A switching diode array and a manufacturing method thereof

Abstract

The present invention discloses a switching diode array and a manufacturing method thereof, including an array diode body. Uniformly distributed pins are provided at the bottom of the array diode body. A metal boot is provided at the bottom of the pins. A plugging groove is provided on the outer wall of the top of the metal boot. A plugging column is integrally formed on the outer wall of the bottom of the pins, and the plugging column is plugged inside the plugging groove. A hollow plate is provided at the top of the array diode body. The inside of the hollow plate is vacuum. A uniformly distributed heat exchange tube is welded on one outer wall of the hollow plate. Uniformly distributed heat dissipation fins are provided on the outer wall of the heat exchange tube. By fixing the hollow plate at the top of the array diode body and injecting refrigerant into the hollow plate to form a vacuum, the present invention enables the refrigerant to evaporate and cool the array diode body when heated, and at the same time, the evaporated refrigerant can be liquefied and refluxed inside the heat exchange tube, so that the heat dissipation performance of the array diode body during operation is better.

Description

Technical Field

[0001] The present invention relates to the technical field of diode arrays, and particularly to a switching diode array and a manufacturing method thereof. Background Art

[0002] The switching diode array belongs to a broader category of silicon protection arrays (SPA) designed to provide ESD protection. Commonly found in small surface mount transient voltage suppressors, it consists of a special P-N semiconductor junction that provides surge protection. The PN junction is usually coated to prevent premature voltage arcing in the non-conductive state. When a transient voltage occurs, the transient voltage suppressor starts to conduct and clamps the transient voltage through the avalanche effect.

[0003] Chinese Patent No. CN201110051916.6 relates to the technical field of semiconductor memories, and particularly to a manufacturing method of a vertical diode array for phase change random access memories. In the present invention, after forming the bit line / word line isolation, a photoresist stripping operation in the word line direction and a bit line / word line isolation cleaning operation are performed to remove the side walls of the second oxide layer remaining in the bit line / word line isolation. Then, the etching of the STI structure (storage cell isolation) is carried out, so that the side wall height of the formed STI structure is reduced, the insulation performance is good, the deep trench structure in the bit line direction is well maintained, the length of the N-type or P-type buried layer (NBL or PBL) in the device area is ensured, a good morphology of the vertical diode array is obtained, the subsequent process window performance is improved, the short channel effect and the junction leakage phenomenon are improved, the integration degree and the interference-free degree of the subsequent phase change memory cells are increased, and the storage performance of the PCRAM device is reduced.

[0004] During the use of the currently used switching diode array, overheating occurs, and its heat dissipation performance is poor, resulting in damage to the switching diode array due to overheating. Therefore, it is urgent to design a switching diode array and a manufacturing method thereof to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a switching diode array and a manufacturing method thereof to solve the above deficiencies in the prior art.

[0006] To achieve the above purpose, the present invention provides the following technical solutions:

[0007] A switching diode array includes an array diode body. The bottom of the array diode body is provided with uniformly distributed pins. The bottom of the pins is provided with metal boots. The outer wall of the top of the metal boots is provided with insertion slots. The outer wall of the bottom of the pins is integrally formed with insertion posts, and the insertion posts are inserted into the interior of the insertion slots. The top of the array diode body is provided with a hollow plate. The interior of the hollow plate is vacuum. One outer wall of the hollow plate is welded with uniformly distributed heat exchange tubes. The outer wall of the heat exchange tubes is provided with uniformly distributed heat dissipation fins. The inner wall of the hollow plate is provided with a capillary layer. The outer wall of the bottom of the hollow plate is provided with an installation cavity. The inner wall of the top of the installation cavity is fixed with a temperature detection chip. The interior of the installation cavity is provided with thermal conductive silicone grease. The temperature detection chip is electrically connected to the array diode body. The outer wall of the top of the hollow plate is welded with a valve nozzle. The top of the valve nozzle is connected with a sealing cover by thread. The inner wall of the bottom of the sealing cover is integrally formed with a conical plug, and the conical plug is adapted to the valve nozzle.

[0008] Further, a sealing gasket is arranged inside the sealing cover, and the sealing gasket is located on the top of the valve nozzle.

[0009] Further, a retaining piece is arranged inside the valve nozzle. A positioning post is integrally formed inside the retaining piece. A first spring is arranged inside the valve nozzle, and the positioning post is inserted into the interior of the first spring.

[0010] Further, a fixing block is fixed on the top of the array diode body. An insertion port is arranged on one outer wall of the fixing block. Insertion plates are integrally formed on both outer walls of the hollow plate, and the insertion plates are inserted into the interior of the insertion port.

[0011] Further, a sliding groove is arranged on the outer wall of the top of the insertion plate. A sliding strip is integrally formed on the inner wall of the top of the insertion port. The insertion plate is slidably connected to the sliding strip through the sliding groove.

[0012] Further, an installation block is welded on one outer wall of the fixing block. An installation hole is arranged inside the installation block. A guide post is movably inserted into the interior of the installation hole. An arc groove is arranged on the outer wall of the top of the insertion plate. The bottom end of the guide post is adapted to the arc groove. A second spring is arranged on the top of the guide post and is located inside the installation hole. Moving grooves are arranged on both outer walls of the installation block. Blocks are welded on both outer walls of the guide post and are located inside the moving grooves.

[0013] Further, a solder cavity is arranged on the top of the metal boot. An inlet communicating with the outer wall of the solder cavity is arranged on one outer wall of the metal boot. An outlet communicating with the solder cavity is arranged on one outer wall of the metal boot.

[0014] Further, a concave hole is provided on the outer wall of the bottom of the metal boot, and uniformly distributed grooves are provided on the inner wall of the concave hole.

[0015] A manufacturing method of a switching diode array includes the following steps:

[0016] Liquid injection step: Rotate the sealing cover to open the valve nozzle, pull the positioning post with a connecting rope to compress the first spring with the baffle, then inject refrigerant into the valve nozzle, evacuate the inside of the hollow plate to a vacuum, and then thread-connect the sealing cover to the valve nozzle;

[0017] Fixing the hollow plate step: Fill the bottom installation cavity of the hollow plate with thermal conductive silicone grease, then insert the plug-in plates on both sides of the hollow plate into the inside of the plug-in interfaces, so that the sliding grooves on the plug-in plates cooperate with the sliding strips inside the plug-in interfaces, and the bottom end of the guide post cooperates with the arc grooves on the plug-in plates, so that the elastic force of the second spring presses down and fixes the plug-in plates;

[0018] Prolonging the pin step: Roll the pins of the array diode body so that a plug-in column is formed at the bottom of the pins;

[0019] Pressing and forming step: Press the outer wall of the plug-in column into patterns, press the metal block into a metal boot, and press patterns on the inner wall of the plug-in groove of the metal boot;

[0020] Sleeving the metal boot step: Sleeve the metal boot outside the plug-in column, and use a pressure device to press-fit the metal boot and the plug-in column;

[0021] Filling solder step: Fill molten metal solder from the inlet, stop filling when the metal solder flows out from the outlet, and polish the outer walls of the pins and the metal boot when the metal solder cools and forms.

[0022] Further, in the step of sleeving the metal boot, the metal boot is made of silver material, in the step of filling solder, the metal solder is made of silver material, in the liquid injection step, the hollow plate is made of copper material, and the refrigerant is one of pure water or ethanol.

[0023] In the above technical solution, a switching diode array and its manufacturing method provided by the present invention have the beneficial effects as follows:

[0024] By fixing a hollow plate on the top of the array diode body and injecting refrigerant and forming a vacuum inside the hollow plate, the present invention enables the refrigerant to evaporate and cool the array diode body when heated, and at the same time, the evaporated refrigerant can be liquefied and refluxed inside the heat exchange tube, so that the heat dissipation performance of the array diode body during operation is better.

[0025] The present invention supports the array diode body through pins, so that there is sufficient heat dissipation gap at the bottom of the array diode body, and a metal boot made of silver is fixed at the bottom of the pins, so that the pins have better electrical conductivity during welding, preventing the pins of the array diode body from being burned out due to excessive resistance at the welding points.

[0026] The present invention sets concave holes and grooves at the bottom of the metal boot, so that when the metal boot is welded to the circuit board, the solder can enter the interior of the concave holes and grooves, making the welding of the array diode body to the circuit board more firm.

[0027] The present invention enables the baffle to automatically block the valve nozzle through the elastic force of spring one, making it more convenient to evacuate the interior of the hollow plate, and making the block of the valve nozzle more tight through the gasket and conical plug inside the sealing cover. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0029] Figure 1 It is a schematic diagram of the overall structure provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0030] Figure 2 It is a schematic diagram of the metal boot structure provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0031] Figure 3 It is a schematic diagram of the hollow plate structure provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0032] Figure 4 It is a schematic diagram of the enlarged structure at A provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0033] Figure 5 It is a schematic diagram of the enlarged structure at B provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0034] Figure 6 It is a schematic diagram of the guide post structure provided by an embodiment of a switching diode array and its manufacturing method of the present invention.

[0035] Description of the Reference Numerals:

[0036] 1 Array diode body, 2 pins, 3 metal boots, 4 hollow plate, 5 insertion posts, 6 insertion slots, 7 concave holes, 8 grooves, 9 solder cavities, 10 inlets, 11 outlets, 12 installation cavities, 13 temperature detection chips, 14 capillary layers, 15 heat exchange tubes, 16 heat sinks, 17 sealing caps, 18 tapered plugs, 19 gaskets, 20 retaining plates, 21 positioning posts, 22 first springs, 23 valve nozzles, 24 fixing blocks, 25 insertion interfaces, 26 insertion plates, 27 sliding grooves, 28 sliding strips, 29 mounting blocks, 30 mounting holes, 31 second springs, 32 stoppers, 33 movable grooves, 34 arc grooves, 35 guide posts. Detailed implementation manners

[0037] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further introduced in detail below with reference to the accompanying drawings.

[0038] As Figure 1-6 shown, a switching diode array provided by an embodiment of the present invention includes an array diode body 1. Uniformly distributed pins 2 are provided at the bottom of the array diode body 1. A metal boot 3 is provided at the bottom of the pin 2. An insertion slot 6 is provided on the outer wall of the top of the metal boot 3. An insertion post 5 is integrally formed on the outer wall of the bottom of the pin 2. The insertion post 5 is inserted into the inside of the insertion slot 6. A hollow plate 4 is provided at the top of the array diode body 1. The inside of the hollow plate 4 is vacuum. Uniformly distributed heat exchange tubes 15 are welded on one outer wall of the hollow plate 4. Uniformly distributed heat sinks 16 are provided on the outer wall of the heat exchange tube 15. A capillary layer 14 is provided on the inner wall of the hollow plate 4. An installation cavity 12 is provided on the outer wall of the bottom of the hollow plate 4. A temperature detection chip 13 is fixed on the inner wall of the top of the installation cavity 12. Thermal grease is provided inside the installation cavity 12. The temperature detection chip 13 is electrically connected to the array diode body 1. A valve nozzle 23 is welded on the outer wall of the top of the hollow plate 4. A sealing cap 17 is connected to the top of the valve nozzle 23 by a thread. A tapered plug 18 is integrally formed on the inner wall of the bottom of the sealing cap 17. The tapered plug 18 is adapted to the valve nozzle 23.

[0039] Specifically, in this embodiment, uniformly distributed pins 2 are provided at the bottom of the array diode body 1. The height of the pins 2 is relatively poor compared to the length of the existing surface-mount type, so that the pins 2 can play a role in supporting a certain height when the array diode body 1 is welded to the circuit board. The array diode body 1 is a switch diode array used in the prior art. A metal boot 3 is provided at the bottom of the pin 2. The metal boot 3 is made of silver material. A socket 6 is provided on the outer wall of the top of the metal boot 3. A plug post 5 is integrally formed on the outer wall of the bottom of the pin 2. The plug post 5 is inserted into the inside of the socket 6. By inserting the plug post 5 into the inside of the socket 6, the contact area between the pin 2 and the metal boot 3 becomes larger, so that the cross-section in contact during conduction is not easily heated. A hollow plate 4 is provided at the top of the array diode body 1. The inside of the hollow plate 4 is a hollow structure, and the hollow plate 4 is made of copper material. The inside of the hollow plate 4 is a vacuum. A uniformly distributed heat exchange tube 15 is welded to the outer wall of one side of the hollow plate 4. Heat dissipation fins 16 are uniformly distributed on the outer wall of the heat exchange tube 15. A capillary layer 14 is provided on the inner wall of the hollow plate 4. The inside of the heat exchange tube 15 also has a capillary layer 14. The capillary layers 14 inside the heat exchange tube 15 and the hollow plate 4 are in contact. After injecting a refrigerant into the inside of the hollow plate 4 and keeping the inside of the hollow plate 4 in a vacuum state, the heat dissipation principle of the hollow plate 4 is as follows: the bottom of the hollow plate 4 is heated, and the heat source heats the capillary layer 14. At this time, the refrigerant quickly evaporates into hot steam (<104 Tor or less) under the heat in a vacuum ultra-low pressure environment. A large amount of heat is absorbed during evaporation. After the hot steam enters the heat exchange tube 15, it re-condenses into a liquid. At this time, it is the heat dissipation process. The condensed refrigerant flows back to the heat source at the bottom of the hollow plate 4 through the capillary layer 14, and the like acts repeatedly to achieve efficient heat dissipation. An installation cavity 12 is provided on the outer wall of the bottom of the hollow plate 4. A temperature detection chip 13 is fixed on the inner wall of the top of the installation cavity 12. The temperature detection chip 13 is used to detect the heat at the bottom of the array diode body 1 and transmit the detected data to the control module on the circuit board. Thermal conductive silicone grease is provided inside the installation cavity 12. The temperature detection chip 13 is electrically connected to the array diode body 1. An air valve 23 is welded to the outer wall of the top of the hollow plate 4. The air valve 23 is used to inject a refrigerant or evacuate the inside of the hollow plate 4. A sealing cover 17 is connected to the top of the air valve 23 by a thread. A conical plug 18 is integrally formed on the inner wall of the bottom of the sealing cover 17. The conical plug 18 is adapted to the air valve 23, and the air valve 23 is blocked by the conical plug 18.

[0040] A switch diode array and a manufacturing method thereof provided by the present invention. By fixing a hollow plate 4 on the top of the array diode body 1 and injecting a refrigerant into the inside of the hollow plate 4 and forming a vacuum, the refrigerant can evaporate and cool the array diode body 1 when heated, and at the same time, after evaporation, it can be liquefied and refluxed inside the heat exchange tube 15, so that the heat dissipation performance of the array diode body 1 during operation is better.

[0041] In another embodiment provided by the present invention, a sealing gasket 19 is arranged inside the sealing cover 17. The sealing gasket 19 is located at the top of the valve nozzle 23. The sealing gasket 19 makes the sealing effect of the sealing cover 17 on the valve nozzle 23 better. A retaining piece 20 is arranged inside the valve nozzle 23. A positioning post 21 is integrally formed inside the retaining piece 20. A first spring 22 is arranged inside the valve nozzle 23. The positioning post 21 is inserted into the first spring 22. A connecting rope is fixed to the top of the positioning post 21. When the connecting rope is pulled, the retaining piece 20 can open the valve nozzle 23, so that the refrigerant can be injected through the valve nozzle 23. The elastic force of the first spring 22 enables the retaining piece 20 to automatically block the valve nozzle 23, making it more convenient to evacuate the inside of the hollow plate 4. And the sealing gasket 19 and the tapered plug 18 inside the sealing cover 17 make the blocking of the valve nozzle 23 more airtight.

[0042] In still another embodiment provided by the present invention, a fixing block 24 is fixed to the top of the array diode body 1. An insertion port 25 is arranged on one outer wall of the fixing block 24. Insertion plates 26 are integrally formed on both outer walls of the hollow plate 4. The insertion plates 26 are inserted into the insertion port 25. The insertion plates 26 are used to fix the hollow plate 4 to the array diode body 1. A sliding groove 27 is arranged on the top outer wall of the insertion plate 26. A sliding bar 28 is integrally formed on the top inner wall of the insertion port 25. The insertion plate 26 is slidably connected to the sliding bar 28 through the sliding groove 27. The insertion plate 26 is limited by the sliding connection of the insertion plate 26 through the sliding groove 27 and the sliding bar 28. An installation block 29 is welded to one outer wall of the fixing block 24. An installation hole 30 is arranged inside the installation block 29. A guide post 35 is movably inserted into the installation hole 30. An arc groove 34 is arranged on the top outer wall of the insertion plate 26. The bottom end of the guide post 35 is adapted to the arc groove 34. A second spring 31 located inside the installation hole 30 is arranged on the top of the guide post 35. Moving grooves 33 are arranged on both outer walls of the installation block 29. Blocks 32 located inside the moving grooves 33 are welded to both outer walls of the guide post 35. The elastic force of the second spring 31 enables the guide post 35 to squeeze the insertion plate 26, so that the insertion plate 26 is not easily slid out of the insertion port 25.

[0043] In still another embodiment provided by the present invention, a solder cavity 9 is arranged on the top of the metal boot 3. An inlet 10 communicating with the outer wall of the solder cavity 9 is arranged on one outer wall of the metal boot 3. Metal solder can be filled into the solder cavity 9 through the inlet 10. An outlet 11 communicating with the solder cavity 9 is arranged on one outer wall of the metal boot 3. When the metal solder inside the solder cavity 9 overflows from the outlet 11, it indicates that the solder cavity 9 is filled with metal solder.

[0044] In yet another embodiment provided by the present invention, a concave hole 7 is provided on the outer wall of the bottom of the metal boot 3, and uniformly distributed grooves 8 are provided on the inner wall of the concave hole 7. By providing the concave hole 7 and the grooves 8 at the bottom of the metal boot 3, when the metal boot 3 is welded to the circuit board, the solder can enter the inside of the concave hole 7 and the grooves 8, making the welding of the array diode body 1 to the circuit board more firm.

[0045] A manufacturing method of a switching diode array includes the following steps:

[0046] Liquid injection step: Rotate the sealing cover 17 to open the air valve 23. Pull the positioning post 21 with a connecting rope to compress the first spring 22 with the retaining piece 20, then inject refrigerant into the inside of the air valve 23, evacuate the inside of the hollow plate 4 to a vacuum, and then thread-connect the sealing cover 17 to the air valve 23;

[0047] Fixing the hollow plate step: Fill the bottom mounting cavity 12 of the hollow plate 4 with thermal grease, then insert the plug-in plates 26 on both sides of the hollow plate 4 into the plug-in openings 25, so that the sliding grooves 27 on the plug-in plates 26 cooperate with the sliding strips 28 inside the plug-in openings 25, and the bottom end of the guide post 35 cooperates with the arc grooves 34 on the plug-in plates 26, so that the elastic force of the second spring 31 presses down and fixes the plug-in plates 26;

[0048] Extending the pin step: Roll the pin 2 of the array diode body 1 so that a plug-in post 5 is formed at the bottom of the pin 2;

[0049] Pressing and forming step: Press patterns on the outer wall of the plug-in post 5, press the metal block into the metal boot 3, and press patterns on the inner wall of the plug-in groove 6 of the metal boot 3;

[0050] Sleeving the metal boot step: Sleeve the metal boot 3 outside the plug-in post 5, and use a pressing device to press-fit the metal boot 3 and the plug-in post 5;

[0051] Filling solder step: Fill molten metal solder from the inlet 10, stop filling when the metal solder flows out from the outlet 11, and polish the outer walls of the pins 2 and the metal boot 3 when the metal solder cools and forms.

[0052] In yet another embodiment provided by the present invention, in the sleeving the metal boot step, the metal boot 3 is made of silver material, in the filling solder step, the metal solder is made of silver material, in the liquid injection step, the hollow plate 4 is made of copper material, and the refrigerant is pure water.

[0053] Only certain exemplary embodiments of the present invention have been described above by way of illustration. Without doubt, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above-mentioned drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A switching diode array, comprising an array diode body (1), characterized in that, The bottom of the array diode body (1) is provided with uniformly distributed pins (2). The bottom of the pins (2) is provided with metal boots (3). The outer wall of the top of the metal boots (3) is provided with a socket groove (6). The outer wall of the bottom of the pins (2) is integrally formed with a socket post (5). The socket post (5) is inserted into the inside of the socket groove (6). The top of the array diode body (1) is provided with a hollow plate (4). The inside of the hollow plate (4) is vacuum. One side outer wall of the hollow plate (4) is welded with uniformly distributed heat exchange tubes (15). The outer wall of the heat exchange tubes (15) is provided with uniformly distributed heat dissipation fins (16). The inner wall of the hollow plate (4) is provided with a capillary layer (14). The bottom outer wall of the hollow plate (4) is provided with an installation cavity (12). The inner wall of the top of the installation cavity (12) is fixed with a temperature detection chip (13). The inside of the installation cavity (12) is provided with thermal grease. The temperature detection chip (13) is electrically connected to the array diode body (1). The top outer wall of the hollow plate (4) is welded with an air valve (23). The top of the air valve (23) is threadedly connected with a sealing cover (17). The inner wall of the bottom of the sealing cover (17) is integrally formed with a tapered plug (18). The tapered plug (18) is adapted to the air valve (23).

2. The switching diode array according to claim 1, wherein, A sealing gasket (19) is arranged inside the sealing cover (17). The sealing gasket (19) is located at the top of the air valve (23).

3. The switching diode array according to claim 2, characterized in that, A retaining piece (20) is arranged inside the air valve (23). A positioning post (21) is integrally formed inside the retaining piece (20). A first spring (22) is arranged inside the air valve (23). The positioning post (21) is inserted into the inside of the first spring (22).

4. A switching diode array according to claim 1, characterized in that, A fixing block (24) is fixed to the top of the array diode body. An insertion port (25) is arranged on one side outer wall of the fixing block (24). Insertion plates (26) are integrally formed on both side outer walls of the hollow plate (4). The insertion plates (26) are inserted into the inside of the insertion port (25).

5. A switching diode array according to claim 4, characterized in that, A sliding groove (27) is arranged on the top outer wall of the insertion plate (26). A sliding bar (28) is integrally formed on the inner wall of the top of the insertion port (25). The insertion plate (26) is slidably connected to the sliding bar (28) through the sliding groove (27).

6. The switching diode array according to claim 4, characterized in that, An installation block (29) is welded to one side outer wall of the fixing block (24). An installation hole (30) is arranged inside the installation block (29). A guide post (35) is movably inserted into the inside of the installation hole (30). An arc groove (34) is arranged on the top outer wall of the insertion plate (26). The bottom end of the guide post (35) is adapted to the arc groove (34). A second spring (31) located inside the installation hole (30) is arranged on the top of the guide post (35). Moving grooves (33) are arranged on both side outer walls of the installation block (29). Blocks (32) located inside the moving grooves (33) are welded to both side outer walls of the guide post (35).

7. A switching diode array according to claim 1, characterized in that, A solder cavity (9) is provided at the top of the metal shoe (3), an inlet (10) communicating with the outer wall of the solder cavity (9) is provided on one side of the outer wall of the metal shoe (3), and an outlet (11) communicating with the solder cavity (9) is provided on one side of the outer wall of the metal shoe (3).

8. A switching diode array according to claim 1, characterized in that, The outer wall of the bottom of the metal shoe (3) is provided with a concave hole (7), and the inner wall of the concave hole (7) is provided with evenly distributed grooves (8).

9. A manufacturing method of a switching diode array, characterized in that, The following steps are involved: Liquid injection step: rotating the sealing cover (17) to open the valve (23), using the connecting rope to pull the positioning column (21) so that the baffle (20) compresses the spring 1 (22), and then injecting refrigerant into the interior of the valve (23), and evacuating the interior of the hollow plate (4), and then threading the sealing cover (17) and the valve (23); The steps of fixing the hollow plate are as follows: filling the bottom mounting cavity (12) of the hollow plate (4) with thermal conductive silicone grease, and then plugging the plug-in boards (26) on both sides of the hollow plate (4) into the plug-in interface (25), so that the slide groove (27) on the plug-in board (26) cooperates with the slide bar (28) inside the plug-in interface (25), and the bottom end of the guide column (35) cooperates with the arc groove (34) on the plug-in board (26), so that the elastic force of the second spring (31) presses down and fixes the plug-in board (26); The pin extension step includes rolling the pin (2) of the array diode body (1) so that a plug-in column (5) is formed at the bottom of the pin (2); Pressing and forming step: pressing the outer wall of the plug-in column (5) into patterns, pressing the metal block into a metal boot (3), and pressing the inner wall of the plug-in slot (6) of the metal boot (3) into patterns; The step of sleeve-fitting the metal boot: sleeve-fitting the metal boot (3) onto the outside of the plug-in column (5), and pressing the metal boot (3) and the plug-in column (5) together using a pressure device; Solder filling step: filling molten metal solder from the inlet (10), stopping filling when the metal solder flows out from the outlet (11), and grinding the outer wall of the pin (2) and the metal shoe (3) when the metal solder cools and forms.

10. The manufacturing method of a switching diode array according to claim 9, characterized in that, In the step of sleeve-fitting the metal shoe, the metal shoe (3) is made of silver; in the step of filling the solder, the metal solder is made of silver; in the step of injecting liquid, the hollow plate (4) is made of copper; and the refrigerant is one of pure water or ethanol.

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