Circuit soft board with heat insulation function and light-emitting module

Abstract

The application discloses a circuit soft board with a heat insulation function and a light-emitting module, wherein the circuit soft board comprises a base material layer, a circuit layer, a binding pad and a vertical projection; the base material layer comprises a heat insulation part and a bending part, and the heat insulation part is adjacent to the bending part; the circuit layer is located on the side and / or surface of the base material layer; the binding pad is electrically connected with the circuit layer; the vertical projection of the binding pad in the base material layer is located in the bending part; wherein the heat insulation part comprises a heat resistance layer and a heat dissipation layer, the heat dissipation layer is located between the heat resistance layer and a device to be bound and is in contact with the device to be bound; the heat dissipation layer has a high heat dissipation coefficient and can effectively dissipate heat of the device to be bound; the heat resistance layer has a low thermal conductivity and can block the heat generated by the device to be bound from being transmitted to the circuit layer, controls the heat to be between the heat resistance layer and the heat dissipation layer, transmits the heat to the environment, ensures that the heat cannot be transmitted to the circuit soft board, and thus the stability of the soft board structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of flexible circuit board technology, and in particular to a flexible circuit board with heat insulation function and a light-emitting module. Background Technology

[0002] With the rapid development of electronic products, there are many types of circuit boards, including rigid boards, flexible boards, and rigid-flex boards. Among them, flexible printed circuits (FPCs) have advantages such as high wiring density, light weight, thinness, flexibility, and high flexibility, which are unmatched by other types of circuit boards.

[0003] Currently, flexible printed circuit boards (FPCBs) are made of flexible substrates such as polyimide or polyester film. After the FPCB is bonded to the device to be bonded, such as an organic light-emitting diode (OLED) screen, the heat dissipation efficiency of the device is affected because the FPCB covers the device or is in close proximity to it. Furthermore, the heat generated by the device is conducted to the FPCB, which can affect the structural stability of the FPCB. Therefore, how to improve the heat dissipation efficiency of the device to be bonded while preventing the heat generated by the device from being conducted to the FPCB has become an urgent technical problem to be solved. Summary of the Invention

[0004] This invention provides a flexible circuit board and a light-emitting module with heat insulation function to improve the heat dissipation efficiency of the device to be bonded, while preventing the heat generated by the device to be bonded from being conducted to the flexible circuit board, thus ensuring the working characteristics of the device.

[0005] According to one aspect of the present invention, a flexible circuit board with heat insulation function is provided, comprising:

[0006] The substrate layer includes a heat-insulating portion and a bending portion, wherein the heat-insulating portion is adjacent to the bending portion;

[0007] A circuit layer located on the side of the substrate layer and / or inside the substrate layer;

[0008] A bonding pad is provided, which is electrically connected to the circuit layer; the vertical projection of the bonding pad in the substrate layer is located in the bend.

[0009] The heat insulation portion includes a heat-insulating layer and a heat-dissipating layer. The heat-dissipating layer is located between the heat-insulating layer and the device to be bonded, and is in contact with the device to be bonded. The heat-dissipating layer is used to dissipate heat from the device to be bonded, and the heat-insulating layer is used to prevent the heat generated by the device to be bonded from being transferred to the circuit layer.

[0010] Optionally, the heat dissipation layer includes multiple hollow structures, which are used to increase the heat dissipation area of ​​the heat dissipation layer.

[0011] Optionally, the cutout pattern of the cutout structure includes at least one of polygons, circles, and ellipses.

[0012] Optionally, the heat dissipation layer includes a heat dissipation substrate in contact with the surface of the device to be bonded, and a plurality of heat dissipation fins fixed between the heat dissipation substrate and the heat insulation layer; the plurality of heat dissipation fins are arranged in sequence at intervals; the cavity formed between two adjacent heat dissipation fins is used as the hollow structure.

[0013] Optionally, the plane on which the heat sink is located is perpendicular to the plane on which the heat sink substrate is located; all the planes on which the heat sink is located are parallel to each other.

[0014] Optionally, the plane where the heat sink is located intersects with the plane where the heat dissipation substrate is located; each pair of adjacent planes where the heat sink is located intersects with each other to form a heat dissipation support frame.

[0015] Optionally, the heat dissipation layer is made of metal; the heat-insulating layer is made of at least one of aerogel and ceramic.

[0016] Optionally, the heat dissipation layer includes a flexible carbon nanotube adhesive sheet.

[0017] Optionally, the thermal conductivity of the insulation gradually decreases along the direction from the device to be bonded to the circuit layer.

[0018] According to another aspect of the present invention, a light-emitting module is provided, including a light-emitting panel and a flexible circuit board with heat insulation function as described in any embodiment of the present invention. The flexible circuit board with heat insulation function is disposed on the non-light-emitting side of the light-emitting panel, and the bonding pads on the flexible circuit board are bonded to the bonding area of ​​the light-emitting panel.

[0019] Optionally, the light-emitting module further includes a graphene film, which is located on the side of the light-emitting panel away from the flexible circuit board and / or on the side of the light-emitting panel close to the flexible circuit board.

[0020] The technical solution provided by this invention combines a flexible substrate layer with a heat dissipation structure. The heat dissipation structure comprises two parts: a heat-resistant layer and a heat dissipation layer. The heat-resistant layer is disposed on the same layer as the bending portion, and the heat dissipation layer is located between the heat-resistant layer and the device to be bonded, and is in contact with the device to be bonded. The heat dissipation layer has a high heat dissipation coefficient, which can effectively dissipate heat from the device to be bonded. The heat-resistant layer has a low thermal conductivity, which can prevent the heat generated by the device to be bonded from being transferred to the circuit layer, controlling the heat between the heat-resistant layer and the heat dissipation layer, and conducting the heat to the environment, ensuring that the heat is not conducted to the flexible circuit board, thereby improving the stability of the flexible circuit board structure.

[0021] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a cross-sectional structural diagram of a flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0024] Figure 2 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0025] Figure 3 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0026] Figure 4 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0027] Figure 5 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0028] Figure 6 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention;

[0029] Figure 7 yes Figure 6 A schematic cross-sectional view of the heat insulation section in the structure shown.

[0030] Figure 8 This is a cross-sectional structural diagram of another heat insulation part provided in an embodiment of the present invention;

[0031] Figure 9 This is a cross-sectional structural diagram of another heat insulation part provided in an embodiment of the present invention;

[0032] Figure 10 This is a cross-sectional structural diagram of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0034] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0035] This invention provides a flexible circuit board with heat insulation function. Figure 1 This is a cross-sectional structural diagram of a flexible circuit board with heat insulation function provided in an embodiment of the present invention. Figure 2 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. Figure 3 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. (Refer to...) Figures 1-3 The flexible circuit board with heat insulation function includes:

[0036] The substrate layer 10 includes a heat insulation portion 12 and a bending portion 11, wherein the heat insulation portion 12 is adjacent to the bending portion 11.

[0037] The circuit layer 20 is located on the side of the substrate layer 10 and / or inside the substrate layer 10, which is used to support the circuit layer 20.

[0038] Bonding pads 30 are electrically connected to circuit layer 20; the vertical projection of bonding pads 30 in substrate layer 10 is located in bend 11.

[0039] The heat insulation part 12 includes a heat-insulating layer 121 and a heat dissipation layer 122. Optionally, the heat-insulating layer 121 is disposed in the same layer as the bending part 11, and the heat dissipation layer 122 is located between the heat-insulating layer 121 and the device to be bonded 200 and is in contact with the device to be bonded 200. The heat dissipation layer 122 is used to dissipate heat from the device to be bonded 200, and the heat-insulating layer 121 is used to block the heat generated by the device to be bonded 200 from being transferred to the circuit layer 20 so that the heat is conducted to the environment.

[0040] Specifically, the substrate layer 10 of the flexible circuit board includes a heat-insulating portion 12 and a bending portion 11, with the heat-insulating portion 12 adjacent to the bending portion 11. The bending portion 11 can be formed of any suitable insulating material with flexibility. For example, the flexible substrate can be formed of polymer materials such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyaryl compounds (PAR), or glass fiber reinforced plastic (FRP). The bending portion 11 may include a first bending portion 111 and a second bending portion 112, located on opposite sides of the heat-insulating portion 12. Alternatively, the heat-insulating portion 12 may be located in the central region of the substrate layer 10, with the bending portion 11 surrounding the edge of the heat-insulating portion 12. The circuit layer 20 can be located on the side of the substrate layer 10 or inside the substrate layer.

[0041] When the circuit layer 20 is located inside the substrate layer 10, the substrate layer 10 encapsulates the circuit layer. (See reference) Figure 1 The circuit layer 20 is shown as located inside the substrate layer 10 and within the bend 11. The bend 11 is disposed around the edge of the heat insulation portion 12, and the circuit layer 20 can be disposed around the edge of the heat insulation portion 12 to achieve conductivity of the bonding pads 30 at both ends.

[0042] When the circuit layer 20 is located on the side of the substrate layer 10, the heat insulation portion 12 and the bending portion 11 are joined together, providing a flat support surface for the circuit layer 20. (Reference) Figure 2The circuit layer 20 is illustrated as located on the side of the substrate layer 10 away from the device to be bonded 200, and one bonding pad 30 is located on the side of the substrate layer 10 closer to the device to be bonded 200 for bonding connection with the device to be bonded 200; another bonding pad 30 is located on the side of the circuit layer 20 away from the substrate layer 10 and can be connected to external lines for power and signal transmission. The bonding pad 30 located on the side of the substrate layer 10 closer to the device to be bonded 200 can be connected to the circuit layer 20 through a through hole penetrating the bend 11, thereby enabling conductivity between the bonding pads 30 on both sides. In addition, a protective layer 50 can be formed on the circuit layer 20. The material of the protective layer 50 can be the same as that of the substrate layer to protect the circuit layer 20 and insulate it from the outside environment.

[0043] refer to Figure 3 The circuit layer 20 is illustrated as being located on one side of the substrate layer 10, with two bonding pads 30 located on the same side of the substrate layer 10. The circuit layer 20 can be fixed to the surface of one side of the substrate layer 10 using a thermosetting adhesive 40, such as AD adhesive (acrylic hot melt adhesive), in which case the substrate layer 10 acts as a base, providing support. The circuit layer 20 can be a double-sided laminate, a three-layer laminate, a four-layer laminate, or other layers of rigid-flex PCB. For example, Figure 3 The double-sided layered board structure is shown. Circuit layer 20 may include a flexible substrate layer 21, and a first metal layer and a second metal layer located on opposite sides of the flexible substrate layer 21. Bonding pads 30 are located on the side of the first metal layer away from the flexible substrate layer and are in contact with the first metal layer. The first and second metal layers can be connected through through-holes 26 penetrating the flexible substrate layer 21. Metal wires are provided in the through-holes 26, allowing the bonding pads 30 to communicate with the second metal layer for signal transmission. The first metal layer may include a base copper 22 on the surface of the flexible substrate layer 21 and copper plating 23 on the surface of the base copper 22. The second metal layer may include a base copper 24 on the other surface of the flexible substrate layer 21 and copper plating 25 on the surface of the base copper 24.

[0044] The bending portion 11 of the flexible circuit board is made of a flexible substrate such as polyimide or polyester film, which has the advantages of high wiring density, light weight, thinness, bendability, and high flexibility. It can withstand millions of dynamic bends without damaging the wires, and can move and stretch arbitrarily according to spatial layout requirements to achieve three-dimensional assembly. (Reference) Figure 1 and Figure 2 The bonding pad 30, which connects to the device to be bonded 200, is located on the side of the bend 11 closest to the device to be bonded 200. When the bend 11 bends downward, it can bring the bonding pad 30 closer to the bonding area 201 of the device to be bonded 200, thereby achieving corresponding contact between the bonding pad 30 and the pad in the bonding area 201. (Reference) Figure 3A bonding pad 30 is provided at the edge of the circuit layer 20 away from the substrate layer 10; the vertical projection of the bonding pad 30 in the substrate layer 10 is located in the bending portion 11. After the bending portion 11 is bent, it can cause the bonding pad 30 to rotate, so that the bonding pad 30 is bonded to the device 200 located on the side of the substrate layer 10 away from the circuit layer 20. The number of bonding pads 30 on the flexible circuit board can be multiple. Here, the number of bonding pads 30 on the flexible circuit board and the arrangement of the bonding pads 30 are not limited, and can be set according to actual needs.

[0045] The device to be bonded 200 is located on one side of the substrate layer 10 of the flexible circuit board with thermal insulation function, close to or in contact with the substrate layer 10 of the flexible circuit board. To prevent the heat generated by the device to be bonded 200 during operation from being difficult to dissipate due to the coverage of the flexible circuit board, and to prevent the heat generated by the device to be bonded 200 during operation from being transferred to the flexible circuit board and affecting the temperature stability of the flexible circuit board structure, this embodiment of the invention sets the area in the substrate layer 10 that is close to or in contact with the device to be bonded 200 as a thermal insulation portion 12 with thermal insulation function. The thermal insulation portion 12 includes a heat-insulating layer 121 and a heat-dissipating layer 122. The heat-insulating layer 121 is disposed in the same layer as the bending portion 11; the heat-dissipating layer 122 is located between the heat-insulating layer 121 and the device to be bonded 200, and is in contact with the device to be bonded 200. In the substrate layer 10, the thickness of the heat insulation portion 12 is greater than the thickness of the bending portion 11, and the thickness of the heat-insulating layer 121 is the same as the thickness of the bending portion 11; the heat dissipation layer 122 is exposed between the heat-insulating layer 121 and the device to be bonded 200 to facilitate heat dissipation.

[0046] Heat dissipation layer 122 can be understood as a film layer with a high heat dissipation coefficient. The heat dissipation coefficient generally refers to convective heat transfer and is the amount of heat transferred through a 1 square meter area in 1 hour under steady-state heat transfer conditions, with units of W / m². 2 K. Setting the film layer that contacts or is close to the device to be bonded 200 to have a high heat dissipation coefficient can effectively dissipate heat from the device 200. The heat-insulating layer 121 can be a film layer with a low thermal conductivity. Thermal conductivity refers to the amount of heat transferred through a 1m thick material in 1 hour through a 1m square meter area under stable heat transfer conditions, with the unit being W / mK. Thermal conductivity is related to factors such as the material's composition, density, moisture content, and temperature. Materials with lower density have lower thermal conductivity. Setting a film layer with a low thermal conductivity between the heat dissipation layer 122 and the circuit layer 20 can prevent the heat generated by the device to be bonded 200 from being transferred to the circuit layer 20, controlling the heat between the heat-insulating layer 121 and the heat dissipation layer 122, allowing the heat to be conducted into the environment, and preventing the heat from being conducted to the flexible circuit board, thereby improving the stability of the flexible circuit board structure.

[0047] It should be noted that, in this embodiment of the invention, the flexible circuit board serves to connect the device to be bonded 200 and other circuits or control chips. One bonding pad 30 on the flexible circuit board is connected to the device to be bonded 200, and the other bonding pad 30 can be connected to other circuits or control chips. No high-heat-generating components are placed on the flexible circuit board to avoid the heat-insulating layer 121 affecting the heat dissipation of the components, which could lead to severe component overheating and affect the stability of the flexible circuit board structure.

[0048] The flexible circuit board with heat insulation function provided in this embodiment of the invention includes: a substrate layer, including a heat insulation portion and a bending portion, the heat insulation portion being adjacent to the bending portion; a circuit layer, located on the side and / or inside of the substrate layer; and bonding pads connected to the circuit layer, the vertical projection of the bonding pads in the substrate layer being located in the bending portion; wherein, the heat insulation portion includes a heat-resistant layer and a heat-dissipating layer, the heat-resistant layer being disposed in the same layer as the bending portion, and the heat-dissipating layer being located between the heat-resistant layer and the device to be bonded, and in contact with the device to be bonded; the heat dissipation layer has a high heat dissipation coefficient, which can effectively dissipate heat from the device to be bonded; the heat resistance layer has a low thermal conductivity, which can prevent the heat generated by the device to be bonded from being transferred to the circuit layer, controlling the heat between the heat resistance layer and the heat dissipation layer, allowing the heat to be conducted to the environment, ensuring that the heat is not conducted to the flexible circuit board, thereby improving the stability of the flexible circuit board structure.

[0049] Optionally, the surface shape of the heat dissipation layer 122 in contact with the device to be bonded 200 can be set according to the surface shape of the device to be bonded 200. (See reference) Figures 1-3 When the surface of the device to be bonded 200 is a plane, the surface of the heat dissipation layer 122 that contacts the device to be bonded 200 is also a plane. Figure 4 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. (Refer to...) Figure 4 When the surface of the device to be bonded 200 is curved, the surface of the heat dissipation layer 122 that contacts the device to be bonded 200 is also curved. This allows the heat dissipation layer 122 to be tightly fitted to the light-emitting panel. This ensures that the entire power amplifier area of ​​the device to be bonded 200 can contact the heat dissipation layer 122, increasing the contact area between the heat dissipation layer 122 and the device to be bonded 200, improving the heat dissipation efficiency of the device to be bonded 200, and simultaneously improving the heat dissipation uniformity of the device to be bonded 200.

[0050] Figure 5 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. (Refer to...) Figure 5 Based on the above embodiments, as one implementation of the present invention, optionally, the heat dissipation layer 122 includes a plurality of hollow structures 1221, which are used to increase the heat dissipation area of ​​the heat dissipation layer 122.

[0051] Specifically, the perforated structure 1221 can be understood as an opening formed in the horizontal direction of the heat dissipation layer 122 that penetrates the heat dissipation layer 122. Etching multiple perforated structures 1221 in the heat dissipation layer 122 increases the contact area between the heat dissipation layer 122 and the external environment, thus increasing the heat dissipation area of ​​the heat dissipation layer 122 and improving its heat dissipation efficiency. The perforated pattern of the perforated structure 1221 includes at least one of polygons, circles, ellipses, and pentagrams, and can also be other shapes.

[0052] Figure 6 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. Figure 7 yes Figure 6 The schematic diagram of the cross-sectional structure of the heat insulation part in the structure shown is for reference. Figure 6 and Figure 7 Based on the above embodiments, as an embodiment of the present invention, optionally, the heat dissipation layer 122 includes a heat dissipation substrate 1222 in contact with the surface of the device to be bonded 200, and a plurality of heat dissipation fins 1223 fixed between the heat dissipation substrate 1222 and the heat insulation layer 121; the plurality of heat dissipation fins 1223 are arranged in sequence at intervals; the cavity formed between two adjacent heat dissipation fins 1223 is used as a hollow structure 1221.

[0053] Specifically, the heat dissipation substrate 1222, which contacts the surface of the device to be bonded 200, is a single-layer film. The shape of the heat dissipation substrate 1222 is determined according to the surface shape of the device to be bonded 200 near the flexible circuit board. When the device to be bonded 200 is a light-emitting panel, such as an OLED display, the surface of the light-emitting panel near the flexible circuit board with heat insulation function is flat, so the heat dissipation substrate 1222 is a flat substrate. If the surface of the light-emitting panel near the flexible circuit board is curved, then the heat dissipation substrate 1222 is a curved substrate, allowing the heat dissipation substrate 1222 to be tightly fitted to the light-emitting panel. This ensures that the entire power amplifier area of ​​the device to be bonded 200 can contact the heat dissipation substrate 1222, increasing the contact area between the heat dissipation substrate 1222 and the device to be bonded 200, improving the heat dissipation efficiency of the device to be bonded 200, and improving the heat dissipation uniformity of the device to be bonded 200. In addition, both opposite surfaces of each heat sink 1223 are in contact with the external environment, thereby further increasing the heat dissipation area of ​​the heat dissipation layer 122 and improving the heat dissipation efficiency of the heat dissipation layer 122. Furthermore, it can reduce the heat transferred from the heat dissipation layer 122 to the heat insulation layer 121, controlling the heat between the heat insulation layer 121 and the heat dissipation layer 122, allowing the heat to be conducted to the environment, reducing the heat conducted to the flexible circuit board, and improving the stability of the flexible circuit board structure. The heat sink 1223 and the heat dissipation substrate 1222 can be made of the same material, and can be formed by etching a single material layer, which can improve the bonding strength between the heat sink 1223 and the heat dissipation substrate 1222.

[0054] Please continue to refer to this. Figure 6 and Figure 7 Optionally, the plane on which the heat sink 1223 is located is perpendicular to the plane on which the heat sink substrate 1222 is located; all the planes on which the heat sink 1223 is located are parallel to each other.

[0055] Specifically, multiple heat sinks 1223 are arranged in parallel between the heat dissipation substrate 1222 and the heat insulation layer 121. The cavity formed between two adjacent heat sinks 1223 is rectangular, that is, the shape of the hollow structure 1221 is rectangular. The plane on which the heat sinks 1223 are located is perpendicular to the plane on which the heat dissipation substrate 1222 is located. The heat sinks 1223 are all inclined in one direction between the heat dissipation substrate 1222 and the heat insulation layer 121, which can improve the support of the heat dissipation layer 122.

[0056] Figure 8 This is a cross-sectional structural diagram of another heat insulation part provided in an embodiment of the present invention. Figure 9 This is a cross-sectional structural diagram of another heat insulation part provided in an embodiment of the present invention, for reference. Figure 8 and Figure 9 In one embodiment of the present invention, optionally, the plane where the heat sink 1223 is located intersects the plane where the heat sink substrate 1222 is located; the planes where each two adjacent heat sinks 1223 are located intersect each other to form a heat dissipation support frame 123.

[0057] Specifically, the heat dissipation layer can be understood as including a heat dissipation substrate 1222 in contact with the surface of the device to be bonded, and a plurality of heat dissipation support frames 123 fixed between the heat dissipation substrate 1222 and the heat insulation layer 121. Each heat dissipation support frame 123 is formed by the intersection of two adjacent heat dissipation fins 1223 with different inclination directions. The heat dissipation fins include a plurality of first heat dissipation fins a inclined along a first direction and a plurality of second heat dissipation fins b inclined along a second direction. The first direction intersects with the second direction, and the direction perpendicular to the heat dissipation substrate is located between the first direction and the second direction. The first heat dissipation fins a and the second heat dissipation fins b are arranged alternately in sequence, and adjacent first heat dissipation fins a and second heat dissipation fins b are used to form a heat dissipation support frame 123.

[0058] As one embodiment of the present invention, optionally, refer to Figure 8 The sides of the first heat sink a and the second heat sink b away from the heat sink substrate 1222 can contact and be fixed, and the sides of the first heat sink a and the second heat sink b close to the heat sink substrate 1222 are both in contact with and fixed to the heat sink substrate 1222.

[0059] The first heat sink a, the second heat sink b, and the heat dissipation base 1222 plate between the first heat sink a and the second heat sink b can form a hollow triangular prism-shaped support frame 123, that is, the cross-sectional shape of the support frame 123 is triangular. Based on the stability of a triangle, the triangular support frame 123 can improve the support of the support frame 123, and thus further improve the support of the heat dissipation layer 122. The shape of the hollow structure 1221 includes triangles and trapezoids.

[0060] As one embodiment of the present invention, optionally, refer to Figure 9 The first heat sink a and the second heat sink b are arranged in a cross shape. The cross structure formed by the first heat sink a and the second heat sink b can be a single structure, which can reduce the deformation of the intersection of the first heat sink a and the second heat sink b under pressure, and improve the stability of the cross-shaped heat dissipation support frame. The sides of the first heat sink a and the second heat sink b near the heat dissipation substrate are in contact with and fixed to the heat dissipation substrate; the sides of the first heat sink a and the second heat sink b near the heat insulation layer 121 are in contact with and fixed to the heat insulation layer 121. The first heat sink a, the second heat sink b, the heat dissipation substrate 1222, and the heat insulation layer 121 can form a cross-shaped heat dissipation support frame 123, thereby improving the support of the heat dissipation layer 122.

[0061] Based on the above embodiments, as one implementation of the present invention, optionally, the material of the heat dissipation layer 122 includes metal; the material of the heat insulation layer 121 includes at least one of aerogel and ceramic.

[0062] Specifically, the material of the heat dissipation layer 122 can include metallic materials, such as aluminum or copper. Metallic materials have a high heat dissipation coefficient. Using a metallic material for the heat dissipation layer 122 accelerates heat exchange, increasing the rate at which heat radiates to the space containing the device to be bonded 200, thereby reducing the surface and internal temperature of the device to be bonded 200 and ensuring its lifespan. Aerogels and ceramics have low thermal conductivity. Using at least one of aerogels and ceramics as the material for the heat-insulating layer 121 allows heat to be contained between the heat-insulating layer 121 and the heat dissipation layer 122, conducting heat to the environment and preventing heat from being conducted to the flexible circuit board, thus improving the stability of the flexible circuit board structure. The material of the heat dissipation layer 122 can also be other materials with high heat dissipation coefficients; the material of the heat-insulating layer 121 can also be other materials with low thermal conductivity.

[0063] In one embodiment of the present invention, the heat dissipation layer 122 optionally includes a flexible carbon nanotube adhesive sheet. Carbon nanotubes are nanomaterials made of carbon atoms, with a thermal conductivity approximately 10 times that of copper, making them a promising heat dissipation material. However, the fragility of carbon nanotubes makes them difficult to process. This embodiment of the invention utilizes a vertically aligned carbon nanotube lamination technique. During lamination, a carbon nanotube layer is placed between two laminates to form a laminated structure. The two laminates on either side protect the top and bottom of the carbon nanotubes, respectively. Protecting the carbon nanotubes through the laminated layer stabilizes their shape and facilitates cutting and processing. The laminate consists of two layers: a protective sheet and an adhesive layer. The adhesive layer is made of a polymer a few micrometers thick, but even a small amount of resin can generate significant thermal resistance. Therefore, to achieve both adhesion and thermal conductivity, the polymer usage must be addressed. By optimizing three or more relevant parameters, such as the density of carbon nanotubes, the type and thickness of resin, and bonding conditions, sufficient adhesion can be maintained without compromising thermal conductivity while preserving the bonding of carbon nanotubes. Flexible carbon nanotube adhesive sheets possess excellent heat dissipation performance and good flexibility, thereby improving the overall flexibility of the device.

[0064] Figure 10 This is a cross-sectional view of another flexible circuit board with heat insulation function provided in an embodiment of the present invention. (Refer to...) Figure 10 Optionally, the thermal conductivity of the insulation portion 12 gradually decreases along the direction from the device to be bonded 200 to the circuit layer 20.

[0065] Specifically, the heat insulation portion 12 can be understood as an integral film structure. That is, the heat-insulating layer 121 and the heat dissipation layer 122 are an integral film structure. Along the direction from the device to be bonded 200 to the circuit layer 20, the thermal conductivity of the heat insulation portion 12 gradually decreases. The thermal conductivity of the heat insulation portion 12 closer to the device to be bonded 200 is higher, ensuring the heat absorption efficiency of the heat insulation portion 12 on the device to be bonded 200, thereby dissipating heat and cooling the device to be bonded 200. The thermal conductivity of the heat insulation portion 12 closer to the circuit layer 20 is lower, which can block heat conduction to the flexible circuit board, thereby improving the stability of the flexible circuit board structure. In one embodiment of the present invention, optionally, the thermal conductivity is closely related to density; by setting the density of the heat insulation portion 12 to gradually decrease along the direction from the device to be bonded 200 to the circuit layer 20, the thermal conductivity of the heat insulation portion 12 can gradually decrease. In another embodiment of the present invention, optionally, the material used for the heat insulation portion 12 includes aluminum nitride (AlN). Alumina is a covalent compound, an insulator, an atomic crystal, and belongs to the diamond-like oxide family. The thermal conductivity of polymeric materials of this type of diamond emulsion is 70–210 W / mK. Therefore, aluminum nitride has excellent heat transfer capabilities. In this embodiment, both the heat-insulating layer 121 and the heat-dissipating layer 122 are made of aluminum nitride. Furthermore, at least one trace element is doped into the heat-insulating layer 121 and / or the heat-dissipating layer 122 in a predetermined proportion to make the thermal conductivity of the heat-insulating layer 121 lower than that of the heat-dissipating layer 5. By adjusting the doping ratio of the trace element, the thermal conductivity of the heat-insulating portion 12 gradually decreases along the direction from the device to be bonded 200 to the circuit layer 20.

[0066] refer to Figure 1 The present invention also provides a light-emitting module, including a light-emitting panel 210 and a flexible circuit board with heat insulation function as described in any of the above embodiments. The flexible circuit board with heat insulation function is disposed on the non-light-emitting side of the light-emitting panel 210, and the pads 30 on the flexible circuit board are bound to the binding area 201 of the light-emitting panel 210.

[0067] By combining a flexible substrate layer 10 with a heat dissipation structure, the heat dissipation structure comprises two parts: a heat-resistant layer 121 and a heat dissipation layer 122. The heat-resistant layer 121 is disposed on the same layer as the bending portion 11, while the heat dissipation layer 122 is located between the heat-resistant layer 121 and the light-emitting panel 210, and is in contact with the light-emitting panel 210. The heat dissipation layer 122 has a high heat dissipation coefficient, effectively dissipating heat from the light-emitting panel 210 and improving its lifespan. The heat-resistant layer 121 has a low thermal conductivity, preventing heat generated by the light-emitting panel 210 from being transferred to the circuit layer 20. This keeps the heat between the heat-resistant layer 121 and the heat dissipation layer 122, allowing it to be conducted to the environment and preventing heat from being conducted to the flexible circuit board, thus improving the stability of the flexible circuit board structure. It should be noted that the flexible circuit board serves to connect the light-emitting panel 210 and control the driver chip that emits light from the light-emitting panel 210. Components with high heat generation can optionally be installed on the flexible circuit board; the heat-resistant layer prevents the heat generated by these components from affecting the stability of the light-emitting module.

[0068] The light-emitting module may further include a graphene film, which is located on the side of the light-emitting panel 210 away from the flexible circuit board and / or on the side of the light-emitting panel 210 closer to the flexible circuit board. Graphene is a two-dimensional crystal with advantages such as extremely high electrical and thermal conductivity, transparency, and chemical stability. By placing the graphene film on the side of the light-emitting panel 210 away from the flexible circuit board and / or on the side of the light-emitting panel closer to the flexible circuit board, the thermal conductivity of graphene can further help dissipate heat from the light-emitting panel 210.

[0069] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A flexible circuit board with heat insulation function, characterized in that, include: The substrate layer includes a heat-insulating portion and a bending portion, wherein the heat-insulating portion is adjacent to the bending portion; A circuit layer located on the side of the substrate layer and / or inside the substrate layer; A bonding pad is provided, which is electrically connected to the circuit layer; the vertical projection of the bonding pad in the substrate layer is located in the bend. The heat insulation portion includes a heat-insulating layer and a heat-dissipating layer. The heat-dissipating layer is located between the heat-insulating layer and the device to be bonded, and is in contact with the device to be bonded. The heat-dissipating layer is used to dissipate heat from the device to be bonded, and the heat-insulating layer is used to prevent the heat generated by the device to be bonded from being transferred to the circuit layer. The heat-dissipating layer is exposed between the heat-insulating layer and the device to be bonded.

2. The flexible circuit board with heat insulation function according to claim 1, characterized in that, The heat dissipation layer includes multiple hollow structures, which are used to increase the heat dissipation area of ​​the heat dissipation layer. The hollowed-out pattern of the hollowed-out structure includes at least one of polygons, circles, and ellipses.

3. The flexible circuit board with heat insulation function according to claim 2, characterized in that, The heat dissipation layer includes a heat dissipation substrate in contact with the surface of the device to be bonded, and a plurality of heat dissipation fins fixed between the heat dissipation substrate and the heat insulation layer; the plurality of heat dissipation fins are arranged in sequence at intervals; the cavity formed between two adjacent heat dissipation fins is used as the hollow structure.

4. The flexible circuit board with heat insulation function according to claim 3, characterized in that, The plane containing the heat sink is perpendicular to the plane containing the heat sink substrate; all the planes containing the heat sink are parallel to each other.

5. The flexible circuit board with heat insulation function according to claim 3, characterized in that, The plane containing the heat sink intersects with the plane containing the heat dissipation substrate; every two adjacent planes containing the heat sink intersect to form a heat dissipation support frame.

6. The flexible circuit board with heat insulation function according to any one of claims 1 to 5, characterized in that, The heat dissipation layer is made of metal; the heat-insulating layer is made of at least one of aerogel and ceramic.

7. The flexible circuit board with heat insulation function according to claim 1, characterized in that, The heat dissipation layer includes a flexible carbon nanotube adhesive sheet.

8. The flexible circuit board with heat insulation function according to claim 1, characterized in that, The thermal conductivity of the insulation gradually decreases along the direction from the device to be bonded to the circuit layer.

9. A light-emitting module, characterized in that, The invention includes a light-emitting panel and a flexible circuit board with heat insulation function as described in any one of claims 1 to 8. The flexible circuit board with heat insulation function is disposed on the non-light-emitting side of the light-emitting panel, and the bonding pads on the flexible circuit board are bonded to the bonding area of ​​the light-emitting panel.

10. The light-emitting module according to claim 9, characterized in that, It also includes a graphene film located on the side of the light-emitting panel away from the flexible circuit board and / or on the side of the light-emitting panel closer to the flexible circuit board.

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