Core shell with various filler materials for enhanced thermal conductivity

Abstract

Disclosed herein is a composite housing for an electronic device. The composite housing may include a metal shell comprising a first material having a first set of material properties, and the composite housing may include a surface that at least partially defines an exterior surface of the electronic device. The composite housing may also include an interior portion comprising a second material having a second set of material properties independent of the first set of material properties, and the interior portion at least partially defines a feature. The interior portion may be coupled to the shell and disposed within the surface of the shell.

Description

[0001] This application is a divisional application of the invention patent application with application number 202010074983.9, application date January 22, 2020, and invention name “Core shell with various filling materials for enhancing thermal conductivity”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This patent application claims priority to U.S. Provisional Patent Application No. 62 / 798,343, filed on January 29, 2019, entitled “CORE SHELL WITH VARIOUSFILLER MATERIALS FOR ENHANCED THERMAL CONDUCTIVITY,” the entire disclosure of which is hereby incorporated by reference herein. Technical Field

[0004] The embodiments generally relate to electronic devices and more particularly to housings for electronic devices. Background Art

[0005] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablets, and watches, can come into contact with a variety of surfaces during use. Furthermore, the use, transportation, and storage of such devices can impose mechanical and thermal stresses on the devices.

[0006] Components used in these devices, such as housings or casings, may benefit from exhibiting different combinations of properties relevant to the use of the device. Casings for portable electronic devices may have a combination of properties, such as strength, appearance, toughness, wear resistance, weight, corrosion resistance, thermal conductivity, electromagnetic shielding, and cost, so that the device functions as desired. Certain materials may provide desired performance levels with respect to some properties, but may not provide optimal performance levels with respect to other properties. Therefore, it is desirable to provide a device casing that can include a variety of materials that can achieve desired performance levels with respect to a variety of desired properties. Summary of the Invention

[0007] According to some aspects of the present disclosure, a housing for an electronic device may include a metal shell and an internal portion, wherein the metal shell includes a first material having a first set of material properties and a surface having a substantially curved shape, the surface at least partially defining an outer surface of the electronic device, the internal portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature, the internal portion being coupled to the shell and disposed within the surface.

[0008] In some cases, the metal shell is preformed and has a thickness greater than about 25 microns. The inner portion and the shell may form a substantially unitary body. The outer shell may be positioned around the periphery of the electronic device, and the surface may at least partially define the outer peripheral surface of the electronic device. The inner portion may at least partially define the internal volume of the electronic device. The inner portion may be bonded to the preformed shell by welding, brazing, diffusion bonding, or mechanical bonding. The outer shell may include an intermediate polymer layer disposed between the preformed shell and the inner portion, the intermediate polymer layer bonding the inner portion to the preformed shell. The first material may include a first metal, and the second material may include a second metal or an alloy different from the first material.

[0009] In some aspects, a component for an electronic device may include a metallic outer portion and an inner portion, the metallic outer portion having a thickness greater than about 25 microns and comprising a first material having a first set of material properties, the outer portion at least partially defining an exterior surface of the electronic device, and the inner portion bonded to the outer portion and comprising a second material having a second set of material properties independent of the first set of material properties, the inner portion defining a feature and at least partially defining an interior volume of the electronic device, wherein the inner portion and the preformed outer portion form a substantially unitary body.

[0010] In some cases, the first material may include a first metal and the second material may include a second metal. The first material may include steel or an aluminum alloy, and the second material may include copper, aluminum, or a steel alloy different from the first material. The first material may include titanium, and the second material may include copper, aluminum, or steel. The inner portion may be bonded to the preformed outer portion by welding, brazing, diffusion bonding, or mechanical bonding. The inner portion may be bonded to the preformed outer portion by die-casting the inner portion into the preformed outer portion. The component may also include an intermediate polymer layer disposed between the inner portion and the preformed outer portion and joining the inner portion and the preformed outer portion. The intermediate polymer layer may include a heat-activated film or an injection-molded polymer. The inner portion may include two layers bonded together and matched to define a feature. The feature is defined by both the inner portion and the preformed outer portion. The preformed outer portion may have a thickness greater than approximately 25 microns.

[0011] According to some aspects, a method of forming a component for an electronic device may include: connecting a pre-formed portion including a first material having a first material property to a second portion including a second material having a second material property independent of the first material property to form a unitary body, and forming one or more features in the second portion.

[0012] In some cases, joining may include welding or brazing the second portion to the preformed portion. Joining may include providing an intermediate layer between the preformed portion and the second portion. Joining may include die casting the second portion into the preformed portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present disclosure will be readily understood by the following detailed description taken in conjunction with the accompanying drawings, in which like reference numerals designate like structural elements, and in which:

[0014] Figure 1 A perspective view of an electronic device is shown.

[0015] Figure 2 An exploded view of the electronic device is shown.

[0016] Figure 3 An exploded view of a housing for an electronic device is shown.

[0017] Figure 4A An exploded perspective view of components of an electronic device is shown.

[0018] Figure 4B A perspective view of components of an electronic device is shown.

[0019] Figure 5 A perspective view of a portion of a housing for an electronic device is shown.

[0020] Figure 6 Shown Figure 5 Another perspective view of this portion of the housing.

[0021] Figure 7 Shown Figure 5 Top view of this part of the housing.

[0022] Figure 8 Shown Figure 5 A side view of this portion of the housing.

[0023] Figure 9A A perspective view of components of an electronic device is shown.

[0024] Figure 9B A perspective view of components of an electronic device is shown.

[0025] Figure 10 A close-up perspective view of a portion of a housing for an electronic device is shown.

[0026] Figure 11 A close-up perspective view of a portion of a housing for an electronic device is shown.

[0027] Figure 12A An exploded perspective view of components of an electronic device is shown.

[0028] Figure 12B A perspective view of components of an electronic device is shown.

[0029] Figure 13A perspective view of a portion of a housing for an electronic device is shown.

[0030] Figure 14 Shown Figure 13 Exploded view of this portion of the housing.

[0031] Figure 15 A process flow diagram illustrating a method for forming a component of an electronic device is shown.

[0032] Figure 16 A perspective view of a unitary body comprising a first material and a second material is shown.

[0033] Figure 17 A perspective view of a unitary body comprising a first material and a second material is shown.

[0034] Figure 18 A schematic diagram showing stages in a method for forming a component of an electronic device is shown. DETAILED DESCRIPTION

[0035] This specification provides examples and does not limit the scope, applicability, or configuration set forth in the claims. Therefore, it should be understood that the functions and arrangements of the elements discussed may be changed without departing from the spirit and scope of the present disclosure, and various embodiments may appropriately omit, replace, or add other procedures or components. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, in other embodiments, features described with respect to some embodiments may be combined.

[0036] One aspect of the present disclosure relates to a composite component for an electronic device, such as a frame, housing, border strip, or portion thereof for an electronic device. In some examples, a composite housing for an electronic device may include a preformed exterior or outer portion, also referred to as a shell, having a first set of material properties. The preformed exterior portion may include a metallic material, such as stainless steel. The composite housing may also include an interior or inner portion, also referred to as a core, having a second set of different material properties that are independent of the first set of material properties. For example, the inner portion may include a metallic material, such as aluminum. The preformed exterior portion and the inner portion may be welded, bonded, adhered, or otherwise connected together so that they form a housing or a portion of a housing and act as a substantially unitary body. That is, in some cases, the composite component may be considered a single material or material body with respect to various processes, such as the manufacturing and assembly processes described herein.

[0037] In some examples, the composite structure may allow the material properties of the interior (primarily the structural or functional portion of the shell) to be separated from the exterior (primarily the decorative portion of the shell). That is, the material of the interior portion may be selected to express one or more properties of the composite shell, while the material of the exterior portion may be independently selected to express one or more other desired properties of the shell. For example, in some cases, the material and / or geometry of the interior portion may be selected to achieve a desired level of strength, weight, stiffness, cost, thermal conductivity, electromagnetic transparency, machinability, carbon footprint, recyclability, other properties, or a combination thereof. At the same time, the material and / or geometry of the exterior portion may be independently selected to achieve a desired level of hardness, corrosion resistance, scratch resistance, an aesthetic finish, strength, weight, stiffness, cost, thermal conductivity, electromagnetic transparency, machinability, carbon footprint, recyclability, other properties, or a combination thereof.

[0038] For example, a housing constructed primarily of a material such as stainless steel may provide a desired exterior cosmetic appearance and a desired level of rigidity, but may be relatively heavy and expensive, and features, such as attachment features, may be relatively difficult to machine and may result in high levels of material waste. On the other hand, a housing constructed primarily of aluminum may be lightweight, low cost, and easy to machine, but may not provide a desired cosmetic appearance or be scratch-resistant. In contrast, a composite housing as described herein having an exterior portion comprising stainless steel connected to an interior portion comprising aluminum may have advantages over an all-steel housing in terms of lightweight, low cost, and ease of machining, while also possessing the desired cosmetic appearance, hardness, and scratch resistance of stainless steel.

[0039] In some examples, the interior or inner portion of a composite housing or component may include any material having one or more desired material properties and may be welded, bonded, adhered, or otherwise connected to the outer portion, as described herein. For example, the inner portion of a composite housing may include an organic material such as a polymer material, a ceramic material, a metallic material, or a combination thereof. In some examples, the inner portion of a composite housing or component, as described herein, may include a metallic material such as aluminum, copper, steel, or an alloy, or a combination thereof. In some examples, the inner portion may include a metallic material having a foamed structure or bulk metallic glass. In some cases, the inner portion may be a composite material, such as a carbon reinforced polymer material, a ceramic reinforced polymer material, a metal matrix composite, a ceramic matrix composite, or other composite material.

[0040] In some examples, the inner portion of a composite housing or component can be primarily, substantially entirely, or at least partially responsible for the mechanical or structural properties of the composite housing or component. That is, properties such as weight, stiffness, and thermal conductivity of the composite housing or component can be substantially similar to the properties of the material from which the inner portion is formed. In some examples, the inner portion of a composite housing or component can have any desired thickness. For example, as described herein, the inner portion of a composite housing can have a thickness of several millimeters and can form a frame or border band around a portion of the perimeter of an electronic device. In some examples, however, the inner portion of a composite housing can have a thickness such that it extends substantially completely across the entire width of the electronic device.

[0041] In some examples, the exterior or outer portion of a composite housing or component may comprise any material having one or more desired material properties and may be welded, bonded, adhered, or otherwise connected to the interior portion, as described herein. For example, the exterior portion may comprise an organic material such as a polymer material, a ceramic material, a metallic material, or a combination thereof. In some examples, the exterior portion of a composite housing or component, as described herein, may comprise a metallic material such as steel, titanium, aluminum, or an alloy, or a combination thereof. In other examples, the exterior portion may comprise precious and semi-precious metals such as silver, gold, platinum, or an alloy, or a combination thereof. In further examples, the exterior portion may comprise a ceramic material such as aluminum oxide or sapphire, zirconium oxide, a carbide, a nitride, a boride, an oxide, or a combination thereof. In some examples, the exterior portion may comprise a metallic material such as bulk metallic glass. In other examples, the exterior portion itself may be a composite material, such as a carbon reinforced polymer material, a ceramic reinforced polymer material, a metal matrix composite, a ceramic matrix composite, or other composite materials.

[0042] In some examples, the outer portion of a composite shell or component can be a preformed or separate article before being connected to the inner portion to form the composite shell or component. That is, the material of the outer portion can be a substantially unitary body, such as a blank, rod, strip, or piece of material. In some examples, however, the outer portion can be formed from multiple bodies of material that are connected to the inner portion to form the composite shell or component. For example, two or more strips or segments of material can be connected to the inner portion to serve as the outer portion, thereby forming the composite shell or component. In some examples, the outer portion is not a coating. That is, in some examples, the outer portion is not grown, deposited, coated, or otherwise formed on the inner portion.

[0043] The outer portion of the composite shell or component can have a thickness greater than about 25 microns, greater than about 50 microns, greater than about 100 microns, 200 microns, 300 microns, 400 microns, 500 microns, or greater. In some examples, the outer portion can have a thickness of up to about 1 millimeter, up to about 2 millimeters, or up to about 5 millimeters, or greater. In addition, the outer portion can have a thickness that varies along one or more locations of the outer portion. For example, a feature can be formed in the outer portion, and the thickness adjacent to the feature can be about 1 millimeter or greater, while some other area of the outer portion where the feature does not appear can have a thickness of about 100 microns. The desired thickness of the outer portion can depend on the material of the outer portion, the material of the inner portion, the desired properties of the resulting composite component, and combinations thereof.

[0044] The outer portion and the inner portion of the composite housing or component can be connected by any method now known in the art or that may be developed in the future. In some examples, the outer portion can be directly connected to the inner portion such that a surface of the outer portion directly contacts, abuts, is fused to, bonded to, or otherwise directly connected to the inner portion. In some examples, the outer portion can be connected to the inner portion by welding, such as ultrasonic welding or laser welding, brazing, diffusion bonding, fusion, or other similar methods. In some examples, the outer portion can be metallurgically bonded to the inner portion along at least a portion of the interface between the outer portion and the inner portion.

[0045] In some examples, the outer portion and the inner portion can be connected together using an adhesive or another intermediate material. For example, the outer portion and the inner portion can be connected or fixed together by glue or adhesive (such as a resin or epoxy resin), by a heat-activated film, by injection molded plastics or by similar connection methods. Alternatively or additionally, these parts can be connected or fixed together via a mechanical engagement between the outer portion and the inner portion. For example, the features of the outer portion can be mechanically engaged with the features of the inner portion to mechanically connect these parts together. The size range of these engagement features can be nanoscale or microscale to macroscale with approximately millimeter size, and various combinations thereof can be included.

[0046] In some examples, the inner portion can be formed in or on the outer portion so that the outer portion and the inner portion are connected by a mechanical bond, a metallurgical bond, another type of bond, or a combination thereof. For example, the inner portion can be cast, molded (such as by metal injection molding), or otherwise formed in a preformed outer portion. In this way, the material of the inner portion can flow into the features on the surface of the outer portion so that when the material of the inner portion solidifies, such as by cooling or curing, a mechanical bond, a metallurgical bond, or another type of bond is formed between the inner portion and the outer portion.

[0047] Either or both of the inner portion and the outer portion of the composite component, such as a portion of a housing for an electronic device, can be subjected to a treatment process before, during, or after the connection process. For example, the surface of the outer portion of the composite component can be subjected to a surface treatment, such as a physical vapor deposition process, after the composite component is formed. The surface of the composite component, including both the inner portion and the outer portion, can be treated, for example, by one or more etching processes to form one or more bonding features that facilitate connection of the composite component to one or more other components of the electronic device.

[0048] The following references Figures 1 to 16 However, the detailed description given herein with respect to these drawings is for illustrative purposes only and is not to be construed as limiting.

[0049] Figure 1 A perspective view of an embodiment of electronic device 100 is shown. Figure 1 The illustrated electronic device 100 is a mobile wireless communications device, such as a smartphone. Figure 1 The smartphone is merely one representative example of a device that may be used in conjunction with the systems and methods disclosed herein. Electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. Electronic device 100 may be referred to as an electronic device or consumer device.

[0050] The electronic device 100 may have a housing that includes a border strip or frame 102 that defines the outer perimeter of the electronic device 100. As described herein, the border strip 102 or portions thereof may be or may include composite components. In some examples, the border strip 102 may include several sidewall components, such as a first sidewall component 104, a second sidewall component 106, a third sidewall component 108 (opposite to one sidewall component 104), and a fourth sidewall component ( Figure 1 As described herein, the aforementioned sidewall member may be or may include a composite member.

[0051] In some cases, some of the sidewall members form antenna assemblies ( Figure 1 106 ). Thus, one or more non-metallic materials can separate the sidewall components of the border strip 102 from each other to electrically isolate the sidewall components. For example, a first separating material 112 separates the first sidewall component 104 from the second sidewall component 106, and a second separating material 114 separates the second sidewall component 106 from the third sidewall component 108. As non-limiting examples, the aforementioned materials may include one or more electrically inert or electrically insulating materials, such as plastics and / or resins.

[0052] The electronic device 100 may also include a display assembly 116 (shown in dotted lines) covered by a protective cover 118. The display assembly 116 may include multiple layers (discussed below), each of which provides unique functionality. The display assembly 116 may be partially covered by a frame 120 or a frame that extends along the outer edge of the protective cover 118 and partially covers the outer edge of the display assembly 116. The frame 120 may be positioned to hide or shield any electrical and mechanical connections between the layers of the display assembly 116 and the flexible circuit connector. In addition, the frame 120 may include a uniform thickness. For example, the frame 120 may include a thickness that does not typically change in the X and Y dimensions.

[0053] In addition, if Figure 1 As shown, the display assembly 116 may include a notch 122, which indicates that the display assembly 116 is missing. The notch 122 may allow for a vision system (discussed below) that provides information to the electronic device 100 for object recognition, such as facial recognition. In this regard, the electronic device 100 may include a mask layer (as shown in dashed lines) having an opening designed to hide or obscure the vision system, which allows the vision system to provide object recognition information. This will be discussed further below. Additionally, the protective cover 118 may be formed of a transparent material such as glass, plastic, sapphire, or the like. In this regard, the protective cover 118 may be referred to as a transparent cover, a transparent protective cover, or (when the protective cover 118 includes glass) a cover glass. As shown in FIG. Figure 1 As shown, the protective cover 118 includes an opening 124, which may represent a single opening of the protective cover 118. The opening 124 may allow acoustic energy (in the form of audible sound) to be transmitted into the electronic device 100, which may be detected by a microphone ( Figure 1 The opening 124 may also or alternatively allow acoustic energy (in the form of audible sound) to be transmitted to the outside of the electronic device 100, which is received by the audio module ( Figure 1Additionally, the electronic device 100 may not include buttons typically found in electronic devices, such as a "home button," in some embodiments, because the protective cover 118 may not include additional openings.

[0054] The electronic device 100 may also include a port 126 designed to receive a connector of a cable assembly. The port 126 allows the electronic device 100 to transmit (send and receive) data and also allows the electronic device 100 to receive power to charge the battery assembly. Thus, the port 126 may include a terminal electrically coupled to the connector.

[0055] Additionally, the electronic device 100 may include several additional openings. For example, the electronic device 100 may include an opening 128 that allows for an additional audio module ( Figure 1 The electronic device 100 may further include an opening 132 that allows an additional microphone of the electronic device to receive the acoustic energy. In addition, the electronic device 100 may include a first fastener 134 and a second fastener 136 that are designed to securely engage with a guide rail coupled to the protective cover 118. In this regard, the first fastener 134 and the second fastener 136 are each designed to couple the protective cover 118 to the border strip 102.

[0056] The electronic device 100 may include several control inputs designed to facilitate sending commands to the electronic device 100. For example, the electronic device 100 may include a first control input 142 and a second control input 144. As non-limiting examples, the aforementioned control inputs may be used to adjust the visual information presented on the display assembly 116 or the amount of acoustic energy output by the audio module. The control may include one of a switch or a button designed to generate a command or signal received by the processor. The control input may extend at least partially through an opening in the side wall member. For example, the second side wall member 106 may include an opening 146 that receives the first control input 142. Figure 2 Further details are provided regarding the features and structure of the electronic device.

[0057] Figure 2 An exploded view of electronic device 200 is shown. Figure 2The electronic device 200 is shown as a smartphone, but is merely one representative example of a device that can be used with or includes the systems and methods described herein. As described with respect to the electronic device 100, the electronic device 200 can correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, and other similar electronic devices. In some cases, the electronic device 200 can include some or all of the features described herein with respect to the electronic device 100.

[0058] The electronic device may have a housing including a bezel band 202 that at least partially defines an exterior portion of the electronic device, such as an outer perimeter. Figure 1 1 , the border strip 202 may include several sidewall components, such as a first sidewall component 204, a second sidewall component 206, a third sidewall component 208 (opposite the first sidewall component 204), and a fourth sidewall component 210. As described herein, the aforementioned sidewall components may be composite components or may include composite components. As described herein, the border strip 202 may also include one or more non-metallic materials that separate and / or connect the sidewall components of the border strip 202 from each other. For example, a separating material 214 may separate and / or connect the second sidewall component 206 from the third sidewall component 208.

[0059] The housing including the bezel band 202 may include one or more features, such as feature 222, that receive or couple to other components of the device 200. For example, the bezel band 202 may include any number of features, such as holes, cavities, recesses, and other mating features, to receive and / or attach to one or more components of the device 200. The electronic device 200 may include internal components, such as a processor, memory, circuit boards, batteries, and sensors. Such components may be disposed within an interior volume defined at least in part by the bezel band 202 and may be attached to the bezel band 202 via an interior surface formed into, defined by, or otherwise becoming a part of the bezel band 202, attachment features such as feature 222, threaded connectors, studs, columns, and / or other securing features.

[0060] Device 200 may include internal components, such as a system-in-package (SiP) 226, which includes one or more integrated circuits, such as a processor, sensors, and memory. Device 200 may also include a battery 224 housed in the internal volume of device 200. Device 200 may also include one or more sensors, such as optical sensors or other sensors, that may sense or otherwise detect information about the environment outside the internal volume of device 200. Additional components, such as a haptic engine, may also be included in device 200. Electronic device 200 may also include a display assembly 216, similar to display assembly 116 described herein. In some cases, display assembly 216 may be received by and / or attached to bezel strip 202 via one or more attachment features.

[0061] The electronic device 200 may also include a chassis 220 that can provide structural support. As described herein, the chassis 220 may include a rigid material such as metal, or may include a composite construction. Additionally, the chassis 220 may be coupled to the border strip 202. In this way, the chassis 220 may also provide an electrical ground path for electrically coupling components to the chassis. The electronic device may alternatively or additionally include a backplate 230 having a cladding and / or other attachment features so that one or more components of the electronic device 200 can be attached to the backplate 230, for example, via welding. The backplate 230 can form a conductive path for connecting components of the electronic device 200. In some cases, the backplate 230 can be attached to the border strip 202 of the device 200 via one or more attachment features, such as feature 222.

[0062] The exterior surface of the electronic device 200 may also be defined by a back cover 240 that may be coupled to the bezel strip 202. In this regard, the back cover 240 may be combined with the bezel strip 202 to form a housing or enclosure for the electronic device 202, wherein the housing or enclosure (including the bezel strip 202 and the back cover 240) at least partially defines an interior volume. The back cover 240 may include a transparent material such as glass, plastic, sapphire, or the like.

[0063] The shell that comprises the frame band 202 with one or more composite parts, as described herein, can satisfy the internal dimension requirement as defined by internal parts.For example, the structure of the shell that comprises the composite frame band 202 can be designed to limit or limit the internal parts that will be accommodated uniquely or mainly by shell.Because the shell with composite frame band 202 can be extremely light and solid, so shell can be shaped to hold internal parts in a dimensionally efficient manner, and is not constrained by the factors outside the component size, such as the needs to additional structural elements.As described herein, the composite parts 204,206,208,210 of frame band can be formed by multiple processes.In some embodiments, these forming processes can allow shell and / or frame band 202 to have the detailed shape or design of special customization, to satisfy one or more demands (such as internal dimension requirement), and do not need additional feature portion to strengthen the structure of shell.In addition, the artificial trace of shell manufacturing process can be eliminated.

[0064] Additionally or alternatively, other components of the electronic device 200, such as individual internal structural components or external input components such as the chassis 220, may be formed from or may include the composite components described herein.

[0065] While any number of components or various components of an electronic device, such as electronic device 200, may be formed from or may include composite components, the structure of these composite components may be, for example, a composite component including an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite components themselves, may apply not only to the specific examples discussed herein, but also to any number of embodiments or various embodiments in any combination. Figure 3 Various embodiments of composite parts are described.

[0066] Figure 3 An exploded view of a bezel strip 302 is shown, which may be formed as an electronic device (such as with respect to Figure 1 and Figure 2 The border strip 302 may include one or more portions that are or include a composite component, such as an outer portion connected to an inner portion, as described herein. For example, the border strip 302 may include a first composite sidewall component 304, a second composite sidewall component 306, a third composite sidewall component 308 (opposite the first composite sidewall component 304), and a fourth composite sidewall component 310. In some cases, as described herein, by way of non-limiting example, the composite components 304, 306, 308, 310 may be separated and / or connected together by materials that may include one or more electrically inert or electrically insulating materials, such as plastics and / or resins.

[0067] although Figure 3 The illustrated embodiment includes a border strip 302 having a plurality of composite sidewall components 304, 306, 308, 310 connected together, but in some cases, as described herein, a housing or case for an electronic device may include or be formed from a single composite component having an interior portion and an exterior portion. Additionally, in some cases, the composite component may form portions of the housing or case other than the sidewalls, such as a top portion, a bottom portion, or any portion of the housing or case. Figures 4A to 8 Further details of composite components are provided.

[0068] Figure 4A An exploded perspective view of a composite component 400 is shown, comprising an outer or exterior portion 402 and an inner or interior portion 404. Figure 4A Although shown in an exploded view, composite component 400 may include an outer or exterior portion 402 connected to or bonded to an inner or interior portion 404. In some examples, outer portion 402 may be preformed and may include a metallic material such as stainless steel, although other materials are expressly contemplated as described herein. In some examples, outer portion 402 may have a thickness greater than approximately 25 microns. Inner portion 404 may have a second, different set of material properties that are independent of the first set of material properties of outer portion 402. In some examples, outer portion 402 and inner portion 404 may be welded, bonded, adhered, or otherwise connected together such that they form a housing or portion of a housing and function as a substantially unitary body 400. Outer portion 402 and inner portion 404 may include any desired shape or design, and thus component 400 may include any desired shape and design. In some examples, component 400 may be part of a housing for an electronic device. However, in some other embodiments, component 400 may be any component of an electronic device, such as a structural component, an interior component, an exterior component, or the like.

[0069] Figure 4B An assembled perspective view of a composite component 400 is shown, for example, as Figure 4A As shown, the composite component includes features 412 and 414 formed in and at least partially defined by the interior portion 404. As shown, features 412, 414 may include protruding features, recessed features, or a combination thereof. In some examples, features such as feature 412 may be formed by an additive manufacturing process. In some examples, features such as feature 414 may be formed by a subtractive manufacturing process. In some cases, features may include holes, recesses, blind holes, cavities, protrusions, or a combination thereof. In some examples, features 412, 414 may be attachment features for one or more other components of the electronic device. As shown, Figure 4A and Figure 4B The components 400 and concepts shown can be applied to any composite component described herein in any combination. Figures 5 to 8 Describes the Figure 4A and Figure 4B Additional examples of the concepts and features discussed.

[0070] Figure 5 Shown may be similar to or include relative to Figure 3 The composite sidewall members 304, 306, 308, 310 and relative Figures 4A to 4B Composite component 510 of the features of component 400 described above. Composite component 510 may include an outer or exterior portion 522 connected to an inner or interior portion 524. In this example, exterior portion 522 may at least partially define an exterior surface of a housing or casing of an electronic device. Interior portion 524 may at least partially define a surface of an interior volume of the electronic device. Figure 5 As shown, composite component 510 may include a plurality of features 532 , 534 , 536 , which may serve as attachment features for other components of the electronic device, for example.

[0071] In some cases, features may be formed in one or both of outer portion 522 and inner portion 524 of composite component 510. For example, inner portion 524 of composite component 510 may include features such as hole 532. In some cases, feature 532 may be a hole, recess, blind hole, or other feature formed in inner portion 524 by a subtractive process (such as machining or etching). In some examples, feature 532 may serve as an attachment feature for other components of the electronic device. Feature 532 may be configured to receive components of the electronic device, such as buttons or input components. Although depicted as hole 532, feature 532 may take any desired form or shape. In some examples, feature 532 may extend at least partially to a desired depth in inner portion 524. Alternatively, however, feature 532 may extend substantially completely through the entire thickness of inner portion 524.

[0072] In some examples, features may be formed in both outer portion 522 and inner portion 524 of composite component 510. For example, feature 534 may be formed in or defined by both outer portion 522 and inner portion 524 of component 510. Feature 534 may be a hole or through-hole extending at least partially through outer portion 522 and inner portion 524. Furthermore, while portions 522 and 524 are shown as having relatively uniform thickness, in some examples, the thickness of outer portion 522 and / or inner portion 524 may vary at the location where a feature, such as feature 534, is formed. Protruding features, such as feature 536, may be formed in inner portion 524, for example, by machining or additive manufacturing processes, and may serve as attachment features for other components of the electronic device. Although depicted as protrusions defining a hole therethrough, feature 536 may comprise any desired shape or design.

[0073] As described herein, the inner portion 524 of the composite component 510 can be selected so that the composite component has a set of material properties required to form features such as features 532, 534, 536. For example, the material of the inner portion 524 can be selected to have a material property or a set of material properties that allows the inner portion 524 to be highly machinable without causing high levels of wear on the machining tools. Additionally, the material of the inner portion 524 can be relatively inexpensive so that material waste resulting from forming the features does not substantially increase production costs. Furthermore, as described herein, the material of the outer portion can be selected to have a material property or a set of material properties that are independent of the material properties of the inner portion, such material properties or this set of material properties allowing the outer portion 522 to have, for example, a high level of hardness and corrosion resistance.

[0074] In some examples, features formed in one or both of outer portion 522 and inner portion 524, such as features 532, 534, 536, can have a major dimension ranging from about micrometers to as much as about millimeters or several millimeters or more. In some cases, features such as feature 536 can have a major dimension ranging from about 100 micrometers to about 1 millimeter. Additionally, in some cases, features such as feature 536 can have a minor dimension ranging from about 100 micrometers to about 1 millimeter.

[0075] In addition, if Figure 5 As shown, the outer portion 522 can have a substantially curved shape or profile that can correspond to the outer profile of the electronic device. The outer portion 522 can have any desired shape or profile. In some examples where the outer portion has a substantially curved shape or profile, the inner portion 524 can be positioned completely behind or within the curve that defines the curved profile of the outer portion 522. Figure 6 Additional details of outer portion 522 are provided.

[0076] Figure 6 Shown Figure 5 Another perspective view of the composite component 510 of the housing. Figure 6 As shown, one or more areas of outer portion 522, such as area 538, may be removed, exposing at least some of inner portion 524. The exposed surface of inner portion 524 may be treated or otherwise processed to, for example, protect the exposed surface of inner portion 524. In some examples, outer portion 522 may comprise a stainless steel alloy, and inner portion 524 may comprise aluminum. At area 538, the aluminum of inner portion 524 is exposed externally, and the interface between the stainless steel of outer portion 522 and the aluminum of inner portion 524 may also be exposed.

[0077] In this case, the interface between the materials of the two portions may form an electrical contact, and one of the materials of portions 522, 524 may be subject to or susceptible to electrical corrosion. Therefore, areas where the interface between the materials of portions 522, 524 is exposed, such as area 538, may be processed or treated to prevent or inhibit electrical corrosion. One or more materials may be deposited over the interface between portions 522, 524 at area 538 to prevent or inhibit electrical corrosion. Example materials may include, but are not limited to, polymeric materials, metallic materials, ceramic materials, or combinations thereof.

[0078] Alternatively, the geometry of outer portion 522 and / or inner portion 524 can be designed so that the interface between these portions is not exposed even when features such as feature 538 are formed in outer portion 522. For example, in some cases, outer portion 522 can be thicker at region 538 where feature 538 is formed so that inner portion 524 is not exposed even when material is removed from outer portion 524. Inner portion 524 can be correspondingly thinner at regions where outer portion 522 has increased thickness so that composite component 510 maintains a relatively uniform thickness. Figure 7 and Figure 8 Alternative views and features of composite component 510 are detailed.

[0079] Figure 7 Shown Figure 5 and Figure 6. As shown, the thickness of one or both of the outer portion 522 and the inner portion 524 may have a thickness that varies along the length of the component 510. Alternatively, however, the thickness of the outer portion 522 and / or the inner portion 524 may be substantially uniform along the length of the component 510. The outer portion 522 may have a thickness greater than about 25 microns, greater than about 50 microns, greater than about 100 microns, 200 microns, 300 microns, 400 microns, 500 microns, or more. In some examples, the outer portion may have a thickness of up to about 1 mm, up to about 2 mm, or up to about 5 mm, or more. In alternative examples, the inner portion 524 may have any desired thickness or thicknesses. For example, as Figure 7 As shown, inner portion 524 can have a thickness ranging from about 100 microns up to about several millimeters or more. In some cases, the inner portion can have a thickness that approximates the entire width of the electronic device.

[0080] Figure 8 Shown Figures 5 to 7 , which is a side view of composite component 510 shown in . As described herein, inner portion 524 may include any number of features formed in the material or inner portion 524, or added or attached to inner portion 524 by any desired method or process. In some cases, features such as feature 534 may be used as attachment features for components of the electronic device, such as internal components or structural components. Additionally, in some examples, inner portion 524 may form or define a surface that at least partially defines an interior volume of the electronic device. In some examples, outer portion 522 may not form part of a surface that defines the interior volume of the electronic device. However, in some cases, outer portion 522 may form at least a portion of a surface that defines the interior volume of the electronic device.

[0081] While any number or types of components of an electronic device may be formed from or may include composite components, such as components 210, 310, 400, and / or 510 described in detail above, the structure of these composite components generally includes an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite components themselves, are applicable not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figures 9A to 11 Various exemplary features of composite parts are described.

[0082] As stated in this article, Figure 9AA perspective view of a composite component 600 is shown that includes an outer portion 602 bonded to an inner portion 604. In some examples, the outer portion 602 may include a metallic material, although other materials are expressly contemplated as described herein. The inner portion may include a second material that is different from the material of the outer portion and includes a second set of material properties that are independent of the set of material properties of the outer portion 602. Figure 9A As shown, outer portion 602 and inner portion 604 can cooperate to at least partially define a feature 612. In some examples, as shown, feature 612 can be a recess, hole, cavity, or other similar feature. However, in some other examples, feature 612 can include a protrusion or a positive feature, or a combination thereof. In some examples, such feature 612 can be an attachment feature for connecting component 600 to one or more other components of an electronic device.

[0083] As stated in this article, Figure 9B A simplified perspective view of a composite component 700 is shown, including an outer portion 702 joined to an inner portion 704. As shown, composite component 700 also includes an intermediate layer 706 disposed between outer portion 702 and inner portion 704, which may at least partially bond portions 702 and 704 together. In some examples, intermediate layer 706 may have any thickness and be any desired material, such as a polymeric material. In some examples, intermediate layer 706 may include a heat-activated film, an adhesive, a polymer, a resin, or an epoxy. In some cases, features, such as feature 712, may be formed in outer portion and / or inner portion 702, 704 before portions 702, 704 are joined via intermediate layer 706. However, in some other examples, portions 702, 704 may be joined via intermediate layer 706, and then one or more features, such as feature 712, may be formed in component 700.

[0084] like Figure 9A and Figure 9B The components 600 and 700 and concepts described herein may be applied to any composite component described herein in any combination. Figure 9A and Figure 9B Further details of the concepts and features discussed are as follows: Figures 10 and 11 As stated.

[0085] Figure 10 A close-up perspective view of a composite component 810 that may form part of a housing or casing for an electronic device is shown. Figures 5 to 8Like component 510 shown, component 810 may include a preformed outer portion 822 coupled to an inner portion 824. Outer portion 822 may include one or more materials having a first set of material properties, while inner portion 824 may include one or more materials having a second set of material properties independent of the first set of material properties.

[0086] As described herein, in some examples, the outer portion 822 can be directly connected, bonded, or adhered to the inner portion 824. That is, the outer portion 822 can directly contact, abut, fused, bonded, or otherwise connected to the inner portion 824. In some examples where both the outer portion 822 and the inner portion 824 comprise metallic materials, the bond between the outer portion 822 and the inner portion 824 can be a metallurgical bond. In some examples, the outer portion 822 can directly contact the inner portion 824 along substantially the entire interface or only at one or more locations. Additionally, in some embodiments, even where the portions 822, 824 are in direct contact along substantially the entire interface, the portions 822, 824 can be bonded or connected together only at one or more locations. For example, in some embodiments, the inner portion 824 can be welded to the outer portion 822 at one or more locations.

[0087] The inner portion 824 can be connected to the outer portion 822 by any number of processes, such as brazing, diffusion bonding, electron beam welding, ultrasonic welding, laser welding, and other connection methods. In some examples, the portions 822 and 824 can be welded together by a pulsed laser welding process, such as a nanosecond pulsed laser welding process. In examples where a welding process is used, the welding process can be performed along the interface or seam between the portions 822 and 824, or can be performed through one or both of the portions 822 and 824 at any number of desired locations.

[0088] like Figure 10 As further shown, composite component 810 may include one or more features, such as feature 832, which are formed or defined by both outer portion 822 and inner portion 824. In some cases, feature 832 may be, for example, an attachment feature for one or more components of an electronic device. Feature 832 may also be used for alternative or additional purposes, and may, for example, be used to reduce the weight of composite component 810. In some examples, feature 832 may facilitate connection of composite component 810 to another composite component to form an enclosure or housing, such as border strip 102 or 202, as described herein. In some examples, feature 832 may mechanically engage with a material (such as material 114, 214, 314 described herein) to form border strip 102, 202.

[0089] While any number or types of components of an electronic device may be formed from or may include composite components, such as components 210, 310, 400, 510, 600, and / or 810, the structure of these composite components may be, for example, a composite component including an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite components themselves, may apply not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figure 11 Various embodiments of composite parts are described.

[0090] Figure 11 An exemplary composite component 910 is shown that may include a preformed outer portion 922 connected to an inner portion 924 via an intermediate layer 926. The intermediate layer 926 may include any desired material, such as a polymeric material, a ceramic material, a metallic material, or a combination thereof. In some examples, the intermediate layer 926 may include a heat-activated film, an adhesive material, an injection-molded material such as an injection-molded metal or polymeric material, and similar connecting materials. In some examples, the intermediate layer 926 may include a resin or epoxy that is curable to bond the outer portion 922 to the inner portion 924. The intermediate layer may also include a moldable material (such as a polymeric material) that may be provided in a moldable form between the portions 922 and 924 and cured or cooled to bond the portions 922 and 924 together.

[0091] The intermediate layer 926 can have any desired thickness. In some examples, the intermediate layer can have a thickness of up to about 1 micron or less, about 5 microns, about 10 microns, about 50 microns, about 100 microns, about 200 microns, about 300 microns, about 500 microns, about 0.1 mm, about 0.5 mm, about 1 mm, about 2 mm, or about 5 mm or more. In some examples, one or more surfaces of the outer portion 922 and / or the inner portion 924 can include features that can mechanically engage with the intermediate layer 926 (e.g., to bond the two portions together). For example, a surface of the outer portion 922 and / or the inner portion 924 can include nanoscale features, microscale features, or macroscale features that mechanically engage with the intermediate layer 926. These features can be formed by processing the surfaces of the portions 922, 924 (e.g., by machining, etching, and similar surface treatments).

[0092] In some examples, as discussed herein, where the outer portion 922 and the inner portion 924 may comprise materials susceptible to galvanic corrosion, such as steel and aluminum, the intermediate layer 926 may be used to inhibit or prevent such corrosion (e.g., by preventing direct contact between the portions 922, 924 in at least some locations). In some examples, the intermediate layer 926 may be present at or along the entire interface between the outer portion 922 and the inner portion 924. However, in other examples, the intermediate layer 926 may be present only at one or more locations between the portions 922, 924, such as at locations where the interface between the outer portion 922 and the inner portion 924 is exposed or may be exposed to the external environment.

[0093] As described herein, the outer portion 922 and the inner portion 924 of the composite component 910 including the intermediate layer 926 may additionally or alternatively be connected or joined by other methods. For example, the outer portion 922 may be connected to the inner portion 924 by mechanically bonding to the intermediate layer 926 at one or more locations and by welding at one or more other locations.

[0094] While any number or types of components of an electronic device may be formed from or may include composite components, such as components 210, 310, 400, 510, and / or 810, the structure of these composite components may be a composite component including an outer portion connected to an inner portion, as described herein. The structure and materials of the outer and inner portions, as well as the composite components themselves, may apply not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Detailed descriptions of the embodiments of FIG. 12 and FIG. 13 may be provided below with reference to FIG. 14 and FIG. 15. Figure 14 Various embodiments of composite parts are described.

[0095] Figure 12AAn exploded, simplified view of a composite component 1000 is shown, including an outer portion 1002 and an inner portion 1004. As described herein, the outer portion may comprise a first material, such as a metal, and may be preformed. The inner portion 1004 may at least partially define one or more features 1012, 1014 and, as shown, may comprise two or more layers 1022, 1024, 1026, 1028. In some examples, these layers 1022-1028 may comprise or be formed from a single material, which may include any of the materials generally used to form inner portions as described herein. Alternatively, however, one or more of the layers 1022-1028 may comprise a different material than another layer. For example, layer 1022 may comprise a second material different from the first material of the outer portion 1002, while layer 1024 may comprise a third material different from both the first material of the outer portion 1002 and the second material of layer 1022. The layers 1022-1028 of the inner portion 1004 can be bonded to one another by any of the methods described herein for bonding parts together (e.g., welding, brazing, diffusion bonding, adhesives, mechanical joining, and other similar bonding or connecting methods). Although the layers 1022-1028 are described in a substantially horizontal stack, the layers can be arranged in any desired manner to form the inner portion 1004. For example, the layers can be stacked vertically, horizontally, or at any angle therebetween.

[0096] like Figure 12B As shown, layers 1022-1028 may cooperate to form and define interior portion 1004 of component 1000. Additionally, two or more layers 1024, 1026 may cooperate to form or define one or more features 1012, 1014. In some examples, as shown, feature 1012 may be a recess, hole, cavity, or the like. However, in some other examples, feature 1014 may include a protrusion, a positive feature, or a combination thereof. Such features 1012, 1014 may be attachment features used to connect component 1000 to one or more other components of an electronic device. In some examples, layers 1022-1028 may be shaped or formed into a desired shape before being joined together to define features 1012, 1014. However, in some other cases, layers 1022-1028 may be joined or connected together and then subjected to additive or subtractive processing to form one or more features 1012, 1014 therein.

[0097] like Figure 12A and Figure 12B The component 1000 and concepts described can be applied to any composite component described herein in any combination. Figure 13 and Figure 14 Describes the Figure 12A and Figure 12BAdditional examples of the concepts and features discussed.

[0098] Figure 13 A composite component 1110 is shown that can be or can form part of a housing or enclosure, such as the bezel strips 102, 202 described herein. As described herein, the composite component 1110 can include an outer or exterior portion 1122 connected to an inner or interior portion 1124. The exterior portion 1122 can at least partially define an exterior surface of the enclosure or enclosure of the electronic device. In this example, the interior portion 1124 can at least partially define a surface that defines an interior volume of the electronic device and can include or be formed from one or more layers 1141, 1142.

[0099] like Figure 13 As shown, the inner portion 1124 having two or more layers 1141, 1142 may include features, such as feature 1132, that may serve as attachment features for other components of the electronic device. Figure 13 As shown, two or more layers 1141, 1142 can cooperate to form a feature, such as feature 1132, in inner portion 1124. In some examples, feature 1132 can be formed in inner portion 1124 after two or more layers 1141, 1142 are connected together, for example, by machining. Alternatively, layers 1141, 1142 can be shaped prior to connection so as to define feature 1132 when connected. In those cases where layers 1141, 1142 can be shaped prior to connection to form feature 1132, inner portion 1124 and / or feature 1132 can be treated or machined to further define the shape of the feature. Figure 11 Further details are provided of how multiple layers may be connected to form the inner portion 1124 .

[0100] Now go to Figure 14, shows an exploded view of inner portion 1124 including layers 1141, 1142, 1143, 1144, 1145, 1146, 1147, 1148, 1149, and 1150 that comprise portion 1124. In some examples, layers 1141-1150 can comprise or be formed from a single material, which can include any of the materials generally described herein for forming inner portions. Alternatively, however, one or more of layers 1141-1150 can comprise a different material than the other layers in layers 1141-1150. For example, layers 1141, 1143, 1145, 1147, 1149 can comprise a first material, such as a metallic material, while layers 1142, 1144, 1146, 1148, 1150 can comprise a different second material, such as a polymeric material. Other configurations of these layers and materials are expressly contemplated. In the context of connecting an outer portion to an inner portion to form a substantially unitary inner portion 1124, layers 1141-1150 can be connected or joined to one another by any of the methods or processes described herein. For example, layer 1141 can be directly welded to adjacent layer 1142, or layers 1141, 1142 can be connected together by an intermediate material such as an adhesive or a heat-activated film.

[0101] In some examples, one or more of the layers 1141-1150 can be formed into a desired shape or design before being connected to another layer to form the inner portion 1124. For example, the layer 1144 can include a metallic material such as aluminum and can be formed by stamping out an aluminum sheet having a desired layer thickness. The stamped layer 1144 can then be connected or bonded to one or more adjacent layers 1143, 1145 to form the inner portion 1124. As described above with respect to Figure 13 As described, layers 1141-1150 can cooperate to form or define feature 1132. Alternatively, feature 1132 can be formed in or defined by a single layer (such as layer 1145).

[0102] One or more of layers 1141-1150 may be substantially continuous or unitary. However, in some cases, one or more of layers 1141-1150 (such as layer 1145) may not be continuous and may include two or more disconnected or discontinuous portions or components. In some cases, underlying layers such as layer 1146 may be used to hold or maintain these portions or components of discontinuous layer 1145 in a desired position or orientation.

[0103] One or more of layers 1141-1150 may have substantially the same thickness or height as one or more other layers in layers 1141-1150. However, in some examples, one or more of layers 1141-1150 may have a different thickness than one or more other layers in layers 1141-1150. Each layer 1141-1150 may have any desired thickness, for example, up to about 10 microns, about 25 microns, about 50 microns, about 100 microns, about 200 microns, about 300 microns, about 400 microns, about 500 microns, or more. In some examples, layers 1141-1150 may have a thickness of about 1 millimeter, about 2 millimeters, or more.

[0104] Although layers 1141-1150 are shown in an orientation where the width of an individual layer substantially corresponds to the width of inner portion 1124 and the thickness of an individual layer constitutes only a fraction of the height of inner portion 1124, in some cases, layers 1141-1150 may be arranged, shaped, or connected in any number of orientations. For example, the height of an individual layer may substantially correspond to the height of inner portion 1124, while the width of an individual layer may constitute only a fraction of the width of inner portion 1124. Alternatively, layers 1141-1150 may be shaped and / or connected such that the width, height, and / or length of a layer constitutes only a fraction of the width, height, and / or length of inner portion 1124.

[0105] While any number or types of components of an electronic device may be formed from or may include composite components, such as components 210, 310, 400, 510, 600, 700, 810, 910, and / or 1110, the structure of these composite components may include an external portion connected to an internal portion, as described herein. The structure and materials of the external and internal portions, as well as the composite components themselves, may apply not only to the specific examples discussed herein, but also to any number or types of embodiments in any combination. Figures 15 to 18 Various embodiments are described in connection with methods and processes for forming the presently described structures.

[0106] As stated in this article, Figure 15 A process flow diagram of an exemplary process for forming a composite component is shown. At block 1210, process 1200 for forming a composite component may include joining a preformed portion (such as an outer portion as described herein) comprising a first material having a first material property or a first set of material properties with a second portion (such as an inner portion as described herein) comprising a second material having a second material property or a second set of material properties. Once joined, the process continues at block 1220 by forming one or more features in at least the second portion.

[0107] At block 1210, a preformed first portion may be joined to a second portion. The preformed first portion may include a first material, while the second portion may include a second material that may be independently selected. The materials of the first and second portions may include any of the materials described herein with respect to the inner and / or outer portions of the composite component. In some examples, prior to joining, the preformed first portion may be treated or processed, for example, to form a desired contour or shape or to form one or more features therein.

[0108] In some examples, the preformed first part can be positioned or maintained in a desired position, for example, by a clamping device or other device, and the second part can be brought into contact with the preformed first part so that the parts are connected together to form a substantially integral body. The specific process for connecting these parts may include any process discussed herein and may be selected based on the materials of the preformed first part and the second part. For example, the connection may include directly connecting the preformed first part to the second part by a process such as welding (e.g., ultrasonic welding or laser welding), brazing, diffusion bonding, fusion, or other similar methods. In some examples, the connection may include pulsed laser welding, such as nanosecond pulsed laser welding. Alternatively, as described herein, the connection may include mechanically joining the features of the preformed first part to the corresponding features of the second part.

[0109] In some examples, connection may alternatively or additionally include providing a layer or material between the preformed first and second parts to connect these parts together. Therefore, in some examples, connection may include providing a material such as an adhesive, glue, heat-activated film, polymer material (such as epoxy or resin) or another moldable material between the preformed first and second parts. This intermediate layer can be provided as a moldable material between these parts at least some positions, and can be cured or cooled to connect these parts. In some cases, the intermediate material can form a direct bond with the surface of one or two parts, such as chemical bonding or metallurgical bonding. In some examples, the intermediate material can connect these parts by mechanically engaging with one or more features on the surface of these parts alternatively or additionally.

[0110] In some examples, the second part can be connected to the preformed first part by providing the second part to the preformed first part in a moldable form and solidifying, cooling, or otherwise hardening the material of the second part. For example, the second part can be cast, die-cast, molded, injection molded, metal injection molded, or otherwise formed into one or more features of the preformed first part. In some examples, the preformed first part can be present in a mold or other device, and the second part can be provided into the mold to harden and connect to the preformed first part.

[0111] In some examples, providing the second part in a moldable form can connect the preformed first part to the second part by directly forming a bond (such as a chemical bond or a metallurgical bond) between the materials of the first part and the second part. These parts can alternatively or additionally be connected by mechanical bonding between the material of the second part and one or more features (such as nanoscale, microscale and / or macroscale features) formed in or on the surface of the first part. Thus, in some examples, the material of the second part can flow or otherwise be provided into one or more receiving features of the preformed first part and harden, thereby mechanically bonding and connecting the parts.

[0112] Furthermore, although the first portion is described as a preformed first portion, it can be formed substantially simultaneously with the second portion. For example, in some cases, the first portion and the second portion can be co-extruded or both can be provided in a moldable form such that the portions are joined by chemical bonding, metallurgical bonding, mechanical bonding, other connecting features, or a combination thereof.

[0113] At block 1220, one or more features are formed in at least the second portion of the composite component. The one or more features may be formed according to any process or method described herein, such as an additive or subtractive manufacturing process. For example, the one or more features may be formed in at least the second portion by machining, etching, deposition, molding, or other processes. Alternatively, for example, as described herein, the one or more features may be formed in both the preformed first portion and the second portion.

[0114] The forming of one or more features in at least the second component at block 1220 can occur substantially simultaneously with the joining step at block 1210. For example, in some cases where the second portion can be cast or molded into a preformed first portion, one or more features can be formed in the second portion during the molding or casting process as the second portion hardens or otherwise forms and joins with the first portion. As described herein, the formed composite component can undergo further processing and treatment. For example, the outer surface of the preformed first portion can be treated (e.g., by depositing a physical vapor deposition (PVD) layer thereon) to provide a desired color or surface finish.

[0115] Figure 16 and Figure 17 An example of a unitary body 1300, 1400 is shown that includes a preformed first portion 1322, 1422 connected to a second portion 1324, 1424, as described above with respect to the method 1200. Figure 16As shown, the preformed first portion 1322 can be directly connected to the second portion. In addition, in some cases, the preformed first portion can have a non-rectangular profile and can have, for example, a curved profile that substantially corresponds to the desired final profile of the composite part. Figure 17 As shown, an intermediate layer 1426 may be present between the pre-formed first portion 1422 and the second portion 1424 as described herein.

[0116] Figure 16 and Figure 17 The monolithic bodies 1300, 1400 shown in FIG do not yet have any features formed thereon as detailed in block 1220. In some examples, the monolithic bodies 1300, 1400 can be processed in a substantially similar manner and by substantially similar equipment and apparatus as a monolithic piece of material to form a composite part. For example, the composite monolithic bodies 1300, 1400 can be processed by a machining apparatus that is typically used to machine parts from a body of a single material.

[0117] Figure 18 A schematic diagram depicting the process steps of the above-described method 1200 including die casting the second portion 1524 onto the preformed first portion 1522 is shown. The preformed first portion 1522 may initially be provided or formed in any general shape or configuration. As described above, the preformed portion 1522 may be subjected to treatment or processing to, for example, provide the portion with a desired outer contour. Figure 18 As shown, this includes machining or otherwise removing material from the portion to achieve the desired curved profile. Figure 14 As described in method 1200, the second portion can be provided in a moldable form adjacent to the first portion and hardened, thereby connecting the first portion and the second portion, for example, by die casting or metal injection molding. In some examples, the casting or molding process can also form one or more features 1532 in at least the second portion substantially simultaneously with the connecting step. The connected composite monolithic body can then be further processed, for example, to provide one or more surface treatments, or to further define or form features in the first portion and / or the second portion, as described herein.

[0118] Any of the features or aspects of the composite components discussed herein may be combined or included in any combination of variations. For example, the design and shape of the outer portion or first part and the inner portion or second part are not limited in any way and may be formed by any number of processes, including those discussed herein. In addition, the first part may be connected to the second part by any known method at any time, even during the formation of one or both parts. As described herein, the composite component may be or may form all or part of a component (such as a housing or casing) of an electronic device. The composite component may also be or form any number of additional components of an electronic device, including an inner component, an outer component, a casing, a surface, or a portion of a surface.

[0119] As used herein, the terms exterior, outside, interior, and inside are used for reference purposes only. An exterior portion or outer portion of a composite component may form a portion of the component's exterior surface, but may not necessarily form the entire exterior of the component's exterior surface. Similarly, an interior portion or inner portion of a composite component may form or define an interior portion or inner portion of the component, but may also form or define a portion of the component's exterior surface or exterior surface.

[0120] Various inventions have been described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that numerous modifications may be made without departing from the scope and spirit of the invention disclosed herein, as those set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. As used in this specification and claims, the terms "comprising" and "having" shall have the same meaning as the term "including."

[0121] For illustrative purposes, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that specific details are not required to practice the embodiments. Therefore, the foregoing descriptions of the specific embodiments described herein are presented for illustration and description purposes. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

Claims

1. A housing of an electronic device, comprising: an elongated housing comprising a first metal having a first set of material properties and a surface having a curved shape, the surface at least partially defining an exterior surface of the electronic device, the elongated housing defining an engagement feature; and an inner portion comprising a second metal having a second set of material properties independent of the first set of material properties and at least partially defining the engagement feature, the inner portion being bonded to the first metal of the elongated shell and disposed inwardly of the surface, wherein the engagement feature defines a through hole having a central axis extending longitudinally along the elongated shell, the through hole being defined by and surrounded by the elongated shell and the inner portion.

2. The housing according to claim 1, wherein: The elongated shell is preformed and has a thickness greater than 25 microns; and The inner portion and the elongated shell form a unitary body.

3. The housing according to claim 1, wherein The housing is positioned around a perimeter of the electronic device, and the surface at least partially defines an outer perimeter of the electronic device.

4. The housing according to claim 1, wherein The inner portion is joined to the elongated shell by welding, brazing, diffusion bonding or mechanical joining.

5. The housing of claim 1, further comprising an intermediate polymer layer disposed between the elongated shell and the inner portion, the intermediate polymer layer bonding the inner portion to the elongated shell.

6. The housing according to claim 1, wherein The second metal is different from the first metal.

7. A component for an electronic device, comprising: A first composite sidewall member, the first composite sidewall member defining an exterior surface of the electronic device, the first composite sidewall member comprising: a metallic outer portion comprising a first material having a first set of material properties, the outer portion having a thickness greater than 25 micrometers and at least partially defining the outer surface and engagement features of the electronic device; and an inner portion bonded to the outer portion and comprising a second material having a second set of material properties independent of the first set of material properties, the inner portion defining an interior volume and at least partially defining the engagement feature, the engagement feature including an attachment feature for attaching to a component disposed in the interior volume, the attachment feature defining a through-hole defined by the first material of the metallic outer portion and the second material of the inner portion; and a second composite sidewall member defining the exterior surface, the second composite sidewall member being separated from the first composite sidewall member by an electrically inert material, Wherein, the inner part and the preformed outer part form a unitary body.

8. The component according to claim 7, wherein The first material includes steel, aluminum, or titanium, and the second material includes copper, aluminum, or steel different from the first material.

9. The component according to claim 7, wherein The inner portion is joined to the preformed outer portion by welding, brazing, diffusion bonding, or mechanical joining.

10. The component according to claim 7, wherein The inner portion is bonded to the preformed outer portion by die casting the inner portion into the preformed outer portion.

11. The component of claim 7, further comprising an intermediate polymer layer disposed between the inner portion and the preformed outer portion and bonding the inner portion and the metallic outer portion.

12. The component according to claim 7, wherein The inner portion includes two layers that are bonded together and cooperate to define the engagement feature.

13. The component according to claim 7, wherein The engagement feature is defined by both the inner portion and the pre-formed outer portion.

14. A method of forming a component for an electronic device, comprising: connecting a preformed portion comprising a first material having a first material property to a second portion comprising a second material having a second material property independent of the first material property to form a unitary elongated body, the second portion defining an interior volume of the electronic device; as well as One or more features defined by the preformed portion and the second portion are formed in the second portion, the one or more features including an attachment feature configured to attach to a component disposed in the interior volume, the attachment feature defining a through hole axially parallel to the elongated body, the through hole being defined by and surrounded by the first material and the second material.

15. The method according to claim 14, wherein Connecting comprises welding or brazing the second portion to the pre-formed portion.

16. The method according to claim 14, wherein Connecting comprises providing an intermediate layer between said pre-formed part and said second part.

17. The method according to claim 14, wherein: Connecting includes die casting the second portion into the preformed portion.

18. A composite structure comprising: a first housing material having a first set of material properties and defining a curved surface and a mechanical engagement feature, the curved surface at least partially defining an exterior portion of the electronic device; a second core material having a second set of material properties independent of the first set of material properties and at least partially defining the mechanical engagement feature, the second core material being disposed interiorly of the curved surface; and An intermediate layer is positioned between the first shell material and the second core material, wherein the intermediate layer comprises a moldable material that bonds the first shell material and the second core material together, and wherein the intermediate layer is used to inhibit galvanic corrosion.

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