Stacked body and display device

Abstract

The present application can provide a laminate and a display device including the same, the laminate having a resin layer containing a light scattering agent on a substrate layer, and suppressing generation of a defective portion in the resin layer. The present application provides a laminate and a display device including the same, the laminate including a substrate layer and a resin layer disposed on at least one surface thereof, the resin layer containing a light scattering agent (A), when a contact angle of the substrate layer with respect to diiodomethane is set as θs (°), and a contact angle of the resin layer with respect to diiodomethane is set as θr (°), the following formula is satisfied: |θs - θr| ≤ 21.

Description

Technical Field

[0001] The present invention relates to a laminate having a resin layer and a display device comprising the laminate. Background Technology

[0002] Patent Document 1 describes a process of forming a coating of a curable resin composition containing quantum dots on a substrate, irradiating the coating with radiation, developing the irradiated coating, and exposing the developed coating, thereby forming a wavelength conversion film on the substrate, and using the wavelength conversion film to construct a light-emitting display element, etc.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-065178 Summary of the Invention

[0006] Sometimes, by including a light-scattering agent in a resist composition such as the curable resin composition described in Patent Document 1, light-scattering properties are imparted to the resin layer formed therefrom. However, according to the research of the inventors, it has been found that when the resin layer contains a light-scattering agent, defects are particularly prone to occur in the resin layer. A defect refers to an area where the surface of the substrate layer is exposed where no resin layer exists on the substrate layer, or an area in the resin layer that is relatively extremely thin.

[0007] The object of the present invention is to provide a laminate and a display device comprising the laminate, wherein the laminate has a resin layer containing a light scattering agent on a substrate layer and the generation of defects in the resin layer is suppressed.

[0008] Solution for solving the problem

[0009] The present invention provides the following stack and display device.

[0010] [1] A laminate comprising a substrate layer and a resin layer disposed on at least one surface of the substrate layer,

[0011] The aforementioned resin layer contains a light-scattering agent (A).

[0012] When the contact angle of the substrate layer relative to diiodomethane is set as θs (°) and the contact angle of the resin layer relative to diiodomethane is set as θr (°), the following equation is satisfied:

[0013] |θs-θr|≤21.

[0014] [2] The laminate according to [1] further satisfies the following formula:

[0015] 0.1≤|θs-θr|.

[0016] [3] The laminate according to [1] or [2], wherein the contact angle θs is less than 60°.

[0017] [4] The laminate according to any one of [1] to [3], wherein the resin layer further comprises quantum dots (B).

[0018] [5] The laminate according to any one of [1] to [4], wherein the resin layer is a cured layer of a resin composition comprising resin (C), photopolymerizable compound (D) and photopolymerization initiator (E).

[0019] [6] The laminate according to any one of [1] to [5], wherein the light scattering agent (A) comprises TiO2 particles.

[0020] [7] A display device comprising any one of [1] to [6] a laminate.

[0021] The present invention can provide a laminate and a display device comprising the laminate, wherein the laminate has a resin layer containing a light scattering agent on a substrate layer, and defects in the resin layer are suppressed. Attached Figure Description

[0022] Figure 1 This is a cross-sectional schematic diagram illustrating an example of the layer structure of the laminate of the present invention. Detailed Implementation

[0023] <Layered Body>

[0024] [1] The composition of the laminate and the contact angle difference Δθ

[0025] The laminate of the present invention (hereinafter also simply referred to as "laminate") comprises a substrate layer and a resin layer, wherein the resin layer is disposed on at least one surface of the substrate layer and comprises a light scattering agent (A). Typically, there is no layer between the substrate layer and the resin layer in the laminate; the resin layer is usually directly laminated on the substrate layer.

[0026] Figure 1 This is a cross-sectional schematic diagram illustrating an example of the layered structure of a laminated body. Figure 1 The laminate 1 shown includes a substrate layer 10 and a resin layer 20 disposed on one surface thereon. The resin layer 20 is directly laminated onto the substrate layer 10. The resin layer 20 contains a light scattering agent (A). The light scattering agent (A) is typically dispersed in the resin layer 20. It should be noted that the resin layer 20 may also be disposed on both sides of the substrate layer 10.

[0027] The resin layer 20 may further contain quantum dots (B). In this case, the resin layer 20 can emit light of a different wavelength than the irradiated light by irradiating it with ultraviolet or visible light. Therefore, the resin layer 20 containing quantum dots (B) can be used as a wavelength conversion film. By selecting the composition and particle size of the quantum dots (B), the wavelength of the emitted light can be selected.

[0028] In the case where the resin layer 20 contains quantum dots (B), the quantum dots (B) are typically dispersed in the resin layer 20.

[0029] The resin layer 20 may also not contain quantum dots (B). In this case, the resin layer 20 has the function of scattering light of the same wavelength as the irradiated light without wavelength conversion. In addition, in this case, defects are less likely to occur in the resin layer 20 in the laminate of the present invention, and therefore, the intensity of the scattered light at the light emission surface is less likely to deviate.

[0030] like Figure 1 As shown, the resin layer 20 can be formed on the entire surface of the substrate layer 10, or on a portion of the surface of the substrate layer. Forming on a portion of the surface of the substrate layer means, for example, that the resin layer 20 is formed in a patterned manner.

[0031] The situation described here, where a resin layer is formed on a portion of the surface of the substrate layer, does not refer to a defect that is not intended, but rather to a situation where a resin layer is intentionally (in design) formed on a portion of the surface of the substrate layer.

[0032] When the contact angle of the substrate layer relative to diiodomethane is set as θs (°) and the contact angle of the resin layer relative to diiodomethane is set as θr (°), the laminate of the present invention satisfies the following formula:

[0033] |θs-θr|≤21.

[0034] By satisfying the above formula, the resin layer is less likely to repel the substrate layer surface, and the adhesion of the resin layer to the substrate layer is improved. Therefore, a laminate with fewer defects in the resin layer can be obtained.

[0035] Hereafter, the left side of the above equation, |θs-θr|, will also be expressed as "Δθ" (contact angle difference).

[0036] From the viewpoint of suppressing defects, Δθ is preferably 20° or less, more preferably 19.3° or less (e.g., 15° or less, 10° or less, or 5° or less).

[0037] On the other hand, Δθ is usually 0.1° or more, and from the viewpoint of the developability of the resin layer, Δθ is preferably 0.2° or more, more preferably 0.3° or more, and even more preferably 0.4° or more.

[0038] θs is typically 15° to 75°, and from the viewpoint of suppressing defects, it is preferably 20° to 70°, more preferably 25° to 60°, even more preferably 30° to 60°, even more preferably 30° to 50°, and particularly preferably 30° to 45°.

[0039] θr is typically 20° to 70° or less, and from the viewpoint of suppressing defects, it is preferably 30° to 60°, more preferably 40° to 58°, and may also be 50° or less.

[0040] In this specification, the contact angle θs of the substrate layer relative to diiodomethane refers to the contact angle of the surface of the substrate layer used to deposit the resin layer relative to diiodomethane. When a resin layer is deposited in the substrate layer, the resin layer can be peeled off without altering its surface properties by ashing treatment using plasma or other methods, or by treatment with a chemical solution. The peeled surface is then measured, and this is defined as the contact angle θs. Furthermore, the contact angle θr of the resin layer relative to diiodomethane is defined as the contact angle of the outer surface of the resin layer deposited on the substrate layer (the surface opposite to the substrate layer side).

[0041] The contact angles of the resin layer's surface and its opposite surface with respect to diiodomethane in the substrate layer are generally the same, either without the pretreatment described later or with the same pretreatment. The contact angles of the outer surface of the resin layer (the surface opposite to the substrate layer side) and its opposite surface with respect to diiodomethane are also generally the same.

[0042] The contact angles θs and θr are values ​​at 25°C. The contact angles θs and θr were measured according to the measurement method described in the Example 1 section below.

[0043] From the viewpoint of suppressing defects, when the surface tension of the substrate layer is set to σs (mN / m) and the surface tension of the resin layer is set to σr (mN / m), the laminate of the present invention preferably satisfies the following formula:

[0044] |σs-σr|≤11.0.

[0045] Hereafter, the left side of the above equation, |σs-σr|, will also be expressed as "Δσ" (surface tension difference).

[0046] From the viewpoint of suppressing defects, Δσ is more preferably 10.8 mN / m or less (e.g., 10.5 mN / m or less, 10.0 mN / m or less, 9.5 mN / m or less, or 9.0 mN / m or less).

[0047] On the other hand, Δσ is usually 0.1 mN / m or more, and from the viewpoint of the developability of the resin layer, Δσ is preferably 0.2 mN / m or more, more preferably 0.5 mN / m or more, and even more preferably 1.0 mN / m or more.

[0048] σs is typically 10mN / m to 60mN / m, and from the viewpoint of suppressing defects, it is preferably 15mN / m to 55mN / m, more preferably 20mN / m to 50mN / m, and even more preferably 30mN / m to 50mN / m.

[0049] σr is typically 15mN / m to 50mN / m, and from the viewpoint of suppressing defects, it is preferably 20mN / m to 45mN / m, more preferably 25mN / m to 40mN / m, and even more preferably 30mN / m to 40mN / m.

[0050] In this specification, the surface tension σs of the substrate layer refers to the surface tension of the surface in the substrate layer used to deposit the resin layer. When a resin layer is deposited in the substrate layer, the resin layer can be peeled off without altering its surface properties by means of ashing treatment using plasma or other methods, or by treatment with a chemical solution. The peeled surface is then measured, and this is defined as the surface tension σs. Furthermore, the surface tension σr of the resin layer is defined as the surface tension of the outer surface of the resin layer deposited on the substrate layer (the surface opposite to the substrate layer side).

[0051] The surface tension of the resin layer in the substrate layer and its opposite surface is generally the same, either without the pretreatment described later or with the same pretreatment. The surface tension of the outer surface of the resin layer (the surface opposite to the substrate layer side) and its opposite surface is also generally the same.

[0052] Surface tension σs and surface tension σr are values ​​at 25°C. Surface tension σs and surface tension σr can be determined according to the following steps.

[0053] (1) At 25°C, drop 1.0 μL of water onto the surface of the substrate layer (when measuring surface tension σs) or the resin layer (when measuring surface tension σr), and use a contact angle measuring device to measure the contact angle θ1 of the coating with water by the θ / 2 method.

[0054] (2) At 25°C, drop 1.0 μL of diiodomethane onto the surface of the substrate layer (when measuring surface tension σs) or resin layer (when measuring surface tension σr). Using a contact angle measuring device, measure the contact angle θ2 of the coating relative to diiodomethane using the θ / 2 method.

[0055] (3) Substitute the θ1 obtained in (1) above into the following equation:

[0056] (1+cosθ)γ L =2[(γ S d γ L d ) 1 / 2 +(γ S p γ L p ) 1 / 2 ]

[0057] The contact angle θ (the solid's contact angle relative to the liquid) in Young's equation is represented by substituting the known values ​​of 21.8 (mN / m) and 51.0 (mN / m) for water into γ. L d (Dispersive force component of surface tension in liquids), γ L p (The polar force component of the surface tension of the liquid), yielding Equation 1. γ in Young's equations. L It is γ L d +γ L p .

[0058] (4) Similarly, substituting θ2 obtained in (2) above into θ in Young's equation, and substituting the known values ​​of 49.5 (mN / m) and 1.3 (mN / m) for diiodomethane into γ, respectively. L d γ L p Equation 2 is obtained.

[0059] (5) Solve the system of equations 1 and 2 to find γ. S d and γ S p As their sum, calculate the surface tension σs (mN / m) or surface tension σr at 25℃.

[0060] Defects in the resin layer can be evaluated, for example, by the following method. A laminate is placed on a black plate with the substrate layer side in contact with the black plate. Fluorescent light is shone onto the laminate from above, and an image of the laminate viewed from the resin layer side is obtained. At this time, the defective areas of the resin layer appear black because there is no resin layer on the substrate layer or the resin layer is relatively extremely thin. On the other hand, good areas without defects are distinctly different from black, exhibiting colors such as white, green, and red depending on the type of light-scattering agent and quantum dots present in the resin layer. By using image processing software to calculate the area ratio of areas exhibiting colors other than black (where the sum of areas exhibiting black and areas exhibiting colors other than black (white, green, red, etc.) is set to 100%, the defects can be evaluated. It can be said that the higher the area ratio, the fewer the defects.

[0061] The aforementioned "resin layer is relatively extremely thin" means that the film thickness of the resin layer becomes extremely thin compared to the average film thickness of the entire resin layer, for example, less than 10% of the average film thickness.

[0062] The area ratio of the laminate of the present invention is preferably 50% or more, more preferably 60% or more, further preferably 70% or more, even more preferably 80% or more, particularly preferably 90% or more, most preferably 95% or more, and may also be 100%.

[0063] [2] Resin composition

[0064] The resin layer of the laminate can be formed from a resin composition. For example, the resin layer can be formed by a method comprising the steps of applying a resin composition onto a substrate layer and, as needed, a drying step.

[0065] The resin composition contains a light scattering agent (A) and a resin (C). Preferably, the resin composition is a curable resin composition that, in addition to containing the light scattering agent (A) and the resin (C), further contains a photopolymerizable compound (D) and a photopolymerization initiator (E).

[0066] The resin layer is preferably a cured layer formed from a curable resin composition. The resin layer as a cured layer can be formed by a method comprising the steps of applying a curable resin composition onto a substrate layer, performing a drying step as needed, and curing it by the action of light and, as needed, further heat.

[0067] The cured layer can be formed on the entire surface of the substrate layer, or it can be formed as a cured pattern on a portion of the substrate layer. In this specification, a cured pattern is one form of cured layer, referring to a cured layer formed in a patterned manner.

[0068] [2-1] Light scattering agent (A)

[0069] The resin composition contains one or more light scattering agents (A). A resin layer formed from this resin composition, in which the light scattering agent (A) is dispersed, exhibits light scattering properties. By containing the light scattering agent (A) in the resin layer, the transmittance and viewing angle characteristics of the resin layer (such as a wavelength conversion film) can be controlled, or the intensity of emitted light can be increased when the resin layer is used as a bank or when the resin layer contains quantum dots (B).

[0070] It should be noted that the term "emitted light intensity" as used in this specification refers to the intensity of light emitted from the resin layer, which can be measured as brightness. For example, "emitted light intensity" may include the following two light intensities: the intensity of incident light incident from a light source into the resin layer that is emitted from the side where the incident light is incident to the opposite side of the main surface of the resin layer opposite to the light source (e.g., incident light incident from a backlight unit into the resin layer is emitted towards the display side); and the intensity of the extracted light when the fluorescence (internal emission) emitted by the quantum dots (B) inside the resin layer by the excitation light incident from the light source into the resin layer is extracted from the resin layer to one side of the opposite main surface of the resin layer (e.g., the display side in the case where the display is arranged above the resin layer in the backlight unit).

[0071] As a light scattering agent (A), inorganic particles such as metal or metal oxide particles and glass particles can be cited. From the viewpoint that it is preferable to have no absorption caused by coloring and only a scattering effect, metal oxide particles are preferred. As metal oxides, TiO2, SiO2, BaTiO3, ZnO, etc. can be cited. From the viewpoint of efficiently scattering light, TiO2 particles are preferred. Generally, the above-mentioned inorganic particles are difficult to disperse directly in a solvent, so dispersants described later are usually used. However, due to their high specific gravity, they are prone to sedimentation in the resin composition, and there is a possibility of uneven dispersion in the resin layer, so defects are easily generated in the resin layer on the substrate layer. In addition, the contact angle of the resin layer with respect to the solvent can also be changed by the dispersion state of the light scattering agent (A) in the resin layer.

[0072] The particle size of the light scattering agent (A) is, for example, about 0.03 μm to 20 μm. From the viewpoint of improving light scattering energy and dispersibility in the resin composition, it is preferably 0.05 μm to 1 μm, and more preferably 0.05 μm to 0.5 μm.

[0073] As a light scattering agent (A), a light scattering agent obtained by pre-dispersing the light scattering agent in part or all of the solvent (F) described later using a dispersant can also be used. As a dispersant, a commercially available product can be used.

[0074] Examples of commercially available products include:

[0075] BYK Chemie Japan CO.,LTD. manufactures DISPERBYK-101, 102, 103, 106, 107, 108, 109, 110, 111, 116, 118, 130, 140, 154, 161, 162, 163, 164, 165, 166, 170, 171, 174, 180, 181, 182, 183, 184, 185, 190, 192, 2000. 2001, 2020, 2025, 2050, 2070, 2095, 2150, 2155; ANTI-TERRA-U, U100, 203, 204, 250,; BYK -P104, P104S, P105, 220S, 6919; BYK-LPN6919, 21116; LACTIMON, LACTIMON-WS; Bykumen, etc.;

[0076] The following models are manufactured by Lubrizol Corporation of Japan: SOLSPERSE-3000, 9000, 13000, 13240, 13650, 13940, 16000, 17000, 18000, 20000, 21000, 24000, 26000, 27000, 28000, 31845, 32000, 32500, 32550, 33500, 32600, 34750, 35100, 36600, 38500, 41000, 41090, 53095, 55000, 76500, etc.

[0077] BASF Corporation manufactures EFKA-46, 47, 48, 452, 4008, 4009, 4010, 4015, 4020, 4047, 4050, 4055, 4060, 4080, 4400, 4401, 4402, 4403, 4406, 4408, 4300, 4310, 4320, 4330, 4340, 450, 451, 453, 4540, 4550, 4560, 4800, 5010, 5065, 5066, 5070, 7500, 7554, 1101, 120, 150, 1501, 1502, 1503, etc.

[0078] Ajisper PA111, PB711, PB821, PB822, PB824, etc., manufactured by Ajinomoto Fine-Techno.

[0079] The content of light scattering agent (A) in the resin composition is, for example, 0.001% to 50% by mass relative to the total amount of solid components in the resin composition. From the viewpoints of the developability of the layer formed by the resin composition and the intensity (brightness) of the emitted light when the resin layer is a wavelength conversion film, as well as the viewpoints of improving the dispersibility of light scattering agent (A), it is preferably 1% to 30% by mass, more preferably 2% to 10% by mass.

[0080] In this specification, the total amount of solid components refers to the sum of the components remaining after removing the solvent (F) described later from the components contained in the resin composition. The content of each component in the solid components of the resin composition can be determined using known analytical methods such as liquid chromatography or gas chromatography. The content of each component in the solid components of the resin composition can be calculated based on the formulation used in the preparation of the resin composition.

[0081] The content of light scattering agent (A) in the resin layer is, for example, 0.001% to 50% by mass relative to the total amount of the resin layer. From the viewpoints of the developability of the resin layer and the intensity of emitted light when the resin layer is a wavelength conversion film, as well as the viewpoints of improving the dispersibility of light scattering agent (A), it is preferably 1% to 30% by mass, and more preferably 2% to 10% by mass.

[0082] According to the present invention, even if the resin layer contains a light scattering agent (A), the defects in the resin layer on the substrate layer can be reduced, and a laminate with good emitted light characteristics can be obtained.

[0083] [2-2] Quantum Dots (B)

[0084] The resin composition may contain one or more quantum dots (B). A resin layer formed from a resin composition containing quantum dots (B) can emit light of a different wavelength than the irradiated light by irradiation with ultraviolet or visible light. Therefore, a resin layer containing quantum dots (B) can be used as a wavelength conversion film.

[0085] Quantum dots (B) are semiconductor particles with a particle size of 1 nm to 100 nm. They are particles that emit light by absorbing ultraviolet or visible light through the band gap of semiconductors.

[0086] Examples of quantum dots (B) include: CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, CdHgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgST e. CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSe Compounds of Group 12 and Group 16 elements such as S, HgZnSeTe, and HgZnSTe; compounds of Group 13 and Group 15 elements such as GaN, GaP, GaAs, AlN, AlP, AlAs, InN, InP, InAs, GaNP, GaNAs, GaPAs, AlNP, AlNAs, AlPAs, InNP, InNAs, InPAs, GaAlNP, GaAlNAs, GaAlPAs, GaInNP, GaInNAs, GaInPAs, InAlNP, InAlNAs, and InAlPAs; and compounds of Group 14 and Group 16 elements such as PdS and PbSe.

[0087] When the quantum dots (B) contain S or Se, quantum dots that have been surface-modified with metal oxides or organic compounds can be used. By using surface-modified quantum dots, the attraction of S or Se due to reactive components contained in or potentially contained in the resin composition can be prevented.

[0088] Quantum dots (B) can be combined with the above-mentioned compounds to form core-shell structures. Examples of such combinations include particles with a CdSe core and a ZnS shell.

[0089] The energy state of quantum dots (B) depends on their size, thus allowing for free selection of the emission wavelength by changing the particle size. For example, in the case of quantum dots composed solely of CdSe, the peak wavelengths of the fluorescence spectra for particle sizes of 2.3 nm, 3.0 nm, 3.8 nm, and 4.6 nm are 528 nm, 570 nm, 592 nm, and 637 nm, respectively.

[0090] Furthermore, the light emitted from quantum dots (B) has a narrow spectral width. By combining such light with steep peaks, the displayable color gamut can be expanded in display devices containing a resin layer formed from a resin composition. Moreover, quantum dots (B) have high responsivity, allowing for efficient utilization of light emitted from a light source.

[0091] The resin composition may contain only one type of quantum dot that emits light of a specific wavelength by means of light emitted from a light source, or it may contain a combination of two or more types of quantum dots that emit light of different wavelengths. Examples of the aforementioned specific wavelength of light include red light, green light, and blue light.

[0092] When the resin composition contains quantum dots (B), the content of quantum dots (B) in the resin composition is, for example, 1% to 60% by mass, preferably 10% to 50% by mass, and more preferably 10% to 40% by mass, relative to the total amount of solid components in the resin composition.

[0093] When the resin layer contains quantum dots (B), the content of quantum dots (B) in the resin layer is, for example, 1% to 60% by mass, preferably 10% to 50% by mass, and more preferably 10% to 40% by mass, relative to the total amount of the resin layer.

[0094] [2-3] Organic ligands

[0095] When the resin composition contains quantum dots (B), the semiconductor particles that are quantum dots (B) can also exist in the resin composition in a state where they are coordinated with organic ligands. Hereinafter, semiconductor particles coordinated with organic ligands will also be referred to as ligand-containing semiconductor particles. The ligands coordinated to the semiconductor particles can be, for example, organic compounds having polar groups that exhibit the ability to coordinate with semiconductor particles. The organic ligands can be added due to limitations in the synthesis of ligand-containing semiconductor particles or for stabilization. For example, in Japanese Patent Publication No. 2015-529698, from the viewpoint of controlling particle size, ligand-containing semiconductor particles contain hexanoic acid as an organic ligand, and for the purpose of stabilization after synthesis, the organic ligand is replaced with DDSA (dodecenylsuccinic acid).

[0096] Organic ligands can be located on the surface of semiconductor particles, for example. The resin composition may contain one or more organic ligands.

[0097] The polar group is preferably at least one group selected from the group consisting of thiol (-SH), carboxyl (-COOH), and amino (-NH2). Polar groups selected from this group are advantageous in improving the coordination with semiconductor particles. High coordination helps to improve color uniformity of the resin layer (wavelength conversion film, etc.) and / or improve the patternability of the resin composition. From the viewpoint of obtaining a resin layer (wavelength conversion film, etc.) with superior emitted light characteristics, the polar group is more preferably at least one group selected from thiol and carboxyl groups. The organic ligand may have one or more polar groups.

[0098] Organic ligands can be, for example, the following formula (X):

[0099] X A -R X (X)

[0100] The organic compound represented. In the formula, X... A R is the polar group mentioned above. X It is a monovalent hydrocarbon group that may contain heteroatoms (N, O, S, halogen atoms, etc.). This hydrocarbon group may have one or more unsaturated bonds, such as carbon-carbon double bonds. The hydrocarbon group may have a straight-chain, branched-chain, or cyclic structure. The number of carbon atoms in this hydrocarbon group is, for example, 1 to 40 or less, or 1 to 30 or less. The methylene group contained in this hydrocarbon group may be substituted with -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc.

[0101] Group R X It may also contain polar groups. For a specific example of such a polar group, refer to polar group X. A The above description.

[0102] As X has a carboxyl group as a polar group A Specific examples of organic ligands include formic acid, acetic acid, propionic acid, and other saturated or unsaturated fatty acids. Specific examples of saturated or unsaturated fatty acids include: saturated fatty acids such as butyric acid, valeric acid, hexanoic acid, caprylic acid, capric acid, lauric acid, myristic acid, pentadecanoic acid, palmitic acid, heptadecanoic acid, stearic acid, arachidic acid, docosahexaenoic acid, and teicosenoic acid; monounsaturated fatty acids such as myristoleic acid, palmitoleic acid, oleic acid, eicosapentaenoic acid, sinapic acid, and teicosenoic acid; and polyunsaturated fatty acids such as linoleic acid, α-linolenic acid, γ-linolenic acid, octadecanoic acid, dihomo-γ-linolenic acid, arachidonic acid, eicosapentaenoic acid, docosahexaenoic acid, and adrenaline (docosahexaenoic acid).

[0103] X has a thiol group or an amino group as a polar group A Specific examples of organic ligands include those with a carboxyl group as a polar group, as illustrated above. A Organic ligands are formed by replacing the carboxyl group of an organic ligand with a thiol group or an amino group.

[0104] As preferred examples of the organic ligands represented by the above formula (X), compounds (J-1) and (J-2) can be cited.

[0105] [Compound (J-1)]

[0106] Compound (J-1) is a compound possessing a first functional group and a second functional group. The first functional group is a carboxyl group (-COOH), and the second functional group is either a carboxyl group or a thiol group (-SH). Compound (J-1) possesses a carboxyl group and / or a thiol group,

[0107] Therefore, it can become a ligand for quantum dot (B).

[0108] The resin composition may contain only one compound (J-1) or more than two compounds.

[0109] By including compound (J-1) in the resin composition, the development speed of the resin composition can be significantly accelerated, and the emitted light intensity of the resin layer (wavelength conversion film, etc.) formed from the resin composition can be improved. This is believed to be because both the carboxyl and thiol groups in compound (J-1) impart high developability to the resin composition based on alkaline developer, and can be well-coordinated with quantum dots (B) to improve the dispersibility of quantum dots (B) in the resin composition. In particular, the carboxyl groups have a greater effect on improving developability based on alkaline developer, while the thiol groups have a greater effect on improving the dispersibility of quantum dots (B).

[0110] Accelerating the development speed of the resin composition also helps to increase the emitted light intensity of the resin layer (wavelength conversion film, etc.). This is believed to be because it can suppress the penetration of water into the resin layer during the development process.

[0111] An example of compound (J-1) is the compound represented by the following formula (J-1a). Compound (J-1) may also be the acid anhydride of the compound represented by formula (J-1a).

[0112] [Chemical Formula 1]

[0113]

[0114] [In the formula, R] B This indicates a divalent hydrocarbon group. In the presence of multiple R groups... B In the case of multiple substituents, these may be the same or different. The above-mentioned hydrocarbon group may have more than one substituent. In the case of multiple substituents, these may be the same or different, and they may bond to each other and form a ring together with the atoms they are bonded to. The -CH2- contained in the above-mentioned hydrocarbon group may be replaced by at least one of -O-, -S-, -SO2-, -CO- and -NH-.

[0115] p represents an integer from 1 to 10.

[0116] As R B The divalent hydrocarbon group represented can be, for example, a chain hydrocarbon group, alicyclic hydrocarbon group, aromatic hydrocarbon group, etc.

[0117] As a chain hydrocarbon group, examples include straight-chain or branched alkyldiyl groups, which typically have 1 to 50 carbon atoms, preferably 1 to 20, and more preferably 1 to 10.

[0118] As an alicyclic hydrocarbon group, examples include monocyclic or polycyclic cycloalkanediols, which typically have 3 to 50 carbon atoms, preferably 3 to 20, and more preferably 3 to 10.

[0119] As aromatic hydrocarbon groups, examples include monocyclic or polycyclic aromatic dimethyl groups, which typically have 6 to 20 carbon atoms.

[0120] Examples of substituents that may be present in the aforementioned hydrocarbon group include: alkyl groups with 1 to 50 carbon atoms, cycloalkyl groups with 3 to 50 carbon atoms, aryl groups with 6 to 20 carbon atoms, carboxyl groups, amino groups, halogen atoms, etc.

[0121] The substituents that the above-mentioned hydrocarbon group may have are preferably carboxyl, amino, or halogen atoms.

[0122] When the -CH2- contained in the above-mentioned hydrocarbon group is replaced by at least one of -O-, -CO- and -NH-, the replacement of -CH2- is preferably at least one of -CO- and -NH-, more preferably -NH-.

[0123] p is preferably 1 or 2.

[0124] Examples of compounds represented by formula (J-1a) include those represented by formulas (1-1) to (1-9).

[0125] [Chemical Formula 2]

[0126]

[0127] If we show specific examples of compounds represented by formula (J-1a) by their chemical names, examples include: mercaptoacetic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, 4-mercaptobutyric acid, mercaptosuccinic acid, mercaptostearic acid, mercaptooctanoic acid, 4-mercaptobenzoic acid, 2,3,5,6-tetrafluoro-4-mercaptobenzoic acid, L-cysteine, N-acetyl-L-cysteine, 3-methoxybutyl 3-mercaptopropionic acid, 3-mercapto-2-methylpropionic acid, etc.

[0128] The preferred ingredients are 3-mercaptopropionic acid and mercaptosuccinic acid.

[0129] Another example of compound (J-1) is a polycarboxylic acid compound, preferably a compound represented by the above formula (J-1a) in which -SH in formula (J-1a) is replaced by a carboxyl group (-COOH) (J-1b).

[0130] Examples of compounds (J-1b) include the following compounds.

[0131] Succinic acid, glutaric acid, adipic acid, octafluoroadipic acid, azelaic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, heptadecanedioic acid, octadecanoic acid, nonadecanedioic acid, dodecanoic acid, 3-ethyl-3-methylglutaric acid, hexafluoroglutaric acid, trans-3-hexenic acid, sebacic acid, hexafluorosecanedioic acid, acetylenic acid, trans-aconitic acid, 1,3-adamantanedicarboxylic acid, bicyclo[2.2.2]octane-1,4-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, 1,1-cyclopropanedicarboxylic acid, 1,1-cyclobutanedicarboxylic acid, cis- or trans-1,3-cyclohexanedicarboxylic acid, cis- or trans-1,4-cyclohexanedicarboxylic acid, 1,1

[0132] -Cyclopentanediacetic acid, 1,2,3,4-cyclopentanetetracarboxylic acid, decahydro-1,4-naphthalenedicarboxylic acid, 2,3-norbornanedicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid, phthalic acid, 3-fluorophthalic acid, isophthalic acid, tetrafluoroisophthalic acid, terephthalic acid, tetrafluoroterephthalic acid, 2,5-dimethylterephthalic acid, 2,6-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,1′-ferrocenedicarboxylic acid, 2 2′-Biphenyl dicarboxylic acid, 4,4′-Biphenyl dicarboxylic acid, 2,5-Furan dicarboxylic acid, Benzophenone-2,4′-dicarboxylic acid monohydrate, Benzophenone-4,4′-dicarboxylic acid, 2,3-Pyrazine dicarboxylic acid, 2,3-Pyridine dicarboxylic acid, 2,4-Pyridine dicarboxylic acid, 3,5-Pyridine dicarboxylic acid, 2,5-Pyridine dicarboxylic acid, 2,6-Pyridine dicarboxylic acid, 3,4-Pyridine dicarboxylic acid, Pyrazole-3,5-dicarboxylic acid monohydrate, 4,4′-Stilbene dicarboxylic acid Carboxylic acids, anthraquinone-2,3-dicarboxylic acid, 4-(carboxymethyl)benzoic acid, chelidonic acid monohydrate, azobenzene-4,4′-dicarboxylic acid, azobenzene-3,3′-dicarboxylic acid, chlorobridged acid, 1H-imidazolium-4,5-dicarboxylic acid, 2,2-bis(4-carboxyphenyl)hexafluoropropane, 1,10-bis(4-carboxyphenoxy)decane, dipropylmalonic acid, dithiodiethanolic acid, 3,3′-dithiodipropionic acid, 4,4′-dithiodibutyric acid, 4,4′ Dicarboxylated diphenyl ether, 4,4′-dicarboxylated diphenyl sulfone, ethylene glycol bis(4-carboxyphenyl) ether, 3,4-ethylenedioxythiophene-2,5-dicarboxylic acid, 4,4′-isopropylidene diphenoxyacetic acid, 1,3-propanone dicarboxylic acid, methylene disalicylic acid, 5,5′-thiodisalicylic acid, tris(2-carboxyethyl) isocyanurate, tetrafluorosuccinic acid, α,α,α′,α′-tetramethyl-1,3-phenylenediamine, 1,3,5-benzenetricarboxylic acid, etc.

[0133] From the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), the molecular weight of compound (J-1) is preferably 3000 or less, more preferably 2000 or less, even more preferably 1000 or less, even more preferably 800 or less, and particularly preferably 500 or less. The molecular weight of compound (J-1) is generally 100 or more.

[0134] The molecular weight mentioned above can be either number-average or weight-average. In this case, the number-average and weight-average molecular weights are the converted numbers of standard polystyrene determined by gel permeation chromatography (GPC), respectively.

[0135] In the resin composition, compound (J-1) preferably has at least a portion of its molecules coordinated to quantum dots (B), or all or almost all of its molecules coordinated to quantum dots (B). That is, the resin composition preferably contains compound (J-1) coordinated to quantum dots (B), and may also contain both compound (J-1) coordinated to quantum dots (B) and compound (J-1) not coordinated to quantum dots (B).

[0136] From the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), it is advantageous to include a compound (J-1) located on the quantum dot (B). The compound (J-1) can typically be located on the quantum dot (B) via a first functional group and / or a second functional group. For example, the compound (J-1) can be located on the surface of the quantum dot (B).

[0137] When the resin composition contains quantum dots (B) and compound (J-1), the content ratio of compound (J-1) to quantum dots (B) in the resin composition is preferably 0.001 to 1 by mass, more preferably 0.01 to 0.5, and even more preferably 0.02 to 0.1. If this content ratio is within this range, it is advantageous from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.).

[0138] When the resin composition contains compound (J-1), the content of compound (J-1) in the resin composition, from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), is preferably 0.1% to 20% by mass, more preferably 0.1% to 10% by mass, further preferably 0.2% to 8% by mass, even more preferably 0.2% to 5% by mass, and particularly preferably 0.5% to 4% by mass, relative to the total amount of solid components in the resin composition.

[0139] [Compound (J-2)]

[0140] Compound (J-2) is different from compound (J-1). It is a compound containing a polyalkylene glycol structure and having a polar group at the molecule's end. The molecule's end is preferably the end of the longest carbon chain in compound (J-2) (the carbon atom in the carbon chain can be replaced by other atoms such as oxygen atoms).

[0141] The resin composition may contain only one compound (J-2) or more than two compounds.

[0142] It should be noted that compounds containing a polyalkylene glycol structure and having the aforementioned first and second functional groups belong to compound (J-1).

[0143] From the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), the resin composition may contain compound (J-1) or compound (J-2), or may contain both compound (J-1) and compound (J-2).

[0144] The structure of polyalkylene glycols refers to the following formula:

[0145] [Chemical Formula 3]

[0146]

[0147] The structure represented (n is an integer greater than 2). In the formula, R... C It is an alkylene group, such as ethylene and propylene.

[0148] As a specific example of compound (J-2), polyalkylene glycol compounds represented by the following formula (J-2a) can be cited.

[0149] [Chemical Formula 4]

[0150]

[0151] In formula (J-2a), X is a polar group, Y is a monovalent group, and Z is a polar group. C It can be a divalent or trivalent group. n is an integer greater than or equal to 2. m is 1 or 2. R C It is an alkylene group.

[0152] In the resin composition, compound (J-2) preferably has at least a portion of its molecules coordinated to quantum dots (B), or all or almost all of its molecules coordinated to quantum dots (B). That is, the resin composition preferably contains compound (J-2) coordinated to quantum dots (B), and may also contain both compound (J-2) coordinated to quantum dots (B) and compound (J-2) not coordinated to quantum dots (B).

[0153] From the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), it is advantageous to include a compound (J-2) located on the quantum dots (B). Compound (J-2a) can typically be located on the quantum dots (B) via a polar group X. When group Y contains a polar group, compound (J-2a) can also be located on the quantum dots (B) via a polar group of group Y, or via both polar groups X and Y. Compound (J-2) can, for example, be located on the surface of the quantum dots (B).

[0154] The polar group X is preferably at least one group selected from the group consisting of thiol (-SH), carboxyl (-COOH), and amino (-NH2). Polar groups selected from this group are advantageous in improving the coordination of the quantum dot (B). From the viewpoint of improving the emitted light intensity of the resin layer (wavelength conversion film, etc.), the polar group X is more preferably at least one group selected from thiol and carboxyl.

[0155] Group Y is a monovalent group. Group Y is not particularly limited and can be any monovalent hydrocarbon group that can have substituents (N, O, S, halogen atoms, etc.). The -CH2- in this hydrocarbon group can be replaced by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc.

[0156] The number of carbon atoms in the aforementioned hydrocarbon group is, for example, 1 to 12. This hydrocarbon group may also have unsaturated bonds.

[0157] Examples of group Y include: alkyl groups having a straight-chain, branched, or cyclic structure with 1 to 12 carbon atoms; and alkoxy groups having a straight-chain, branched, or cyclic structure with 1 to 12 carbon atoms. The alkyl and alkoxy groups preferably have 1 to 8 carbon atoms, more preferably 1 to 6, and even more preferably 1 to 4. The -CH2- group contained in the alkyl and alkoxy groups can be replaced by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. Among these, group Y is preferably a straight-chain or branched alkoxy group with 1 to 4 carbon atoms, more preferably a straight-chain alkoxy group with 1 to 4 carbon atoms.

[0158] Group Y may contain a polar group. Examples of such a polar group include at least one group selected from thiol (-SH), carboxyl (-COOH), and amino (-NH2). Among these, as described above, compounds containing a polyalkylene glycol structure and having the aforementioned first and second functional groups belong to compound (J-1). The polar group is preferably disposed at the end of group Y.

[0159] Group Z CIt is a divalent or trivalent group. Group Z C Without specific limitations, examples include divalent or trivalent hydrocarbon groups that may contain heteroatoms (N, O, S, halogen atoms, etc.). The number of carbon atoms in this hydrocarbon group is, for example, 1 to 24. This hydrocarbon group may also have unsaturated bonds.

[0160] Group Z, as a divalent group C Examples include: alkylene groups having a linear, branched, or cyclic structure with 1 to 24 carbon atoms; and alkenyl groups having a linear, branched, or cyclic structure with 1 to 24 carbon atoms. The number of carbon atoms in the alkylene and alkenyl groups is preferably 1 to 12, more preferably 1 to 8, and even more preferably 1 to 4. The -CH2- group contained in the alkylene and alkenyl groups can be replaced by -O-, -S-, -C(=O)-, -C(=O)-O-, -OC(=O)-, -C(=O)-NH-, -NH-, etc. The trivalent group Z... C Examples can be cited from the group Z, which is a divalent group as described above. C A group formed by removing one hydrogen atom from a group.

[0161] Group Z C It can have a branched structure. The group Z with a branched structure... C Alternatively, a polyalkylene glycol structure different from the polyalkylene glycol structure represented by the above formula (J-2a) may be found in a branch that is different from the branch containing the polyalkylene glycol structure represented by the above formula (J-2a).

[0162] Among them, group Z C Preferably, it is a straight-chain or branched alkylene group having 1 to 6 carbon atoms, and more preferably a straight-chain alkylene group having 1 to 4 carbon atoms.

[0163] R C It is an alkylene group, preferably a straight-chain or branched alkylene group having 1 to 6 carbon atoms, and more preferably a straight-chain alkylene group having 1 to 4 carbon atoms.

[0164] In formula (J-2a), n is an integer of 2 or more, preferably 2 to 540, more preferably 2 to 120, and even more preferably 2 to 60.

[0165] The molecular weight of compound (J-2) can be, for example, around 150 to 10,000. From the viewpoint of accelerating the development speed of the resin composition and increasing the intensity of emitted light from the resin layer (wavelength conversion film, etc.), it is preferably 150 to 5,000, and more preferably 150 to 4,000.

[0166] The molecular weight mentioned above can be either number-average or weight-average. In this case, the number-average molecular weight and weight-average molecular weight are the converted numbers of standard polystyrene determined by GPC, respectively.

[0167] When the resin composition contains quantum dots (B) and compound (J-2), the content ratio of compound (J-2) to quantum dots (B) in the resin composition is preferably 0.001 to 2 by mass, more preferably 0.01 to 1.5, and even more preferably 0.1 to 1. If this content ratio is within this range, it is advantageous from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.).

[0168] When the resin composition contains compound (J-2), the content of compound (J-2) in the resin composition, from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), is preferably 0.1% to 40% by mass, more preferably 0.1% to 20% by mass, further preferably 1% to 15% by mass, and even more preferably 2% to 10% by mass, relative to the total amount of solid components in the resin composition.

[0169] When the resin composition comprises compound (J-1) and compound (J-2), the content ratio of compound (J-2) to compound (J-1) in the resin composition, by mass ratio, is preferably 1 to 50, more preferably 5 to 40, and even more preferably 10 to 25. If this content ratio is within this range, it is advantageous from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.).

[0170] The resin composition may further contain a compound (J-3) other than compound (J-1) and compound (J-2), which has the ability to coordinate with quantum dots (B).

[0171] Examples of compounds (J-3) include organic acids, organic amine compounds, and thiols. Compound (J-3) can be silicone oil modified with carboxyl and amino or thiols. By including such a compound (J-3) in the resin composition, the properties of the resin layer (contact angle θr, surface tension σr, and other surface properties) can be adjusted.

[0172] When the resin composition contains quantum dots (B) and compound (J-3), the content ratio of compound (J-3) to quantum dots (B) in the resin composition is preferably 0.001 to 2 by mass, more preferably 0.01 to 1.5, and even more preferably 0.1 to 1. If this content ratio is within this range, it is advantageous from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.).

[0173] When the resin composition contains compound (J-3), the content of compound (J-3) in the resin composition, from the viewpoint of accelerating the development speed of the resin composition and increasing the emitted light intensity of the resin layer (wavelength conversion film, etc.), is preferably 0.1% to 40% by mass, more preferably 0.1% to 20% by mass, further preferably 0.2% to 15% by mass, and even more preferably 0.2% to 10% by mass, relative to the total amount of solid components in the resin composition.

[0174] It should be noted that compound (J-3) does not contain light scattering agent (A), resin (C), photopolymerizable compound (D), photopolymerization initiator (E), photopolymerization initiation aid (E1), solvent (F), antioxidant (G) and leveling agent (H).

[0175] Resin compositions can contain organic ligands even without quantum dots (B). By including organic ligands in the resin composition, the properties of the resin layer (contact angle θr, surface tension σr, and other surface properties) can be adjusted.

[0176] [2-4] Resin (C)

[0177] The resin composition may contain one or more resins (C). Examples of resins (C) include resins [K1] to [K4].

[0178] Resin [K1]: a copolymer selected from at least one (a) (hereinafter also referred to as "(a)") of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and a monomer (c) (but different from (a)) capable of copolymerizing with (a) (hereinafter also referred to as "(c)");

[0179] Resin [K2]: A resin obtained by reacting a monomer (b) (hereinafter also referred to as "(b)") having a cyclic ether structure having 2 to 4 carbon atoms with an olefinic unsaturated bond, and a copolymer of (a) and (c);

[0180] Resin [K3]: A resin obtained by reacting the copolymers of (a) and (b) with (c);

[0181] Resin [K4]: A resin obtained by reacting the copolymer of (a) and (b) with (c) and then reacting it with a carboxylic anhydride.

[0182] Examples of (a) include unsaturated monocarboxylic acids such as (meth)acrylic acid, crotonic acid, ortho-, meta-, and p-vinylbenzoic acid;

[0183] Maleic acid, fumaric acid, citraconic acid, zeaxanthin, itaconic acid, 3-vinyl phthalic acid, 4-vinyl phthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyltetrahydrophthalic acid, 1,4-cyclohexene dicarboxylic acid, and other unsaturated dicarboxylic acids;

[0184] Methyl-5-norbornene-2,3-dicarboxylic acid, 5-carboxybicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, and other bicyclic unsaturated compounds containing carboxyl groups;

[0185] Maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinyl phthalic anhydride, 4-vinyl phthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic acid bicyclic [2.2.1]hept-2-ene anhydride and other unsaturated dicarboxylic acid anhydrides;

[0186] Unsaturated mono[(meth)acryloyloxyethyl] esters of polycarboxylic acids with two or more members, such as succinate mono[2-(meth)acryloyloxyethyl] ester and phthalate mono[2-(meth)acryloyloxyethyl] ester.

[0187] Examples include unsaturated (meth)acrylates containing both hydroxyl and carboxyl groups in the same molecule, such as α-(hydroxymethyl)(meth)acrylic acid.

[0188] Among them, (meth)acrylic acid, maleic anhydride, etc. are preferred in terms of copolymerization reactivity or the solubility of the resulting resin (C) in alkaline aqueous solution.

[0189] In this specification, (meth)acrylic acid refers to acrylic acid and / or methacrylic acid. The same applies to "(meth)acryloyl", "(meth)acrylate", etc.

[0190] (b) is, for example, a monomer having a cyclic ether structure having 2 to 4 carbon atoms (e.g., selected from at least one of ethylene oxide ring, oxobutane ring, and tetrahydrofuran ring) and an alkene unsaturated bond. (b) is preferably a monomer having a cyclic ether structure having 2 to 4 carbon atoms and a (meth)acryloyloxy group.

[0191] Examples of (b) include: glycidyl (meth)acrylate, β-methyl glycidyl (meth)acrylate, β-ethyl glycidyl (meth)acrylate, glycidyl vinyl ether, o-vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, α-methyl-o-vinyl benzyl glycidyl ether, α-methyl-m-vinyl benzyl glycidyl ether, α-methyl-p-vinyl benzyl glycidyl ether, 2,3-bis(glycidyloxymethyl)styrene, 2,4-bis( Monomers containing ethylene oxide rings and olefinic unsaturated bonds, such as glycidyloxymethyl styrene, 2,5-bis(glycidyloxymethyl)styrene, 2,6-bis(glycidyloxymethyl)styrene, 2,3,4-tris(glycidyloxymethyl)styrene, 2,3,5-tris(glycidyloxymethyl)styrene, 2,3,6-tris(glycidyloxymethyl)styrene, 3,4,5-tris(glycidyloxymethyl)styrene, and 2,4,6-tris(glycidyloxymethyl)styrene.

[0192] Monomers containing an oxetane ring and an alkene unsaturated bond, such as 3-methyl-3-methacryloxymethyloxetane, 3-methyl-3-methacryloxymethyloxetane, 3-ethyl-3-methacryloxymethyloxetane, 3-ethyl-3-methacryloxyethyloxetane, 3-methyl-3-methacryloxyethyloxetane, 3-ethyl-3-methacryloxyethyloxetane, and 3-ethyl-3-methacryloxyethyloxetane;

[0193] Monomers such as tetrahydrofurfuryl acrylate (e.g., Biscoat V#150, manufactured by Osaka Organic Chemical Industry Co., Ltd.) and tetrahydrofurfuryl methacrylate, which have tetrahydrofuran rings and olefinic unsaturated bonds.

[0194] In terms of the high reactivity and low likelihood of unreacted residues during the manufacture of resins [K2] to [K4], monomers having an ethylene oxide ring and olefinic unsaturated bonds are preferred as (b).

[0195] Examples of (c) include: methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, tert-butyl methacrylate, 2-ethylhexyl methacrylate, dodecyl methacrylate, lauryl methacrylate, stearyl methacrylate, cyclopentyl methacrylate, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo[5.2.1.0] 2，6 ] Decane-8-yl ester (commonly known in this art as "(meth)acrylate dicyclopentyl ester". Also sometimes referred to as "(meth)acrylate tricyclodecyl ester"). (meth)acrylate tricyclo[5.2.1.0] 2，6 Decen-8-yl ester (commonly referred to as "(meth)acrylate dicyclopentenyl ester"), (meth)acrylate dicyclopentyloxyethyl ester, (meth)acrylate isobornyl ester, (meth)acrylate adamantyl ester, (meth)acrylate allyl ester, (meth)acrylate propargyl ester, (meth)acrylate phenyl ester, (meth)acrylate naphthyl ester, (meth)acrylate benzyl ester, and other (meth)acrylates;

[0196] Hydroxyl methacrylates such as 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate;

[0197] Diethyl maleate, diethyl fumarate, diethyl itaconic acid, and other dicarboxylic acid diesters;

[0198] Bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[2.2.1]hept-2-ene, 5-(2′-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(2′-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene Bicyclic unsaturated compounds such as cyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-bis(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, and 5,6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene;

[0199] N-Phenylacetylmaleimide, N-Cyclohexylmaleimide, N-Benzylmaleimide, N-Succinimino-3-maleimide benzoate, N-Succinimino-4-maleimide butyrate, N-Succinimino-6-maleimide hexanoate, N-Succinimino-3-maleimide propionate, N-(9-Acridineyl)maleimide and other dicarbonylimide derivatives;

[0200] Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene, etc.

[0201] Among these, styrene, vinyltoluene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo[2.2.1]hept-2-ene are preferred in terms of copolymerization reactivity and heat resistance of resin (C).

[0202] In the overall structural units constituting resin [K1], the preferred ratio of resin [K1] from its respective structural units is:

[0203] Structural units from (a): 2 mol% to 60 mol%

[0204] Structural units from (c): 40 mol%–98 mol%;

[0205] More preferably:

[0206] Structural units from (a): 10 mol% to 50 mol%

[0207] Structural units from (c): 50 mol% to 90 mol%.

[0208] If the ratio of the structural units of the resin [K1] is within the above range, the resin composition tends to have excellent storage stability, the developability of the resulting resin layer, and solvent resistance.

[0209] The resin [K1] can be manufactured, for example, by referring to the method described in the literature "Experimental Method for Polymer Synthesis" (written by Takayuki Otsu, Chemical Dojin Publishing Co., Ltd., 1st edition, 1st printing, published on March 1, 1972) and the references cited in that literature.

[0210] Specifically, the following method can be used: a specified amount of (a) and (c), polymerization initiator and solvent are placed into a reaction vessel, for example, by replacing oxygen with nitrogen to create a deoxygenated environment, and heating and maintaining the temperature are carried out while stirring.

[0211] The polymerization initiators and solvents used herein are not particularly limited, and commonly used polymerization initiators and solvents in this field can be used. For example, examples of polymerization initiators include azo compounds (2,2′-azobisisobutyronitrile, 2,2′-azobis(2,4-dimethylpentanonitrile) etc.) and organic peroxides (benzoyl peroxide, etc.); as solvents, any solvent that can dissolve the monomers is acceptable, and examples of solvents (F) that can be included in the resin composition, as described later, are also acceptable.

[0212] The resulting copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or from a solution extracted in solid (powder) form by methods such as reprecipitation. If the solvent (F) described later is used as the solvent during polymerization, the reaction solution can be used directly in the preparation of the resin composition, thus simplifying the manufacturing process of the resin composition.

[0213] The resin [K2] can be manufactured by adding a cyclic ether having 2 to 4 carbon atoms in (b) to a carboxylic acid and / or carboxylic anhydride in (a) for the copolymer of (a) and (c).

[0214] First, the copolymers of (a) and (c) are manufactured in the same manner as described in the method for manufacturing resin [K1]. In this case, the ratio of the respective structural units is preferably the same as that described in resin [K1].

[0215] Next, the cyclic ether having 2 to 4 carbon atoms in (b) is reacted with a portion of the carboxylic acid and / or carboxylic anhydride from (a) in the copolymer described above.

[0216] After producing the copolymer of (a) and (c), the environment inside the flask is replaced with air instead of nitrogen, and the reaction is carried out in the presence of (b), a reaction catalyst (e.g., organophosphorus compound, metal complex, amine compound, etc.) for carboxylic acid or carboxylic anhydride and cyclic ether, and a polymerization inhibitor (e.g., hydroquinone, etc.), for example, at 60°C to 130°C for 1 to 10 hours, thereby producing resin [K2].

[0217] Compared to 100 mol in (a), the amount of (b) used is preferably 5 to 80 mol, more preferably 10 to 75 mol. By setting it within this range, there is a tendency for a better balance between the storage stability of the resin composition, the developability of the resulting resin layer, and the solvent resistance, heat resistance, and mechanical strength of the resin layer.

[0218] Organophosphorus compounds used as reaction catalysts include, for example, triphenylphosphine. Amine compounds used as reaction catalysts include, for example, aliphatic tertiary amine compounds or aliphatic quaternary ammonium salt compounds; specific examples include tris(dimethylaminomethyl)phenol, triethylamine, tetrabutylammonium bromide, and tetrabutylammonium chloride. From the viewpoint of the developability of the resin layer and the intensity of the emitted light from the wavelength conversion film when the resin layer is the wavelength conversion film described later, the reaction catalyst is preferably an organophosphorus compound.

[0219] The amount of reaction catalyst used is preferably 0.001 to 5 parts by mass relative to the total amount of 100 parts by mass of (a), (b) and (c).

[0220] The amount of polymerization inhibitor used is preferably 0.001 to 5 parts by mass relative to the total amount of 100 parts by mass of (a), (b) and (c).

[0221] The reaction conditions, such as the method of addition, reaction temperature, and time, can be appropriately adjusted taking into account factors such as the manufacturing equipment and the heat generated during polymerization. It should be noted that, similar to polymerization conditions, the method of addition and reaction temperature can be appropriately adjusted taking into account factors such as the manufacturing equipment and the heat generated during polymerization.

[0222] Regarding resin [K3], as a first stage, copolymers of (b) and (c) are obtained in the same manner as resin [K1] described above. As described above, the resulting copolymer can be used directly from the reaction solution, or from a concentrated or diluted solution, or from a solution extracted in solid (powder) form by methods such as reprecipitation.

[0223] The ratios of structural units from (b) and (c) are preferably as follows, relative to the total number of moles of structural units constituting the copolymer:

[0224] Structural units from (b): 5 mol% to 95 mol%

[0225] Structural units from (c): 5 mol% to 95 mol%;

[0226] More preferably: structural units from (b): 10 mol% to 90 mol%

[0227] Structural units from (c): 10 mol% to 90 mol%.

[0228] Resin [K3] can be obtained by reacting the carboxylic acid or carboxylic anhydride contained in (a) with the cyclic ether from (b) in the copolymer of (b) and (c) under the same conditions as the manufacturing method of resin [K2].

[0229] The amount of (a) used in reaction with the copolymer described above is preferably 5 to 80 moles relative to 100 moles of (b).

[0230] Resin [K4] is a resin obtained by further reacting carboxylic anhydride with resin [K3]. The carboxylic anhydride is reacted with a hydroxyl group, which is generated by the reaction of a cyclic ether with a carboxylic acid or a carboxylic anhydride.

[0231] Examples of carboxylic anhydrides include: maleic anhydride, citraconic anhydride, itaconic anhydride, 3-vinylphthalic anhydride, 4-vinylphthalic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, 1,2,3,6-tetrahydrophthalic anhydride, dimethyltetrahydrophthalic anhydride, 5,6-dicarboxylic bicyclo[2.2.1]hept-2-ene anhydride, etc.

[0232] The amount of carboxylic anhydride used is preferably 0.5 to 1 mole or less, relative to the amount of (a) used (1 mole).

[0233] Examples of resins [K1], [K2], [K3], and [K4] include, for example, benzyl methacrylate / (meth)acrylic acid copolymer, styrene / (meth)acrylic acid copolymer, etc.;

[0234] Resins such as benzyl methacrylate / (meth)acrylate copolymer with glycidyl methacrylate, resins such as tricyclodecyl methacrylate / styrene / (meth)acrylate copolymer with glycidyl methacrylate, and resins such as tricyclodecyl methacrylate / (meth)acrylate / benzyl methacrylate / (meth)acrylate copolymer with glycidyl methacrylate [K2]; resins such as (meth)acrylate and tricyclodecyl methacrylate / (meth)acrylate copolymer with glycidyl methacrylate, and resins such as (meth)acrylate and tricyclodecyl methacrylate / styrene / (meth)acrylate copolymer with glycidyl methacrylate [K3]; resins such as (meth)acrylate and tricyclodecyl methacrylate / (meth)acrylate copolymer with glycidyl methacrylate, and resins such as (K4] obtained by reacting (meth)acrylate and tricyclodecyl methacrylate / (meth)acrylate copolymer with glycidyl methacrylate.

[0235] The resin (C) preferably includes at least one selected from resin [K2], resin [K3] and resin [K4].

[0236] As a further example of resin (C), the alkali-soluble resin described in Japanese Patent Application Publication No. 2018-123274 can be cited.

[0237] The resin (C) may include one or more of the resins [K1], [K2], [K3], [K4] and the alkali-soluble resins described in Japanese Patent Application Publication No. 2018-123274.

[0238] As a further example of resin (C), polyalkylene glycol compounds can be cited. Examples of polyalkylene glycol compounds include polyethylene glycol and polypropylene glycol. When the resin composition further comprises quantum dots (B), the polyalkylene glycol compound can improve the dispersibility of the quantum dots (B) in the resin composition, which is advantageous.

[0239] The weight-average molecular weight of resin (C), as determined by GPC based on standard polystyrene, is preferably 9000 or less. By giving resin (C) the aforementioned weight-average molecular weight, the development speed of the resin layer can be increased, and when the resin layer is a wavelength conversion film, there is a tendency to obtain a wavelength conversion film with high emitted light intensity.

[0240] The weight-average molecular weight of the resin (C) converted from standard polystyrene is, for example, 1,000 to 9,000, and preferably 2,000 to 8,500, more preferably 3,000 to 8,500, from the viewpoint of the development speed of the resin layer and the intensity of the emitted light from the wavelength conversion film.

[0241] The weight-average molecular weight of resin (C) converted from standard polystyrene was determined according to the determination method described in Example 1 below.

[0242] For the purpose of setting the weight-average molecular weight of resin (C) within the above range, the selection of raw materials, addition methods, reaction temperature and time, and other reaction conditions can be appropriately combined and adjusted.

[0243] The molecular weight distribution of the resin (C) [weight-average molecular weight (Mw) / number-average molecular weight (Mn)] determined by CPC is, for example, 1.0 to 6.0, and preferably 1.2 to 4.0 from the viewpoint of the developability of the resin layer.

[0244] Regarding the acid value of resin (C), based on the solid content, it is preferably 90 mg KOH / g to 150 mg KOH / g. When the acid value is less than 90 mg KOH / g, the solubility of the resin layer relative to the alkaline developer becomes lower, raising concerns about residues remaining on the substrate. When the acid value exceeds 150 mg KOH / g, the possibility of resin layer peeling after development increases.

[0245] From the viewpoint of the developability of the resin layer, the acid value of the resin (C) is preferably 95 mg KOH / g to 140 mg KOH / g, and more preferably 100 mg KOH / g to 130 mg KOH / g.

[0246] The acid value is a value determined as the amount (mg) of potassium hydroxide required to neutralize 1g of resin (C), and can be determined, for example, by titration using an aqueous solution of potassium hydroxide. The acid value of resin (C) was determined according to the determination method described in the Example 1 section below.

[0247] Resin (C) may contain a double bond equivalent of, for example, 300 g / eq to 2000 g / eq, preferably 500 g / eq to 1500 g / eq. By containing resin (C) with a double bond equivalent of 300 g / eq to 2000 g / eq, there is a tendency to easily prevent matting during the process of manufacturing the cured pattern. When resin (C) contains resin with a double bond equivalent of more than 2000 g / eq, there is a tendency to reduce the ability of resin (C) to effectively protect the quantum dots (B). When resin (C) contains resin with a double bond equivalent of less than 300 g / eq, there is a tendency for the cured pattern to be undissolved and easily peeled off during development.

[0248] Examples of resins having a double bond equivalent of 300 g / eq to 2000 g / eq include (meth)acrylic resins. Resin (C) preferably comprises a (meth)acrylic resin.

[0249] When the resin composition contains a light scattering agent (A) but not quantum dots (B), the content of resin (C) in the resin composition relative to the total amount of solid components of the resin composition is, for example, 5% to 80% by mass, preferably 10% to 70% by mass, and more preferably 15% to 65% by mass. When the content of resin (C) is within the above range, the light scattering agent (A) is easily dispersed, and there is a tendency to maintain a high intensity of emitted light during the process of manufacturing the cured pattern.

[0250] When the resin composition contains a light scattering agent (A) and quantum dots (B), the content of resin (C) in the resin composition relative to the total amount of solid components of the resin composition is, for example, 5% to 80% by mass, preferably 10% to 65% by mass, and more preferably 15% to 45% by mass. When the content of resin (C) is within the above range, the light scattering agent (A) and quantum dots (B) are easily dispersed, and there is a tendency to maintain a high intensity of emitted light during the process of manufacturing the cured pattern described later.

[0251] When the resin composition contains a light scattering agent (A), further contains a photopolymerizable compound (D) described later, and does not contain quantum dots (B), the mass ratio (solid content ratio) of resin (C) to photopolymerizable compound (D) is, for example, 1 or more, and preferably 1.5 to 3.5 from the viewpoint of the developability of the resin layer.

[0252] When the resin composition contains a light scattering agent (A), quantum dots (B), and a photopolymerizable compound (D), the mass ratio (solid content ratio) of resin (C) to photopolymerizable compound (D) is, for example, 1 or more, and preferably 2.5 to 5.5 from the viewpoint of the developability of the resin layer.

[0253] It should be noted that there is a tendency for the resin (C) to have a higher content of polar groups, resulting in a higher contact angle θr between the resin layer and diiodomethane. Examples of polar groups include carboxyl, hydroxyl, and amino groups.

[0254] [2-5] Photopolymerizable compounds (D)

[0255] The resin composition may contain one or more photopolymerizable compounds (D). Resin compositions further comprising photopolymerizable compound (D) and a photopolymerization initiator (E) described later exhibit curability. The photopolymerizable compound (D) is a compound that can be polymerized by active free radicals, acids, etc., generated from the photopolymerization initiator (E) described later; examples include compounds having olefinic unsaturated bonds, and (meth)acrylate compounds are preferred.

[0256] Among them, the photopolymerizable compound (D) is preferably a polymerizable compound having three or more olefinic unsaturated bonds. Examples of such polymerizable compounds include: trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol octa(meth)acrylate, tripentaerythritol hepta(meth)acrylate, tetrapentaerythritol deca(meth)acrylate, tetrapentaerythritol nona(meth)acrylate, tri(2-(meth)acryloyloxyethyl) isocyanurate, ethylene glycol-modified pentaerythritol tetra(meth)acrylate, ethylene glycol-modified dipentaerythritol hexa(meth)acrylate, propylene glycol-modified pentaerythritol tetra(meth)acrylate, propylene glycol-modified dipentaerythritol hexa(meth)acrylate, caprolactone-modified pentaerythritol tetra(meth)acrylate, caprolactone-modified dipentaerythritol hexa(meth)acrylate, etc.

[0257] The weight-average molecular weight of the photopolymerizable compound (D) is preferably 150 to 2900, more preferably 250 to 1500.

[0258] When the resin composition contains a photopolymerizable compound (D), the content of the photopolymerizable compound (D) in the resin composition is preferably 7% to 60% by mass, more preferably 10% to 45% by mass, and even more preferably 13% to 30% by mass, relative to the total amount of solid components in the resin composition. If the content of the photopolymerizable compound (D) is within the above range, there is a tendency for the residual film rate of the cured pattern and the chemical resistance of the cured pattern to be further improved.

[0259] [2-6] Photopolymerization initiator (E)

[0260] When a resin composition contains a photopolymerizable compound (D), the resin composition typically further contains one or more photopolymerization initiators (E). A photopolymerization initiator (E) is a compound that can initiate polymerization by generating active free radicals, acids, etc., through the action of light or heat.

[0261] The photopolymerization initiator (E) is preferably an oxime compound having a first molecular structure represented by the following formula (1). Hereinafter, the oxime compound will also be referred to as "oxime compound (1)".

[0262] [Chemical Formula 5]

[0263]

[0264] From the viewpoint of increasing the intensity of emitted light from the resin layer (wavelength conversion film, etc.), it is advantageous to contain oxime compound (1) as a photopolymerization initiator (E). One reason for this effect is speculated to be that, due to the unique molecular structure of oxime compound (1), the absorption wavelength of oxime compound (1) changes significantly before and after the oxime compound (1) required to initiate photopolymerization changes. Therefore, oxime compound (1) has a high photoradical polymerization initiation ability.

[0265] In equation (1), R 1 R represents 11 OR 11 COR 11 SR 11 CONR 12 R 13 Or CN.

[0266] R 11 R 12 and R 13 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0267] R 11 R 12 Or R 13 The hydrogen atoms of the represented group can be ORed. 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atoms or COOR 21 replace.

[0268] R 21 R 22 and R 23 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0269] R 21 R 22Or R 23 The hydrogen atoms of the represented groups can be replaced by CN, halogen atoms, hydroxyl groups, or carboxyl groups.

[0270] In R 11 R 12 R 13 R 21 R 22 Or R 23 When the indicated group has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times.

[0271] R 24 It represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0272] In R 11 R 12 R 13 R 21 R 22 Or R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 12 With R 13 and R 22 With R 23 They can also form rings together separately.

[0273] * indicates a bonding site with the second molecular structure, which is a molecular structure other than the first molecular structure of the oxime compound (1).

[0274] As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Alkyl groups representing 1 to 20 carbon atoms include, for example: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, tripentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, trioctyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, tetradecyl, hexadecyl, octadecyl, eicosyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, cyclohexylethyl, etc.

[0275] As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Examples of aryl groups with 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthracel, phenanthryl, phenyl groups with one or more of the above alkyl groups substituted, biphenyl, naphthyl, anthracel, etc.

[0276] As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Aryl groups with 7 to 30 carbon atoms can be exemplified by benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc.

[0277] As R in equation (1) 11 R 12 R 13 R 21 R 22 R 23 and R 24 Examples of heterocyclic groups with 2 to 20 carbon atoms include pyridinyl, pyrimidinyl, furanyl, thiopheneyl, tetrahydrofuranyl, dioxocyclopentyl, benzoxazol-2-yl, tetrahydropyranyl, pyrrolidinyl, imidazolidyl, pyrazolidyl, tetrahydrothiazolyl, isotetrahydrothiazolyl, oxazolidyl, isoxazolidyl, piperidinyl, piperazinyl, morpholinyl, etc., preferably 5 to 7-membered heterocycles.

[0278] R in equation (1) 12 With R 13 and R 22 With R 23 The fact that they can form a ring together means that R 12 With R 13 and R 22 With R 23 They can each form a ring together with the nitrogen, carbon, or oxygen atoms they are attached to.

[0279] Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23The rings that can be formed together include, for example, cyclopentane rings, cyclohexane rings, cyclopentene rings, benzene rings, piperidine rings, morpholine rings, lactone rings, lactam rings, etc., preferably 5- to 7-membered rings.

[0280] As R in equation (1) 11 R 12 R 13 R 21 R 22 and R 23 Halogen atoms that can be used as substituents include fluorine, chlorine, bromine, and iodine atoms.

[0281] R in equation (1) 1 R is preferred 11 More preferably, it is an alkyl group having 1 to 20 carbon atoms, even more preferably an alkyl group having 1 to 10 carbon atoms, and still more preferably an alkyl group having 1 to 6 carbon atoms.

[0282] An example of a second molecular structure linked to the first molecular structure represented by formula (1) is the structure represented by formula (2) below. The second molecular structure refers to any other molecular structural part of the oxime compound (1) besides the aforementioned first molecular structure.

[0283] The bonding sites indicated by "*" in formula (2) are directly bonded to the bonding sites indicated by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (2), the benzene ring with "-*" in formula (2) is directly bonded to the carbonyl group with "-*" in formula (1).

[0284] [Chemical Formula 6]

[0285]

[0286] In equation (2), R 2 and R 3 Represent R independently 11 OR 11 SR 11 COR 11 CONR 12 R 13 NR 12 COR 11 OCOR 11 COOR 11 SCOR 11 OCSR 11 COSR 11 CSOR 11 CN or halogen atoms.

[0287] In the existence of multiple R 2At the same time, they can be the same or different.

[0288] In the existence of multiple R 3 At the same time, they can be the same or different.

[0289] R 11 R 12 and R 13 It means the same as above.

[0290] s and t independently represent integers from 0 to 4.

[0291] L represents a sulfur atom, CR 31 R 32 CO or NR 33 .

[0292] R 31 R 32 and R 33 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an aralkyl group with 7 to 30 carbon atoms.

[0293] In R 31 R 32 Or R 33 When the represented group has an alkyl moiety, the alkyl moiety can be branched or cyclic, R 31 R 32 and R 33 It can also form a ring independently with any adjacent benzene ring.

[0294] R 4 Represents a hydroxyl group, a carboxyl group, or the following formula (2-1).

[0295] [Chemical Formula 7]

[0296] (R 4a ) v -L 2 -L 1 - (2-1)

[0297] (In equation (2-1), L) 1 Indicates -O-, -S-, -NR 22 -、-NR 22 CO-, -SO2-, -CS-, -OCO-, or -COO-.

[0298] R 22 It means the same as above.

[0299] L 2This refers to a group formed by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, a group formed by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms, a group formed by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms.

[0300] In L 2 When the indicated group has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 22 -、-NR 22 COO-、-OCONR 22 -, -SCO-, -COS-, -OCS-, or -CSO- are interrupted 1 to 5 times, and the alkylene moiety can be branched or cyclic.

[0301] R 4a OR 41 SR 41 CONR 42 R 43 NR 42 COR 43 OCOR 41 COOR 41 SCOR 41 OCSR 41 COSR 41 CSOR 41 CN or halogen atoms.

[0302] In the existence of multiple R 4a At the same time, they can be the same or different.

[0303] R 41 R 42 and R 43 Each of the following independently represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an aralkyl group with 7 to 30 carbon atoms, in R 41 R 42 and R 43 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic, R 42 With R 43 They can form a ring together.

[0304] v represents an integer from 1 to 3.

[0305] The group to be represented.

[0306] * indicates the bonding site of the first molecular structure of the oxime compound (1).

[0307] R in equation (2) 11 R 12 R 13 R 21 R 22 R 23 R 24 R 31 R 32 and R 33 And R in equation (2-1) above 22 R 41 R 42 and R 43 The examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, and aralkyl groups with 7 to 30 carbon atoms are the same as R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same.

[0308] R in equation (2) 11 R 12 R 13 R 21 R 22 R 23 R 24 and R in the above formula (2-1) 22 Examples of heterocyclic groups with 2 to 20 carbon atoms are similar to R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same.

[0309] R in equation (2) 31 R 32 and R 33 The ability of R to independently form a ring with any adjacent benzene ring refers to the fact that R... 31 R 32 and R 33 Each can independently form a ring together with any adjacent benzene ring and the nitrogen atom to which it is attached.

[0310] R in equation (2) 31 R 32 and R 33 Examples of rings that can be formed together with any adjacent benzene ring and Ra in formula (1) 12 With Ra 13 and Ra22 With Ra 23 The same applies to examples of rings that can be formed together.

[0311] L in the above formula (2-1) 2 It refers to a group formed by removing v hydrogen atoms from an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0312] Examples of alkyl groups derived by removing v hydrogen atoms from an alkyl group having 1 to 20 carbon atoms, for example when v is 1, include: methylene, ethylene, propylene, methyl ethylene, butylene, 1-methylpropylene, 2-methylpropylene, 1,2-dimethylpropylene, 1,3-dimethylpropylene, 1-methylbutylene, 2-methylbutylene, 3-methylbutylene, 4-methylbutylene, 2,4-dimethylbutylene, 1,3-dimethylbutylene, pentamethylene, hexylene, heptylene, octylene, nonylene, decylene, dodecylene, tridecylene, tetradecylene, pentadecylene, ethane-1,1-diyl, propane-2,2-diyl, etc.

[0313] Examples of aryl groups obtained by removing v hydrogen atoms from an aryl group having 6 to 30 carbon atoms include, for example, 1,2-phenylene, 1,3-phenylene, 1,4-phenylene, 2,6-naphthylene, 1,4-naphthylene, 2,5-dimethyl-1,4-phenylene, diphenylmethane-4,4′-diyl, 2,2-diphenylpropane-4,4′-diyl, diphenyl sulfide-4,4′-diyl, and diphenyl sulfone-4,4′-diyl.

[0314] As a group obtained by removing v hydrogen atoms from an aralkyl group having 7 to 30 carbon atoms, for example, when v is 1, groups represented by the following formula (a) and groups represented by the following formula (b) can be cited.

[0315] [Chemical Formula 8]

[0316]

[0317] In equations (a) and (b), L 3 and L 5 L represents an alkylene group having 1 to 10 carbon atoms. 4 and L 6 Indicates a single bond or an alkylene group having 1 to 10 carbon atoms.

[0318] Examples of alkylene groups having 1 to 10 carbon atoms include: methylene, ethylene, propylene, methyl ethylene, butylene, 1-methyl propyleneene, 2-methyl propyleneene, 1,2-dimethyl propyleneene, 1,3-dimethyl propyleneene, 1-methyl butylene, 2-methyl butylene, 3-methyl butylene, 4-methyl butylene, 2,4-dimethyl butylene, 1,3-dimethyl butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, etc.

[0319] As a group obtained by removing v hydrogen atoms from a heterocyclic group having 2 to 20 carbon atoms, examples include, for example, 2,5-pyridinidyl, 2,6-pyridinidyl, 2,5-pyrimidinediyl, 2,5-thiophenediyl, 3,4-tetrahydrofurandiyl, 2,5-tetrahydrofurandiyl, 2,5-furandiyl, 3,4-thiazolyldiyl, 2,5-benzofurandiyl, 2,5-benzothiaphenediyl, N-methylindole-2,5-diyl, 2,5-benzothiazolyldiyl, 2,5-benzoxazolediyl, etc., which are divalent heterocyclic groups.

[0320] As R in equation (2) 2 and R 3 and R in the above formula (2-1) 4a Examples of halogen atoms that can be represented include fluorine, chlorine, bromine, and iodine atoms.

[0321] From the viewpoint of solubility in solvent (F) and / or development speed of resin composition, a preferred example of the structure represented by formula (2) is the structure represented by formula (2a) below.

[0322] [Chemical Formula 9]

[0323]

[0324] In formula (2a), L′ represents a sulfur atom or NR. 50 R 50 R represents a linear, branched, or cyclic alkyl group having 1 to 20 carbon atoms. 2 R 3 R 4 , s, and t represent the same meaning as above.

[0325] From the same point of view as above, another preferred example of the structure represented by equation (2) is the structure represented by equation (2b) below.

[0326] [Chemical Formula 10]

[0327]

[0328] In equation (2b), R 44Represents a hydroxyl group, a carboxyl group, or the following formula (2-2).

[0329] [Chemical Formula 11]

[0330] R 44a -L 12 -L 11 - (2-2)

[0331] (In equation (2-2), L) 11 It represents -O- or *-OCO-, where * indicates the same as L. 12 The bonding site, L 12 R represents an alkylene group having 1 to 20 carbon atoms, which can be interrupted by 1 to 3 -O- groups. 44a OR 55 or COOR 55 R 55 (This refers to an alkyl group having 1 to 6 hydrogen atoms or carbon atoms.)

[0332] The group to be represented.

[0333] R 44 Preferably, the group represented by formula (2-2) is preferred. In this case, it is advantageous in terms of the solubility of the oxime compound (1) in the solvent (F) and the development speed of the resin composition.

[0334] L 12 The alkylene group represented preferably has 1 to 10 carbon atoms, more preferably 1 to 4.

[0335] R 44a Preferably, it is a hydroxyl or carboxyl group, more preferably a hydroxyl group.

[0336] The method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (2) is not particularly limited. For example, it can be manufactured according to the method described in Japanese Patent Application Publication No. 2011-132215.

[0337] Another example of a second molecular structure linked to the first molecular structure represented by equation (1) is the structure represented by equation (3) below.

[0338] The bonding sites indicated by "*" in equation (3) are directly bonded to the bonding sites indicated by "*" in equation (1). That is, when the second molecule structure is the structure represented by equation (3), equation (3) is directly bonded to the bonding sites represented by "*".

[0339] The benzene ring with "-*" in (3) is directly bonded to the carbonyl group with "-*, , in (1).

[0340] [Chemical Formula 12]

[0341]

[0342] In equation (3), R 5 It represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0343] When the group represented by R5 has an alkyl moiety, the alkyl moiety can be branched or cyclic.

[0344] R 5 The hydrogen atoms of the represented group can be R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom or COOR 21 replace.

[0345] R 21 R 22 and R 23 It means the same as above.

[0346] R 21 R 22 Or R 23 The hydrogen atoms of the represented groups can be replaced by CN, halogen atoms, hydroxyl groups, or carboxyl groups.

[0347] In R 21 R 22 and R 23 When the indicated group has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times.

[0348] R 24 It means the same as above.

[0349] In R 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together.

[0350] R 6 R 7 R 8 and R 9 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 Hydroxyl group, nitro group, CN or halogen atom.

[0351] R 61 R 62 R 63 R 64 and R 65 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0352] R 61 R 62 R 63 R 64 Or R 65 The hydrogen atoms of the represented group can be ORed. 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atoms or COOR 21 replace.

[0353] R 6 With R 7 R 7 With R 8 and R 8 With R 9 They can form rings together separately.

[0354] * indicates the bonding site of the first molecular structure of the oxime compound (1).

[0355] R in equation (3) 5 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms are the same as R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same.

[0356] R in equation (3) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 They can form a ring together with the nitrogen, carbon, or oxygen atoms they are attached to.

[0357] R in equation (3) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together.

[0358] As R in equation (3) 6 R 7 R 8 and R 9 The halogen atom represented, and the substituted R 5 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms that contain hydrogen atoms include fluorine, chlorine, bromine, and iodine atoms.

[0359] From the viewpoint of solubility in solvent (F) and / or development speed of resin composition, in a preferred embodiment, R 5 It is the group represented by the following formula (3-1).

[0360] [Chemical Formula 13]

[0361]

[0362] In formula (3-1), Z represents a group formed by removing one hydrogen atom from an alkyl group having 1 to 20 carbon atoms, a group formed by removing one hydrogen atom from an aryl group having 6 to 30 carbon atoms, a group formed by removing one hydrogen atom from an aralkyl group having 7 to 30 carbon atoms, or a group formed by removing one hydrogen atom from a heterocyclic group having 2 to 20 carbon atoms.

[0363] When the group represented by Z has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- are interrupted 1 to 5 times, and the alkylene moiety can be branched or cyclic;

[0364] R 21 R 22 and R 24 This indicates the same meaning as above.

[0365] From the same point of view as above, Z in formula (3-1) is preferably methylene, ethylene, or phenylene.

[0366] Starting from the same point of view as above, R in equation (3-1) 21 and R 22Preferably, it is an alkyl group with 1 to 20 carbon atoms or an aryl group with 6 to 30 carbon atoms, more preferably methyl, ethyl or phenyl.

[0367] Starting from the same point of view as above, in another preferred approach, R 7 It is a nitro group.

[0368] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (3). For example, it can be manufactured according to the methods described in Japanese Patent Application Publication No. 2000-80068 and Japanese Patent Application Publication No. 2011-178776.

[0369] Another example of a second molecular structure linked to the first molecular structure represented by equation (1) is the structure represented by equation (4) below.

[0370] The bonding sites indicated by "*" in equation (4) are directly bonded to the bonding sites indicated by "*" in equation (1). That is, when the structure of the second molecule is the structure represented by equation (4), equation (1) is directly bonded to the bonding sites represented by "*".

[0371] The benzene ring with "-*" in (4) is directly bonded to the carbonyl group with "-*" in (1).

[0372] [Chemical Formula 14]

[0373]

[0374] In equation (4), R 71 It represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0375] In R 71 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic.

[0376] R 71 The hydrogen atoms of the represented group can be R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom or COOR 21 replace.

[0377] R 21 R 22 and R 23 It means the same as above.

[0378] R 21 R 22 Or R 23 The hydrogen atoms of the represented groups can be replaced by CN, halogen atoms, hydroxyl groups, or carboxyl groups.

[0379] In R 21 R 22 and R 23 When the indicated group has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times.

[0380] R 24 It means the same as above.

[0381] In R 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together.

[0382] R 72 R 73 And 3 Rs 74 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 Hydroxyl group, nitro group, CN or halogen atom.

[0383] R 61 R 62 R 63 R 64 and R 65 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0384] R 61 R 62 R 63 R 64 Or R 65 The hydrogen atoms of the represented group can be ORed. 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atoms or COOR 21 replace.

[0385] R 72 R 73 and 2 R 74 They can form rings together separately.

[0386] * indicates the bonding site of the first molecular structure of the oxime compound (1).

[0387] R in equation (4) 71 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms are the same as R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same.

[0388] R in equation (4) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 They can form a ring together with the nitrogen, carbon, or oxygen atoms they are attached to.

[0389] R in equation (4) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together.

[0390] As R in equation (4) 72 R 73 and R 74 The halogen atom represented, and the substituted R 71 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms that contain hydrogen atoms include fluorine, chlorine, bromine, and iodine atoms.

[0391] There are no particular limitations on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (4), for example, it can be manufactured according to the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0392] Another example of a second molecular structure linked to the first molecular structure represented by equation (1) is the structure represented by equation (5) below.

[0393] The bonding sites indicated by "*" in equation (5) are directly bonded to the bonding sites indicated by "*" in equation (1). That is, when the second molecule structure is the structure represented by equation (5), equation (1) is directly bonded to the bonding sites represented by "*".

[0394] The pyrrole ring with "-*" in (5) is directly bonded to the carbonyl group with "-*" in (1).

[0395] [Chemical Formula 15]

[0396]

[0397] In equation (5), R 81 It represents a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an aralkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0398] In R 81 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic.

[0399] R 81 The hydrogen atoms of the represented group can be R 21 OR 21 COR 21 SR 21 NR 22 R 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 NR 22 COR 21 OCOR 21 COOR 21 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 SCOR 21 OCSR 21 COSR 21 CSOR 21 hydroxyl group, nitro group, CN, halogen atom or COOR 21 replace.

[0400] R 21 R 22 and R 23 It means the same as above.

[0401] R 21 R 22 Or R 23 The hydrogen atoms of the represented groups can be replaced by CN, halogen atoms, hydroxyl groups, or carboxyl groups.

[0402] In R 21 R 22 and R 23 When the indicated group has an alkylene moiety, the alkylene moiety can be -O-, -S-, -COO-, -OCO-, or -NR. 24 -、-NR 24 CO-, -NR 24 COO-、-OCONR 24 -, -SCO-, -COS-, -OCS-, or -CSO- interrupt 1 to 5 times.

[0403] R 24 It means the same as above.

[0404] In R 21 R 22 and R 23 When the indicated group has an alkyl moiety, the alkyl moiety can be branched or cyclic. Additionally, R... 22 With R 23 They can form a ring together.

[0405] R 82 R 83 R 84 R 85 and R 86 Represent R independently 61 OR 61 SR 61 COR 62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 Hydroxyl group, nitro group, CN or halogen atom.

[0406] R 61 R 62 R 63 R 64 and R 65 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0407] R 61 R 62 R 63 R64 Or R 65 The hydrogen atoms of the represented group can be ORed. 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atoms or COOR 21 replace.

[0408] R 83 With R 84 R 84 With R 85 and R 85 With R 86 They can form rings together separately.

[0409] * indicates the bonding site of the first molecular structure of the oxime compound (1).

[0410] R in equation (5) 81 R 21 R 22 R 23 R 24 R 61 R 62 R 63 R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms are the same as R in formula (1). 11 R 12 R 13 R 21 R 22 R 23 and R 24 The examples are the same.

[0411] R in equation (5) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 They can form a ring together with the nitrogen, carbon, or oxygen atoms they are attached to.

[0412] R in equation (5) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together.

[0413] As R in equation (5) 82 R 83 R 84 R 85 and R 86 The halogen atom represented, and the substituted R 81 R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms that contain hydrogen atoms include fluorine, chlorine, bromine, and iodine atoms.

[0414] There is no particular limitation on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (5), for example, it can be manufactured according to the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0415] Another example of a second molecular structure linked to the first molecular structure represented by equation (1) is the structure represented by equation (6) below.

[0416] The bonding sites indicated by "*" in formula (6) are directly bonded to the bonding sites indicated by "*" in formula (1). That is, when the second molecular structure is the structure represented by formula (6), the benzene ring with "-*" in formula (6) is directly bonded to the carbonyl group with "-*" in formula (1).

[0417] [Chemical Formula 16]

[0418]

[0419] In equation (6), there are 4 R's. 91 R 92 R 93 R 94 R 95 R 96 and R 97 Represent R independently 61 OR 61 SR 61 COR62 CONR 63 R 64 NR 65 COR 61 OCOR 61 COOR 62 SCOR 61 OCSR 61 COSR 62 CSOR 61 Hydroxyl group, nitro group, CN or halogen atom.

[0420] R 61 R 62 R 63 R 64 and R 65 Each of the following can be independently represented: a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, an aryl group with 6 to 30 carbon atoms, an arylalkyl group with 7 to 30 carbon atoms, or a heterocyclic group with 2 to 20 carbon atoms.

[0421] R 61 R 62 R 63 R 64 Or R 65 The hydrogen atoms of the represented group can be ORed. 21 COR 21 SR 21 NR 22 Ra 23 CONR 22 R 23 -NR 22 -OR 23 -N(COR) 22 )-OCOR 23 -C(=N-OR) 21 )-R 22 -C(=N-OCOR) 21 )-R 22 CN, halogen atoms or COOR 21 replace.

[0422] R 21 R 22 and R 23 It means the same as above.

[0423] R 92 With R 93 R 94 With R 95 R 95 With R 96 and R 96 With R 97 They can form rings together separately.

[0424] * indicates the bonding site of the first molecular structure of the oxime compound (1).

[0425] R in equation (6) 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of alkyl groups with 1 to 20 carbon atoms, aryl groups with 6 to 30 carbon atoms, aralkyl groups with 7 to 30 carbon atoms, and heterocyclic groups with 2 to 20 carbon atoms are the same as R in formula (1). 11 R 12 R 13 R 21 R 22 and R 23 The examples are the same.

[0426] R in equation (6) 22 With R 23 The ability to form a ring together refers to R 22 With R 23 They can form a ring together with the nitrogen, carbon, or oxygen atoms they are attached to.

[0427] R in equation (6) 22 With R 23 Examples of rings that can be formed together and Ra in equation (1) 12 With Ra 13 and Ra 22 With Ra 23 The same applies to examples of rings that can be formed together.

[0428] As R in equation (6) 91 R 92 R 93 R 94 R 95 R 96 and R 97 The halogen atom represented, and the substituted R 21 R 22 R 23 R 61 R 62 R 63 R 64 and R 65 Examples of halogen atoms that contain hydrogen atoms include fluorine, chlorine, bromine, and iodine atoms.

[0429] There are no particular limitations on the method of manufacturing the oxime compound (1) having the second molecular structure represented by formula (6), for example, it can be manufactured according to the methods described in International Publication No. 2017 / 051680 and International Publication No. 2020 / 004601.

[0430] The photopolymerization initiator (E) preferably contains an oxime compound (1). The photopolymerization initiator (E) may further contain other photopolymerization initiators besides the oxime compound (1), or it may not contain the oxime compound (1) and only contain other photopolymerization initiators besides the oxime compound (1).

[0431] Other photopolymerization initiators include oxime compounds other than oxime compounds (1), biimidazole compounds, triazine compounds, and acylphosphine compounds.

[0432] Other than oxime compound (1), examples of oxime compounds can be found that have a partial structure represented by the following formula (d1). * indicates a bonding site.

[0433] [Chemical Formula 17]

[0434]

[0435] Examples of oxime compounds having a partial structure represented by formula (d1) include, for example: N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, N-acetoxy-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethane-1-imine, N-acetoxy-1-[9-ethyl-6-{2-methyl-4-(3,3-dimethyl-2,4-dioxane-3-dioxane-3-yl]ethane-1-imine, etc. Compounds such as those described in Japanese Patent Application Publication No. 2011-132215, International Patent Publication No. 2008 / 78678, International Patent Publication No. 2008 / 78686, and International Patent Publication No. 2012 / 132558 may also be used. Commercially available products such as Irgacure OXE01 and OXE02 (manufactured by BASF) and N-1919 (manufactured by ADEKA) may also be used.

[0436] The oxime compound having the partial structure represented by formula (d1) is preferably selected from at least one of N-benzoyloxy-1-(4-phenylthiophenyl)butane-1-one-2-imine, N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine, and N-benzoyloxy-1-(4-phenylthiophenyl)-3-cyclopentylpropane-1-one-2-imine, more preferably N-benzoyloxy-1-(4-phenylthiophenyl)octane-1-one-2-imine.

[0437] Examples of biimidazole compounds include those represented by formula (d5).

[0438] [Chemical Formula 18]

[0439]

[0440] In formula (d5), R E ~R J This indicates an aryl group with 6 to 10 carbon atoms that can have substituents.

[0441] Examples of aryl groups with 6 to 10 carbon atoms include phenyl, tolueneyl, xyleneyl, ethylphenyl, and naphthyl, with phenyl being the most preferred.

[0442] Examples of substituents include halogen atoms and alkoxy groups having 1 to 4 carbon atoms. Examples of halogen atoms include fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms. Examples of alkoxy groups having 1 to 4 carbon atoms include methoxy, ethoxy, propoxy, and butoxy groups, with methoxy being preferred.

[0443] Examples of biimidazole compounds include: 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole, 2,2′-bis(2,3-dichlorophenyl)-4,4′,5,5′-tetraphenylbiimidazole (e.g., see Japanese Patent Application Publication No. 06-75372, Japanese Patent Application Publication No. 06-75373, etc.), 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetra(alkoxyphenyl)biimidazole, 2,2′-bis( 2-Chlorophenyl)-4,4′,5,5′-tetra(dialkoxyphenyl)biimidazole, 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetra(trialkoxyphenyl)biimidazole (e.g., see Japanese Patent Publication No. 48-38403, Japanese Patent Publication No. 62-174204, etc.), and imidazole compounds in which the phenyl group at the 4,4′, 5,5′-position is substituted with an alkoxycarbonyl group (e.g., see Japanese Patent Publication No. 7-10913, etc.). Among these, compounds represented by the following formulas or mixtures thereof are preferred.

[0444] [Chemical Formula 19]

[0445]

[0446] Examples of triazine compounds include: 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[ [2-(5-methylfuran-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(furan-2-yl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl)vinyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)vinyl]-1,3,5-triazine, etc. Among these, 2,4-bis(trichloromethyl)-6-piperyl-1,3,5-triazine is preferred.

[0447] Examples of acylphosphine compounds include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and (2,4,6-trimethylbenzoyl)diphenylphosphine oxide.

[0448] Other photopolymerization initiators besides oxime compound (1) may be used alone or in combination with two or more photopolymerization initiators. When using two or more photopolymerization initiators, they may be combined with other photopolymerization initiators besides oxime compounds (1), biimidazole compounds, triazine compounds, and acylphosphine compounds.

[0449] Other photopolymerization initiators include, for example: benzoin compounds such as benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; benzophenone compounds such as methyl benzoyl peroxide, 4-phenylbenzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3′,4,4′-tetra(tert-butylperoxycarbonyl)benzophenone, 2,4,6-trimethylbenzophenone, and 4,4′-bis(diethylamino)benzophenone; quinone compounds such as 9,10-phenanthroquinone, 2-ethylanthraquinone, and camphorquinone; and 10-butyl-2-chloroacridone, benzoin, methyl phenylglyoxylate, and titanium decene compounds.

[0450] When the resin composition contains a photopolymerization initiator (E), the content of the photopolymerization initiator (E) in the resin composition is preferably 0.1 to 300 parts by mass relative to 100 parts by mass of the photopolymerizable compound (D), more preferably 0.1 to 200 parts by mass. Furthermore, the content of the photopolymerization initiator (E) in the resin composition is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the combined amount of resin (C) and photopolymerizable compound (D), more preferably 1 to 20 parts by mass. If the content of the photopolymerization initiator (E) is within the above range, there is a tendency for the resin composition to become more sensitive, thus shortening the exposure time, and therefore a tendency to improve the productivity of the cured layer of the resin composition.

[0451] Regarding the content of oxime compound (1) in the photopolymerization initiator (E), from the viewpoint of increasing the intensity of emitted light from the resin layer (wavelength conversion film, etc.), it is preferably 30% to 100% by mass relative to the total amount of photopolymerization initiator (E), more preferably 50% to 100% by mass, even more preferably 80% to 100% by mass, even more preferably 90% to 100% by mass, particularly preferably 95% to 100% by mass, and most preferably 100% by mass.

[0452] [2-7] Photopolymerization initiator (E1)

[0453] The resin composition may further include a photopolymerization initiator (E) and one or more photopolymerization initiation aids (E1). The photopolymerization initiation aid (E1) is a compound or sensitizer used to promote the polymerization of a photopolymerizable compound (D) initiated by the photopolymerization initiator (E). Examples of photopolymerization initiation aids (E1) include amine compounds, alkoxyanthracene compounds, thioxanthone compounds, and carboxylic acid compounds.

[0454] Examples of the aforementioned amine compounds include: triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-ethylhexyl 4-dimethylaminobenzoate, N,N-dimethyl-p-toluidine, 4,4′-bis(dimethylamino)benzophenone (commonly known as michalcone), 4,4′-bis(diethylamino)benzophenone, 4,4′-bis(ethylmethylamino)benzophenone, etc., with 4,4′-bis(diethylamino)benzophenone being preferred. Commercially available products such as EAB-F (manufactured by Hodogaya Chemical Industry Co., Ltd.) may also be used.

[0455] Examples of alkoxyanthracene compounds include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 9,10-dibutoxyanthracene, 2-ethyl-9,10-dibutoxyanthracene, etc.

[0456] Examples of thioxanthone compounds include: 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, etc.

[0457] Examples of carboxylic acid compounds include: phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, naphthioacetic acid, N-naphthylglycine, naphthoxyacetic acid, etc.

[0458] When the resin composition contains a photopolymerization initiator (E1), the content of the photopolymerization initiator (E1) in the resin composition is preferably 0.1 to 300 parts by mass relative to 100 parts by mass of the photopolymerizable compound (D), more preferably 0.1 to 200 parts by mass. Furthermore, the content of the photopolymerization initiator (E1) in the resin composition is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the total amount of resin (C) and photopolymerizable compound (D), more preferably 1 to 20 parts by mass. If the content of the photopolymerization initiator (E1) is within the above range, further high sensitivity of the resin composition can be achieved.

[0459] [2-8] Solvent (F)

[0460] The resin composition may contain one or more solvents (F). The solvent (F) is not particularly limited as long as it dissolves the resin (C), and solvents commonly used in the field can be used. Examples include: ester solvents (solvents containing -COO- but not -O- in the molecule), ether solvents (solvents containing -O- but not -COO- in the molecule), ether ester solvents (solvents containing both -COO- and -O- in the molecule), ketone solvents (solvents containing -CO- but not -COO- in the molecule), alcohol solvents (solvents containing OH in the molecule but not -O-, -CO-, and -COO-), aromatic hydrocarbon solvents, amide solvents, dimethyl sulfoxide, etc.

[0461] When the resin composition further contains a photopolymerizable compound (D) and a photopolymerization initiator (E), the solvent (F) is preferably a solvent that dissolves the photopolymerizable compound (D) and the photopolymerization initiator (E).

[0462] Examples of ester solvents include: methyl lactate, ethyl lactate, n-butyl lactate, methyl 2-hydroxyisobutyrate, ethyl acetate, n-butyl acetate, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, isopropyl butyrate, ethyl butyrate, n-butyl butyrate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, cyclohexyl acetate (cyclohexyl acetate, cyclohexyl acetate), and γ-butyrolactone.

[0463] Examples of ether solvents include: ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, 3-methoxy-1-butanol, 3-methoxy-3-methylbutanol, tetrahydrofuran, tetrahydropyran, 1,4-dioxane, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, anisole, phenethyl ether, and methyl anisole, etc.

[0464] Examples of ether ester solvents include: methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, ethyl 2-methoxy-2-methylpropionate, ethyl 3-methoxybutylacetate, 3-methyl-3-methoxybutylacetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, etc.

[0465] Examples of ketone solvents include: 4-hydroxy-4-methyl-2-pentanone, acetone, 2-butanone, 2-heptanone, 3-heptanone, 4-heptanone, 4-methyl-2-pentanone, cyclopentanone, cyclohexanone, and isophorone.

[0466] Examples of alcohol solvents include methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, and glycerol.

[0467] Examples of aromatic hydrocarbon solvents include benzene, toluene, xylene, and mesitylene.

[0468] Examples of amide solvents include N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0469] As solvent (F), preferably propylene glycol monomethyl ether acetate, ethyl lactate, propylene glycol monomethyl ether, ethyl 3-ethoxypropionate, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, 4-hydroxy-4-methyl-2-pentanone, cyclohexanol acetate, toluene, or a mixture of two or more of these, more preferably containing propylene glycol monomethyl ether acetate.

[0470] When the solvent (F) contains propylene glycol monomethyl ether acetate, the content of propylene glycol monomethyl ether acetate in the solvent (F) is preferably 30% by mass or more, more preferably 40% by mass or more, even more preferably 50% by mass or more, and may also be 60% by mass or more, 70% by mass or more, 80% by mass or more, or 90% by mass or more.

[0471] Solvent (F) is a component other than the solid components of the resin composition. For example, solvents contained in light scattering agents (A), quantum dots (B), resins (C), etc. are also included in solvent (F).

[0472] The solvent (F) content in the resin composition is the ratio of the total mass of all solvents contained in the composition to the total mass of the composition, and is, for example, 40% to 95% by mass, preferably 55% to 90% by mass, relative to the total mass of the resin composition. In other words, the solid content of the resin composition is preferably 5% to 60% by mass, more preferably 10% to 45% by mass. If the solvent (F) content is within the above range, the flatness of the resin layer becomes better, and there is a tendency to easily form a resin layer of appropriate film thickness.

[0473] [2-9] Antioxidants (G)

[0474] The resin composition may further contain one or more antioxidants (G).

[0475] As an antioxidant (G), there are no particular limitations if it is an antioxidant commonly used in industry, such as phenolic antioxidants, phosphorus antioxidants, phosphorus / phenolic compound antioxidants, and sulfur antioxidants.

[0476] Phosphorus / phenol composite antioxidants can be compounds having one or more phosphorus atoms and phenol atoms in their molecules. From the viewpoint of the developability of the resin layer (wavelength conversion film, etc.) and the intensity of emitted light, antioxidant (G) is preferably a phosphorus / phenol composite antioxidant.

[0477] Examples of phenolic antioxidants include: Irganox (registered trademark) 1010 (Irganox 1010: pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Corporation), the related series 1076 (Irganox 1076: octadecyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF Corporation), the related series 1330 (Irganox 1330: 3,3′,3″,5,5′,5″-hexa-tert-butyl-a,a′,a″-(trimethylbenzene-2,4,6-triyl)tri-p-cresol, manufactured by BASF Corporation), and the related series 3114 (Irganox 1010: pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF Corporation), and 3114 (Irganox 1010: pentaerythritol tetrakis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, manufactured by BASF Corporation). 3114: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation; related products include 3790 (Irganox 3790: 1,3,5-tris((4-tert-butyl-3-hydroxy-2,6-dimethyl)methyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, manufactured by BASF Corporation); related products include 1035 (Irganox 1035: thiodiethylidene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Corporation); and 1135 (Irganox 1035: thiodiethylidene bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], manufactured by BASF Corporation); and related products include 1135 (Irganox 1035). 1135: 3,5-bis(1,1-dimethylethyl)-4-hydroxy-C7-C9 alkyl ester of phenylpropionic acid, manufactured by BASF Corporation; related products include 1520L (Irganox 1520L: 4,6-bis(octylthiomethyl)-o-cresol, manufactured by BASF Corporation); 3125 (Irganox 3125, manufactured by BASF Corporation); 565 (Irganox 565: 2,4-bis(n-octylthio)-6-(4-hydroxy-3′,5′-di-tert-butylphenylamino)-1,3,5-triazine, manufactured by BASF Corporation); and Adekastab (registered trademark) AO-80 (Adekastab). AO-80: 3,9-bis(2-(3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy)-1,1-dimethylethyl)-2,4,8,10-tetraoxellaspiro(5,5)deca-ane, manufactured by ADEKA Corporation), Sumilizer (registered trademark) BHT, GA-80 of the same series, GS of the same series (all manufactured by Sumitomo Chemical Co., Ltd.), Cyanox (registered trademark) 1790 (Cyanox 1790, manufactured by Cytec Corporation), Vitamin E (manufactured by Eisai Co., Ltd.), etc.

[0478] Examples of phosphorus-based antioxidants include: Irgafos 168 (trademarked) (Irgafos 168: tris(2,4-di-tert-butylphenyl) phosphite, manufactured by BASF Corporation), Irgafos 12 (Irgafos 12: tris[2-[[2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxane-6-yl]oxy]ethyl]amine, manufactured by BASF Corporation), Irgafos 38 (Irgafos 38: bis(2,4-bis(1,1-dimethylethyl)-6-methylphenyl) ethyl phosphite, manufactured by BASF Corporation), Adekastab 329K (trademarked) 329K, PEP36, and PEP-8 (all manufactured by ADEKA Corporation), and Sandstab P-EPQ (Clariant). (manufactured by CO., LTD.), Weston (registered trademark) 618, 619G of the same series (all manufactured by GE), Ultranox 626 (manufactured by GE), etc.

[0479] Examples of phosphorus / phenol complex antioxidants include Sumilizer (a registered trademark) GP (6-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1.3.2]dioxaphosphazenecycloheptane) (manufactured by Sumitomo Chemical Co., Ltd.).

[0480] Examples of sulfur-based antioxidants include dialkyl thiodipropionate compounds such as dilaurate thiodipropionate, dimyristyl thiodipropionate, or distearate thiodipropionate, and β-alkyl mercaptopropionate compounds of polyols such as tetra[methylene(3-dodecylthio)propionate]methane.

[0481] When the resin composition contains an antioxidant (G), the content of antioxidant (G) in the resin composition is, for example, 1 to 50 parts by mass relative to 100 parts by mass of resin (C), preferably 5 to 40 parts by mass from the viewpoint of heat resistance of the resin layer, more preferably 7 to 30 parts by mass, and even more preferably 11 to 25 parts by mass.

[0482] [2-10] Leveling agent (H)

[0483] The resin composition may further contain one or more leveling agents (H). The contact angle of the resin layer with respect to the solvent can be adjusted by the type and amount of leveling agent (H) and the dispersion state in the resin layer.

[0484] Examples of leveling agents (H) include silicone-based surfactants, fluorinated surfactants, and silicone-based surfactants containing fluorine atoms. They may also have polymerizable groups on their side chains. From the viewpoint of the developability of the resin layer (wavelength conversion film, etc.) and the intensity of emitted light, fluorinated surfactants are preferred as leveling agents (H).

[0485] As silicone-based surfactants, examples include surfactants with intramolecular siloxane bonds. Specific examples include: Toray Silicone DC3PA, SH7PA, DC11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH8400 (trade name: Toray Dow Corning Corporation), KP321, KP322, KP323, KP324, KP326, KP340, KP341 (manufactured by Shin-Etsu Chemical Industry Co., Ltd.), TSF400, TSF401, TSF410, TSF4300, TSF4440, TSF4445, TSF4446, TSF4452, and TSF4460 (manufactured by MomentivePerformance Materials Japan Co., Ltd.), etc.

[0486] Examples of fluorinated surfactants include surfactants with intramolecular fluorocarbon chains. Specific examples include: Fluorad (registered trademark) FC430, FC431 (manufactured by Sumitomo 3M Corporation), Megafac (registered trademark) F142D, F171, F172, F173, F177, F183, F554, F575, R30, and RS-718-K (manufactured by DIC Corporation), Eftop (registered trademark) EF301, EF303, EF351, and EF352 (manufactured by Mitsubishi Materials Electronics & Chemicals Co., Ltd.), Surflon (registered trademark) S381, S382, SC101, and SC105 (manufactured by Asahi Glass Co., Ltd.), and E5844 (manufactured by Daikin Precision Chemical Research Institute Co., Ltd.), etc.

[0487] Examples of silicone surfactants containing fluorine atoms include surfactants with siloxane bonds and fluorocarbon chains within their molecules. Specific examples include Megafac (registered trademark) R08, BL20, F475, F477, and F443 (manufactured by DIC Corporation).

[0488] When the resin composition contains a leveling agent (H), the content of the leveling agent (H) in the resin composition relative to the total amount of the resin composition is, for example, 0.001% to 1.0% by mass, preferably 0.005% to 0.75% by mass, more preferably 0.01% to 0.5% by mass, and even more preferably 0.05% to 0.5% by mass. If the content of the leveling agent (H) is within the above range, the flatness of the resin layer can be better.

[0489] It should be noted that the resin composition may further include, as needed, additives known in the art such as polymerization inhibitors, fillers, other polymeric compounds, adhesion promoters, light stabilizers, and chain transfer agents.

[0490] [3] Method for manufacturing resin composition

[0491] The resin composition can be manufactured by a process comprising a mixed light scattering agent (A) and a resin (C), and other components to be used as desired. The method of manufacturing the resin composition may further include a step of preparing the resin (C).

[0492] [4] Method for manufacturing resin layer

[0493] The resin layer can be formed from a resin composition. For example, the resin layer can be formed by a method comprising the steps of applying a resin composition onto a substrate layer and, as needed, a drying step. The resin composition is preferably a curable resin composition that, in addition to containing a light scattering agent (A) and a resin (C), further contains a photopolymerizable compound (D) and a photopolymerization initiator (E).

[0494] The resin layer is preferably a cured layer formed from a curable resin composition. The resin layer as a cured layer can be formed by a method comprising the steps of applying a curable resin composition onto a substrate layer, performing a drying step as needed, and curing it by the action of light and, as needed, further heat.

[0495] The cured layer can be formed on the entire surface of the substrate layer, or it can be formed as a cured pattern on a part of the substrate layer.

[0496] Methods for forming a cured layer on a portion of a substrate layer include photolithography, inkjet printing, and printing. Among these, photolithography is preferred. Photolithography involves coating a curable resin composition onto a substrate layer, allowing it to dry to form a composition layer, and then exposing and developing the composition layer using a photomask.

[0497] As a method for forming a cured layer on the entire surface of a substrate layer, the following methods can be cited: applying a curable resin composition onto a substrate layer, drying it to form a composition layer, heating the composition layer and / or exposing the entire composition layer to light.

[0498] The formation of a curing pattern using photolithography can be carried out using known or conventional apparatus and conditions. For example, it can be produced in the following manner.

[0499] First, a curable resin composition is coated onto a substrate and then subjected to heat drying (pre-baking) and / or vacuum drying to remove volatile components such as solvents, thereby obtaining a composition layer. Examples of coating methods include spin coating, slot coating, and slot spin coating.

[0500] The preferred temperature for heating and drying is 30°C to 120°C, more preferably 50°C to 110°C. The preferred heating time is 10 seconds to 60 minutes, more preferably 30 seconds to 30 minutes.

[0501] When performing vacuum drying, it is preferable to carry out the process at a pressure of 50 Pa to 150 Pa and a temperature range of 20°C to 25°C.

[0502] The film thickness of the composition layer is not particularly limited, and can be appropriately selected according to the film thickness of the target curing pattern, for example, 1μm to 20μm, preferably 3μm to 18μm, more preferably 5μm to 14μm, and even more preferably 7μm to 12μm.

[0503] Next, the composition layer is exposed via a photomask used to form the target curing pattern. The shape of the pattern on the photomask is not particularly limited.

[0504] The preferred light source for exposure is one that produces light with wavelengths between 250 nm and 450 nm. For example, light around 436 nm, 408 nm, or 365 nm can be selectively extracted from the light of the photopolymerization initiator (E) using a bandpass filter, based on the absorption wavelength of that wavelength. Specific examples of light sources include mercury lamps, light-emitting diodes (LEDs), metal halide lamps, and halogen lamps.

[0505] To ensure uniform illumination of the exposed surface with parallel light, or to accurately align the photomask with the substrate to which the composition layer is formed, exposure apparatus such as a mask aligner and a stepper is preferably used. The exposed composition layer is then cured by polymerization of photopolymerizable compounds (D) contained within it.

[0506] Developing is performed by contacting the exposed composition layer with a developing solution, thereby dissolving and removing the unexposed portions of the composition layer in the developing solution to obtain a cured pattern. Examples of developing solutions include aqueous solutions of alkaline compounds such as potassium hydroxide, sodium bicarbonate, sodium carbonate, and tetramethylammonium hydroxide, or organic solvents. The concentration of the alkaline compound in the aqueous solution is preferably 0.01% to 10% by mass, more preferably 0.03% to 5% by mass. Examples of organic solvents include those similar to the solvent (F) described above. The developing solution may contain a surfactant.

[0507] The development method can be any of the following: liquid coating, immersion, or spraying. Furthermore, during development, the substrate can be tilted at any angle.

[0508] Preferably, the cured pattern obtained by development is further heated (post-baked). The heating temperature is preferably 150°C to 250°C, more preferably 160°C to 235°C. The heating time is preferably 1 minute to 120 minutes, more preferably 10 minutes to 60 minutes. By heating after development, unreacted photopolymerizable compounds (D) contained in the cured pattern can be polymerized, thus obtaining a cured pattern with better chemical resistance.

[0509] [5] Substrate layer

[0510] Examples of substrate layers include glass substrates, film substrates, and silicon wafer substrates. Examples of resins constituting the membrane substrate include: polyolefin resins such as chain polyolefin resins (polyethylene resins, polypropylene resins, etc.) and cyclic polyolefin resins such as norbornene resins; cellulose resins such as triacetyl cellulose and diacetyl cellulose; polyester resins such as polyethylene terephthalate and polybutylene terephthalate; polyvinyl alcohol resins; polycarbonate resins; (meth)acrylic resins such as methyl methacrylate resins; polystyrene resins; polyvinyl chloride resins; acrylonitrile-butadiene-styrene resins; acrylonitrile-styrene resins; polyvinyl acetate resins; polyvinylidene chloride resins; polyamide resins; polyacetal resins; modified polyphenylene ether resins; polysulfone resins; polyethersulfone resins; polyetherketone resins; polyphenylene sulfide resins; polyphenylene oxide resins; polyarylate resins; polyamide-imide resins; and thermoplastic resins such as polyimide resins.

[0511] In addition, the substrate layer can be a laminated substrate or a laminated film. For example, it can be a glass substrate or a film substrate with functional layers such as a hard coating layer and a primer layer.

[0512] The substrate layer can also undergo pretreatment to adjust the contact angle of its surface. Examples of pretreatment include solvent cleaning with alcohol or acetone, acid treatment, alkali treatment, plasma treatment, and corona treatment. By selecting an appropriate pretreatment for the substrate layer to be laminated with the resin layer, the formation of defects in the resin layer can be prevented, or the adhesion of the resin layer to the substrate layer can be improved, compared to an untreated substrate layer.

[0513] The thickness of the substrate layer is typically 5μm to 300μm, preferably 20μm to 200μm.

[0514] <Display Device>

[0515] As described above, since the resin layer 20 containing quantum dots (B) has the function of converting the wavelength of the irradiated light, it can be used as a color conversion layer (wavelength conversion film) for a display device. Examples of such display devices include those described in Japanese Patent Application Publication Nos. 2006-309219, 2006-310303, 2013-15812, 2009-251129, and 2014-2363. Specifically, examples of display devices include liquid crystal displays, organic EL displays, and inorganic EL displays.

[0516] Example

[0517] The present invention will now be described in more detail through examples. Unless otherwise specified, “%” and “parts” in the examples refer to mass % and mass parts, respectively.

[0518] [Determination of the contact angle θs (25°C) of the substrate layer relative to diiodomethane]

[0519] At 25°C, 1.0 μL of diiodomethane was dropped onto the surface of the resin layer in the substrate layer. The contact angle of the substrate layer relative to the diiodomethane was measured using a contact angle measuring device (DM700, manufactured by Kyowa Interface Science Co., Ltd.) by the θ / 2 method.

[0520] [Determination of the contact angle θr (25°C) of the resin layer relative to diiodomethane]

[0521] At 25°C, 1.0 μL of diiodomethane was dropped onto the outer surface of the resin layer (the surface opposite to the substrate layer) in the obtained laminate. The contact angle of the resin layer relative to the diiodomethane was measured using a contact angle measuring device (DM700, Kyowa Interface Science Co., Ltd.) by the 0 / 2 method.

[0522] [Evaluation of defects in the resin layer on the substrate]

[0523] A laminate is placed on a black plate with the substrate layer side in contact with the black plate. Fluorescent light is shone onto the laminate from above, and an image (photograph) of the laminate is obtained from the resin layer side. At this time, the defective areas of the resin layer appear black because there is no resin layer on the substrate layer or the resin layer is relatively extremely thin. On the other hand, the good areas without defects exhibit a color distinctly different from black. Using image processing software (ImageJ), the area ratio of the areas exhibiting colors other than black is calculated when the sum of the areas exhibiting black and the areas exhibiting colors other than black is set to 100%, and the non-defective areas of the resin layer are evaluated according to the following evaluation criteria.

[0524] A: The above area ratio is over 80%.

[0525] B: The above area ratio is 50% or more but less than 80%.

[0526] C: The above area ratio is less than 50%.

[0527] [Weight-average molecular weight of the resin (converted from standard polystyrene)]

[0528] The weight-average molecular weight (Mw) of the resin was determined using the GPC method under the following conditions.

[0529] Device: K2479 (manufactured by Shimadzu Corporation)

[0530] Column: SHIMADZU Shim-pack GPC-80M

[0531] Column temperature: 40℃

[0532] Solvent: Tetrahydrofuran

[0533] Flow rate: 1.0 mL / min

[0534] Detector: RI

[0535] Calibration standard materials: TSK STANDARD POLYSTYRENE F-40, F-4, F-288, A-2500, A-500 (manufactured by Tosoh Corporation)

[0536] [Acid value of resin]

[0537] Accurately weigh 3g of resin solution and dissolve it in a mixed solvent of 90g acetone and 10g water. Use a 0.1% KOH aqueous solution as the titrant and determine the acid value of the resin solution using an automatic titration device (manufactured by Hiranuma Sangyo Co., Ltd., trade name: COM-555). Calculate the acid value (AV) of each 1g of solid component based on the acid value of the solution and the solid component of the solution.

[0538] [Solid components of the resin solution]

[0539] Approximately 1 g of resin solution was measured in an aluminum cup, dried at 180°C for 1 hour, and its mass was determined. The solid content (mass %) of the resin solution was calculated based on the amount of mass reduction.

[0540] (Manufacturing Example 1: Preparation of Resin (C-1) Solution)

[0541] In a flask equipped with a stirrer, a reflux condenser with a thermometer, a dropping funnel, and a nitrogen inlet tube, 110 parts of propylene glycol monomethyl ether acetate (hereinafter referred to as "PGMEA") were added, and the mixture was stirred while being substituted with nitrogen, and the temperature was raised to 80°C. 25 parts of dicyclopentyl methacrylate, 26 parts of methyl methacrylate, 16 parts of methacrylic acid, and 11 parts of 2,2′-azobis(2,4-dimethylpentanilide) were dissolved in 110 parts of PGMEA to obtain a solution. This solution was added dropwise to the flask through the dropping funnel, and the mixture was stirred at 80°C for 3 hours.

[0542] Next, 16 parts of glycidyl methacrylate, 0.4 parts of 2,2′-methylenebis(4-methyl-6-tert-butylphenol), and 0.8 parts of triphenylphosphine were added to a flask, heated to 110°C, and stirred for 8 hours. This allowed the carboxylic acid and epoxy groups in the polymer to react, introducing polymerizable unsaturated bonds. Then, 17 parts of 1,2,3,6-tetrahydrophthalic anhydride were added, and the reaction continued for 3 hours, introducing carboxylic acid groups into the side chains. The reaction solution was cooled to room temperature to obtain a resin (C-1) solution.

[0543] The standard polystyrene equivalent weight-average molecular weight of resin (C-1) is 7600, the molecular weight distribution is 2.1, the acid value is 100 mg KOH / g, and the solid content in the resin (C-1) solution is 40% by mass.

[0544] (Manufacturing Example 2: Preparation of Resin (C-2) Solution)

[0545] Except that the amount of 2,2′-azobis(2,4-dimethylpentanonitrile) used was 14 parts, the resin (C-2) solution was obtained in the same manner as in Manufacturing Example 1.

[0546] The standard polystyrene equivalent weight-average molecular weight of resin (C-2) is 5200, the molecular weight distribution is 2.2, the acid value is 100 mg KOH / g, and the solid content in the resin (C-2) solution is 40% by mass.

[0547] (Manufacturing Example 3: Preparation of a dispersion of light scattering agent (A-1))

[0548] To 70 parts of titanium dioxide nanoparticles, 3 parts of DISPERBYK21116 (manufactured by BYK-Chemie Japan) were added, and PGMEA was added in a total of 100 parts. The mixture was then stirred using a coating shaker until fully dispersed to obtain a dispersion of light scattering agent (A-1) (73% solid content).

[0549] (Manufacturing Example 4: Preparation of a dispersion of quantum dots (B-1))

[0550] A toluene dispersion of InP / ZnSeS quantum dots coordinated with oleic acid as a ligand was prepared. The dispersion was subjected to vacuum distillation to remove toluene. 70 parts of cyclohexyl acetate were added relative to 30 parts of solids to obtain a dispersion of quantum dots (B-1) (30% solids).

[0551] (Example 5: Preparation of a quantum dot dispersion containing organic ligands (X-1) and (X-2))

[0552] A specified amount of organic ligand (X-1) was added to the dispersion of quantum dots (B-1) obtained in Manufacturing Example 4, and the mixture was stirred at 80°C for 2 hours to obtain a quantum dot dispersion containing organic ligand (X-1) and organic ligand (X-2).

[0553] The organic ligand (X-2) refers to the oleic acid present in the InP / ZnSeS quantum dots coordinated with oleic acid used in Manufacturing Example 4 above.

[0554] (Manufacturing Examples 6-11: Preparation of Resin Compositions 6-11)

[0555] For manufacturing examples 6, 7, 8, 10 and 11, a curable resin composition was prepared by mixing a specified amount of resin (C-1) solution or resin (C-2) solution obtained in manufacturing examples 1 and 2, a dispersion of light scattering agent (A-1) obtained in manufacturing example 3, and other components shown in Table 1.

[0556] For manufacturing example 9, a curable resin composition was prepared by mixing a specified amount of the resin (C-1) solution obtained in manufacturing example 1, the dispersion of the light scattering agent (A-1) obtained in manufacturing example 3, the quantum dot dispersion obtained in manufacturing example 5, and other components shown in Table 1.

[0557] The contents of each component in the resin composition, determined by the amount added, are shown in Table 1. In Table 1, the contents of components other than solvent (F) are converted from solid components (unit: parts by mass). The unit of solvent (F) content is parts by mass. For example, quantum dots (B-1) are incorporated as a dispersion of quantum dots (B-1) in the preparation of the resin composition, but the contents shown in Table 1 are the amounts of quantum dots (B-1) themselves contained in the solution. The solvent (F) in Table 1 includes the dispersion used in the preparation of the resin composition and the solvent contained in the solution.

[0558] Regarding the content of organic ligand (X-2) in the resin composition shown in Table 1, the concentration of organic ligand (X-2) in the dispersion of quantum dots (B-1) obtained in Manufacturing Example 4 was determined according to the method described in [a] below, and calculated based on this.

[0559] [a] Determination of the concentration of organic ligand (X-2)

[0560] The dispersion of quantum dots (B-1) was vacuum dried at 150°C to remove the solvent. Then, for the remaining solid components, the weight change was measured using a thermogravimetric analyzer (TGDTA6200) at a heating rate of 5°C / min from 50°C to 550°C. The weight change from 50°C to 500°C was taken as the weight of the organic ligand (X-2), and the concentration of the organic ligand (X-2) in the dispersion of quantum dots (B-1) was calculated.

[0561] [Table 1]

[0562]

[0563] The abbreviations of the components shown in Table 1 are detailed below.

[0564] [1] Organic ligand (X-1): 3-mercaptopropionic acid (manufactured by Tokyo Chemical Industry Co., Ltd., 100% solid content)

[0565] [2] Organic ligand (X-2): Oleic acid

[0566] [3] Organic ligand (X-3): Carboxyl-modified silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., "X-22-3701E")

[0567] [4] Photopolymerizable compound (D-1): M-510 (polyalkali modified acrylate, manufactured by Toa Synthetic Co., Ltd., 100% solids)

[0568] [5] Photopolymerizable compound (D-2): A-9550 (dipentaerythritol polyacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd., 100% solids)

[0569] [6] Photopolymerization initiator (E-1): A compound represented by the following formula. Manufactured by the method described in Japanese Patent Application Publication No. 2011-132215 (100% solid content).

[0570] [Chemical Formula 20]

[0571]

[0572] [7] Solvent (F-1): PGMEA (propylene glycol monomethyl ether acetate)

[0573] [8] Solvent (F-2): Cyclohexyl acetate

[0574] [9] Antioxidant (G-1): Sumilizer-GP (phosphorus / phenol complex antioxidant, manufactured by Sumitomo Chemical Co., Ltd., 100% solid content)

[0575]

[10] Leveling agent (H-1): F-554 (fluorine-based leveling agent, manufactured by DIC, 100% solids)

[0576] <Examples 1-8, Comparative Example 1, Reference Example 1>

[0577] On the substrate layer shown in Table 2, the resin composition shown in Table 2 was applied by spin coating to a film thickness of 10 μm, and then pre-baked at 100°C for 3 minutes to form a cured composition layer. Relative to the substrate layer on which this cured composition layer was formed, an exposure machine (TME-150RSK; manufactured by Topcon Co., Ltd.) was used in an atmospheric environment at 80 mJ / cm². 2 The substrate is exposed to light at an exposure level (365nm reference), developed, and then baked at 100°C for 60 minutes to obtain a laminate containing a substrate layer and a resin layer (cured layer).

[0578] In the substrate layers shown in Table 2, No. 1 is a glass plate (Eagle XG; manufactured by Corning). The glass plate used is one that has been wiped with Bemcot (manufactured by Asahi Kasei Corporation) after being impregnated with acetone (manufactured by Fujifilm and Kojun Pharmaceutical Co., Ltd.), and then dried with an air gun. No. 2 to No. 4 are respectively a (meth)acrylic resin film with an acrylic hard coating, a cyclic polyolefin resin film with an acrylic hard coating, and a (meth)acrylic resin film with an acrylic hard coating, with a resin composition coated on the hard coating side.

[0579] In addition, No. 5 is a glass plate obtained by surface activation through atmospheric pressure plasma treatment of the glass plate (Eagle XG; manufactured by Corning).

[0580] Table 2 shows the measurement results of contact angles θs and θr, the contact angle difference Δθ(|θs-θr|), and the evaluation results of defects in the resin layer on the substrate (“Defect Evaluation” in Table 2). The values ​​in parentheses in “Defect Evaluation” in Table 2 are the values ​​of the above area ratio (%).

[0581] [Table 2]

[0582]

[0583] Symbol Explanation

[0584] One-layer laminate, 10-layer substrate, 20-layer resin.

Claims

1. A laminate comprising a substrate layer and a resin layer disposed on at least one surface of the substrate layer, The resin layer contains a light-scattering agent (A). Furthermore, the resin layer is formed from a resin composition comprising a leveling agent (H), and the leveling agent (H) in the resin composition contains 0.001% to 1.0% by mass relative to the total amount of the resin composition. When the contact angle of the substrate layer relative to diiodomethane is set to θs and the contact angle of the resin layer relative to diiodomethane is set to θr, the following equation is satisfied: ,in, The units for contact angles θs and θr are °. The contact angle θs is 30° to 60°, and the contact angle θr is 30° to 60°.

2. The laminate according to claim 1, further satisfying the following formula: 。 3. The laminate according to claim 1 or 2, wherein, The resin layer further comprises quantum dots (B).

4. The laminate according to claim 1 or 2, wherein, The resin layer is a cured layer of a resin composition comprising resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E).

5. The laminate according to claim 1 or 2, wherein, The light scattering agent (A) contains TiO2 particles.

6. A display device comprising the laminate according to any one of claims 1 to 5.

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