Hot-pressing member and hot-pressing apparatus

Abstract

The application provides a hot-pressing component for carrying a workpiece requiring hot-pressing adhesive film, which comprises a base, a first carrier, a buffer and a second carrier. The base is provided with a cavity. The first carrier is arranged in the cavity and has a first through hole. The buffer has a second through hole. The surface of the first carrier facing the buffer is provided with a recess. The buffer is arranged in the recess. The second carrier is arranged on the buffer and used for abutting against the workpiece. The second carrier has a third through hole. The second through hole penetrates through the first through hole and the third through hole, and is used for allowing part of the workpiece to pass through the third through hole, the second through hole and part of the first through hole, so as to hot-press the adhesive film in the workpiece. In the application, the buffer is accommodated in the recess, so that the buffer is prevented from excessively overflowing, and the adhesive film is uniformly stressed during hot-pressing. The application also provides a hot-pressing device.

Description

Technical Field

[0001] This application relates to the field of camera module technology, and in particular to a hot-pressing component and hot-pressing equipment. Background Technology

[0002] In electronic components, metal parts widely employ contact-type conductivity to achieve electromagnetic shielding and other requirements. A common solution is to create contact-type conductive areas on the surface of the metal components using conductive tape. This has led to the widespread application of anisotropic conductive films (ACF films). ACF films are primarily used in electronic circuit board processes where high-temperature lead-tin soldering is not feasible. ACF films are composed of high-quality resin and conductive particles. In the manufacturing process of electronic components, such as lens modules, the lens needs to be placed within the machining holes of the carrier board in a hot-pressing device. The ACF film between the hot-pressed chip and the flexible circuit board serves to provide conductivity between the chip and the flexible circuit board.

[0003] During the hot-pressing process, a hot press head in the hot press equipment applies pressure to the ACF film, causing the ACF film between the chip and the flexible circuit board to melt, bond, and solidify. To ensure uniform stress on the ACF film during hot pressing and to prevent deformation of the AA adhesive in the lens due to heat transfer from the hot press head, a buffer pad is installed in the carrier board of the hot press equipment. However, during use, due to prolonged compression, the edges of the buffer pad may overflow and slip out of the hot-pressing area. Therefore, frequent checks for overflow are necessary, affecting operational efficiency. Summary of the Invention

[0004] In view of this, it is necessary to provide a hot-pressing component and a hot-pressing device to solve the above problems.

[0005] This application provides a hot-pressing component for supporting a workpiece requiring hot-pressing of an adhesive film. The hot-pressing component includes a base, a first support member, a buffer member, and a second support member. The base has a cavity. The first support member is disposed within the cavity and has a first through hole. The buffer member has a second through hole, and the surface of the first support member facing the buffer member has a recess, with the buffer member disposed within the recess. The second support member is disposed on the buffer member and abuts against the workpiece. The second support member has a third through hole, which extends through the first through hole and the third through hole, allowing a portion of the workpiece to pass through the third through hole, the second through hole, and a portion of the first through hole for hot-pressing the adhesive film within the workpiece.

[0006] In the aforementioned hot pressing component, by providing a recess on the first bearing member to accommodate the buffer member, excessive overflow and damage to the buffer member are prevented, ensuring uniform stress on the adhesive film on the workpiece during hot pressing. Furthermore, the buffer member improves the uniformity of stress on the hot-pressed adhesive film, thereby increasing efficiency and workpiece yield.

[0007] Optionally, in some embodiments of this application, the inner diameter of the third through hole is smaller than the inner diameter of the second through hole.

[0008] Optionally, in some embodiments of this application, the recess has a first inner wall and a second inner wall disposed opposite to the first inner wall. The first inner wall is close to the first through hole. Both the first inner wall and the second inner wall are inclined relative to the bottom wall of the recess. Along the direction from the buffer to the second support member, the first inner wall and the second inner wall gradually approach each other.

[0009] Optionally, in some embodiments of this application, the sidewalls of the buffer abut against the ends of the first inner wall and the second inner wall away from the bottom wall.

[0010] Optionally, in some embodiments of this application, the depth of the recess is 60%-80% of the height of the buffer extending out of the recess.

[0011] Optionally, in some embodiments of this application, the inclination angle between the first inner wall and the second inner wall is 10-80°.

[0012] Optionally, in some embodiments of this application, the second carrier is further provided with a cover plate, and the cover plate has a fourth through hole that is collinear with the central axis of the third through hole, and the inner diameter of the fourth through hole is larger than the inner diameter of the third through hole.

[0013] Optionally, in some embodiments of this application, the first carrier has an outer wall, a portion of which is recessed to form a groove, and the base has a boss corresponding to the groove on the inner wall of the cavity.

[0014] Optionally, in some embodiments of this application, the buffer is made of silicone rubber.

[0015] This application also provides a hot pressing device, including a hot pressing head and the aforementioned hot pressing component, wherein the hot pressing head is disposed on the hot pressing component and is used to extrude and heat melt the adhesive film in the workpiece.

[0016] In the aforementioned hot-pressing component, by providing a recess on the first bearing member to accommodate the buffer member, excessive overflow of the buffer member is prevented, so that the adhesive film on the workpiece is subjected to uniform force during hot pressing, so that the conductive particles in the adhesive film are fully crushed to achieve electrical conduction; the buffer member is set in the recess, which can also improve the problem of easy breakage of the buffer member, facilitate the rebound of the buffer member, and improve the service life of the buffer member, thereby improving production efficiency and workpiece yield. Attached Figure Description

[0017] Figure 1This is a cross-sectional view of a hot-pressed component according to an embodiment of this application.

[0018] Figure 2 This application provides a cross-sectional view of a hot pressing device that utilizes hot pressing components.

[0019] Figure 3 This is a schematic diagram of a partial explosion structure of a hot-pressed component in one embodiment of this application.

[0020] Explanation of main component symbols

[0021]

[0022]

[0023] The following detailed implementation methods will be combined with the above appendix. Figure 1-3 Further explanation of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0025] It should be noted that when a component is said to be "attached" to another component, it can be directly on the other component or it can be placed in a component. When a component is said to be "set" on another component, it can be directly set on the other component or it may be placed in a component.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0027] See Figure 1 and Figure 2This application provides a hot-pressing component 100 for supporting a workpiece 200 requiring a hot-pressed adhesive film 240, thereby facilitating the hot-pressing ACF process of the workpiece 200, i.e., the hot-pressing adhesive film 240 process. The hot-pressing component 100 includes a base 10, a first support member 20, a buffer member 30, a second support member 40, and a cover plate 50. The base 10 has a cavity 11, the first support member 20 is disposed within the cavity 11, and the cover plate 50 is disposed on the base 10. The buffer member 30 is disposed on the first support member 20, and a recess 24 is formed inwardly on the surface of the first support member 20 near the buffer member 30. A portion of the buffer member 30 is accommodated within the recess 24, and another portion of the buffer member 30 extends out of the recess 24. The second support member 40 is disposed on the buffer member 30. The buffer member 30 is used to ensure the uniformity of force on the adhesive film 240 during hot-pressing of the workpiece 200.

[0028] See Figure 2 The workpiece 200 can be any part that requires the hot-pressed adhesive film 240. In some embodiments, the workpiece 200 is a lens module, which includes a lens mount 210, a lens 220 disposed on the lens mount 210, a bracket 230 disposed on the surface of the lens mount 210 away from the lens 220, and an adhesive film 240. The adhesive film 240 is disposed on the side of the bracket 230 away from the lens 220. An adhesive layer 260 is also provided between the lens mount 210 and the bracket 230, and the adhesive layer 260 can be made of AA glue. A flexible circuit board 250 is disposed on the adhesive film 240, and the flexible circuit board 250 is electrically connected to other electronic components (not shown) in the lens module by hot-pressing the adhesive film 240. The lens module in this embodiment is only for illustrative purposes and is not intended to be limiting.

[0029] See Figure 2 and Figure 3 The first support member 20 has a first through hole 21, the buffer member 30 has a second through hole 31, and the second support member 40 has a third through hole 41. The central axes of the first through hole 21, the second through hole 31, and the third through hole 41 are collinear. The inner diameter of the third through hole 41 is smaller than the inner diameter of the second through hole 31. When the workpiece 200 needs to be hot-pressed with adhesive film 240, part of the workpiece 200 passes through the third through hole 41, that is, the lens 220 of the workpiece 200 passes through the third through hole 41, the second through hole 31, and part of the first through hole 21. The outer diameter of the lens mount 210 is larger than the inner diameter of the third through hole 41. Therefore, the lens mount 210 is located on and abuts against the second support member 40, and the adhesive film 240 is located above the second support member 40 to achieve positioning of the workpiece 200.

[0030] See Figure 2 and Figure 3When the workpiece 200 is hot-pressed with adhesive film 240, an external force is applied downward to the adhesive film 240 of the workpiece 200 to melt and compress the adhesive film 240, thereby compressing the workpiece 200 downward. The force is applied to the second support member 40 through the mirror base 210 of the workpiece 200, and then the second support member 40 compresses the buffer member 30. The buffer member 30 is deformed by compression and overflows in the horizontal direction. At this time, the recess 24 on the first support member 20 prevents the excessive deformation of the buffer member 30, which is conducive to the rebound of the buffer member 30 and improves the phenomenon of deformation overflow of the buffer member 30, thereby improving the service life of the buffer member 30. This setting can also improve the uniformity of the force when the adhesive film 240 is compressed, so that the conductive particles in the adhesive film 240 are fully crushed during hot pressing to achieve electrical conduction, improve the yield of hot-pressed adhesive film 240 of workpiece 200, and improve production efficiency.

[0031] See Figure 2 and Figure 3 In some embodiments, the first support member 20 has an annular outer sidewall 22, a portion of which is recessed to form a groove 23. The first support member 20 fits against the inner wall of the cavity 11 of the base 10. The inner sidewall of the cavity 11 has protruding bosses 12 at positions corresponding to the grooves 23. The engagement of the bosses 12 and the grooves 23 increases the contact area between the base 10 and the first support member 20, thus improving the stability of their connection. In some embodiments, the first support member 20 is generally square and made of aluminum or aluminum alloy. The cavity 11 in the base 10 is generally square, corresponding to the shape of the first support member 20, so that the first support member 20 fits against the inner wall of the cavity 11.

[0032] See Figure 2 and Figure 3 In some embodiments, the recess 24 of the first support member 20 has a first inner wall 241 and a second inner wall 242 disposed opposite to the first inner wall 241, the first inner wall 241 being close to the first through hole 21. The first inner wall 241, the second inner wall 242, and the bottom wall 243 together form the recess 24, which is generally square. Both the first inner wall 241 and the second inner wall 242 are inclined relative to the bottom wall 243 of the recess 24, specifically, along the direction from the buffer member 30 to the second support member 40, the first inner wall 241 and the second inner wall 242 gradually approach each other. In some embodiments, the inclination angles of the first inner wall 241 and the second inner wall 242 are the same or different. Preferably, the inclination angle θ of the first inner wall 241 and the second inner wall 242 is 10-80°. Within this range, it is convenient to better prevent the buffer member 30 from overflowing, reduce the deformation rate of the buffer member 30, and facilitate the rebound of the buffer member 30.

[0033] See Figure 1 , Figure 2 and Figure 3 In some embodiments, the buffer 30 is also generally square and adapted to the recess 24, with the buffer 30 housed within and partially extending out of the recess 24. The sidewalls of the buffer 30 abut against the ends of the first inner wall 241 and the second inner wall 242 away from the bottom wall 243, defining the position of the buffer 30 within the recess 24. In some embodiments, preferably, the depth d of the recess 24 is 60-80% of the height h of the buffer 30 extending out of the recess 24. This range allows for better rebound of the buffer 30 after compression. In some embodiments, the buffer 30 is preferably made of silicone rubber, but other elastic and resilient polymer materials may also be used.

[0034] See Figure 2 and Figure 3 The second support member 40 is disposed on the buffer member 30, and the cover plate 50 is disposed on the second support member 40 to better define the position of the second support member 40. The cover plate 50 has a fourth through hole 51, wherein the fourth through hole 51 is collinear with the central axis of the third through hole 41, and the inner diameter of the fourth through hole 51 is larger than the inner diameter of the third through hole 41, so that the workpiece 200 passes through the fourth through hole 51 and partially abuts against the second support member 40. For example, the lens 220 passes through the third through hole 41, and the lens mount 210 is accommodated in the fourth through hole 51 and abuts against the top surface of the second support member 40. The edge of the cover plate 50 is bent toward the buffer member 30 to form a receiving groove 52 for accommodating the second support member 40 and part of the buffer member 30. The receiving groove 52 communicates with and corresponds to the cavity 11 to arrange the first support member 20, the buffer pad and the second support member 40 between the base 10 and the cover plate 50. In some embodiments, the second support member 40 is made of steel plate, which is generally square and corresponds to the size of the buffer member 30.

[0035] See Figure 2This application also provides a hot pressing device 300, including a hot pressing head 310 and a hot pressing component 100. The hot pressing head 310 is disposed on the hot pressing component 100 and is used to extrude and heat melt the adhesive film 240 on the workpiece 200. The specific operation process of hot-pressing adhesive film 240 onto workpiece 200 is as follows: First, workpiece 200 is clamped using a clamping mechanism (not shown) and kept in a clamped state. Workpiece 200 is placed into the fourth through hole 51, with lens 220 in workpiece 200 passing through the third through hole 41, the second through hole 31, and part of the first through hole 21. Then, a hot press head 310 with a certain temperature is applied to the flexible board 250 of workpiece 200. Through the temperature of the hot press head 310 and the compression of adhesive film 240, adhesive film 240 is in a molten and flowing state, causing adhesive film 240 to adhere between flexible board 250 and the electronic component. Then, adhesive film 240 is cooled and cured, and the conductive particles in adhesive film 240 achieve electrical conductivity between the electronic component and flexible board 250. A silicone strip 320 is also provided between the hot press head 310 and the flexible board 250 to improve the flatness of the hot-pressed adhesive film 240.

[0036] Meanwhile, this application also tested the effect of the buffer 30. The buffer 30 has a tensile strength greater than 9.6 MPa, a tear strength greater than 36 N / mm, a permanent deformation rate of 5%, and a hardness of 65°+ / 5°. The thickness of the buffer 30 is 0.8 mm, the depth of the recess 24 is 0.5 mm, that is, the height of the buffer 30 extending into the recess 24 is 0.3 mm, and the inclination angle of the first inner wall 241 and the second inner wall 242 is 80°.

[0037] Please see Figure 2 According to Table 1, workpiece 200 was placed in hot-pressing component 100 for testing. The initial thickness of buffer component 30 was approximately 0.8 mm. It can be seen that as the number of pressing cycles increases, the thickness of buffer component 30 decreases, but the change is small. This indicates that the first inner wall 241 and the second inner wall 242 in the recess 24 block the buffer component 30, preventing excessive deformation and facilitating its rebound, thus reducing its deformation rate. After 90,000 pressing cycles, the appearance of workpiece 200 was observed to be normal, and the thickness of buffer component 30 showed no significant change, with no overflow. Furthermore, after 90,000 pressing cycles, the tensile force of buffer component 30 was 0.36, and the conductive particles of the adhesive film 240 reached 32.0931 μm, exceeding the required conductive particle size of 27 μm for production. Reliability testing confirmed that the product meets production requirements. As can be seen from Table 1, compared with the existing hot-pressing structure, the buffer 30 will overflow after 26,000 pressing cycles. The combination structure of the recess 24 and the buffer 30 provided in this application improves the overflow phenomenon of the existing buffer 30 and significantly improves the service life of the buffer 30.

[0038] Furthermore, through testing, it was found that in the specific design, the dimensions of the first support member 20 are designed according to the size of the workpiece 200, and the inner diameter of the first through hole 21 of the first support member 20 is expanded outward to an edge width (i.e., the width of the first support member 20) of not less than 1.5 mm relative to the size of the workpiece 200. The thickness of the buffer member 30 is 0.8–1.5 mm, and the thickness of the second support member 40 is 0.2–0.3 mm, so that the hot-pressing adhesive film 240 is subjected to more uniform force. The hot-pressing component 100 provided in this application has a better effect on hot-pressing the adhesive film 240 of the workpiece 200.

[0039] Table 1 shows the performance test results of the buffer components after hot-pressing the workpiece with adhesive film.

[0040]

[0041]

[0042] This application adopts the structure of the recessed portion 24 and the buffer 30 described above, and has conducted multiple tests, all of which have achieved the above-mentioned effect.

[0043] In this application, by providing a recess 24 on the first support member 20 to accommodate the buffer member 30, excessive overflow of the buffer member 30 is prevented, so that the adhesive film 240 on the workpiece 200 is subjected to uniform force during hot pressing, so that the conductive particles in the adhesive film 240 are fully crushed to achieve electrical conduction; the buffer member 30 is provided in the recess 24, which can also improve the problem of easy breakage of the buffer member 30, facilitate the rebound of the buffer member 30, and improve the service life of the buffer member 30, thereby improving production efficiency and the yield of the workpiece 200.

[0044] Those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the spirit and essence of this application fall within the scope of this application's disclosure.

Claims

1. A hot-pressing component for supporting workpieces requiring hot-pressed adhesive films, characterized in that, The hot-pressing component includes: The base has a cavity; A first support member is disposed within the cavity, and the first support member has a first through hole; A buffer member has a second through hole, and the surface of the first support member facing the buffer member has a recess, and the buffer member is disposed in the recess; A second support member is disposed on the buffer member for abutting the workpiece. The second support member has a third through hole, which passes through the first through hole and the third through hole, allowing part of the workpiece to pass through the third through hole, the second through hole, and part of the first through hole to heat-press the adhesive film in the workpiece. The recessed portion has a first inner wall and a second inner wall disposed opposite to the first inner wall. The first inner wall is close to the first through hole. Both the first inner wall and the second inner wall are inclined relative to the bottom wall of the recessed portion. Along the direction from the buffer member to the second support member, the first inner wall and the second inner wall gradually approach each other. The depth of the recessed portion is 60%-80% of the height of the buffer member extending out of the recessed portion.

2. The hot-pressed component as described in claim 1, characterized in that, The inner diameter of the third through hole is smaller than the inner diameter of the second through hole.

3. The hot-pressed component as described in claim 1, characterized in that, The sidewalls of the buffer abut against the ends of the first inner wall and the second inner wall away from the bottom wall, respectively.

4. The hot-pressed component as described in claim 1, characterized in that, The inclination angle of the first inner wall and the second inner wall is 10-80°.

5. The hot-pressed component as described in claim 1, characterized in that, The second support member is also provided with a cover plate, and a fourth through hole is provided on the cover plate, which is collinear with the central axis of the third through hole. The inner diameter of the fourth through hole is larger than the inner diameter of the third through hole.

6. The hot-pressed component as claimed in claim 1, characterized in that, The first support member has an outer wall, part of which is recessed to form a groove, and the base has a boss on the inner wall of the cavity corresponding to the groove.

7. The hot-pressed component as claimed in claim 1, characterized in that, The cushioning element is made of silicone rubber.

8. A hot pressing device, comprising a hot pressing head, characterized in that, It also includes a hot pressing member as described in any one of claims 1-7, wherein the hot pressing head is disposed on the hot pressing member for extruding and hot-melting the adhesive film in the workpiece.

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