Metallic adapter system, related methods and products

Abstract

A metal joining system includes a power source and a metal joiner. The metal joiner includes a cleaning head, a cutting head, a joining head, and a seam finisher, each of which is communicatively coupled to the power source. The cutting head and the cleaning head are configured to direct a first laser beam to prepare a joining area, and the joining head is configured to direct a second laser beam to form a seam in the joining area. A method of joining metal bases includes forming a joining area in abutting metal bases, directing the first laser beam onto the joining area in a seam preparation phase, and directing the second laser beam onto the joining area to form a weld. A product of a metal joiner, namely a weld, the product removes a portion of weld metal at a weld start area and a weld crater area.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 705,580, filed on July 6, 2020, and entitled “Metal Bonder Systems, Related Methods, and Products,” the contents of which are hereby incorporated by reference in their entirety. Technical Field

[0003] The present application relates to metalworking and, more particularly, to systems and methods for joining metal substrates together. Background Art

[0004] Metalworking can sometimes include joining two (or more) metal substrates together using a seam. As an example, a joining process can be used to join two coils of metal sheets together. This type of joining process is sometimes a mechanical joining process in continuous aluminum coil processing, which includes overlapping the sheets, partial sheet cutting, bending, and placing a metal insert between the adjacent edges of the two metal sheets to join the sheets together. Using this type of process, it may be difficult to join thin-gauge sheets together due to the size of the metal insert or its strength without the insert. It may also be difficult to join thicker-gauge sheets together because the insert may fall off during subsequent processing. For example, the cut edge of the insert may stick to nearby rollers, which in turn may have a negative impact on the surface quality of the metal sheets. When the mechanical seam undergoes a chemical process for surface treatment, any hidden chemical residues remaining in the gap of the mechanical seam may have a negative impact on the surface quality of the sheets. In addition, the metal insert increases the metal thickness at the seam, which may require that the equipment used to process the seam downstream be subsequently adjusted to account for the increased metal thickness. For example, when a seam having increasing thickness is passed through the tension leveling rollers, the tension leveling rollers may need to be raised to allow the thicker seam to pass through the tension leveler and then be closed after the seam has passed through the tension leveler. In this case, the length of the metal substrate that was not processed by the tension leveling rollers (because the tension leveling rollers were raised) will need to be cut off to ensure that the required quality of the metal substrate is met. Summary of the Invention

[0005] The embodiments covered by this patent are defined by the following claims, not by this Summary. This Summary is a high-level overview of various embodiments and introduces some concepts that are further described in the Detailed Description section below. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used alone to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of this patent, any or all of the drawings, and each claim.

[0006] According to some embodiments, a metal joiner system includes a power source and a metal joiner. The metal joiner includes a cutting head and a joining head connected to the cutting head such that the joining head moves with the cutting head. The cutting head is communicatively coupled to the power source and prepares a joining area for forming a seam by directing a first laser beam from the metal joiner onto the joining area. The joining head is communicatively coupled to the power source and forms a seam in the joining area by directing a second laser beam from the metal joiner onto the joining area. In some embodiments, at least one characteristic of the second laser beam is different than the first laser beam.

[0007] In some embodiments, the metal joiner can also include a cleaning head and / or a seam finisher. The cleaning head can be positioned on a bottom of the metal substrate and can remove contaminants from the bottom, including but not limited to oil, lubricant, dirt, grime, etc. In certain examples, the cutting head is positioned on a top of the metal substrate. In various examples, the cleaning head and the cutting head can operate or function separately to prepare the joining area. The seam finisher can be positioned to remove a portion of the weld metal at a start of the weld, a weld crater, and / or other weld defects.

[0008] According to certain embodiments, a metal joiner for a metal joiner system includes a cutting head and a joining head connected to the cutting head such that the joining head moves with the cutting head. The cutting head prepares a joining area for forming a seam by directing a first laser beam from the metal joiner onto the joining area. The joining head forms a seam in the joining area by directing a second laser beam from the metal joiner onto the joining area. In some examples, at least one characteristic of the second laser beam is different than the first laser beam.

[0009] In various embodiments, the metal joiner can also include a cleaning head and / or a seam finisher. In certain examples, a front cleaning head can be connected to both the cutting head and the trailing joining head and move at the same functional speed. In such embodiments, the cleaning head, the cutting head, and the joining head can function simultaneously at the same travel speed. In some embodiments, the cutting head with the front cleaning head attached prepares the joining area. The seam finisher can be positioned to remove a portion of the weld metal at a start of the weld, a weld crater, and / or other weld defects.

[0010] According to some embodiments, a metal joiner for a metal joiner system includes a cutting head that prepares a join region for forming a seam by directing a first laser beam from the metal joiner onto the join region. The metal joiner also includes a joining head that forms a seam in the join region by directing a second laser beam from the metal joiner onto the join region. In certain embodiments, at least one characteristic of the second laser beam is different than the first laser beam. In various examples, the metal joiner is capable of moving along a travel path during a metal joining process, and the joining head is joined to the cutting head such that the joining head is downstream of the cutting head along the travel path.

[0011] In certain embodiments, the metal joiner also includes a cleaning head that removes contaminants from a bottom of the metal base, including but not limited to oil, lubricant, dirt, grime, and the like. In some embodiments, the cutting head is positioned above a top of the metal base. In some aspects, the cleaning head can be a front piece and the cutting head can be a trailing piece, and the front cleaning head and the trailing cutting head can operate simultaneously at the same travel speed.

[0012] According to various embodiments, a method includes aligning an ending edge of a first metal base with a starting edge of a second metal base such that an edge surface of the ending edge abuts an edge surface of the starting edge. In certain embodiments, the alignment is optionally less than or equal to 10% of a thickness of the metal base. As a non-limiting example, a 2 mm thick metal base can have an alignment within 0.2 mm. In various embodiments, bottom surfaces of the first metal base and the second metal base are optionally substantially horizontally aligned (e.g., within 10% of a minimum specification) when aligned.

[0013] The aligned ending edge and starting edge together define a join region. The method includes preparing the join region for joining by directing a first laser beam onto the join region with a cutting head. The method also includes forming a weld seam by directing a second laser beam onto the join region with a joining head. At least one characteristic of the first laser beam is different than the second laser beam. Forming the weld seam joins the first metal base with the second metal base.

[0014] In some embodiments, the method can also include directing a cleaning process onto the join region with a cleaning head positioned on a bottom of the metal base. The method can also include preparing the join region for joining by directing a first laser beam from a cutting head positioned on a top of the metal base. The method can also include directing a seam finisher onto the join region to remove a portion of the weld metal at a weld seam start, a weld crater, and / or other weld defects.

[0015] According to some embodiments, a weld joint joins a first metal base to a second metal base. The weld joint includes a top weld joint surface and a bottom weld joint surface. In some examples, the top weld joint surface is recessed relative to a top surface of the first metal base and relative to a top surface of the second metal base, and the bottom weld joint surface is recessed relative to a bottom surface of the first metal base and relative to a bottom surface of the second metal base.

[0016] In various embodiments, the first metal base and the second metal base can have the same thickness or different thicknesses. In certain embodiments, a weld joint joins the first metal base to the second metal base. The weld joint includes a top weld joint surface and a bottom weld joint surface. In some examples, the top weld joint surface is thicker relative to a top surface of the first metal base and relative to a top surface of the second metal base, and the bottom weld joint surface is thicker relative to a bottom surface of the first metal base and relative to a bottom surface of the second metal base. The additional weld metal thickness beyond the top surface of the first metal base and the top of the second metal base can optionally be no greater than 0.2 mm and / or 10% of the thickness of both the first metal base and the second metal base. The additional weld metal thickness beyond the bottom surface of the first metal base and the bottom of the second metal base can optionally be no greater than 0.2 mm and / or 10% of the thickness of both the first metal base and the second metal base.

[0017] According to certain embodiments, a weld joint joins a first metal base to a second metal base. The weld joint includes a weld joint thickness, and the weld joint thickness transitions from a thickness of the first metal base to a thickness of the second metal base. In some embodiments, the weld joint thickness is optionally less than at least one of the thickness of the first metal base or the thickness of the second metal base.

[0018] In some embodiments, the first metal base and the second metal base have the same thickness or different thicknesses. In various embodiments, the weld joint thickness is optionally greater than one of the thickness of the first metal base or the thickness of the second metal base. In certain embodiments, a weld joint joins the first metal base to the second metal base regardless of whether they are the same gauge or different. In some examples, a portion of the weld metal is removed at a weld start, a weld crater, and / or other weld metal defect locations.

[0019] The various implementations described herein can include additional systems, methods, features, and advantages that can not be expressly disclosed herein but will be apparent from the detailed description and drawings. It is intended that all such additional systems, methods, features, and advantages be within the scope of the present disclosure and be protected by the claims appended hereto. BRIEF DESCRIPTION OF DRAWINGS

[0020] This description refers to the following drawings, in which like reference numerals are used in different views to indicate like or similar components.

[0021] Figure 1 A metal bonder system having a metal bonder with a cutting head and a bonding head is shown according to an embodiment.

[0022] Figure 2 Shows the process before the metal bonder bonding process Figure 1 Metal connector system.

[0023] Figure 3 shows the process during the preparation phase of the bonding process according to an embodiment Figure 1 Metal joiners for machining systems.

[0024] Figure 4 shows during the bonding phase of the bonding process according to an embodiment Figure 1 Metal connector.

[0025] Figure 5 Is based on the implementation plan Figure 1 A flow chart of a method for bonding metal substrates using a metal bonder system.

[0026] Figure 6 A metal bonder system is shown having a cleaning head, a holder, and a metal cutting head according to an embodiment.

[0027] Figure 7 Is based on the implementation plan Figure 6 A flow chart of a method for bonding metal substrates using a metal bonder system.

[0028] Figure 8 According to the implementation plan Figure 7 End view of the metal substrate during the input phase of the method.

[0029] Figure 9 According to the implementation plan Figure 7 During the stationary phase of the method Figure 6 End view of a metal coupler system.

[0030] Figure 10 According to the implementation plan Figure 7 During the joint preparation phase of the method Figure 6 Side view of a metal coupler system.

[0031] Figure 11 During the joint preparation phase according to the embodiment Figure 6 Side view of the cleaning head of the metal adapter system.

[0032] Figure 12 is a cleaning head according to an embodiment Figure 6 is a bottom view of the cleaning head of

[0033] Figure 13 is a method according to an embodiment of Figure 7 is a metal adapter system of Figure 6 is an end view of the metal adapter system of

[0034] Figure 14 is a method according to an embodiment of Figure 7 is a top view of the metal base during the seam forming phase of the method of

[0035] Figure 15 is a method according to an embodiment of Figure 7 is a metal adapter system of Figure 6 is an end view of the metal adapter system of

[0036] Figure 16 is a method according to an embodiment of Figure 6 is an end view of a weld formed by the metal adapter system of

[0037] Figure 17 is a method according to an embodiment of Figure 6 is an end view of a weld formed by the metal adapter system of

[0038] Figure 18 is a method according to an embodiment of Figure 7 is a side view of the metal adapter system of Figure 6

[0039] Figure 19 is a method according to an embodiment of Figure 7 is a top view of the metal base during the weld finishing phase of the method of

[0040] Figure 20 are end and top views of the joined metal bases having the same gauge and during the output phase of the method of Figure 7

[0041] are end and top views of the joined metal bases having different gauges and during the output phase of the method of Figure 21 Figure 7 is a top view of the joined metal bases during the output phase of the method of

[0042] Figure 22 Figure 7 is a top view of the joined metal bases during the output phase of the method of

[0043] Figure 23 is a top view of the joined metal bases during the output phase of the method of Figure 7 ​​​top view of the joined metal base during the output stage of the method.

[0044] Figure 24 is a top view of the joined metal base during the output stage of the method. Figure 7 is a top view of the joined metal base during the output stage of the method.

[0045] Figure 25 is a top view of the joined metal base during the output stage of the method. Figure 7 is a top view of the joined metal base during the output stage of the method. DETAILED DESCRIPTION

[0046] The subject matter specifically contemplated herein is described in terms of embodiments set forth in the description and illustrations provided herein, and these embodiments demonstrate and describe particular aspects. Adaptation and / or modifications in accordance with routine methods are possible at this time and can be made to some and even any of the illustrations described herein. Those skilled in the relevant art will recognize or be able to ascertain, using no more than routine experimentation depending on available information and the known uses of the relevant technologies, equivalents to the specific embodiments described. Such equivalents are considered to be within the scope of the claims. The disclosure is not intended to be limited to the embodiments shown, but is to be accorded the full scope consistent with the claims, to the full extent allowed by applicable laws, including the period of patent life following the grant of a patent. The claims, therefore, are what establish the essential features essential to the basic and genus of the disclosure and can include and be limited to both combinations and sub-combinations of the elements disclosed and may, in some cases, be written to include what is described syntactically or in other fashions in this specification, including drawings, that are understood, by those skilled in the art, to contribute to the essence of the basic and genus of this disclosure.

[0047] In this description, reference is made to alloys identified by Aluminum Industry designations, such as "series" or "7xxx." For an understanding of the nomenclature and identification of aluminum and its alloys, the most commonly used numerical designation system, see "International Alloy Designations and Chemical Composition Limits for Wrought Aluminum and Wrought Aluminum Alloys" or "Registration Record of Aluminum Association Alloy Designations and Chemical Compositions Limits for Aluminum Alloys in the Form of Castings and Ingot," both published by the Aluminum Association.

[0048] Described herein are metal joiner systems for joining two (or more) metal substrates together. In some embodiments, the metal substrates can be subjected to a shear cut or a mechanical cut prior to the metal joiner system. The metal joiner system can be used to join any suitable metal substrates, but it can be particularly suitable for joining metal substrates of aluminum and / or aluminum alloys and steel and / or steel alloys. In various non-limiting examples, the metal substrates can include aluminum and aluminum alloys, including but not limited to: 1xxx series aluminum alloys, 2xxx series aluminum alloys, 3xxx series aluminum alloys, 4xxx series aluminum alloys, 5xxx series aluminum alloys, 6xxx series aluminum alloys, 7xxx series aluminum alloys, and / or 8xxx series aluminum alloys and / or various other types of metal materials. As another non-limiting example, in certain embodiments, the metal substrates can include steel, high-strength steel used in the automotive industry, including but not limited to: carbon steel, dual-phase steel, and / or advanced high-strength steel. In certain non-limiting examples, each metal substrate can be 0.3 mm to 6 mm in gauge or thickness, but various other gauges within or outside of this range can be utilized. The metal substrates can be the same material (e.g., the same aluminum alloy) or different materials (e.g., two different aluminum alloys). The metal substrates can have the same gauge or different gauges as desired, such that the weld or seam can be formed between the metal substrates with the same thickness or different thicknesses. In some embodiments, the metal substrates can be metal sheets, but in other examples need not be sheets. In some non-limiting examples, the metal joiner system can be used to join two metal coils together.

[0049] The metal joiner system includes a metal joiner having a cutting head and a joining head. The metal joiner can also include a cleaning head and / or a seam finisher. The metal joiner system can include a power source communicatively coupled to the cutting head and the joining head. The metal joiner system can also include a controller communicatively coupled to the metal joiner and can control the metal joiner during a joining process, which includes a preparation phase, a joining phase, and / or a weld finish phase. In various aspects, the joining head is connected to the cutting head such that the joining head moves with the cutting head during the joining process. In various aspects, the cutting head is connected to the cleaning head such that the cutting head moves with the cleaning head during the preparation phase of the cutting process, but need not necessarily do so in other examples.

[0050] In certain examples, during a preparation phase of the joining process, the cutting head can prepare the joining region by directing the first laser beam onto the joining region to form a joint. In some examples, the controller controls the cutting head during the preparation phase such that the first laser beam forms a gap between the joining edges of the first and second metal substrates. Additionally or alternatively, the controller can also control the cutting head during the preparation phase such that the first laser beam is directed onto the top and bottom surfaces of the first and second metal substrates to remove contaminants such as lubricants, grease, fingerprints, etc., and / or otherwise prepare the top and bottom surfaces to form the joint.

[0051] In various examples, during a joining phase of the joining process, the joining head can form a joint (also referred to as a weld) by directing the second laser beam onto the joining region. The second laser beam can have at least one characteristic that is different from the first laser beam, including but not limited to: beam size, beam intensity, beam pattern, and / or other suitable characteristics as desired. In some embodiments, the controller controls the joining head such that the second laser beam heats a portion of the joining region and forms a weld. In certain aspects, the controller controls the joining head such that the second laser beam forms a weld having a thickness that is less than the thickness of the metal substrates forming the joining region. In various aspects, the controller controls the joining head such that the second laser beam forms a weld that is concave with respect to the top surface of the metal substrates forming the joining region and / or concave with respect to the bottom surface of the metal substrates forming the joining region. In various aspects, the controller controls the joining head such that the second laser beam forms a weld having additional thickness with respect to the top surface of the metal substrates forming the joining region and / or additional thickness with respect to the bottom surface of the metal substrates forming the joining region at the weld metal. The additional weld metal thickness beyond the top surface of the first metal substrate and the top of the second metal substrate can optionally be no greater than 0.2 mm or 10% of the thickness of both the first and second metal substrates. The additional weld metal thickness (weld reinforcement) beyond the bottom surface of the first metal substrate and the bottom of the second metal substrate can optionally be no greater than 0.2 mm or 10% of the thickness of both the first and second metal substrates.

[0052] The metal joiner systems described herein can improve the speed at which a seam is formed between two metal substrates because a single metal joiner can both prepare the joining area for the seam and form the seam. In some embodiments, the metal joiner systems described herein can operate at a welding speed of at least 3 meters per minute. In some cases, the metal joiner systems described herein can operate at a welding speed of up to 20 meters per minute. In other embodiments, the metal joiner systems can operate at a welding speed of 60 meters per minute. Additionally, the metal joiner of the metal joiner system can improve the quality of the surface of the metal substrates by utilizing the first laser beam and the second laser beam. The metal joiner system can also minimize or reduce metal loss when using the joining process and / or subsequent processing of the joined metal substrates. For example, the laser beams used to cut and form the seam can produce minimal debris and / or minimal loss of the metal substrate to form the seam. Additionally, because the welds formed by the metal joiner system have a reduced thickness, subsequent processing does not have to stop or otherwise account for thicker seam sections that would otherwise be present in existing mechanical joins (e.g., due to excessive weld reinforcement of more than 0.2 mm or 10% of the metal substrate thickness). The metal joiner systems described herein can also allow for the formation of a seam between metal substrates without the need for chemical solvents. In certain aspects, the process can have reduced processing time because the preparation and joining are done in close succession.

[0053] Figure 1 An example of a metal joiner system 100 is shown in accordance with various embodiments, and Figures 2 to 4 A metal joiner system 100 is shown during various stages of a joining process. The metal joiner system 100 includes a metal joiner 102 that selectively forms a weld 116 in a joining area 106 that joins a first metal substrate 104A and a second metal substrate 104B. The metal joiner system 100 can also include a power source 136 and a controller 134.

[0054] The first metal substrate 104A and the second metal substrate 104B can be various suitable metals as desired, and the metal of the first metal substrate 104A need not be the same as the metal of the second metal substrate 104B. In various examples, the first metal substrate 104A can be part of a first roll of metal substrate and the second metal substrate 104B can be part of a second roll of metal substrate. Various suitable metals for the first metal substrate 104A and / or the second metal substrate 104B can include, but are not limited to, aluminum, an aluminum alloy, steel, stainless steel, or other metals as desired. As Figures 2 to 4As best shown, the first metal base 104A and the second metal base 104B each include a top surface 124, a bottom surface 122, and an edge surface 126 extending between the top surface 124 and the bottom surface 122. As discussed in detail below, in various aspects, the joint region 106 can include at least a portion of the top surface 124, at least a portion of the bottom surface 122, and the edge surface 126.

[0055] In some examples, and as shown in FIG. 1, the metal joiner 102 includes a cutting head 110 and a joining head 108. In various aspects, the cutting head 110 is communicatively coupled with a power source 136 such that the power source 136 powers the cutting head 110 and the cutting head 110 can direct a first laser beam 112 onto the joint region 106 during a joining process. Similarly, the joining head 108 is communicatively coupled with the power source 136 such that the power source 136 powers the joining head 108 and the joining head 108 can direct a second laser beam 114 onto the joint region 106 during the joining process. In various aspects, at least one characteristic of the first laser beam 112 from the cutting head 110 can be different than the second laser beam 114 from the joining head 108. In certain embodiments, the at least one characteristic can include, but is not limited to, a beam intensity, a beam size, or a pattern of the beam directed onto the joint region 106. In some non-limiting examples, the beam size of the first laser beam 112 is smaller than the beam size of the second laser beam 114. Figure 2 and Figure 3 As shown, the coating 120 (or other contaminant) can be located on portions of one or more of the top surface 124, the bottom surface 122, or the edge surface 126. In some embodiments, the coating 120 can be intentionally placed on the surface or can be placed on the surface as a byproduct of a previous process or processing. As some examples, the coating 120 can be a contaminant of the joining process, such as grease, lubricant, fingerprints, dirt, grime, oil, etc. As discussed in detail below, during the joining process, the metal joiner system 100 can at least partially remove some of the coating 120, which can improve the formation of the weld 116 and improve the surface quality of the metal base.

[0056] Referring to Figure 1 , the metal joiner 102 includes a cutting head 110 and a joining head 108. In various aspects, the cutting head 110 is communicatively coupled with a power source 136 such that the power source 136 powers the cutting head 110 and the cutting head 110 can direct a first laser beam 112 onto the joint region 106 during a joining process. Similarly, the joining head 108 is communicatively coupled with the power source 136 such that the power source 136 powers the joining head 108 and the joining head 108 can direct a second laser beam 114 onto the joint region 106 during the joining process. In various aspects, at least one characteristic of the first laser beam 112 from the cutting head 110 can be different than the second laser beam 114 from the joining head 108. In certain embodiments, the at least one characteristic can include, but is not limited to, a beam intensity, a beam size, or a pattern of the beam directed onto the joint region 106. In some non-limiting examples, the beam size of the first laser beam 112 is smaller than the beam size of the second laser beam 114.

[0057] The joining head 108 is connected to the cutting head 110 such that the joining head 108 moves with the cutting head 110. Alternatively, the joining head 108 is connected to the cutting head 108 such that the portion of the joint region 106 where the joining head 108 directs the second laser beam 114 thereon is substantially the same as the portion of the joint region 106 where the cutting head 110 directs the first laser beam 112 thereon as the metal joiner 102 moves in the travel direction 118. In Figure 1In the example of FIG. 1, the support 138 connects the bonding head 108 and the cutting head 110; however, in other examples, various other suitable devices or mechanisms can connect the bonding head 108 with the cutting head 110 such that the bonding head 108 moves with the cutting head 110. In various aspects, the bonding head 108 connected to the cutting head 110 can allow for utilization of a single power source. The connected heads can also require less time to set up and calibrate the metal bonder 102 compared to existing bonder systems, as a single set up and calibration step can optionally be utilized. The connected heads of the metal bonder 102 can also allow the metal bonder 102 to complete the bonding process without requiring operator intervention.

[0058] The controller 134 is communicatively coupled with the bonding head 108 and the cutting head 110. The controller 134 can optionally be communicatively coupled with the power source 136. As discussed in detail below, the controller 134 can selectively control the metal bonder 102 during a bonding process.

[0059] The controller 134 can include one or more of a general purpose processing unit, a processor specifically designed for joining control analysis and / or metal joining applications, a processor specifically designed for wireless communication such as a programmable system on a chip from Cypress Semiconductor, or other suitable processor. Memory can be provided with the controller 134, but need not be in other examples. When included, the memory can include long term storage memory and / or short term working memory, and the memory can be used by the controller 134 to store a set of working processor instructions (i.e., the processor can write data to the memory). In some aspects, the memory can include one of a disk-based storage device and / or several other types of storage media including, but not limited to, memory disks, USB drives, flash drives, remotely connected storage media, virtual disk drives, etc. Various other features can also be included in the controller 134 including, but not limited to, communication circuitry / units, an optional display, an optional speaker, and / or a power storage unit. In some aspects, some or all of the components of the controller 134 can be included together in a single package or sensor suite, such as within the same housing. In additional or alternative aspects, some of the components can be included together in a housing and others can be separate (i.e., the controller 134 can be a distributed system). Other configurations of the controller 134 can be utilized as desired. In various aspects, the controller 134 communicates data with the joining head 108 and the cutting head 110 to control at least one of the position or orientation of the metal joiner 102 relative to the joining area 106, the first laser beam 112, the second laser beam 114, the welding speed of the metal joiner 102, the size of the gap formed during the preparation phase of the joining process, the thickness of the weld formed by the metal joiner 102 during the joining phase of the joining process, combinations thereof, or other suitable features of the metal joiner system 100 as desired during the joining process.

[0060] Optionally, and as shown, the metal joiner system 100 can include a shielding gas nozzle 111. In certain embodiments, the shielding gas nozzle 111 can provide shielding gas 113 to the sides of the weld 116. When included, the shielding gas nozzle 111 can optionally not block any weld quality monitoring and / or scanning. The shielding gas nozzle 111 can be connected to the joining head 108 and / or the cutting head 110, but need not be in other embodiments. In other embodiments, the shielding gas nozzle 111 can be omitted. Figure 1

[0061] Figure 5 Various phases of a joining process utilizing the metal joiner system 100 to join the first metal base 104A with the second metal base 104B are shown, and Figures 2 to 4 ​Metal bonder system 100 is shown during various stages.

[0062] Reference box 502 and Figure 5 , the joint region forming stage of the bonding process may include positioning the first metal substrate 104A relative to the second metal substrate 104B to form the bonding region 106. In some embodiments, and as Figure 2 As shown, forming the bonding area 106 may include positioning the first metal substrate 104A relative to the second metal substrate 104B such that the edge surface 126 of the first metal substrate 104A abuts the edge surface 126 of the second metal substrate 104B. Optionally, block 502 may include initially positioning the metal bonder 102 relative to the bonding area 106. In various aspects, initially positioning the metal bonder 102 may include positioning the metal bonder 102 such that the metal bonder 102 is substantially aligned with the bonding edge surface 126. In some embodiments, the metal bonder 102 may be initially positioned above the top surface 124 of the metal substrates 104A-104B, but in other examples the metal bonder 102 may be initially positioned below the bottom surface 122 of the metal substrates 104A-104B.

[0063] refer to Figure 5 Box 504 and Figure 3In various examples, the preparation phase of the joining process can include preparing the joint region 106 for forming a seam with the cutting head 110 of the metal joiner 102. In various embodiments, the controller 134 controls the cutting head 110 to direct the first laser beam 112 onto the joint region 106. In various embodiments, the controller 134 controls the cutting head 110 to direct the first laser beam 112 such that the first laser beam 112 cuts portions of the first metal base 104A and the second metal base 104B proximate the edge surface 126 and forms a gap 140 between the first metal base 104A and the second metal base 104B. In certain aspects, the controller 134 controls the cutting head 110 such that the gap 140 formed by the first laser beam 112 has a gap width 128 that is less than or equal to about 0.5 mm, such as less than or equal to about 0.4 mm, such as less than or equal to about 0.3 mm, such as less than or equal to about 0.2 mm, such as less than or equal to about 0.1 mm. In other embodiments, the gap width 128 can optionally be greater than 0.4 mm, such as greater than 0.5 mm, and / or at any other gap width 128 as desired. In certain aspects, the cutting head 110 is controlled to produce a rough (high speed) laser cut that can create microgaps when the metal bases 104A-104B are placed together. In such examples, the molten metal (produced by the laser of the joining head 108) penetrates into these voids during welding, and the voids themselves contribute to the weld thickness being about equal to or less than the thickness of the metal bases. In some embodiments, the weld can have a thickness that is up to 10% greater than the thickness of one or both metal bases, such as about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, and any ranges therein. In some embodiments, the weld can have a thickness that is about 0.1 mm to about 0.5 mm greater than the thickness of one or both metal bases, such as about 0.1 mm, about 0.2 mm, about 0.3 mm, about 0.4 mm, about 0.5 mm, or any range therein. Advantageously, a weld having a thickness that is less than one or both metal bases allows the weld to be further processed downstream without adjusting downstream equipment, such as by passing through a tension leveler and rollers.

[0064] Additionally or alternatively, during the preparation phase, the controller 134 can control the cutting head 110 to direct the first laser beam 112 onto portions of the top surface 124 and / or portions of the bottom surface 122 of the first metal base 104A and / or the second metal base 104B to remove at least some of the coating 120 that can or can not be present on such surfaces. In some embodiments, the controller 134 can control the cutting head 110 such that the gap 140 is formed first or the coating 120 is removed first.

[0065] In Figure 5In block 506 and as Figure 4 As shown, during the joining phase of the joining process, the controller 134 can control the bonding head 108 to direct the second laser beam 114 onto the bonding area 106. In various aspects, the bonding head 108 directs the second laser beam 114 into the gap 140 to heat the surfaces of the metal substrates 104A-104B within the gap 140 to form the weld 116. In various aspects, by forming the gap 140 in the preparation phase, the metal bonder system 100 can form the weld 116 during the joining phase with minimal chip generation and improved thickness because the second laser beam 114 can be directed into the gap 140. Figure 4 As shown, in various aspects, the controller 134 controls the bonding head 108 such that the thickness 142 of the weld 116 formed by the second laser beam 118 is less than the thickness (i.e., the distance between the top surface 124 and the bottom surface 122) of the first metal substrate 104A and / or the thickness of the second metal substrate 104B. In some examples, the controller 134 controls the bonding head 108 such that the weld 116 formed by the second laser beam 118 has an outer weld surface 132 that is recessed relative to the top surface 124 and / or the bottom surface 122. In some embodiments, the outer weld surface 132 is recessed relative to the top surface 124 and / or the bottom surface 122 by a recess distance 130. Weld 116 having a reduced thickness and / or being recessed relative to surfaces 124, 122 may provide an improved joint between metal substrates 104A-104B compared to conventional joints because weld 116 may subsequently be processed by other equipment (such as a tension leveler) without the need to adjust the equipment for thicker joints as conventionally required.

[0066] As mentioned, during the preparation phase and the joining phase of the bonding process, the controller 134 can control the metal bonder 102 to travel along the travel direction 118 at a welding speed. In some non-limiting examples, the welding speed can be greater than or equal to about 3 meters per minute, such as about 20 meters per minute, such as about 60 meters per minute, or other speeds as desired. In other examples, the welding speed can be less than about 3 meters per minute. Although the preparation phase and the joining phase of the bonding process are described separately, these two phases can be performed simultaneously by the metal bonder 102. For example, referring back to Figure 1 During the bonding process, the controller 134 may control the metal bonder 102 so that the cutting head 110 directs the first laser beam 112 onto a first portion of the bonding area 106 and the bonding head 108 directs the second laser beam 114 onto a second portion of the bonding area 106, while the metal bonder 102 moves in the travel direction 118.

[0067] Figure 6 as well as Figures 8 to 25Another example of a metal bonder system 200 according to various embodiments is shown. Metal bonder system 200 is substantially similar to metal bonder system 100 and includes metal bonder 102 having cutting head 110 and bonding head 108. Similar to metal bonder system 100, metal bonder system 200 also includes controller 134. Although not shown, metal bonder system 200 may also include a power source.

[0068] Compared to the support 138 of the metal bonder system 200, the support 238 of the metal bonder system 200 is modified so that the support 238 can support more than one metal bonder 102. Figure 6 As shown, compared to the metal bonder system 100, the metal bonder system 200 further includes at least one cleaning head 244 and at least one retaining member 246. Figure 6 In the example shown, the metal bonder system 200 includes two cleaning heads 244 and two holders 246, but any desired number of cleaning heads 244 and / or holders 246 may be utilized. In various embodiments, the cleaning heads 244 are connected to at least one metal bonder 102 via a support 238 (or other suitable structure) such that the cleaning heads 244 move with the at least one metal bonder 102. In the example shown, a single support 238 supports two metal bonders 102 and two cleaning heads 244. In other examples, all of the metal bonders 102 and / or cleaning heads 244 need not be supported on a single support.

[0069] like Figure 11 and Figure 12 As best shown, in some embodiments, each cleaning head 244 includes an inner nozzle 248 configured to direct a cleaning force 252 onto the seam area and an outer nozzle 250 configured to provide a vacuum force 254 and to inhale dust, air, and / or other debris. In certain embodiments, the cleaning force 252 can be provided by a cleaning agent, including but not limited to compressed air, acetone, a laser beam, or other suitable cleaning agents or methods as needed. In addition, in other embodiments, the cleaning head 244 can be other suitable devices or components that can selectively apply the cleaning force 252 as needed. As a non-limiting example, one or more cleaning heads 244 can be a wiper that can be parallel to (or otherwise as needed) the cutting head 244 and that moves in front of the cutting head 244. In this embodiment, a wiper (e.g., a blade or other suitable wiper device) can be optionally attached to the same unit, and the wiper will apply the cleaning force before the cutting head 110.

[0070] In some embodiments, the inner nozzle 248 and the outer nozzle 250 are each arranged at an oblique angle relative to the surface being cleaned, so that the cleaning force 252 and the vacuum force 254 are applied at an oblique angle. In other examples, the nozzles 248, 250 do not need to be at an oblique angle. Optionally, and as Figure 10 As shown, the cleaning head 244 includes a supplemental nozzle 255 configured to provide a vacuum force 254. In some aspects, the supplemental nozzle 255 is configured to be vertically aligned with (or in proximity to) the cutting head 110 so that the supplemental nozzle 255 can collect dust and / or other debris generated by the cutting head 110 when applying the first laser beam 112. The cleaning head 244 can be positioned on the same side of the metal substrate as the metal bonder 102 or on an opposite side of the metal substrate as the metal bonder 102. In some embodiments, the cleaning head 244 is configured to direct the cleaning force 252 and the vacuum force 254 in front of the laser light from the metal bonder 102 in the direction of travel 118. As shown in FIG. Figure 11 As shown, the cleaning head 244 can be offset from the metal substrate by a gap 257. In some non-limiting examples, the gap 157 can be from 1 mm to 2 mm, although in other embodiments the gap can be less than 1 mm and / or greater than 2 mm.

[0071] Each holder 246 is configured to grip and / or otherwise hold the metal substrate during the process. The holder 246 can be a variety of suitable mechanisms or devices for gripping the metal substrate, including but not limited to mechanical grippers, robotic arms, or other suitable devices as needed to create direct contact.

[0072] In certain embodiments, metal bonder system 200 (and / or metal bonder system 100) can be used to bond various metal substrates as desired. As some non-limiting examples, metal bonder system 200 (and / or metal bonder system 100) can be used to bond similar or dissimilar rolled steel sheets, similar or dissimilar rolled aluminum sheets, and / or other metal sheets or metal products as desired.

[0073] Figure 7 Another example of a method for joining metal substrates according to various embodiments is shown. In certain aspects, the method can be used to join various metal substrates as needed, including but not limited to steel and aluminum. In certain aspects, the method has improved processing time (i.e., execution time). Figure 7 In one non-limiting example, the processing time may be less than one minute, such as about 50 seconds. In other examples, the processing time may be more than one minute and / or less than 50 seconds as needed.

[0074] Block 702 is the input phase of the method. Figure 8In various embodiments, during the input stage, two metal substrates 204A-204B are initially provided. In certain aspects, the metal substrates 204A-204B are metal coils. Each metal substrate 204A-204B can have its own unique identifier. The metal substrates 204A-204B can have different gauges, the same gauge, different alloy types, the same alloy type, can come from a cold rolling process, can come from a hot rolling process, can each have its own temper condition (e.g., F temper), can be cut by shear cutting, band saw cutting, or other suitable cutting techniques, and have any cut edge quality as desired, and / or can include any grade of metal (e.g., any grade of steel and / or any grade of aluminum sheet) as desired. In Figure 8 In embodiments, the metal substrates 204A-204B have different gauges. Alternatively, the metal substrates 204A-204B have a gauge less than or equal to 6 mm.

[0075] Block 704 is the securing stage of the method. Referring to Figure 8 During the securing stage, the metal substrates 204A-204B are each held by a metal holder 246. In one non-limiting example, the securing stage can take about 10 seconds, but in other embodiments need not be 10 seconds.

[0076] Block 706 is the seam preparation stage of the method. Referring to Figure 6 and Figure 9 During the seam preparation stage, the cutting head 110 directs the first laser beam 112 to cut portions of the metal substrates 204A-204B. During the seam preparation stage, the inner nozzles 248 of the cleaning head 244 direct cleaning agent such that the cleaning force 252 is applied directly onto the seam area to remove lubricant and / or otherwise prepare the seam area as desired. As previously mentioned, in certain aspects, the cutting head 110 is controlled to produce a rough (at high speed) laser cut that can produce microgaps 261 (see FIG. 3) when the metal substrates 204A-204B are placed together. Figure 14). In such examples, the molten metal (produced by the laser of the joining head 108) penetrates into these microgaps 261 during welding, and the microgaps 261 themselves contribute to the weld 116 having a thickness that is about equal to or less than the thickness of the metal base. As previously mentioned, in certain embodiments, the weld can have a thickness that is up to 10% greater than the thickness of one or both metal bases, such as about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, about 10%, and any ranges therein. In some embodiments, the weld can have a thickness that is about 0.1 mm to about 0.5 mm greater than the thickness of one or both metal bases, such as about 0.1 mm, about 0.2 mm, about 0.3 mm, about 0.4 mm, about 0.5 mm, or any ranges therein. Advantageously, a weld having a thickness that is less than one or both metal bases allows the weld to be further processed downstream without adjusting downstream equipment, such as by passing through a tension leveler and rollers.

[0077] During the seam preparation phase, the outer nozzle 248 applies a vacuum force 254 such that the debris removed by the cleaning force 252 and / or by the first laser beam 112 is removed. In one non-limiting example, the seam preparation phase can take about 10 seconds, but in other embodiments need not be 10 seconds.

[0078] Block 708 is a seam formation phase of the method. In one non-limiting example, the seam preparation phase can take about 5 seconds, but in other embodiments need not be 5 seconds. Referring to FIG. 7, the seam formation phase can be performed by the joining head 108. Figure 13 and Figure 14 During the seam formation phase, the at least one metal base 204A-204B and optionally the two metal bases 204A-204B are advanced toward each other to form a gap 140 between the joining edges of the metal bases 204A-204B. As previously mentioned, in certain aspects, the gap 140 is less than or equal to about 0.5 mm, such as less than or equal to about 0.4 mm, such as less than or equal to about 0.3 mm, such as less than or equal to about 0.2 mm, such as less than or equal to about 0.1 mm. In other embodiments, the gap 140 is greater than 0.5 mm. As Figure 14 shown, the joining edges can have full or half microgaps 261 (enlarged in Figure 14 FIG. 7 for purposes of illustration). In some optional examples, the seam formation phase can be performed prior to the seam preparation phase (block 706).

[0079] Block 710 is a weld formation phase of the method. Referring to FIG. 7, the weld formation phase can be performed by the joining head 108. Figures 15 to 18During the weld formation phase, while the retainer 246 holds the metal bases 204A-204B in place, the joining head 108 directs the second laser beam 114 onto the joining region to join the metal bases 204A-204B. Optionally, the metal joiner system 200 includes a purge nozzle 260 configured to direct a purge agent (e.g., argon) onto the seam region to minimize direct contact of the welded metal with ambient atmosphere during the joining process and to remove gases or vapors that can be harmful to the welded seam as it is being welded and immediately after it is welded. Optionally, the weld formation phase can be performed concurrently with the seam preparation phase or separately from the seam preparation phase (e.g., in separate passes over the seam region).

[0080] Referring to Figure 15 and Figure 17 In examples where the metal bases 204A-204B have different gauges, the weld 116 is thinner than the metal base of the thicker gauge. In such examples with different gauges, during the weld formation phase, the second laser beam 114 from the joining head 108 can be offset from the seam region and can be applied on the metal base of the thicker gauge (see, e.g., FIG. 6B). Figure 15 ).

[0081] Referring to Figure 16 In other embodiments, the metal base 204A can be joined with a metal base 204C that has the same gauge as the metal base 204A. In these embodiments, the weld 116 can optionally have a weld reinforcement that is less than 0.2 mm and / or 10% of the metal base thickness. In examples with similar gauges, during the weld formation phase, the second laser beam 114 can be applied to the joining region (e.g., to both metal bases).

[0082] Block 712 is a weld finishing phase of the method. In certain aspects, the weld finishing phase can be optional, referring to Figure 19During the weld finishing stage, the weld start region 262 and the weld end region 264 of the weld 116 are removed via a weld or seam finisher 265, which can be various suitable mechanisms or devices as desired. As some non-limiting examples, the weld start region 262 and the weld end region 264 can be removed by the seam finisher 265 via a punching tool, partial shear cutting, laser cutting, or various other mechanisms or devices as desired. In certain aspects, removing the weld start region 262 and the weld end region 264 can remove stress locations and remove weld defects on the joined metal substrates, thereby improving the suitability of the joined metal substrates for further processing without (or minimizing) fractures in the weld or damage to processing machinery. In some embodiments, the joined metal substrate from which the weld start region 262 and the weld end region 264 have been removed may be able to be passed up and down through a set of processing rollers having various diameters ranging from 600 mm to 1200 mm at least 50 times, for example, about 50 times, about 60 times, about 70 times, about 80 times, about 90 times, or about 100 times, or any range therebetween, without breaking at the weld.

[0083] Block 714 is the output stage of the method. Figure 20 The metal substrates 204A and 204C (of the same specification) in the output stage are shown, and Figure 21 The metal substrates 204A-204B (with different specifications) in the output stage are shown. Figure 20 and Figure 21 As shown, in various embodiments, in the output stage, the thickness of the weld 116 is less than the thickness of at least one of the metal substrates and optionally less than the thickness of both metal substrates. In various embodiments, in the output stage, the thickness of the weld 116 is greater than the thickness of at least one of the metal substrates and optionally greater than the thickness of both metal substrates, wherein for welds having the same specifications, the weld reinforcement is in the range of less than 0.2 mm or 10% of the metal substrate thickness.

[0084] It should be understood that Figure 6 In embodiments where the metal bonder system 200 includes two metal bonders 102 (each having a cutting head 110) and at least one cleaning head 244, a single cutting head 110 and cleaning head 244 (e.g., of one of the metal bonders 102) may be used in a first pass, and a second cutting head 110 and cleaning head 244 (of the other metal bonder 102) may be used in a second pass, or two pairs of metal bonders 102 (and thus two cutting heads 110) and cleaning heads 244 may be used simultaneously. In some embodiments, using more than one pair of metal bonders 102 and cleaning heads 244 at a time may make cutting nonlinear shapes easier and / or more accurate over time.

[0085] Figures 22 to 25 Non-limiting examples of various orientations of weld 116 relative to process direction 270 that can be produced via metal bonder system 100 or metal bonder system 200 are shown. As shown, weld 116 can be vertical, angled, curved, or have other shapes or orientations as desired. In some embodiments, non-vertical weld 116 can minimize the portion of the weld that is under pressure from downstream rollers 274 (or other processing) at any one time, while still requiring less metal removal than current mechanical bonding methods.

[0086] Figure 21 An example of a weld 116 is shown that is substantially perpendicular to the machine direction 270. In certain embodiments, Figure 21 The weld 116 may be suitable for joining metal substrates of similar or dissimilar gauges.

[0087] Figure 22 An example of another weld 116 that is curved relative to the machine direction 270 is shown. Figure 22 As shown, during processing, a first portion 272 of the weld 116 may engage a roller 274 (or other processing equipment) before other portions of the weld 116 . Figure 22 The weld 116 may be suitable for joining metal substrates of similar or dissimilar gauges.

[0088] Figure 23 An example of a weld 116 that is perpendicular or at a right angle to the machine direction 270 is shown. Figure 24 An example of a weld 116 at an oblique angle relative to the machine direction 270 is shown. Figure 24 The weld 116 can be suitable for joining metal substrates of similar specifications. In one non-limiting example, the tilt angle can be less than or equal to 5°, such as less than or equal to 4°, such as less than or equal to 3°, such as less than or equal to 2°, such as less than or equal to 1°, relative to the machine direction 270. In other embodiments, the tilt angle can be greater than 5 degrees. As some non-limiting examples, the tilt angle can range from greater than 0° to less than 90°. In other embodiments, the weld 116 can be at any other angle relative to the machine direction 270 as desired.

[0089] Figure 25 An example of a weld 116 that is curved relative to the machine direction 270 is shown. Figure 23 Weld 116, Figure 25 The first portion 272 of the weld 116 has a reduced length. Figure 25 The weld 116 may be suitable for joining metal substrates of similar or dissimilar gauges.

[0090] A collection of example embodiments is provided below, including at least some embodiments expressly recited as “exemplary,” which provide additional description of various example embodiments in accordance with the concepts described herein. These exemplifications are not meant to be mutually exclusive, exhaustive, or limiting; and the present disclosure is not limited to these example exemplifications, but encompasses all possible modifications and variations within the scope of the published claims and their equivalents.

[0091] Exemplification 1. A metal joiner system comprising: a power source; and a metal joiner comprising: a cutting head communicatively coupled to the power source and configured to prepare a joining region for forming a seam by directing a first laser beam from the metal joiner onto the joining region; and a joining head communicatively coupled to the power source and configured to form the seam in the joining region by directing a second laser beam from the metal joiner onto the joining region, wherein the joining head is connected to the cutting head such that the joining head moves with the cutting head.

[0092] Exemplification 1a. The metal joiner system of any preceding or subsequent exemplification or combination of exemplifications, wherein the metal joiner further comprises a cleaning head configured to prepare the joining region by directing a cleaning force from the cleaning head onto the joining region.

[0093] Exemplification 1b. The metal joiner system of any preceding or subsequent exemplification or combination of exemplifications, wherein the joining head is connected to the cutting head to which the cleaning head is attached such that the joining head moves simultaneously or separately from the cutting head.

[0094] Exemplification 1c. The metal joiner system of any preceding or subsequent exemplification or combination of exemplifications, wherein the metal joiner further comprises a seam finisher communicatively coupled to the power source and configured to remove metal at a weld start region and a crater region of the seam.

[0095] Exemplification 2. The metal joiner system of any preceding or subsequent exemplification or combination of exemplifications, wherein the joining region is formed during a metal joining process by joining edges of a first metal substrate and a second metal substrate.

[0096] Exemplification 3. The metal joiner system of any preceding or subsequent exemplification or combination of exemplifications, further comprising: a controller communicatively coupled to the metal joiner, wherein the controller is configured to control the cutting head such that the first laser beam forms a gap between the joining edges of the first metal substrate and the second metal substrate, and wherein the gap is less than 0.5 mm.

[0097] Example 4. The metal joiner system of any preceding or subsequent example or combination of examples, wherein the join region further comprises a top surface and a bottom surface of each of the first metal substrate and the second metal substrate, wherein the metal joiner system further comprises a controller communicatively coupled to the metal joiner, and wherein the controller is configured to control the cutting head such that the first laser beam is directed onto at least one of the top surface or the bottom surface.

[0098] Example 5. The metal joiner system of any preceding or subsequent example or combination of examples, further comprising: a controller communicatively coupled to the metal joiner, and wherein the controller is configured to move the metal joiner along a travel path at a speed of at least 3 meters / minute while directing at least one of the first laser beam or the second laser beam from the metal joiner.

[0099] Example 6. The metal joiner system of any preceding or subsequent example or combination of examples, wherein at least one property of the second laser beam is different than the first laser beam, and wherein the at least one property comprises at least one of a beam size or a beam pattern.

[0100] Example 7. The metal joiner system of any preceding or subsequent example or combination of examples, wherein the metal joiner is movable along a travel path, and wherein the joining head is connected to the cutting head such that the first laser beam is applied to the travel path before the second laser beam is applied to the travel path.

[0101] Example 8. The metal joiner system of any preceding or subsequent example or combination of examples, wherein the joining head is configured to direct the second laser beam onto a join region formed by the joining edges of the first metal substrate and the second metal substrate and form a seam at the seam region during a metal joining process.

[0102] Example 8a. The metal joiner system of any preceding or subsequent example or combination of examples, further comprising: a cleaning head configured to direct a cleaning force onto the join region and apply a vacuum force onto the join region.

[0103] Example 8b. The metal joiner system of any preceding or subsequent example or combination of examples, wherein the cleaning head is configured to direct the cleaning force onto at least one of a top surface and a bottom surface of the seam.

[0104] Example 8c. The metal joiner system of any preceding or subsequent example or combination of examples, wherein the cleaning force comprises at least one of a chemical solvent, a doctor blade, compressed air, or a laser beam.

[0105] Example 8d. The metal joiner system of any preceding or subsequent example or combination of examples, further comprising: a seam finisher configured to remove a portion of the seam from at least one of a top surface or a bottom surface of the seam.

[0106] Example 9. A metal joiner for a metal joiner system, the metal joiner comprising: a cutting head configured to prepare a joining area for forming a seam by directing a first laser beam from the metal joiner onto the joining area; and a joining head configured to form the seam in the joining area by directing a second laser beam from the metal joiner onto the joining area, wherein the joining head is connected to the cutting head such that the joining head moves with the cutting head.

[0107] Example 9a. The metal joiner of any preceding or subsequent example or combination of examples, wherein the metal joiner further comprises a cleaning head and a seam finisher, wherein the seam finisher is configured to remove a portion of the seam from the joining area.

[0108] Example 9b. The metal joiner of any preceding or subsequent example or combination of examples, wherein the joining head is connected to the cutting head such that the joining head moves simultaneously or separately from the cutting head.

[0109] Example 10. The metal joiner of any preceding or subsequent example or combination of examples, wherein at least one characteristic of the second laser beam is different from the first laser beam, and wherein the at least one characteristic comprises at least one of a beam size, a beam intensity, or a beam pattern, and wherein the at least one characteristic comprises at least one of a beam size or a beam pattern.

[0110] Example 11. The metal joiner of any preceding or subsequent example or combination of examples, wherein the metal joiner is movable along a travel path, and wherein the joining head is connected to the cutting head such that the first laser beam is applied to the travel path before the second laser beam is applied to the same travel path.

[0111] Example 11a. The metal joiner of any preceding or subsequent example or combination of examples, wherein the joining area comprises a first metal substrate and a second metal substrate, and wherein the joining head is configured to form a seam having a thickness that is less than a thickness of the first metal substrate and less than a thickness of the second metal substrate.

[0112] Example 12. A metal joiner system comprising: the metal joiner of any preceding or subsequent example or combination of examples; a controller communicatively coupled to the metal joiner; and a power source communicatively coupled to the cutting head and the joining head.

[0113] Example 13. A metal joiner for a metal joiner system, the metal joiner comprising: a cutting head configured to prepare a joining area for forming a seam by directing a first laser beam from the metal joiner onto the joining area; and a joining head configured to form the seam in the joining area by directing a second laser beam from the metal joiner onto the joining area, wherein the metal joiner is movable along a travel path during a metal joining process, and wherein the joining head is connected to the cutting head such that the joining head is downstream of the cutting head along the travel path.

[0114] Example 14. The metal joiner of any preceding or subsequent example or combination of examples, wherein the joining head is connected to the cutting head such that the first laser beam is applied to the travel path before the second laser beam is applied to the travel path.

[0115] Example 14a. The method of any preceding or subsequent example or combination of examples, wherein preparing the joining area further comprises directing a cleaning head onto the joining area ahead of the cutting head on a bottom of the metal substrate.

[0116] Example 14b. The method of any preceding or subsequent example or combination of examples, further comprising: directing a seam finisher to remove a portion of the weld seam at one or more of a weld start, a weld crater, or a weld defect.

[0117] Example 15. The metal joiner of any preceding or subsequent example or combination of examples, wherein at least one characteristic of the second laser beam is different than the first laser beam, and wherein the at least one characteristic comprises at least one of a beam size or a beam pattern.

[0118] Example 16. The metal joiner of any preceding or subsequent example or combination of examples, wherein the joining head is connected to the cutting head such that the joining head moves with the cutting head.

[0119] Example 16a. The method of any preceding or subsequent example or combination of examples, wherein preparing the joining area comprises removing contaminants from the joining area with a cleaning head.

[0120] Example 17. A metal joiner system comprising: the metal joiner of any preceding or subsequent example or combination of examples; a controller communicatively coupled to the metal joiner; and a power source communicatively coupled to the cutting head and the joining head.

[0121] Example 18. A method comprising: aligning an ending edge of a first metal substrate with a starting edge of a second metal substrate such that an edge surface of the ending edge abuts an edge surface of the starting edge, wherein the aligned ending edge and starting edge define a joining region; preparing the joining region for joining by directing a first laser beam onto the joining region with a cutting head of a metal joiner; and directing a second laser beam onto the joining region with a joining head of the metal joiner to form a weld, wherein forming the weld joins the first metal substrate with the second metal substrate.

[0122] Example 19. The method of any preceding or subsequent example or combination of examples, wherein preparing the joining region comprises forming a gap in the joining region between the first metal substrate and the second metal substrate with the first laser beam, wherein the gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate, and wherein a width of the gap is less than 0.5 mm.

[0123] Example 20. The method of any preceding or subsequent example or combination of examples, wherein preparing the joining region comprises removing a contaminant from the joining region with the first laser beam.

[0124] Example 21. The method of any preceding or subsequent example or combination of examples, wherein removing the contaminant comprises removing a lubricant from the joining region.

[0125] Example 22. The method of any preceding or subsequent example or combination of examples, wherein preparing the joining region comprises directing the first laser beam onto a top surface of the first metal substrate, a bottom surface of the first metal substrate, a top surface of the second metal substrate, a bottom surface of the second metal substrate, the edge surface of the ending edge, and the edge surface of the starting edge.

[0126] Example 23. The method of any preceding or subsequent example or combination of examples, wherein forming the weld comprises forming a weld having a weld thickness that is less than a thickness of the first metal substrate and less than a thickness of the second metal substrate.

[0127] Example 24. The method of any preceding or subsequent example or combination of examples, wherein forming the weld includes forming a weld having a top weld surface that is recessed relative to top surfaces of the first and second metal substrates and a bottom weld surface that is recessed relative to bottom surfaces of the first and second metal substrates.

[0128] Example 24a. The method of any preceding or subsequent example or combination of examples, wherein directing the second laser beam includes directing the second laser beam that includes at least one characteristic that is different than the first laser beam.

[0129] Example 25. A weld formed by the method of any preceding or subsequent example or combination of examples.

[0130] Example 26. A weld joining a first metal substrate to a second metal substrate, wherein the weld includes a top weld surface and a bottom weld surface, wherein the top weld surface is recessed relative to at least one of a top surface of the first metal substrate or a top surface of the second metal substrate, and wherein the bottom weld surface is recessed relative to at least one of a bottom surface of the first metal substrate or a bottom surface of the second metal substrate.

[0131] Example 27. The weld of any preceding or subsequent example or combination of examples, wherein the weld extends substantially perpendicular to a processing direction of the joined first and second metal substrates.

[0132] Example 28. The weld of any preceding or subsequent example or combination of examples, wherein the weld does not extend perpendicular to a processing direction of the joined first and second metal substrates.

[0133] Example 28a. The weld of any preceding or subsequent example or combination of examples, wherein weld metal at one or more of the weld start region or weld crater region is removed from the first and second metal substrates.

[0134] Example 29. The weld of any preceding or subsequent example or combination of examples, wherein the top weld surface is recessed relative to both a top surface of the first metal substrate and a top surface of the second metal substrate, and wherein the bottom weld surface is recessed relative to both the bottom surface of the first metal substrate and the bottom surface of the second metal substrate.

[0135] Example 30. A weld joining a first metal substrate to a second metal substrate, wherein the weld includes a weld thickness, and wherein the weld thickness is less than at least one of a thickness of the first metal substrate or a thickness of the second metal substrate.

[0136] Example 30a. The weld as recited in any preceding or subsequent example or combination of examples, wherein forming the weld comprises forming a weld having a weld thickness that extends beyond a top surface of the first metal base and less than 0.2 mm beyond a top surface of the second metal base or 10% of the thickness of both the first metal base and the second metal base.

[0137] Example 31. The weld as recited in any preceding or subsequent example or combination of examples, wherein the weld extends substantially perpendicular to a processing direction of the joined first and second metal bases.

[0138] Example 32. The weld as recited in any preceding or subsequent example or combination of examples, wherein the weld does not extend perpendicular to a processing direction of the joined first and second metal bases.

[0139] Example 33. The weld as recited in any preceding or subsequent example or combination of examples, wherein the weld thickness is less than both the thickness of the first metal base and the thickness of the second metal base.

[0140] Example 34. A method comprising: preparing a first metal base comprising a first finish edge by clamping the first metal base and directing a first laser beam from a metal joiner onto a first side of the first metal base to produce a first joining surface on the first finish edge of the first metal base; preparing a second metal base comprising a second finish edge by clamping the second metal base and directing a second laser beam from the metal joiner onto a first side of the second metal base to produce a second joining surface on the second finish edge of the second metal base; forming a joining region of the first and second metal bases by abutting the first joining surface with the second joining surface; and directing a third laser beam onto the joining region with the metal joiner to form a weld, wherein forming the weld joins the first metal base with the second metal base.

[0141] Example 35. The method as recited in any preceding or subsequent example or combination of examples, wherein preparing the first metal base further comprises applying a cleaning force on a second side of the first metal base opposite the first side while directing the first laser beam, and wherein preparing the second metal base further comprises applying a cleaning force on a second side of the second metal base opposite the first side while directing the second laser beam.

[0142] The aspects described above are merely examples for possible implementations and are set forth to elucidate the principles of the present disclosure. Many changes and modifications can be made to the above-described embodiments with respect to the spirit and principles of the present disclosure without departing from the scope of the present disclosure. All such modifications and changes are intended to be included within the scope of the present disclosure and are to be construed as if individually presented in any appended claims. In addition, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation, nor for purposes of defining any scope of the appended claims.

Claims

1. A metal bonder system comprising: power supply; as well as A metal bonder, comprising: a cutting head communicatively coupled to the power source and configured to prepare the join area for forming a seam by directing a first laser beam from the metal joiner onto the join area; as well as a bonding head communicatively coupled to the power source and configured to form the seam in the bonding area by directing a second laser beam from the metal bonder onto the bonding area, wherein the engagement head is connected to the cutting head such that the engagement head moves with the cutting head, wherein the bonding area includes a bonding edge between the first metal substrate and the second metal substrate during the metal bonding process, The metal bonder system further includes a controller communicatively coupled to the metal bonder, wherein the controller is configured to control the cutting head such that the first laser beam forms a gap between the bonded edges of the first and second metal substrates. The gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate.

2. The metal bonder system of claim 1 , wherein the gap is less than 0.5 mm.

3. A metal bonder system as described in claim 1, wherein the bonding area further includes a top surface and a bottom surface of each of the first metal substrate and the second metal substrate, wherein the metal bonder system further includes a controller communicatively coupled to the metal bonder, and wherein the controller is configured to control the cutting head so that the first laser beam is directed onto at least one of the top surface or the bottom surface.

4. The metal bonder system of claim 1 , further comprising a controller communicatively coupled to the metal bonder, and wherein the controller is configured to move the metal bonder along a travel path at a speed of at least 3 meters per minute while directing at least one of the first laser beam or the second laser beam from the metal bonder.

5. The metal bonder system of claim 1, wherein at least one characteristic of the second laser beam is different from the first laser beam, and wherein the at least one characteristic comprises at least one of beam size, beam intensity, or beam pattern.

6. The metal bonder system of claim 1 , wherein the metal bonder is movable along a travel path, and wherein the bonding head is connected to the cutting head such that the first laser beam is applied to the travel path before the second laser beam is applied to the travel path.

7. The metal bonder system of claim 1 , further comprising: A cleaning head is configured to direct a cleaning force onto the engagement area and to apply a suction force to the engagement area.

8. The metal joiner system of claim 7, wherein the cleaning head is configured to direct the cleaning force onto at least one of a top surface and a bottom surface of the joint.

9. The metal bonder system of claim 7, wherein the cleaning force comprises at least one of a chemical solvent, compressed air, or a laser beam.

10. The metal bonder system of claim 1 , further comprising: A seam finisher is configured to remove a portion of a start of a weld forming the seam or an end of the weld forming the seam.

11. The metal bonder system of claim 1 , wherein the metal bonder further comprises a cleaning head configured to prepare the bond area by directing a cleaning force from the cleaning head onto the bond area.

12. The metal bonder system of claim 11, wherein the bonding head is connected to the cutting head to which the cleaning head is attached so that the bonding head moves simultaneously with or separately from the cutting head.

13. The metal bonder system of claim 11, wherein the metal bonder further comprises a joint finisher communicatively coupled to the power source and configured to remove metal at one or more of a weld initiation region or a crater region of the joint.

14. A metal bonder for use in a metal bonder system, the metal bonder comprising: a cutting head configured to prepare the joining area for forming a seam by directing a first laser beam from the metal bonder onto the joining area to form a gap in the joining area; as well as a bonding head configured to form the seam in the bonding area by directing a second laser beam from the metal bonder onto the bonding area, wherein the engagement head is connected to the cutting head such that the engagement head moves with the cutting head, wherein the bonding area includes a bonding edge between the first metal substrate and the second metal substrate during the metal bonding process, The metal bonder system further includes a controller communicatively coupled to the metal bonder, wherein the controller is configured to control the cutting head such that the first laser beam forms a gap between the bonded edges of the first and second metal substrates. The gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate.

15. The metal bonder of claim 14, wherein at least one characteristic of the second laser beam is different from the first laser beam, and wherein the at least one characteristic comprises at least one of beam intensity, beam size, or beam pattern.

16. The metal bonder of claim 14, wherein the metal bonder is movable along a travel path, and wherein the bonding head is connected to the cutting head such that the first laser beam is applied to the travel path before the second laser beam is applied to the travel path.

17. The metal bonder of claim 14, wherein the bonding area comprises a first metal substrate and a second metal substrate, and wherein the bonding head is configured to form a joint having a thickness less than a thickness of the first metal substrate and less than a thickness of the second metal substrate.

18. The metal bonder of claim 14, wherein the metal bonder further comprises a cleaning head and a seam finisher, wherein the seam finisher is configured to remove a portion of the seam from the bond area.

19. The metal bonder of claim 18, wherein the bonding head is connected to the cutting head such that the bonding head moves simultaneously with or separately from the cutting head.

20. A method for joining metal substrates, comprising: aligning an ending edge of a first metal substrate with a starting edge of a second metal substrate such that an edge surface of the ending edge abuts an edge surface of the starting edge, wherein the aligned ending and starting edges define a joint area; preparing the joining area for joining by directing a first laser beam onto the joining area using a cutting head of a metal joiner; as well as directing a second laser beam onto the joining region using a joining head of a metal joiner to form a weld, wherein forming the weld joins the first metal substrate to the second metal substrate, Wherein preparing the joining region includes forming a gap in the joining region between the first metal substrate and the second metal substrate using the first laser beam, wherein the gap extends through a thickness of the first metal substrate and a thickness of the second metal substrate.

21. The method of claim 20, wherein the width of the gap is less than 0.5 mm.

22. The method of claim 20, wherein preparing the joining area comprises removing contaminants from the joining area using a cleaning head.

23. The method of claim 20, wherein preparing the bonding area comprises removing contaminants from the bonding area using the first laser beam.

24. The method of claim 23, wherein directing the second laser beam comprises directing the second laser beam comprising at least one characteristic different from the first laser beam.

25. The method of claim 20, wherein preparing the joining area comprises directing the first laser beam onto a top surface of the first metal substrate, a bottom surface of the first metal substrate, a top surface of the second metal substrate, a bottom surface of the second metal substrate, the edge surface of the ending edge, and the edge surface of the starting edge.

26. The method of claim 20, wherein forming the weld comprises forming a weld having a weld thickness that is less than a thickness of the first metal substrate and less than a thickness of the second metal substrate.

27. The method of claim 20, wherein forming the weld comprises forming a weld having a weld thickness that extends beyond the top surface of the first metal substrate and beyond the top surface of the second metal substrate by less than 0.2 mm or 10% of the thickness of both the first metal substrate and the second metal substrate.

28. The method of claim 20, wherein forming the weld comprises forming a weld having a top weld surface that is recessed relative to top surfaces of the first and second metal substrates and a bottom weld surface that is recessed relative to bottom surfaces of the first and second metal substrates.

29. The method of claim 20, wherein preparing the joining area further comprises directing a cleaning head onto the joining area in front of the cutting head on the bottom of the metal substrate.

30. The method of claim 20, further comprising: The seam finisher is directed to remove a portion of the weld at one or more of a weld start, a weld crater, or a weld defect.

31. A weld formed according to the method of any one of claims 20-30 that joins a first metal substrate to a second metal substrate, wherein the weld comprises a top weld surface and a bottom weld surface, wherein the top weld surface is recessed relative to at least one of the top surface of the first metal substrate or the top surface of the second metal substrate, and wherein the bottom weld surface is recessed relative to at least one of the bottom surface of the first metal substrate or the bottom surface of the second metal substrate.

32. The weld of claim 31 , wherein the weld extends substantially perpendicular to a machine direction of the joined first and second metal substrates.

33. The weld of claim 31 , wherein the weld is non-perpendicular to a machine direction of the joined first and second metal substrates.

34. The weld of claim 31 , wherein the top weld surface is recessed relative to both the top surface of the first metal substrate and the top surface of the second metal substrate, and wherein the bottom weld surface is recessed relative to both the bottom surface of the first metal substrate and the bottom surface of the second metal substrate.

35. A weld formed according to the method of any one of claims 20-30 that joins a first metal substrate to a second metal substrate, wherein the weld comprises a weld thickness, and wherein the weld thickness is less than at least one of the thickness of the first metal substrate or the thickness of the second metal substrate.

36. The weld of claim 35, wherein the weld extends substantially perpendicular to a machine direction of the joined first and second metal substrates.

37. The weld of claim 35, wherein the weld is not perpendicular to a machine direction of the joined first and second metal substrates.

38. The weld of claim 35, wherein the weld thickness is less than both the thickness of the first metal substrate and the thickness of the second metal substrate.

39. The weld of claim 35, wherein weld metal located at a weld initiation region or the weld crater region is removed from the first and second metal substrates.

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