inductor
By using a long strip-shaped via conductor with a center offset to connect to the pad portion, the problems of via conductor blocking magnetic flux and thermal expansion stress are solved, and the Q value and manufacturing reliability of the inductor are improved.
Patent Information
- Application Number
- CN202211163890.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-09-25
- Filing Date
- 2022-09-23
- Publication Date
- 2025-10-17
- Estimated Expiration
- 2042-09-23
AI Technical Summary
The via conductors and lands block the magnetic flux, affecting the Q value of the inductor. Furthermore, stress caused by thermal expansion and contraction affects the stability of the inductor.
The via conductors are long strips with their center positions offset to reduce obstruction of the line conductors. The line conductors and the via conductors are connected by pads to form a spiral track, dispersing the stress caused by thermal expansion and contraction.
The shielding of magnetic flux by the through-hole conductor is reduced, the Q value stability of the inductor is improved, the reliability during the manufacturing and installation process is enhanced, and the stress impact during thermal expansion and contraction is reduced.
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Figure CN115881391B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to an inductor, and particularly relates to an inductor in which a coil is arranged inside a component main body made of a non-conductive material. BACKGROUND
[0002] The inductor of the present application has a component main body having a laminated structure in which a plurality of non-conductive material layers are laminated. A coil is arranged inside the component main body. The coil is configured to have a plurality of wire conductors extending along interfaces between the non-conductive material layers, respectively, and a plurality of via conductors penetrating the non-conductive material layers in the thickness direction, and by alternately connecting the wire conductors and the via conductors, the whole extends along a spiral track.
[0003] In Figure 30 an inductor 1 is schematically illustrated. In Figure 30 , the component main body 2 provided in the inductor 1 and the coil 3 arranged inside the component main body 2 are illustrated in a state of being seen in the axial direction of the coil 3 (a direction orthogonal to the paper surface). Figure 30
[0004] The component main body 2 has a laminated structure in which a plurality of non-conductive material layers extend along the direction of the paper surface. The coil 3 is configured to have a plurality of wire conductors 4 extending along interfaces between the non-conductive material layers, respectively, and a plurality of via conductors 5 penetrating the non-conductive material layers in the thickness direction, and by alternately connecting the wire conductors 4 and the via conductors 5, the whole extends along a spiral track. On the outer surface of the component main body 2, a first external terminal electrode 6 and a second external terminal electrode 7 are provided, which are connected to one end and the other end of the coil 3, respectively. Figure 30
[0005] Referring to Figure 30 The connection of the plurality of wire conductors 4 in the coil 3 is described more specifically. In order to distinguish the four illustrated via-hole conductors 5 from each other, the via-hole conductors 5 are each attached with reference characters "5-1", "5-2", "5-3", and "5-4". In addition, the five wire conductors 4 connected via each of the four via-hole conductors 5-1, 5-2, 5-3, and 5-4 are each attached with reference characters "4-1", "4-2", "4-3", "4-4", and "4-5". The wire conductors 4-1, 4-2, 4-3, 4-4, and 4-5 are respectively provided so as to extend along different interfaces between the non-conductive material layers. In the stacking direction of the non-conductive material layers, the interface at which the wire conductor 4-2 is provided is next to the interface at which the wire conductor 4-1 is provided, the interface at which the wire conductor 4-3 is provided is next to the interface at which the wire conductor 4-2 is provided, the interface at which the wire conductor 4-4 is provided is next to the interface at which the wire conductor 4-3 is provided, and the interface at which the wire conductor 4-5 is provided is next to the interface at which the wire conductor 4-4 is provided.
[0006] The wire conductor 4-1 connected to the first external terminal electrode 6 via the first lead-out conductor 8 extends in the clockwise direction to the position of the via-hole conductor 5-1. The via-hole conductor 5-1 connects the wire conductor 4-1 and the wire conductor 4-2. The wire conductor 4-2 extends in the clockwise direction from the position of the via-hole conductor 5-1 to the position of the via-hole conductor 5-2. The via-hole conductor 5-2 connects the wire conductor 4-2 and the wire conductor 4-3. The wire conductor 4-3 extends in the clockwise direction from the position of the via-hole conductor 5-2 to the position of the via-hole conductor 5-3. The via-hole conductor 5-3 connects the wire conductor 4-3 and the wire conductor 4-4. The wire conductor 4-4 extends in the clockwise direction from the position of the via-hole conductor 5-3 to the position of the via-hole conductor 5-4. The via-hole conductor 5-4 connects the wire conductor 4-4 and the wire conductor 4-5. The wire conductor 4-5 extends in the clockwise direction from the position of the via-hole conductor 5-4 and is connected to the second external terminal electrode 7 via the second lead-out conductor 9.
[0007] A pad portion 10 is provided at the end portion of each wire conductor 4 connected to each via-hole conductor 5. The pad portion 10 generally has a wider area than the cross-sectional area of the via-hole conductor 5, and ensures the connection reliability of the wire conductor 4 and the via-hole conductor 5. In addition, the via-hole conductor 5 has a circular cross-section with a diameter larger than the wire width of the wire conductor 4.
[0008] For example, in Japanese Patent Application Publication No. 2018-184582 (Patent Literature 1), an inductor 1 is described in which the cross-section of the via-hole conductor 5 is circular with a diameter larger than the wire width of the wire conductor 4, and the pad portion 10 is a shape wider than the cross-sectional area of the via-hole conductor 5 and concentric with the cross-section of the via-hole conductor 5.
[0009] Patent Literature 1: Japanese Patent Application Laid-Open No. 2018-184582
[0010] In Figure 30 In actual use of the inductor 1 shown in FIG. 1, magnetic flux passes through the region R surrounded by the spiral-shaped track formed by the plurality of wire conductors 4 in a manner orthogonal to the paper surface. On the other hand, in the region R, there is a portion of the via conductor 5 that protrudes from the inner periphery side of the wire conductor 4, and further, a portion of the pad portion 10. Figure 30
[0011] It has recently been understood that, in this state, the via conductor 5 and the pad portion 10 shield the magnetic flux, thereby exerting an influence on the characteristics of the inductor 1, particularly, the Q value. SUMMARY
[0012] Therefore, an object of the present application is to provide an inductor that can solve the above-described problems.
[0013] An inductor according to an aspect of the present disclosure includes a component body composed of a non-conductive material, and a coil disposed inside the component body and having a plurality of wire conductors extending along main surfaces of the component body, respectively, and a plurality of via conductors extending perpendicularly to the main surfaces of the component body, respectively, the wire conductors having pad portions connected to the via conductors, and the wire conductors and the via conductors having a spiral-shaped track by being connected.
[0014] In the inductor described above, the plurality of via conductors include long-stripe via conductors having a long-stripe shape extending along the wire conductors. Also, in the inductor described above, when viewed in the axial direction of the coil, a center position in a width direction orthogonal to a length direction of the long-stripe via conductors is offset from a center position in the width direction of a first pad portion connected to the long-stripe via conductors.
[0015] According to the inductor according to the aspect described above, the degree to which the via conductors protrude toward the inner periphery side of the wire conductors can be reduced, or the via conductors can be made not to protrude toward the inner periphery side of the wire conductors. Therefore, the shielding of the magnetic flux by the via conductors can be reduced or eliminated, and the influence of the via conductors on the characteristics of the inductor, particularly, the Q value can be suppressed.
[0016] In addition, according to the inductor according to the aspect described above, stress at the time of thermal expansion or shrinkage caused by the application of heat at the time of manufacturing, mounting, or actual operation of the inductor can be dispersed. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 is a perspective view showing the appearance of the inductor 11.
[0018] Figure 2 is a perspective view showing the inductor 11 viewed in the axial direction of the coil 20Figure 1 A diagram of the inductor 11 shown.
[0019] Figure 3 is a diagram of a portion of the inductor 11 shown, and is a plan view of the non-conductive material layer 19-1 provided with the wire conductor 23-1 that provides the first end portion 21 of the coil 20. Figure 2
[0020] Figure 4 is a diagram of a portion of the inductor 11 shown, and is a cross-sectional view of the non-conductive material layer 19-2 provided with the via conductor 24-1 connected to the wire conductor 23-1. Figure 2
[0021] Figure 5 is a diagram of a portion of the inductor 11 shown, and is a plan view of the non-conductive material layer 19-2 provided with the wire conductor 23-2 connected to the via conductor 24-1. Figure 2
[0022] Figure 6 is a diagram of a portion of the inductor 11 shown, and is a cross-sectional view of the non-conductive material layer 19-3 provided with the via conductor 24-2 connected to the wire conductor 23-2. Figure 2
[0023] Figure 7 is a diagram of a portion of the inductor 11 shown, and is a plan view of the non-conductive material layer 19-3 provided with the wire conductor 23-3 connected to the via conductor 24-2. Figure 2
[0024] Figure 8 is a diagram of a portion of the inductor 11 shown, and is a cross-sectional view of the non-conductive material layer 19-4 provided with the via conductor 24-3 connected to the wire conductor 23-3. Figure 2
[0025] Figure 9 is a diagram of a portion of the inductor 11 shown, and is a plan view of the non-conductive material layer 19-4 provided with the wire conductor 23-4 connected to the via conductor 24-3. Figure 2
[0026] Figure 10 is a diagram of a portion of the inductor 11 shown, and is a cross-sectional view of the non-conductive material layer 19-5 provided with the via conductor 24-4 connected to the wire conductor 23-4. Figure 2
[0027] Figure 11 is a diagram of a portion of the inductor 11 shown, and is a plan view of the non-conductive material layer 19-5 provided with the wire conductor 23-4 connected to the via conductor 24-3. Figure 2 is a sectional view showing the non-conductive material layer 19-2 provided with the via hole conductor 24-1 connected to the wire conductor 23-1.
[0028] Figure 12 is a view showing a portion of the inductor 11a, and is a plan view showing the non-conductive material layer 19-1 provided with the wire conductor 23-1 providing the first end portion 21 of the coil 20a. Figure 2
[0029] Figure 13 is a view showing a portion of the inductor 11b, and is a plan view showing the non-conductive material layer 19-1 provided with the wire conductor 23-1 providing the first end portion 21 of the coil 20b. Figure 2
[0030] Figure 14 is a view showing a portion of the coil 20c of the inductor 11c in the axial direction of the coil 20c.
[0031] Figure 15 is a view showing a portion of the inductor 11c, and is a plan view showing the non-conductive material layer 19-1 provided with the wire conductor 23-1 providing the first end portion 21 of the coil 20c. Figure 14
[0032] Figure 16 is a view showing a portion of the inductor 11c, and is a sectional view showing the non-conductive material layer 19-2 provided with the via hole conductor 24-1 connected to the wire conductor 23-1. Figure 14
[0033] Figure 17 is a view showing a portion of the inductor 11c, and is a plan view showing the non-conductive material layer 19-2 provided with the wire conductor 23-2 connected to the via hole conductor 24-1. Figure 14
[0034] Figure 18 is a view showing a portion of the inductor 11d, and is a plan view showing the non-conductive material layer 19-1 provided with the wire conductor 23-1 providing the first end portion 21 of the coil 20d. Figure 2
[0035] Figure 19 is a view showing a portion of the inductor 11d, and is a plan view showing the non-conductive material layer 19-2 provided with the via hole conductor 24-1 connected to the wire conductor 23-1. Figure 18
[0036] Figure 20 is a view showing a portion of the inductor 11d, and is a sectional view showing the non-conductive material layer 19-2 provided with the via hole conductor 24-1 connected to the wire conductor 23-1. Figure 18
[0037] Figure 21 is a view showing a portion of the inductor 11d, and is a plan view showing the non-conductive material layer 19-2 provided with the wire conductor 23-2 connected to the via hole conductor 24-1. Figure 18 is a sectional view showing the non-conductive material layer 19-2 provided with the line conductor 23-2 connected to the via conductor 24-1.
[0038] Figure 22 is a plan view showing the non-conductive material layer 19-3 provided with the line conductor 23-3 connected to the via conductor 24-2. Figure 18 is a sectional view showing the non-conductive material layer 19-3 provided with the line conductor 23-3 connected to the via conductor 24-2.
[0039] Figure 23 is a plan view showing the non-conductive material layer 19-4 provided with the line conductor 23-4 connected to the via conductor 24-3. Figure 18 is a sectional view showing the non-conductive material layer 19-4 provided with the line conductor 23-4 connected to the via conductor 24-3.
[0040] Figure 24 is a plan view showing the non-conductive material layer 19-5 provided with the line conductor 23-5 connected to the via conductor 24-4. Figure 18 is a sectional view showing the non-conductive material layer 19-5 provided with the line conductor 23-5 connected to the via conductor 24-4.
[0041] Figure 25 is a plan view showing the non-conductive material layer 19-6 provided with the line conductor 23-6 connected to the via conductor 24-5. Figure 18 is a sectional view showing the non-conductive material layer 19-6 provided with the line conductor 23-6 connected to the via conductor 24-5.
[0042] Figure 26 is a plan view showing the non-conductive material layer 19-7 provided with the line conductor 23-7 connected to the via conductor 24-6. Figure 18 is a sectional view showing the non-conductive material layer 19-7 provided with the line conductor 23-7 connected to the via conductor 24-6.
[0043] Figure 27 is a plan view showing the non-conductive material layer 19-8 provided with the line conductor 23-8 connected to the via conductor 24-7. Figure 18 is a sectional view showing the non-conductive material layer 19-8 provided with the line conductor 23-8 connected to the via conductor 24-7.
[0044] Figure 28 is a plan view showing the non-conductive material layer 19-9 provided with the line conductor 23-9 connected to the via conductor 24-8. Figure 18 is a sectional view showing the non-conductive material layer 19-9 provided with the line conductor 23-9 connected to the via conductor 24-8.
[0045] Figure 29 is a plan view showing the non-conductive material layer 19-10 provided with the line conductor 23-10 connected to the via conductor 24-9. Figure 18is a plan view showing the non-conductive material layer 19-6 provided with the wire conductor 23-6 connected with the via hole conductor 24-5 and providing the second end portion 22 of the coil 20d.
[0046] Figure 30 is a view showing the inductor 1 in perspective in the axial direction of the coil 3.
[0047] Reference Signs List
[0048] 11, 11a to 11d... inductor; 12... component body; 19... non-conductive material layer; 20, 20a to 20d... coil; 23... wire conductor; 24... via hole conductor; 25... pad portion. DETAILED DESCRIPTION
[0049] Reference Signs List Figures 1-11 An inductor 11 according to a first embodiment of the present application will be described.
[0050] The inductor 11 has a component body 12. The component body 12 is composed of a non-conductive material containing at least one of glass, resin, and ferrite, for example. In the case where the component body 12 is composed of a molded body of resin or the like, it can also contain a non-magnetic filler such as silica, a magnetic filler such as ferrite or a metal magnetic body. Also, it can be a configuration in which a plurality of combinations of these glass, ferrite, and resin are made. The component body 12 has a rectangular parallelepiped shape. The rectangular parallelepiped shape can also be a shape in which the edge line portions and the corner portions are given a radius or a chamfer, for example.
[0051] More specifically, as shown in Figure 1 the component body 12 of the rectangular parallelepiped shape has a mounting surface 13 toward a mounting substrate side, a top surface 14 opposite to the mounting surface 13, a first side surface 15 and a second side surface 16 linking between the mounting surface 13 and the top surface 14 and opposite to each other, and a first end surface 17 and a second end surface 18 linking between the mounting surface 13 and the top surface 14 and between the first side surface 15 and the second side surface 16 and opposite to each other, respectively.
[0052] The component body 12 has a laminated configuration in which a plurality of non-conductive material layers 19 composed of the above-described non-conductive material are laminated. The plurality of non-conductive material layers 19 are laminated from the first side surface 15 toward the second side surface 16, and the first side surface 15 and the second side surface 16 of the component body 12 are provided by the main surfaces of the non-conductive material layers 19 at each end portion in the laminating direction, respectively. That is, the first side surface 15 and the second side surface 16 are one example of the main surfaces of the component body 12.
[0053] As shown in Figure 2As shown, the coil 20 is arranged inside the component body 12. The coil 20 has a spiral-shaped track. The axis of the spiral-shaped track of the coil 20 is oriented in a direction orthogonal to the side surfaces 15 and 16, i.e., in a direction parallel to the mounting surface 13. That is, the axis direction of the coil 20 is a direction parallel to the mounting surface 13, and is a direction orthogonal to the first side surface 15 and the second side surface 16. The coil 20 has a first end portion 21 and a second end portion 22 opposite to each other, and between the first end portion 21 and the second end portion 22, has a plurality of wire conductors 23 extending along any interface of the plurality of non-conductive material layers 19, i.e., extending along the first side surface 15 and the second side surface 16, respectively, and a plurality of via conductors 24 extending in the thickness direction through any one of the non-conductive material layers 19, i.e., extending perpendicular to the first side surface 15 and the second side surface 16, respectively. The wire conductors 23 have a pad portion 25 connected to the via conductors 24 at each end portion. The coil 20 has a spiral-shaped track as a whole by alternately connecting the wire conductors 23 and the via conductors 24.
[0054] As shown, the coil 20 has a spiral-shaped track. The axis of the spiral-shaped track of the coil 20 is oriented in a direction orthogonal to the side surfaces 15 and 16, i.e., in a direction parallel to the mounting surface 13. That is, the axis direction of the coil 20 is a direction parallel to the mounting surface 13, and is a direction orthogonal to the first side surface 15 and the second side surface 16. The coil 20 has a first end portion 21 and a second end portion 22 opposite to each other, and between the first end portion 21 and the second end portion 22, has a plurality of wire conductors 23 extending along any interface of the plurality of non-conductive material layers 19, i.e., extending along the first side surface 15 and the second side surface 16, respectively, and a plurality of via conductors 24 extending in the thickness direction through any one of the non-conductive material layers 19, i.e., extending perpendicular to the first side surface 15 and the second side surface 16, respectively. The wire conductors 23 have a pad portion 25 connected to the via conductors 24 at each end portion. The coil 20 has a spiral-shaped track as a whole by alternately connecting the wire conductors 23 and the via conductors 24. Figure 2 As shown, the coil 20 has a spiral-shaped track. The axis of the spiral-shaped track of the coil 20 is oriented in a direction orthogonal to the side surfaces 15 and 16, i.e., in a direction parallel to the mounting surface 13. That is, the axis direction of the coil 20 is a direction parallel to the mounting surface 13, and is a direction orthogonal to the first side surface 15 and the second side surface 16. The coil 20 has a first end portion 21 and a second end portion 22 opposite to each other, and between the first end portion 21 and the second end portion 22, has a plurality of wire conductors 23 extending along any interface of the plurality of non-conductive material layers 19, i.e., extending along the first side surface 15 and the second side surface 16, respectively, and a plurality of via conductors 24 extending in the thickness direction through any one of the non-conductive material layers 19, i.e., extending perpendicular to the first side surface 15 and the second side surface 16, respectively. The wire conductors 23 have a pad portion 25 connected to the via conductors 24 at each end portion. The coil 20 has a spiral-shaped track as a whole by alternately connecting the wire conductors 23 and the via conductors 24.
[0055] The first external terminal electrode 26 and the second external terminal electrode 27 are provided on the outer surface of the component body 12, and are connected to the first end portion 21 and the second end portion 22 of the coil 20, respectively. The first external terminal electrode 26 and the second external terminal electrode 27 are provided so as to span the mounting surface 13 of the component body 12 and each of the first end surface 17 and the second end surface 18 adjacent thereto. If the first external terminal electrode 26 and the second external terminal electrode 27 are provided in such a form, a proper form of a soldering leg can be formed when the inductor 11 is mounted on a mounting substrate, and thus a mounting state with high reliability in both electrical connection and mechanical engagement can be obtained. The first external terminal electrode 26 and the second external terminal electrode 27 are provided so as to penetrate in the thickness direction of each of the plurality of non-conductive material layers 19 except for a few non-conductive material layers 19 at both end portions in the stacking direction.
[0056] The coil 20 and the external terminal electrodes 26 and 27 described above are formed by patterning a conductor film composed of a conductive paste containing, for example, silver as a conductive component. In addition, the non-conductive material layer 19 is formed by patterning a non-conductive material film composed of a paste containing, for example, a non-conductive material containing at least one of glass, resin, and ferrite, as needed. The patterning of the conductor film and the patterning of the non-conductive material film are performed, for example, by photolithography, a half-addition method, a screen printing method, a transfer method, or the like.
[0057] Although not illustrated, a plating film can also be formed on the portions of the external terminal electrodes 26 and 27 that are exposed from the component main body 12. The plating film contains, for example, a plating Ni layer and a plating Sn layer thereon.
[0058] The via conductors 24 include long strip-shaped long strip via conductors that extend along the wire conductors 23. In this embodiment, all of the via conductors 24 illustrated are long strip via conductors. The reference numeral "24" used to indicate the via conductors is also used as is for the long strip via conductors. From Figure 2 As is apparent, the center position in the width direction orthogonal to the length direction of the long strip via conductors 24 is offset from the center position in the width direction of the pad portion, i.e., the first pad portion 25, that is connected to the long strip via conductors 24. More specifically, when viewed in the axial direction of the coil 20 (a direction orthogonal to the paper surface), the center position in the width direction of the long strip via conductors 24 is offset toward the outer periphery side of the spiral-shaped track formed by the wire conductors 23 from the center position in the width direction of the wire conductors 23. Preferably, the long strip via conductors 24 do not protrude from the inner periphery of the wire conductors 23. Figure 2 When viewed in the axial direction of the coil 20 (a direction orthogonal to the paper surface), the center position in the width direction of the long strip via conductors 24 is offset toward the outer periphery side of the spiral-shaped track formed by the wire conductors 23 from the center position in the width direction of the wire conductors 23. Preferably, the long strip via conductors 24 do not protrude from the inner periphery of the wire conductors 23.
[0059] In addition, in Figure 2 the inner periphery of the long strip via conductors 24 is located away from the inner periphery of the wire conductors 23, but the width direction dimension of the long strip via conductors 24 can be made larger than the width direction dimension of the wire conductors 23, and the inner periphery of the long strip via conductors 24 can be located on the inner periphery of the wire conductors 23. Also, if the width direction dimension of the pad portion 25 is made larger than the width direction dimension of the wire conductors 23, and the width direction dimension of the long strip via conductors 24 is made larger than the width direction dimension of the pad portion 25, it is possible to advantageously disperse stress at the time of thermal expansion or contraction caused by the application of heat at the time of manufacture, mounting, or actual operation of the inductor 11.
[0060] Mainly with reference to Figures 3-11 the connection of the plurality of wire conductors 23 in the coil 20 is described in more detail.
[0061] In order to distinguish between Figure 2The four via-hole conductors 24 shown in the figure are respectively given reference numerals “ 24 - 1 ”, “ 24 - 2 ”, “ 24 - 3 ”, and “ 24 - 4 ”.
[0062] Furthermore, each of the five wire conductors 23 connected via each of the four via-hole conductors 24-1, 24-2, 24-3, and 24-4 is denoted by reference numerals "23-1," "23-2," "23-3," "23-4," and "23-5." The wire conductors 23-1, 23-2, 23-3, 23-4, and 23-5 are provided so as to extend along different interfaces between the non-conductive material layers 19.
[0063] Furthermore, the pad portions 25 provided at the respective ends of the line conductors 23 - 1 , 23 - 2 , 23 - 3 , and 23 - 4 are denoted by reference numerals “ 25 - 1 ”, “ 25 - 2 ”, “ 25 - 3 ”, and “ 25 - 4 ”.
[0064] Furthermore, the non-conductive material layer 19, which includes the linear conductors 23-1, 23-2, 23-3, 23-4, and 23-5, is provided on the main surface with reference numerals "19-1," "19-2," "19-3," "19-4," and "19-5." The non-conductive material layers 19-1, 19-2, 19-3, 19-4, and 19-5 are stacked in this order from bottom to top.
[0065] A first lead conductor 28 and a second lead conductor 29 are connected to the first end 21 and the second end 22 of the coil 20, respectively. The first lead conductor 28 and the second lead conductor 29 are provided by extensions of the wire conductors 23-1 and 23-5 that are positioned at the first end 21 and the second end 22 of the coil 20, respectively.
[0066] In this specification, the terms "wire conductor," "lead conductor," and "external terminal electrode" are defined and distinguished as follows. A "wire conductor" refers to the portion of the coil that surrounds the coil when viewed from the coil axis. A "lead conductor" refers to the portion extending away from the surrounding portion. An "external terminal electrode" refers to the portion exposed from the component body.
[0067] First, if Figure 3 As shown, on the non-conductive material layer 19 - 1 , the line conductor 23 - 1 connected to the first external terminal electrode 26 via the first lead conductor 28 extends in the clockwise direction to the pad portion 25 - 1 .
[0068] Next, Figure 4The non-conductive material layer 19-2 is stacked on the non-conductive material layer 19-1. The elongated via conductor 24-1 is provided so as to penetrate the non-conductive material layer 19-2.
[0069] The long via hole conductor 24-1 connects the line conductor 23-1 and the pad portion 25-1. Figure 5 The wire conductor 23-2 is shown.
[0070] Next, if Figure 5 As shown, on the non-conductive material layer 19 - 2 , the line conductor 23 - 2 extends from the position of the elongated via-hole conductor 24 - 1 to the pad portion 25 - 2 in the clockwise direction.
[0071] Next, Figure 6 The non-conductive material layer 19-3 is stacked on the non-conductive material layer 19-2. The elongated via conductor 24-2 is provided so as to penetrate the non-conductive material layer 19-3.
[0072] The long via hole conductor 24-2 connects the line conductor 23-2 and the pad portion 25-2. Figure 7 The wire conductor 23-3 is shown.
[0073] Next, if Figure 7 As shown, on the non-conductive material layer 19 - 3 , the line conductor 23 - 3 extends from the position of the elongated via-hole conductor 24 - 2 to the pad portion 25 - 3 in the clockwise direction.
[0074] Next, Figure 8 The non-conductive material layer 19-4 is shown stacked on the non-conductive material layer 19-3. The elongated via conductor 24-3 is provided so as to penetrate the non-conductive material layer 19-4.
[0075] The long via hole conductor 24-3 connects the line conductor 23-3 and the pad portion 25-3. Figure 9 The wire conductor 23-4 is shown.
[0076] Next, if Figure 9 As shown, on the non-conductive material layer 19 - 4 , the line conductor 23 - 4 extends from the position of the elongated via-hole conductor 24 - 3 to the pad portion 25 - 4 in the clockwise direction.
[0077] Next, Figure 10 The non-conductive material layer 19-5 is stacked on the non-conductive material layer 19-4. The long via hole conductor 24-4 is provided so as to penetrate the non-conductive material layer 19-5. The long via hole conductor 24-4 connects the line conductor 23-4 and the pad portion 25-4. Figure 11 The wire conductor 23-5 is shown.
[0078] Next, ifFigure 11 As shown, on the non-conductive material layer 19-5, the line conductor 23-5 extends from the position of the long hole conductor 24-4 in the clockwise direction and is connected to the second external terminal electrode 27 via the second lead conductor 29.
[0079] In the above, according to the first embodiment, when viewed in the axial direction of the coil 20, it is easy to cause the long hole conductor 24 not to project toward the inner peripheral side of the line conductor 23. Therefore, the possibility of the shielding of the magnetic flux by the hole conductor 24 is reduced, and it is possible to suppress the influence of the hole conductor 24 on the characteristics of the inductor 11, particularly the Q value.
[0080] In addition, in the manufacturing process of the inductor 11, even if a lamination deviation occurs, the possibility of the long hole conductor 24 projecting toward the inner peripheral side of the line conductor 23 is reduced, and thus it is possible to obtain a stable, i.e., narrow deviation, inductance value in the inductor 11.
[0081] In addition, even if the degree of the long hole conductor 24 projecting toward the inner peripheral side of the line conductor 23 is reduced or the long hole conductor 24 is caused not to project toward the inner peripheral side of the line conductor 23, by being in the long shape extending along the line conductor 23, it is possible to obtain a larger contact area with the line conductor 23 compared to a circular hole conductor, and thus it is possible to improve the connection reliability with the line conductor 23.
[0082] In addition, according to the first embodiment, since the center position in the width direction of the long hole conductor 24 orthogonal to the length direction is offset from the center position in the width direction of the line conductor 23, it is possible to disperse the stress at the time of thermal expansion or shrinkage due to the application of heat at the time of manufacturing, mounting, or actual work of the inductor 11.
[0083] The above-described effects by the long hole conductor 24 obtained in the first embodiment also function in the second and subsequent embodiments described below.
[0084] Next, the inductor 11a according to the second embodiment of the present application will be described with reference to Figure 12 to the inductor 11a according to the second embodiment of the present application. Figure 12 is a view corresponding to Figure 2 In Figure 12 , elements corresponding to elements shown in Figure 2 are attached with the same reference numerals, and overlapping descriptions are omitted.
[0085] Figure 12 As with the inductor 11 shown in Figure 2 , in the inductor 11a, the center position in the width direction of the long hole conductor 24 orthogonal to the length direction is offset from the center position in the width direction of the line conductor 23 and the land portion 25. However, in the inductor 11a, the long hole conductor 24 is connected to the line conductor 23 via the land portion 25. Figure 2In the case of the inductor 11 shown, the center position in the width direction of the long through-hole conductor 24 is offset from the center position in the width direction of the wire conductor 23 toward the inner periphery side of the spiral-shaped track formed by the wire conductor 23 when viewed in the axial direction of the coil 20a.
[0086] Further, in the Figure 12 , the long through-hole conductor 24 does not protrude from the outer periphery of the wire conductor 23, and the outer periphery of the long through-hole conductor 24 is positioned on the outer periphery of the wire conductor 23. In this way, in the case where the long through-hole conductor 24 does not protrude from the outer periphery of the wire conductor 23, the wire conductor 23 can be brought closer to the outer terminal electrodes 26, 27, the edge of the component main body 12, and thus the inner diameter of the coil 20a can be increased, and the Q value of the inductor 11a can be improved. In addition, in the case where the outer periphery of the long through-hole conductor 24 is positioned on the outer periphery of the wire conductor 23, in the configuration in which the Q value of the inductor 11a can be improved by the above-described non-protrusion, the contact area of the wire conductor 23 and the long through-hole conductor 24 can be maximized, and the connection reliability can be improved.
[0087] According to the second embodiment, first, as in the case of the first embodiment, the degree to which the through-hole conductor 24 protrudes toward the inner periphery side of the wire conductor 23 can be reduced, and the influence on the Q value can be suppressed, and the stress at the time of thermal expansion and contraction caused by the application of heat at the time of manufacturing, mounting, or actual operation of the inductor 11a can be dispersed.
[0088] In addition, according to the second embodiment, by the long through-hole conductor 24, the degree to which the wire conductor 23 protrudes toward the inner periphery side can be reduced, and the connection area of the wire conductor 23 and the long through-hole conductor 24 can be increased, and the connection reliability of the connection portion can be improved.
[0089] In addition, the second embodiment also has the feature that the width direction dimension of the long through-hole conductor 24 is greater than the width direction dimension of the wire conductor 23. This relates to increasing the connection area of the wire conductor 23 and the long through-hole conductor 24, and thus the connection reliability of the connection portion can be improved.
[0090] In addition, in the second embodiment, the pad portion 25 to which the long through-hole conductor 24 is connected is not explicitly illustrated in Figure 12 , but the wire conductor 23 has the pad portion 25. The width direction dimension of the long through-hole conductor 24 is greater than the width direction dimension of the pad portion 25. According to this configuration, the stress generated at the time of thermal expansion and contraction caused by the application of heat at the time of manufacturing, mounting, or actual operation of the inductor can be advantageously dispersed.
[0091] The feature of the second embodiment described above, i.e., the feature that the width dimension of the long via conductor 24 is larger than the width dimension of the wire conductor 23, can also be applied to an embodiment in which the center position of the width direction of the long via conductor 24 is offset from the center position of the width direction of the wire conductor 23 toward the outer peripheral side of the spiral track formed by the wire conductor 23.
[0092] also, Figure 12 The shape of the coil 20a shown is similar to Figure 2 The coil 20 shown in FIG. 1 is different in form. This first shows that the coil can take various forms. Figure 12 In the coil 20a shown, Figure 2 Compared with the coil 20 shown in FIG. 1 , the inner peripheral edge can be reduced in unevenness. Therefore, the loss caused by current concentration and the like can be suppressed.
[0093] A third embodiment may be formed by combining the features of the first embodiment and the second embodiment described above. Figure 13 The inductor 11b according to the third embodiment of the present invention is equivalent to Figure 2 In the picture. Figure 13 In, with Figure 2 Corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[0094] exist Figure 13 The illustrated inductor 11b includes multiple elongated via-hole conductors, including, for example, a first elongated via-hole conductor 24-1, a second elongated via-hole conductor 24-2, a third elongated via-hole conductor 24-3, and a fourth elongated via-hole conductor 24-4. The widthwise center position of the first elongated via-hole conductor 24-1 is offset from the widthwise center position of the wire conductor 23 (pad portion 25) toward the outer periphery of the spiral track formed by the coil 20b. The widthwise centers of the second and third elongated via-hole conductors 24-2 and 24-3 coincide with the widthwise center position of the wire conductor 23 (pad portion 25). The widthwise center position of the fourth elongated via-hole conductor 24-4 is offset from the widthwise center position of the wire conductor 23 (pad portion 25) toward the inner periphery of the spiral track formed by the coil 20b.
[0095] According to the third embodiment, it is possible to achieve both the narrow inductance characteristics according to the first embodiment and the high connection reliability according to the second embodiment.
[0096] The first to third embodiments share the following feature: the number of turns of the wire conductor 23 within the same interface between the non-conductive material layers 19 is 0.7 or more and less than 2 turns. If the number of turns is 0.7 or more, leakage magnetic flux can be reduced, while if it is less than 2 turns, a wider area for magnetic flux to pass through can be ensured.
[0097] Regarding the number of turns described above, one turn is defined as follows: One turn is defined as the stage where tangent lines are drawn sequentially from the starting end to the ending end along the outer circumference of the wire conductor 23 and the tangent lines rotate 360 degrees.
[0098] In addition, the first to third embodiments have the following features in common: the number of turns of the wire conductor 23 in the same interface between the non-conductive material layers 19 is less than 1 turn, and the number of turns of the wire conductor 23 along each interface between the non-conductive material layers 19, i.e., the wire conductors 23-2, 23-3, and 23-4, is constant. According to this structure, for example, Figure 2 It can be seen that the intervals between the elongated via-hole conductors 24 - 1 , 24 - 2 , 24 - 3 and 24 - 4 are equal, and bottlenecks due to the cross-sectional area in the current path provided by the coil 20 are eliminated, making it difficult to generate losses due to current concentration.
[0099] Next, refer to Figures 14-17 , a fourth embodiment of the present invention is described. Figure 14 This is a view showing a portion of the coil 20 c included in the inductor 11 c according to the fourth embodiment, viewed from above in the axial direction of the coil 20 c . Figures 14-17 are equivalent to Figures 2-5 In the picture. Figures 14-17 In, with Figures 2-5 Corresponding elements are denoted by the same reference numerals, and redundant descriptions are omitted.
[0100] exist Figure 14 The middle figure shows the first lead conductor 28 , the first wire conductor 23 - 1 and the second wire conductor 23 - 2 having the first land portion 25 - 1 in the coil 20 c , and the elongated via-hole conductor 24 - 1 .
[0101] like Figure 15 As shown, the line conductor 23 - 1 connected to the first external terminal electrode 26 via the first lead conductor 28 on the non-conductive material layer 19 - 1 extends in the clockwise direction to the first pad portion 25 - 1 .
[0102] Next, Figure 16 The non-conductive material layer 19-2 is stacked on the non-conductive material layer 19-1. The via hole conductor 24-1 is provided so as to penetrate the non-conductive material layer 19-2. The via hole conductor 24-1 connects the line conductor 23-1 and the pad portion 25-1. Figure 17The second line conductor 23-2 is shown. That is, the second line conductor 23-2 is connected to the long via conductor 24-1 from the side opposite to the first pad portion 25-1. Figure 16 The long via conductor 24-1 is shown to have a larger width direction dimension than Figure 4 The long via conductor 24-1 is shown to have a larger width direction dimension than
[0103] Next, as shown in FIG. 17, the non-conductive material layer 19-2 is formed on the coil 20c. Figure 17 As shown, on the non-conductive material layer 19-2, the line conductor 23-2 extends from the position of the long via conductor 24-1 in the clockwise direction to the pad portion 25-2.
[0104] In the fourth embodiment, in a part of the coil 20c having the above-described structure, the long via conductor 24-1 is connected to the second line conductor 23-2 from the side opposite to the first pad portion 25-1. Figure 14 As can be seen, when viewed in the axis direction of the coil 20c, the center position in the width direction of the long via conductor 24-1 is offset from the center position in the width direction of the first pad portion 25-1, and the center position in the width direction of the long via conductor 24-1 is offset from the center position in the width direction of the part of the second line conductor 23-2 connected to the long via conductor 24-1. More specifically, the long via conductor 24-1 has a relatively large width direction dimension, and the inner periphery of the pad portion 25-1 of the line conductor 23-1 is in contact with the inner periphery of the long via conductor 24-1, and the outer periphery of the line conductor 23-2 is in contact with the outer periphery of the long via conductor 24-1.
[0105] According to this structure, at the time of shrinkage after the application of heat at the manufacturing stage of the inductor, the mounting process, or actual work, the shrinkage stress received by the long via conductor 24-1 from the line conductors 23-1 and 23-2 can be advantageously dispersed, and the long via conductor 24-1 is less likely to break. Further, the above-described description is made with respect to the long via conductor 24-1 as a part of the coil 20c, but the same applies to the other long via conductors.
[0106] Next, with reference to Figures 18-29 A fifth embodiment of the present application will be described. Figure 18 is a view that shows the inductor 11d according to the fifth embodiment, and corresponds to Figure 2 is a view that shows the inductor 11d according to the fifth embodiment, and corresponds to Figures 19-29 is a view that shows the inductor 11d according to the fifth embodiment, and corresponds to Figures 3-11 In Figures 18-29 , elements corresponding to elements shown in Figures 2-11 are given the same reference numerals, and overlapping descriptions are omitted.
[0107] The inductor 11d according to the fifth embodiment has the following feature: the number of turns of the line conductor 23 within the same interface between the non-conductive material layers 19 exceeds one turn and is less than two turns.
[0108] Referring to Figure 18 The first end portion 21 and the second end portion 22 of the coil 20d provided in the inductor 11d according to the fifth embodiment are connected to the first lead conductor 28 and the second lead conductor 29, respectively.
[0109] Referring mainly to Figures 19-29 The connection of the plurality of wire conductors 23 in the coil 20d provided in the inductor 11d according to the fifth embodiment will be described.
[0110] As Figure 19 indicated, the wire conductor 23-1 connected to the first external terminal electrode 26 via the first lead conductor 28 on the non-conductive material layer 19-1 extends about 1.75 turns in the clockwise direction to the pad portion 25-1.
[0111] Next, the non-conductive material layer 19-2 indicated in Figure 20 is laminated on the non-conductive material layer 19-1. The long strip via conductor 24-1 is provided so as to penetrate the non-conductive material layer 19-2. The long strip via conductor 24-1 connects the wire conductor 23-1 and the wire conductor 23-2 indicated in Figure 21 via the pad portion 25-1.
[0112] Here, as Figure 18 can be understood, the center position in the width direction orthogonal to the length direction of the long strip via conductor 24-1 (the reference numeral to which "24" is added in Figure 18 is shifted from the center position in the width direction of the wire conductor 23 toward the outer peripheral side of the spiral-shaped track formed by the wire conductor 23.
[0113] Next, as Figure 21 indicated, on the non-conductive material layer 19-2, the wire conductor 23-2 extends about 1.5 turns in the clockwise direction from the position of the long strip via conductor 24-1 to the pad portion 25-2.
[0114] Next, the non-conductive material layer 19-3 indicated in Figure 22 is laminated on the non-conductive material layer 19-2. The circular via conductor 24-2 is provided so as to penetrate the non-conductive material layer 19-3. The via conductor 24-2 connects the wire conductor 23-2 and the wire conductor 23-3 indicated in Figure 23 via the pad portion 25-2.
[0115] Next, as Figure 23 indicated, on the non-conductive material layer 19-3, the wire conductor 23-3 extends about 1.75 turns in the clockwise direction from the position of the circular via conductor 24-2 to the pad portion 25-3.
[0116] Next, the non-conductive material layer 19-4 indicated in Figure 24The non-conductive material layer 19-4 is stacked on the non-conductive material layer 19-3. The long via hole conductor 24-3 is provided so as to penetrate the non-conductive material layer 19-4. The long via hole conductor 24-3 connects the line conductor 23-3 and the pad portion 25-3. Figure 25 The wire conductor 23-4 is shown.
[0117] Here, from Figure 18 It can be seen that the long via hole conductor 24-3 (at Figure 18 , the center position of the wire conductor 23 in the width direction perpendicular to the length direction is offset from the center position of the wire conductor 23 in the width direction toward the outer peripheral side of the spiral track formed by the wire conductor 23.
[0118] Next, if Figure 25 As shown, on the non-conductive material layer 19 - 4 , the line conductor 23 - 4 extends from the position of the elongated via conductor 24 - 3 in a clockwise direction for about 1.75 turns to the pad portion 25 - 4 .
[0119] Next, Figure 26 The non-conductive material layer 19-5 shown is stacked on the non-conductive material layer 19-4. A circular via hole conductor 24-4 is provided so as to penetrate the non-conductive material layer 19-5. The via hole conductor 24-4 connects the line conductor 23-4 and the pad portion 25-4. Figure 27 The wire conductor 23-5 is shown.
[0120] Next, if Figure 27 As shown, on the non-conductive material layer 19 - 5 , the line conductor 23 - 5 extends from the position of the circular via-hole conductor 24 - 4 in the clockwise direction for about 1.5 turns to the pad portion 25 - 5 .
[0121] Next, Figure 28 The non-conductive material layer 19-6 is stacked on the non-conductive material layer 19-5. The long via hole conductor 24-5 is provided so as to penetrate the non-conductive material layer 19-6. The long via hole conductor 24-5 connects the line conductor 23-5 and the pad portion 25-5. Figure 29 The wire conductor 23-6 is shown.
[0122] Here, from Figure 18 It can be seen that the long via hole conductor 24-5 (at Figure 18 , the center position of the wire conductor 23 in the width direction perpendicular to the length direction is offset from the center position of the wire conductor 23 in the width direction toward the outer peripheral side of the spiral track formed by the wire conductor 23.
[0123] Next, if Figure 29As shown, the wire conductor 23-6 extends about 1.75 turns in the clockwise direction from the position of the long through-hole conductor 24-5 on the non-conductive material layer 19-6 and is connected to the second external terminal electrode 27 via the second lead conductor 29.
[0124] In the first to fifth embodiments described above, the first to fourth embodiments have the following feature in common: the width direction dimension of the wire conductor 23 within the same interface between the non-conductive material layers 19 is constant. According to this structure, since the concavities and convexities on the inner periphery side of the coil 20, 20a, 20b, and 20c can be reduced, the shielding of the magnetic flux can be reduced or eliminated, and in addition, losses due to current concentration and the like can be less likely to occur. Furthermore, even if the width direction dimension of the wire conductor 23 is constant, for example, there can be portions where the width direction dimension changes, such as at the corner portions.
[0125] In the fifth embodiment, Figure 21 The wire conductor 23-2 shown and Figure 23 The wire conductor 23-3 shown has a larger width direction dimension in the portion connected to the circular through-hole conductor 24-2 than in other portions, Figure 25 The wire conductor 23-4 shown and Figure 27 The wire conductor 23-5 shown has a larger width direction dimension in the portion connected to the circular through-hole conductor 24-4 than in other portions. However, these portions where the width direction dimension is larger merely provide a form in which the outermost peripheral portion of the spiral portion protrudes outward, and thus hardly become a cause of shielding the magnetic flux. In addition, in the fifth embodiment, the width direction dimension of the majority of the wire conductor 23 within the same interface between the non-conductive material layers 19 is also constant, and thus losses due to current concentration and the like can be less likely to occur.
[0126] The present application has been described above in relation to several embodiments, but various modifications can be made within the scope of the present application.
[0127] For example, in the illustrated embodiments, the coils 20, 20a, 20b, 20c, and 20d are disposed inside the component body 12 in a state in which the axis thereof is oriented in a direction parallel to the mounting surface 13, but the direction of the lamination of the non-conductive material layers can be changed, and the axis of the coil can be oriented in a direction orthogonal to the mounting surface. In addition, the axis of the coil is sometimes oriented in a direction parallel to the mounting surface and in a direction along the length of the component body (for example, the left-right direction in FIG. 1). Figure 2
[0128] In addition, in the illustrated embodiment, the external terminal electrodes 26 and 27 are provided across each of the mounting surface 13 of the component main body 12 and the two surfaces of the first end surface 17 and the second end surface 18 adjacent thereto, but for example, can be formed so as to extend to the top surface 14 and the first side surface 15 and the second side surface 16, or formed only on the mounting surface 13, and the formation region of the external terminal electrodes can be arbitrarily changed as needed.
[0129] In addition, the total number of turns of the plurality of wire conductors provided in the coil can be arbitrarily changed by changing the number of connections of the wire conductors and the through-hole conductors.
[0130] In addition, each of the embodiments described in the present specification is illustrative, and partial substitution or combination of structures can be made between different embodiments.
Claims
1. An inductor comprising: a component body composed of a non-conductive material; and The coil is arranged inside the component body and includes a plurality of wire conductors extending along the main surface of the component body and a plurality of via-hole conductors extending perpendicularly to the main surface of the component body, wherein the wire conductors have pad portions connected to the via-hole conductors, and a spiral track is formed by connecting the wire conductors and the via-hole conductors. The plurality of via hole conductors include a long via hole conductor extending along the line conductor. When viewed from the axial direction of the coil, the center position of the elongated via hole conductor in the width direction perpendicular to the longitudinal direction is offset from the center position of the first land portion connected to the elongated via hole conductor in the width direction.
2. The inductor according to claim 1, wherein The center position of the elongated via-hole conductor in the width direction is offset toward the outer periphery of the spiral track.
3. The inductor according to claim 1, wherein The center position of the elongated via-hole conductor in the width direction is offset toward the inner circumference of the spiral track.
4. The inductor according to claim 2, wherein The plurality of via-hole conductors include a second elongated via-hole conductor extending along the line conductor. A center position of the second elongated via-hole conductor in the width direction is offset toward an inner circumference of the spiral track.
5. The inductor according to claim 1, wherein The coil includes: a first wire conductor, which is one of the plurality of wire conductors and has the first pad portion; and a second wire conductor, which is one of the plurality of wire conductors and is connected to the elongated via conductor from a side opposite to the first pad portion. When viewed from above in the axial direction of the coil, a center position of the elongated via-hole conductor in the width direction is offset from a center position of a portion of the second wire conductor connected to the elongated via-hole conductor in the width direction.
6. The inductor according to claim 5, wherein A center position of the first land portion in the width direction is offset from a center position of a portion of the second wire conductor connected to the elongated via-hole conductor in the width direction.
7. The inductor according to claim 1, wherein A dimension of the elongated via-hole conductor in the width direction is larger than a dimension of a first wire conductor in the width direction. The first wire conductor is one of the plurality of wire conductors and has the first land portion.
8. The inductor according to claim 1, wherein A dimension of the elongated via-hole conductor in the width direction is larger than a dimension of the first land portion in the width direction.
9. The inductor according to any one of claims 1 to 8, wherein: A dimension of one of the plurality of wire conductors in the width direction is constant.
10. The inductor according to any one of claims 1 to 9, wherein The number of turns of one of the plurality of wire conductors is equal to or greater than 0.7 turns and less than 2 turns.
11. The inductor according to any one of claims 1 to 10, wherein: The number of turns of the plurality of wire conductors is a constant number of turns smaller than 1 turn.
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