Printing device

Abstract

The printing device comprises: a scraper (311) which abuts against the upper surface of a mask (300) provided with an opening and moves in a specified direction to print the solder supplied to the mask onto a substrate (200); a drive unit (3a) which moves the scraper in the specified direction; and a control unit (7) which controls the movement of the scraper driven by the drive unit, wherein the control unit is configured to perform the following control: at a timing other than printing, the solder is stirred using the scraper in such a manner that the inside of the solder on the mask is exposed.

Description

Technical Field

[0001] The present invention relates to a printing device, and in particular to a printing device for printing solder onto a substrate. Background Art

[0002] Conventionally, there is known a printing device for printing solder on a substrate. This type of printing device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2010-260293.

[0003] The above-mentioned Japanese Patent Publication No. 2010-260293 discloses a printing device, which is provided with a scraper that moves in a predetermined direction to print the solder supplied to the mask on the substrate. In addition, in order to suppress the situation where the old solder remains on the mask, the printing device of the above-mentioned Japanese Patent Publication No. 2010-260293 is provided with a roller that is arranged inside the solder on the mask and is used to stir the solder, and a rotation drive source for rotationally driving the roller.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-260293 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the printing device of Japanese Patent Application Publication No. 2010-260293, in order to prevent old solder from remaining on the mask, a roller for stirring the solder and a rotation drive source for rotationally driving the roller are required to be arranged inside the solder on the mask. Therefore, there is a problem of increasing the number of components and complicating the device structure.

[0009] The present invention is made to solve the above-mentioned problems, and one object of the present invention is to provide a printing device that can suppress the increase in the number of components and the complication of the device structure, and can reduce the possibility of old solder remaining on the mask.

[0010] Technical solutions to solve problems

[0011] In order to achieve the above-mentioned purpose, a printing device according to one aspect of the present invention comprises: a scraper, which abuts against the upper surface of a mask provided with an opening and moves in a specified direction to print the solder supplied to the mask onto a substrate; a driving unit, which moves the scraper in the specified direction; and a control unit, which controls the movement of the scraper driven by the driving unit, and the control unit is configured to perform the following control: at a timing other than printing, the solder is stirred using the scraper in such a manner that the inside of the solder on the mask is exposed.

[0012] In a printing device according to one aspect of the present invention, as described above, a control unit is provided, and the control unit performs the following control: at a timing other than printing, the solder is stirred by a scraper in such a manner that the inside of the solder on the mask is exposed. In this way, the inside and the outside of the solder can be stirred effectively, thereby preventing the inside of the solder from being left unused for printing on the substrate. In addition, since the inside of the solder can be stirred by the scraper itself used for printing, it is not necessary to provide a roller for stirring the solder and a rotation drive source for rotationally driving the roller. As a result, it is possible to prevent the number of components from increasing and the device structure from becoming complicated, and to reduce the possibility of old solder remaining on the mask.

[0013] In the printing device according to the above aspect, the control unit is preferably configured to perform control such that the solder on the mask is cut off by the scraper or the solder is extended in a manner that it spreads on the mask, so that the inside of the solder on the mask is exposed, thereby stirring the solder. If configured in this way, the inside of the solder can be reliably exposed by cutting the solder by the scraper or the solder is extended in a manner that it spreads on the mask, so that the inside and outside of the solder can be stirred more effectively.

[0014] In this case, preferably, the control unit is configured to perform the following control: after the solder on the mask is cut off by the scraper or the solder is extended in a manner of spreading on the mask so that the inside of the solder on the mask is exposed, the exposed solder inside is mixed with the solder of other parts, thereby stirring the solder. If configured in this way, the scraper can be used to more effectively stir the solder inside and the solder of other parts, so that the possibility of old solder remaining inside can be more effectively reduced.

[0015] In the printing device according to the above aspect, preferably, the control unit is configured to perform control as follows: after the scraper is moved by a first movement action to expose the inside of the solder on the mask, the scraper is moved by a second movement action different from the first movement action to mix the exposed inside solder with the other parts of the solder, thereby stirring the solder. If configured in this way, the movement of the scraper to expose the inside of the solder can be made different from the movement of the scraper to mix the inside solder with the other parts of the solder, so that the exposed inside solder can be effectively prevented from returning to the inside again without being stirred.

[0016] In the printing device of one aspect above, preferably, the control unit is configured to perform the following control: the solder on the mask is cut off in the vertical direction, cut off in the horizontal direction, cut off in the oblique direction, or extended in a manner that the solder is spread on the mask by the scraper, thereby stirring the solder. If configured in this way, by cutting the solder in the vertical direction, the center position of the solder can be easily cut off regardless of the amount of the solder, so that the inside of the solder can be more effectively exposed. In addition, by cutting the solder in the horizontal direction, cutting it in the oblique direction, or extending the solder in a manner that the solder is spread on the mask, the solder can be prevented from adhering to the back side of the scraper, thereby preventing the solder attached to the back side of the scraper from peeling off and being arranged in an unexpected position during printing.

[0017] In the printing device of the above aspect, preferably, the control unit is configured to perform the following control: the solder is stirred based on at least one of the operation time, the number of printed sheets, the number of times the solder is replenished, and the stirring instruction of the user. If so configured, the inside of the solder can be exposed regularly and stirred, so the possibility of old solder remaining inside can be more effectively reduced.

[0018] Effects of the Invention

[0019] According to the present invention, as described above, it is possible to suppress an increase in the number of components and a complication of the device structure, and to reduce the possibility that old solder will remain on the mask. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a front view showing the overall structure of a printing device according to one embodiment of the present invention.

[0021] Figure 2 This is a side view of the vicinity of a squeegee unit of a printing device according to an embodiment of the present invention.

[0022] Figure 3 This is a block diagram showing a control structure of a printing device according to one embodiment of the present invention.

[0023] Figure 4 This is a diagram for explaining a first stirring example of solder in the printing device according to the embodiment of the present invention.

[0024] Figure 5 It is a diagram for explaining a second stirring example of the solder in the printing device according to the embodiment of the present invention.

[0025] Figure 6 It is a diagram for explaining a third stirring example of the solder in the printing device according to the embodiment of the present invention.

[0026] Figure 7It is a diagram for explaining a fourth stirring example of the solder in the printing device according to the embodiment of the present invention. DETAILED DESCRIPTION

[0027] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0028] Reference Figure 1 to Figure 7 , the structure of a printing device 100 according to an embodiment of the present invention is described.

[0029] The printing device 100 of this embodiment has a function of printing solder on the surface of the substrate 200 in a predetermined pattern formed in the openings of the mask 300. Figure 1 As shown, the printing device 100 includes: a base 1; a substrate stage 2, which is provided on the base 1, holds a substrate 200 and performs alignment with respect to a mask 300; and a squeegee unit 3, which is provided above the mask 300, and the mask 300 is arranged above the substrate stage 2. The printing device 100 has a function of carrying out the printed substrate 200 by the carrying-in conveyor 4b after printing the substrate 200 carried in by the carrying-in conveyor 4a.

[0030] The substrate stage 2 is mainly composed of a pair of conveyors 22 , an X-axis moving mechanism 23 , a Y-axis moving mechanism 24 , an R-axis moving mechanism 25 , a Z-axis moving mechanism 26 , and a substrate lifting and lowering support mechanism 27 .

[0031] The X-axis moving mechanism 23 has an X-axis driving unit 231 (see Figure 3 ), X-axis table 232 and X-axis rail 233. The Y-axis moving mechanism 24 has a Y-axis driving unit 241 (see Figure 3 ), Y-axis table 242 and Y-axis rail 243. The R-axis moving mechanism 25 has an R-axis driving unit 251 (see Figure 3 ) and the R-axis table 252. The Z-axis moving mechanism 26 has a Z-axis driving unit 261 (refer to Figure 3 ) and a Z-axis table 262. The substrate lifting support mechanism 27 includes a support shaft driving unit 271 (see Figure 3 ) and substrate lifting support member (multiple support pins) 272.

[0032] The substrate stage 2 holds the substrate 200 to be conveyed at a predetermined position on the conveyor 22. Thereafter, the position of the substrate 200 relative to the substrate stage 2 is recognized by a substrate camera (not shown). In addition, the position of the mask 300 is recognized in advance by a mask camera (not shown). In addition, the substrate stage 2 is configured so that, after the substrate 200 is moved by the X-axis moving mechanism 23, the Y-axis moving mechanism 24, and the R-axis moving mechanism 25 and the substrate 200 is positioned relative to the mask 300, the substrate 200 is raised to a predetermined position in close contact with the lower surface of the mask 300 by the Z-axis moving mechanism 26. In addition, the substrate camera and the mask camera are respectively configured so that, when photographing a mark (not shown) on the substrate and a mark (not shown) on the mask, the camera axis driving unit 11 (see Figure 3 ) and invades and moves into the space between the substrate workbench 2 and the mask 300.

[0033] like Figure 1 As shown in FIG. 1 , the pair of conveyors 22 are arranged to extend along the conveying direction of the substrate 200. In addition, the pair of conveyors 22 are arranged parallel to each other at a predetermined distance in the front-back direction (Y direction). In addition, the pair of conveyors 22 are configured to be able to adjust the interval in the Y direction corresponding to the width of the substrate 200 to be conveyed. Specifically, the pair of conveyors 22 are configured to be able to adjust the interval in the Y direction corresponding to the width of the substrate 200 to be conveyed by the substrate width axis driving unit 28 (see FIG. 1 ). Figure 3 ) is driven to adjust the interval (width) between a pair of conveyors 22.

[0034] In addition, the pair of conveyors 22 is configured to be connected to the substrate conveying shaft drive unit 29 (see Figure 3 ) to transport the substrate 200 in the X direction. In addition, the pair of conveyors 22 is supported from below by the Z-axis table 262 and is configured to be movable in the up-down direction (Z direction) by the Z-axis moving mechanism 26. In addition, the pair of conveyors 22 has the function of receiving the substrate 200 before printing from the in-conveyor 4a and carrying out the printed substrate 200 to the out-conveyor 4b.

[0035] In addition, on the substrate table 2, a substrate lifting support member 272 including a plurality of support pins is provided on the upper side (Z1 direction side) of the Z-axis table 262. The plurality of support pins are configured to support the substrate 200 from below. Specifically, the substrate 200 conveyed by the pair of conveyors 22 is lifted from the pair of conveyors 22 by the plurality of support pins to a predetermined height. Then, the substrate 200 raised to a predetermined height position relative to the pair of conveyors 22 is held by the substrate clamp 221 (see Figure 3 ) clamped. In this state, as described above, the substrate 200 is aligned with the mask 300 and the substrate 200 is raised to be in close contact with the lower surface of the mask 300, and the substrate 200 is held at a predetermined printing position on the lower surface of the mask 300.

[0036] The mask 300 has openings of a predetermined pattern. In addition, the mask 300 has a rectangular shape in a plan view, and a frame 301 is installed on the outer periphery. Figure 1 As shown, the mask 300 is fixedly held above the substrate stage 2 by clamping the frame 301 with the mask clamping part 5 .

[0037] like Figure 1 As shown in FIG. 1 , the scraper unit 3 is disposed above the mask 300. The scraper unit 3 has a function of scraping the solder supplied to the upper surface of the mask 300 on the upper surface of the mask 300 by reciprocating in the front-rear direction (Y direction). Thus, the solder is printed on the surface of the substrate 200 through the opening of the mask 300. Specifically, as shown in FIG. Figure 2 and Figure 3 As shown, the squeegee unit 3 includes a print head 31 and a squeegee Z-axis motor 32 for driving the print head 31 to move up and down. Alternatively, an air cylinder for driving the print head 31 to move up and down using air pressure may be provided instead of the squeegee Z-axis motor 32.

[0038] like Figure 1 As shown, the print head 31 is supported by a pair of rails 6 so as to be movable in the front-rear direction (Y direction). Specifically, the print head 31 is configured to move in the front-rear direction (Y direction) by a scraper Y-axis motor 3a (see Figure 3 ) is driven to move in the Y direction. That is, the scraper Y-axis motor 3a moves the scraper 311 in a predetermined direction (Y direction). In addition, the print head 31 is configured to be able to move up and down in the vertical direction (Z direction). Specifically, the print head 31 is configured to be able to move up and down in the vertical direction (Z direction) by the scraper Z-axis motor 3a (refer to Figure 3 ) is driven to move in the Z direction. In addition, the scraper Y-axis motor 3a is an example of a "drive unit" in the scope of the claim.

[0039] In addition, if Figure 2 As shown, the print head 31 has a print head main body 31a and a squeegee support plate 313. The print head main body 31a is mainly composed of a squeegee 311, a squeegee rotation motor 312, a pair of guides 314, a pair of compression coil springs 315 and a squeegee support bracket 316.

[0040] like Figure 1 As shown in FIG. 1 , the scraper 311 is formed to extend in the X direction. In addition, the scraper 311 is configured to abut against the upper surface of the mask 300 provided with an opening, and to move in a predetermined direction (Y direction) to print the solder supplied to the mask 300 through the opening of the mask 300 onto the substrate 200. In addition, as shown in FIG. Figure 2As shown, the scraper 311 is rotatably mounted on the scraper support bracket 316 with the support shaft 317 extending in the X direction as the rotation center. Specifically, the scraper 311 is configured to rotate with the support shaft 317 as the center when the scraper rotation motor 312 is driven.

[0041] The scraper 311 has a scraping surface (working surface) 311a for scraping solder, and scrapes the solder on the upper surface of the mask 300 by sliding in the front-rear direction (Y direction) relative to the upper surface of the mask 300. The scraper 311 uses the same scraping surface 311a in both the outward printing (printing from the rear to the front direction (Y1 direction)) and the return printing (printing from the front to the rear direction (Y2 direction)).

[0042] The scraper support plate 313 is configured to support the print head main body 31a. Specifically, the scraper support plate 313 is configured to support the print head main body 31a in a suspended manner by contacting with the stopper 314a of a pair of guide parts 314, and the print head main body 31a includes: the guide part 314; the scraper support bracket 316 connected to the lower side (Z2 direction) of the guide part 314; the scraper 311 and the scraper rotation motor 312 respectively provided on the scraper support bracket 316; and a pair of compression coil springs 315 supported by the scraper support bracket 316. In addition, the scraper support plate 313 is configured to be engaged (threaded) with the ball screw shaft 322, and moves in the up-down direction (Z direction) by the rotation of the ball screw shaft 322.

[0043] In addition, if Figure 3 As shown in FIG. 1 , the squeegee unit 3 is provided with a solder supply unit 33 . The solder supply unit 33 is configured to automatically supply solder onto the mask 300 .

[0044] In addition, if Figure 3 As shown, the printing device 100 is provided with a control unit 7 for controlling the printing device 100. The control unit 7 includes a main control unit 7a, a drive control unit 7b, and a valve control unit 7c. The main control unit 7a is composed of a CPU and has a function of controlling each unit based on a printing program stored in the storage unit 10. In addition, the main control unit 7a is configured to control the scraper unit, the conveyor unit, and the camera unit via the drive control unit 7b and the valve control unit 7c. Specifically, the drive control unit 7b controls the drive of the scraper Y-axis motor 3a, the scraper Z-axis motor 32, and the scraper rotation motor 312 to move the scraper 311 in the Y direction and the Z direction, and to rotate the scraper 311 around the support shaft 317. That is, the control unit 7 controls the movement of the scraper 311 realized by the scraper Y-axis motor 3a, the scraper Z-axis motor 32, and the scraper rotation motor 312.

[0045] In addition, the driving control unit 7b controls the driving of the solder supply unit 33 to supply solder to the mask 300. Specifically, the control unit 7 controls the supply of solder to the mask 300 every predetermined number of printed sheets. In addition, the control unit 7 uses a sensor (not shown) or a camera (not shown) to obtain the amount of solder on the mask 300, and when it is determined that the amount of solder is less than the predetermined amount, the control unit 7 controls the supply of solder to the mask 300 using the solder supply unit 33.

[0046] In addition, the drive control unit 7b controls the driving of the X-axis driving unit 231, the Y-axis driving unit 241, the R-axis driving unit 251, and the Z-axis driving unit 261, so that the substrate 200 clamped by the substrate clamping member 221 of the conveyor unit moves in the X direction, the Y direction, and the Z direction. In addition, the drive control unit 7b controls the driving of the R-axis driving unit 251, so that the substrate 200 clamped by the substrate clamping member 221 of the conveyor unit rotates in the R-axis direction with the Z-axis direction as the rotation center. In addition, the drive control unit 7b controls the driving of the support shaft driving unit 271, so that the substrate lifting support member 272 (support pin) moves in the up-down direction (Z direction). In addition, the drive control unit 7b controls the driving of the camera shaft driving unit 11 of the camera unit, so that the mask camera (not shown) for recognizing the position and posture of the mask 300 is moved.

[0047] In addition, the drive control unit 7b controls the drive of the substrate width axis drive unit 28 to adjust the interval (width) in the Y direction of the conveyor 22. In addition, the drive control unit 7b controls the drive of the substrate conveying axis drive unit 29 to convey the substrate 200 in the X direction by the conveyor 22. In addition, the valve control unit 7c controls the air drive of the substrate clamp 221 to control the opening and closing of the clamp of the substrate 200. In addition, the drive control unit 7b controls the drive of the camera axis drive unit 11 of the camera unit to move a substrate camera (not shown) for recognizing the position and posture of the substrate 200.

[0048] In addition, the camera unit is equipped with a mask camera facing upward and a substrate camera facing downward. In addition, the substrate clamp 221 clamps the substrate 200 from both sides of the substrate 200 in the Y direction. When the substrate 200 is clamped, the height position (Z direction position) of the upper surface of the substrate clamp 221 is consistent with the height position (Z direction position) of the upper surface of the substrate 200, and the substrate clamp 221 is configured to support the load from the scraper 311 through the mask 300 in the same manner as the substrate 200.

[0049] The main control unit 7a is configured to cause the display unit 8 to display the operating state of the printing device 100. The main control unit 7a is configured to receive various information inputted via the input unit 9 by the operator.

[0050] Here, in the present embodiment, the control unit 7 is configured to perform the following control: at a timing other than printing, the solder on the mask 300 is stirred by the scraper 311 in such a manner that the solder (hereinafter referred to as "the inside of the solder") that will remain inside the solder and not be used for printing even if the solder rolls on the mask 300 is exposed. Specifically, the control unit 7 is configured to perform the following control: the solder on the mask 300 is cut off by the scraper 311 or the solder is extended in such a manner that it spreads on the mask 300, so that the inside of the solder on the mask 300 is exposed, thereby stirring the solder.

[0051] Here, when the solder on the mask 300 is printed onto the substrate 200 using the scraper 311, the scraper 311 is moved along the Y direction, thereby rolling and moving the solder on the mask 300. As a result, the solder can be filled into the opening of the mask 300 with high precision, neither too much nor too little. When the solder is rolled, the solder inside the rotation axis close to the solder may not continue to stay inside due to the rotation and move outward. In addition, when new solder is supplied, since the internal solder is also arranged on the inside after the new solder is supplied, it is sometimes not used for printing and remains. Therefore, it is necessary to fully stir the solder so that the old solder does not remain inside.

[0052] Under the condition that the solder is completely stirred, when the solder is replaced at a ratio of t / 1 hour (0<t<1), the probability (ratio) that the solder from 4 hours ago will remain 4 hours later is (1-t)^4. For example, in the case of t=0.7, the probability (ratio) that the solder will remain is 0.3^4=0.0081, and more than 99% of the solder is replaced, and almost no solder from 4 hours ago will remain.

[0053] In addition, in the present embodiment, the control unit 7 is configured to perform the following control: after the solder on the mask 300 is cut off by the scraper 311 or the solder is extended in a manner that it spreads on the mask, so that the inside of the solder on the mask 300 is exposed, the exposed inside solder is mixed with the solder of other parts, thereby stirring the solder. Specifically, the control unit 7 is configured to perform the following control: after the scraper 311 is moved by a first moving action to expose the inside of the solder on the mask 300, the scraper 311 is moved by a second moving action different from the first moving action to mix the exposed inside solder with the solder of other parts, thereby stirring the solder.

[0054] In addition, the control unit 7 is configured to perform the following control: using the scraper 311 to cut the solder on the mask 300 in the vertical direction (Z direction), in the horizontal direction (Y direction), in the inclined direction, or to extend the solder in a manner that spreads on the mask 300, thereby stirring the solder.

[0055] Specifically, in Figure 4 In the first stirring example shown, the solder S on the mask 300 is cut in the horizontal direction (Y direction) by the scraper 311 and stirred. Figure 4 In the first stirring example shown, Figure 4 As shown in (a), as a first movement operation, the scraper 311 moves horizontally toward the solder S while floating upward from the mask 300. Then, as shown in FIG. Figure 4 As shown in (b), the solder S on the mask 300 is cut off in the horizontal direction (Y direction) by the scraper 311. In addition, the height position of the scraper 311 during the first moving action can be set so that the amount of solder S is measured using a sensor or a camera, and the lower end of the scraper 311 passes through the central portion S1 of the solder S (the portion of the solder arranged in the center before stirring). In addition, in the first moving action, the scraper 311 can be repeatedly moved several times at different height positions. Then, after cutting off the solder S in the horizontal direction, the scraper 311 is moved to abut against the mask 300, as shown in FIG. Figure 4 As shown in (c), the solder S attached to the scraper 311 is placed on the mask 300. Then, as a second moving operation, Figure 4 As shown in (d), the scraper 311 moves in the vertical direction and the horizontal direction (Y direction) to merge the cut solder S and stir the solder S.

[0056] In addition, Figure 5 In the second stirring example shown, the solder S on the mask 300 is cut in the vertical direction (Z direction) by the scraper 311 and stirred. Figure 5 In the second stirring example shown, Figure 5 As shown in (a), as a first moving action, the scraper 311 moves from above the solder S toward the solder S downward. In addition, the horizontal direction (Y direction) position of the scraper 311 during the first moving action can be set to measure the position of the solder S using a sensor or a camera so that the lower end of the scraper 311 passes through the central portion S1 of the solder S (the portion of the solder arranged in the center before stirring). In addition, in the first moving action, the scraper 311 can also be repeatedly moved several times at different horizontal positions. In addition, the horizontal direction (Y direction) position of the scraper 311 during the first moving action can also be directly specified using, for example, the input unit 9. Then, as Figure 5As shown in (b), after the solder S is cut in the vertical direction, the scraper 311 is moved to abut against the mask 300, and the solder S attached to the scraper 311 is arranged on the mask 300. In this case, the scraper 311 may be moved in a manner that the vertical movement of the scraper 311 is further combined with the horizontal movement. Figure 5 As shown in (c), the scraper 311 rises. Then, as a second moving action, Figure 5 As shown in (d), the scraper 311 moves in the vertical direction and the horizontal direction (Y direction) to merge the cut solder S and stir the solder S.

[0057] In addition, Figure 6 In the third stirring example shown, the solder S on the mask 300 is cut in an oblique direction by the scraper 311 and stirred. Figure 6 In the third stirring example shown, Figure 6 As shown in (a), as a first movement, the scraper 311 moves obliquely downward from above the solder S toward the solder S. Then, as shown in Figure 6 As shown in (b), the solder S on the mask 300 is cut off in an oblique direction by the scraper 311. In addition, the position in the horizontal direction (Y direction) at which the scraper 311 starts to move during the first moving action can be set so that the position of the solder S is measured using a sensor or a camera, and the lower end of the scraper 311 passes through the central portion S1 of the solder S obtained based on the above measurement (the portion of the solder arranged in the center before stirring). In addition, in the first moving action, the scraper 311 can be repeatedly moved in an oblique direction multiple times starting from different horizontal movement starting positions. Then, after cutting off the solder S in the oblique direction, the scraper 311 is moved to abut against the mask 300, and the solder S attached to the scraper 311 is arranged on the mask 300. Thereafter, as Figure 6 As shown in (c), the scraper 311 rises. Then, as a second moving action, Figure 6 As shown in (d), the scraper 311 moves in the vertical direction and the horizontal direction (Y direction) to merge the cut solder S and stir the solder S.

[0058] In addition, Figure 7 In the fourth stirring example shown, the solder S on the mask 300 is stirred by the scraper 311 extending on the mask 300. In other words, the solder S on the mask 300 is stirred while being flattened by the scraper 311. Figure 7 In the fourth stirring example shown, Figure 7As shown in (a), as the first movement, the scraper 311 moves horizontally toward the solder S while floating upward from the mask 300. In addition, the height position of the scraper 311 during the first movement can also be set to a position where the scraper 311 slightly returns upward from the position where it abuts against the mask 300. Then, as shown in FIG. Figure 7 As shown in (b), the solder S extends in a manner that it spreads on the mask 300. As a result, the central portion S1 of the solder S (the solder portion arranged in the center before stirring) is exposed. Figure 7 As shown in (c), the scraper 311 rises. Then, as a second moving action, Figure 7 As shown in (d), the scraper 311 moves in the vertical direction and the horizontal direction (Y direction) to gather the stretched solder S and stir the solder S.

[0059] The solder stirred on the mask 300 is rolled by moving in the Y direction using the scraper 311. The solder is rolled by moving the solder a predetermined distance while reciprocating in the Y direction. Thus, the stirred solder returns to a shape suitable for printing on the substrate 200.

[0060] The solder on the mask 300 may be stirred and then rolled using the end region of the mask 300 where no opening is provided, or may be performed using the entire mask 300 with the substrate 200 disposed below the mask 300 .

[0061] In addition, in the present embodiment, the control unit 7 is configured to perform the following control: the solder is stirred based on at least one of the operation time, the number of printed sheets, the number of times the solder is replenished, and the user's stirring instruction. For example, in the case of the operation time, the solder is stirred every predetermined operation time. In addition, in the case of the number of printed sheets, the solder is stirred every predetermined number of printed sheets. In addition, in the case of the number of times the solder is replenished, the solder is stirred every predetermined number of replenishments. In addition, in the case of the user's stirring instruction, the solder is stirred when the stirring instruction is received from the user.

[0062] In this embodiment, the following effects can be obtained.

[0063] In the present embodiment, as described above, the control unit 7 is provided, and the control unit 7 performs the following control: at a timing other than printing, the solder is stirred by the scraper 311 in such a manner that the inside of the solder on the mask 300 is exposed. Thus, the inside and outside of the solder can be stirred effectively, and thus it is possible to prevent the inside of the solder from being left unused for printing on the substrate 200. In addition, since the inside of the solder can be stirred by the scraper 311 itself used for printing, it is not necessary to provide a roller for stirring the solder and a rotation drive source for rotationally driving the roller. As a result, it is possible to prevent the number of components from increasing and the device structure from becoming complicated, and it is possible to reduce the possibility of old solder remaining on the mask 300.

[0064] In addition, in the present embodiment, as described above, the control unit 7 is configured to perform control such that the solder on the mask 300 is cut off or the solder is extended in a manner that it spreads on the mask 300 by the scraper 311, so that the inside of the solder on the mask 300 is exposed, thereby stirring the solder. Thus, by cutting the solder by the scraper 311 or extending the solder in a manner that it spreads on the mask 300, the inside of the solder can be reliably exposed, and thus the inside and outside of the solder can be stirred more effectively.

[0065] In addition, in the present embodiment, as described above, the control unit 7 is configured to perform the following control: after the solder on the mask 300 is cut off or extended on the mask by the scraper 311, the inside of the solder on the mask 300 is exposed, and the exposed solder inside is mixed with the solder of other parts, thereby stirring the solder. In this way, the scraper 311 can be used to more effectively stir the solder inside and the solder of other parts, so that the possibility of old solder remaining inside can be more effectively reduced.

[0066] In addition, in the present embodiment, as described above, the control unit 7 is configured to perform the following control: after the scraper 311 is moved by the first movement to expose the inside of the solder on the mask 300, the scraper 311 is moved by the second movement different from the first movement to mix the exposed inside solder with the other parts of the solder, thereby stirring the solder. Thus, the movement of the scraper 311 to expose the inside of the solder can be made different from the movement of the scraper 311 to mix the inside solder with the other parts of the solder, so that the exposed inside solder can be effectively prevented from returning to the inside again without being stirred.

[0067] In addition, in the present embodiment, as described above, the control unit 7 is configured to perform the following control: the solder on the mask 300 is cut in the vertical direction (Z direction), cut in the horizontal direction (Y direction), cut in the oblique direction, or extended in a manner that the solder is spread on the mask 300 by the scraper 311, thereby stirring the solder. Thus, by cutting the solder in the vertical direction, the center position of the solder can be easily cut regardless of the amount of the solder, so that the inside of the solder can be more effectively exposed. In addition, by cutting the solder in the horizontal direction, cutting it in the oblique direction, or extending it in a manner that the solder is spread on the mask, the solder can be prevented from adhering to the back side of the scraper 311, so that the solder adhering to the back side of the scraper 311 during printing can be prevented from peeling off and being arranged in an unexpected position.

[0068] In addition, in the present embodiment, as described above, the control unit 7 is configured to perform the following control: the solder is stirred based on at least one of the operation time, the number of printed sheets, the number of times the solder is replenished, and the stirring instruction of the user. Thus, the inside of the solder can be exposed regularly and stirred, so the possibility of old solder remaining inside can be more effectively reduced.

[0069] In addition, the embodiments disclosed this time should be considered to be illustrative in all aspects and not restrictive. The scope of the present invention is not shown by the description of the above embodiments, but by the scope of the claims, and includes all changes within the meaning and scope equivalent to the scope of the claims.

[0070] For example, in the above-mentioned embodiment, an example of a structure in which the solder on the mask is cut into two and stirred is shown, but the present invention is not limited to this. In the present invention, the solder on the mask may be cut into three or more and stirred.

[0071] In addition, in the above-mentioned embodiment, an example of a structure in which the solder on the mask is cut or expanded with the scraping surface of the scraper facing downward is shown, but the present invention is not limited thereto. In the present invention, the solder on the mask may also be cut or expanded with the scraping surface of the scraper vertically erected or facing upward.

[0072] In addition, in the above-mentioned embodiment, an example of printing solder on a substrate by contact printing in which printing is performed by bringing the substrate and the mask into close contact is shown, but the present invention is not limited to this. In the present invention, a gap printing (non-contact printing) method in which a gap (space) is provided between the substrate and the mask and printing (scraping) and release processes are performed simultaneously can also be applied to print solder on the substrate.

[0073] In addition, in the above embodiment, an example of a printing device with a single channel structure having one channel for conveying substrates in the front-to-back direction (Y direction) is shown, but the present invention is not limited thereto. In the present invention, a printing device with a multi-channel structure having a plurality of channels for conveying substrates in the front-to-back direction (Y direction) may also be used.

[0074] In addition, in the above-mentioned embodiment, an example of a structure in which one scraper is moved in two directions, the front-back direction (Y direction), to perform printing is shown, but the present invention is not limited thereto. In the present invention, a structure in which two scrapers are provided, a scraper that moves in the forward direction to perform printing and a scraper that moves in the backward direction to perform printing.

[0075] Description of symbols

[0076] 3a Scraper Y-axis motor (drive unit)

[0077] 7 Control Unit

[0078] 100 Printing device

[0079] 200 substrates

[0080] 300 Mask

[0081] 311 Scraper

Claims

1. A printing device comprising: a squeegee that abuts against an upper surface of a mask provided with an opening and moves in a predetermined direction to print the solder supplied to the mask onto a substrate; a driving unit for moving the scraper in the specified direction; and a control unit for controlling the movement of the scraper driven by the driving unit, The control unit is configured to perform the following control: at a timing other than printing, the solder on the mask is cut off by the scraper or the solder is extended to spread on the mask in a manner such that the center portion of the solder on the mask is exposed, thereby stirring the solder by the scraper.

2. The printing device according to claim 1, wherein: The control unit is configured to perform the following control: using the scraper to cut off the solder on the mask or extend the solder in a manner that expands on the mask, so that the inside of the solder on the mask is exposed, and then the exposed solder inside is mixed with the solder of other parts, thereby stirring the solder.

3. The printing device according to claim 1 or 2, wherein: The control unit is configured to perform the following control: after the scraper is moved by a first movement action to expose the inside of the solder on the mask, the scraper is moved by a second movement action different from the first movement action to mix the exposed inside solder with other parts of the solder, thereby stirring the solder.

4. The printing device according to claim 1 or 2, wherein: The control unit is configured to control the scraper to cut the solder on the mask in a vertical direction, in a horizontal direction, in an oblique direction, or to extend the solder so as to spread on the mask, thereby stirring the solder.

5. The printing device according to claim 1 or 2, wherein: The control unit is configured to perform control to stir the solder based on at least one of an operation time, a number of printed sheets, a number of times the solder is replenished, and a stirring instruction from a user.

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