information handling system. BACKGROUND

[0002] As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and / or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements can vary significantly between different users or applications, information handling systems can also vary regarding the information being processed, the methods being used to process the information, and the amounts of information being processed, stored, or communicated. Variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems can include a variety of hardware and software components that can be configured to process, store, and communicate information and can include one or more computers, data storage systems, and networking systems.

[0003] As the clock speeds and power consumption of processors, graphics cards, random access memory (RAM), and other components in information handling systems increase, the heat generated by such components as a byproduct of normal operation also increases. Generally, the temperature of these components needs to be kept within a reasonable range to prevent overheating, instability, failure, and damage that can result in a shortened useful life of the components. As a result, air movers (e.g., cooling fans and blowers) are often used in information handling systems to cool the information handling systems and their components.

[0004] To control the temperature of the components of an information handling system, air movers can direct air onto one or more heatsinks thermally coupled to individual components. A traditional method for cooling components can include a “passive” cooling system for dissipating heat from the components to air driven by one or more system-level air movers (e.g., fans) for cooling multiple components of the information handling system in addition to peripheral components. Another traditional method can include an “active” cooling system using liquid cooling, where a heat exchange cold plate is thermally coupled to a component and a refrigerated fluid passes through a conduit inside the cold plate to remove heat from the component.

[0005] FIG. 1 illustrates an information handling system 102 including a liquid- assisted air-cooled thermal control system 118 as known in the art. As shown in FIG. 1, the information handling system 102 can include one or more processors 103, one or more memory modules 104, and a liquid-assisted air-cooled thermal control system 118. Further, as shown in FIG. 1, the liquid-assisted air-cooled thermal control system 118 can include one or more air movers 108, a heat rejection medium 122, a fluid conduit 126, a cold manifold 128, a hot manifold 130, and a radiator 132.

[0006] As shown in FIG. 1, the liquid-assisted air-cooled thermal control system 118 can be arranged in a parallel configuration, as the cooling liquid can be delivered from the radiator 132 to the cold manifold 128, from which the cooling liquid can be distributed in parallel to two heat rejection mediums 122 (e.g., cold plates thermally coupled to respective processors 103). Thus, heat generated by the processors 103 can be transferred to their respective heat rejection mediums 122, and from the heat rejection mediums 122 to the liquid. The liquid, now heated by the heat transfer from the processors 103, can flow to the hot manifold 130 and the radiator 132. Air driven by the air movers 108 to the vicinity of the radiator 132 can cool the liquid, which can reappear as cooled liquid as it flows into the cold manifold 128, forming a liquid cooling loop.

[0007] While the processors 103 can be cooled primarily by liquid cooling, other components of the information handling system 102, such as the memory modules 104, can be cooled entirely by airflow driven by the air movers 108. However, the arrangement of FIG. 1 has disadvantages with respect to cooling of downstream components. To illustrate, due to a temperature gradient across the radiator 132 from the left side of FIG. 1 to the right side of FIG. 1, air passing over the left side of the radiator 132 can be warmed more than air passing over the right side of the radiator 132. Thus, as this airflow continues down in FIG. 1, the temperature of the air driven to the vicinity of the memory modules 104 on the left side of FIG. 1 can be warmer than the temperature of the air driven to the vicinity of the memory modules 104 on the right side of FIG. 1.

[0008] Another disadvantage of the liquid-assisted air-cooled thermal control system 118 depicted in FIG. 1 is that the liquid cooling loop includes two three-way valves with fluid conduits 126, which can require additional soldering or otherwise fluid connections (which can result in lower reliability) and can present a large liquid flow impedance.

[0009] A further disadvantage of the liquid-assisted air-cooled thermal control system 118 depicted in FIG. 1 is that, due to the parallel wiring of the fluid conduits 126, the processors 103 can experience uneven thermal performance due to uneven liquid flow distribution to the heat rejection mediums 122. SUMMARY

[0010] In accordance with the teachings of the present disclosure, the drawbacks and problems associated with existing designs of thermal control systems for information processing systems can be substantially reduced or eliminated.

[0011] In accordance with embodiments of the present disclosure, an information processing system can include a plurality of information processing resources including at least a first information processing resource and a second information processing resource, and a thermal control system. The thermal control system can include one or more air movers, a first heat rejection medium thermally coupled to the first information processing resource, the first heat rejection medium configured to receive a flow of cooling fluid through the first heat rejection medium, a second heat rejection medium thermally coupled to the second information processing resource, the second heat rejection medium configured to receive the flow of cooling fluid through the second heat rejection medium, a first heat exchanger fluidly coupled to the first heat rejection medium and positioned such that an airflow driven by the one or more air movers flows proximate to the first heat exchanger, and a second heat exchanger fluidly coupled to the second heat rejection medium and positioned such that the airflow driven by the one or more air movers flows proximate to the second heat exchanger. Components of the thermal control system can be arranged such that the cooling fluid flows from the first heat exchanger to the first heat rejection medium, from the first heat rejection medium to the second heat exchanger, from the second heat exchanger to the second heat rejection medium, and from the second heat rejection medium to the first heat exchanger. The first heat exchanger and the second heat exchanger can be arranged relative to each other and relative to the one or more air movers such that the airflow driven by the one or more air movers proximate to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger due to a mirror heat gradient across the first heat exchanger and the second heat exchanger.

[0012] According to these and other embodiments of the present disclosure, a thermal control system can include a first heat sink configured to be thermally coupled to a first information processing resource, the first heat sink further configured to receive a flow of cooling fluid through the first heat sink; a second heat sink configured to be thermally coupled to a second information processing resource, the second heat sink further configured to receive the flow of cooling fluid through the second heat sink; a first heat exchanger fluidically coupled to the first heat sink and positioned such that an airflow driven by one or more air movers flows in proximity to the first heat exchanger; and a second heat exchanger fluidically coupled to the second heat sink and positioned such that the airflow driven by the one or more air movers flows in proximity to the second heat exchanger. Components of the thermal control system can be arranged such that the cooling fluid flows from the first heat exchanger to the first heat sink, from the first heat sink to the second heat exchanger, from the second heat exchanger to the second heat sink, and from the second heat sink to the first heat exchanger. The first heat exchanger and the second heat exchanger can be arranged relative to each other and relative to the one or more air movers such that the airflow driven by the one or more air movers in proximity to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger due to a mirrored thermal gradient across the first heat exchanger and the second heat exchanger.

[0013] According to these and other embodiments of the present disclosure, a method can include fluidly coupling a first heat exchanger to a first heat rejection medium and positioning the first heat exchanger such that an airflow driven by one or more air movers flows in proximity to the first heat exchanger, wherein the first heat rejection medium is configured to be thermally coupled to a first information processing resource and is configured to receive a flow of cooling fluid through the first heat rejection medium; fluidly coupling a second heat exchanger to a second heat rejection medium and positioning the second heat exchanger such that the airflow driven by the one or more air movers flows in proximity to the second heat exchanger, wherein the second heat rejection medium is configured to be thermally coupled to a second information processing resource and is configured to receive a flow of cooling fluid through the second heat rejection medium; arranging components of a thermal control system such that the cooling fluid flows from the first heat exchanger to the first heat rejection medium, from the first heat rejection medium to the second heat exchanger, from the second heat exchanger to the second heat rejection medium, and from the second heat rejection medium to the first heat exchanger; and arranging the first heat exchanger and the second heat exchanger relative to each other and relative to the one or more air movers such that, due to a mirrored thermal gradient across the first heat exchanger and the second heat exchanger, the airflow driven by the one or more air movers in proximity to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger.

[0014] The technical advantages of the present disclosure can be readily appreciated as the same becomes better understood by reference to the accompanying drawings, descriptions, and claims. The objects and advantages of the embodiments will be realized and attained by means of the elements, features, and combinations particularly pointed out in the claims.

[0015] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the claims set forth in this disclosure. BRIEF DESCRIPTION OF DRAWINGS

[0016] A more complete understanding of embodiments of the application and the advantages thereof can be acquired by referring to the following description in consideration with the accompanying drawings, in which like reference numerals indicate like features, and in which:

[0017] FIG. 1 illustrates a block diagram of an exemplary information processing system as known in the art; and

[0018] Figure 2 illustrates a block diagram of an exemplary information processing system according to embodiments of the present disclosure. DETAILED DESCRIPTION

[0019] By reference to Figure 2The preferred embodiments and their advantages are best understood with reference to the drawings, wherein like numbers refer to like and corresponding parts.

[0020] For purposes of this disclosure, an information handling system can include any instrumentality or aggregate of instrumentalities operable to compute, classify, process, transmit, receive, retrieve, originate, switch, store, display, manifest, detect, record, reproduce, handle, or utilize any form of information, intelligence, or data for business, scientific, control, entertainment, or other purposes. For example, an information handling system can be a personal computer, a PDA, a consumer electronic device, a network storage device, or any other suitable device and can vary in size, shape, performance, functionality, and price, depending on intended use. An information handling system can include a memory, one or more processing resources such as a central processing unit (CPU) or hardware or software control logic. Additional components of the information handling system can include one or more storage devices, one or more communication ports, and various input and output (I / O) devices, such as a keyboard, a mouse, and a video display. The information handling system can also include one or more buses operable to transmit communications between various hardware components.

[0021] For purposes of this disclosure, a computer readable medium can include any instrumentality or aggregation of instrumentalities that can retain data and / or instructions for a period of time. Computer readable media can include, without limitation, storage media such as a direct access storage device (e.g., a hard disk drive or floppy diskette), a sequential access storage device (e.g., a tape disk drive), compact disk, CD-ROM, DVD, random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), and / or flash memory; and communication media, such as a wire, optical fiber, microwave, radio frequency link, and other electromagnetic and / or optical carrier. Further, computer readable media can include any combination of the foregoing.

[0022] For purposes of this disclosure, an information handling resource can refer broadly to any component system, device, or equipment of an information handling system in a broad sense, including, but not limited to, processors, buses, memory, I / O devices and / or interfaces, storage resources, network interfaces, motherboards, integrated circuit packages; electromechanical devices (e.g., air movers), displays, and power supplies.

[0023] Figure 2A block diagram of an exemplary information handling system 202 in accordance with an embodiment of the present disclosure is shown. In some embodiments, the information handling system 202 can comprise a server or "blade" configured to be housed within a rack, tower chassis, or other enclosure with a plurality of other servers or "blades." In other embodiments, the information handling system 202 can comprise a personal computer (e.g., a desktop computer, a laptop computer, a mobile computer, and / or a notebook computer). In other embodiments, the information handling system 202 can be a memory appliance integral with a memory enclosure configured to house a plurality of physical disk drives and / or other computer-readable media for storing data. As Figure 2 shown, the information handling system 202 can include a plurality of processors 203, a plurality of memory modules 204, and a liquid-assisted air-cooled thermal control system 218.

[0024] The processors 203 can include any system, device, or apparatus operable to interpret and / or execute program instructions and / or process data, and can include, but are not limited to, a microprocessor, a microcontroller, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), or any other digital or analog circuitry configured to interpret and / or execute program instructions and / or process data. In some embodiments, the processors 203 can interpret and / or execute program instructions and / or process data stored in the memory modules 204 and / or another component of the information handling system 202.

[0025] The memory modules 204 can be communicatively coupled to one or more of the processors 203 and can include any system, device, or apparatus operable to retain program instructions or data for a period of time. The memory modules 204 can include random access memory (RAM), electrically erasable programmable read-only memory (EEPROM), a PCMCIA card, a flash memory, a magnetic storage, an opto-magnetic storage, or any suitable selection and / or array of volatile memory or non-volatile memory that retains data after power to the information handling system 202 is cut. In some embodiments, the memory modules 204 can include a dual in-line memory module (DIMM) or other similar memory module.

[0026] As Figure 2 shown, the liquid-assisted air-cooled thermal control system 218 can include one or more air movers 208, heat rejection media 222 (e.g., heat rejection media 222A and 222B) each thermally coupled to a respective processor 203, fluid conduits 226, a cold manifold 228, a hot manifold 230, and a plurality of heat sinks 232 (e.g., heat sinks 232A and 232B).

[0027] Air booster 208 may include any mechanical or electromechanical system, device, or apparatus operable to move air and / or other gases to cool the information processing resources of information processing system 202. In some embodiments, air booster 208 may include a fan (e.g., a rotating arrangement of blades or blades acting on air). In other embodiments, air booster 208 may include a blower (e.g., a centrifugal fan employing a rotating impeller to accelerate air received at its inlet and change the direction of airflow). In these and other embodiments, the rotation and other moving parts of air booster 208 may be driven by an electric motor. The rotational speed of the electric motor may be controlled by an air booster control signal transmitted from the thermal control system of information processing system 202. In operation, air booster 208 may cool the information processing resources of information processing system 202 by: drawing cool air from outside the enclosure into the housing 200 containing the information processing resources; exhausting warm air from inside the housing to the outside of the housing; and / or moving air across one or more heat sinks (not explicitly shown) inside the housing to cool one or more information processing resources.

[0028] Heat dissipation medium 222 may include components configured to transfer heat from information processing resources (e.g., processor 203, such as...). Figure 2 Any system, apparatus, or device that reduces the temperature of an information processing resource by dissipating heat (as shown). For example, the heat dissipation medium 222 may include a solid (e.g., a heat pipe, heat spreader, heat sink, fin stack, etc.) thermally coupled to the information processing resource, such that heat generated by the information processing resource is transferred from the information processing resource. In a particular embodiment, the heat dissipation medium 222 may include a cold plate through which a cooling liquid can flow, such that heat can be transferred from the information processing resource (e.g., processor 203) to the cooling liquid via the heat dissipation medium 222.

[0029] In operation, the cooled fluid can be received from the radiator 232B via the cooling manifold 228. Although not explicitly stated for clarity and illustration... Figure 2 As shown, but in some embodiments, the liquid-assisted air cooling thermal control system 218 may include components (e.g., a pump) for driving fluid flow. As the fluid passes through the heat dissipation medium 222B adjacent to the processor 203, heat can be transferred from the processor to the heat dissipation medium 222B and from the heat dissipation medium 222B to the fluid flowing within it, thereby cooling the processor 203. This heated fluid can then be discharged from the fluid conduit 226 to the radiator 232A.

[0030] Since the airflow is driven by the air booster 208 to the vicinity of the radiator 232A, when the fluid flows through the radiator 232A (e.g., in...), Figure 2As the fluid flows through the heat sink 232B (e.g., from right to left), the fluid can cool. Upon cooling, the fluid can again flow to the cold manifold 228, repeating the flow and cooling process.

[0031] As the air flow is driven by the air mover 108 to the vicinity of the heat sink 232B, as the fluid flows through the heat sink 232B (e.g., from right to left), the fluid can cool. Upon cooling, the fluid can again flow to the cold manifold 228, repeating the flow and cooling process. Figure 2

[0032] In addition to the processor 203, the memory 204, and the liquid-assisted air-cooled thermal control system 218, the information handling system 202 can include one or more other information handling resources. Moreover, for the clarity and conciseness of the disclosure, Figure 2 The information handling system 202 is depicted as including a liquid-assisted air-cooled thermal control system 218 for cooling the processor 203. However, in some embodiments, methods similar or identical to those described herein for cooling the processor 203 can be used to provide cooling to any other information handling resource of the information handling system 202.

[0033] Figure 2 One notable difference between the depicted information handling system 202 and the information handling system 102 depicted in FIG. 1 is that the heat sinks 232 and the heat rejection media 222 are in a serial loop, as opposed to a parallel arrangement of the heat rejection media 122. Another notable difference is that the heat sink 132 of FIG. 1 is effectively split into two heat sinks 232A and 232B.

[0034] As a result of the left-to-right hot-to-cold temperature gradient in the heat sink 232A and the approximately mirrored right-to-left hot-to-cold temperature gradient in the heat sink 232B, the air flow driven by the heat sinks 232A and 232B can be approximately uniform in temperature once past the heat sinks 232A and 232B. Thus, the air flowing adjacent to the memory module 204 should be approximately uniform, potentially overcoming the shortcomings of the arrangement of FIG. 1.

[0035] Moreover, the wiring of the fluid conduit network for the heat rejection media 222A and 222B can be approximately equal, potentially reducing or eliminating the mismatched cooling of the processor 103 in the arrangement of FIG. 1.

[0036] Moreover, Figure 2 ​The arrangement of FIG. 1 can not require the use of the three-way valve required in the arrangement of FIG. 1, thereby potentially reducing fluid routing complexity and improving reliability compared to the arrangement of FIG. 1.

[0037] As used herein, when two or more elements are referred to as "coupled" to one another, such terminology indicates that such two or more elements are in either electronic or mechanical communication, as applicable, whether directly or indirectly, with or without intervening elements.

[0038] The present disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend as a result of the teaching of the disclosure. Similarly, unless otherwise specifically stated herein, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend as a result of the teaching of the disclosure. Moreover, the reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted, arranged, capable, configured, enabled, operable, or operative to perform a particular function encompasses that apparatus, system, or component, whether or not the particular function is being performed. Consequently, modifications can be made by one of ordinary skill in the art to the systems, apparatuses, and methods described herein in light of the teaching of the disclosure. For example, the components of the systems and apparatuses can be integrated or separated. Additionally, the operations of the systems and apparatuses disclosed herein can be performed by more, fewer, or other components and the methods described can include more, fewer, or other steps. Additionally, steps can be performed in any suitable order. As used in this document, "each" refers to each member of a set or each member of a subset of a set.

[0039] Although example embodiments are illustrated in the drawings and described above, the principles of the disclosure can be implemented using any number of techniques. The disclosure should in no way be limited to the illustrative implementations, set forth above and shown in the accompanying drawings.

[0040] Unless specifically stated otherwise, the articles depicted in the drawings are not necessarily drawn to scale.

[0041] All examples and conditional language recited herein are intended to be construed to cover all processes, products, and alternatives falling within the scope of the disclosure and the teachings of the inventor, and are not to be construed as limited to the specific examples and conditions described. Although embodiments of the disclosure have been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the disclosure.

[0042] While specific advantages have been enumerated above, various embodiments can include some, none or all of the enumerated advantages. Additionally, other technical advantages can become readily apparent to those of ordinary skill in the art after review of the foregoing figures and description.

[0043] To aid the patent office and any readers of any patent issued on this application in interpreting the claims appended hereto, applicants wish to state that they do not intend any of the appended claims to invoke 35 U.S.C. § 112(f) unless the words “means for” or “step for” are explicitly used in the particular claim.

Claims

1. An information processing system comprising: a plurality of information processing resources, the plurality of information processing resources including at least a first information processing resource and a second information processing resource; and a thermal control system, the thermal control system comprising: one or more air movers; a first thermal sink thermally coupled to the first information processing resource, the first thermal sink configured to receive a flow of cooling fluid through the first thermal sink; a second thermal sink thermally coupled to the second information processing resource, the second thermal sink configured to receive a flow of the cooling fluid through the second thermal sink; a first heat exchanger fluidly coupled to the first thermal sink and the second thermal sink and positioned such that an airflow driven by the one or more air movers flows proximate to the first heat exchanger; and a second heat exchanger fluidly coupled to the first thermal sink and the second thermal sink and positioned such that the airflow driven by the one or more air movers flows proximate to the second heat exchanger, wherein the first heat exchanger, second heat exchanger, and first thermal sink, second thermal sink are in a serial loop; wherein: components of the thermal control system are arranged such that the cooling fluid flows from the first heat exchanger to the first thermal sink, from the first thermal sink to the second heat exchanger, from the second heat exchanger to the second thermal sink, and from the second thermal sink to the first heat exchanger; and the first heat exchanger and the second heat exchanger are arranged relative to each other and relative to the one or more air movers such that the airflow driven by the one or more air movers proximate to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger due to a mirrored thermal gradient across the first heat exchanger and the second heat exchanger.

2. The information processing system of claim 1, wherein: a first manifold fluidly interfaces between the first heat exchanger and the first thermal sink; and a second manifold fluidly interfaces between the second heat exchanger and the second thermal sink.

3. The information processing system of claim 1, wherein: the first heat exchanger comprises a first heat spreader; and the second heat exchanger comprises a second heat spreader.

4. The information processing system of claim 1, wherein: the first information processing resource comprises a first processor; and the second information processing resource comprises a second processor.

5. The information processing system of claim 1, wherein: the first thermal sink comprises a first cold plate; and the second thermal sink comprises a second cold plate.

6. A thermal control system comprising: a first thermal sink configured to thermally couple to a first information processing resource, the first thermal sink further configured to receive a flow of cooling fluid through the first thermal sink; a second thermal sink configured to thermally couple to a second information processing resource, the second thermal sink further configured to receive a flow of the cooling fluid through the second thermal sink; a first heat exchanger fluidly coupled to the first thermal sink and the second thermal sink and positioned such that an airflow driven by one or more air movers flows proximate to the first heat exchanger; and a second heat exchanger fluidly coupled to the first thermal sink and the second thermal sink and positioned such that the airflow driven by the one or more air movers flows proximate to the second heat exchanger, wherein the first heat exchanger, second heat exchanger, and first thermal sink, second thermal sink are in a serial loop; wherein: components of the thermal control system are arranged such that the cooling fluid flows from the first heat exchanger to the first thermal sink, from the first thermal sink to the second heat exchanger, from the second heat exchanger to the second thermal sink, and from the second thermal sink to the first heat exchanger; and the first heat exchanger and the second heat exchanger are arranged relative to each other and relative to the one or more air movers such that the airflow driven by the one or more air movers proximate to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger due to a mirrored thermal gradient across the first heat exchanger and the second heat exchanger. a second heat sink medium, the second heat sink medium configured to be thermally coupled to a second information processing resource, the second heat sink medium further configured to receive a flow of cooling fluid through the second heat sink medium; a first heat exchanger fluidly coupled to the first heat sink medium and the second heat sink medium and positioned such that an airflow driven by one or more air movers flows in proximity to the first heat exchanger; and a second heat exchanger fluidly coupled to the first heat sink medium and the second heat sink medium and positioned such that the airflow driven by the one or more air movers flows in proximity to the second heat exchanger, wherein the first heat exchanger, second heat exchanger, and first heat sink medium, second heat sink medium are in a serial loop; wherein: components of the thermal control system are arranged such that the cooling fluid flows from the first heat exchanger to the first heat sink medium, from the first heat sink medium to the second heat exchanger, from the second heat exchanger to the second heat sink medium, and from the second heat sink medium to the first heat exchanger; and the first heat exchanger and the second heat exchanger are arranged relative to each other and relative to the one or more air movers such that the airflow driven by the one or more air movers in proximity to the first heat exchanger and the second heat exchanger has an approximately uniform temperature once driven across the first heat exchanger and the second heat exchanger due to a mirrored thermal gradient across the first heat exchanger and the second heat exchanger.

7. The thermal control system of claim 6, wherein: a first manifold fluidly interfaces between the first heat exchanger and the first heat sink medium; and a second manifold fluidly interfaces between the second heat exchanger and the second heat sink medium.

8. The thermal control system of claim 6, wherein: the first heat exchanger comprises a first heat spreader; and the second heat exchanger comprises a second heat spreader.

9. The thermal control system of claim 6, wherein: the first information processing resource comprises a first processor; and the second information processing resource comprises a second processor.

10. The thermal control system of claim 6, wherein: the first heat sink medium comprises a first cold plate; and the second heat sink medium comprises a second cold plate.

11. A method comprising: fluidly coupling a first heat exchanger to a first heat sink medium and a second heat sink medium and positioning the first heat exchanger such that an airflow driven by one or more air movers flows in proximity to the first heat exchanger, wherein the first heat sink medium is configured to be thermally coupled to a first information processing resource and configured to receive a flow of cooling fluid through the first heat sink medium; fluidly coupling a second heat exchanger to the first and second heat rejection mediums and positioning the second heat exchanger such that an airflow driven by the one or more air movers flows in proximity to the second heat exchanger, wherein the second heat rejection medium is configured to be thermally coupled to a second information processing resource and configured to receive a flow of cooling fluid through the second heat rejection medium, wherein the first and second heat exchangers and the first and second heat rejection mediums are in a serial loop; arranging components of the thermal control system such that the cooling fluid flows from the first heat exchanger to the first heat rejection medium, from the first heat rejection medium to the second heat exchanger, from the second heat exchanger to the second heat rejection medium, and from the second heat rejection medium to the first heat exchanger; and arranging the first and second heat exchangers relative to each other and relative to the one or more air movers such that an airflow driven by the one or more air movers in proximity to the first and second heat exchangers has an approximately uniform temperature once driven across the first and second heat exchangers due to a mirrored thermal gradient across the first and second heat exchangers.

12. The method of claim 11, wherein: a first manifold is fluidly interfaced between the first heat exchanger and the first heat rejection medium; and a second manifold is fluidly interfaced between the second heat exchanger and the second heat rejection medium.

13. The method of claim 11, wherein: the first heat exchanger comprises a first heat sink; and the second heat exchanger comprises a second heat sink.

14. The method of claim 11, wherein: the first information processing resource comprises a first processor; and the second information processing resource comprises a second processor.

15. The method of claim 11, wherein: the first heat rejection medium comprises a first cold plate; and the second heat rejection medium comprises a second cold plate.

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