Aluminum nitride insulation heat dissipation integrated substrate and preparation method thereof

Abstract

The application provides an aluminum nitride insulation and heat dissipation integrated substrate and a preparation method thereof, which comprises an aluminum nitride insulation layer and an aluminum nitride liquid cooling heat dissipation layer; the aluminum nitride insulation layer is integrally formed on at least one side of the aluminum nitride liquid cooling heat dissipation layer; the aluminum nitride liquid cooling heat dissipation layer is provided with a cooling flow channel, and the two ends of the cooling flow channel are respectively a fluid inlet and a fluid outlet; and the aluminum nitride insulation layer is integrally formed with a chip mounting groove. The application adopts an aluminum nitride ceramic to integrally design the overall structure, and is integrally prepared by using an additive manufacturing process. The application has reliable and stable structure, good insulation and heat dissipation effects, and is convenient and simple to produce and install.

Description

Technical Field

[0001] The present invention relates to the field of high-power electronic component heat dissipation, and in particular to an aluminum nitride insulation and heat dissipation integrated substrate and a preparation method thereof. Background Art

[0002] Currently, power components are moving towards high-density assembly, high power, lightweight, and compact size. This places higher demands on the heat dissipation modules of power devices. While improving heat dissipation performance, it is also necessary to reduce space and ensure the stability and reliability of electronic devices. Conventional power semiconductor packaging modules are generally manufactured using a multi-layer stacking process. The large number of stacked layers increases the difficulty of the packaging process, and the thermal resistance of the multiple stacked layers also affects the efficient heat transfer, making it impossible to meet the development requirements of small size. Summary of the Invention

[0003] In response to the deficiencies in the prior art, the present invention provides an aluminum nitride insulating and heat-dissipating integrated substrate and a preparation method thereof. The present invention adopts aluminum nitride ceramics for an integrated design of the overall structure and adopts an additive manufacturing process for integrated preparation. The present invention has a reliable and stable structure, good insulation and heat dissipation effects, and is easy to produce and install.

[0004] The present invention is achieved through the following technical solutions:

[0005] An aluminum nitride insulation and heat dissipation integrated substrate, comprising an aluminum nitride insulation layer and an aluminum nitride liquid cooling and heat dissipation layer; the aluminum nitride insulation layer is integrally formed on at least one side of the aluminum nitride liquid cooling and heat dissipation layer;

[0006] A cooling channel is provided in the aluminum nitride liquid cooling heat dissipation layer, with a fluid inlet and a fluid outlet at both ends of the cooling channel respectively; a chip mounting groove is integrally formed on the aluminum nitride insulating layer.

[0007] Preferably, the fluid inlet and the fluid outlet are located at the same end of the aluminum nitride liquid cooling heat dissipation layer, and a cleaning window for cleaning the cooling channel is provided at the other end of the aluminum nitride liquid cooling heat dissipation layer.

[0008] Furthermore, the cleaning window is covered with a window cover; or, the cleaning window is filled with aluminum nitride ceramics.

[0009] Preferably, the aluminum nitride insulating layer is integrally formed on one side surface or two opposite side surfaces of the aluminum nitride liquid cooling and heat dissipation layer.

[0010] Preferably, the cooling channel is a single-layer channel or a spatial multi-layer channel.

[0011] Preferably, the thickness of the aluminum nitride insulation layer is 0.5-10 mm, and the thickness of the aluminum nitride liquid cooling heat dissipation layer is 0.5-20 mm.

[0012] The method for preparing the aluminum nitride insulation and heat dissipation integrated substrate comprises:

[0013] S1, using aluminum nitride ceramic slurry as raw material, using a 3D printing method to print a ceramic body;

[0014] S2, degreasing and sintering the ceramic body to obtain an aluminum nitride insulation and heat dissipation integrated substrate.

[0015] Preferably, in S1, the 3D printing method is a photo-curing printing method; after printing is completed, the aluminum nitride ceramic slurry inside the cooling channel is cleaned, and a ceramic body is obtained after cleaning.

[0016] Furthermore, the fluid inlet and fluid outlet of the cooling channel are located at the same end of the aluminum nitride liquid cooling heat dissipation layer, and a cleaning window for cleaning the cooling channel is provided at the other end of the aluminum nitride liquid cooling heat dissipation layer;

[0017] In S1, after printing is completed, the aluminum nitride ceramic slurry inside the cooling channel is cleaned. After cleaning is completed, the cleaning window is closed to obtain a ceramic body.

[0018] Furthermore, the cleaning of the aluminum nitride ceramic slurry inside the cooling channel is specifically as follows:

[0019] An air gun was used to connect the nozzle to the fluid inlet and outlet of the printed model to clean out the aluminum nitride ceramic slurry. The model was then immersed in a cleaning solution and vacuumed under ultrasonic conditions.

[0020] Remove the model from the cleaning liquid and repeat the above cleaning process until the aluminum nitride ceramic slurry inside the cooling channel is cleaned.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The present invention combines an insulating substrate with a liquid-cooled radiator to achieve an integrated design. Specifically, the aluminum nitride insulating layer and the aluminum nitride liquid-cooled heat dissipation layer are integrally formed. The aluminum nitride insulating layer plays an insulating role, and cooling liquid is passed into the cooling flow channel in the aluminum nitride liquid-cooled heat dissipation layer to achieve the heat dissipation function. The insulating layer and the heat dissipation layer are integrally formed, which reduces thermal resistance and improves the overall heat dissipation performance by more than 10%.

[0023] Furthermore, the present invention provides a cleaning window on the integrated substrate to facilitate cleaning of the cooling channel during the preparation process.

[0024] Furthermore, when the present invention provides a spatial multi-layer flow channel, it can better achieve the heat dissipation function.

[0025] The present invention uses aluminum nitride ceramic slurry to uniformly prepare the overall structure of the integrated insulation and heat dissipation substrate, realizes the molding of the ceramic body through the 3D printing process, and then obtains the finished product through cleaning, degreasing and hot pressing sintering processes. Compared with the traditional multi-layer tooling process, the tooling process is simplified, the assembly space is compressed, the production efficiency and product stability are improved, and the heat dissipation efficiency can be improved while ensuring stable and reliable insulation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic structural diagram of an aluminum nitride insulation and heat dissipation integrated substrate according to Example 1 of the present invention.

[0027] Figure 2 This is a side view of the aluminum nitride insulation and heat dissipation integrated substrate structure of Example 1 of the present invention.

[0028] Figure 3 for Figure 2 Cross-section of the middle flow channel at AA.

[0029] Figure 4 This is a cleaning window form of the aluminum nitride insulation and heat dissipation integrated substrate in Examples 1 and 2 of the present invention.

[0030] Figure 5 This is a schematic structural diagram of an aluminum nitride insulation and heat dissipation integrated substrate according to Example 2 of the present invention.

[0031] Figure 6 This is a diagram of the fluid volume domain inside the flow channel of the aluminum nitride insulation and heat dissipation integrated substrate of Example 2 of the present invention.

[0032] Figure 7 This is a side view of the aluminum nitride insulation and heat dissipation integrated substrate structure of Example 2 of the present invention. DETAILED DESCRIPTION

[0033] In order to further understand the present invention, the present invention is described below in conjunction with embodiments. These descriptions are only for further explaining the features and advantages of the present invention and are not intended to limit the claims of the present invention.

[0034] See also Figure 1-7 The aluminum nitride insulation and heat dissipation integrated substrate of the present invention includes an aluminum nitride insulation layer 2 and an aluminum nitride liquid cooling and heat dissipation layer 3; the aluminum nitride insulation layer 2 is integrally formed on at least one side of the aluminum nitride liquid cooling and heat dissipation layer 3, and preferably, the aluminum nitride insulation layer 2 is integrally formed on one side or two opposite sides of the aluminum nitride liquid cooling and heat dissipation layer 3.

[0035] A cooling channel 7 is provided within the aluminum nitride liquid cooling heat dissipation layer 3. A fluid inlet 4 and a fluid outlet 8 are located at either end of the cooling channel 7. In one embodiment, the fluid inlet 4 and the fluid outlet 8 are located at the same end of the aluminum nitride liquid cooling heat dissipation layer 3. A cleaning window 5 for cleaning the cooling channel 7 is provided at the other end of the aluminum nitride liquid cooling heat dissipation layer 3. The cleaning window 5 is covered with a window cover 6.

[0036] The aluminum nitride insulating layer 2 is integrally formed with a chip mounting groove 1, which is formed according to the chip arrangement requirements. The chip mounting groove 1 is used to secure the chip. The substrate of the present invention utilizes the insulating and thermal conductivity properties of aluminum nitride ceramic to provide insulation and thermal conductivity. The cooling fluid flowing through the cooling channel 7 cools the chip. The cleaning window 5 is used to clean excess material from the cooling channel 7 during the preparation process.

[0037] The thickness of the aluminum nitride insulating layer 2 may be 0.5-10 mm, and the thickness of the aluminum nitride liquid cooling heat dissipation layer may be 0.5-20 mm.

[0038] The cooling medium used in the cooling channel is an anhydrous coolant, and the cooling channel can be designed as a single-layer channel or a spatial multi-layer channel according to the heat dissipation efficiency.

[0039] The cleaning window 5 can be in the form of a cuboid or other shapes, or can be a plurality of holes. When the hole diameter is less than 3 mm, the window cover 6 is not required.

[0040] The preparation method of the aluminum nitride insulating and heat-dissipating integrated substrate of the present invention is to stack aluminum nitride ceramic slurry in a layer-by-layer cumulative manner through a 3D printing process. After printing is completed, excess raw materials inside the cooling channel are cleaned. After cleaning, the cleaning window is closed, and then a degreasing and sintering process is used to ensure the densification of the aluminum nitride insulating and heat-dissipating integrated substrate.

[0041] Specifically, the following steps are included:

[0042] S1, printing model: prepare aluminum nitride ceramic slurry, use a photocuring printer to print the ceramic slurry, and load the ceramic slurry into the printer hopper; import the model data file into the control software, the printer prints the model according to the imported data file, and selects an infrared laser with a wavelength range of 500nm-13000nm to scan and solidify the aluminum nitride ceramic slurry; after printing, the excess slurry is recycled, and the slurry on the surface of the printed model is cleaned, and then the slurry inside the cooling channel is cleaned through the cleaning window 5. After cleaning, the ceramic body is obtained. Since the ceramic slurry has certain self-supporting characteristics, there is no need to add additional support inside the cooling channel. The internal structure of the cooling channel can ensure the molding of the structure inside the cooling channel, so there is no need to consider the removal of internal support.

[0043] S2, Sealing the Cleaning Window: Evenly apply aluminum nitride ceramic slurry to the four edges of the window cover 6, ensuring that the window cover adheres to the cleaning window through the aluminum nitride ceramic slurry. If the cleaning window 5 consists of multiple small holes with a diameter of less than 3 mm, the window cover 6 is not required; the aluminum nitride ceramic slurry can be applied directly to the holes. After sealing, perform infrared light curing for 20-30 minutes.

[0044] S3, degreasing and sintering of the ceramic body: During degreasing, since aluminum nitride is easily oxidized by oxygen in the air above 500°C, the designed maximum degreasing temperature must not exceed 500°C. The cross-linked light-cured resin in the ceramic body is completely oxidized and removed within 500°C; after degreasing, hot pressing and sintering are carried out to obtain an aluminum nitride ceramic sintered body.

[0045] The aluminum nitride ceramic slurry includes aluminum nitride powder, photosensitive resin premix, dispersant, and photoinitiator.

[0046] The method for cleaning the slurry inside the cooling channel is as follows: after printing is completed, the model is immediately taken out, and then the slurry inside the cooling channel is cleaned with an air gun, and the air gun nozzle is respectively connected to the fluid inlet and the fluid outlet, so that most of the slurry is cleaned out. To further ensure that the slurry between the microstructures inside the cooling channel is cleaned out, the model is placed in a suction bottle filled with a special cleaning liquid to ensure that the model is completely immersed in the cleaning liquid. The upper mouth of the suction bottle is connected to the vacuum air pump suction pipe, and the sealed bottle is placed in an ultrasonic cleaning tank. The ultrasonic cleaning and vacuum air pump are turned on at the same time. After working for a period of time, preferably 15 minutes, the model is taken out and the cooling channel is flushed again with an air gun. This cycle is repeated until the slurry inside the cooling channel is completely cleaned.

[0047] Example 1

[0048] In this embodiment, an aluminum nitride insulation and heat dissipation integrated substrate and a preparation method thereof are provided. Figure 1-3 As shown, the aluminum nitride insulation and heat dissipation integrated substrate consists of an aluminum nitride insulation layer 2 and an aluminum nitride liquid cooling and heat dissipation layer 3; a cooling channel 7 is provided in the aluminum nitride liquid cooling and heat dissipation layer 3, and the two ends of the cooling channel 7 are respectively a fluid inlet 4 and a fluid outlet 8, and the fluid inlet 4 and the fluid outlet 8 are located at the same end of the aluminum nitride liquid cooling and heat dissipation layer 3, and a cleaning window 5 for cleaning the cooling channel 7 is provided at the other end of the aluminum nitride liquid cooling and heat dissipation layer 3, and the cleaning window 5 is covered with a window cover 6 or the cleaning window 5 is filled with aluminum nitride ceramics; a chip mounting groove 1 is integrally formed on the aluminum nitride insulation layer 2.

[0049] In this embodiment, the thickness of the aluminum nitride insulating layer 2 may be 2.5 mm, and the chip mounting groove 1 thereon may be in the shape of a cuboid, a boss, or other protruding forms.

[0050] In this embodiment, the thickness of the aluminum nitride liquid cooling heat dissipation layer 3 can be 5mm. The cooling channel 7 is a single-layer multi-channel channel with a thickness of 5mm. To ensure the molding quality, the design of the internal coolant channel should take into account the minimum shape size of not less than 1mm. Figure 3 for Figure 2 The cross-sectional view at AA provides a display of the middle cross-sectional structure of the cooling channel 7. The cooling medium used in the cooling channel 7 is an anhydrous coolant.

[0051] In this embodiment, the cleaning window 5 can be in the form of a cuboid or other shapes, or can be a plurality of holes. Figure 4 When the aperture is less than 3mm, no window cover is required.

[0052] The present invention also provides a method for preparing an aluminum nitride insulation and heat dissipation integrated substrate, the method specifically comprising:

[0053] S1, prepare aluminum nitride ceramic slurry, use a photocuring printer to print the ceramic slurry, and load the ceramic slurry into the printer hopper; import the model data file into the control software, the printer prints the model according to the imported data file, and selects an infrared laser with a wavelength range of 12300nm to scan and solidify the aluminum nitride ceramic slurry; after printing, the excess slurry is recovered, and the slurry on the surface of the printed model is cleaned, and then the slurry inside the cooling channel 7 is cleaned through the cleaning window 5. After cleaning, a ceramic body is obtained. Since the ceramic slurry has certain self-supporting properties, no additional support is required inside the cooling channel 7. The internal structure of the channel can ensure the molding of the structure inside the channel, so there is no need to consider the removal of the internal support.

[0054] S2, closing the cleaning window: evenly apply aluminum nitride ceramic slurry on the four edges of the window cover 6, so that the window cover is adhered to the cleaning window 5 through the aluminum nitride ceramic slurry. When the cleaning window 5 consists of a plurality of small holes with a diameter of less than 3 mm (see Figure 4 ), without the need for a window cover, aluminum nitride ceramic slurry can be applied directly to the hole. After sealing, it is cured with an infrared lamp for 25 minutes.

[0055] S3, degreasing and sintering of ceramic bodies: During degreasing, aluminum nitride is easily oxidized by oxygen in the air above 500°C. Therefore, the maximum degreasing temperature should not be higher than 500°C. A thermal degreasing method is used, with intermittent gradient heating to 450°C (gradient temperatures are 75°C, 200°C, 250°C and 450°C) and then cooling with the furnace to completely remove the cross-linked photocurable resin in the printed ceramic body through oxidation. After degreasing, hot pressing and sintering are carried out at a high pressure of 25MPa and 1700°C for 4h to obtain a ceramic body with a density of 3.26g / cm3 , an aluminum nitride ceramic sintered body with a thermal conductivity of 200 W / mk and an aluminum nitride lattice oxygen content of 0.49 wt%.

[0056] In this embodiment, the aluminum nitride ceramic slurry includes aluminum nitride powder, a photosensitive resin premix, a dispersant, and a photoinitiator.

[0057] In this embodiment, the method for cleaning the slurry inside the cooling channel is to take out the model immediately after printing is completed, and then use an air gun to clean the slurry inside the cooling channel, and connect the air gun mouth to the fluid inlet and fluid outlet respectively, so that most of the slurry is cleaned out. In order to further ensure that the slurry between the microstructures inside the cooling channel 7 is cleaned out, the model is placed in a suction bottle filled with a special cleaning liquid to ensure that the model is completely immersed in the cleaning liquid. The upper mouth of the suction bottle is connected to the vacuum air pump suction pipe, and the sealed bottle is placed in the ultrasonic cleaning tank. The ultrasonic cleaning and vacuum air pump are turned on at the same time. After working for 15 minutes, the model is taken out and the air gun is used again to flush the inside of the cooling channel. This cycle is repeated until the slurry inside the cooling channel is completely cleaned.

[0058] Example 2

[0059] In this embodiment, an aluminum nitride insulation and heat dissipation integrated substrate and a preparation method thereof are provided. Figure 5-7 As shown, the aluminum nitride insulation and heat dissipation integrated substrate includes an aluminum nitride insulation layer 2 and an aluminum nitride liquid cooling and heat dissipation layer 3; a cooling channel 7 is provided in the aluminum nitride liquid cooling and heat dissipation layer 3, and the two ends of the cooling channel 7 are respectively a fluid inlet 4 and a fluid outlet 8, and the fluid inlet 4 and the fluid outlet 8 are located at the same end of the aluminum nitride liquid cooling and heat dissipation layer 3, and a cleaning window 5 for cleaning the cooling channel 7 is provided at the other end of the aluminum nitride liquid cooling and heat dissipation layer 3; the cleaning window 5 is covered with a window cover 6, or the cleaning window 5 is filled with aluminum nitride ceramics; a chip mounting groove 1 is integrally formed on the aluminum nitride insulation layer 2.

[0060] In this embodiment, the aluminum nitride insulating layer 2 may be 2 mm thick and distributed on both sides of the aluminum nitride liquid cooling layer 3 . The chip mounting slots 1 on the aluminum nitride insulating layer 2 may be double-sided card slots.

[0061] In this embodiment, the thickness of the aluminum nitride liquid cooling layer 3 can be 7mm. Its internal cooling channel 7 is a spatial multi-layer channel to improve the heat dissipation efficiency. To ensure the molding quality, the internal coolant channel design considers the minimum shape size of not less than 1mm. Figure 6 The structure of the cooling channel 7 is shown, and the cooling medium used in the cooling channel 7 is an anhydrous coolant.

[0062] In this embodiment, the cleaning window 5 can be in a rectangular or other shape. When the aperture is less than 3 mm, no window cover is required.

[0063] An embodiment of the present invention further provides a method for preparing an aluminum nitride insulation and heat dissipation integrated substrate, the method comprising:

[0064] S1 prepares aluminum nitride ceramic slurry, prints the ceramic slurry using a photocuring printer, and loads the ceramic slurry into the printer's hopper; imports the model's data file into the control software, and the printer prints the model based on the imported data file. An infrared laser with a wavelength of 12300nm is used to scan and solidify the aluminum nitride slurry; after printing, the excess slurry is recovered, and the slurry on the surface of the printed model is cleaned, and then the slurry inside the cooling channel is cleaned. After cleaning, the ceramic body is obtained. Since the ceramic slurry has certain self-supporting properties, no additional support is required inside the cooling channel. The internal structure of the channel can ensure the formation of the structure inside the channel, so there is no need to consider removing the internal support.

[0065] S2 Close the cleaning window: Apply aluminum nitride ceramic slurry evenly on the four edges of the window cover 6 so that the window cover is adhered to the cleaning window through the aluminum nitride ceramic slurry. When the cleaning window consists of multiple small holes with a diameter of less than 3 mm (see Figure 4 ), no window cover is required, and the slurry can be applied directly to the hole. After sealing, it is cured with an infrared lamp for 25 minutes.

[0066] Degreasing and sintering of S3 ceramic body: During degreasing, aluminum nitride is easily oxidized by oxygen in the air above 500℃. Therefore, the maximum degreasing temperature should not be higher than 500℃. The thermal degreasing method is used, and the intermittent gradient heating to 450℃ (the gradient temperature is 75℃, 200℃, 250℃ and 450℃ respectively) is carried out and then cooled with the furnace to oxidize and remove the cross-linked light-cured resin in the ceramic body. After degreasing, hot pressing sintering is carried out. The density of the product is 3.23g / cm3 and the product is sintered at 25MPa high pressure and 1700℃ for 4h. 3 , an aluminum nitride ceramic sintered body with a thermal conductivity of 198 W / mk and an aluminum nitride lattice oxygen content of 0.47 wt%.

[0067] In this embodiment, the aluminum nitride ceramic slurry includes aluminum nitride powder, a photosensitive resin premix, a dispersant, and a photoinitiator.

[0068] In this embodiment, the method for cleaning the slurry inside the cooling channel is to take out the model immediately after printing is completed, and then use an air gun to clean the slurry inside the cooling channel, and connect the air gun nozzle to the fluid inlet and fluid outlet respectively, so that most of the slurry is cleaned out. In order to further ensure that the slurry between the microstructures inside the cooling channel is cleaned out, the model is placed in a suction bottle filled with a special cleaning liquid to ensure that the component is completely immersed in the cleaning liquid. The upper mouth of the suction bottle is connected to the vacuum air pump suction pipe, and the sealed bottle is placed in the ultrasonic cleaning tank. The ultrasonic cleaning and vacuum air pump are turned on at the same time. After working for 15 minutes, the sample is taken out and the internal channel is flushed again with an air gun. This cycle is repeated until the internal slurry is completely cleaned.

Claims

1. An aluminum nitride insulation and heat dissipation integrated substrate, characterized in that: It comprises an aluminum nitride insulating layer (2) and an aluminum nitride liquid cooling and heat dissipation layer (3); the aluminum nitride insulating layer (2) is integrally formed on at least one side of the aluminum nitride liquid cooling and heat dissipation layer (3); A cooling channel (7) is provided in the aluminum nitride liquid cooling heat dissipation layer (3), and two ends of the cooling channel (7) are respectively a fluid inlet (4) and a fluid outlet (8); a chip mounting groove (1) is integrally formed on the aluminum nitride insulating layer (2); The fluid inlet (4) and the fluid outlet (8) are located at the same end of the aluminum nitride liquid cooling heat dissipation layer (3), and a cleaning window (5) for cleaning the cooling channel (7) is provided at the other end of the aluminum nitride liquid cooling heat dissipation layer (3).

2. The aluminum nitride insulation and heat dissipation integrated substrate according to claim 1, characterized in that: The cleaning window (5) is covered with a window cover (6); or, the cleaning window (5) is filled with aluminum nitride ceramic.

3. The aluminum nitride insulation and heat dissipation integrated substrate according to claim 1, characterized in that: The aluminum nitride insulating layer (2) is integrally formed on one side or two opposite sides of the aluminum nitride liquid cooling and heat dissipation layer (3).

4. The aluminum nitride insulation and heat dissipation integrated substrate according to claim 1, characterized in that: The cooling channel (7) is a single-layer channel or a spatial multi-layer channel.

5. The aluminum nitride insulation and heat dissipation integrated substrate according to claim 1, characterized in that: The aluminum nitride insulating layer (2) has a thickness of 0.5-10 mm, and the aluminum nitride liquid cooling heat dissipation layer (3) has a thickness of 0.5-20 mm.

6. The method for preparing the aluminum nitride insulation and heat dissipation integrated substrate according to claim 1, characterized in that: include: S1, using aluminum nitride ceramic slurry as raw material, using a 3D printing method to print a ceramic body; after the printing is completed, cleaning the aluminum nitride ceramic slurry inside the cooling channel (7), after cleaning is completed, closing the cleaning window (5) to obtain a ceramic body; S2, degreasing and sintering the ceramic body to obtain an aluminum nitride insulation and heat dissipation integrated substrate.

7. The method for preparing the aluminum nitride insulation and heat dissipation integrated substrate according to claim 6, characterized in that: In S1, the 3D printing method is a photo-curing printing method.

8. The method for preparing the aluminum nitride insulation and heat dissipation integrated substrate according to claim 6, characterized in that: The aluminum nitride ceramic slurry for cleaning the interior of the cooling channel (7) is specifically: An air gun is used to connect the nozzle to the fluid inlet (4) and the fluid outlet (8) of the printed model, and the aluminum nitride ceramic slurry is cleaned out. The model is then immersed in a cleaning liquid and vacuumed under ultrasonic conditions. Remove the model from the cleaning liquid and repeat the above cleaning process until the aluminum nitride ceramic slurry inside the cooling channel is cleaned.

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