Structure and method for manufacturing the same

Abstract

The present application relates to a structure and a manufacturing method thereof. The structure (101) is provided with: a ceramic substrate (1) having a first surface (1a); a first conductor pattern (7) disposed on the first surface (1a); and a first columnar conductor (5) connected to the first conductor pattern (7) and extending in a thickness direction in a direction away from the ceramic substrate (1). The first columnar conductor (5) has a recess on an end surface on a side close to the ceramic substrate (1), and the first surface (1a) has a raised portion in a region overlapping the first columnar conductor (5) so as to correspond to the recess.

Description

Technical Field

[0001] This invention relates to a structure and a method for manufacturing the same. Background Technology

[0002] Japanese Patent No. 2681327 (Patent Document 1) discloses a method for manufacturing a bumped circuit board having a ceramic substrate and bumps provided on the surface of the ceramic substrate. According to Patent Document 1, the bumps are obtained by forming through holes in an unsintered sheet that has not been sintered at the sintering temperature of a green sheet, filling the through holes with conductors, and removing the unsintered sheet after a heating process.

[0003] Patent Document 1: Japanese Patent No. 2681327

[0004] In Patent Document 1, the electrode, referred to as a bump, does not deform during hot pressing and heating of the green sheet, thus preventing deviations in shape, thickness, and spacing. Furthermore, the object referred to as a "bump" in Patent Document 1 is a columnar electrode, and therefore will be referred to below as a columnar conductor.

[0005] When it is desired to form such columnar conductors with uniform height without subsequent grinding or other processing, the conductive paste used to fill the through-holes for forming the columnar conductors needs to be a conductive paste with minimal shrinkage during calcination. In this case, due to the minimal shrinkage of the conductive paste, the interface between the ceramic substrate and the columnar conductor becomes flat, making it difficult to achieve high bonding strength between the columnar conductor and the ceramic substrate. Therefore, when applying significant force to the columnar conductor during resin sealing processes or similar procedures performed after its formation, defects such as the columnar conductor peeling off from the ceramic substrate may occur. Summary of the Invention

[0006] Therefore, the purpose of this invention is to improve the bonding strength between the columnar conductor and the ceramic substrate.

[0007] To achieve the above objectives, the structure based on the present invention comprises: a ceramic substrate having a first surface; a first conductor pattern disposed on the first surface; and a first columnar conductor connected to the first conductor pattern and extending in the thickness direction away from the ceramic substrate. The first columnar conductor has a recess at its end face near the ceramic substrate. The first surface has a raised portion in the region overlapping with the first columnar conductor to correspond to the recess.

[0008] According to the present invention, the end face of the first columnar conductor has a recess, thereby increasing the bonding area and thus improving the bonding strength between the first columnar conductor and the ceramic substrate. Attached Figure Description

[0009] Figure 1This is a cross-sectional view of the structure based on Embodiment 1 of the present invention.

[0010] Figure 2 yes Figure 1 A magnified view of a portion of the image.

[0011] Figure 3 This is an explanatory diagram of the first step of the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0012] Figure 4 This is an explanatory diagram of the second step of the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0013] Figure 5 This is an explanatory diagram of the third step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0014] Figure 6 This is an explanatory diagram of the fourth step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0015] Figure 7 This is an explanatory diagram of the fifth step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0016] Figure 8 This is an explanatory diagram of the sixth step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0017] Figure 9 This is an explanatory diagram of the seventh step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0018] Figure 10 This is an explanatory diagram of the eighth step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0019] Figure 11 This is an explanatory diagram of the ninth step in the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0020] Figure 12 This is an explanatory diagram of the tenth step of the manufacturing method of the structure based on Embodiment 1 of the present invention.

[0021] Figure 13 This is a cross-sectional view of the structure based on Embodiment 2 of the present invention.

[0022] Figure 14 yes Figure 13 A magnified view of a portion of the image.

[0023] Figure 15 This is a top view showing the positional relationship of the first columnar conductor and the conductor through-hole in the structure according to Embodiment 2 of the present invention.

[0024] Figure 16 This is a top view showing the positional relationship of the first columnar conductor and the conductor through-hole in a second example of the structure based on Embodiment 2 of the present invention.

[0025] Figure 17 This is a top view showing the positional relationship of the first columnar conductor and the conductor through-hole in a third example of the structure based on Embodiment 2 of the present invention.

[0026] Figure 18 This is a top view showing the positional relationship of the first columnar conductor and the conductor through hole in the fourth example of the structure based on Embodiment 2 of the present invention.

[0027] Figure 19 This is a perspective view of the structure based on Embodiment 3 of the present invention.

[0028] Figure 20 This is a bottom view of the structure based on Embodiment 3 of the present invention.

[0029] Figure 21 It is about Figure 20 A sectional view along line XXI-XXI in the middle.

[0030] Figure 22 It is about Figure 20 A sectional view along line XXII-XXII in the middle.

[0031] Figure 23 This is a cross-sectional view of the structure based on Embodiment 4 of the present invention.

[0032] Figure 24 This is a first explanatory diagram of the manufacturing method of the structure based on Embodiment 4 of the present invention.

[0033] Figure 25 This is a second explanatory diagram of the manufacturing method of the structure based on Embodiment 4 of the present invention.

[0034] Figure 26 This is a bottom view of the structure based on Embodiment 5 of the present invention.

[0035] Figure 27 It is about Figure 26 A sectional view along lines XXVII-XXVII.

[0036] Figure 28 It is about Figure 26 A sectional view along lines XXVIII-XXVIII.

[0037] Figure 29 This is a cross-sectional view of the structure based on Embodiment 6 of the present invention.

[0038] Figure 30 yes Figure 29 A magnified view of a portion of the image. Detailed Implementation

[0039] The dimensions shown in the accompanying drawings are not necessarily true representations of actual dimensions; sometimes they are exaggerated for ease of explanation. In the following description, the concepts of up or down are not limited to absolute up or down, but sometimes refer to relative up or down in the illustrated pose.

[0040] (Implementation Method 1)

[0041] Reference Figures 1-2 The structure based on Embodiment 1 of the present invention will be described. Figure 1 This is a cross-sectional view of the structure 101 in this embodiment.

[0042] The structure 101 includes: a ceramic substrate 1 having a first surface 1a; a first conductor pattern 7 disposed on the first surface 1a; and a first columnar conductor 5 connected to the first conductor pattern 7 and extending along the thickness direction in a direction away from the ceramic substrate 1. The ceramic substrate 1 has a second surface 1b as the side opposite to the first surface 1a. The ceramic substrate 1 includes a plurality of stacked insulating layers 2. Figure 2 Indicates will Figure 1 The image shows a magnified view of the first columnar conductor 5 and its vicinity. The first columnar conductor 5 has a recess 5x on its end face near the ceramic substrate 1. The first surface 1a has a raised portion 9 in the area overlapping with the first columnar conductor 5, so as to correspond to the recess 5x.

[0043] Some conductor films (not shown) may also be provided on the lower surface of the first columnar conductor 5. Even if more than one conductor film made of a material different from the other parts of the first columnar conductor 5 is provided on the lower surface of the first columnar conductor 5, the whole including these conductor films shall be regarded as the first columnar conductor 5.

[0044] Conductor patterns 16 and conductor vias 13 are disposed inside the ceramic substrate 1. The conductor patterns 16 are disposed at the interfaces between insulating layers 2. The conductor vias 13 penetrate the insulating layer 2 along the thickness direction. A conductor via 13 is also disposed below the first conductor pattern 7. The conductor via 13 located at this position electrically connects the first conductor pattern 7 and the conductor pattern 16.

[0045] Here, an example is shown where a conductor through-hole 13 is disposed below the first columnar conductor 5, but the presence of a conductor through-hole 13 at this location is not mandatory. For example, it could also be a structure where the first conductor pattern 7 is connected to the lower side of the first columnar conductor 5, and the conductor through-hole 13 is connected to the lower side of the first conductor pattern 7 at the end of the first conductor pattern 7 extending laterally. Alternatively, it could also be a structure without a conductor through-hole 13 connected to the first conductor pattern 7.

[0046] Components 41 and 42 are mounted on the second surface 1b. On the first surface 1a, the first columnar conductor 5 is sealed with sealing resin 6a. The end face of the first columnar conductor 5 away from the ceramic substrate 1 is exposed from the sealing resin 6a. Components 41 and 42 on the second surface 1b are covered by sealing resin 6b.

[0047] In this embodiment, the first columnar conductor 5 has a recess 5x on its end face near the ceramic substrate 1, and the first surface 1a has a protrusion 9 in the area overlapping with the first columnar conductor 5 to correspond to the recess 5x. Therefore, the first conductor pattern 7 is located between them in a curved shape along this shape. By having such a configuration, the bonding area between the first columnar conductor 5 and the first conductor pattern 7, as well as the bonding area between the first conductor pattern 7 and the ceramic substrate 1, are both increased. Therefore, the bonding strength between the first columnar conductor 5 and the ceramic substrate 1 is improved, and as a result, the reliability of the structure is improved.

[0048] In this embodiment, the structure 101 includes a conductor via 13. The conductor via 13 is connected to the first conductor pattern 7 and extends along the thickness direction from the first surface 1a toward the interior of the ceramic substrate 1. As shown in this embodiment, when viewed from above, the conductor via 13 is preferably configured to overlap at least partially with the first columnar conductor 5 at a position offset from the center of the first columnar conductor 5. In this way, the conductor via 13 is located at a position offset from the center of the first columnar conductor 5, thereby reducing the risk of wire breakage associated with deformation of the first columnar conductor 5.

[0049] The first columnar conductor 5 is not only connected to the ceramic substrate 1, but also to the conductor through-hole 13 via the first conductor pattern 7. Therefore, they can be connected by metallic bonds, enabling a bond with higher strength than that between the ceramic layer and the metal. By increasing the bond strength, the risk of breakage can be reduced.

[0050] Furthermore, as shown in this embodiment, the first columnar conductor 5 can have a tapered shape whose diameter decreases as it moves away from the first surface 1a. By adopting this structure, a larger bonding area with the first surface 1a can be ensured, thereby improving the bonding strength.

[0051] Alternatively, the first columnar conductor 5 may also have a tapered shape whose diameter increases as it moves away from the first surface 1a. By adopting this structure, the bonding area of ​​the first columnar conductor 5 when the structure is mounted on the mother substrate or the like can be ensured to be large, thereby improving the bonding strength.

[0052] Furthermore, the shrinkage rate of the material of the first columnar conductor 5 during calcination is preferably greater than that of the material of the ceramic substrate 1 during calcination. This relationship in shrinkage rates allows for more reliable generation of the depression 5x during calcination, effectively increasing the bonding area.

[0053] Furthermore, in this embodiment, the structure 101 is described as having components 41 and 42 mounted on the second surface 1b and these components covered by sealing resin 6b, but this is only an example. Components 41 and 42 and sealing resin 6b are not essential for the structure. The structure based on the present invention can also be a structure in which no components are mounted on the second surface 1b. The structure based on the present invention can also be a structure in which no components are mounted on the second surface 1b and no sealing resin 6b is formed. A structure including a structure in which components are mounted on any surface of a ceramic substrate is sometimes referred to as a "module".

[0054] (Manufacturing method)

[0055] Reference Figures 3 to 12 The manufacturing method of the structure in this embodiment will be described. First, as Figure 3 As shown, sacrificial sheet 20 is prepared. Sacrificial sheet 20 is a sheet that has not been sintered within the temperature range for sintering the ceramic composition of the ceramic green sheet. Next, as... Figure 4 As shown, a through hole 14 is formed in the sacrificial piece 20. The process of forming the through hole 14 can be performed, for example, by laser processing. Figure 4 In the example shown, a through hole 14 is formed by laser processing from the lower surface. Furthermore, as... Figure 5 As shown, conductive paste 15 is filled into the through hole 14.

[0056] like Figure 6 As shown, a first laminate 81 is prepared as a ceramic green sheet 12. The first laminate 81 has a first surface 1a. The first laminate 81 has a conductor pattern 16 and a conductor through-hole 13 inside. The first laminate 81 has a first conductor pattern 7 on the first surface 1a.

[0057] like Figure 7 As shown, sacrificial pieces 20 are stacked on the first surface 1a of the first laminate 81. This yields a second laminate 82. The second laminate 82 is then calcined in this state. The result is... Figure 8The state shown is as follows. After the calcination process, the conductive paste 15 filling the through-hole 14 shrinks. Each ceramic green sheet 12 becomes an insulating layer 2. After the calcination process, the stack of ceramic green sheets 12 becomes a ceramic substrate 1, which serves as the stack of insulating layers 2. In the ceramic substrate 1, multiple insulating layers 2 have been integrated. Since the portion of the conductive paste 15 in contact with the sacrificial sheet 20 does not shrink, but the central portion of the conductive paste 15 shrinks, the first columnar conductor 5 becomes a shape with a concave central portion of its end face.

[0058] Next, the unsintered sacrificial piece 20 is removed. This removal process can be performed, for example, by sandblasting. Since the sacrificial piece 20 is unsintered, it is removed, becoming... Figure 9 The state shown.

[0059] like Figure 10 As shown, all portions of the first surface 1a are covered with sealing resin 6a. Next, the upper surface is ground. Thus, it becomes... Figure 11 The state shown is as follows. Through grinding, the upper surface of the first columnar conductor 5 is exposed from the sealing resin 6a.

[0060] like Figure 12 As shown, components 41 and 42 are mounted on the second surface 1b of the ceramic substrate 1. Furthermore, sealing resin 6b is configured to cover the second surface 1b and components 41 and 42. As a result, it is possible to obtain… Figure 1 The shown structure is 101.

[0061] In addition, Figure 7 In this process, the sacrificial piece 20 is stacked on top of the first stack 81, but the order is not limited to this. For example, the first stack 81 can also be stacked on top of the sacrificial piece 20.

[0062] The manufacturing method of the structure described herein can be summarized as follows. The manufacturing method of the structure includes: a step of opening a through hole 14 in a sacrificial sheet 20 that has not been sintered within the sintering temperature range of the ceramic components of the ceramic green sheet; a step of filling the through hole 14 with conductive paste 15; a step of preparing a first laminate 81 having a first surface 1a as a laminate of ceramic green sheets; a step of laminating the sacrificial sheet 20 onto the first surface 1a of the first laminate 81 to obtain a second laminate 82; a step of calcining the second laminate 82; and a step of removing the sacrificial sheet 20 from the second laminate 82 to leave the first columnar conductor 5 formed by calcining the conductive paste 15. After the above-described calcination step, the first columnar conductor 5 has a recess 5x on one end face near the ceramic substrate 1 formed by calcining the first laminate 81, and the first surface 1a has a protrusion 9 in the area overlapping with the first columnar conductor 5 to correspond to the recess 5x.

[0063] Furthermore, in this manufacturing method, it is preferable that the shrinkage rate of the conductive paste 15 during calcination is greater than that of the ceramic green sheet 12 during calcination. This relationship in shrinkage rates allows for more reliable generation of the depression 5x during calcination, effectively increasing the bonding area.

[0064] (Implementation Method 2)

[0065] Reference Figures 13-18 The structure based on Embodiment 2 of the present invention will be described. Figure 13 This is a cross-sectional view of the structure 102 in this embodiment. The basic structure of the structure 102 is the same as that of the structure 101 described in Embodiment 1. Figure 14 This indicates that the first cylindrical conductor 5 and its vicinity have been magnified. Figure 15 This shows the view from above of the first columnar conductor 5 and the conductor through-hole 13. Figure 15 The circle shown is the outline of the lower end of the first cylindrical conductor 5. Figure 15 In the diagram, the conductor through-hole 13 is located on the other side of the first cylindrical conductor 5, and is therefore indicated by a dashed line. As shown here, the two conductor through-holes 13 are connected to one first cylindrical conductor 5.

[0066] The structure of the construct 102 can be as follows: The construct 102 has a plurality of conductive vias 13. These plurality of conductive vias 13 are connected to the first conductor pattern 7 and extend along the thickness direction from the first surface 1a toward the interior of the ceramic substrate 1. When viewed from above, each of the plurality of conductive vias 13 is configured to at least partially overlap with the first columnar conductor 5 at a position offset from the center of the first columnar conductor 5. When focusing on and viewing any one of the conductive vias 13 from above, the conductive via 13 may also have both overlapping and non-overlapping portions with the first columnar conductor 5.

[0067] Here, an example is shown where two conductor through-holes 13 are configured relative to a first columnar conductor 5, but as... Figure 16 , Figure 17 as well as Figure 18 As shown, more than three conductor vias 13 can also be configured. When multiple conductor vias 13 are configured, it is preferable that at least a portion of them overlap with the first columnar conductor 5 at a position offset from the center of the first columnar conductor 5, thus... Figure 16 , Figure 17 as well as Figure 18 As shown, preferably, multiple conductor through holes 13 are arranged in a ring when viewed from above.

[0068] In this embodiment, the same effects as those described in Embodiment 1 can be achieved. Furthermore, in this embodiment, the plurality of conductor vias 13 are connected to a first columnar conductor 5 via the first conductor pattern 7 and configured to at least partially overlap with it, thus reducing the risk of wire breakage. By arranging the plurality of conductor vias 13 at a position offset from the center of the first columnar conductor 5, the deepest recess position of the recess 5x of the first columnar conductor 5 can be avoided, thus reducing the risk of wire breakage.

[0069] In addition, Figures 15-18 In the example shown, the multiple conductor vias 13 are configured to be housed inside the outline of the first cylindrical conductor 5, but the conductor vias 13 may also protrude partially from the outline of the first cylindrical conductor 5.

[0070] (Implementation Method 3)

[0071] Reference Figures 19-22 The structure based on Embodiment 3 of the present invention will be described. Figure 19 This is a perspective view of the structure 103 in this embodiment. Figure 19 In the image, the side of the structure 103 mounted on the mother substrate or the like can be seen. This side will be referred to as the "lower surface" below. On the lower surface, the sealing resin 6a is exposed. At the center of the lower surface, the semiconductor device 60 is exposed from the sealing resin 6a. At the outer edge of the lower surface, a plurality of first columnar conductors 5 are exposed. The plurality of first columnar conductors 5 are arranged in a ring at the outer edge of the lower surface. However, this arrangement is only an example and is not limited thereto.

[0072] On the side of the structure 103, the ceramic substrate 1 is exposed. By observing the side of the structure 103, it is clear that the ceramic substrate 1 is held between sealing resins 6a and 6b. This is just one example and is not a limitation. The side of the structure 103 may also be covered by some film.

[0073] Figure 20 This shows a bottom view of structure 103. Figure 20 In the diagram, the first conductor pattern 7, hidden on the other side of the sealing resin 6a, is indicated by a dashed line. In the structure 103, there is also a portion where the first conductor pattern 7 is configured relative to the plurality of first columnar conductors 5. Figure 20 In the example shown, there are also areas where the dashed lines representing the shape of the first conductor pattern 7 do not enclose the shape of the first cylindrical conductor 5. However, in such areas, the first conductor pattern 7, having a shape exactly the same size as the first cylindrical conductor 5, overlaps on the other side of the first cylindrical conductor 5. Figure 20In the example shown, the number of conductor vias 13 configured for a single first cylindrical conductor 5 varies. There are locations where only one conductor via 13 is configured for a single first cylindrical conductor 5, and locations where four conductor vias 13 are configured for a single first cylindrical conductor 5. Thus, the number of conductor vias 13 configured for a single first cylindrical conductor 5 can be appropriately set.

[0074] Figure 21 and Figure 22 This is a cross-sectional view showing the case where the structure 103 is mounted on the mother substrate 501. Figure 21 It is about Figure 20 A sectional view along line XXI-XXI in the middle. Figure 22 It is about Figure 20 A cross-sectional view along line XXII-XXII. A pad electrode 53 is provided on the surface of the mother substrate 501. The lower surface of the first columnar conductor 5 is connected to the pad electrode 53 of the mother substrate 501 via solder balls 52.

[0075] In this embodiment, the same effect as that described in Embodiment 2 can also be obtained.

[0076] (Implementation Method 4)

[0077] Reference Figures 23-25 The structure based on Embodiment 4 of the present invention will be described. Figure 23 This is a cross-sectional view of the structure 104 in this embodiment. The basic structure of the structure 104 is the same as that of the structure 101 described in Embodiment 1.

[0078] In this embodiment, the structure 104 includes a second columnar conductor 5b. The second columnar conductor 5b is connected to the end of the first columnar conductor 5a on the side away from the ceramic substrate 1, and extends in the thickness direction toward the side away from the ceramic substrate 1.

[0079] according to Figure 23 To illustrate the example more specifically, in structure 104, the first columnar conductor 5a, the second columnar conductor 5b, and the third columnar conductor 5c are arranged to be continuous along the thickness direction so as to penetrate the sealing resin 6a. The thickness of the sealing resin 6a is thicker than that shown in Embodiment 1. The lower end of the first columnar conductor 5a is connected to the first conductor pattern 7 provided on the first surface 1a. The upper end of the third columnar conductor 5c protrudes outward from the sealing resin 6a. Here, an example of three columnar conductors connected along the thickness direction is shown, but the number of connected columnar conductors can be more than three. It can also be two, or four or more. Here, as an example, the case where the number of connected columnar conductors is three is illustrated.

[0080] Reference Figures 24-25 The manufacturing method of the structure 104 will be described. This manufacturing method is similar to the method described in Embodiment 1, but uses multiple sacrificial pieces 20. Figure 24 As shown, multiple sacrificial sheets 20 are stacked on the first surface 1a of the first laminate 81, which is a ceramic green sheet 12. In this way, blocks of conductive paste 15 filling the through holes 14 are connected vertically. In this state, by calcination, it becomes... Figure 25 The state is shown. The three connected blocks of conductive paste 15 shrink due to calcination, resulting in depressions on the lower surface of the first columnar conductor 5a and the upper surface of the third columnar conductor 5c. This is similar to the state in Embodiment 1. Figure 7 Compared to the case where only one sacrificial sheet 20 is overlapped as shown, the total volume of the conductive paste 15 is larger, and therefore the depth of the depression caused by shrinkage is also greater.

[0081] In this embodiment, the same effect as that described in Embodiment 1 can also be obtained. In addition, in this embodiment, the structure 104 includes a second columnar conductor 5b, which is connected to the end of the first columnar conductor 5a on the side away from the ceramic substrate 1, and extends in the thickness direction toward the side away from the ceramic substrate 1. Therefore, the volume of the columnar conductor is increased, and as a result, the depth of the depression caused by shrinkage during calcination is increased, which can increase the bonding strength.

[0082] The more columnar conductors connected in the thickness direction, the larger the total volume of the conductive paste 15, and therefore the greater the depth of the depression caused by shrinkage during calcination.

[0083] (Implementation Method 5)

[0084] Reference Figures 26-28 The structure based on Embodiment 5 of the present invention will be described. Figure 26 This is a bottom view of the structure 105 in this embodiment. At the center of the lower surface of the structure 105, the semiconductor device 61 is exposed from the sealing resin 6a. The semiconductor device 61 is thicker than the semiconductor device 60 shown in Embodiment 3. Figure 27 and Figure 28 This is a cross-sectional view showing the case where the structure 105 is mounted on the mother substrate 501. Figure 27 It is about Figure 26 A sectional view along lines XXVII-XXVII. Figure 28 It is about Figure 26 A sectional view along lines XXVIII-XXVIII. (See attached image.) Figure 27 and Figure 28 As shown, the lower surface of the third columnar conductor 5c is connected to the pad electrode 53 of the mother substrate 501 via solder ball 52.

[0085] In this embodiment, the same effects as those described in Embodiment 4 can also be obtained. Furthermore, in this embodiment, because of the structure of multiple layers of columnar conductors overlapping inside the sealing resin 6a, the thickness of the sealing resin 6a can be increased, such as... Figure 28 As shown, it is capable of accommodating a semiconductor device 61 with thickness.

[0086] If the height of the columnar conductor increases, the force acting on the columnar conductor when an external force is applied to the structure from the side will also increase, requiring high fixing strength. However, in this embodiment, since the height of the columnar conductor increases and the recess becomes larger, the bonding area increases, thereby improving the bonding strength between the columnar conductor and the ceramic substrate. Therefore, it can also have high fixing strength against external forces acting on the structure.

[0087] (Implementation Method 6)

[0088] Reference Figure 29 The structure based on Embodiment 6 of the present invention will be described. Figure 29 This is a cross-sectional view of the structure 106 in this embodiment. The basic structure of the structure 106 is the same as that of the structure 101 described in Embodiment 1. Figure 30 Indicates will Figure 29 The first cylindrical conductor 5 and its vicinity are magnified.

[0089] The structure 106 of this embodiment includes: a ceramic substrate 1 having a first surface 1a; and a first columnar conductor 5 connected to the first surface 1a and extending in the thickness direction away from the ceramic substrate 1. The ceramic substrate 1 has a conductor through-hole 13 extending in the thickness direction exposed above the first surface 1a. The first columnar conductor 5 is connected to the conductor through-hole 13. The first columnar conductor 5 has a recess 5x on its end face near the ceramic substrate 1. The first surface 1a has a protrusion 9 in the region overlapping with the first columnar conductor 5 to correspond to the recess 5x.

[0090] Structure 106 is similar to structure 101, but the difference is that the lower end of the first columnar conductor 5 is directly connected to the conductor through hole 13 without passing through the first conductor pattern 7.

[0091] In this embodiment, the first columnar conductor 5 has a recess 5x on its end face near the ceramic substrate 1, and the first surface 1a has a protrusion 9 in the area overlapping with the first columnar conductor 5 to correspond to the recess 5x. Therefore, the bonding area between the first columnar conductor 5 and the conductor via 13 is also increased. As a result, the bonding strength between the first columnar conductor 5 and the ceramic substrate 1 is improved, and consequently, the reliability of the structure is improved.

[0092] In addition, multiple appropriate combinations of the above embodiments can be used.

[0093] Furthermore, all the points in the above-disclosed embodiments are merely illustrative and not intended to limit the invention. The scope of the invention is defined by the claims, including all equivalents and modifications within the scope of the claims.

[0094] Explanation of reference numerals in the attached figures

[0095] 1...substrate; 1a...first side; 1b...second side; 2...insulating layer; 5, 5a...first columnar conductor; 5b...second columnar conductor; 5c...third columnar conductor; 5x...recess; 6a, 6b...sealing resin; 7...first conductor pattern; 9...protrusion; 41, 42...component; 12...ceramic green sheet; 13...conductor via; 14...through hole; 15...conductive paste; 16...conductor pattern; 20...sacrificial sheet; 52...solder ball; 53...pad electrode; 60, 61...semiconductor device; 81...first laminate; 82...second laminate; 101, 102, 103, 104, 105, 106...structure; 501...mother substrate.

Claims

1. A structure, wherein, Possessing: a ceramic substrate having a first surface; a first conductor pattern arranged on the first surface; and a first columnar conductor connected to the first conductor pattern and extending in a thickness direction in a direction away from the ceramic substrate, the first columnar conductor has a recess on an end surface on a side close to the ceramic substrate, the first surface has a protrusion in a region where the first columnar conductor overlaps, so as to correspond to the recess.

2. The structure according to claim 1, wherein the structure possesses a conductor via hole connected to the first conductor pattern and extending in a thickness direction in a direction from the first surface toward an inside of the ceramic substrate, the conductor via hole is arranged so as to overlap the first columnar conductor at least in part at a position deviated from a center of the first columnar conductor, in a plan view.

3. The structure according to claim 1, wherein the structure possesses a plurality of conductor via holes connected to the first conductor pattern and extending in a thickness direction in a direction from the first surface toward an inside of the ceramic substrate, each of the plurality of conductor via holes is arranged so as to overlap the first columnar conductor at least in part at a position deviated from a center of the first columnar conductor, in a plan view.

4. The structure according to any one of claims 1 to 3, wherein the first columnar conductor has a tapered shape in which a diameter becomes smaller as it moves away from the first surface.

5. The structure according to any one of claims 1 to 3, wherein the first columnar conductor has a tapered shape in which a diameter becomes larger as it moves away from the first surface.

6. The structure according to any one of claims 1 to 3, wherein the structure possesses a second columnar conductor connected to an end on a side away from the ceramic substrate of the first columnar conductor and extending in a thickness direction toward the side away from the ceramic substrate.

7. The structure according to any one of claims 1 to 3, wherein a shrinkage rate at the time of calcination of a material of the first columnar conductor is greater than a shrinkage rate at the time of calcination of a material of the ceramic substrate. Possessing:

8. A structure, wherein, a ceramic substrate having a first surface; and a first columnar conductor connected to the first surface and extending in a thickness direction in a direction away from the ceramic substrate, the ceramic substrate possesses a conductor via hole extending in the thickness direction in a manner exposed to the first surface, the first columnar conductor being connected to the conductor via hole, the first columnar conductor has a recess on an end surface on a side close to the ceramic substrate, the first surface has a protrusion in a region where the first columnar conductor overlaps, so as to correspond to the recess.

9. The structure according to claim 8, wherein the first columnar conductor has a tapered shape in which a diameter becomes smaller as it moves away from the first surface.

10. The structure according to claim 8, wherein the first columnar conductor has a tapered shape in which a diameter becomes larger as it moves away from the first surface.

11. The structure according to any one of claims 8 to 10, wherein ​ The structure is provided with a second columnar conductor connected to an end of the first columnar conductor on a side away from the ceramic substrate and extending in a thickness direction toward the side away from the ceramic substrate.

12. The structure according to any one of claims 8 to 10, wherein The shrinkage rate of the material of the first columnar conductor at the time of calcination is greater than the shrinkage rate of the material of the ceramic substrate at the time of calcination.

13. A method of manufacturing a structure, wherein, Comprise: a step of opening a through hole in a sacrificial sheet that is not sintered in a temperature range in which a ceramic component of a ceramic green sheet is sintered; a step of filling the through hole with a conductive paste; a step of preparing a laminate of ceramic green sheets, that is, a first laminate having a first surface; a step of laminating the sacrificial sheet to the first surface of the first laminate to obtain a second laminate; a step of calcining the second laminate; and a step of removing the sacrificial sheet from the second laminate so as to leave a first columnar conductor generated by calcination of the conductive paste, After the step of calcining, an end surface of the first columnar conductor on a side close to a ceramic substrate formed by calcination of the first laminate has a recess, and the first surface has a protruding portion in a region in which the first columnar conductor overlaps so as to correspond to the recess.

14. The manufacturing method of the structure according to claim 13, wherein The shrinkage rate of the conductive paste at the time of calcination is greater than the shrinkage rate of the ceramic green sheet at the time of calcination.

Images